Production JLCPCB Manufacturing

JLCPCB Manufacturing Specification

Status: Draft Project: Enigma-NG Author: Izzyonstage & GitHub Copilot Version: v.0.1.0 Associated Hardware Revision: Rev A Last Updated: 2026-05-11

This document defines the JLCPCB fabrication and assembly constraints that apply across all Enigma-NG boards. Board-level design specifications and the Global Routing Specification (GRS) should reference this document rather than restating these constraints individually.

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1. Board Stackups

1.0 Stackup Code Naming Convention

JLCPCB stackup codes follow the pattern: JLC + 0N (layer count, zero-padded) + 16 (1.6mm nominal board thickness) + 21 (copper weight: 2oz outer / 1oz inner) + -PPPP (primary prepreg type).

Code segment	Meaning	Example value
JLC	JLCPCB identifier	fixed
04 or 06	Layer count (4-layer or 6-layer)	04, 06
16	Board thickness (1.6mm nominal)	16
21	Copper weight (2oz outer / 1oz inner)	21
-3313 or -3313	Primary prepreg type (outermost dielectric layer)	-3313

System stackup codes:

Stackup code	Layer count	Boards
JLC041621-3313	4-layer, 2oz outer / 1oz inner	ROT, STA, EXT, REF, ENC, JM, AM, USM (8 boards)
JLC061621-3313	6-layer, 2oz outer / 1oz inner	CTL (CI required), PM (CI not required)

Note: Older documents (pre-DEC-065) used the codes JLC04161H-7628 and JLC06161H-2116. These codes were incorrect interpretations of the JLCPCB stackup naming scheme and have been replaced throughout. JLC041621-3313 and JLC061621-3313 are the correct, authoritative codes.

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1.1 Four-Layer 2oz Stackup — JLC041621-3313

This is the standard stackup for all Enigma-NG boards except the Controller Board and Power Module.

Physical stackup (JLCPCB-authoritative):

Layer / Material	Thickness (mil)	Thickness (mm)	Copper Weight
L1 — Outer Copper	2.76	0.070	2oz
Prepreg — 3313 RC57%	3.62	0.092	—
L2 — Inner Copper	1.18	0.030	1oz
Core — FR4 (1/1oz without copper)	~48.5	~1.231	—
L3 — Inner Copper	1.18	0.030	1oz
Prepreg — 3313 RC57%	3.62	0.092	—
L4 — Outer Copper	2.76	0.070	2oz
Total		≈ 1.6 mm ✓

Prepreg dielectric properties (3313 RC57%): h = 0.092 mm, Eᵣ = 4.2

Controlled-impedance trace widths — JLCPCB calculator authoritative (non-coplanar):

Target	Type	Layer	Trace Width	Spacing
50Ω SE	Microstrip	L1 (outer)	0.1425 mm (5.61 mil)	—
50Ω SE	Stripline	L2 (inner)	0.1478 mm (5.82 mil)	—
90Ω diff	Diff microstrip	L1 (outer)	0.1468 mm (5.78 mil)	0.2032 mm (8.00 mil)
100Ω diff	Diff stripline	L2 (inner)	0.1128 mm (4.44 mil)	0.2032 mm (8.00 mil)

IPC-2141A accuracy warning: IPC-2141A estimates deviate significantly from the JLCPCB calculator for this stackup: outer 50Ω IPC estimate is approximately −9% low; inner 50Ω IPC estimate is approximately +13% high. Use JLCPCB calculator values only. Do not use IPC-2141A.

Boards using this stackup: Rotor (A+B), Stator, Extension, Reflector, User Settings Module (USM), Actuation Module, Encoder, JTAG Module

Design rule reference: design/Standards/Global_Routing_Spec.md §2.3.1 (standard 4-layer) and §2.3.2 (inverted 4-layer — JTAG Module, Actuation Module)

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1.2 Six-Layer 2oz Stackup — JLC061621-3313

This stackup is used by the Controller Board and the Power Module.

