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Corpus Testing 28

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Corpus Page 28

Part 28 of 29 of Corpus Testing: boards 2,917 to 3,024, six runs each, one file format a run, as Corpus Testing describes.

2917. SystemBoardPLCC

SystemBoardPLCC: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 20 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.3 6.6 0.7 ms 5.2 0.2 0.8 0.2 14.5
Simulation, STEP 0.3 1.2 6.5 0.6 ms 5.2 4.4 0.9 0.2 18.9
Simulation, STL 0.3 1.2 6.9 0.6 ms 5.4 0.4 0.8 0.2 15.2
Simulation, OBJ 0.3 1.3 6.5 0.6 ms 5.3 8.7 0.7 0.2 23.1
Visual, GLB 0.3 1.3 6.5 0.5 ms 10.9 0.2 1.1 0.2 20.5
Visual, OBJ 0.3 1.2 6.5 0.6 ms 10.6 5.4 1.4 0.2 25.7
Board Repo: transistorfet/retroverse
Board: SystemBoardPLCC.kicad_pcb
Folder components / systemboard / hardware / SystemBoardPLCC
Complexity 308 / 1000 (size 208, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 33, 568, 138
Triangles, simulation 1,694,846 in 126 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 57 MB 770 MB
STEP 239 MB 787 MB
STL 85 MB 783 MB
OBJ 173 MB 1.1 GB
Visual
GLB 36 MB 725 MB
OBJ 110 MB 844 MB

2918. SystemBoardSMT

SystemBoardSMT: stages 4 and 6 take 45% to 82% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 28 s. Visual, GLB takes 26 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 5.6 0.8 ms 6.1 0.3 1.0 0.2 15.5
Simulation, STEP 0.4 2.0 6.1 0.9 ms 6.6 5.4 0.9 0.3 21.7
Simulation, STL 0.4 2.0 5.9 0.9 ms 6.6 0.5 1.0 0.2 16.6
Simulation, OBJ 0.4 2.0 5.9 0.9 ms 6.5 11.8 1.1 0.3 28.0
Visual, GLB 0.4 2.1 6.0 0.9 ms 15.1 0.2 1.6 0.3 25.7
Visual, OBJ 0.4 1.8 5.9 0.8 ms 14.9 7.0 1.7 0.2 31.9
Board Repo: transistorfet/retroverse
Board: SystemBoardSMT.kicad_pcb
Folder components / systemboard / hardware / SystemBoardSMT
Complexity 332 / 1000 (size 232, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 32, 896, 220
Triangles, simulation 2,137,672 in 128 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 676 MB
STEP 255 MB 839 MB
STL 107 MB 687 MB
OBJ 221 MB 1.4 GB
Visual
GLB 40 MB 805 MB
OBJ 124 MB 978 MB

2919. CYM1A113

CYM1A113: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 26 s. Visual, GLB takes 23 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 7.4 0.5 ms 7.1 0.3 0.8 0.2 17.9
Simulation, STEP 0.5 1.7 7.2 0.5 ms 7.1 4.4 0.8 0.2 21.9
Simulation, STL 0.6 1.7 7.1 0.6 ms 7.2 0.5 0.8 0.2 17.9
Simulation, OBJ 0.5 1.6 7.1 0.5 ms 6.9 9.0 0.8 0.2 26.2
Visual, GLB 0.5 1.7 7.1 0.6 ms 11.8 0.2 1.2 0.2 22.7
Visual, OBJ 0.5 1.7 7.4 0.6 ms 12.3 6.2 1.4 0.3 29.8
Board Repo: trezor/trezor-hardware
Board: CYM1A113.kicad_pcb
Folder electronics / trezor_model_t / kicad
Complexity 339 / 1000 (size 244, features 95)
KESE features through vias, microvias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 10th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 105, 971, 177
Triangles, simulation 1,570,744 in 133 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 55 MB 588 MB
STEP 230 MB 743 MB
STL 79 MB 601 MB
OBJ 164 MB 1.1 GB
Visual
GLB 34 MB 754 MB
OBJ 103 MB 818 MB

2920. trezor_v1.1

trezor_v1.1: stages 4 and 6 take 39% to 80% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 10 s. Simulation, OBJ takes 17 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.6 3.0 0.4 ms 4.8 0.3 0.9 0.3 11.2
Simulation, STEP 0.3 1.8 3.0 0.4 ms 4.5 2.8 0.8 0.3 13.5
Simulation, STL 0.4 1.5 2.8 0.3 ms 4.3 0.4 0.7 0.3 10.4
Simulation, OBJ 0.2 1.4 2.6 0.4 ms 4.2 7.9 0.8 0.3 17.4
Visual, GLB 0.2 1.5 2.8 0.3 ms 7.8 96 ms 0.5 0.3 13.1
Visual, OBJ 0.3 1.4 2.6 0.4 ms 7.1 3.1 0.7 0.3 15.3
Board Repo: trezor/trezor-hardware
Board: trezor_v1.1.kicad_pcb
Folder electronics / trezor_one / kicad
Complexity 301 / 1000 (size 256, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 16
File format KiCad 5 (20171130)
Parts, tracks, vias 37, 545, 89
Triangles, simulation 1,305,058 in 88 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 39 MB 480 MB
STEP 99 MB 563 MB
STL 65 MB 470 MB
OBJ 134 MB 854 MB
Visual
GLB 17 MB 446 MB
OBJ 51 MB 439 MB

2921. iMX6 Demo Board

iMX6 Demo Board: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 78 s. Simulation, STEP takes 2 min. Simulation, STL takes 80 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 7.7 23.9 2 ms 37.0 1.7 5.2 0.4 78.0
Simulation, STEP 2.2 7.9 24.6 3 ms 36.6 23.4 5.3 0.4 100.5
Simulation, STL 2.3 7.7 23.9 2 ms 36.9 3.6 5.5 0.5 80.5
Simulation, OBJ 2.4 8.1 24.1 2 ms 37.4 52.7 5.4 0.5 130.6
Visual, GLB 2.4 8.1 23.9 3 ms 85.6 1.1 9.9 0.4 131.3
Visual, OBJ 2.7 8.2 25.0 2 ms 86.4 30.0 10.3 0.4 162.8
Board Repo: ts-manuel/imx6-demo-board
Board: iMX6 Demo Board.kicad_pcb
Folder kicad
Complexity 511 / 1000 (size 326, features 185)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 458, 7,806, 973
Triangles, simulation 9,038,324 in 603 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 306 MB 2.4 GB
STEP 1.4 GB 3.2 GB
STL 452 MB 2.5 GB
OBJ 982 MB 5.7 GB
Visual
GLB 179 MB 2.9 GB
OBJ 598 MB 3.7 GB

2922. iMX6 Demo Board_from_REF

iMX6 Demo Board_from_REF: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 41 s. Simulation, STL takes 34 s. Simulation, OBJ takes 52 s. Visual, GLB takes 53 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.3 11.5 3 ms 13.9 0.5 1.6 0.3 33.4
Simulation, STEP 1.4 4.2 11.6 1 ms 13.2 8.9 1.4 0.3 41.0
Simulation, STL 1.3 4.1 11.2 1.0 ms 14.2 0.9 1.5 0.3 33.7
Simulation, OBJ 1.4 4.3 11.6 1 ms 14.4 18.6 1.7 0.3 52.2
Visual, GLB 1.5 4.4 12.2 1 ms 32.1 0.3 2.6 0.3 53.3
Visual, OBJ 1.4 4.5 11.7 1 ms 30.9 11.4 2.9 0.3 63.2
Board Repo: ts-manuel/imx6-demo-board
Board: iMX6 Demo Board_from_REF.kicad_pcb
Folder kicad
Complexity 433 / 1000 (size 313, features 120)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 468, 3,672, 333
Triangles, simulation 3,165,490 in 480 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 107 MB 1.0 GB
STEP 465 MB 1.3 GB
STL 158 MB 1.0 GB
OBJ 340 MB 2.1 GB
Visual
GLB 63 MB 1.4 GB
OBJ 209 MB 1.5 GB

2923. RP2040_debugger

RP2040_debugger: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 9.8 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 16 s. Visual, GLB takes 15 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.9 3.5 0.4 ms 3.9 0.2 0.7 0.2 9.8
Simulation, STEP 0.4 1.0 3.5 0.5 ms 4.2 3.6 0.7 0.2 13.5
Simulation, STL 0.4 1.0 3.6 0.4 ms 4.2 0.3 0.7 0.2 10.4
Simulation, OBJ 0.4 1.0 3.6 0.5 ms 4.1 6.0 0.6 0.3 16.0
Visual, GLB 0.4 1.0 3.7 0.6 ms 8.2 0.1 1.3 0.2 15.0
Visual, OBJ 0.4 1.0 3.6 0.4 ms 8.1 4.0 1.2 0.3 18.5
Board Repo: twisted-fields/rp2040-motor-controller
Board: RP2040_debugger.kicad_pcb
Folder debugger
Complexity 322 / 1000 (size 227, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 57, 560, 87
Triangles, simulation 1,002,398 in 78 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 433 MB
STEP 156 MB 532 MB
STL 50 MB 440 MB
OBJ 101 MB 742 MB
Visual
GLB 24 MB 590 MB
OBJ 72 MB 595 MB

2924. driver_module

driver_module: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 9.5 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 14 s. Visual, GLB takes 16 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 3.7 0.4 ms 3.5 0.2 0.4 0.3 9.5
Simulation, STEP 0.4 1.1 3.4 0.3 ms 3.6 2.8 0.5 0.2 12.0
Simulation, STL 0.4 1.0 3.5 0.4 ms 3.5 0.3 0.4 0.2 9.4
Simulation, OBJ 0.3 1.2 3.5 0.3 ms 3.4 5.3 0.4 0.3 14.5
Visual, GLB 0.4 1.2 3.5 0.5 ms 9.1 0.1 1.0 0.3 15.6
Visual, OBJ 0.3 1.1 3.6 0.4 ms 9.7 3.3 1.0 0.3 19.4
Board Repo: twisted-fields/rp2040-motor-controller
Board: driver_module.kicad_pcb
Folder driver_module
Complexity 294 / 1000 (size 199, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 106, 640, 162
Triangles, simulation 1,087,146 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 436 MB
STEP 137 MB 548 MB
STL 54 MB 442 MB
OBJ 111 MB 780 MB
Visual
GLB 24 MB 603 MB
OBJ 73 MB 592 MB

2925. RP2040_base

RP2040_base: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 47 s. Simulation, STL takes 37 s. Simulation, OBJ takes 62 s. Visual, GLB takes 68 s. Visual, OBJ takes 83 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.1 13.9 1 ms 14.3 0.7 1.9 0.3 36.5
Simulation, STEP 1.1 4.3 13.4 0.6 ms 14.8 11.1 1.9 0.3 46.9
Simulation, STL 1.1 4.2 13.7 0.8 ms 14.7 1.3 1.8 0.3 37.0
Simulation, OBJ 1.2 4.5 14.1 1 ms 15.3 24.1 2.1 0.3 61.7
Visual, GLB 1.1 4.7 14.4 0.7 ms 42.0 0.5 4.6 0.3 67.6
Visual, OBJ 1.1 4.3 14.0 0.7 ms 42.1 16.8 4.5 0.3 83.1
Board Repo: twisted-fields/rp2040-motor-controller
Board: RP2040_base.kicad_pcb
Folder RP2040_base
Complexity 418 / 1000 (size 283, features 135)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 10th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 257, 4,544, 553
Triangles, simulation 4,250,826 in 226 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 145 MB 1.2 GB
STEP 592 MB 1.6 GB
STL 213 MB 1.2 GB
OBJ 456 MB 2.7 GB
Visual
GLB 100 MB 1.6 GB
OBJ 319 MB 2.0 GB

