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Corpus Testing 12

github-actions[bot] edited this page Nov 11, 2026 · 24 revisions

Corpus Page 12

Part 12 of 29 of Corpus Testing: boards 1,189 to 1,296, six runs each, one file format a run, as Corpus Testing describes.

1189. syzygy-txr-breakout

syzygy-txr-breakout: stages 4 and 6 take 45% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 20 s. Visual, GLB takes 17 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.4 4.1 0.5 ms 4.7 0.2 0.6 0.3 11.9
Simulation, STEP 0.5 1.2 4.0 0.4 ms 4.8 3.5 0.7 0.3 15.0
Simulation, STL 0.4 1.2 4.2 0.4 ms 5.1 0.5 0.7 0.3 12.2
Simulation, OBJ 0.5 1.4 4.2 0.4 ms 4.9 8.1 0.7 0.3 19.9
Visual, GLB 0.4 1.1 4.0 0.5 ms 10.3 0.1 1.1 0.3 17.3
Visual, OBJ 0.4 1.2 4.2 0.4 ms 11.1 4.4 1.3 0.3 22.9
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-txr-breakout.kicad_pcb
Folder syzygy-txr-breakout / kicad-src
Complexity 314 / 1000 (size 199, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 28, 2,385, 68
Triangles, simulation 1,349,284 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 655 MB
STEP 196 MB 645 MB
STL 67 MB 602 MB
OBJ 137 MB 927 MB
Visual
GLB 24 MB 684 MB
OBJ 74 MB 705 MB

1190. obsidian-boa-r0.1

obsidian-boa-r0.1: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 9.4 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 15 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 3.3 0.5 ms 3.7 0.2 0.6 0.3 9.4
Simulation, STEP 0.4 1.1 3.5 0.5 ms 3.9 3.0 0.6 0.2 12.7
Simulation, STL 0.3 1.1 3.3 0.5 ms 3.7 0.3 0.6 0.3 9.7
Simulation, OBJ 0.3 1.1 3.4 0.5 ms 3.7 5.8 0.6 0.2 15.1
Visual, GLB 0.3 1.0 3.3 0.6 ms 9.0 0.1 0.9 0.2 14.9
Visual, OBJ 0.3 1.1 3.5 0.5 ms 9.2 3.3 1.0 0.2 18.7
Board Repo: gregdavill/obsidian-boa
Board: obsidian-boa-r0.1.kicad_pcb
Folder hw / obsidian-boa-r0.1
Complexity 364 / 1000 (size 239, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201002)
Parts, tracks, vias 83, 975, 113
Triangles, simulation 1,191,616 in 87 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 40 MB 452 MB
STEP 180 MB 539 MB
STL 60 MB 450 MB
OBJ 121 MB 820 MB
Visual
GLB 23 MB 644 MB
OBJ 71 MB 642 MB

1191. FreshTwinkie

FreshTwinkie: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 9.4 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 15 s. Visual, GLB takes 14 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.1 3.8 0.3 ms 3.5 0.1 0.5 0.2 9.4
Simulation, STEP 0.3 1.1 3.8 0.4 ms 3.6 2.8 0.5 0.2 12.3
Simulation, STL 0.2 1.1 3.8 0.4 ms 3.6 0.3 0.5 0.2 9.7
Simulation, OBJ 0.3 1.1 3.8 0.3 ms 3.7 5.4 0.4 0.2 14.9
Visual, GLB 0.3 1.1 3.8 0.5 ms 7.3 97 ms 0.9 0.2 13.7
Visual, OBJ 0.3 1.1 3.8 0.4 ms 6.7 3.4 0.8 0.2 16.3
Board Repo: gregdavill/PD-sniffer
Board: FreshTwinkie.kicad_pcb
Folder hw / FreshTwinkie_v0.1
Complexity 325 / 1000 (size 235, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 50, 1,014, 145
Triangles, simulation 1,049,192 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 468 MB
STEP 155 MB 555 MB
STL 52 MB 484 MB
OBJ 109 MB 736 MB
Visual
GLB 21 MB 501 MB
OBJ 65 MB 523 MB

1192. FreshTwinkie_v0.1_panel

FreshTwinkie_v0.1_panel: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 24 s. Simulation, OBJ takes 38 s. Visual, GLB takes 35 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.6 10.0 0.6 ms 9.5 0.4 1.0 0.3 24.2
Simulation, STEP 0.6 2.6 9.5 0.6 ms 9.7 6.2 1.0 0.3 29.9
Simulation, STL 0.7 2.7 9.4 0.7 ms 9.3 0.6 1.0 0.3 24.1
Simulation, OBJ 0.6 2.6 9.9 0.6 ms 9.8 13.4 1.0 0.3 37.6
Visual, GLB 0.7 2.7 10.1 0.6 ms 19.1 0.2 1.9 0.3 35.1
Visual, OBJ 0.6 2.8 10.2 0.8 ms 19.0 8.2 2.2 0.2 43.1
Board Repo: gregdavill/PD-sniffer
Board: FreshTwinkie_v0.1_panel.kicad_pcb
Folder hw / FreshTwinkie_v0.1_panel
Complexity 361 / 1000 (size 261, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 100, 2,028, 290
Triangles, simulation 2,186,448 in 94 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 76 MB 752 MB
STEP 323 MB 941 MB
STL 109 MB 750 MB
OBJ 235 MB 1.5 GB
Visual
GLB 46 MB 1.0 GB
OBJ 144 MB 1.0 GB

1193. kimchi_micro

kimchi_micro: stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 71 s. Simulation, STEP takes 86 s. Simulation, STL takes 72 s. Simulation, OBJ takes 2 min. Visual, GLB takes 95 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 9.6 23.3 1 ms 29.9 1.5 4.6 0.4 71.0
Simulation, STEP 1.6 9.5 23.4 1 ms 30.1 16.2 4.4 0.4 85.6
Simulation, STL 1.6 9.1 22.8 1.0 ms 30.6 3.3 4.3 0.4 72.0
Simulation, OBJ 1.6 9.0 23.3 1 ms 31.0 46.3 4.5 0.5 116.3
Visual, GLB 1.8 9.1 23.0 1.0 ms 53.5 0.7 6.9 0.3 95.3
Visual, OBJ 1.7 9.4 24.3 1 ms 53.0 18.3 7.1 0.3 114.1
Board Repo: groupgets/kimchi-micro
Board: kimchi_micro.kicad_pcb
Folder hardware_sbc
Complexity 404 / 1000 (size 334, features 70)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 8
File format KiCad 8 (20240108)
Parts, tracks, vias 289, 10,738, 1,058
Triangles, simulation 9,560,528 in 411 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 330 MB 2.1 GB
STEP 1.2 GB 2.9 GB
STL 478 MB 2.1 GB
OBJ 1.1 GB 6.1 GB
Visual
GLB 143 MB 2.5 GB
OBJ 480 MB 3.1 GB

1194. LevelShifter

LevelShifter: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 7.5 s. Simulation, STL takes 5.1 s. Simulation, OBJ takes 7.8 s. Visual, GLB takes 8.7 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.6 0.3 ms 2.1 93 ms 0.3 0.2 5.0
Simulation, STEP 0.2 0.4 1.5 0.3 ms 2.6 2.2 0.3 0.3 7.5
Simulation, STL 0.3 0.4 1.5 0.3 ms 2.2 0.1 0.3 0.2 5.1
Simulation, OBJ 0.2 0.4 1.6 0.3 ms 2.4 2.7 0.3 0.2 7.8
Visual, GLB 0.2 0.4 1.4 0.3 ms 5.8 79 ms 0.6 0.2 8.7
Visual, OBJ 0.2 0.4 1.6 0.3 ms 5.2 2.3 0.8 0.2 10.8
Board Repo: gusmanb/logicanalyzer
Board: LevelShifter.kicad_pcb
Folder Electronics / LogicAnalyzer / LevelShifter
Complexity 224 / 1000 (size 164, features 60)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 21, 986, 10
Triangles, simulation 659,382 in 76 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 370 MB
STEP 114 MB 426 MB
STL 33 MB 346 MB
OBJ 66 MB 472 MB
Visual
GLB 18 MB 512 MB
OBJ 54 MB 526 MB

1195. LogicAnalyzer

LogicAnalyzer: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 7.2 s. Simulation, STEP takes 10 s. Simulation, STL takes 7.4 s. Simulation, OBJ takes 10 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.7 0.4 ms 2.9 0.1 0.4 0.3 7.2
Simulation, STEP 0.2 0.6 2.5 0.4 ms 3.1 2.9 0.4 0.2 10.0
Simulation, STL 0.2 0.5 2.6 0.4 ms 3.3 0.2 0.4 0.2 7.4
Simulation, OBJ 0.2 0.5 2.4 0.3 ms 3.0 3.6 0.4 0.2 10.3
Visual, GLB 0.2 0.5 2.3 0.4 ms 6.1 93 ms 0.8 0.2 10.3
Visual, OBJ 0.2 0.5 2.3 1 ms 6.3 2.8 0.8 0.2 13.1
Board Repo: gusmanb/logicanalyzer
Board: LogicAnalyzer.kicad_pcb
Folder Electronics / LogicAnalyzer / LogicAnalyzer
Complexity 228 / 1000 (size 158, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 10, 1,119, 1
Triangles, simulation 881,842 in 50 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 423 MB
STEP 165 MB 502 MB
STL 44 MB 436 MB
OBJ 88 MB 598 MB
Visual
GLB 24 MB 651 MB
OBJ 72 MB 649 MB

1196. AnalyzerBoxPCB_fork

AnalyzerBoxPCB_fork: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 8.3 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.8 0.5 ms 3.6 0.1 0.5 0.2 8.3
Simulation, STEP 0.3 0.7 2.7 0.3 ms 3.3 2.7 0.4 0.2 10.4
Simulation, STL 0.3 0.7 2.8 0.4 ms 3.4 0.3 0.4 0.2 8.2
Simulation, OBJ 0.3 0.7 2.7 0.3 ms 3.5 5.3 0.4 0.2 13.2
Visual, GLB 0.4 0.7 2.8 0.3 ms 7.8 0.1 0.9 0.3 12.9
Visual, OBJ 0.3 0.7 2.9 0.4 ms 7.7 4.2 1.2 0.3 17.2
Board Repo: gusmanb/logicanalyzer
Board: AnalyzerBoxPCB_fork.kicad_pcb
Folder Electronics / LogicAnalyzer / LogicAnalyzer_JasonYANG170 / KiCad 8
Complexity 250 / 1000 (size 190, features 60)
KESE features through vias, arc tracks,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 54, 796, 63
Triangles, simulation 935,662 in 67 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 492 MB
STEP 145 MB 515 MB
STL 47 MB 485 MB
OBJ 94 MB 662 MB
Visual
GLB 25 MB 582 MB
OBJ 75 MB 620 MB

1197. jitx-design

jitx-design: stages 4 and 6 take 58% to 83% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 23 s. Simulation, STL takes 17 s. Simulation, OBJ takes 25 s. Visual, GLB takes 21 s. Visual, OBJ takes 28 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.3 4.7 0.6 ms 9.7 0.2 0.7 0.3 17.4
Simulation, STEP 0.5 1.2 4.7 0.4 ms 9.7 5.9 0.7 0.2 22.9
Simulation, STL 0.5 1.2 4.8 0.6 ms 9.3 0.4 0.7 0.3 17.2
Simulation, OBJ 0.4 1.2 5.1 0.4 ms 9.4 7.6 0.8 0.3 24.8
Visual, GLB 0.5 1.1 4.9 0.4 ms 12.7 0.2 1.8 0.2 21.3
Visual, OBJ 0.4 1.1 4.9 0.3 ms 13.4 6.5 1.7 0.3 28.3
Board Repo: gusmanb/logicanalyzer
Board: jitx-design.kicad_pcb
Folder Electronics / LogicAnalyzer / LogicAnalyzerV2 / designs / jitx-design / kicad
Complexity 308 / 1000 (size 193, features 115)
KESE features through vias, slotted holes,
arc tracks, filled zones,
copper drawings, TrueType text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 26, 1,778, 50
Triangles, simulation 1,448,730 in 69 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 49 MB 665 MB
STEP 274 MB 710 MB
STL 72 MB 670 MB
OBJ 150 MB 961 MB
Visual
GLB 41 MB 694 MB
OBJ 123 MB 881 MB

1198. StackLink

StackLink: stages 4 and 6 take 45% to 77% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 32 ms 0.1 0.4 0.1 ms 0.6 20 ms 65 ms 0.2 1.4
Simulation, STEP 35 ms 0.1 0.4 0.2 ms 0.6 0.8 67 ms 0.2 2.2
Simulation, STL 34 ms 0.1 0.4 0.1 ms 0.5 27 ms 63 ms 0.2 1.4
Simulation, OBJ 34 ms 0.1 0.4 0.1 ms 0.6 0.6 92 ms 0.2 2.1
Visual, GLB 33 ms 0.1 0.4 0.1 ms 1.0 12 ms 86 ms 0.2 1.9
Visual, OBJ 36 ms 0.1 0.5 0.2 ms 1.0 0.4 83 ms 0.2 2.3
Board Repo: gusmanb/logicanalyzer
Board: StackLink.kicad_pcb
Folder Electronics / LogicAnalyzer / StackLink / StackLink
Complexity 137 / 1000 (size 92, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 5, 12, 6
Triangles, simulation 108,050 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.6 MB 170 MB
STEP 16 MB 170 MB
STL 5.4 MB 162 MB
OBJ 10 MB 169 MB
Visual
GLB 2.4 MB 130 MB
OBJ 6.6 MB 133 MB

1199. sprig_console

sprig_console: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 7.2 s. Simulation, STEP takes 9.1 s. Simulation, STL takes 7.0 s. Simulation, OBJ takes 11 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.9 0.3 ms 2.6 0.1 0.4 0.2 7.2
Simulation, STEP 0.3 0.6 2.9 0.2 ms 2.6 2.1 0.3 0.2 9.1
Simulation, STL 0.3 0.6 2.8 0.3 ms 2.5 0.3 0.4 0.2 7.0
Simulation, OBJ 0.3 0.6 2.9 0.2 ms 2.5 4.1 0.3 0.2 11.0
Visual, GLB 0.3 0.6 3.0 0.3 ms 6.1 98 ms 0.7 0.2 10.9
Visual, OBJ 0.3 0.6 2.9 0.4 ms 6.2 2.9 0.9 0.2 14.0
Board Repo: hackclub/sprig
Board: sprig_console.kicad_pcb
Folder hardware / mainboard_PCB / kicad
Complexity 231 / 1000 (size 146, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 25, 254, 19
Triangles, simulation 808,388 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 409 MB
STEP 137 MB 435 MB
STL 40 MB 408 MB
OBJ 82 MB 590 MB
Visual
GLB 19 MB 502 MB
OBJ 58 MB 472 MB

1200. pico-reset

pico-reset: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.3 ms 0.8 38 ms 0.1 0.2 2.4
Simulation, STEP 94 ms 0.2 1.0 0.3 ms 0.9 1.1 0.1 0.2 3.6
Simulation, STL 95 ms 0.2 0.9 0.3 ms 0.8 68 ms 0.2 0.2 2.4
Simulation, OBJ 91 ms 0.2 0.9 0.2 ms 0.7 0.9 0.1 0.2 3.1
Visual, GLB 85 ms 0.1 0.8 0.2 ms 1.7 14 ms 99 ms 0.2 3.0
Visual, OBJ 97 ms 0.2 0.8 0.5 ms 1.6 0.4 93 ms 0.2 3.4
Board Repo: hackclub/sprig
Board: pico-reset.kicad_pcb
Folder sprig-hax / hardware / DebugShimPCB
Complexity 82 / 1000 (size 82, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 3, 21, 0
Triangles, simulation 162,188 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.1 MB 194 MB
STEP 22 MB 213 MB
STL 8.1 MB 194 MB
OBJ 16 MB 194 MB
Visual
GLB 2.7 MB 158 MB
OBJ 7.6 MB 159 MB

1201. sprig_console

sprig_console: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 7.2 s. Simulation, STEP takes 9.5 s. Simulation, STL takes 7.2 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 3.2 0.3 ms 2.5 0.1 0.4 0.2 7.2
Simulation, STEP 0.3 0.6 3.3 0.3 ms 2.5 2.2 0.4 0.2 9.5
Simulation, STL 0.3 0.6 3.1 0.3 ms 2.5 0.3 0.4 0.2 7.2
Simulation, OBJ 0.3 0.6 3.2 0.2 ms 2.5 4.3 0.4 0.2 11.5
Visual, GLB 0.3 0.6 3.1 0.3 ms 5.8 88 ms 0.8 0.2 10.9
Visual, OBJ 0.3 0.6 3.2 0.4 ms 5.7 2.8 0.8 0.2 13.7
Board Repo: hackclub/sprig
Board: sprig_console.kicad_pcb
Folder sprig-hax / hardware / SprigHaxPCB / kicad
Complexity 230 / 1000 (size 145, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 25, 242, 16
Triangles, simulation 816,372 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 382 MB
STEP 144 MB 463 MB
STL 41 MB 399 MB
OBJ 83 MB 597 MB
Visual
GLB 19 MB 439 MB
OBJ 58 MB 460 MB

