Hardware Architecture

5.1 Hardware Architecture

High-Level Diagram

Insert Figure: Power Layer → SBC (Raspberry Pi 5) / MCU (ESP32) → Sensors (LiDAR, Depth Cam, RGB Cam, IMU, Encoders, IR) → Drive System / Docking Station → Cloud Backend

Layers

• Power Layer: 3x 18650 Li-ion (3S), BMS/UPS module, voltage regulators
• Processing & Control: Raspberry Pi 5 (SLAM, streaming, networking) + ESP32 (real-time motor control, low-level polling)
• Sensors: 2D LiDAR (SLAM/obstacle detection), RGB-D camera (3D mapping), RGB camera (live feed), IMU, wheel encoders
• Drive System: DC gear motors, motor driver, caster wheel (2-wheel differential drive)
• Docking Station: IR beacon emitter/receiver, charging contacts

Design Rationale

Why this component split (SBC vs MCU), power budget considerations, key tradeoffs.