2926. rp2040_encoder

rp2040_encoder: stages 4 and 6 take 41% to 75% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.1 ms 0.6 21 ms 79 ms 0.2 1.6
Simulation, STEP 0.1 0.2 0.4 0.2 ms 0.5 0.8 59 ms 0.2 2.3
Simulation, STL 0.1 0.2 0.4 0.1 ms 0.6 33 ms 73 ms 0.2 1.6
Simulation, OBJ 0.1 0.1 0.5 0.2 ms 0.6 0.6 72 ms 0.2 2.2
Visual, GLB 0.1 0.1 0.4 0.1 ms 1.3 18 ms 0.1 0.2 2.3
Visual, OBJ 0.1 0.1 0.5 0.1 ms 1.3 0.5 0.1 0.2 2.8
Board Repo: twisted-fields/rp2040-motor-controller
Board: rp2040_encoder.kicad_pcb
Folder rp2040_encoder
Complexity 185 / 1000 (size 110, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 10, 47, 4
Triangles, simulation 126,086 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.4 MB 188 MB
STEP 22 MB 204 MB
STL 6.3 MB 189 MB
OBJ 12 MB 189 MB
Visual
GLB 3.8 MB 168 MB
OBJ 10 MB 164 MB

2927. user_interface

user_interface: stages 4 and 6 take 44% to 80% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 6.0 s. Simulation, STL takes 4.4 s. Simulation, OBJ takes 6.7 s. Visual, GLB takes 7.5 s. Visual, OBJ takes 8.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.4 0.6 ms 1.5 72 ms 0.3 0.3 4.3
Simulation, STEP 0.3 0.6 1.5 0.2 ms 1.4 1.6 0.3 0.2 6.0
Simulation, STL 0.2 0.5 1.5 0.7 ms 1.5 0.2 0.3 0.3 4.4
Simulation, OBJ 0.2 0.6 1.5 0.2 ms 1.4 2.5 0.3 0.2 6.7
Visual, GLB 0.2 0.5 1.6 0.3 ms 4.4 56 ms 0.5 0.3 7.5
Visual, OBJ 0.2 0.5 1.5 0.3 ms 4.1 1.6 0.6 0.3 8.6
Board Repo: twisted-fields/rp2040-motor-controller
Board: user_interface.kicad_pcb
Folder user_interface
Complexity 262 / 1000 (size 177, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 38, 386, 62
Triangles, simulation 492,310 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 282 MB
STEP 64 MB 336 MB
STL 25 MB 292 MB
OBJ 50 MB 390 MB
Visual
GLB 12 MB 330 MB
OBJ 35 MB 331 MB

2928. Board-DjinnBase

Board-DjinnBase: stages 4 and 6 take 43% to 77% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 76 ms 0.1 0.5 0.1 ms 0.6 29 ms 65 ms 0.2 1.5
Simulation, STEP 71 ms 0.1 0.4 0.1 ms 0.6 0.9 58 ms 0.2 2.4
Simulation, STL 73 ms 0.1 0.4 0.1 ms 0.6 41 ms 74 ms 0.2 1.6
Simulation, OBJ 92 ms 0.1 0.5 0.1 ms 0.6 0.8 61 ms 0.2 2.4
Visual, GLB 83 ms 0.1 0.4 0.1 ms 1.5 33 ms 0.2 0.2 2.5
Visual, OBJ 96 ms 0.1 0.5 0.1 ms 1.4 0.6 0.1 0.2 3.1
Board Repo: tzarc/keyboards
Board: Board-DjinnBase.kicad_pcb
Folder Djinn / Rev1 / Board-DjinnBase
Complexity 54 / 1000 (size 24, features 30)
KESE features filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 1, 0, 0
Triangles, simulation 177,144 in 12 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.9 MB 184 MB
STEP 29 MB 197 MB
STL 8.9 MB 187 MB
OBJ 17 MB 191 MB
Visual
GLB 4.5 MB 139 MB
OBJ 13 MB 159 MB

2929. Board-DjinnPlate

Board-DjinnPlate: stages 4 and 6 take 41% to 73% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 4.1 s. Visual, GLB takes 4.2 s. Visual, OBJ takes 5.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.6 0.1 ms 1.0 55 ms 0.1 0.2 2.5
Simulation, STEP 0.2 0.3 0.6 0.1 ms 1.0 1.3 0.1 0.2 3.7
Simulation, STL 0.2 0.2 0.6 0.1 ms 1.0 80 ms 91 ms 0.2 2.3
Simulation, OBJ 0.2 0.3 0.6 0.1 ms 1.1 1.6 0.1 0.2 4.1
Visual, GLB 0.2 0.3 0.6 0.2 ms 2.4 43 ms 0.4 0.2 4.2
Visual, OBJ 0.2 0.4 0.6 0.1 ms 2.3 1.2 0.3 0.2 5.1
Board Repo: tzarc/keyboards
Board: Board-DjinnPlate.kicad_pcb
Folder Djinn / Rev1 / Board-DjinnPlate
Complexity 69 / 1000 (size 29, features 40)
KESE features slotted holes, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 0, 0
Triangles, simulation 347,412 in 12 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 272 MB
STEP 69 MB 314 MB
STL 17 MB 297 MB
OBJ 35 MB 294 MB
Visual
GLB 9.6 MB 272 MB
OBJ 28 MB 281 MB

2930. Djinn

Djinn: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 83 s. Simulation, STEP takes 2 min. Simulation, STL takes 83 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.4 12.4 30.0 0.9 ms 32.8 1.2 4.0 0.3 83.1
Simulation, STEP 2.4 12.1 29.7 1 ms 32.6 22.3 3.8 0.3 103.3
Simulation, STL 2.4 12.4 29.8 0.7 ms 32.2 2.5 3.7 0.3 83.3
Simulation, OBJ 2.4 12.2 29.5 1.0 ms 32.9 44.9 3.8 0.3 125.9
Visual, GLB 2.4 12.0 30.4 2 ms 91.8 1.0 10.4 0.3 148.2
Visual, OBJ 2.4 12.1 29.9 0.7 ms 89.8 38.1 9.9 0.3 182.7
Board Repo: tzarc/keyboards
Board: Djinn.kicad_pcb
Folder Djinn / Rev1
Complexity 345 / 1000 (size 255, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 230, 2,956, 630
Triangles, simulation 7,553,280 in 180 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 258 MB 2.7 GB
STEP 1.4 GB 3.1 GB
STL 378 MB 2.6 GB
OBJ 807 MB 4.8 GB
Visual
GLB 234 MB 3.4 GB
OBJ 749 MB 4.5 GB

2931. Djinn

Djinn: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 90 s. Simulation, STEP takes 2 min. Simulation, STL takes 96 s. Simulation, OBJ takes 2 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.5 13.9 33.8 2 ms 33.7 1.2 4.8 0.4 90.2
Simulation, STEP 2.6 14.2 34.0 2 ms 35.2 22.4 5.1 0.3 113.8
Simulation, STL 2.6 14.5 35.4 2 ms 35.6 2.6 4.6 0.3 95.6
Simulation, OBJ 2.7 13.9 34.4 2 ms 33.6 48.2 4.6 0.3 137.6
Visual, GLB 2.6 14.4 34.5 2 ms 100.0 1.3 12.1 0.3 165.1
Visual, OBJ 2.7 14.5 35.5 2 ms 101.8 40.9 12.0 0.3 207.6
Board Repo: tzarc/keyboards
Board: Djinn.kicad_pcb
Folder Djinn / Rev2a
Complexity 353 / 1000 (size 263, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 230, 3,274, 711
Triangles, simulation 7,974,724 in 196 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 273 MB 2.9 GB
STEP 1.5 GB 3.2 GB
STL 399 MB 2.8 GB
OBJ 856 MB 5.0 GB
Visual
GLB 245 MB 3.6 GB
OBJ 787 MB 4.7 GB

2932. ExtraBoard-Base

ExtraBoard-Base: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 5.5 s. Simulation, STEP takes 7.2 s. Simulation, STL takes 5.4 s. Simulation, OBJ takes 7.7 s. Visual, GLB takes 6.2 s. Visual, OBJ takes 7.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 2.4 0.3 ms 2.0 75 ms 0.2 0.3 5.5
Simulation, STEP 0.1 0.3 2.7 0.3 ms 1.6 1.9 0.3 0.2 7.2
Simulation, STL 0.2 0.3 2.6 0.2 ms 1.7 0.1 0.2 0.2 5.4
Simulation, OBJ 0.1 0.3 2.5 0.2 ms 1.7 2.4 0.3 0.3 7.7
Visual, GLB 0.1 0.3 2.4 0.4 ms 2.7 45 ms 0.3 0.3 6.2
Visual, OBJ 0.1 0.3 2.7 0.3 ms 3.1 1.1 0.3 0.3 7.8
Board Repo: tzarc/keyboards
Board: ExtraBoard-Base.kicad_pcb
Folder Djinn / Rev2a / ExtraBoard-Base
Complexity 74 / 1000 (size 44, features 30)
KESE features filled zones, curved board outline
Tested 10th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 11, 0, 0
Triangles, simulation 382,012 in 12 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 249 MB
STEP 57 MB 272 MB
STL 19 MB 250 MB
OBJ 38 MB 283 MB
Visual
GLB 6.2 MB 198 MB
OBJ 18 MB 216 MB

2933. ExtraBoard-Plate

ExtraBoard-Plate: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 7.0 s. Simulation, STEP takes 8.6 s. Simulation, STL takes 7.0 s. Simulation, OBJ takes 11 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.8 2.6 0.4 ms 2.6 0.1 0.3 0.3 7.0
Simulation, STEP 0.3 0.6 2.5 0.4 ms 2.4 2.3 0.3 0.2 8.6
Simulation, STL 0.3 0.7 2.7 0.6 ms 2.5 0.3 0.3 0.2 7.0
Simulation, OBJ 0.3 0.7 2.7 0.6 ms 2.5 4.0 0.3 0.3 10.8
Visual, GLB 0.4 0.7 2.6 0.4 ms 5.3 82 ms 0.9 0.2 10.2
Visual, OBJ 0.3 0.8 2.6 0.3 ms 4.9 2.3 0.8 0.2 12.0
Board Repo: tzarc/keyboards
Board: ExtraBoard-Plate.kicad_pcb
Folder Djinn / Rev2a / ExtraBoard-Plate
Complexity 85 / 1000 (size 45, features 40)
KESE features slotted holes, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 13, 0, 0
Triangles, simulation 743,632 in 12 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 442 MB
STEP 141 MB 486 MB
STL 37 MB 445 MB
OBJ 75 MB 560 MB
Visual
GLB 17 MB 432 MB
OBJ 50 MB 432 MB