1202. ZU64DR_RFSOC_A5

ZU64DR_RFSOC_A5: stages 4 and 6 take 68% to 88% of a run. Simulation, GLB takes 61 s. Simulation, STEP takes 77 s. Simulation, STL takes 60 s. Simulation, OBJ takes 78 s. Visual, GLB takes 69 s. Visual, OBJ takes 81 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 4.3 23.5 0.8 ms 30.1 0.6 1.6 0.4 61.1
Simulation, STEP 0.7 4.5 24.2 0.7 ms 30.6 15.1 1.5 0.4 77.1
Simulation, STL 0.6 4.3 23.4 0.2 ms 28.7 1.4 1.5 0.3 60.1
Simulation, OBJ 0.6 4.2 22.9 0.1 ms 29.7 18.5 1.6 0.3 78.0
Visual, GLB 0.7 4.2 23.4 0.8 ms 36.0 0.3 4.3 0.3 69.3
Visual, OBJ 0.6 4.4 23.9 0.1 ms 36.6 10.9 4.5 0.3 81.2
Board Repo: hamedroghani/zu64dr_rfsoc_kicad
Board: ZU64DR_RFSOC_A5.kicad_pcb
Complexity 229 / 1000 (size 184, features 45)
KESE features stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 12
File format KiCad 8 (20231120)
Parts, tracks, vias 75, 0, 0
Triangles, simulation 3,488,834 in 35 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 123 MB 1.5 GB
STEP 685 MB 2.0 GB
STL 174 MB 1.5 GB
OBJ 374 MB 2.4 GB
Visual
GLB 72 MB 1.6 GB
OBJ 221 MB 1.6 GB

1203. Easyduino_Atmega_Nano

Easyduino_Atmega_Nano: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 6.1 s. Simulation, STL takes 4.7 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 6.9 s. Visual, OBJ takes 8.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.6 0.3 ms 1.7 87 ms 0.3 0.2 4.5
Simulation, STEP 0.2 0.5 1.6 0.3 ms 1.8 1.6 0.3 0.2 6.1
Simulation, STL 0.2 0.5 1.5 0.2 ms 1.7 0.2 0.3 0.3 4.7
Simulation, OBJ 0.2 0.5 1.5 0.3 ms 1.6 2.5 0.3 0.2 6.9
Visual, GLB 0.2 0.5 1.5 0.2 ms 3.9 51 ms 0.5 0.2 6.9
Visual, OBJ 0.2 0.5 1.5 0.3 ms 3.8 1.5 0.5 0.2 8.3
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_Atmega_Nano.kicad_pcb
Folder Atmega328p Arduino Nano
Complexity 304 / 1000 (size 219, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 31, 332, 57
Triangles, simulation 632,874 in 75 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 312 MB
STEP 78 MB 369 MB
STL 32 MB 318 MB
OBJ 63 MB 462 MB
Visual
GLB 13 MB 366 MB
OBJ 39 MB 363 MB

1204. Easyduino_Atmega

Easyduino_Atmega: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 7.3 s. Simulation, STEP takes 9.4 s. Simulation, STL takes 7.4 s. Simulation, OBJ takes 11 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 2.6 0.4 ms 2.8 0.2 0.5 0.2 7.3
Simulation, STEP 0.3 0.7 2.4 0.4 ms 2.8 2.4 0.5 0.2 9.4
Simulation, STL 0.3 0.8 2.5 0.3 ms 2.9 0.2 0.5 0.2 7.4
Simulation, OBJ 0.3 0.8 2.3 0.2 ms 2.8 4.2 0.5 0.2 11.3
Visual, GLB 0.3 0.8 2.6 0.3 ms 5.5 81 ms 0.8 0.3 10.2
Visual, OBJ 0.3 0.8 2.5 0.3 ms 5.3 2.4 0.8 0.2 12.3
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_Atmega.kicad_pcb
Folder Atmega328p Arduino Uno
Complexity 320 / 1000 (size 220, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 36, 391, 106
Triangles, simulation 859,494 in 68 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 388 MB
STEP 99 MB 470 MB
STL 43 MB 382 MB
OBJ 86 MB 622 MB
Visual
GLB 17 MB 498 MB
OBJ 52 MB 458 MB

1205. Easyduino_ESP32

Easyduino_ESP32: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 6.5 s. Simulation, STEP takes 9.0 s. Simulation, STL takes 6.6 s. Simulation, OBJ takes 10 s. Visual, GLB takes 9.9 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.3 0.5 ms 2.4 0.1 0.4 0.3 6.5
Simulation, STEP 0.2 0.7 2.5 0.3 ms 2.4 2.4 0.5 0.2 9.0
Simulation, STL 0.3 0.7 2.4 0.3 ms 2.4 0.2 0.5 0.2 6.6
Simulation, OBJ 0.2 0.7 2.5 0.3 ms 2.3 3.9 0.4 0.3 10.3
Visual, GLB 0.2 0.6 2.4 0.4 ms 5.8 67 ms 0.5 0.3 9.9
Visual, OBJ 0.3 0.7 2.5 0.3 ms 5.4 2.5 0.5 0.3 12.2
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_ESP32.kicad_pcb
Folder ESP32
Complexity 299 / 1000 (size 214, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 29, 372, 64
Triangles, simulation 663,478 in 86 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 324 MB
STEP 98 MB 385 MB
STL 33 MB 324 MB
OBJ 67 MB 494 MB
Visual
GLB 14 MB 412 MB
OBJ 42 MB 377 MB

1206. Easyduino_ESP32S3

Easyduino_ESP32S3: stages 4 and 6 take 47% to 78% of a run. Simulation, GLB takes 7.9 s. Simulation, STEP takes 9.6 s. Simulation, STL takes 7.5 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 2.6 0.5 ms 3.1 0.2 0.6 0.2 7.9
Simulation, STEP 0.2 0.9 2.5 0.4 ms 2.9 2.4 0.5 0.2 9.6
Simulation, STL 0.2 0.8 2.4 0.5 ms 3.0 0.3 0.5 0.2 7.5
Simulation, OBJ 0.3 0.8 2.4 0.6 ms 3.0 4.3 0.6 0.2 11.6
Visual, GLB 0.3 0.9 2.4 0.3 ms 6.2 0.1 0.9 0.2 11.1
Visual, OBJ 0.2 0.8 2.6 0.5 ms 6.2 2.5 0.7 0.2 13.3
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_ESP32S3.kicad_pcb
Folder ESP32S3
Complexity 312 / 1000 (size 227, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 35, 703, 137
Triangles, simulation 980,336 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 420 MB
STEP 135 MB 519 MB
STL 49 MB 409 MB
OBJ 99 MB 696 MB
Visual
GLB 19 MB 536 MB
OBJ 58 MB 509 MB

1207. Easyduino_RP2040

Easyduino_RP2040: stages 4 and 6 take 45% to 82% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 10 s. Simulation, STL takes 7.9 s. Simulation, OBJ takes 13 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 2.8 0.3 ms 3.0 0.2 0.6 0.2 7.7
Simulation, STEP 0.3 0.9 2.7 0.2 ms 3.0 2.8 0.6 0.3 10.4
Simulation, STL 0.3 0.8 2.7 0.2 ms 3.0 0.2 0.5 0.2 7.9
Simulation, OBJ 0.3 0.8 2.7 0.2 ms 3.0 5.1 0.6 0.2 12.7
Visual, GLB 0.3 0.8 2.7 0.3 ms 6.1 85 ms 0.5 0.3 10.6
Visual, OBJ 0.3 0.8 2.8 0.3 ms 6.0 3.1 0.5 0.2 13.6
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_RP2040.kicad_pcb
Folder Raspberry Pi Pico 2040
Complexity 325 / 1000 (size 225, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 47, 570, 88
Triangles, simulation 947,692 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 399 MB
STEP 133 MB 493 MB
STL 47 MB 399 MB
OBJ 95 MB 702 MB
Visual
GLB 20 MB 492 MB
OBJ 61 MB 515 MB

1208. Easyduino_STM32F103

Easyduino_STM32F103: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 7.2 s. Simulation, STEP takes 9.3 s. Simulation, STL takes 7.0 s. Simulation, OBJ takes 11 s. Visual, GLB takes 9.8 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.3 0.4 ms 3.0 0.1 0.5 0.2 7.2
Simulation, STEP 0.2 0.7 2.4 0.6 ms 3.0 2.2 0.4 0.3 9.3
Simulation, STL 0.2 0.7 2.3 0.3 ms 2.9 0.2 0.5 0.2 7.0
Simulation, OBJ 0.2 0.7 2.2 0.4 ms 3.0 3.9 0.5 0.3 10.8
Visual, GLB 0.2 0.7 2.4 0.5 ms 5.5 68 ms 0.6 0.3 9.8
Visual, OBJ 0.3 0.7 2.2 0.4 ms 5.9 2.2 0.6 0.2 12.1
Board Repo: Hanqaqa/Easyduino
Board: Easyduino_STM32F103.kicad_pcb
Folder STM32F103 Bluepill
Complexity 313 / 1000 (size 218, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 30, 484, 75
Triangles, simulation 780,722 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 355 MB
STEP 93 MB 435 MB
STL 39 MB 355 MB
OBJ 78 MB 586 MB
Visual
GLB 16 MB 388 MB
OBJ 48 MB 472 MB

1209. stepperdriver front panel

stepperdriver front panel: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 5.2 s. Simulation, STEP takes 6.1 s. Simulation, STL takes 4.7 s. Simulation, OBJ takes 6.8 s. Visual, GLB takes 7.3 s. Visual, OBJ takes 8.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.7 1.9 0.3 ms 1.5 67 ms 0.3 0.3 5.2
Simulation, STEP 0.4 0.6 1.6 0.2 ms 1.4 1.5 0.2 0.2 6.1
Simulation, STL 0.3 0.7 1.8 0.2 ms 1.4 0.1 0.2 0.2 4.7
Simulation, OBJ 0.4 0.7 1.8 0.3 ms 1.5 2.0 0.2 0.2 6.8
Visual, GLB 0.3 0.7 1.7 0.3 ms 3.9 59 ms 0.4 0.2 7.3
Visual, OBJ 0.3 0.8 1.8 0.2 ms 3.6 1.7 0.5 0.3 8.9
Board Repo: harp-tech/device.stepperdriver
Board: stepperdriver front panel.kicad_pcb
Folder Hardware / PCB / stepper driver front panel
Complexity 239 / 1000 (size 149, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 22, 219, 57
Triangles, simulation 410,638 in 37 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 291 MB
STEP 73 MB 326 MB
STL 21 MB 290 MB
OBJ 42 MB 345 MB
Visual
GLB 11 MB 326 MB
OBJ 34 MB 329 MB

1210. stepper driver rear panel

stepper driver rear panel: stages 4 and 6 take 38% to 64% of a run. Simulation, GLB takes 1.1 s. Simulation, STEP takes 1.9 s. Simulation, STL takes 1.1 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.4 s. Visual, OBJ takes 1.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 90 ms 88 ms 0.2 0.1 ms 0.4 11 ms 32 ms 0.2 1.1
Simulation, STEP 95 ms 89 ms 0.3 0.1 ms 0.4 0.7 28 ms 0.2 1.9
Simulation, STL 95 ms 89 ms 0.3 0.3 ms 0.4 20 ms 31 ms 0.2 1.1
Simulation, OBJ 90 ms 87 ms 0.3 0.1 ms 0.4 0.4 33 ms 0.2 1.5
Visual, GLB 92 ms 86 ms 0.3 0.1 ms 0.6 10 ms 65 ms 0.2 1.4
Visual, OBJ 91 ms 89 ms 0.3 0.1 ms 0.6 0.3 62 ms 0.3 1.6
Board Repo: harp-tech/device.stepperdriver
Board: stepper driver rear panel.kicad_pcb
Folder Hardware / PCB / stepper driver rear panel
Complexity 156 / 1000 (size 66, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 1, 0, 4
Triangles, simulation 61,040 in 12 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.1 MB 72 MB
STEP 8.5 MB 177 MB
STL 3.1 MB 74 MB
OBJ 5.9 MB 85 MB
Visual
GLB 1.6 MB 109 MB
OBJ 4.5 MB 109 MB

1211. stepper driver

stepper driver: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 45 s. Simulation, STEP takes 57 s. Simulation, STL takes 47 s. Simulation, OBJ takes 69 s. Visual, GLB takes 63 s. Visual, OBJ takes 80 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 5.4 17.4 1 ms 16.8 0.8 2.7 0.3 44.5
Simulation, STEP 1.3 5.0 17.4 0.6 ms 17.3 12.4 3.0 0.3 56.7
Simulation, STL 1.2 5.1 17.6 1 ms 18.3 1.4 2.9 0.4 47.0
Simulation, OBJ 1.2 5.1 17.2 1 ms 17.0 25.4 2.8 0.3 68.9
Visual, GLB 1.1 5.0 16.9 0.7 ms 34.0 0.5 5.3 0.3 63.1
Visual, OBJ 1.2 4.8 16.5 0.7 ms 33.8 17.9 5.6 0.2 80.1
Board Repo: harp-tech/device.stepperdriver
Board: stepper driver.kicad_pcb
Folder Hardware / PCB / stepper driver
Complexity 408 / 1000 (size 283, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 207, 2,022, 900
Triangles, simulation 4,340,758 in 241 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 144 MB 1.3 GB
STEP 566 MB 1.9 GB
STL 217 MB 1.4 GB
OBJ 457 MB 2.7 GB
Visual
GLB 100 MB 1.7 GB
OBJ 320 MB 2.1 GB

1212. HALMET

HALMET: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 19 s. Simulation, OBJ takes 33 s. Visual, GLB takes 31 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 2.5 6.4 0.9 ms 8.1 0.4 0.9 0.3 19.5
Simulation, STEP 0.9 2.4 6.2 0.7 ms 8.0 5.8 0.9 0.2 24.5
Simulation, STL 1.0 2.4 6.1 0.8 ms 7.9 0.7 0.9 0.3 19.2
Simulation, OBJ 1.0 2.5 6.7 1.0 ms 8.4 13.1 0.9 0.3 32.9
Visual, GLB 1.0 2.4 6.2 0.8 ms 18.5 0.2 2.4 0.3 31.1
Visual, OBJ 1.0 2.4 7.5 2 ms 18.8 8.6 2.4 0.2 41.0
Board Repo: hatlabs/halmet-hardware
Board: HALMET.kicad_pcb
Complexity 369 / 1000 (size 219, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 215, 1,395, 333
Triangles, simulation 2,383,058 in 156 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 816 MB
STEP 325 MB 972 MB
STL 119 MB 800 MB
OBJ 249 MB 1.6 GB
Visual
GLB 53 MB 1.1 GB
OBJ 164 MB 1.2 GB

1213. HALPI2

HALPI2: stages 4 and 6 take 48% to 87% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 3 min. Simulation, OBJ takes 4 min. Visual, GLB takes 5 min. Visual, OBJ takes 5 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 6.4 12.6 53.6 2 ms 62.7 3.2 10.0 0.6 149.2
Simulation, STEP 6.8 12.8 54.3 2 ms 63.7 40.2 10.4 0.7 188.9
Simulation, STL 6.8 13.0 53.1 2 ms 61.9 7.1 10.4 0.7 152.9
Simulation, OBJ 6.9 12.8 53.6 2 ms 63.8 96.8 10.0 0.7 244.6
Visual, GLB 7.0 13.0 54.5 2 ms 190.6 1.5 14.6 0.6 281.7
Visual, OBJ 6.7 12.6 51.9 2 ms 185.5 53.6 12.9 0.6 323.8
Board Repo: hatlabs/halpi2-hardware
Board: HALPI2.kicad_pcb
Complexity 495 / 1000 (size 310, features 185)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 552, 5,434, 1,660
Triangles, simulation 14,008,076 in 554 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 464 MB 3.5 GB
STEP 2.1 GB 4.7 GB
STL 700 MB 3.6 GB
OBJ 1.5 GB 8.8 GB
Visual
GLB 283 MB 4.7 GB
OBJ 929 MB 6.1 GB

1214. HALSER

HALSER: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 19 s. Simulation, OBJ takes 30 s. Visual, GLB takes 32 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.2 7.2 0.9 ms 8.2 0.4 0.8 0.3 19.7
Simulation, STEP 0.6 2.4 7.1 1 ms 7.4 5.3 0.9 0.3 24.1
Simulation, STL 0.6 2.4 6.9 0.8 ms 7.8 0.6 0.9 0.2 19.5
Simulation, OBJ 0.6 2.4 6.9 0.8 ms 7.7 10.8 0.8 0.3 29.6
Visual, GLB 0.6 2.3 7.3 0.9 ms 18.8 0.2 2.1 0.2 31.6
Visual, OBJ 0.6 2.3 7.2 0.8 ms 17.7 7.2 2.4 0.2 37.7
Board Repo: hatlabs/halser-hardware
Board: HALSER.kicad_pcb
Complexity 366 / 1000 (size 216, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 174, 1,183, 354
Triangles, simulation 2,423,634 in 129 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 771 MB
STEP 301 MB 972 MB
STL 121 MB 767 MB
OBJ 252 MB 1.6 GB
Visual
GLB 54 MB 1.1 GB
OBJ 165 MB 1.2 GB

1215. SH-RPi

SH-RPi: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 21 s. Simulation, OBJ takes 35 s. Visual, GLB takes 33 s. Visual, OBJ takes 47 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.5 7.8 0.9 ms 8.9 0.4 1.0 0.3 21.6
Simulation, STEP 0.9 2.9 7.5 0.7 ms 8.1 6.2 0.9 0.4 26.9
Simulation, STL 0.7 2.3 8.0 1.0 ms 8.0 0.7 1.0 0.3 21.0
Simulation, OBJ 0.8 2.5 7.7 1 ms 8.9 13.4 0.9 0.3 34.6
Visual, GLB 0.8 2.5 8.0 0.8 ms 19.2 0.2 2.0 0.3 33.0
Visual, OBJ 0.6 2.6 8.7 0.7 ms 21.7 10.6 2.2 0.3 46.7
Board Repo: hatlabs/sh-rpi-hardware
Board: SH-RPi.kicad_pcb
Complexity 343 / 1000 (size 213, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 153, 925, 364
Triangles, simulation 2,241,942 in 132 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 75 MB 719 MB
STEP 275 MB 955 MB
STL 112 MB 743 MB
OBJ 234 MB 1.5 GB
Visual
GLB 50 MB 926 MB
OBJ 155 MB 1.1 GB