Physical stackup (JLCPCB-authoritative):

Layer / Material	Thickness (mil)	Thickness (mm)	Copper Weight
L1 — Outer Copper	2.76	0.070	2oz
Prepreg — 3313 RC57%	3.62	0.092	—
L2 — Inner Copper	1.18	0.030	1oz
Core (L2–L3) — 1/1oz without copper	17.72	0.450	—
L3 — Inner Copper	1.18	0.030	1oz
Prepreg — 2116 RC54%	4.29	0.109	—
Prepreg — 2116 RC54%	4.29	0.109	—
L4 — Inner Copper	1.18	0.030	1oz
Core (L4–L5) — 1/1oz without copper	17.72	0.450	—
L5 — Inner Copper	1.18	0.030	1oz
Prepreg — 3313 RC57%	3.62	0.092	—
L6 — Outer Copper	2.76	0.070	2oz
Total		≈ 1.6 mm ✓

Controlled-impedance trace widths — JLCPCB calculator authoritative (non-coplanar):

Target	Type	Layer	Trace Width	Spacing
50Ω SE	Microstrip	L1 or L6 (outer)	0.1425 mm (5.61 mil)	—
50Ω SE	Stripline	L2 (inner, ref L1/L3)	0.1387 mm (5.46 mil)	—
90Ω diff	Diff microstrip	L1 or L6 (outer)	0.1468 mm (5.78 mil)	0.2032 mm (8.00 mil)
100Ω diff	Diff stripline	L2 (inner, ref L1/L3)	0.1123 mm (4.42 mil)	0.2032 mm (8.00 mil)

IPC-2141A accuracy warning: IPC-2141A estimates deviate significantly from the JLCPCB calculator for this stackup: outer 50Ω IPC estimate is approximately −9% low; inner 50Ω IPC estimate is approximately +21% high. Use JLCPCB calculator values only. Do not use IPC-2141A.

Boards using this stackup:

Board	CI service required?	Reason
Controller Board	Yes — required	USB 3.0 SS, USB 2.0, HDMI, Ethernet BI_D diff pairs on inner layers; TDR-verified widths mandatory
Power Module	No — not required	Power-dominated board; no high-speed differential pairs requiring TDR-verified widths

Design rule reference: design/Standards/Global_Routing_Spec.md §2.3.3

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1.3 JLCPCB Stackup Catalog — Evaluated Options

The following table records all JLCPCB stackup options evaluated during the stackup selection process (DEC-065). Options not selected are retained here for traceability.

Code	Layers	Thickness	Outer Cu	Inner Cu	Prepreg	Status
JLC041621-3313	4L	1.6mm	2oz	1oz	3313 RC57%	✅ Selected — system standard 4-layer
JLC061621-3313	6L	1.6mm	2oz	1oz	3313 + 2116	✅ Selected — system standard 6-layer
JLC04161H-7628	4L	1.6mm	2oz	1oz	7628	❌ Eliminated — incorrect code interpretation; 7628 prepreg gives higher Eᵣ, requiring narrower traces than calculator confirms
JLC06161H-2116	6L	1.6mm	2oz	1oz	2116	❌ Eliminated — incorrect code interpretation; replaced by JLC061621-3313
JLC041621-7628	4L	1.6mm	2oz	1oz	7628	❌ Not selected — 7628 prepreg is higher loss at GHz frequencies vs 3313
JLC041221-3313	4L	1.2mm	2oz	1oz	3313	❌ Not selected — 1.2mm thickness non-standard for system; connector mating assumes 1.6mm

2. PCB Fabrication Capabilities and Constraints

Source: JLCPCB PCB Capabilities — verify all values in this section against the live page before design sign-off, as JLCPCB periodically update their published limits.

All boards are fabricated using JLCPCB's standard PCB service. The following constraints apply and must be respected in all board designs.