2934. ghoul

ghoul: stages 4 and 6 take 53% to 81% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 61 s. Simulation, STL takes 50 s. Simulation, OBJ takes 72 s. Visual, GLB takes 77 s. Visual, OBJ takes 98 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.6 17.5 1 ms 19.7 0.7 2.0 0.3 47.2
Simulation, STEP 1.5 5.9 17.6 1 ms 20.5 13.1 2.0 0.3 60.9
Simulation, STL 1.5 5.9 17.6 0.9 ms 21.6 1.3 2.2 0.3 50.4
Simulation, OBJ 1.5 6.2 18.2 1 ms 20.2 23.8 2.1 0.3 72.4
Visual, GLB 1.5 6.2 18.6 0.9 ms 44.5 0.6 5.7 0.3 77.4
Visual, OBJ 1.5 6.2 18.6 1 ms 45.1 20.1 5.8 0.3 97.5
Board Repo: tzarc/keyboards
Board: ghoul.kicad_pcb
Folder Ghoul / v1.0
Complexity 326 / 1000 (size 206, features 120)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 10th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 166, 2,087, 497
Triangles, simulation 3,894,076 in 191 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 134 MB 1.5 GB
STEP 737 MB 1.8 GB
STL 195 MB 1.5 GB
OBJ 417 MB 2.6 GB
Visual
GLB 116 MB 1.8 GB
OBJ 371 MB 2.5 GB

2935. half-plate

half-plate: stages 4 and 6 take 40% to 66% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 0.1 0.1 ms 0.9 27 ms 49 ms 0.2 1.7
Simulation, STEP 0.1 0.2 0.1 0.1 ms 0.9 1.0 56 ms 0.2 2.6
Simulation, STL 0.1 0.2 0.1 0.1 ms 0.9 44 ms 48 ms 0.2 1.7
Simulation, OBJ 0.1 0.2 0.2 0.1 ms 0.9 0.9 63 ms 0.2 2.6
Visual, GLB 0.1 0.2 0.2 0.1 ms 1.4 29 ms 0.2 0.2 2.3
Visual, OBJ 0.2 0.2 0.1 0.1 ms 1.4 0.8 0.2 0.2 3.0
Board Repo: tzarc/keyboards
Board: half-plate.kicad_pcb
Folder Ghoul / v1.0 / half-plate
Complexity 47 / 1000 (size 17, features 30)
KESE features filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 173,544 in 6 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.1 MB 230 MB
STEP 32 MB 249 MB
STL 8.7 MB 227 MB
OBJ 17 MB 234 MB
Visual
GLB 5.0 MB 191 MB
OBJ 14 MB 191 MB

2936. Kobold

Kobold: stages 4 and 6 take 46% to 82% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 28 s. Simulation, STL takes 22 s. Simulation, OBJ takes 36 s. Visual, GLB takes 33 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.2 7.5 0.5 ms 8.8 0.4 1.1 0.3 21.0
Simulation, STEP 0.7 2.1 7.4 0.6 ms 9.2 6.9 1.1 0.2 27.6
Simulation, STL 0.7 2.1 7.7 0.5 ms 9.5 0.9 1.1 0.2 22.2
Simulation, OBJ 0.6 2.1 7.2 0.5 ms 9.4 15.1 1.1 0.3 35.8
Visual, GLB 0.7 2.2 7.5 0.5 ms 19.3 0.3 2.5 0.2 32.7
Visual, OBJ 0.7 2.1 7.4 0.5 ms 19.2 9.8 2.5 0.3 42.1
Board Repo: tzarc/keyboards
Board: Kobold.kicad_pcb
Folder Kobold / R1
Complexity 339 / 1000 (size 244, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 95, 971, 220
Triangles, simulation 2,671,456 in 99 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 92 MB 904 MB
STEP 424 MB 1.1 GB
STL 134 MB 861 MB
OBJ 282 MB 1.7 GB
Visual
GLB 59 MB 1.0 GB
OBJ 183 MB 1.2 GB

2937. APPS final

APPS final: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 30 ms 91 ms 0.5 0.2 ms 0.6 26 ms 74 ms 0.2 1.5
Simulation, STEP 28 ms 93 ms 0.5 0.1 ms 0.6 0.7 77 ms 0.2 2.2
Simulation, STL 31 ms 0.1 0.6 0.1 ms 0.6 33 ms 73 ms 0.2 1.5
Simulation, OBJ 30 ms 99 ms 0.5 0.1 ms 0.6 0.6 92 ms 0.2 2.1
Visual, GLB 30 ms 91 ms 0.5 0.2 ms 1.2 12 ms 82 ms 0.2 2.1
Visual, OBJ 30 ms 0.1 0.5 0.2 ms 1.2 0.3 74 ms 0.2 2.4
Board Repo: ucdfs/circuits
Board: APPS final.kicad_pcb
Folder APPS_KR
Complexity 169 / 1000 (size 99, features 70)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 12, 26, 0
Triangles, simulation 151,248 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.2 MB 182 MB
STEP 24 MB 184 MB
STL 7.6 MB 182 MB
OBJ 15 MB 180 MB
Visual
GLB 2.8 MB 139 MB
OBJ 7.9 MB 140 MB

2938. Battery Temperature Sensor

Battery Temperature Sensor: stages 4 and 6 take 58% to 80% of a run. Simulation, GLB takes 8.2 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.9 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.7 0.3 ms 3.8 0.1 0.4 0.2 8.2
Simulation, STEP 0.3 0.6 2.9 0.2 ms 3.8 3.1 0.4 0.2 11.3
Simulation, STL 0.4 0.6 2.9 0.2 ms 3.9 0.4 0.4 0.2 8.9
Simulation, OBJ 0.3 0.6 2.9 0.3 ms 4.2 3.5 0.4 0.2 12.2
Visual, GLB 0.3 0.5 2.8 0.4 ms 6.2 0.1 1.0 0.2 11.2
Visual, OBJ 0.3 0.6 2.8 0.3 ms 6.2 2.6 1.0 0.3 13.8
Board Repo: ucdfs/circuits
Board: Battery Temperature Sensor.kicad_pcb
Folder Archive / Battery Temperature Sensor_KR
Complexity 257 / 1000 (size 172, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 107, 419, 58
Triangles, simulation 735,112 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 414 MB
STEP 119 MB 450 MB
STL 37 MB 417 MB
OBJ 73 MB 519 MB
Visual
GLB 19 MB 598 MB
OBJ 56 MB 603 MB

2939. LTC6812-15W

LTC6812-15W: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 18 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.0 3.9 0.6 ms 4.6 0.2 0.5 0.3 11.0
Simulation, STEP 0.5 0.9 3.7 0.9 ms 4.4 3.8 0.6 0.2 14.1
Simulation, STL 0.6 0.9 3.7 0.7 ms 4.7 0.4 0.5 0.3 11.0
Simulation, OBJ 0.5 0.9 3.6 0.6 ms 4.3 6.0 0.6 0.2 16.2
Visual, GLB 0.5 0.9 3.9 0.7 ms 11.4 0.1 1.1 0.3 18.2
Visual, OBJ 0.6 0.9 3.6 0.8 ms 10.8 4.6 1.5 0.2 22.2
Board Repo: ucdfs/circuits
Board: LTC6812-15W.kicad_pcb
Folder ENNOID_BMS / Slave
Complexity 324 / 1000 (size 244, features 80)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 246, 1,418, 64
Triangles, simulation 1,120,794 in 280 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 38 MB 580 MB
STEP 189 MB 627 MB
STL 56 MB 565 MB
OBJ 113 MB 767 MB
Visual
GLB 30 MB 835 MB
OBJ 92 MB 832 MB

2940. (LVE)Shutdown

(LVE)Shutdown: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 18 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.1 6.7 0.4 ms 4.8 0.2 0.7 0.2 14.0
Simulation, STEP 0.4 1.1 6.8 0.4 ms 4.7 3.9 0.6 0.2 17.7
Simulation, STL 0.4 1.1 6.2 0.4 ms 4.9 0.4 0.6 0.2 14.0
Simulation, OBJ 0.4 1.1 6.5 0.4 ms 4.6 7.1 0.6 0.2 20.5
Visual, GLB 0.4 1.1 6.2 0.4 ms 8.8 0.1 1.0 0.2 18.0
Visual, OBJ 0.4 1.1 6.3 0.4 ms 8.8 4.2 1.1 0.2 22.0
Board Repo: ucdfs/circuits
Board: (LVE)Shutdown.kicad_pcb
Folder Kieran Care package / (LVE)Shutdown_KR
Complexity 253 / 1000 (size 168, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 114, 410, 11
Triangles, simulation 1,386,784 in 81 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 47 MB 599 MB
STEP 202 MB 693 MB
STL 69 MB 608 MB
OBJ 141 MB 965 MB
Visual
GLB 29 MB 730 MB
OBJ 88 MB 728 MB

2941. BSPD KiCAD

BSPD KiCAD: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 8.5 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.7 s. Simulation, OBJ takes 13 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.7 3.8 0.6 ms 2.8 0.1 0.4 0.2 8.5
Simulation, STEP 0.3 0.6 3.7 0.6 ms 2.8 2.4 0.4 0.2 10.4
Simulation, STL 0.3 0.6 3.8 0.7 ms 3.0 0.3 0.4 0.2 8.7
Simulation, OBJ 0.3 0.7 3.8 0.6 ms 2.8 4.3 0.4 0.2 12.6
Visual, GLB 0.3 0.6 3.7 0.6 ms 5.7 74 ms 0.7 0.2 11.3
Visual, OBJ 0.3 0.6 3.7 0.6 ms 5.3 2.8 0.8 0.2 13.6
Board Repo: ucdfs/circuits
Board: BSPD KiCAD.kicad_pcb
Folder Kieran Care package / BSPD_KR
Complexity 239 / 1000 (size 154, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 59, 276, 5
Triangles, simulation 878,990 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 434 MB
STEP 125 MB 503 MB
STL 44 MB 434 MB
OBJ 88 MB 625 MB
Visual
GLB 18 MB 534 MB
OBJ 55 MB 456 MB

2942. Charger_Shutdown_KR

Charger_Shutdown_KR: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 5.2 s. Simulation, STEP takes 6.6 s. Simulation, STL takes 5.3 s. Simulation, OBJ takes 8.1 s. Visual, GLB takes 7.2 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.2 0.3 ms 1.9 76 ms 0.3 0.2 5.2
Simulation, STEP 0.2 0.3 2.1 0.7 ms 2.0 1.6 0.3 0.2 6.6
Simulation, STL 0.2 0.4 2.1 0.3 ms 2.0 0.1 0.3 0.2 5.3
Simulation, OBJ 0.2 0.4 2.2 0.4 ms 2.1 2.5 0.3 0.3 8.1
Visual, GLB 0.2 0.3 2.1 0.4 ms 3.8 50 ms 0.4 0.2 7.2
Visual, OBJ 0.2 0.4 2.1 0.4 ms 3.7 1.5 0.4 0.2 8.5
Board Repo: ucdfs/circuits
Board: Charger_Shutdown_KR.kicad_pcb
Folder Kieran Care package / Charger_Shutdown_KR
Complexity 232 / 1000 (size 147, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 41, 209, 10
Triangles, simulation 524,408 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 318 MB
STEP 77 MB 361 MB
STL 26 MB 307 MB
OBJ 52 MB 389 MB
Visual
GLB 11 MB 343 MB
OBJ 33 MB 351 MB