1216. motor-controller-hw

motor-controller-hw: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 37 s. Simulation, STL takes 31 s. Simulation, OBJ takes 48 s. Visual, GLB takes 43 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.4 12.1 0.6 ms 11.1 0.5 1.5 0.3 29.7
Simulation, STEP 0.6 3.5 12.6 0.6 ms 11.3 7.7 1.4 0.3 37.4
Simulation, STL 0.6 3.5 12.8 0.6 ms 11.4 0.8 1.6 0.3 31.1
Simulation, OBJ 0.6 3.8 12.9 0.6 ms 11.0 17.6 1.6 0.3 47.8
Visual, GLB 0.6 3.7 12.1 0.6 ms 23.3 0.3 2.7 0.3 43.1
Visual, OBJ 0.7 3.5 13.4 1.0 ms 23.3 10.8 2.6 0.2 54.4
Board Repo: heev/motor-controller-2018
Board: motor-controller-hw.kicad_pcb
Folder motor-controller-hw
Complexity 318 / 1000 (size 263, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 156, 1,989, 192
Triangles, simulation 3,029,272 in 206 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 106 MB 1.0 GB
STEP 513 MB 1.1 GB
STL 151 MB 933 MB
OBJ 327 MB 2.0 GB
Visual
GLB 65 MB 1.2 GB
OBJ 202 MB 1.3 GB

1217. MotorControllerPowerBoard

MotorControllerPowerBoard: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 32 s. Visual, GLB takes 27 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.6 9.9 0.7 ms 7.5 0.3 1.0 0.2 22.1
Simulation, STEP 0.4 2.4 9.0 0.5 ms 7.0 5.0 0.9 0.3 25.1
Simulation, STL 0.5 2.4 9.5 0.5 ms 7.2 0.6 1.0 0.3 21.3
Simulation, OBJ 0.5 2.4 9.0 0.6 ms 7.2 11.7 1.0 0.3 32.1
Visual, GLB 0.4 2.4 9.2 0.7 ms 13.5 0.2 1.4 0.2 27.4
Visual, OBJ 0.4 2.5 9.0 0.6 ms 13.4 5.9 1.7 0.3 33.3
Board Repo: heev/motor-controller-2018
Board: MotorControllerPowerBoard.kicad_pcb
Folder MotorControllerPowerBoardRev2 / MotorControllerPowerBoard
Complexity 271 / 1000 (size 201, features 70)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 131, 747, 108
Triangles, simulation 2,114,558 in 108 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 652 MB
STEP 303 MB 793 MB
STL 106 MB 635 MB
OBJ 222 MB 1.4 GB
Visual
GLB 38 MB 764 MB
OBJ 115 MB 836 MB

1218. voltage-regulator-module

voltage-regulator-module: stages 4 and 6 take 43% to 77% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 82 ms 0.4 0.1 ms 0.5 18 ms 64 ms 0.2 1.3
Simulation, STEP 90 ms 84 ms 0.4 0.2 ms 0.5 0.7 54 ms 0.2 2.1
Simulation, STL 85 ms 74 ms 0.3 0.1 ms 0.5 20 ms 49 ms 0.2 1.2
Simulation, OBJ 86 ms 79 ms 0.3 0.2 ms 0.5 0.4 50 ms 0.2 1.7
Visual, GLB 84 ms 75 ms 0.4 0.1 ms 1.2 13 ms 0.1 0.2 2.0
Visual, OBJ 86 ms 76 ms 0.4 0.2 ms 1.1 0.3 91 ms 0.2 2.3
Board Repo: heev/motor-controller-2018
Board: voltage-regulator-module.kicad_pcb
Folder voltage-regulator-module
Complexity 174 / 1000 (size 129, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 14, 127, 10
Triangles, simulation 107,936 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.8 MB 178 MB
STEP 21 MB 189 MB
STL 5.4 MB 185 MB
OBJ 11 MB 178 MB
Visual
GLB 2.7 MB 156 MB
OBJ 7.4 MB 157 MB

1219. ISA_CGA

ISA_CGA: stages 4 and 6 take 49% to 86% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.9 9.2 39.2 3 ms 42.4 2.4 7.3 0.5 103.0
Simulation, STEP 2.0 9.1 37.8 2 ms 40.1 25.2 6.8 0.5 121.7
Simulation, STL 1.9 9.3 39.7 4 ms 41.7 4.8 7.1 0.6 105.0
Simulation, OBJ 2.0 9.5 40.8 2 ms 41.1 67.3 7.2 0.6 168.6
Visual, GLB 2.3 9.4 42.0 3 ms 102.4 1.0 10.8 0.4 168.4
Visual, OBJ 2.0 9.4 39.8 2 ms 101.2 29.2 10.7 0.3 192.6
Board Repo: hkzlab/CGA_Redux
Board: ISA_CGA.kicad_pcb
Complexity 307 / 1000 (size 237, features 70)
KESE features through vias, custom pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 170, 7,503, 328
Triangles, simulation 11,388,894 in 316 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 387 MB 2.5 GB
STEP 1.5 GB 3.5 GB
STL 569 MB 2.4 GB
OBJ 1.2 GB 7.1 GB
Visual
GLB 196 MB 3.2 GB
OBJ 634 MB 4.0 GB

1220. ISA_ES1868

ISA_ES1868: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 38 s. Simulation, STL takes 31 s. Simulation, OBJ takes 50 s. Visual, GLB takes 47 s. Visual, OBJ takes 60 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 3.1 11.8 0.7 ms 11.3 0.6 1.7 0.3 29.7
Simulation, STEP 0.9 3.0 11.7 1 ms 11.8 8.0 1.7 0.4 37.5
Simulation, STL 1.0 3.3 11.8 0.8 ms 11.7 1.1 1.9 0.3 30.9
Simulation, OBJ 1.2 3.1 11.7 0.8 ms 12.3 19.2 1.8 0.3 49.7
Visual, GLB 0.9 3.1 12.2 0.7 ms 26.8 0.3 3.1 0.3 46.8
Visual, OBJ 1.0 3.5 12.6 0.7 ms 28.4 11.3 3.6 0.2 60.5
Board Repo: hkzlab/ES1868_ISA8
Board: ISA_ES1868.kicad_pcb
Complexity 329 / 1000 (size 249, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 119, 1,607, 85
Triangles, simulation 3,227,944 in 148 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 110 MB 1.1 GB
STEP 478 MB 1.3 GB
STL 161 MB 1.1 GB
OBJ 340 MB 2.1 GB
Visual
GLB 65 MB 1.4 GB
OBJ 200 MB 1.3 GB

1221. ISA_ES688

ISA_ES688: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 37 s. Simulation, STL takes 30 s. Simulation, OBJ takes 49 s. Visual, GLB takes 47 s. Visual, OBJ takes 58 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 3.3 11.5 1 ms 11.3 0.5 1.6 0.3 29.6
Simulation, STEP 0.9 3.1 11.5 0.9 ms 11.5 8.4 1.6 0.3 37.4
Simulation, STL 1.0 3.2 11.4 0.8 ms 11.6 1.0 1.7 0.3 30.2
Simulation, OBJ 1.1 3.3 12.5 0.8 ms 11.6 18.6 1.7 0.3 49.1
Visual, GLB 0.9 3.3 11.6 0.8 ms 27.8 0.3 3.3 0.3 47.5
Visual, OBJ 0.9 3.0 12.0 0.8 ms 26.8 11.4 3.6 0.2 58.1
Board Repo: hkzlab/ES688_ISA8
Board: ISA_ES688.kicad_pcb
Complexity 335 / 1000 (size 255, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 125, 2,157, 166
Triangles, simulation 3,361,666 in 167 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 115 MB 1.1 GB
STEP 512 MB 1.3 GB
STL 168 MB 1.1 GB
OBJ 355 MB 2.2 GB
Visual
GLB 71 MB 1.4 GB
OBJ 221 MB 1.5 GB

1222. allwinner-h3

allwinner-h3: stages 4 and 6 take 59% to 85% of a run. Simulation, GLB takes 9.6 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.7 0.5 ms 5.2 0.1 0.5 0.2 9.6
Simulation, STEP 0.2 0.6 2.8 0.2 ms 5.1 3.5 0.5 0.2 13.0
Simulation, STL 0.2 0.6 2.7 0.4 ms 5.1 0.3 0.5 0.2 9.7
Simulation, OBJ 0.2 0.7 2.5 0.4 ms 5.0 3.7 0.4 0.2 12.7
Visual, GLB 0.2 0.7 2.6 0.2 ms 8.2 0.1 0.6 0.2 12.7
Visual, OBJ 0.2 0.6 2.8 0.2 ms 8.7 3.6 1.0 0.2 17.2
Board Repo: hvwyl/allwinner-h3-ddr3-16x1-kicad
Board: allwinner-h3.kicad_pcb
Folder project
Complexity 293 / 1000 (size 223, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 20, 1,320, 119
Triangles, simulation 867,728 in 91 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 506 MB
STEP 137 MB 533 MB
STL 43 MB 494 MB
OBJ 86 MB 615 MB
Visual
GLB 25 MB 683 MB
OBJ 76 MB 678 MB

1223. FCCU-v2-schematic-pcb

FCCU-v2-schematic-pcb: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 43 s. Simulation, STEP takes 52 s. Simulation, STL takes 45 s. Simulation, OBJ takes 63 s. Visual, GLB takes 62 s. Visual, OBJ takes 75 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 4.3 16.9 1 ms 17.4 0.9 1.8 0.3 42.6
Simulation, STEP 0.9 4.6 16.8 0.7 ms 18.0 9.3 1.8 0.3 51.6
Simulation, STL 0.9 4.6 17.2 2 ms 18.1 2.0 1.9 0.3 45.0
Simulation, OBJ 0.9 4.3 17.4 0.8 ms 18.1 20.0 1.7 0.2 62.7
Visual, GLB 0.9 4.6 16.4 0.7 ms 35.2 0.3 4.0 0.3 61.7
Visual, OBJ 0.9 4.4 17.0 2 ms 37.0 10.8 4.5 0.3 74.8
Board Repo: hydrogreenpollub/fuel_cell_control_unit_pcb_fccu_v2_1
Board: FCCU-v2-schematic-pcb.kicad_pcb
Complexity 400 / 1000 (size 270, features 130)
KESE features through vias, padstacks, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 207, 3,324, 532
Triangles, simulation 4,737,866 in 182 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 161 MB 1.4 GB
STEP 635 MB 1.7 GB
STL 237 MB 1.4 GB
OBJ 501 MB 3.0 GB
Visual
GLB 86 MB 1.6 GB
OBJ 268 MB 1.8 GB

1224. FCCU-v21-schematic-pcb

FCCU-v21-schematic-pcb: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 59 s. Simulation, STEP takes 71 s. Simulation, STL takes 62 s. Simulation, OBJ takes 90 s. Visual, GLB takes 82 s. Visual, OBJ takes 97 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 6.3 24.0 0.9 ms 23.4 0.8 2.8 0.4 59.3
Simulation, STEP 1.6 6.7 23.5 2 ms 23.2 13.0 2.7 0.4 71.1
Simulation, STL 1.7 6.3 24.5 0.9 ms 24.2 2.1 2.6 0.4 61.7
Simulation, OBJ 1.4 6.4 24.6 1 ms 24.1 30.8 2.7 0.4 90.5
Visual, GLB 1.4 6.3 23.2 1 ms 46.5 0.5 4.2 0.3 82.3
Visual, OBJ 1.4 6.3 23.6 1.0 ms 45.6 15.6 4.5 0.3 97.3
Board Repo: hydrogreenpollub/fuel_cell_control_unit_pcb_fccu_v2_1
Board: FCCU-v21-schematic-pcb.kicad_pcb
Complexity 404 / 1000 (size 274, features 130)
KESE features through vias, padstacks, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 258, 3,794, 507
Triangles, simulation 4,809,760 in 228 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 165 MB 1.2 GB
STEP 677 MB 1.7 GB
STL 241 MB 1.2 GB
OBJ 511 MB 3.1 GB
Visual
GLB 90 MB 1.6 GB
OBJ 280 MB 1.9 GB

1225. Amiga 2000R6

Amiga 2000R6: stages 4 and 6 take 57% to 88% of a run. Simulation, GLB takes 8 min. Simulation, STEP takes 10 min. Simulation, STL takes 8 min. Simulation, OBJ takes 12 min. Visual, GLB takes 12 min. Visual, OBJ takes 13 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 4.6 33.1 235.2 4 ms 166.1 8.0 25.6 1.0 473.6
Simulation, STEP 4.2 32.6 238.4 4 ms 168.2 106.9 27.7 1.2 579.1
Simulation, STL 4.7 33.9 239.0 6 ms 177.7 17.7 25.7 1.1 499.8
Simulation, OBJ 3.9 30.8 231.5 8 ms 174.2 237.4 30.9 3.1 711.9
Visual, GLB 4.8 33.2 240.8 5 ms 422.0 4.3 43.4 1.0 749.6
Visual, OBJ 4.0 30.3 227.1 7 ms 366.9 98.2 35.3 0.9 762.7
Board Repo: iansbremner/Amiga-2000-KiCAD
Board: Amiga 2000R6.kicad_pcb
Complexity 346 / 1000 (size 291, features 55)
KESE features through vias, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026 to 11th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 543, 21,184, 1,195
Triangles, simulation 28,431,494 in 828 parts
Verifier PASS in all six runs
Run again Visual, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
Run again Simulation, OBJ: failed in the corpus run, run again with no memory cap and no time limit (swap added to a 16 GB machine), and passed
File
type
File
size
Peak memory
used
Simulation
GLB 975 MB 6.2 GB
STEP 5.1 GB 8.9 GB
STL 1.4 GB 6.5 GB
OBJ 3.2 GB 18 GB
Visual
GLB 548 MB 8.0 GB
OBJ 1.8 GB 11 GB

1226. Daughterboard

Daughterboard: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 71 s. Simulation, STEP takes 88 s. Simulation, STL takes 73 s. Simulation, OBJ takes 2 min. Visual, GLB takes 97 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 4.7 32.8 2 ms 26.8 1.5 4.4 0.3 71.4
Simulation, STEP 0.8 5.0 33.5 2 ms 27.0 17.3 4.2 0.4 88.2
Simulation, STL 0.8 4.9 32.8 2 ms 27.1 2.9 4.3 0.4 73.1
Simulation, OBJ 0.8 5.0 32.2 2 ms 26.9 40.0 4.1 0.4 109.5
Visual, GLB 0.8 5.1 33.5 2 ms 50.0 0.5 6.3 0.3 96.5
Visual, OBJ 0.8 5.1 33.4 2 ms 49.5 16.1 6.2 0.3 111.4
Board Repo: iansbremner/Amiga-3000-Daughterboard
Board: Daughterboard.kicad_pcb
Complexity 253 / 1000 (size 218, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 90, 3,667, 102
Triangles, simulation 8,425,376 in 307 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 285 MB 1.9 GB
STEP 1.2 GB 2.6 GB
STL 421 MB 1.9 GB
OBJ 908 MB 5.3 GB
Visual
GLB 125 MB 2.3 GB
OBJ 396 MB 2.6 GB

1227. Issue 4

Issue 4: stages 4 and 6 take 57% to 87% of a run. Simulation, GLB takes 68 s. Simulation, STEP takes 84 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 96 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.0 36.1 0.8 ms 21.9 1.0 2.8 0.3 68.0
Simulation, STEP 1.0 5.1 36.1 0.9 ms 22.0 16.3 3.0 0.3 83.8
Simulation, STL 0.9 5.0 36.5 0.5 ms 22.0 2.0 2.9 0.3 69.6
Simulation, OBJ 0.9 4.9 36.6 0.6 ms 21.9 34.3 2.8 0.3 101.8
Visual, GLB 1.0 5.1 36.2 0.7 ms 48.0 0.6 5.1 0.3 96.2
Visual, OBJ 0.9 5.1 36.3 0.7 ms 46.6 19.6 4.7 0.3 113.5
Board Repo: iansbremner/ZX-Spectrum-Issue-4B-KiCAD
Board: Issue 4.kicad_pcb
Complexity 283 / 1000 (size 218, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 195, 5,111, 429
Triangles, simulation 6,255,428 in 166 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 215 MB 1.8 GB
STEP 1.1 GB 2.2 GB
STL 313 MB 1.8 GB
OBJ 673 MB 4.0 GB
Visual
GLB 125 MB 2.0 GB
OBJ 397 MB 2.6 GB

1228. tomu-fpga

tomu-fpga: stages 4 and 6 take 54% to 81% of a run. Simulation, GLB takes 6.5 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.3 s. Simulation, OBJ takes 9.7 s. Visual, GLB takes 8.4 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.1 0.2 ms 2.0 84 ms 0.3 0.2 6.5
Simulation, STEP 0.2 0.7 2.9 0.2 ms 2.0 1.6 0.2 0.3 7.9
Simulation, STL 0.2 0.7 3.0 0.2 ms 1.8 0.2 0.2 0.2 6.3
Simulation, OBJ 0.2 0.8 3.1 0.2 ms 2.1 3.0 0.3 0.2 9.7
Visual, GLB 0.2 0.8 3.1 0.3 ms 3.6 48 ms 0.3 0.3 8.4
Visual, OBJ 0.2 0.8 3.7 0.2 ms 3.8 1.5 0.3 0.2 10.5
Board Repo: im-tomu/fomu-hardware
Board: tomu-fpga.kicad_pcb
Folder archive / dvt / pcb
Complexity 347 / 1000 (size 192, features 155)
KESE features blind and buried vias, microvias,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 41, 579, 249
Triangles, simulation 513,942 in 44 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 313 MB
STEP 74 MB 348 MB
STL 26 MB 312 MB
OBJ 53 MB 408 MB
Visual
GLB 9.8 MB 310 MB
OBJ 29 MB 307 MB

