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v0.7.4 — blind/buried vias and sheet reuse
Blind/buried vias
Via.layer_from/layer_tospan (default = through; all existing board text loads unchanged)- Span honored by every consumer: Gerber flash, per-span Excellon drill files (
name-top-in1.drl), DRC clearance, copper connectivity, board stats (via_kinds) - KiCad import parses
(layers "F.Cu" "In1.Cu")spans, normalized outside-in; spans outside the stack dropped with report - IPC-2581: per-span drill Layers with
<Span>children — structure conformance-matched against kicad-cli's own export of a 4-layer through+blind+buried board (via-pad distribution and all drill spans identical) - Fab manifest now reports the true copper layer count
Sheet reuse (KiCad instances model)
- One
.kicad_schfile instanced by N sheet nodes imports with per-instance references resolved from(instances (project (path "/root-uuid/sheet-uuid" (reference ...)))) - Netlist matched node-for-node against
kicad-cli sch export netliston the reuse fixture - Duplicate Sheetnames disambiguated; genuine ref collisions still fail loud
- False "wire endpoints" transform warning on hierarchical designs removed (sheet pins are known wire targets)
18 new tests; suite 400 green, CI verified per commit.