2943. Discharge KiCAD

Discharge KiCAD: stages 4 and 6 take 48% to 75% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 3.0 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.1 ms 0.8 31 ms 0.1 0.2 2.2
Simulation, STEP 0.1 0.2 0.7 0.1 ms 0.7 0.9 0.1 0.2 3.0
Simulation, STL 0.1 0.2 0.8 0.2 ms 0.8 43 ms 0.1 0.2 2.2
Simulation, OBJ 0.1 0.2 0.8 0.1 ms 0.7 0.9 0.1 0.2 3.0
Visual, GLB 0.1 0.2 0.8 0.2 ms 1.5 26 ms 0.2 0.2 3.0
Visual, OBJ 0.1 0.2 0.8 0.2 ms 1.4 0.6 0.1 0.2 3.4
Board Repo: ucdfs/circuits
Board: Discharge KiCAD.kicad_pcb
Folder Kieran Care package / Discharge_KR
Complexity 194 / 1000 (size 119, features 75)
KESE features custom pads, rounded,
trapezoid or chamfered pads,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 16, 80, 0
Triangles, simulation 203,798 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.8 MB 214 MB
STEP 26 MB 228 MB
STL 10 MB 219 MB
OBJ 20 MB 212 MB
Visual
GLB 4.4 MB 188 MB
OBJ 12 MB 192 MB

2944. Cell Tap Fuse Board 2x

Cell Tap Fuse Board 2x: stages 4 and 6 take 39% to 59% of a run. Simulation, GLB takes 0.8 s. Simulation, STEP takes 1.1 s. Simulation, STL takes 0.9 s. Simulation, OBJ takes 0.9 s. Visual, GLB takes 1.0 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 60 ms 0.1 0.1 ms 0.3 7 ms 29 ms 0.2 0.8
Simulation, STEP 87 ms 51 ms 0.1 0.1 ms 0.3 0.3 26 ms 0.2 1.1
Simulation, STL 87 ms 59 ms 0.2 0.1 ms 0.3 12 ms 26 ms 0.2 0.9
Simulation, OBJ 84 ms 45 ms 0.1 0.1 ms 0.2 0.1 32 ms 0.2 0.9
Visual, GLB 85 ms 59 ms 0.2 0.1 ms 0.4 6 ms 48 ms 0.2 1.0
Visual, OBJ 80 ms 51 ms 0.1 0.1 ms 0.4 0.1 50 ms 0.2 1.1
Board Repo: ucdfs/circuits
Board: Cell Tap Fuse Board 2x.kicad_pcb
Folder Kieran Care package / ENNOID_BMS - Cell Tap Fuse Board 2x
Complexity 115 / 1000 (size 65, features 50)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 2, 8, 0
Triangles, simulation 41,276 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.4 MB 68 MB
STEP 6.3 MB 73 MB
STL 2.1 MB 68 MB
OBJ 3.9 MB 78 MB
Visual
GLB 1.0 MB 103 MB
OBJ 2.7 MB 103 MB

2945. Cell Tap Fuse Board 3x

Cell Tap Fuse Board 3x: stages 4 and 6 take 38% to 70% of a run. Simulation, GLB takes 1.1 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.3 s. Visual, GLB takes 1.5 s. Visual, OBJ takes 1.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 99 ms 83 ms 0.2 0.1 ms 0.4 11 ms 40 ms 0.2 1.1
Simulation, STEP 84 ms 73 ms 0.3 0.1 ms 0.4 0.7 32 ms 0.2 1.8
Simulation, STL 93 ms 72 ms 0.2 0.1 ms 0.5 17 ms 41 ms 0.2 1.2
Simulation, OBJ 84 ms 60 ms 0.2 0.1 ms 0.4 0.3 34 ms 0.2 1.3
Visual, GLB 86 ms 62 ms 0.2 0.1 ms 0.8 11 ms 63 ms 0.2 1.5
Visual, OBJ 77 ms 66 ms 0.3 0.1 ms 0.7 0.2 51 ms 0.2 1.6
Board Repo: ucdfs/circuits
Board: Cell Tap Fuse Board 3x.kicad_pcb
Folder Kieran Care package / ENNOID_BMS - Cell Tap Fuse Board 3x
Complexity 131 / 1000 (size 81, features 50)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 4, 16, 0
Triangles, simulation 69,248 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.2 MB 171 MB
STEP 9.5 MB 173 MB
STL 3.5 MB 170 MB
OBJ 6.6 MB 170 MB
Visual
GLB 1.5 MB 151 MB
OBJ 4.2 MB 150 MB

2946. BMS-Master

BMS-Master: stages 4 and 6 take 60% to 85% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 27 s. Simulation, STL takes 21 s. Simulation, OBJ takes 29 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.3 7.6 1 ms 9.8 0.3 1.0 0.3 20.9
Simulation, STEP 0.6 1.4 7.7 0.7 ms 9.8 6.6 1.0 0.3 27.4
Simulation, STL 0.7 1.4 7.7 0.7 ms 9.8 0.5 1.0 0.3 21.3
Simulation, OBJ 0.6 1.3 7.5 0.8 ms 10.1 8.5 1.0 0.3 29.3
Visual, GLB 0.6 1.4 7.3 0.7 ms 14.5 0.2 1.4 0.3 25.7
Visual, OBJ 0.6 1.4 7.5 0.9 ms 14.7 7.0 1.6 0.3 33.0
Board Repo: ucdfs/circuits
Board: BMS-Master.kicad_pcb
Folder Kieran Care package / ENNOID_BMS - Master
Complexity 347 / 1000 (size 237, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 218, 1,289, 130
Triangles, simulation 1,469,656 in 201 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 664 MB
STEP 263 MB 774 MB
STL 73 MB 691 MB
OBJ 151 MB 1.0 GB
Visual
GLB 40 MB 869 MB
OBJ 122 MB 926 MB

2947. LTC6812-15W

LTC6812-15W: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 0.9 4.0 0.7 ms 5.6 0.2 0.6 0.3 12.0
Simulation, STEP 0.5 0.9 3.9 0.6 ms 5.1 4.2 0.6 0.2 15.3
Simulation, STL 0.5 0.9 3.9 0.6 ms 5.3 0.5 0.6 0.2 11.9
Simulation, OBJ 0.5 0.9 3.8 1 ms 5.3 5.7 0.6 0.3 17.0
Visual, GLB 0.5 0.8 4.0 0.8 ms 11.6 0.2 1.2 0.2 18.5
Visual, OBJ 0.5 0.9 3.8 0.8 ms 11.6 4.6 1.3 0.2 22.9
Board Repo: ucdfs/circuits
Board: LTC6812-15W.kicad_pcb
Folder Kieran Care package / ENNOID_BMS - Slave
Complexity 344 / 1000 (size 244, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 246, 1,418, 64
Triangles, simulation 1,384,100 in 280 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 47 MB 609 MB
STEP 260 MB 713 MB
STL 69 MB 589 MB
OBJ 142 MB 965 MB
Visual
GLB 39 MB 703 MB
OBJ 116 MB 892 MB

2948. TSAL

TSAL: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 21 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.1 6.8 0.6 ms 5.5 0.2 0.7 0.3 15.1
Simulation, STEP 0.3 1.0 6.4 1.0 ms 5.8 4.1 0.8 0.3 18.9
Simulation, STL 0.3 1.1 6.6 0.5 ms 5.6 0.4 0.8 0.3 15.2
Simulation, OBJ 0.4 1.1 6.7 0.6 ms 5.7 7.7 0.8 0.2 22.8
Visual, GLB 0.4 1.0 6.8 2 ms 10.9 0.1 1.3 0.2 20.7
Visual, OBJ 0.4 1.2 6.8 0.5 ms 10.6 4.4 1.3 0.2 24.9
Board Repo: ucdfs/circuits
Board: TSAL.kicad_pcb
Folder Kieran Care package / NEW_TSAL_KR
Complexity 259 / 1000 (size 174, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 99, 613, 23
Triangles, simulation 1,575,932 in 88 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 53 MB 665 MB
STEP 220 MB 773 MB
STL 79 MB 666 MB
OBJ 160 MB 1.1 GB
Visual
GLB 30 MB 781 MB
OBJ 92 MB 730 MB

2949. PDU_KR

PDU_KR: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 5.1 s. Simulation, STEP takes 6.9 s. Simulation, STL takes 4.8 s. Simulation, OBJ takes 7.6 s. Visual, GLB takes 7.3 s. Visual, OBJ takes 8.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 2.3 0.3 ms 1.5 97 ms 0.3 0.3 5.1
Simulation, STEP 0.3 0.4 2.3 0.5 ms 1.6 1.7 0.3 0.3 6.9
Simulation, STL 0.2 0.4 2.1 0.2 ms 1.6 0.1 0.3 0.2 4.8
Simulation, OBJ 0.2 0.4 2.4 0.2 ms 1.6 2.6 0.3 0.2 7.6
Visual, GLB 0.2 0.4 2.5 0.3 ms 3.5 49 ms 0.5 0.2 7.3
Visual, OBJ 0.2 0.4 2.3 0.3 ms 3.4 1.5 0.5 0.3 8.6
Board Repo: ucdfs/circuits
Board: PDU_KR.kicad_pcb
Folder Kieran Care package / PDU_KR
Complexity 206 / 1000 (size 136, features 70)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 44, 114, 0
Triangles, simulation 502,746 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 323 MB
STEP 87 MB 337 MB
STL 25 MB 296 MB
OBJ 51 MB 385 MB
Visual
GLB 10 MB 326 MB
OBJ 30 MB 328 MB

2950. Pre-charge KiCAD

Pre-charge KiCAD: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 6.9 s. Simulation, STEP takes 8.8 s. Simulation, STL takes 7.0 s. Simulation, OBJ takes 10 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.5 3.1 0.3 ms 2.2 0.1 0.4 0.2 6.9
Simulation, STEP 0.3 0.5 3.2 0.3 ms 2.1 2.0 0.4 0.2 8.8
Simulation, STL 0.3 0.6 3.1 0.3 ms 2.2 0.2 0.4 0.2 7.0
Simulation, OBJ 0.3 0.5 3.0 0.3 ms 2.2 3.7 0.5 0.2 10.4
Visual, GLB 0.3 0.6 3.2 0.4 ms 5.1 76 ms 0.6 0.2 10.1
Visual, OBJ 0.3 0.6 3.2 0.3 ms 4.7 2.5 0.7 0.3 12.3
Board Repo: ucdfs/circuits
Board: Pre-charge KiCAD.kicad_pcb
Folder Kieran Care package / Pre-charge_KR
Complexity 264 / 1000 (size 154, features 110)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 51, 274, 13
Triangles, simulation 666,692 in 42 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 359 MB
STEP 102 MB 419 MB
STL 33 MB 365 MB
OBJ 67 MB 478 MB
Visual
GLB 15 MB 372 MB
OBJ 43 MB 443 MB

2951. Breakout

Breakout: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 5.0 0.4 ms 3.9 0.2 0.5 0.2 11.0
Simulation, STEP 0.3 0.8 5.1 0.6 ms 3.8 3.0 0.5 0.2 13.7
Simulation, STL 0.3 0.8 4.8 0.4 ms 3.7 0.3 0.5 0.2 10.7
Simulation, OBJ 0.3 0.8 4.8 0.4 ms 3.7 5.8 0.6 0.2 16.1
Visual, GLB 0.3 0.8 5.0 0.4 ms 7.2 0.1 0.8 0.2 14.5
Visual, OBJ 0.3 0.8 5.0 0.4 ms 7.2 3.4 0.9 0.2 17.9
Board Repo: ucdfs/circuits
Board: Breakout.kicad_pcb
Folder Kieran Care package / Teensy 4.1 Breakout Board
Complexity 235 / 1000 (size 150, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 53, 218, 6
Triangles, simulation 1,096,444 in 107 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 507 MB
STEP 155 MB 559 MB
STL 55 MB 481 MB
OBJ 110 MB 747 MB
Visual
GLB 22 MB 521 MB
OBJ 67 MB 590 MB