1229. tomu-fpga

tomu-fpga: stages 4 and 6 take 59% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 21 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.4 6.2 0.7 ms 6.3 0.2 0.6 0.3 15.3
Simulation, STEP 0.3 1.3 6.5 0.6 ms 6.3 3.7 0.5 0.2 18.9
Simulation, STL 0.3 1.3 6.3 0.5 ms 6.2 0.3 0.5 0.3 15.2
Simulation, OBJ 0.3 1.4 6.3 0.5 ms 6.2 6.3 0.6 0.2 21.2
Visual, GLB 0.3 1.4 6.2 0.3 ms 9.3 0.2 0.9 0.2 18.6
Visual, OBJ 0.3 1.4 6.3 0.5 ms 9.3 4.7 0.9 0.2 23.1
Board Repo: im-tomu/fomu-hardware
Board: tomu-fpga.kicad_pcb
Folder archive / evt / pcb
Complexity 265 / 1000 (size 220, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 62, 919, 162
Triangles, simulation 1,100,316 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 38 MB 474 MB
STEP 194 MB 565 MB
STL 55 MB 466 MB
OBJ 113 MB 811 MB
Visual
GLB 27 MB 613 MB
OBJ 80 MB 616 MB

1230. tomu

tomu: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 2.7 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.2 ms 0.8 30 ms 0.1 0.2 2.2
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.8 0.9 84 ms 0.2 3.0
Simulation, STL 0.1 0.2 0.8 0.2 ms 0.8 46 ms 0.1 0.2 2.3
Simulation, OBJ 0.1 0.2 0.6 0.2 ms 0.8 0.7 0.1 0.2 2.7
Visual, GLB 0.1 0.2 0.6 0.2 ms 1.8 21 ms 0.1 0.2 3.0
Visual, OBJ 99 ms 0.2 0.6 0.1 ms 1.9 0.6 0.1 0.3 3.7
Board Repo: im-tomu/tomu-hardware
Board: tomu.kicad_pcb
Folder pcb
Complexity 193 / 1000 (size 138, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 14, 193, 25
Triangles, simulation 162,358 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.7 MB 206 MB
STEP 26 MB 212 MB
STL 8.1 MB 204 MB
OBJ 16 MB 204 MB
Visual
GLB 3.9 MB 173 MB
OBJ 11 MB 172 MB

1231. tomu

tomu: stages 4 and 6 take 54% to 77% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 2.9 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.6 0.2 ms 1.3 25 ms 87 ms 0.2 2.5
Simulation, STEP 0.1 0.2 0.6 0.2 ms 1.3 1.0 77 ms 0.2 3.5
Simulation, STL 0.1 0.2 0.6 0.2 ms 1.3 37 ms 79 ms 0.2 2.5
Simulation, OBJ 0.1 0.2 0.6 0.1 ms 1.3 0.8 84 ms 0.2 3.2
Visual, GLB 0.1 0.2 0.6 0.2 ms 1.6 20 ms 0.1 0.2 2.9
Visual, OBJ 0.1 0.2 0.6 0.2 ms 1.7 0.6 0.1 0.2 3.4
Board Repo: im-tomu/tomu-hardware
Board: tomu.kicad_pcb
Folder releases / v0.0 / gerbers
Complexity 211 / 1000 (size 136, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 198, 13
Triangles, simulation 122,700 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.4 MB 196 MB
STEP 24 MB 205 MB
STL 6.1 MB 195 MB
OBJ 12 MB 195 MB
Visual
GLB 3.5 MB 163 MB
OBJ 9.8 MB 165 MB

1232. tomu

tomu: stages 4 and 6 take 53% to 75% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.0 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.2 ms 1.2 24 ms 80 ms 0.2 2.3
Simulation, STEP 0.1 0.2 0.5 0.1 ms 1.2 0.8 70 ms 0.2 3.1
Simulation, STL 0.1 0.2 0.5 0.2 ms 1.2 37 ms 98 ms 0.2 2.3
Simulation, OBJ 0.1 0.2 0.7 0.2 ms 1.1 0.6 85 ms 0.2 3.0
Visual, GLB 0.1 0.2 0.5 0.2 ms 1.6 19 ms 0.1 0.3 2.8
Visual, OBJ 0.1 0.2 0.5 0.2 ms 1.6 0.5 0.1 0.2 3.2
Board Repo: im-tomu/tomu-hardware
Board: tomu.kicad_pcb
Folder releases / v0.1 / gerbers
Complexity 211 / 1000 (size 136, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 198, 13
Triangles, simulation 122,368 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.4 MB 195 MB
STEP 23 MB 214 MB
STL 6.1 MB 195 MB
OBJ 12 MB 195 MB
Visual
GLB 3.5 MB 165 MB
OBJ 9.8 MB 163 MB

1233. tomu

tomu: stages 4 and 6 take 44% to 76% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.7 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.3 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.4 0.2 ms 0.8 23 ms 72 ms 0.2 1.8
Simulation, STEP 0.1 0.2 0.5 0.1 ms 0.7 1.0 81 ms 0.2 2.7
Simulation, STL 0.1 0.2 0.5 0.2 ms 0.8 32 ms 70 ms 0.2 1.8
Simulation, OBJ 0.1 0.2 0.4 0.1 ms 0.7 0.6 66 ms 0.2 2.3
Visual, GLB 99 ms 0.2 0.5 0.1 ms 1.4 17 ms 99 ms 0.2 2.5
Visual, OBJ 0.1 0.2 0.4 0.2 ms 1.5 0.6 0.1 0.2 3.1
Board Repo: im-tomu/tomu-hardware
Board: tomu.kicad_pcb
Folder releases / v0.2 / gerbers
Complexity 210 / 1000 (size 135, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 176, 13
Triangles, simulation 121,252 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.3 MB 194 MB
STEP 24 MB 203 MB
STL 6.1 MB 193 MB
OBJ 12 MB 192 MB
Visual
GLB 3.5 MB 162 MB
OBJ 9.7 MB 162 MB

1234. tomu

tomu: stages 4 and 6 take 48% to 77% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.5 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.6 0.1 ms 0.8 25 ms 74 ms 0.2 1.9
Simulation, STEP 0.1 0.2 0.6 0.1 ms 0.8 1.0 78 ms 0.2 3.0
Simulation, STL 0.1 0.2 0.6 0.2 ms 0.8 37 ms 74 ms 0.2 1.9
Simulation, OBJ 0.1 0.1 0.5 0.1 ms 0.8 0.7 77 ms 0.2 2.5
Visual, GLB 0.1 0.1 0.5 0.1 ms 1.5 20 ms 0.1 0.2 2.7
Visual, OBJ 0.1 0.2 0.6 0.2 ms 1.5 0.5 0.1 0.2 3.2
Board Repo: im-tomu/tomu-hardware
Board: tomu.kicad_pcb
Folder releases / v0.3 / gerber
Complexity 200 / 1000 (size 135, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 177, 13
Triangles, simulation 132,304 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.7 MB 198 MB
STEP 26 MB 209 MB
STL 6.6 MB 196 MB
OBJ 13 MB 196 MB
Visual
GLB 3.7 MB 168 MB
OBJ 10 MB 169 MB

1235. alu

alu: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 39 s. Simulation, STL takes 33 s. Simulation, OBJ takes 46 s. Visual, GLB takes 56 s. Visual, OBJ takes 69 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 3.5 14.5 1 ms 11.9 0.5 1.2 0.3 32.3
Simulation, STEP 0.4 3.3 14.1 1 ms 11.0 8.4 1.2 0.3 38.7
Simulation, STL 0.5 3.4 14.3 1.0 ms 11.7 1.0 1.3 0.3 32.5
Simulation, OBJ 0.5 3.6 13.9 1 ms 12.4 14.6 1.2 0.3 46.4
Visual, GLB 0.5 3.4 14.3 1 ms 32.2 0.4 4.6 0.3 55.6
Visual, OBJ 0.5 3.4 14.9 1 ms 31.3 13.3 5.5 0.2 69.3
Board Repo: imihajlow/ccpu
Board: alu.kicad_pcb
Folder boards / alu
Complexity 262 / 1000 (size 207, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 66, 4,386, 780
Triangles, simulation 3,122,734 in 178 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 108 MB 1.3 GB
STEP 542 MB 1.4 GB
STL 156 MB 1.3 GB
OBJ 332 MB 2.0 GB
Visual
GLB 95 MB 1.7 GB
OBJ 300 MB 1.9 GB

1236. control

control: stages 4 and 6 take 59% to 83% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 33 s. Visual, GLB takes 33 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.3 10.5 1 ms 9.7 0.3 0.8 0.3 24.3
Simulation, STEP 0.4 2.4 10.3 1 ms 9.5 6.2 0.8 0.3 29.9
Simulation, STL 0.4 2.3 10.7 1 ms 10.0 0.7 0.8 0.3 25.2
Simulation, OBJ 0.4 2.3 10.2 0.9 ms 9.6 9.8 0.8 0.3 33.5
Visual, GLB 0.4 2.3 10.3 0.9 ms 17.6 0.3 2.4 0.2 33.5
Visual, OBJ 0.4 2.3 10.3 1 ms 18.0 8.5 3.0 0.2 42.7
Board Repo: imihajlow/ccpu
Board: control.kicad_pcb
Folder boards / control
Complexity 250 / 1000 (size 195, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 89, 1,430, 408
Triangles, simulation 1,991,990 in 129 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 733 MB
STEP 343 MB 942 MB
STL 100 MB 747 MB
OBJ 209 MB 1.3 GB
Visual
GLB 57 MB 1.1 GB
OBJ 176 MB 1.2 GB

1237. eth

eth: stages 4 and 6 take 52% to 79% of a run. Simulation, GLB takes 42 s. Simulation, STEP takes 52 s. Simulation, STL takes 42 s. Simulation, OBJ takes 63 s. Visual, GLB takes 57 s. Visual, OBJ takes 71 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 4.9 11.7 3 ms 21.3 0.7 1.7 0.4 41.6
Simulation, STEP 0.8 5.0 11.3 2 ms 21.4 11.0 1.6 0.4 51.7
Simulation, STL 0.8 4.8 11.1 2 ms 21.3 1.7 1.6 0.4 41.6
Simulation, OBJ 0.9 4.9 11.8 0.7 ms 21.3 22.4 1.6 0.3 63.3
Visual, GLB 0.9 5.1 11.5 2 ms 33.2 0.6 5.6 0.3 57.2
Visual, OBJ 0.9 4.8 11.5 2 ms 32.5 15.2 5.3 0.3 70.5
Board Repo: imihajlow/ccpu
Board: eth.kicad_pcb
Folder boards / eth
Complexity 323 / 1000 (size 223, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 92, 2,811, 853
Triangles, simulation 4,559,284 in 229 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 151 MB 1.4 GB
STEP 514 MB 1.7 GB
STL 228 MB 1.4 GB
OBJ 494 MB 2.9 GB
Visual
GLB 98 MB 1.6 GB
OBJ 323 MB 2.1 GB

1238. io

io: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 40 s. Simulation, STL takes 32 s. Simulation, OBJ takes 48 s. Visual, GLB takes 46 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.9 14.5 1 ms 11.6 0.5 1.2 0.2 31.4
Simulation, STEP 0.5 2.9 14.9 1 ms 12.1 8.6 1.2 0.3 40.3
Simulation, STL 0.6 3.0 14.3 1 ms 11.6 0.7 1.3 0.3 31.9
Simulation, OBJ 0.5 3.0 14.7 0.9 ms 12.1 15.9 1.3 0.3 47.8
Visual, GLB 0.5 3.1 15.2 0.7 ms 23.3 0.3 3.2 0.3 46.0
Visual, OBJ 0.5 3.0 14.9 1 ms 21.4 11.0 2.5 0.4 53.7
Board Repo: imihajlow/ccpu
Board: io.kicad_pcb
Folder boards / io
Complexity 306 / 1000 (size 241, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 119, 1,990, 399
Triangles, simulation 2,577,618 in 121 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 89 MB 879 MB
STEP 447 MB 1.2 GB
STL 129 MB 832 MB
OBJ 272 MB 1.7 GB
Visual
GLB 67 MB 1.2 GB
OBJ 208 MB 1.4 GB

1239. registers

registers: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 59 s. Simulation, STL takes 48 s. Simulation, OBJ takes 70 s. Visual, GLB takes 91 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.6 20.2 2 ms 16.8 0.8 2.1 0.3 46.5
Simulation, STEP 0.7 5.5 21.5 2 ms 16.4 12.1 2.1 0.3 58.6
Simulation, STL 0.8 5.5 20.7 2 ms 16.6 1.7 2.2 0.4 47.9
Simulation, OBJ 0.9 5.8 21.1 2 ms 16.3 23.1 2.0 0.3 69.5
Visual, GLB 0.7 5.5 23.2 2 ms 52.8 0.7 7.6 0.3 90.8
Visual, OBJ 0.8 6.1 24.2 3 ms 52.9 20.0 7.5 0.4 111.8
Board Repo: imihajlow/ccpu
Board: registers.kicad_pcb
Folder boards / registers
Complexity 278 / 1000 (size 223, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 213, 5,186, 1,072
Triangles, simulation 4,822,450 in 238 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 166 MB 1.7 GB
STEP 859 MB 2.0 GB
STL 241 MB 2.0 GB
OBJ 517 MB 3.1 GB
Visual
GLB 135 MB 2.2 GB
OBJ 434 MB 2.9 GB

1240. stack

stack: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 42 s. Simulation, STL takes 33 s. Simulation, OBJ takes 48 s. Visual, GLB takes 52 s. Visual, OBJ takes 66 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 10.3 2 ms 15.9 0.5 1.2 0.3 31.2
Simulation, STEP 0.4 2.5 10.8 1 ms 15.8 11.1 1.4 0.3 42.3
Simulation, STL 0.6 2.6 10.5 2 ms 16.4 1.2 1.3 0.3 32.8
Simulation, OBJ 0.5 2.6 10.9 1 ms 16.2 16.2 1.3 0.3 48.0
Visual, GLB 0.5 2.4 10.4 2 ms 32.8 0.5 5.0 0.3 51.9
Visual, OBJ 0.5 2.4 11.3 1 ms 32.3 13.7 5.5 0.3 65.8
Board Repo: imihajlow/ccpu
Board: stack.kicad_pcb
Folder boards / stack
Complexity 293 / 1000 (size 238, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 75, 2,008, 574
Triangles, simulation 3,306,378 in 155 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 110 MB 1.2 GB
STEP 477 MB 1.4 GB
STL 165 MB 1.2 GB
OBJ 343 MB 2.1 GB
Visual
GLB 94 MB 1.5 GB
OBJ 297 MB 1.9 GB

1241. vario

vario: stages 4 and 6 take 60% to 84% of a run. Simulation, GLB takes 34 s. Simulation, STEP takes 41 s. Simulation, STL takes 34 s. Simulation, OBJ takes 47 s. Visual, GLB takes 51 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.7 12.9 0.5 ms 16.1 0.4 1.4 0.3 34.5
Simulation, STEP 0.6 2.6 12.3 1 ms 15.8 7.9 1.3 0.3 40.8
Simulation, STL 0.5 2.5 12.2 1 ms 15.8 1.0 1.3 0.3 33.6
Simulation, OBJ 0.5 2.6 12.2 1.0 ms 16.0 14.0 1.4 0.3 47.1
Visual, GLB 0.5 2.8 12.5 1 ms 30.0 0.4 4.7 0.2 51.2
Visual, OBJ 0.6 2.6 12.4 1 ms 28.8 13.2 5.3 0.3 63.2
Board Repo: imihajlow/ccpu
Board: vario.kicad_pcb
Folder boards / vario
Complexity 263 / 1000 (size 208, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 117, 2,905, 737
Triangles, simulation 3,018,872 in 181 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 105 MB 1.1 GB
STEP 485 MB 1.4 GB
STL 151 MB 1.1 GB
OBJ 322 MB 2.0 GB
Visual
GLB 93 MB 1.5 GB
OBJ 296 MB 1.9 GB

1242. vga

vga: stages 4 and 6 take 58% to 86% of a run. Simulation, GLB takes 46 s. Simulation, STEP takes 61 s. Simulation, STL takes 48 s. Simulation, OBJ takes 68 s. Visual, GLB takes 69 s. Visual, OBJ takes 86 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.7 19.1 1 ms 19.1 0.6 1.9 0.4 45.6
Simulation, STEP 0.6 3.5 20.4 1.0 ms 20.7 13.5 1.8 0.4 61.0
Simulation, STL 0.8 3.6 20.0 1 ms 19.8 1.4 1.6 0.3 47.5
Simulation, OBJ 0.7 3.4 19.6 0.6 ms 19.7 22.3 1.6 0.3 67.7
Visual, GLB 0.6 3.4 19.6 3 ms 39.9 0.5 4.7 0.4 69.0
Visual, OBJ 0.7 3.3 21.7 1 ms 39.0 16.9 4.6 0.3 86.5
Board Repo: imihajlow/ccpu
Board: vga.kicad_pcb
Folder boards / vga
Complexity 300 / 1000 (size 245, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 80, 3,075, 715
Triangles, simulation 3,380,028 in 171 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 116 MB 1.2 GB
STEP 593 MB 1.5 GB
STL 169 MB 1.1 GB
OBJ 358 MB 2.2 GB
Visual
GLB 95 MB 1.6 GB
OBJ 302 MB 2.0 GB

