Skip to content

Tapeout Checklist

Richard Huang edited this page Aug 3, 2026 · 2 revisions

Tapeout Checklist

Tapeout is the moment the design is released to the foundry. After it, nothing can be changed — a mask set costs real money and a respin costs months. This page is the gate: every item must be checked, evidenced, and signed by a named owner before release.

Treat it as a checklist in the aviation sense. Not a summary of what you probably did, but a list you physically walk through with someone else watching.


The Golden Rules

  1. Freeze before you check. Any change after a check invalidates it.
  2. Evidence, not memory. Every item needs an archived log or report.
  3. Named owner per item. "The team checked it" means nobody checked it.
  4. Two people per critical item. The person who did the work and one who didn't.
  5. Waivers are documented or they don't exist. Justification, reviewer, date.
  6. If you don't understand it, it isn't signed off.

Timeline

flowchart LR
    A[Design freeze] --> B[Full signoff run]
    B --> C[Checklist review]
    C --> D[Fix + re-verify]
    D --> C
    C --> E[GDSII release]
    E --> F[Foundry acceptance]
    style C fill:#2d6a9f,color:#fff
Loading

The C → D → C loop is where most tapeouts spend their final weeks. Budget for it — first-pass checklist review always finds something.


1. Physical Verification

Check Criterion Evidence
DRC clean Zero violations or documented waivers Pegasus report
LVS clean No discrepancies Pegasus report
ERC clean No floating gates, no supply shorts Pegasus report
Antenna Zero violations Pegasus report
Metal density Within min/max per layer, fill inserted Density report
Seal ring Present and correct per foundry spec Layout inspection
Scribe / dicing Correct per shuttle spec Layout inspection

See Signoff for how these are run.


2. Timing

Check Criterion
Setup WNS ≥ 0, all views, extracted parasitics, SI on
Hold WNS ≥ 0, all views — no exceptions
Design rules Zero max_tran, max_cap, max_fanout violations
Analysis coverage ~100%, no silently unconstrained paths
Exceptions reviewed Every false path and multicycle path justified
All modes Functional, scan, at-speed all pass
Clock domain crossings Declared and verified

Hold is non-negotiable — see Timing Closure. A hold violation is a dead chip at every frequency.


3. Power Integrity

Check Criterion
Static IR drop ≤ 2–3% VDD
Dynamic IR drop ≤ 5% VDD, with a real activity trace
Electromigration Within foundry limits for target lifetime
PDN connectivity Every macro and cell connected; verify_power_via clean
Decap Inserted, ratio within plan
Power domains Match UPF; isolation and level shifters correct

See Power Planning.


4. Functional and Logical

Check Criterion
LEC Final netlist equivalent to RTL, all points mapped
Gate-level simulation Passes with SDF back-annotation
Regression Full Verification suite green on the tapeout RTL
Reset Verified from all reset states
Scan chains Continuity verified, chain order documented
ATPG coverage Meets target

5. Chip Integration

Check Criterion
Padring Complete, correct pad order, no gaps
Pad assignment Matches package/bond diagram exactly
ESD Protection on every pad; correct clamps
Power pads Sufficient count and distribution for peak current
I/O configuration Drive strength, pull-ups, levels correct
Corner cells Present
Bond pad opening Matches packaging requirement

Pad assignment errors are among the most common and most fatal student-tapeout mistakes. Check it against the bond diagram, pad by pad, with two people.


6. Deliverables

Item Notes
GDSII The layout itself; correct top cell name
LEF Abstract, if the block is reused
Netlist Final routed Verilog
SDF Timing for gate-level simulation
SPEF Extracted parasitics
Timing reports All views, archived
DRC/LVS reports Clean, archived
Waiver document Every waiver with justification and reviewer
Bond/package diagram Pad-to-pin mapping
README How to reproduce the whole flow

7. Archive and Reproducibility

Archive enough that someone can rebuild this exact database in a year:

  • Tool versions (exact, including patch level)
  • PDK version and rule deck versions
  • All scripts, constraints, and configuration
  • Git commit hash of the RTL
  • Full logs from every flow stage
  • The final database itself

Pin tool versions deliberately rather than tracking whatever the default resolves to, and record exactly which ones produced the released database.


8. Process and Sign-off

Item Owner
Design frozen, no pending ECOs PD lead
All checklist items evidenced PD lead
Waivers reviewed and approved PD lead + advisor
Foundry/shuttle submission requirements met Integration owner
Submission deadline confirmed Program owner
Backup of the complete database Anyone — but verify the backup restores

Common Tapeout Mistakes

Mistake Consequence
Late ECO after signoff Invalidates completed checks; the classic respin cause
Pad assignment mismatch Chip cannot be bonded correctly — unrecoverable
Hold violation waived under schedule pressure Dead silicon at every frequency
Signed off on static IR only Dynamic hotspot fails in the lab
One precision/functional mode unverified Half the chip untested
Undocumented waiver Nobody can tell later whether it was safe
Wrong GDS top cell name Foundry rejects the submission
Missing fill Density DRC failure at the foundry, after your deadline
No archive Cannot reproduce or debug the silicon you receive

See also: Signoff · Timing Closure · Power Planning · Floorplanning · Physical Design

Clone this wiki locally