2952. Voltage_Measurement_KR

Voltage_Measurement_KR: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 6.1 s. Simulation, STEP takes 8.1 s. Simulation, STL takes 6.2 s. Simulation, OBJ takes 9.7 s. Visual, GLB takes 9.0 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.6 0.4 ms 2.0 96 ms 0.4 0.3 6.1
Simulation, STEP 0.2 0.5 2.7 0.4 ms 1.9 2.0 0.4 0.2 8.1
Simulation, STL 0.2 0.5 2.7 0.8 ms 2.1 0.2 0.4 0.2 6.2
Simulation, OBJ 0.2 0.5 2.7 0.4 ms 2.2 3.3 0.4 0.2 9.7
Visual, GLB 0.2 0.6 2.8 0.6 ms 4.6 63 ms 0.6 0.2 9.0
Visual, OBJ 0.3 0.5 2.8 0.5 ms 4.5 2.0 0.7 0.3 11.1
Board Repo: ucdfs/circuits
Board: Voltage_Measurement_KR.kicad_pcb
Folder Kieran Care package / Voltage_Measurement_KR
Complexity 235 / 1000 (size 150, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 52, 225, 7
Triangles, simulation 638,094 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 361 MB
STEP 92 MB 393 MB
STL 32 MB 367 MB
OBJ 64 MB 457 MB
Visual
GLB 14 MB 421 MB
OBJ 41 MB 431 MB

2953. flightcontroller

flightcontroller: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 32 s. Visual, GLB takes 29 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.0 7.4 0.6 ms 8.7 0.4 1.1 0.3 20.6
Simulation, STEP 0.9 2.1 7.1 0.6 ms 8.2 6.6 1.0 0.3 26.2
Simulation, STL 0.8 2.1 6.8 0.9 ms 9.0 0.8 1.1 0.2 20.9
Simulation, OBJ 0.8 2.1 7.2 0.6 ms 8.5 12.0 1.1 0.3 32.0
Visual, GLB 0.8 2.0 7.2 0.6 ms 16.3 0.2 2.0 0.3 28.8
Visual, OBJ 0.8 2.1 7.3 0.7 ms 15.8 8.1 2.3 0.2 36.7
Board Repo: ukinori/flightcontroller
Board: flightcontroller.kicad_pcb
Complexity 348 / 1000 (size 263, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 129, 3,528, 249
Triangles, simulation 2,284,130 in 154 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 807 MB
STEP 366 MB 1.0 GB
STL 114 MB 811 MB
OBJ 238 MB 1.5 GB
Visual
GLB 52 MB 963 MB
OBJ 162 MB 1.1 GB

2954. uECG_v4_5

uECG_v4_5: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 8.4 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 2.8 0.6 ms 3.8 0.1 0.4 0.3 8.4
Simulation, STEP 0.3 0.6 2.7 0.5 ms 3.8 2.5 0.4 0.2 10.6
Simulation, STL 0.3 0.6 2.6 0.4 ms 3.9 0.2 0.4 0.2 8.2
Simulation, OBJ 0.2 0.7 2.6 0.4 ms 3.9 3.5 0.4 0.3 11.5
Visual, GLB 0.2 0.7 2.7 0.4 ms 7.2 0.1 0.9 0.3 12.1
Visual, OBJ 0.2 0.7 2.6 0.6 ms 7.2 3.1 0.9 0.2 14.9
Board Repo: ultimaterobotics/uECG_pcb
Board: uECG_v4_5.kicad_pcb
Folder uECG_v4_5
Complexity 273 / 1000 (size 218, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 67, 730, 138
Triangles, simulation 725,870 in 100 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 389 MB
STEP 126 MB 492 MB
STL 36 MB 388 MB
OBJ 73 MB 541 MB
Visual
GLB 23 MB 568 MB
OBJ 68 MB 571 MB

2955. uECG_v4_52_lsm_tlv

uECG_v4_52_lsm_tlv: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.7 s. Simulation, STL takes 7.1 s. Simulation, OBJ takes 11 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.5 0.4 ms 3.2 0.1 0.4 0.2 7.4
Simulation, STEP 0.3 0.7 2.4 0.3 ms 3.3 2.4 0.4 0.2 9.7
Simulation, STL 0.3 0.7 2.4 0.3 ms 3.0 0.2 0.4 0.2 7.1
Simulation, OBJ 0.3 0.7 2.4 0.3 ms 3.3 3.6 0.4 0.2 11.0
Visual, GLB 0.3 0.7 2.7 0.3 ms 5.9 95 ms 0.5 0.2 10.4
Visual, OBJ 0.3 0.7 2.5 0.5 ms 5.9 3.2 0.5 0.2 13.2
Board Repo: ultimaterobotics/uECG_pcb
Board: uECG_v4_52_lsm_tlv.kicad_pcb
Folder uECG_v4_52_lsm_tlv
Complexity 310 / 1000 (size 220, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 71, 814, 147
Triangles, simulation 754,512 in 97 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 390 MB
STEP 140 MB 483 MB
STL 38 MB 394 MB
OBJ 77 MB 525 MB
Visual
GLB 23 MB 570 MB
OBJ 69 MB 528 MB

2956. NanoS3_Carrier

NanoS3_Carrier: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 5.7 s. Simulation, STEP takes 7.2 s. Simulation, STL takes 5.6 s. Simulation, OBJ takes 8.6 s. Visual, GLB takes 8.8 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.4 ms 2.0 0.1 0.3 0.3 5.7
Simulation, STEP 0.2 0.5 2.3 0.2 ms 1.9 1.7 0.3 0.2 7.2
Simulation, STL 0.2 0.5 2.3 0.3 ms 2.0 0.2 0.3 0.2 5.6
Simulation, OBJ 0.2 0.5 2.4 0.3 ms 2.1 2.9 0.4 0.2 8.6
Visual, GLB 0.2 0.5 2.4 0.3 ms 4.8 69 ms 0.6 0.3 8.8
Visual, OBJ 0.2 0.5 2.4 0.3 ms 4.5 2.1 0.6 0.2 10.6
Board Repo: UnexpectedMaker/esp32s3
Board: NanoS3_Carrier.kicad_pcb
Folder kicad / NanoS3 Carrier
Complexity 267 / 1000 (size 152, features 115)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 20, 255, 83
Triangles, simulation 547,766 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 306 MB
STEP 102 MB 347 MB
STL 27 MB 319 MB
OBJ 56 MB 427 MB
Visual
GLB 14 MB 364 MB
OBJ 43 MB 382 MB

2957. OMGS3_Carrier_R1

OMGS3_Carrier_R1: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 3.8 s. Simulation, STEP takes 4.9 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.2 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 6.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.6 0.3 ms 1.3 63 ms 0.2 0.2 3.8
Simulation, STEP 0.2 0.3 1.4 0.2 ms 1.3 1.3 0.2 0.2 4.9
Simulation, STL 0.2 0.3 1.4 0.3 ms 1.2 87 ms 0.2 0.2 3.5
Simulation, OBJ 0.2 0.4 1.5 0.2 ms 1.2 1.6 0.3 0.2 5.2
Visual, GLB 0.2 0.4 1.6 0.2 ms 3.1 42 ms 0.4 0.2 5.9
Visual, OBJ 0.2 0.3 1.5 0.5 ms 2.9 1.3 0.3 0.2 6.8
Board Repo: UnexpectedMaker/esp32s3
Board: OMGS3_Carrier_R1.kicad_pcb
Folder kicad / OMGS3 Carrier
Complexity 269 / 1000 (size 144, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 15, 134, 80
Triangles, simulation 353,816 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 259 MB
STEP 52 MB 290 MB
STL 18 MB 252 MB
OBJ 36 MB 292 MB
Visual
GLB 8.9 MB 278 MB
OBJ 26 MB 279 MB

2958. EdgeS3D_Carrier_P1

EdgeS3D_Carrier_P1: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 8.3 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.0 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.3 0.3 ms 3.2 0.1 0.4 0.2 8.3
Simulation, STEP 0.2 0.7 3.2 0.3 ms 3.0 2.3 0.5 0.2 10.1
Simulation, STL 0.2 0.6 3.3 0.3 ms 3.0 0.2 0.4 0.2 8.0
Simulation, OBJ 0.2 0.7 3.3 0.8 ms 3.3 4.1 0.5 0.2 12.4
Visual, GLB 0.2 0.7 3.4 0.3 ms 6.7 95 ms 0.7 0.2 12.1
Visual, OBJ 0.2 0.7 3.5 0.5 ms 6.8 3.1 0.7 0.2 15.2
Board Repo: UnexpectedMaker/esp32s3
Board: EdgeS3D_Carrier_P1.kicad_pcb
Folder series_d / KiCAD / EdgeS3D_Carrier_P1
Complexity 257 / 1000 (size 157, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 15, 338, 160
Triangles, simulation 769,534 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 378 MB
STEP 126 MB 465 MB
STL 38 MB 398 MB
OBJ 79 MB 556 MB
Visual
GLB 21 MB 527 MB
OBJ 64 MB 529 MB

2959. armory

armory: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 45 s. Simulation, STL takes 38 s. Simulation, OBJ takes 58 s. Visual, GLB takes 54 s. Visual, OBJ takes 64 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.9 14.4 0.5 ms 14.2 0.7 2.0 0.3 36.2
Simulation, STEP 0.6 4.0 14.9 1 ms 14.4 8.9 2.0 0.3 45.0
Simulation, STL 0.7 4.1 14.8 1 ms 14.6 1.4 2.2 0.3 38.1
Simulation, OBJ 0.7 4.1 14.3 0.5 ms 14.7 21.4 2.4 0.4 57.9
Visual, GLB 0.6 4.4 15.1 0.7 ms 28.6 0.4 4.2 0.3 53.6
Visual, OBJ 0.7 4.3 14.7 0.5 ms 27.7 11.7 4.7 0.3 64.1
Board Repo: usbarmory/usbarmory
Board: armory.kicad_pcb
Folder hardware / mark-one
Complexity 339 / 1000 (size 294, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 8
File format KiCad 3 (3)
Parts, tracks, vias 174, 2,408, 337
Triangles, simulation 4,039,766 in 144 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 140 MB 1.2 GB
STEP 558 MB 1.4 GB
STL 202 MB 1.1 GB
OBJ 443 MB 2.7 GB
Visual
GLB 75 MB 1.4 GB
OBJ 240 MB 1.6 GB

2960. armory

armory: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 56 s. Simulation, STL takes 46 s. Simulation, OBJ takes 71 s. Visual, GLB takes 70 s. Visual, OBJ takes 82 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 4.7 15.4 0.9 ms 18.5 0.9 2.5 0.4 44.0
Simulation, STEP 1.6 4.8 15.0 2 ms 19.0 11.9 2.8 0.4 55.6
Simulation, STL 1.6 4.8 15.4 0.9 ms 19.3 2.2 2.6 0.3 46.2
Simulation, OBJ 1.7 4.7 14.7 2 ms 18.9 27.5 2.7 0.4 70.6
Visual, GLB 2.1 5.6 15.4 2 ms 40.4 0.4 5.4 0.3 69.6
Visual, OBJ 1.7 5.1 15.4 1 ms 39.7 14.2 5.8 0.3 82.2
Board Repo: usbarmory/usbarmory
Board: armory.kicad_pcb
Folder hardware / mark-two-beta
Complexity 400 / 1000 (size 320, features 80)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 180, 18,286, 423
Triangles, simulation 5,129,354 in 434 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 178 MB 1.5 GB
STEP 738 MB 1.8 GB
STL 257 MB 1.5 GB
OBJ 553 MB 3.3 GB
Visual
GLB 94 MB 1.6 GB
OBJ 302 MB 2.0 GB