1243. 4in1-panel

4in1-panel: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 3 min. Simulation, STEP takes 4 min. Simulation, STL takes 3 min. Simulation, OBJ takes 5 min. Visual, GLB takes 6 min. Visual, OBJ takes 6 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 51.4 65.0 2 ms 62.1 2.7 8.3 0.5 191.7
Simulation, STEP 1.6 51.7 64.6 2 ms 61.0 23.9 8.6 0.5 211.8
Simulation, STL 1.8 50.9 64.2 2 ms 62.6 5.8 8.6 0.6 194.4
Simulation, OBJ 1.6 53.4 63.9 2 ms 62.7 80.3 8.9 0.6 271.3
Visual, GLB 1.6 53.2 65.0 4 ms 215.5 1.0 11.5 0.4 348.3
Visual, OBJ 1.6 51.6 62.2 2 ms 212.4 29.0 11.5 0.4 368.7
Board Repo: incutec-hw/openesc-30x30
Board: 4in1-panel.kicad_pcb
Folder hardware
Complexity 464 / 1000 (size 259, features 205)
KESE features through vias, padstacks,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ,
copper finish, plated board edge
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 388, 2,655, 2,604
Triangles, simulation 13,067,554 in 279 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 427 MB 2.9 GB
STEP 1.4 GB 3.8 GB
STL 653 MB 2.8 GB
OBJ 1.4 GB 8.0 GB
Visual
GLB 196 MB 3.4 GB
OBJ 636 MB 4.2 GB

1244. 4in1

4in1: stages 4 and 6 take 53% to 87% of a run. Simulation, GLB takes 82 s. Simulation, STEP takes 95 s. Simulation, STL takes 86 s. Simulation, OBJ takes 2 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 14.9 31.9 1 ms 29.5 1.4 3.5 0.3 82.3
Simulation, STEP 0.8 15.5 32.6 1 ms 29.9 12.2 3.9 0.4 95.3
Simulation, STL 0.7 15.9 32.9 1 ms 30.4 2.7 3.4 0.4 86.4
Simulation, OBJ 0.8 15.4 32.8 1 ms 29.0 35.4 3.8 0.3 117.5
Visual, GLB 0.8 14.9 33.3 1 ms 107.0 0.4 5.2 0.3 162.0
Visual, OBJ 0.8 15.1 32.7 1 ms 102.7 15.7 5.6 0.3 173.0
Board Repo: incutec-hw/openesc-30x30
Board: 4in1.kicad_pcb
Folder hardware
Complexity 415 / 1000 (size 245, features 170)
KESE features through vias, padstacks, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ,
copper finish, plated board edge
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 214, 1,220, 1,702
Triangles, simulation 7,517,890 in 211 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 243 MB 1.6 GB
STEP 760 MB 2.2 GB
STL 376 MB 1.6 GB
OBJ 786 MB 4.6 GB
Visual
GLB 113 MB 2.3 GB
OBJ 366 MB 2.4 GB

1245. H745 CM4 module

H745 CM4 module: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 31 s. Simulation, STL takes 25 s. Simulation, OBJ takes 39 s. Visual, GLB takes 38 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 3.2 8.0 1 ms 10.2 0.6 1.6 0.3 24.5
Simulation, STEP 0.5 3.4 8.1 1 ms 10.6 6.3 1.6 0.3 30.8
Simulation, STL 0.5 3.1 8.2 1 ms 10.6 1.2 1.5 0.3 25.4
Simulation, OBJ 0.6 3.4 8.1 2 ms 10.3 14.6 1.5 0.3 38.7
Visual, GLB 0.5 3.2 8.1 1 ms 23.1 0.3 2.4 0.2 37.8
Visual, OBJ 0.5 3.3 7.6 1.0 ms 21.4 8.1 2.8 0.3 44.0
Board Repo: intergalaktik/bb3-cm4
Board: H745 CM4 module.kicad_pcb
Folder EEZ_BB3_CM4_H7
Complexity 356 / 1000 (size 271, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 110, 2,859, 483
Triangles, simulation 3,491,940 in 292 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 119 MB 1.1 GB
STEP 439 MB 1.3 GB
STL 175 MB 1.0 GB
OBJ 375 MB 2.3 GB
Visual
GLB 65 MB 1.2 GB
OBJ 213 MB 1.5 GB

1246. EEZ_BB3_CM4_R1B0

EEZ_BB3_CM4_R1B0: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 83 s. Simulation, STEP takes 98 s. Simulation, STL takes 83 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 8.0 38.2 1 ms 29.3 1.5 4.0 0.4 83.0
Simulation, STEP 1.7 7.7 38.0 1 ms 29.0 16.7 3.9 0.5 97.5
Simulation, STL 1.8 8.2 36.2 2 ms 29.2 3.2 3.4 0.4 82.5
Simulation, OBJ 1.6 7.6 35.5 1 ms 29.6 39.3 3.9 0.4 118.0
Visual, GLB 1.8 8.0 37.4 2 ms 71.5 0.8 7.8 0.3 127.6
Visual, OBJ 1.8 8.4 36.6 1 ms 72.0 23.1 9.2 0.4 151.5
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_BB3_CM4_R1B0.kicad_pcb
Folder EEZ_BB3_CM4_R1B0
Complexity 376 / 1000 (size 281, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 239, 5,730, 914
Triangles, simulation 7,322,202 in 347 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 252 MB 2.0 GB
STEP 1.1 GB 2.5 GB
STL 366 MB 1.9 GB
OBJ 799 MB 4.7 GB
Visual
GLB 149 MB 2.5 GB
OBJ 480 MB 3.2 GB

1247. EEZ_DIB_BP3C_r3B3

EEZ_DIB_BP3C_r3B3: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 29 s. Simulation, STEP takes 36 s. Simulation, STL takes 31 s. Simulation, OBJ takes 47 s. Visual, GLB takes 43 s. Visual, OBJ takes 53 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.0 12.4 0.7 ms 10.9 0.5 1.6 0.3 29.4
Simulation, STEP 0.7 3.2 12.8 0.7 ms 10.8 6.4 1.6 0.3 35.9
Simulation, STL 0.8 3.2 12.9 0.7 ms 11.3 0.9 1.6 0.4 31.2
Simulation, OBJ 0.7 3.3 13.8 0.7 ms 10.8 15.8 1.9 0.4 46.7
Visual, GLB 0.8 3.2 14.2 0.7 ms 21.9 0.3 2.0 0.4 42.7
Visual, OBJ 0.9 4.2 13.7 0.8 ms 23.7 7.8 1.9 0.3 52.5
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_DIB_BP3C_r3B3.kicad_pcb
Folder EEZ_BB3_CM4_R1B0
Complexity 288 / 1000 (size 193, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 55, 718, 161
Triangles, simulation 2,232,070 in 92 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 652 MB
STEP 333 MB 847 MB
STL 112 MB 684 MB
OBJ 240 MB 1.5 GB
Visual
GLB 43 MB 856 MB
OBJ 131 MB 974 MB

1248. EEZ_DIB_MCU_r3B4

EEZ_DIB_MCU_r3B4: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 52 s. Simulation, STEP takes 61 s. Simulation, STL takes 52 s. Simulation, OBJ takes 78 s. Visual, GLB takes 75 s. Visual, OBJ takes 92 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 5.9 21.7 0.8 ms 19.7 0.8 2.0 0.3 51.7
Simulation, STEP 1.2 5.9 21.2 0.8 ms 19.5 11.4 2.0 0.3 61.4
Simulation, STL 1.2 5.7 21.4 0.8 ms 19.5 1.4 2.0 0.3 51.7
Simulation, OBJ 1.2 5.6 21.6 2 ms 19.6 27.9 2.0 0.3 78.2
Visual, GLB 1.2 5.8 21.9 0.8 ms 41.4 0.5 3.7 0.3 74.8
Visual, OBJ 1.2 5.9 22.1 0.8 ms 42.0 16.5 3.6 0.3 91.6
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_DIB_MCU_r3B4.kicad_pcb
Folder EEZ_BB3_CM4_R1B0
Complexity 371 / 1000 (size 276, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 185, 5,012, 755
Triangles, simulation 5,098,868 in 274 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 174 MB 1.4 GB
STEP 787 MB 1.9 GB
STL 255 MB 1.5 GB
OBJ 549 MB 3.3 GB
Visual
GLB 106 MB 1.8 GB
OBJ 342 MB 2.4 GB

1249. EEZ_BB3_CM4_SoM

EEZ_BB3_CM4_SoM: stages 4 and 6 take 52% to 78% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.4 s. Visual, GLB takes 2.2 s. Visual, OBJ takes 2.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 84 ms 87 ms 0.2 0.6 ms 0.7 17 ms 74 ms 0.2 1.4
Simulation, STEP 0.1 90 ms 0.3 0.3 ms 0.7 0.4 63 ms 0.2 1.8
Simulation, STL 99 ms 89 ms 0.2 0.3 ms 0.6 26 ms 66 ms 0.2 1.3
Simulation, OBJ 85 ms 75 ms 0.2 0.4 ms 0.6 0.2 56 ms 0.2 1.4
Visual, GLB 95 ms 89 ms 0.2 0.4 ms 1.5 11 ms 83 ms 0.2 2.2
Visual, OBJ 0.1 93 ms 0.2 0.5 ms 1.5 0.2 69 ms 0.2 2.4
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_BB3_CM4_SoM.kicad_pcb
Folder EEZ_BB3_CM4_SoM
Complexity 75 / 1000 (size 45, features 30)
KESE features stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 2, 0, 0
Triangles, simulation 32,988 in 181 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.3 MB 75 MB
STEP 6.6 MB 78 MB
STL 1.7 MB 74 MB
OBJ 3.8 MB 81 MB
Visual
GLB 1.8 MB 118 MB
OBJ 5.0 MB 115 MB

1250. EEZ_DIB_BP3C_r3B3

EEZ_DIB_BP3C_r3B3: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 29 s. Simulation, STL takes 25 s. Simulation, OBJ takes 36 s. Visual, GLB takes 36 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.5 10.6 0.4 ms 9.0 0.4 1.3 0.3 24.6
Simulation, STEP 0.6 2.5 10.5 0.7 ms 8.9 4.9 1.4 0.3 29.1
Simulation, STL 0.5 2.7 10.7 0.8 ms 9.0 0.7 1.4 0.3 25.4
Simulation, OBJ 0.6 2.6 10.7 0.5 ms 8.8 12.0 1.3 0.3 36.2
Visual, GLB 0.5 2.5 11.1 1 ms 20.0 0.2 1.7 0.2 36.3
Visual, OBJ 0.6 2.6 10.8 0.3 ms 19.2 6.4 2.3 0.3 42.2
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_DIB_BP3C_r3B3.kicad_pcb
Folder EEZ_DIB_BP3C_R3B3
Complexity 288 / 1000 (size 193, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 55, 718, 161
Triangles, simulation 2,205,946 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 77 MB 660 MB
STEP 328 MB 851 MB
STL 110 MB 701 MB
OBJ 238 MB 1.5 GB
Visual
GLB 42 MB 904 MB
OBJ 128 MB 958 MB

1251. EEZ_DIB_MCU_r3B4

EEZ_DIB_MCU_r3B4: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 43 s. Simulation, STL takes 35 s. Simulation, OBJ takes 53 s. Visual, GLB takes 56 s. Visual, OBJ takes 71 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 4.6 14.6 0.9 ms 13.6 0.6 1.9 0.3 36.6
Simulation, STEP 0.7 4.6 13.8 1 ms 13.2 8.9 1.8 0.3 43.3
Simulation, STL 0.7 4.4 14.0 1 ms 12.9 1.3 1.8 0.4 35.5
Simulation, OBJ 0.9 4.8 13.9 0.9 ms 12.6 19.5 1.6 0.3 53.5
Visual, GLB 0.8 4.5 13.1 1 ms 32.6 0.3 4.1 0.3 55.7
Visual, OBJ 0.6 4.5 14.1 1 ms 34.4 12.6 5.0 0.2 71.4
Board Repo: intergalaktik/bb3-cm4
Board: EEZ_DIB_MCU_r3B4.kicad_pcb
Folder EEZ_DIB_MCU_r3B4
Complexity 359 / 1000 (size 264, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 118, 2,912, 638
Triangles, simulation 3,889,020 in 275 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 131 MB 1.1 GB
STEP 509 MB 1.6 GB
STL 194 MB 1.2 GB
OBJ 414 MB 2.6 GB
Visual
GLB 86 MB 1.4 GB
OBJ 274 MB 1.8 GB

1252. Intergalaktik_proto

Intergalaktik_proto: stages 4 and 6 take 66% to 89% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 25 s. Simulation, OBJ takes 34 s. Visual, GLB takes 30 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 0.9 10.0 0.5 ms 12.5 0.3 0.7 0.3 25.5
Simulation, STEP 0.8 0.9 9.9 0.4 ms 13.0 5.5 0.6 0.3 30.8
Simulation, STL 0.8 0.9 9.6 0.3 ms 12.5 0.4 0.6 0.2 25.1
Simulation, OBJ 0.8 0.9 9.6 0.3 ms 12.8 9.1 0.6 0.2 34.1
Visual, GLB 0.8 0.9 9.6 0.6 ms 16.9 0.2 1.0 0.3 29.7
Visual, OBJ 0.9 0.9 9.7 0.5 ms 17.0 4.1 1.0 0.3 33.9
Board Repo: intergalaktik/business-card-smd-proto
Board: Intergalaktik_proto.kicad_pcb
Folder KiCad / Intergalaktik_proto
Complexity 183 / 1000 (size 98, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 0, 119, 8
Triangles, simulation 1,533,816 in 24 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 53 MB 649 MB
STEP 319 MB 826 MB
STL 77 MB 683 MB
OBJ 161 MB 1.1 GB
Visual
GLB 24 MB 675 MB
OBJ 74 MB 652 MB

1253. EMC_antenna

EMC_antenna: stages 4 and 6 take 34% to 59% of a run. Simulation, GLB takes 1.1 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 1.1 s. Simulation, OBJ takes 1.4 s. Visual, GLB takes 1.2 s. Visual, OBJ takes 1.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 85 ms 0.2 0.1 ms 0.4 10 ms 28 ms 0.2 1.1
Simulation, STEP 0.1 84 ms 0.2 0.1 ms 0.4 0.7 27 ms 0.2 1.8
Simulation, STL 0.1 0.1 0.2 0.1 ms 0.4 17 ms 25 ms 0.2 1.1
Simulation, OBJ 0.1 83 ms 0.2 0.1 ms 0.4 0.3 42 ms 0.2 1.4
Visual, GLB 0.1 93 ms 0.2 0.1 ms 0.4 9 ms 0.1 0.2 1.2
Visual, OBJ 0.1 79 ms 0.2 0.1 ms 0.4 0.3 0.1 0.2 1.4
Board Repo: intergalaktik/EMC-experiments
Board: EMC_antenna.kicad_pcb
Folder EMC_antenna
Complexity 69 / 1000 (size 24, features 45)
KESE features arc tracks, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 1, 0, 0
Triangles, simulation 75,346 in 9 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.8 MB 79 MB
STEP 19 MB 193 MB
STL 3.8 MB 76 MB
OBJ 7.6 MB 107 MB
Visual
GLB 2.1 MB 115 MB
OBJ 5.7 MB 142 MB

1254. adcIO

adcIO: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 5.4 s. Simulation, STEP takes 7.1 s. Simulation, STL takes 5.3 s. Simulation, OBJ takes 8.2 s. Visual, GLB takes 8.3 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 1.8 0.4 ms 2.1 99 ms 0.3 0.3 5.4
Simulation, STEP 0.3 0.6 1.8 0.4 ms 2.1 1.8 0.3 0.2 7.1
Simulation, STL 0.3 0.6 1.8 0.3 ms 2.0 0.2 0.3 0.2 5.3
Simulation, OBJ 0.3 0.5 1.8 0.4 ms 2.0 3.0 0.4 0.3 8.2
Visual, GLB 0.3 0.5 2.0 0.4 ms 4.6 64 ms 0.6 0.2 8.3
Visual, OBJ 0.3 0.5 1.7 0.5 ms 4.7 2.0 0.6 0.3 10.1
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: adcIO.kicad_pcb
Folder adcIO
Complexity 286 / 1000 (size 171, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 36, 212, 66
Triangles, simulation 640,134 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 355 MB
STEP 96 MB 393 MB
STL 32 MB 390 MB
OBJ 65 MB 469 MB
Visual
GLB 15 MB 392 MB
OBJ 43 MB 383 MB

1255. camIO

camIO: stages 4 and 6 take 45% to 77% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.9 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.0 0.2 ms 1.1 58 ms 0.2 0.2 3.1
Simulation, STEP 0.2 0.4 1.0 0.2 ms 1.2 1.1 0.2 0.2 4.2
Simulation, STL 0.2 0.4 1.0 0.1 ms 1.2 0.1 0.2 0.2 3.2
Simulation, OBJ 0.2 0.4 1.0 0.2 ms 1.2 1.8 0.2 0.2 4.9
Visual, GLB 0.2 0.4 1.0 0.2 ms 3.0 49 ms 0.4 0.2 5.3
Visual, OBJ 0.2 0.4 1.0 0.3 ms 3.0 1.3 0.3 0.2 6.4
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: camIO.kicad_pcb
Folder camIO
Complexity 286 / 1000 (size 171, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 25, 296, 76
Triangles, simulation 422,226 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 290 MB
STEP 66 MB 323 MB
STL 21 MB 303 MB
OBJ 43 MB 337 MB
Visual
GLB 12 MB 321 MB
OBJ 34 MB 315 MB