Parameter	Constraint	Notes
Minimum trace width	0.09mm (3.5 mil)	GRS specifies 0.127mm CI minimum; 0.20mm signal minimum — both are above this limit
Minimum trace spacing	0.09mm (3.5 mil)	GRS 10 mil (0.254mm) clearance requirement is more conservative
Minimum via drill	0.2mm (drill); 0.45mm (pad)	Standard vias only; see §2.1
Blind / buried vias	Not supported	No blind or buried vias on any board
Minimum hole size (drill)	0.2mm	Mechanical NPTH and PTH
Minimum annular ring	0.1mm (one side)	GRS specifies 6.0mm ENIG ring for mounting holes (far exceeds minimum)
Board thickness	1.6mm nominal (±10%)	All boards in this design target 1.6mm
Surface finish	ENIG (Electroless Nickel Immersion Gold)	System-wide; provides flat, solderable, gold-plated surface
Copper weight	2oz finished copper	System-wide; matches GRS §1.1 trace width calculations
Solder mask	Both sides	LPI solder mask on all boards
Silkscreen	Both sides	See GRS §10.1 for pin-1 silkscreen requirements
Min silkscreen line width	0.153mm
Max board size	500mm × 470mm	Enigma-NG boards are well within this limit
Panelisation	Available (V-cut, tab-route)	May be useful for small boards (Rotor, USM)

2.1 Via Constraints

JLCPCB standard service supports through-hole vias only. Blind and buried vias are not available on the standard 4-layer or 6-layer service.

Via type	Supported	Notes
Through-hole via	✔ Yes	Standard; min drill 0.2mm, min pad 0.45mm
Blind via	❌ No	Not available on standard service
Buried via	❌ No	Not available on standard service
Micro-via	⚠️ Non-standard service	Available; requires advanced/HDI service tier — verify current offering on JLCPCB capabilities page
Back-drill	⚠️ Non-standard service	Available; requires explicit quotation — verify current offering on JLCPCB capabilities page

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3. PCBA (Assembly) Service Constraints

JLCPCB offers a PCBA (PCB Assembly) service with SMT component placement. The following constraints must be understood and accounted for in board designs.

3.1 Assembly Side Constraint

Constraint	Detail
SMT assembly side	Single-sided only on standard service
THT placement	Manual fit required (not included in JLCPCB PCBA standard service)
Double-sided SMT	Available on Economic PCBA service with limitations; requires explicit quotation

Design note for Reflector Board: The Reflector is a single-sided SMT assembly. All SMT components must be on the same board face to use JLCPCB standard PCBA. This is an explicit design constraint, not a limitation — see design/Electronics/Reflector/Design_Spec.md.

3.2 THT Components

All THT components (headers, connectors, DIP switches, pin headers, through-hole capacitors) require manual fitting after JLCPCB PCBA. These components are excluded from the JLCPCB PCBA BOM and assembled separately. Each board design spec identifies which components are manually fitted.

3.3 Component Library Types

Library type	Description	Assembly surcharge
Basic	Pre-loaded in JLCPCB feeders; no extra fee	None
Preferred	JLCPCB preferred parts; low surcharge	Low
Extended	Requires feeder setup fee per unique part	~$3 per unique part

Note: Where a BOM entry shows Global sourcing / consignment in the JLCPCB PN column, the component must be sourced and consigned to JLCPCB separately.

3.4 Minimum Order Quantity (MOQ)

Parameter	Value
PCBA MOQ (standard)	2 boards per order
PCBA MOQ (prototype)	5 boards (Economic PCBA)

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4. Design Rule Cross-References

Document	Relationship
design/Standards/Global_Routing_Spec.md	System-wide routing rules; references this document for stackup details
design/Electronics/Controller/Design_Spec.md §9	Controller-specific 6-layer stackup (JLC061621-3313)
design/Electronics/Rotor/Design_Spec.md §4	Rotor 4-layer stackup (JLC041621-3313)
design/Electronics/Stator/Design_Spec.md §7	Stator fabrication requirements
design/Electronics/Power_Module/Design_Spec.md §8	Power Module fabrication requirements