2961. accessory

accessory: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.2 s. Simulation, STL takes 7.4 s. Simulation, OBJ takes 11 s. Visual, GLB takes 11 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.9 0.3 ms 2.9 0.1 0.4 0.2 7.4
Simulation, STEP 0.2 0.7 2.8 0.3 ms 2.6 2.2 0.4 0.2 9.2
Simulation, STL 0.3 0.7 2.9 0.3 ms 2.7 0.2 0.4 0.2 7.4
Simulation, OBJ 0.2 0.8 2.9 0.7 ms 2.9 3.8 0.4 0.2 11.3
Visual, GLB 0.2 0.9 2.8 0.5 ms 6.2 88 ms 0.8 0.2 11.1
Visual, OBJ 0.2 0.7 3.0 0.4 ms 6.5 3.0 0.8 0.3 14.5
Board Repo: usbarmory/usbarmory
Board: accessory.kicad_pcb
Folder hardware / mark-two-debug-accessory
Complexity 278 / 1000 (size 213, features 65)
KESE features through vias, slotted holes,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 37, 609, 80
Triangles, simulation 714,356 in 80 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 388 MB
STEP 122 MB 480 MB
STL 36 MB 397 MB
OBJ 73 MB 517 MB
Visual
GLB 20 MB 493 MB
OBJ 61 MB 496 MB

2962. armory

armory: stages 4 and 6 take 44% to 81% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 42 s. Simulation, STL takes 32 s. Simulation, OBJ takes 55 s. Visual, GLB takes 52 s. Visual, OBJ takes 65 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 3.7 9.9 1 ms 13.3 0.7 2.1 0.4 31.7
Simulation, STEP 1.5 4.1 10.7 1 ms 13.4 9.6 2.0 0.3 41.6
Simulation, STL 1.5 3.9 9.7 1 ms 13.1 1.2 1.9 0.3 31.7
Simulation, OBJ 1.4 3.9 10.4 1 ms 13.9 23.3 2.3 0.3 55.5
Visual, GLB 1.6 4.0 10.0 1 ms 32.2 0.4 3.8 0.3 52.3
Visual, OBJ 1.5 4.0 10.6 1 ms 31.7 13.3 3.7 0.3 65.1
Board Repo: usbarmory/usbarmory
Board: armory.kicad_pcb
Folder hardware / mark-two-lan
Complexity 445 / 1000 (size 320, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 194, 17,001, 371
Triangles, simulation 3,979,384 in 422 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 136 MB 1.1 GB
STEP 616 MB 1.4 GB
STL 199 MB 1.1 GB
OBJ 426 MB 2.6 GB
Visual
GLB 75 MB 1.4 GB
OBJ 242 MB 1.7 GB

2963. armory

armory: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 49 s. Simulation, STL takes 40 s. Simulation, OBJ takes 60 s. Visual, GLB takes 59 s. Visual, OBJ takes 70 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.0 13.6 0.8 ms 16.6 1.0 2.4 0.3 39.2
Simulation, STEP 1.3 4.0 13.5 1 ms 16.8 10.7 2.4 0.3 49.0
Simulation, STL 1.4 4.1 13.4 1 ms 16.5 1.9 2.6 0.3 40.2
Simulation, OBJ 1.3 3.8 12.9 1.0 ms 16.5 22.5 2.7 0.4 60.2
Visual, GLB 1.4 4.0 13.0 2 ms 34.5 0.5 5.0 0.3 58.7
Visual, OBJ 1.3 3.9 13.4 1 ms 33.8 12.2 5.2 0.3 70.0
Board Repo: usbarmory/usbarmory
Board: armory.kicad_pcb
Folder hardware / mark-two
Complexity 400 / 1000 (size 320, features 80)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 180, 17,717, 431
Triangles, simulation 5,187,220 in 436 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 179 MB 1.4 GB
STEP 751 MB 1.7 GB
STL 259 MB 1.7 GB
OBJ 559 MB 3.3 GB
Visual
GLB 94 MB 1.8 GB
OBJ 304 MB 2.0 GB

2964. milight-hub-base

milight-hub-base: stages 4 and 6 take 47% to 76% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.0 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.2 ms 0.8 35 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.7 0.3 ms 0.8 1.0 0.1 0.2 3.1
Simulation, STL 0.1 0.2 0.7 0.2 ms 0.7 47 ms 95 ms 0.2 2.0
Simulation, OBJ 0.1 0.2 0.7 0.2 ms 0.7 0.9 0.1 0.2 2.9
Visual, GLB 0.1 0.2 0.6 0.2 ms 1.7 27 ms 0.2 0.2 3.1
Visual, OBJ 0.1 0.2 0.6 0.2 ms 1.7 0.7 0.2 0.2 3.7
Board Repo: usimd/milight-hub
Board: milight-hub-base.kicad_pcb
Complexity 248 / 1000 (size 143, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 23, 110, 55
Triangles, simulation 233,428 in 36 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.1 MB 230 MB
STEP 39 MB 249 MB
STL 12 MB 239 MB
OBJ 24 MB 240 MB
Visual
GLB 6.2 MB 208 MB
OBJ 18 MB 208 MB

2965. uCM4

uCM4: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 6.7 s. Simulation, STEP takes 8.6 s. Simulation, STL takes 6.5 s. Simulation, OBJ takes 10 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.3 0.8 ms 2.6 0.1 0.5 0.2 6.7
Simulation, STEP 0.3 0.6 2.3 0.6 ms 2.5 2.2 0.5 0.2 8.6
Simulation, STL 0.3 0.6 2.3 0.5 ms 2.5 0.2 0.4 0.2 6.5
Simulation, OBJ 0.4 0.6 2.2 0.6 ms 2.8 3.5 0.5 0.2 10.2
Visual, GLB 0.3 0.6 2.3 0.5 ms 6.4 92 ms 0.7 0.2 10.6
Visual, OBJ 0.3 0.6 2.3 0.5 ms 6.2 3.1 0.7 0.2 13.5
Board Repo: v3l0c1r4pt0r/ucm4
Board: uCM4.kicad_pcb
Complexity 285 / 1000 (size 175, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20210228)
Parts, tracks, vias 30, 1,280, 109
Triangles, simulation 649,970 in 177 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 382 MB
STEP 117 MB 417 MB
STL 33 MB 384 MB
OBJ 66 MB 473 MB
Visual
GLB 20 MB 533 MB
OBJ 59 MB 525 MB

2966. bus_breakout

bus_breakout: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 3.8 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 3.9 s. Visual, OBJ takes 4.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 93 ms 0.3 1.2 0.3 ms 0.9 41 ms 0.1 0.2 2.9
Simulation, STEP 90 ms 0.3 1.2 0.2 ms 1.0 1.0 0.1 0.2 3.8
Simulation, STL 89 ms 0.3 1.2 0.2 ms 1.0 59 ms 0.1 0.2 2.9
Simulation, OBJ 96 ms 0.3 1.1 0.2 ms 0.9 1.1 0.2 0.2 3.9
Visual, GLB 97 ms 0.2 1.2 0.2 ms 2.0 21 ms 0.2 0.2 3.9
Visual, OBJ 96 ms 0.2 1.2 0.2 ms 1.9 0.6 0.2 0.2 4.4
Board Repo: vascofazza/8bit-cpu
Board: bus_breakout.kicad_pcb
Folder bus_breakout
Complexity 124 / 1000 (size 104, features 20)
KESE features copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 4, 72, 0
Triangles, simulation 248,268 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.6 MB 227 MB
STEP 43 MB 235 MB
STL 12 MB 226 MB
OBJ 25 MB 227 MB
Visual
GLB 5.1 MB 203 MB
OBJ 15 MB 202 MB

2967. arduino_eeprom_programmer

arduino_eeprom_programmer: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.1 4.4 0.3 ms 3.2 0.1 0.5 0.2 10.0
Simulation, STEP 0.6 1.0 4.4 0.2 ms 3.3 2.8 0.5 0.2 12.8
Simulation, STL 0.6 1.1 4.6 0.5 ms 3.2 0.3 0.5 0.2 10.4
Simulation, OBJ 0.6 1.0 4.4 0.3 ms 3.2 5.5 0.5 0.3 15.4
Visual, GLB 0.6 1.0 4.5 0.4 ms 7.7 0.1 1.0 0.2 15.1
Visual, OBJ 0.6 1.0 4.5 0.4 ms 7.9 3.9 1.0 0.3 19.2
Board Repo: vascofazza/8bit-cpu
Board: arduino_eeprom_programmer.kicad_pcb
Folder eeprom_programmer / arduino_eeprom_programmer
Complexity 191 / 1000 (size 136, features 55)
KESE features through vias, filled zones,
copper drawings, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 317, 4
Triangles, simulation 926,940 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 418 MB
STEP 177 MB 482 MB
STL 46 MB 409 MB
OBJ 95 MB 669 MB
Visual
GLB 22 MB 526 MB
OBJ 64 MB 533 MB

2968. display_interface

display_interface: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 9.5 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.0 4.2 0.6 ms 3.0 0.1 0.5 0.2 9.5
Simulation, STEP 0.4 1.0 4.0 0.3 ms 3.0 2.5 0.4 0.2 11.6
Simulation, STL 0.5 0.9 3.9 0.3 ms 3.1 0.2 0.5 0.3 9.4
Simulation, OBJ 0.6 1.1 4.2 0.3 ms 3.0 4.1 0.5 0.3 13.7
Visual, GLB 0.4 1.0 4.1 0.4 ms 7.3 94 ms 1.0 0.2 14.0
Visual, OBJ 0.5 1.0 4.5 0.3 ms 7.1 3.0 1.2 0.3 17.6
Board Repo: vascofazza/8bit-cpu
Board: display_interface.kicad_pcb
Folder helix_display_interface / display_interface
Complexity 227 / 1000 (size 147, features 80)
KESE features through vias, custom pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 10, 554, 5
Triangles, simulation 871,560 in 43 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 384 MB
STEP 172 MB 461 MB
STL 44 MB 389 MB
OBJ 90 MB 636 MB
Visual
GLB 21 MB 483 MB
OBJ 63 MB 529 MB

2969. 8bit-computer

8bit-computer: stages 4 and 6 take 58% to 89% of a run. Simulation, GLB takes 4 min. Simulation, STEP takes 5 min. Simulation, STL takes 4 min. Simulation, OBJ takes 6 min. Visual, GLB takes 6 min. Visual, OBJ takes 7 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.6 15.3 109.1 4 ms 83.3 3.4 12.6 0.6 226.7
Simulation, STEP 2.8 15.7 112.8 3 ms 84.7 50.1 12.8 0.6 279.4
Simulation, STL 2.8 15.8 112.0 3 ms 84.4 7.6 13.0 0.6 236.3
Simulation, OBJ 3.0 16.3 114.0 2 ms 84.3 110.7 12.8 0.5 341.7
Visual, GLB 2.8 16.0 113.4 3 ms 192.7 1.7 17.2 0.4 344.2
Visual, OBJ 2.8 16.1 113.3 3 ms 195.3 60.9 17.3 0.5 406.1
Board Repo: vascofazza/8bit-cpu
Board: 8bit-computer.kicad_pcb
Folder MK1_CPU / 8bit-computer
Complexity 387 / 1000 (size 287, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 328, 11,197, 441
Triangles, simulation 15,245,230 in 586 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 527 MB 3.5 GB
STEP 2.9 GB 4.9 GB
STL 762 MB 3.3 GB
OBJ 1.7 GB 9.8 GB
Visual
GLB 328 MB 5.1 GB
OBJ 1.0 GB 6.5 GB