1256. dualTranslation

dualTranslation: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 17 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.1 5.4 0.3 ms 4.2 0.2 0.5 0.3 12.2
Simulation, STEP 0.4 1.1 5.3 0.2 ms 4.5 3.0 0.5 0.3 15.1
Simulation, STL 0.4 1.3 5.2 0.3 ms 4.2 0.3 0.6 0.3 12.2
Simulation, OBJ 0.4 1.2 5.3 0.3 ms 4.5 6.2 0.6 0.3 18.5
Visual, GLB 0.4 1.1 4.9 0.3 ms 9.4 0.1 0.8 0.2 17.0
Visual, OBJ 0.4 1.3 5.1 0.5 ms 9.6 4.0 0.9 0.3 21.5
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: dualTranslation.kicad_pcb
Folder dualTranslation
Complexity 273 / 1000 (size 188, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 54, 521, 119
Triangles, simulation 941,732 in 56 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 477 MB
STEP 153 MB 504 MB
STL 47 MB 443 MB
OBJ 97 MB 690 MB
Visual
GLB 21 MB 537 MB
OBJ 64 MB 528 MB

1257. dvi

dvi: stages 4 and 6 take 44% to 79% of a run. Simulation, GLB takes 4.9 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 8.2 s. Visual, GLB takes 8.4 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.5 1.6 0.3 ms 1.7 84 ms 0.3 0.2 4.9
Simulation, STEP 0.3 0.5 1.6 0.3 ms 1.8 1.6 0.3 0.2 6.3
Simulation, STL 0.3 0.6 1.6 0.3 ms 1.8 0.1 0.3 0.2 4.9
Simulation, OBJ 0.3 0.6 1.7 0.5 ms 1.9 3.2 0.3 0.2 8.2
Visual, GLB 0.3 0.6 1.8 0.2 ms 4.8 88 ms 0.5 0.3 8.4
Visual, OBJ 0.3 0.6 1.6 0.3 ms 4.8 2.3 0.6 0.2 10.5
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: dvi.kicad_pcb
Folder dvi
Complexity 285 / 1000 (size 185, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 47, 518, 89
Triangles, simulation 576,678 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 339 MB
STEP 91 MB 384 MB
STL 29 MB 331 MB
OBJ 58 MB 439 MB
Visual
GLB 15 MB 403 MB
OBJ 45 MB 403 MB

1258. eduIO

eduIO: stages 4 and 6 take 51% to 79% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.1 s. Visual, GLB takes 5.7 s. Visual, OBJ takes 7.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.2 0.2 ms 1.2 53 ms 0.2 0.2 3.4
Simulation, STEP 0.2 0.3 1.3 0.5 ms 1.2 1.3 0.2 0.2 4.7
Simulation, STL 0.2 0.3 1.3 0.3 ms 1.2 85 ms 0.2 0.2 3.5
Simulation, OBJ 0.2 0.3 1.3 0.3 ms 1.3 1.6 0.2 0.2 5.1
Visual, GLB 0.2 0.3 1.3 0.5 ms 3.2 49 ms 0.3 0.3 5.7
Visual, OBJ 0.2 0.4 1.3 0.3 ms 3.2 1.2 0.4 0.2 7.0
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: eduIO.kicad_pcb
Folder eduIO
Complexity 257 / 1000 (size 142, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 22, 180, 25
Triangles, simulation 305,672 in 65 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 246 MB
STEP 52 MB 279 MB
STL 15 MB 245 MB
OBJ 31 MB 270 MB
Visual
GLB 8.7 MB 272 MB
OBJ 25 MB 271 MB

1259. ethIO

ethIO: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 7.9 s. Simulation, STEP takes 9.6 s. Simulation, STL takes 7.8 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 3.1 0.2 ms 2.7 0.1 0.4 0.2 7.9
Simulation, STEP 0.4 1.0 2.8 0.3 ms 2.7 2.1 0.4 0.3 9.6
Simulation, STL 0.3 0.9 3.0 0.3 ms 2.6 0.2 0.4 0.2 7.8
Simulation, OBJ 0.3 1.0 2.9 0.2 ms 2.7 4.5 0.4 0.2 12.1
Visual, GLB 0.3 1.0 2.9 0.2 ms 6.8 0.1 0.6 0.2 11.9
Visual, OBJ 0.3 1.0 3.1 0.2 ms 6.5 2.9 0.8 0.2 14.9
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: ethIO.kicad_pcb
Folder ethIO
Complexity 320 / 1000 (size 190, features 130)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 46, 708, 122
Triangles, simulation 860,620 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 379 MB
STEP 141 MB 457 MB
STL 43 MB 379 MB
OBJ 89 MB 626 MB
Visual
GLB 20 MB 466 MB
OBJ 61 MB 489 MB

1260. extension_template

extension_template: stages 4 and 6 take 41% to 74% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.6 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 0.4 0.1 ms 0.7 22 ms 55 ms 0.2 1.7
Simulation, STEP 0.1 0.1 0.4 0.2 ms 0.6 0.9 69 ms 0.2 2.5
Simulation, STL 0.2 0.2 0.4 0.1 ms 0.6 40 ms 61 ms 0.2 1.7
Simulation, OBJ 0.2 0.2 0.4 0.2 ms 0.6 0.7 80 ms 0.3 2.4
Visual, GLB 0.1 0.1 0.4 0.1 ms 1.5 23 ms 0.2 0.2 2.6
Visual, OBJ 0.1 0.1 0.4 0.1 ms 1.6 0.5 0.2 0.2 3.1
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: extension_template.kicad_pcb
Folder extension_template
Complexity 241 / 1000 (size 126, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 7, 51, 6
Triangles, simulation 139,358 in 36 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.0 MB 213 MB
STEP 28 MB 220 MB
STL 7.0 MB 211 MB
OBJ 14 MB 205 MB
Visual
GLB 4.4 MB 170 MB
OBJ 12 MB 179 MB

1261. GamePad_I2S_audio

GamePad_I2S_audio: stages 4 and 6 take 37% to 70% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.0 s. Visual, GLB takes 3.7 s. Visual, OBJ takes 4.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 0.6 0.2 ms 0.7 31 ms 91 ms 0.3 2.4
Simulation, STEP 0.3 0.4 0.7 0.3 ms 0.7 1.3 80 ms 0.3 3.7
Simulation, STL 0.3 0.4 0.7 0.4 ms 0.7 41 ms 73 ms 0.3 2.5
Simulation, OBJ 0.3 0.3 0.6 0.2 ms 0.7 0.7 67 ms 0.3 3.0
Visual, GLB 0.3 0.4 0.6 0.4 ms 2.0 26 ms 0.2 0.2 3.7
Visual, OBJ 0.3 0.4 0.6 0.2 ms 2.3 0.8 0.2 0.2 4.7
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: GamePad_I2S_audio.kicad_pcb
Folder GamePad_I2S_audio / KiCad
Complexity 265 / 1000 (size 180, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 81, 268, 51
Triangles, simulation 131,540 in 65 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.8 MB 213 MB
STEP 21 MB 215 MB
STL 6.6 MB 212 MB
OBJ 14 MB 207 MB
Visual
GLB 4.7 MB 197 MB
OBJ 13 MB 200 MB

1262. GamePad_I2S_audio

GamePad_I2S_audio: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 8.5 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.1 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.8 3.2 0.4 ms 3.2 0.1 0.6 0.2 8.5
Simulation, STEP 0.4 0.9 3.1 0.3 ms 3.1 2.7 0.5 0.2 10.8
Simulation, STL 0.4 0.9 2.9 0.3 ms 3.0 0.2 0.5 0.2 8.1
Simulation, OBJ 0.4 0.9 3.0 0.4 ms 3.4 4.7 0.5 0.2 13.0
Visual, GLB 0.4 0.9 3.0 0.4 ms 6.8 0.1 0.6 0.2 12.0
Visual, OBJ 0.4 0.9 3.0 0.4 ms 7.1 3.6 0.6 0.2 15.8
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: GamePad_I2S_audio.kicad_pcb
Folder GamePad_I2S_audio_Buttons / KiCad
Complexity 280 / 1000 (size 195, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 77, 713, 127
Triangles, simulation 866,552 in 91 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 404 MB
STEP 135 MB 500 MB
STL 43 MB 405 MB
OBJ 88 MB 619 MB
Visual
GLB 23 MB 579 MB
OBJ 69 MB 516 MB

1263. MikroBusIO

MikroBusIO: stages 4 and 6 take 45% to 82% of a run. Simulation, GLB takes 7.3 s. Simulation, STEP takes 9.3 s. Simulation, STL takes 7.4 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.8 2.6 0.4 ms 2.6 0.1 0.5 0.2 7.3
Simulation, STEP 0.4 0.8 2.6 0.4 ms 2.7 2.1 0.5 0.2 9.3
Simulation, STL 0.4 0.8 2.6 0.3 ms 2.6 0.2 0.5 0.2 7.4
Simulation, OBJ 0.4 0.9 2.6 0.4 ms 2.6 4.4 0.5 0.2 11.6
Visual, GLB 0.4 0.8 2.7 0.3 ms 6.6 95 ms 0.6 0.2 11.4
Visual, OBJ 0.4 0.8 2.7 0.3 ms 6.5 3.3 0.7 0.2 14.5
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: MikroBusIO.kicad_pcb
Folder MikroBusIO
Complexity 300 / 1000 (size 185, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 55, 388, 109
Triangles, simulation 755,740 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 382 MB
STEP 111 MB 432 MB
STL 38 MB 396 MB
OBJ 77 MB 537 MB
Visual
GLB 19 MB 473 MB
OBJ 58 MB 479 MB

1264. pwrIO

pwrIO: stages 4 and 6 take 42% to 80% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 6.7 s. Simulation, STL takes 5.3 s. Simulation, OBJ takes 8.3 s. Visual, GLB takes 8.3 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 1.7 0.3 ms 1.8 93 ms 0.3 0.2 5.0
Simulation, STEP 0.3 0.6 1.8 0.3 ms 1.8 1.7 0.4 0.3 6.7
Simulation, STL 0.3 0.6 1.9 0.3 ms 1.7 0.2 0.4 0.2 5.3
Simulation, OBJ 0.4 0.6 1.7 0.3 ms 1.7 3.3 0.4 0.2 8.3
Visual, GLB 0.3 0.6 1.8 0.3 ms 4.8 73 ms 0.5 0.2 8.3
Visual, OBJ 0.3 0.6 1.8 0.3 ms 5.3 2.3 0.5 0.2 11.1
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: pwrIO.kicad_pcb
Folder pwrIO
Complexity 255 / 1000 (size 180, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 45, 441, 59
Triangles, simulation 577,794 in 60 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 329 MB
STEP 94 MB 370 MB
STL 29 MB 324 MB
OBJ 59 MB 434 MB
Visual
GLB 15 MB 394 MB
OBJ 44 MB 409 MB

1265. simpleIO

simpleIO: stages 4 and 6 take 45% to 81% of a run. Simulation, GLB takes 4.4 s. Simulation, STEP takes 5.9 s. Simulation, STL takes 4.6 s. Simulation, OBJ takes 7.4 s. Visual, GLB takes 7.0 s. Visual, OBJ takes 9.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.4 0.3 ms 1.7 84 ms 0.3 0.2 4.4
Simulation, STEP 0.2 0.5 1.3 0.3 ms 1.8 1.6 0.3 0.2 5.9
Simulation, STL 0.2 0.5 1.5 0.3 ms 1.8 0.2 0.3 0.2 4.6
Simulation, OBJ 0.3 0.5 1.4 0.3 ms 1.9 2.7 0.3 0.2 7.4
Visual, GLB 0.2 0.5 1.4 0.3 ms 4.2 55 ms 0.4 0.2 7.0
Visual, OBJ 0.3 0.5 1.4 0.2 ms 3.8 2.3 0.5 0.2 9.0
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: simpleIO.kicad_pcb
Folder simpleIO / KiCad
Complexity 252 / 1000 (size 177, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 48, 247, 82
Triangles, simulation 455,592 in 69 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 289 MB
STEP 63 MB 350 MB
STL 23 MB 288 MB
OBJ 46 MB 370 MB
Visual
GLB 12 MB 365 MB
OBJ 36 MB 345 MB

1266. tmrIO

tmrIO: stages 4 and 6 take 47% to 76% of a run. Simulation, GLB takes 3.6 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.1 s. Visual, GLB takes 5.5 s. Visual, OBJ takes 6.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 1.2 0.3 ms 1.2 56 ms 0.2 0.2 3.6
Simulation, STEP 0.2 0.4 1.3 0.2 ms 1.2 1.2 0.2 0.2 4.7
Simulation, STL 0.2 0.4 1.2 0.4 ms 1.1 86 ms 0.2 0.2 3.4
Simulation, OBJ 0.2 0.4 1.3 0.2 ms 1.1 1.7 0.2 0.2 5.1
Visual, GLB 0.3 0.4 1.2 0.3 ms 3.0 46 ms 0.4 0.2 5.5
Visual, OBJ 0.3 0.4 1.3 0.3 ms 3.2 1.3 0.3 0.2 6.9
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: tmrIO.kicad_pcb
Folder tmrIO
Complexity 270 / 1000 (size 170, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 23, 282, 76
Triangles, simulation 442,664 in 51 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 304 MB
STEP 62 MB 318 MB
STL 22 MB 291 MB
OBJ 45 MB 339 MB
Visual
GLB 11 MB 309 MB
OBJ 33 MB 315 MB

1267. USB

USB: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 7.8 s. Simulation, STEP takes 9.9 s. Simulation, STL takes 7.8 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.9 2.7 0.4 ms 3.0 0.1 0.5 0.3 7.8
Simulation, STEP 0.4 0.9 2.7 0.3 ms 3.0 2.3 0.5 0.2 9.9
Simulation, STL 0.3 0.9 2.7 0.4 ms 2.9 0.2 0.5 0.2 7.8
Simulation, OBJ 0.3 0.9 2.8 0.2 ms 2.8 4.4 0.5 0.2 11.9
Visual, GLB 0.3 0.8 2.7 0.4 ms 5.7 84 ms 0.6 0.2 10.5
Visual, OBJ 0.3 0.9 2.6 0.3 ms 5.4 3.1 0.7 0.2 13.2
Board Repo: intergalaktik/Extension_Boards_for_Olimex_GateMate
Board: USB.kicad_pcb
Folder USB
Complexity 285 / 1000 (size 185, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 38, 364, 189
Triangles, simulation 760,970 in 51 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 402 MB
STEP 102 MB 458 MB
STL 38 MB 421 MB
OBJ 77 MB 553 MB
Visual
GLB 18 MB 482 MB
OBJ 55 MB 448 MB

1268. intergalaktik

intergalaktik: stages 4 and 6 take 38% to 67% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 74 ms 0.3 0.1 ms 0.4 13 ms 39 ms 0.2 1.2
Simulation, STEP 97 ms 71 ms 0.2 0.1 ms 0.4 0.7 43 ms 0.2 1.8
Simulation, STL 0.1 73 ms 0.3 0.2 ms 0.5 21 ms 39 ms 0.2 1.2
Simulation, OBJ 0.1 76 ms 0.3 0.1 ms 0.5 0.4 47 ms 0.2 1.5
Visual, GLB 0.1 71 ms 0.3 0.1 ms 0.8 8 ms 73 ms 0.3 1.7
Visual, OBJ 94 ms 67 ms 0.2 0.1 ms 0.9 0.2 61 ms 0.2 1.8
Board Repo: intergalaktik/KiCad-PCB
Board: intergalaktik.kicad_pcb
Folder hardware
Complexity 160 / 1000 (size 80, features 80)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 3, 6, 0
Triangles, simulation 68,008 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.4 MB 169 MB
STEP 9.1 MB 176 MB
STL 3.4 MB 167 MB
OBJ 6.6 MB 171 MB
Visual
GLB 1.4 MB 152 MB
OBJ 4.0 MB 151 MB

1269. mono_addon

mono_addon: stages 4 and 6 take 58% to 87% of a run. Simulation, GLB takes 9.7 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 14 s. Visual, GLB takes 16 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 5.1 0.3 ms 2.9 0.1 0.4 0.2 9.7
Simulation, STEP 0.3 0.6 5.2 0.4 ms 2.9 2.3 0.4 0.2 12.0
Simulation, STL 0.3 0.6 5.5 0.6 ms 2.8 0.2 0.5 0.2 10.2
Simulation, OBJ 0.3 0.6 5.0 0.3 ms 2.8 4.1 0.4 0.2 13.6
Visual, GLB 0.3 0.7 5.4 0.3 ms 8.7 84 ms 0.7 0.3 16.1
Visual, OBJ 0.3 0.6 5.2 0.3 ms 8.6 3.1 0.7 0.2 18.8
Board Repo: intergalaktik/mono_addon
Board: mono_addon.kicad_pcb
Folder KiCad / mono_addon
Complexity 271 / 1000 (size 161, features 110)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 44, 238, 95
Triangles, simulation 764,454 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 399 MB
STEP 163 MB 475 MB
STL 38 MB 402 MB
OBJ 81 MB 579 MB
Visual
GLB 20 MB 498 MB
OBJ 58 MB 509 MB

