Project: Reflow Soldering Oven

Insulation

• IN-23 firebrick 0.14 W/mK

Heat Capacity

• At STP air 1.2 kJ m^-3 C^-1. For .5 ft³ volume, raising temperature 260 C requires 4.4 kJ.
• FR-4: 0.76 -- 1.2 J g^-1 K^-1. ⅛ in thick board is 0.6 g in^-2. 0.72 J K^-1 in^-2.
• Copper: 0.385 J g^-1 K^-1. 0.2 g in^-2 per oz. 0.077 J K^-1 in^-2.
• 4 in x 6 x ⅛ in board with 2 oz copper: 19 J K^-1, raising temperature 260 C requires 5 kJ.

Heating

• 1 kW at 115 V would require 8.7 A, or a 13.23 Ω resistive load.

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