2970. programming_interface

programming_interface: stages 4 and 6 take 57% to 82% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 14 s. Visual, GLB takes 15 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.9 4.7 0.5 ms 3.2 0.1 0.5 0.2 10.0
Simulation, STEP 0.4 0.9 4.9 0.3 ms 3.4 2.7 0.4 0.2 13.0
Simulation, STL 0.4 1.0 4.7 0.4 ms 3.3 0.3 0.5 0.3 10.5
Simulation, OBJ 0.4 0.9 4.9 0.5 ms 3.4 4.2 0.4 0.2 14.4
Visual, GLB 0.4 1.0 5.3 0.5 ms 7.3 0.1 1.1 0.2 15.4
Visual, OBJ 0.4 1.0 5.1 0.5 ms 6.8 2.7 0.8 0.2 16.9
Board Repo: vascofazza/8bit-cpu
Board: programming_interface.kicad_pcb
Folder start9_programming_interface / programming_interface
Complexity 247 / 1000 (size 192, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 13, 631, 11
Triangles, simulation 1,047,248 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 431 MB
STEP 199 MB 520 MB
STL 52 MB 452 MB
OBJ 108 MB 749 MB
Visual
GLB 23 MB 578 MB
OBJ 69 MB 578 MB

2971. omower

omower: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 71 s. Simulation, STEP takes 84 s. Simulation, STL takes 74 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 7.9 32.9 1 ms 24.3 1.3 2.9 0.4 70.9
Simulation, STEP 1.2 8.0 32.7 1 ms 24.0 15.2 2.8 0.4 84.3
Simulation, STL 1.2 7.7 34.4 1 ms 24.7 2.4 3.1 0.3 74.0
Simulation, OBJ 1.2 8.6 33.7 1 ms 25.0 34.9 3.0 0.3 106.7
Visual, GLB 1.2 7.9 33.7 1 ms 60.0 0.6 6.2 0.3 109.9
Visual, OBJ 1.3 8.1 33.2 1 ms 57.9 19.6 6.3 0.3 126.7
Board Repo: vasimv/omower
Board: omower.kicad_pcb
Folder hardware / OMower
Complexity 337 / 1000 (size 282, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 402, 4,619, 537
Triangles, simulation 5,924,968 in 351 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 207 MB 1.4 GB
STEP 824 MB 1.9 GB
STL 296 MB 1.5 GB
OBJ 642 MB 3.9 GB
Visual
GLB 114 MB 1.8 GB
OBJ 362 MB 2.5 GB

2972. BLDC_4

BLDC_4: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 24 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.4 4.7 0.7 ms 5.2 0.3 0.8 0.3 13.1
Simulation, STEP 0.4 1.5 4.8 0.5 ms 5.1 3.5 0.8 0.3 16.4
Simulation, STL 0.5 1.4 4.6 0.7 ms 5.3 0.5 0.8 0.2 13.3
Simulation, OBJ 0.4 1.5 4.7 0.5 ms 5.2 7.5 0.7 0.2 20.3
Visual, GLB 0.4 1.3 4.6 0.6 ms 15.4 0.2 1.5 0.3 23.8
Visual, OBJ 0.4 1.5 4.9 0.8 ms 15.5 5.4 1.8 0.3 29.8
Board Repo: vedderb/bldc-hardware
Board: BLDC_4.kicad_pcb
Folder design
Complexity 303 / 1000 (size 258, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 117, 1,671, 187
Triangles, simulation 1,473,188 in 129 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 623 MB
STEP 222 MB 636 MB
STL 74 MB 620 MB
OBJ 153 MB 1.0 GB
Visual
GLB 36 MB 702 MB
OBJ 108 MB 786 MB

2973. VB-IoT1_v1

VB-IoT1_v1: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 38 s. Simulation, STEP takes 48 s. Simulation, STL takes 40 s. Simulation, OBJ takes 62 s. Visual, GLB takes 67 s. Visual, OBJ takes 82 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.9 13.3 0.7 ms 15.8 0.9 2.1 0.3 38.4
Simulation, STEP 1.0 4.9 13.5 1 ms 16.0 10.4 2.2 0.3 48.3
Simulation, STL 1.1 4.9 13.5 0.8 ms 16.7 1.5 2.2 0.3 40.1
Simulation, OBJ 1.0 5.1 13.7 0.7 ms 15.9 23.2 2.5 0.3 61.7
Visual, GLB 1.0 4.9 13.6 0.7 ms 41.8 0.5 5.2 0.3 67.4
Visual, OBJ 1.0 5.0 13.3 0.7 ms 39.4 17.0 5.9 0.3 81.9
Board Repo: venseytech/VB-IoT1
Board: VB-IoT1_v1.kicad_pcb
Folder VB-IoT1_v1
Complexity 336 / 1000 (size 281, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 175, 5,166, 533
Triangles, simulation 4,269,758 in 267 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 148 MB 1.3 GB
STEP 710 MB 1.7 GB
STL 214 MB 1.3 GB
OBJ 457 MB 2.7 GB
Visual
GLB 111 MB 1.8 GB
OBJ 350 MB 2.3 GB

2974. MicroZed_carrier_board_v4

MicroZed_carrier_board_v4: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 39 s. Visual, GLB takes 35 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 3.3 9.5 1.0 ms 9.6 0.5 1.4 0.3 25.0
Simulation, STEP 0.4 3.1 9.2 1 ms 9.7 6.1 1.3 0.2 30.2
Simulation, STL 0.4 2.9 9.3 1 ms 10.1 1.1 1.4 0.2 25.5
Simulation, OBJ 0.4 3.0 8.8 1 ms 10.0 15.4 1.3 0.2 39.3
Visual, GLB 0.4 3.3 9.0 1 ms 19.6 0.3 2.7 0.2 35.5
Visual, OBJ 0.5 3.1 9.1 1 ms 19.4 7.9 3.2 0.2 43.3
Board Repo: viktor-nikolov/microzed-carrier-board
Board: MicroZed_carrier_board_v4.kicad_pcb
Folder KiCad_and_production_files
Complexity 312 / 1000 (size 222, features 90)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 91, 1,904, 296
Triangles, simulation 3,634,492 in 225 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 120 MB 995 MB
STEP 370 MB 1.3 GB
STL 182 MB 1.0 GB
OBJ 379 MB 2.3 GB
Visual
GLB 63 MB 1.3 GB
OBJ 197 MB 1.4 GB

2975. vimdrones_esc_development_board

Stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 20 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 5.4 0.6 ms 5.5 0.3 0.7 0.3 14.3
Simulation, STEP 0.8 1.6 5.7 0.5 ms 5.7 3.8 0.6 0.2 18.4
Simulation, STL 0.4 1.4 5.0 0.4 ms 5.6 0.6 0.7 0.3 13.9
Simulation, OBJ 0.4 1.5 5.2 0.4 ms 5.3 7.7 0.6 0.2 20.9
Visual, GLB 0.4 1.5 5.4 0.4 ms 11.3 0.1 1.2 0.2 20.1
Visual, OBJ 0.5 1.5 5.5 0.4 ms 10.1 4.7 1.6 0.3 24.1
Board Repo: VimDrones/AM32_esc_development_board
Board: vimdrones_esc_development_board.kicad_pcb
Complexity 366 / 1000 (size 241, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 82, 650, 292
Triangles, simulation 1,569,380 in 81 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 53 MB 564 MB
STEP 211 MB 712 MB
STL 78 MB 564 MB
OBJ 161 MB 1.0 GB
Visual
GLB 32 MB 682 MB
OBJ 96 MB 740 MB

2976. Tangenta

Tangenta: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 8.9 35.3 5 ms 63.1 1.8 4.9 0.3 116.6
Simulation, STEP 2.1 8.7 35.1 3 ms 62.5 26.2 4.9 0.4 139.7
Simulation, STL 2.2 8.7 33.4 3 ms 63.8 3.7 5.3 0.4 117.6
Simulation, OBJ 2.2 8.9 34.8 3 ms 62.4 62.7 5.3 0.4 176.8
Visual, GLB 2.3 8.9 35.0 3 ms 89.0 1.1 10.2 0.3 146.9
Visual, OBJ 2.2 9.1 35.3 3 ms 93.0 36.1 12.0 0.3 188.0
Board Repo: vmetodiev/tangenta
Board: Tangenta.kicad_pcb
Folder Tangenta
Complexity 395 / 1000 (size 295, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 559, 7,736, 1,128
Triangles, simulation 10,448,246 in 1043 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 345 MB 2.8 GB
STEP 1.3 GB 3.6 GB
STL 522 MB 2.8 GB
OBJ 1.1 GB 6.5 GB
Visual
GLB 219 MB 3.5 GB
OBJ 719 MB 4.3 GB

2977. CM4_MATX

CM4_MATX: stages 4 and 6 take 56% to 87% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 35 s. Simulation, STL takes 28 s. Simulation, OBJ takes 41 s. Visual, GLB takes 36 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.2 12.2 1 ms 11.0 0.4 1.1 0.3 27.7
Simulation, STEP 0.3 2.2 12.1 2 ms 11.4 7.4 1.2 0.3 34.9
Simulation, STL 0.4 2.2 11.9 2 ms 11.7 0.9 1.1 0.3 28.4
Simulation, OBJ 0.3 2.2 11.6 2 ms 11.2 13.9 1.1 0.3 40.7
Visual, GLB 0.3 2.1 11.8 2 ms 19.7 0.2 1.8 0.2 36.1
Visual, OBJ 0.4 2.3 12.0 2 ms 20.1 7.6 2.1 0.2 44.8
Board Repo: volkertb/CM4_MATX
Board: CM4_MATX.kicad_pcb
Folder KiCad
Complexity 111 / 1000 (size 101, features 10)
KESE features curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 31, 0, 0
Triangles, simulation 2,451,152 in 596 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 747 MB
STEP 273 MB 987 MB
STL 123 MB 741 MB
OBJ 259 MB 1.6 GB
Visual
GLB 46 MB 996 MB
OBJ 142 MB 1.1 GB

2978. altair-8800b-cpu-card

altair-8800b-cpu-card: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 41 s. Simulation, STL takes 33 s. Simulation, OBJ takes 53 s. Visual, GLB takes 46 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 3.2 14.4 2 ms 12.5 0.7 1.7 0.3 33.4
Simulation, STEP 0.6 2.9 14.4 1 ms 12.2 8.7 1.7 0.3 40.7
Simulation, STL 0.6 2.9 13.6 1 ms 12.5 1.1 1.6 0.3 32.6
Simulation, OBJ 0.6 2.9 14.3 1 ms 12.5 20.2 1.8 0.3 52.5
Visual, GLB 0.6 3.0 14.4 1 ms 24.5 0.3 2.8 0.2 45.8
Visual, OBJ 0.6 2.9 14.1 1 ms 24.4 11.9 3.3 0.2 57.4
Board Repo: warmech/altair-8800b-cpu-card
Board: altair-8800b-cpu-card.kicad_pcb
Folder cad
Complexity 261 / 1000 (size 201, features 60)
KESE features through vias, filled zones,
curved board outline,
TrueType text
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 136, 2,087, 314
Triangles, simulation 3,660,442 in 245 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 123 MB 1.2 GB
STEP 486 MB 1.5 GB
STL 183 MB 1.2 GB
OBJ 382 MB 3.0 GB
Visual
GLB 75 MB 1.4 GB
OBJ 236 MB 2.0 GB