1270. ulx4m-panel

ulx4m-panel: stages 4 and 6 take 45% to 84% of a run. Simulation, GLB takes 3 min. Simulation, STEP takes 4 min. Simulation, STL takes 4 min. Simulation, OBJ takes 7 min. Visual, GLB takes 5 min. Visual, OBJ takes 7 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 4.0 22.4 72.7 5 ms 91.7 5.1 11.8 0.9 208.7
Simulation, STEP 4.5 23.2 71.9 4 ms 88.3 52.0 13.1 0.9 254.0
Simulation, STL 4.4 21.9 74.1 3 ms 90.4 9.4 11.0 0.8 211.9
Simulation, OBJ 5.1 26.6 89.5 6 ms 113.1 187.5 22.5 2.1 446.4
Visual, GLB 4.4 20.3 70.0 4 ms 208.0 2.0 24.5 0.6 329.9
Visual, OBJ 4.2 20.6 68.0 3 ms 215.5 64.0 24.3 0.6 397.4
Board Repo: intergalaktik/ULX4M
Board: ulx4m-panel.kicad_pcb
Folder plot / panel
Complexity 402 / 1000 (size 357, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 11th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 860, 35,844, 2,856
Triangles, simulation 23,814,454 in 1200 parts
Note panel
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with no memory cap and no time limit (swap added to a 16 GB machine), and passed
File
type
File
size
Peak memory
used
Simulation
GLB 788 MB 5.3 GB
STEP 3.2 GB 6.4 GB
STL 1.2 GB 5.2 GB
OBJ 2.6 GB 15 GB
Visual
GLB 446 MB 7.2 GB
OBJ 1.5 GB 9.5 GB

1271. ulx4m

ulx4m: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 51 s. Simulation, STEP takes 66 s. Simulation, STL takes 53 s. Simulation, OBJ takes 86 s. Visual, GLB takes 83 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.6 17.8 1 ms 22.2 1.0 2.9 0.3 51.4
Simulation, STEP 1.4 5.7 18.5 2 ms 22.9 14.2 3.0 0.4 66.1
Simulation, STL 1.4 5.6 18.4 0.8 ms 22.4 2.1 3.0 0.3 53.1
Simulation, OBJ 1.4 5.9 18.2 1 ms 22.4 35.2 3.0 0.3 86.4
Visual, GLB 1.5 6.0 18.3 1 ms 50.6 0.5 5.8 0.3 83.2
Visual, OBJ 1.4 6.0 18.6 2 ms 49.5 21.4 6.3 0.3 103.5
Board Repo: intergalaktik/ULX4M
Board: ulx4m.kicad_pcb
Folder plot / panel
Complexity 361 / 1000 (size 306, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 215, 8,961, 714
Triangles, simulation 5,933,356 in 312 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 203 MB 1.5 GB
STEP 778 MB 2.0 GB
STL 297 MB 1.5 GB
OBJ 635 MB 3.8 GB
Visual
GLB 112 MB 2.2 GB
OBJ 367 MB 2.4 GB

1272. ulx4m

ulx4m: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 64 s. Simulation, STEP takes 81 s. Simulation, STL takes 63 s. Simulation, OBJ takes 95 s. Visual, GLB takes 87 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 6.6 23.4 2 ms 26.6 1.3 3.9 0.4 64.0
Simulation, STEP 2.1 7.7 24.0 2 ms 26.2 16.6 4.2 0.4 81.1
Simulation, STL 1.8 6.8 24.3 2 ms 23.6 2.3 3.8 0.5 63.1
Simulation, OBJ 1.8 6.3 20.5 2 ms 24.0 38.8 3.5 0.4 95.3
Visual, GLB 1.7 6.2 19.4 1 ms 53.4 0.6 5.8 0.4 87.5
Visual, OBJ 1.6 6.0 19.7 3 ms 52.6 20.7 5.2 0.3 106.1
Board Repo: intergalaktik/ULX4M
Board: ulx4m.kicad_pcb
Complexity 390 / 1000 (size 305, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 218, 8,560, 700
Triangles, simulation 5,597,444 in 372 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 187 MB 1.6 GB
STEP 777 MB 1.9 GB
STL 280 MB 1.6 GB
OBJ 598 MB 3.6 GB
Visual
GLB 111 MB 1.9 GB
OBJ 361 MB 2.4 GB

1273. ulx4m-cm4-hat

ulx4m-cm4-hat: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 9.9 s. Simulation, STL takes 7.6 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 2.6 0.6 ms 3.2 0.1 0.6 0.2 7.7
Simulation, STEP 0.2 0.7 2.6 0.6 ms 3.2 2.5 0.5 0.3 9.9
Simulation, STL 0.2 0.7 2.6 0.5 ms 3.1 0.2 0.5 0.2 7.6
Simulation, OBJ 0.2 0.7 2.5 0.4 ms 3.3 4.2 0.5 0.2 11.6
Visual, GLB 0.2 0.8 2.6 0.5 ms 6.1 90 ms 0.8 0.3 10.8
Visual, OBJ 0.2 0.7 2.6 0.4 ms 6.3 2.8 0.8 0.2 13.6
Board Repo: intergalaktik/ULX4M-CM4-HAT
Board: ulx4m-cm4-hat.kicad_pcb
Complexity 241 / 1000 (size 186, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 37, 708, 95
Triangles, simulation 860,812 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 374 MB
STEP 112 MB 460 MB
STL 43 MB 373 MB
OBJ 86 MB 622 MB
Visual
GLB 19 MB 463 MB
OBJ 57 MB 509 MB

1274. ulx4m-ld

ulx4m-ld: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 49 s. Simulation, STEP takes 60 s. Simulation, STL takes 50 s. Simulation, OBJ takes 78 s. Visual, GLB takes 80 s. Visual, OBJ takes 96 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.0 16.7 1 ms 21.6 0.9 3.0 0.3 48.9
Simulation, STEP 1.4 5.1 17.2 0.9 ms 21.2 12.5 2.7 0.3 60.5
Simulation, STL 1.3 5.3 16.6 0.8 ms 21.4 2.0 2.7 0.3 49.7
Simulation, OBJ 1.3 5.1 16.9 1 ms 21.1 30.1 2.9 0.3 77.7
Visual, GLB 1.5 5.1 16.1 0.8 ms 49.5 0.6 7.2 0.3 80.2
Visual, OBJ 1.4 5.0 16.5 0.9 ms 50.4 17.5 4.9 0.3 96.0
Board Repo: intergalaktik/ULX4M-LD
Board: ulx4m-ld.kicad_pcb
Complexity 409 / 1000 (size 324, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 253, 15,844, 801
Triangles, simulation 6,595,260 in 384 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 221 MB 1.8 GB
STEP 945 MB 2.2 GB
STL 330 MB 1.7 GB
OBJ 707 MB 4.2 GB
Visual
GLB 135 MB 2.3 GB
OBJ 440 MB 3.0 GB

1275. ulx4m_panel

ulx4m_panel: stages 4 and 6 take 47% to 86% of a run. Simulation, GLB takes 4 min. Simulation, STEP takes 5 min. Simulation, STL takes 4 min. Simulation, OBJ takes 7 min. Visual, GLB takes 7 min. Visual, OBJ takes 8 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 5.2 22.8 86.8 4 ms 106.6 5.5 14.2 0.8 241.9
Simulation, STEP 5.1 22.7 84.5 4 ms 105.3 58.8 13.0 0.9 290.3
Simulation, STL 5.5 22.5 85.0 4 ms 105.8 11.2 13.0 0.9 243.9
Simulation, OBJ 5.5 24.7 91.1 4 ms 118.4 178.7 24.5 2.1 445.0
Visual, GLB 5.2 22.7 83.4 6 ms 269.6 3.0 25.6 0.7 410.2
Visual, OBJ 5.2 23.3 85.4 4 ms 270.1 78.5 26.3 0.6 489.4
Board Repo: intergalaktik/ULX4M-LS
Board: ulx4m_panel.kicad_pcb
Folder panel
Complexity 432 / 1000 (size 357, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026 to 11th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 872, 34,240, 2,800
Triangles, simulation 23,074,944 in 1440 parts
Note panel
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with no memory cap and no time limit (swap added to a 16 GB machine), and passed
File
type
File
size
Peak memory
used
Simulation
GLB 746 MB 4.8 GB
STEP 3.5 GB 6.8 GB
STL 1.2 GB 4.8 GB
OBJ 2.6 GB 15 GB
Visual
GLB 451 MB 7.2 GB
OBJ 1.5 GB 9.5 GB

1276. ULX4M-PCIe-IO_x4_half

ULX4M-PCIe-IO_x4_half: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 50 s. Simulation, STEP takes 61 s. Simulation, STL takes 52 s. Simulation, OBJ takes 76 s. Visual, GLB takes 84 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 6.1 21.0 2 ms 17.6 0.8 2.6 0.4 49.9
Simulation, STEP 1.5 6.0 21.4 3 ms 18.1 11.2 2.7 0.4 61.2
Simulation, STL 1.5 6.1 21.1 2 ms 17.8 2.1 2.8 0.3 51.8
Simulation, OBJ 1.4 6.2 21.4 2 ms 18.0 25.4 2.7 0.4 75.6
Visual, GLB 1.4 6.3 21.6 2 ms 47.3 0.6 7.0 0.3 84.5
Visual, OBJ 1.5 6.6 21.6 2 ms 47.6 16.8 6.7 0.3 101.1
Board Repo: intergalaktik/ULX4M-PCIe-IO
Board: ULX4M-PCIe-IO_x4_half.kicad_pcb
Folder kicad
Complexity 341 / 1000 (size 231, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 118, 6,055, 477
Triangles, simulation 4,666,562 in 233 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 160 MB 1.6 GB
STEP 718 MB 1.7 GB
STL 233 MB 1.5 GB
OBJ 503 MB 3.1 GB
Visual
GLB 112 MB 2.0 GB
OBJ 357 MB 2.4 GB

1277. ULX4M_GPDI

ULX4M_GPDI: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 11 s. Simulation, OBJ takes 18 s. Visual, GLB takes 19 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 3.8 0.9 ms 5.2 0.3 0.6 0.2 11.5
Simulation, STEP 0.3 1.1 4.0 0.3 ms 5.2 3.9 0.5 0.2 15.2
Simulation, STL 0.3 1.0 3.8 0.4 ms 5.1 0.4 0.6 0.2 11.5
Simulation, OBJ 0.3 1.1 3.7 0.6 ms 5.1 6.9 0.5 0.2 17.9
Visual, GLB 0.3 1.0 3.9 0.6 ms 11.4 0.2 1.6 0.2 18.6
Visual, OBJ 0.3 1.1 3.9 0.6 ms 11.4 5.0 1.8 0.3 23.9
Board Repo: intergalaktik/ULX4M_documents
Board: ULX4M_GPDI.kicad_pcb
Folder ULX4M_test
Complexity 240 / 1000 (size 185, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 27, 690, 156
Triangles, simulation 1,632,014 in 83 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 57 MB 675 MB
STEP 260 MB 849 MB
STL 82 MB 704 MB
OBJ 172 MB 1.2 GB
Visual
GLB 41 MB 864 MB
OBJ 126 MB 929 MB

1278. ulx5m-gs_panel_checked_v002

ulx5m-gs_panel_checked_v002: stages 4 and 6 take 46% to 86% of a run. Simulation, GLB takes 4 min. Simulation, STEP takes 4 min. Simulation, STL takes 4 min. Simulation, OBJ takes 8 min. Visual, GLB takes 7 min. Visual, OBJ takes 8 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 5.7 24.6 80.1 4 ms 88.0 4.6 12.7 0.8 216.5
Simulation, STEP 5.9 23.0 76.3 3 ms 88.1 55.8 12.6 0.7 262.5
Simulation, STL 5.9 22.2 76.2 4 ms 90.9 10.7 13.4 0.9 220.1
Simulation, OBJ 7.1 27.0 94.8 4 ms 126.2 201.0 22.9 2.2 481.1
Visual, GLB 5.8 22.3 76.2 4 ms 305.0 2.9 33.0 0.7 445.8
Visual, OBJ 5.5 21.5 72.9 4 ms 289.5 78.4 26.9 0.6 495.3
Board Repo: intergalaktik/ulx5m-gs
Board: ulx5m-gs_panel_checked_v002.kicad_pcb
Folder hardware / panel
Complexity 501 / 1000 (size 361, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026 to 11th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 1,148, 30,512, 3,416
Triangles, simulation 25,478,436 in 1392 parts
Note panel
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with no memory cap and no time limit (swap added to a 16 GB machine), and passed
File
type
File
size
Peak memory
used
Simulation
GLB 822 MB 6.0 GB
STEP 3.5 GB 7.6 GB
STL 1.3 GB 6.1 GB
OBJ 2.8 GB 16 GB
Visual
GLB 507 MB 8.0 GB
OBJ 1.7 GB 11 GB

1279. ulx5m-gs

ulx5m-gs: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 56 s. Simulation, STEP takes 69 s. Simulation, STL takes 56 s. Simulation, OBJ takes 90 s. Visual, GLB takes 92 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 5.8 18.3 1 ms 25.8 1.0 3.1 0.5 56.0
Simulation, STEP 1.5 5.7 18.3 1 ms 26.1 13.7 3.1 0.4 68.9
Simulation, STL 1.6 6.0 17.3 1 ms 25.4 2.3 3.3 0.4 56.3
Simulation, OBJ 1.5 5.8 18.6 1 ms 26.4 33.7 3.2 0.4 89.6
Visual, GLB 1.6 5.7 17.3 1 ms 59.9 0.6 7.0 0.3 92.4
Visual, OBJ 1.5 5.8 18.0 2 ms 60.2 19.2 7.1 0.3 112.2
Board Repo: intergalaktik/ulx5m-gs
Board: ulx5m-gs.kicad_pcb
Folder hardware
Complexity 460 / 1000 (size 310, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 287, 7,628, 854
Triangles, simulation 6,349,706 in 360 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 212 MB 1.5 GB
STEP 844 MB 2.2 GB
STL 318 MB 1.6 GB
OBJ 677 MB 4.0 GB
Visual
GLB 127 MB 2.1 GB
OBJ 409 MB 2.6 GB

1280. ulx5m-m2

ulx5m-m2: stages 4 and 6 take 46% to 83% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 40 s. Simulation, STL takes 34 s. Simulation, OBJ takes 55 s. Visual, GLB takes 58 s. Visual, OBJ takes 73 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 3.7 10.4 1 ms 13.6 0.6 1.6 0.3 31.9
Simulation, STEP 1.4 3.8 9.9 2 ms 13.9 9.1 1.6 0.3 40.0
Simulation, STL 1.5 3.8 10.8 0.9 ms 14.4 1.3 1.8 0.3 33.9
Simulation, OBJ 1.4 3.8 10.7 1 ms 14.8 22.5 1.9 0.3 55.4
Visual, GLB 1.5 4.0 10.6 1 ms 37.6 0.4 4.0 0.3 58.4
Visual, OBJ 1.6 3.8 11.1 2 ms 39.2 13.3 4.2 0.3 73.4
Board Repo: intergalaktik/ulx5m-m2
Board: ulx5m-m2.kicad_pcb
Complexity 405 / 1000 (size 295, features 110)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 208, 4,044, 559
Triangles, simulation 3,982,396 in 294 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 134 MB 1.2 GB
STEP 534 MB 1.5 GB
STL 199 MB 1.1 GB
OBJ 429 MB 2.6 GB
Visual
GLB 77 MB 1.5 GB
OBJ 249 MB 1.7 GB

1281. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 80 s. Simulation, STEP takes 97 s. Simulation, STL takes 79 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.6 5.9 27.5 4 ms 38.5 1.7 3.5 0.4 80.0
Simulation, STEP 2.7 6.1 27.5 2 ms 36.4 21.3 3.2 0.3 97.5
Simulation, STL 2.7 5.8 27.0 4 ms 36.9 2.7 3.1 0.3 78.5
Simulation, OBJ 2.4 5.8 26.9 1 ms 38.0 44.2 3.5 0.4 121.3
Visual, GLB 2.6 6.0 27.4 1 ms 66.8 0.9 7.1 0.3 111.1
Visual, OBJ 2.8 6.7 30.0 1 ms 65.9 29.0 7.1 0.4 142.0
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1
Complexity 402 / 1000 (size 262, features 140)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 509, 8,133, 666
Triangles, simulation 7,355,260 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 244 MB 2.2 GB
STEP 1.0 GB 2.7 GB
STL 368 MB 2.1 GB
OBJ 773 MB 4.6 GB
Visual
GLB 168 MB 2.7 GB
OBJ 541 MB 3.5 GB

1282. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 59% to 85% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 35 s. Visual, GLB takes 38 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 1.9 9.8 1 ms 10.0 0.3 0.6 0.2 23.8
Simulation, STEP 0.8 2.0 9.7 2 ms 10.3 6.4 0.7 0.2 30.1
Simulation, STL 0.9 2.0 9.8 1 ms 10.4 0.6 0.7 0.2 24.5
Simulation, OBJ 0.8 2.1 10.3 1 ms 10.0 10.5 0.7 0.2 34.6
Visual, GLB 0.7 2.0 9.6 1 ms 22.6 0.2 2.6 0.2 38.0
Visual, OBJ 0.7 1.9 9.3 2 ms 21.8 8.4 3.6 0.2 46.0
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / layout_tool
Complexity 94 / 1000 (size 84, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 495, 0, 0
Triangles, simulation 2,474,306 in 511 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 922 MB
STEP 344 MB 1.2 GB
STL 124 MB 931 MB
OBJ 264 MB 1.7 GB
Visual
GLB 67 MB 1.3 GB
OBJ 208 MB 1.5 GB

1283. modified_arena_10_of_10_v1r1

modified_arena_10_of_10_v1r1: stages 4 and 6 take 49% to 75% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 19 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 1.7 5.6 2 ms 3.4 0.2 0.4 0.3 12.6
Simulation, STEP 1.1 1.7 5.5 0.8 ms 3.4 3.5 0.6 0.2 15.9
Simulation, STL 1.0 1.6 5.4 0.8 ms 3.7 0.3 0.5 0.3 12.8
Simulation, OBJ 1.1 1.8 5.6 1 ms 3.5 6.0 0.5 0.2 18.8
Visual, GLB 1.1 2.0 5.4 0.8 ms 8.5 0.1 1.1 0.3 18.6
Visual, OBJ 1.1 1.6 5.3 0.8 ms 8.8 4.5 1.1 0.2 22.6
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: modified_arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / layout_tool
Complexity 104 / 1000 (size 84, features 20)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 495, 0, 0
Triangles, simulation 990,208 in 253 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 473 MB
STEP 139 MB 576 MB
STL 50 MB 458 MB
OBJ 102 MB 715 MB
Visual
GLB 26 MB 633 MB
OBJ 79 MB 671 MB

1284. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 55 s. Simulation, STEP takes 71 s. Simulation, STL takes 59 s. Simulation, OBJ takes 90 s. Visual, GLB takes 84 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 4.8 23.2 2 ms 22.3 1.1 2.3 0.3 55.4
Simulation, STEP 1.3 5.0 22.9 3 ms 23.0 16.0 2.4 0.4 71.0
Simulation, STL 1.3 4.6 23.7 2 ms 23.4 2.6 2.5 0.3 58.6
Simulation, OBJ 1.3 5.1 24.3 2 ms 22.4 34.3 2.3 0.3 90.0
Visual, GLB 1.4 5.2 22.7 2 ms 48.3 0.5 5.9 0.3 84.2
Visual, OBJ 1.5 4.9 23.2 2 ms 47.6 18.7 6.8 0.3 103.1
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / manual_route / v1
Complexity 387 / 1000 (size 242, features 145)
KESE features through vias,
blind and buried vias,
slotted holes, rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 1,743, 403
Triangles, simulation 5,647,298 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.5 GB
STEP 659 MB 2.0 GB
STL 282 MB 1.5 GB
OBJ 591 MB 3.5 GB
Visual
GLB 103 MB 2.0 GB
OBJ 327 MB 2.2 GB

1285. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 59 s. Simulation, STEP takes 74 s. Simulation, STL takes 61 s. Simulation, OBJ takes 92 s. Visual, GLB takes 88 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 5.7 22.2 3 ms 24.0 1.2 3.4 0.3 58.6
Simulation, STEP 1.6 5.7 23.9 2 ms 23.7 16.1 3.1 0.4 74.4
Simulation, STL 1.6 5.6 23.1 2 ms 24.2 2.4 3.4 0.4 60.6
Simulation, OBJ 1.5 5.3 21.9 2 ms 23.4 36.4 2.9 0.3 91.7
Visual, GLB 1.7 5.9 22.8 2 ms 49.6 0.5 7.2 0.3 88.1
Visual, OBJ 1.7 5.6 23.2 3 ms 48.6 17.8 8.3 0.3 105.5
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / manual_route / v1 / routed
Complexity 364 / 1000 (size 254, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 4,090, 677
Triangles, simulation 7,459,160 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 248 MB 1.9 GB
STEP 815 MB 2.4 GB
STL 373 MB 1.9 GB
OBJ 787 MB 4.7 GB
Visual
GLB 128 MB 2.3 GB
OBJ 413 MB 2.7 GB

1286. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 53% to 86% of a run. Simulation, GLB takes 50 s. Simulation, STEP takes 62 s. Simulation, STL takes 51 s. Simulation, OBJ takes 78 s. Visual, GLB takes 76 s. Visual, OBJ takes 94 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.1 21.4 2 ms 19.7 1.0 2.3 0.3 50.0
Simulation, STEP 1.0 4.2 21.8 2 ms 18.8 13.4 2.1 0.3 61.6
Simulation, STL 1.2 4.2 21.4 3 ms 19.6 2.2 2.3 0.3 51.2
Simulation, OBJ 1.1 4.5 20.9 2 ms 20.0 28.7 2.3 0.4 77.9
Visual, GLB 0.9 3.9 20.0 2 ms 45.7 0.5 4.8 0.3 76.1
Visual, OBJ 1.2 3.8 20.6 2 ms 46.4 16.3 5.3 0.3 93.9
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / manual_route / v2
Complexity 387 / 1000 (size 242, features 145)
KESE features through vias,
blind and buried vias,
slotted holes, rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 1,744, 405
Triangles, simulation 5,657,426 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.5 GB
STEP 660 MB 2.0 GB
STL 283 MB 1.6 GB
OBJ 592 MB 3.6 GB
Visual
GLB 104 MB 2.0 GB
OBJ 327 MB 2.1 GB

1287. arena_10_of_10_v1r1

arena_10_of_10_v1r1: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 61 s. Simulation, STEP takes 75 s. Simulation, STL takes 62 s. Simulation, OBJ takes 2 min. Visual, GLB takes 89 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 6.0 23.8 2 ms 24.5 1.1 3.6 0.4 61.0
Simulation, STEP 1.7 5.8 23.3 3 ms 24.6 15.8 3.2 0.4 74.8
Simulation, STL 1.8 5.8 23.1 3 ms 24.9 2.8 3.5 0.4 62.2
Simulation, OBJ 1.8 6.1 23.1 3 ms 25.3 41.0 3.6 0.4 101.3
Visual, GLB 1.9 5.9 22.9 2 ms 50.7 0.5 7.0 0.3 89.2
Visual, OBJ 1.7 5.8 23.3 2 ms 48.8 18.8 6.8 0.3 105.4
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10_of_10_v1r1.kicad_pcb
Folder arena_10-10 / arena_10-10_v1 / manual_route / v2 / routed
Complexity 363 / 1000 (size 253, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 4,129, 652
Triangles, simulation 7,323,260 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 244 MB 1.8 GB
STEP 805 MB 2.5 GB
STL 366 MB 1.9 GB
OBJ 772 MB 4.6 GB
Visual
GLB 126 MB 2.2 GB
OBJ 406 MB 2.8 GB

1288. arena_top_10-10

arena_top_10-10: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 9.2 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.0 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.1 4.0 0.5 ms 2.6 0.1 0.5 0.2 9.2
Simulation, STEP 0.6 1.0 4.1 0.8 ms 2.6 2.6 0.5 0.3 11.6
Simulation, STL 0.6 0.9 3.9 0.5 ms 2.6 0.3 0.5 0.2 9.0
Simulation, OBJ 0.6 1.0 4.0 0.9 ms 2.6 4.8 0.5 0.2 13.7
Visual, GLB 0.6 1.0 4.0 0.5 ms 6.2 89 ms 0.7 0.2 12.8
Visual, OBJ 0.7 1.0 4.0 0.4 ms 6.2 3.1 0.7 0.2 15.8
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_top_10-10.kicad_pcb
Folder arena_10-10 / arena_top_10-10
Complexity 266 / 1000 (size 136, features 130)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 32, 54, 30
Triangles, simulation 857,574 in 96 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 467 MB
STEP 116 MB 483 MB
STL 43 MB 453 MB
OBJ 86 MB 617 MB
Visual
GLB 19 MB 476 MB
OBJ 57 MB 489 MB

1289. arena_10-10_v2r1

arena_10-10_v2r1: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 73 s. Simulation, STEP takes 90 s. Simulation, STL takes 74 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 5.6 27.2 2 ms 33.6 1.4 3.1 0.4 73.3
Simulation, STEP 2.2 5.7 25.1 2 ms 35.3 18.4 3.2 0.4 90.2
Simulation, STL 2.2 5.3 25.8 1 ms 34.5 2.8 3.1 0.5 74.2
Simulation, OBJ 2.3 5.5 26.7 1 ms 35.1 35.5 2.7 0.4 108.1
Visual, GLB 2.1 5.3 24.4 2 ms 67.9 0.8 8.1 0.3 108.8
Visual, OBJ 2.1 5.7 25.9 1 ms 65.6 23.5 9.0 0.3 132.1
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10-10_v2r1.kicad_pcb
Folder arena_10-10 / develop / with_reg / arena_10-10_v2r1
Complexity 403 / 1000 (size 263, features 140)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 521, 8,209, 732
Triangles, simulation 7,924,200 in 530 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 261 MB 2.2 GB
STEP 1.1 GB 2.8 GB
STL 396 MB 2.2 GB
OBJ 829 MB 4.9 GB
Visual
GLB 174 MB 2.8 GB
OBJ 559 MB 3.5 GB

1290. arena_10-10_v2r1

arena_10-10_v2r1: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 74 s. Simulation, STEP takes 87 s. Simulation, STL takes 71 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 6.0 24.6 1 ms 37.1 1.2 2.8 0.3 74.1
Simulation, STEP 2.0 5.5 23.7 1 ms 33.5 18.8 2.9 0.4 86.8
Simulation, STL 2.1 5.5 24.1 2 ms 34.0 2.5 2.9 0.3 71.3
Simulation, OBJ 1.9 5.4 23.5 2 ms 35.5 38.3 2.9 0.4 108.0
Visual, GLB 2.1 5.5 24.3 1 ms 62.1 0.7 9.6 0.3 104.6
Visual, OBJ 2.1 5.3 23.6 2 ms 61.6 22.8 9.9 0.3 125.7
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_10-10_v2r1.kicad_pcb
Folder arena_10-10 / develop / without_reg / arena_10-10_v2r1
Complexity 388 / 1000 (size 263, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 543, 8,276, 744
Triangles, simulation 8,057,822 in 539 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 264 MB 2.2 GB
STEP 1.1 GB 2.8 GB
STL 403 MB 2.3 GB
OBJ 840 MB 5.0 GB
Visual
GLB 176 MB 2.8 GB
OBJ 566 MB 3.5 GB

1291. arena_12-18

arena_12-18: stages 4 and 6 take 50% to 88% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.3 9.0 41.2 2 ms 37.4 1.9 6.3 0.5 99.6
Simulation, STEP 3.2 9.0 41.5 3 ms 35.9 25.7 6.4 0.5 122.2
Simulation, STL 3.2 9.1 41.0 2 ms 37.9 3.6 6.6 0.5 101.9
Simulation, OBJ 3.2 9.3 42.7 2 ms 37.9 61.5 6.4 0.5 161.6
Visual, GLB 3.1 9.5 41.5 2 ms 114.8 0.7 7.0 0.4 176.9
Visual, OBJ 3.2 9.4 41.7 2 ms 119.0 28.7 7.7 0.4 210.1
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_12-18.kicad_pcb
Folder arena_12-18
Complexity 381 / 1000 (size 256, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 604, 3,679, 855
Triangles, simulation 9,784,698 in 604 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 333 MB 2.3 GB
STEP 1.3 GB 3.1 GB
STL 489 MB 2.3 GB
OBJ 1.1 GB 6.2 GB
Visual
GLB 161 MB 2.8 GB
OBJ 516 MB 3.4 GB

1292. arena_12-18

arena_12-18: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 33 s. Simulation, STL takes 28 s. Simulation, OBJ takes 41 s. Visual, GLB takes 44 s. Visual, OBJ takes 52 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.6 11.1 2 ms 10.9 0.4 1.2 0.3 27.3
Simulation, STEP 0.9 2.3 11.2 1 ms 10.6 7.2 1.0 0.3 33.5
Simulation, STL 0.9 2.2 11.5 2 ms 11.5 0.8 1.0 0.2 28.1
Simulation, OBJ 1.0 2.4 11.8 2 ms 11.6 12.9 1.0 0.3 40.9
Visual, GLB 1.0 2.3 11.5 1 ms 26.1 0.3 2.9 0.3 44.4
Visual, OBJ 1.1 2.1 11.4 1 ms 25.3 9.1 3.2 0.3 52.5
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_12-18.kicad_pcb
Folder arena_12-18 / layout_tool
Complexity 94 / 1000 (size 84, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 495, 0, 0
Triangles, simulation 2,474,306 in 511 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 952 MB
STEP 344 MB 1.2 GB
STL 124 MB 953 MB
OBJ 264 MB 1.7 GB
Visual
GLB 67 MB 1.4 GB
OBJ 208 MB 1.4 GB

1293. modified_arena_10_of_10_v1r1

modified_arena_10_of_10_v1r1: stages 4 and 6 take 48% to 77% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 16 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 1.6 5.0 1 ms 2.8 0.2 0.4 0.2 11.2
Simulation, STEP 1.1 1.6 5.0 0.8 ms 3.3 3.4 0.4 0.2 14.9
Simulation, STL 1.0 1.6 5.0 0.8 ms 3.3 0.3 0.4 0.2 11.8
Simulation, OBJ 1.0 1.5 5.0 0.9 ms 2.9 5.3 0.4 0.3 16.5
Visual, GLB 1.0 1.6 4.9 0.8 ms 7.4 0.1 0.7 0.2 16.0
Visual, OBJ 1.1 1.5 4.9 0.7 ms 7.5 4.2 0.8 0.2 20.2
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: modified_arena_10_of_10_v1r1.kicad_pcb
Folder arena_12-18 / layout_tool
Complexity 104 / 1000 (size 84, features 20)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 495, 0, 0
Triangles, simulation 990,208 in 253 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 496 MB
STEP 139 MB 550 MB
STL 50 MB 489 MB
OBJ 102 MB 712 MB
Visual
GLB 26 MB 737 MB
OBJ 79 MB 671 MB

1294. arena_12-18

arena_12-18: stages 4 and 6 take 50% to 85% of a run. Simulation, GLB takes 49 s. Simulation, STEP takes 60 s. Simulation, STL takes 50 s. Simulation, OBJ takes 78 s. Visual, GLB takes 70 s. Visual, OBJ takes 88 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.3 20.1 2 ms 19.9 0.9 2.1 0.3 48.9
Simulation, STEP 1.1 4.2 19.9 3 ms 19.1 13.4 2.0 0.3 60.0
Simulation, STL 1.2 4.1 20.6 2 ms 19.9 1.7 2.0 0.3 49.9
Simulation, OBJ 1.2 4.2 19.6 2 ms 19.5 31.0 2.1 0.3 77.9
Visual, GLB 1.1 4.2 19.7 2 ms 40.2 0.4 4.5 0.3 70.5
Visual, OBJ 1.1 4.2 19.8 2 ms 40.9 16.8 5.1 0.3 88.1
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_12-18.kicad_pcb
Folder arena_12-18 / manual_route / v1
Complexity 387 / 1000 (size 242, features 145)
KESE features through vias,
blind and buried vias,
slotted holes, rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 1,743, 403
Triangles, simulation 5,647,298 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.5 GB
STEP 659 MB 2.0 GB
STL 282 MB 1.5 GB
OBJ 591 MB 3.5 GB
Visual
GLB 103 MB 2.0 GB
OBJ 327 MB 2.1 GB

1295. arena_12-18

arena_12-18: stages 4 and 6 take 47% to 84% of a run. Simulation, GLB takes 70 s. Simulation, STEP takes 90 s. Simulation, STL takes 72 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 6.8 28.2 2 ms 27.3 1.6 3.9 0.4 70.3
Simulation, STEP 2.2 7.1 28.7 2 ms 28.3 19.8 3.8 0.4 90.2
Simulation, STL 2.1 6.9 27.9 3 ms 28.0 3.0 4.0 0.4 72.3
Simulation, OBJ 2.1 6.7 27.2 2 ms 28.6 48.7 4.0 0.5 117.7
Visual, GLB 2.2 7.0 29.9 3 ms 55.7 0.6 6.4 0.4 102.2
Visual, OBJ 2.2 7.2 29.1 3 ms 54.5 24.1 5.7 0.3 123.3
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_12-18.kicad_pcb
Folder arena_12-18 / manual_route / v1 / routed
Complexity 364 / 1000 (size 254, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 4,090, 677
Triangles, simulation 7,459,160 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 248 MB 1.9 GB
STEP 815 MB 2.5 GB
STL 373 MB 1.9 GB
OBJ 787 MB 4.7 GB
Visual
GLB 128 MB 2.3 GB
OBJ 413 MB 2.7 GB

1296. arena_12-18

arena_12-18: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 49 s. Simulation, STEP takes 62 s. Simulation, STL takes 51 s. Simulation, OBJ takes 76 s. Visual, GLB takes 74 s. Visual, OBJ takes 88 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.4 20.5 2 ms 19.7 0.9 2.1 0.4 49.3
Simulation, STEP 1.1 4.5 20.2 2 ms 20.1 13.6 2.2 0.3 62.1
Simulation, STL 1.2 4.3 20.0 2 ms 20.9 2.2 2.2 0.3 51.1
Simulation, OBJ 1.2 4.4 20.3 2 ms 19.9 27.3 2.3 0.4 75.8
Visual, GLB 1.2 4.2 20.2 2 ms 42.2 0.5 5.4 0.3 74.1
Visual, OBJ 1.0 4.3 20.6 2 ms 42.6 14.9 4.8 0.3 88.4
Board Repo: iorodeo/led-display_g6_hardware_arena
Board: arena_12-18.kicad_pcb
Folder arena_12-18 / manual_route / v2
Complexity 387 / 1000 (size 242, features 145)
KESE features through vias,
blind and buried vias,
slotted holes, rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 505, 1,744, 405
Triangles, simulation 5,657,426 in 516 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.5 GB
STEP 660 MB 2.0 GB
STL 283 MB 1.5 GB
OBJ 592 MB 3.5 GB
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OBJ 327 MB 2.1 GB
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