2979. altair-8800b-display-control-pcb

Stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 61 s. Simulation, STEP takes 77 s. Simulation, STL takes 63 s. Simulation, OBJ takes 93 s. Visual, GLB takes 92 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 5.4 26.3 2 ms 23.1 0.9 4.1 0.3 60.8
Simulation, STEP 0.7 5.5 27.4 2 ms 23.2 15.3 4.2 0.3 76.6
Simulation, STL 0.8 5.3 26.5 2 ms 23.2 2.1 4.7 0.4 62.9
Simulation, OBJ 0.8 5.6 26.7 2 ms 23.7 31.5 3.9 0.4 92.5
Visual, GLB 0.8 5.2 27.1 3 ms 51.7 0.5 7.0 0.3 92.5
Visual, OBJ 0.8 5.1 26.6 2 ms 49.0 17.2 7.5 0.3 106.7
Board Repo: warmech/altair-8800b-display-control-pcb
Board: altair-8800b-display-control-pcb.kicad_pcb
Folder cad
Complexity 250 / 1000 (size 215, features 35)
KESE features through vias, slotted holes,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 231, 3,782, 372
Triangles, simulation 5,441,458 in 443 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 182 MB 1.5 GB
STEP 841 MB 2.1 GB
STL 272 MB 1.5 GB
OBJ 572 MB 4.5 GB
Visual
GLB 112 MB 1.9 GB
OBJ 358 MB 2.2 GB

2980. lisa-2mb-ram-card

lisa-2mb-ram-card: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 51 s. Simulation, STEP takes 66 s. Simulation, STL takes 55 s. Simulation, OBJ takes 88 s. Visual, GLB takes 73 s. Visual, OBJ takes 85 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.9 19.6 1.0 ms 20.1 1.1 3.5 0.4 51.5
Simulation, STEP 1.0 5.9 20.2 1 ms 21.2 13.1 3.9 0.4 65.6
Simulation, STL 1.0 6.2 21.1 1 ms 20.6 2.4 3.7 0.4 55.4
Simulation, OBJ 0.9 6.0 20.9 2 ms 21.8 34.5 3.4 0.4 87.8
Visual, GLB 0.9 5.9 20.0 2 ms 40.0 0.5 5.6 0.3 73.1
Visual, OBJ 0.9 6.1 21.1 2 ms 38.4 13.5 5.2 0.3 85.5
Board Repo: warmech/lisa-2mb-ram-card
Board: lisa-2mb-ram-card.kicad_pcb
Folder cad
Complexity 288 / 1000 (size 213, features 75)
KESE features through vias, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 74, 2,945, 150
Triangles, simulation 5,930,502 in 242 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 200 MB 1.5 GB
STEP 693 MB 1.9 GB
STL 297 MB 1.4 GB
OBJ 632 MB 3.7 GB
Visual
GLB 88 MB 1.6 GB
OBJ 281 MB 2.0 GB

2981. cpu-card

cpu-card: stages 4 and 6 take 46% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 4 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.8 12.9 51.9 2 ms 53.2 3.1 8.0 0.5 133.4
Simulation, STEP 3.9 12.5 50.7 2 ms 53.4 37.3 7.6 0.6 166.0
Simulation, STL 3.9 12.5 51.5 2 ms 53.9 5.9 7.7 0.6 136.0
Simulation, OBJ 3.8 13.0 52.7 3 ms 54.3 99.6 7.9 0.6 231.9
Visual, GLB 4.0 12.4 51.0 2 ms 116.6 1.3 10.5 0.5 196.3
Visual, OBJ 4.6 13.8 54.2 3 ms 124.5 46.8 11.2 0.5 255.5
Board Repo: warmech/lisa-cpu-card
Board: cpu-card.kicad_pcb
Folder cad
Complexity 397 / 1000 (size 242, features 155)
KESE features through vias, custom pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 140, 9,460, 1,038
Triangles, simulation 14,992,174 in 395 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 515 MB 3.6 GB
STEP 2.1 GB 4.3 GB
STL 750 MB 3.5 GB
OBJ 1.6 GB 9.5 GB
Visual
GLB 252 MB 4.2 GB
OBJ 830 MB 5.4 GB

2982. altimeter

altimeter: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 21 s. Simulation, STL takes 16 s. Simulation, OBJ takes 26 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.5 5.7 0.5 ms 6.6 0.3 0.9 0.2 15.9
Simulation, STEP 0.6 1.6 5.7 0.6 ms 6.6 5.5 0.9 0.2 21.0
Simulation, STL 0.6 1.5 5.6 0.5 ms 6.4 0.5 0.8 0.2 15.7
Simulation, OBJ 0.6 1.6 5.7 0.4 ms 6.7 10.6 0.9 0.2 26.3
Visual, GLB 0.6 1.8 5.7 0.5 ms 15.3 0.2 1.9 0.2 25.7
Visual, OBJ 0.6 1.7 5.9 0.5 ms 14.7 7.6 1.8 0.3 32.6
Board Repo: waterloo-rocketry/canhw
Board: altimeter.kicad_pcb
Folder altimeter
Complexity 374 / 1000 (size 249, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 137, 1,234, 161
Triangles, simulation 1,893,396 in 162 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 731 MB
STEP 283 MB 849 MB
STL 95 MB 705 MB
OBJ 196 MB 1.3 GB
Visual
GLB 46 MB 868 MB
OBJ 140 MB 979 MB

2983. camera

camera: stages 4 and 6 take 45% to 81% of a run. Simulation, GLB takes 9.0 s. Simulation, STEP takes 12 s. Simulation, STL takes 8.8 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 2.7 0.8 ms 4.0 0.2 0.7 0.3 9.0
Simulation, STEP 0.4 1.0 2.5 0.5 ms 3.9 3.1 0.6 0.2 11.7
Simulation, STL 0.4 0.9 2.5 0.5 ms 3.9 0.3 0.6 0.2 8.8
Simulation, OBJ 0.3 0.9 2.6 0.5 ms 3.9 5.9 0.6 0.2 14.5
Visual, GLB 0.4 0.9 2.7 0.5 ms 8.5 0.1 1.0 0.3 13.8
Visual, OBJ 0.4 0.9 2.7 0.5 ms 8.7 4.4 1.0 0.2 18.3
Board Repo: waterloo-rocketry/canhw
Board: camera.kicad_pcb
Folder camera
Complexity 334 / 1000 (size 234, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 58, 754, 165
Triangles, simulation 1,060,698 in 133 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 457 MB
STEP 147 MB 576 MB
STL 53 MB 457 MB
OBJ 107 MB 729 MB
Visual
GLB 26 MB 694 MB
OBJ 77 MB 653 MB

2984. camera_interface_CAN_board

camera_interface_CAN_board: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 7.2 s. Simulation, STL takes 5.5 s. Simulation, OBJ takes 8.3 s. Visual, GLB takes 8.7 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.8 0.4 ms 2.1 97 ms 0.3 0.2 5.3
Simulation, STEP 0.3 0.5 1.7 0.3 ms 2.1 2.1 0.3 0.2 7.2
Simulation, STL 0.3 0.5 1.8 0.2 ms 2.2 0.2 0.4 0.3 5.5
Simulation, OBJ 0.3 0.5 1.8 0.3 ms 2.1 3.1 0.3 0.2 8.3
Visual, GLB 0.3 0.5 1.7 0.3 ms 5.3 71 ms 0.6 0.2 8.7
Visual, OBJ 0.3 0.6 1.7 0.5 ms 5.3 2.1 0.7 0.2 10.8
Board Repo: waterloo-rocketry/canhw
Board: camera_interface_CAN_board.kicad_pcb
Folder camera_interface_CAN_board
Complexity 275 / 1000 (size 175, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 44, 248, 67
Triangles, simulation 646,922 in 67 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 359 MB
STEP 101 MB 413 MB
STL 32 MB 375 MB
OBJ 65 MB 481 MB
Visual
GLB 16 MB 417 MB
OBJ 47 MB 413 MB

2985. CAN_relay

CAN_relay: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.9 s. Simulation, STL takes 6.9 s. Simulation, OBJ takes 10 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.1 0.4 ms 2.9 0.1 0.4 0.3 6.8
Simulation, STEP 0.2 0.6 2.1 0.4 ms 2.8 2.5 0.4 0.2 8.9
Simulation, STL 0.3 0.6 2.3 0.4 ms 2.8 0.3 0.4 0.2 6.9
Simulation, OBJ 0.2 0.6 2.1 0.4 ms 3.0 3.9 0.4 0.2 10.4
Visual, GLB 0.3 0.6 2.2 0.5 ms 6.4 93 ms 0.9 0.2 10.8
Visual, OBJ 0.3 0.6 2.3 0.3 ms 6.5 2.6 0.9 0.2 13.4
Board Repo: waterloo-rocketry/canhw
Board: CAN_relay.kicad_pcb
Folder CAN_relay
Complexity 318 / 1000 (size 218, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 46, 314, 79
Triangles, simulation 820,192 in 132 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 389 MB
STEP 122 MB 479 MB
STL 41 MB 393 MB
OBJ 82 MB 612 MB
Visual
GLB 20 MB 520 MB
OBJ 60 MB 526 MB

2986. AD_Breakout

AD_Breakout: stages 4 and 6 take 47% to 77% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 5.5 s. Simulation, STL takes 4.1 s. Simulation, OBJ takes 6.1 s. Visual, GLB takes 5.5 s. Visual, OBJ takes 7.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.2 0.2 ms 1.6 77 ms 0.3 0.3 4.0
Simulation, STEP 0.2 0.4 1.2 0.2 ms 1.6 1.6 0.2 0.2 5.5
Simulation, STL 0.2 0.4 1.2 0.3 ms 1.6 0.1 0.3 0.3 4.1
Simulation, OBJ 0.2 0.4 1.2 0.3 ms 1.6 2.1 0.2 0.3 6.1
Visual, GLB 0.2 0.4 1.2 0.2 ms 3.1 48 ms 0.3 0.3 5.5
Visual, OBJ 0.2 0.4 1.1 0.2 ms 3.3 1.5 0.3 0.3 7.1
Board Repo: waterloo-rocketry/canhw
Board: AD_Breakout.kicad_pcb
Folder CanardBoard / AD_Breakout_Board
Complexity 259 / 1000 (size 174, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 10th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 39, 268, 61
Triangles, simulation 352,802 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 257 MB
STEP 47 MB 293 MB
STL 18 MB 255 MB
OBJ 35 MB 267 MB
Visual
GLB 8.6 MB 275 MB
OBJ 25 MB 274 MB

2987. CanardBoard

CanardBoard: stages 4 and 6 take 45% to 86% of a run. Simulation, GLB takes 52 s. Simulation, STEP takes 61 s. Simulation, STL takes 52 s. Simulation, OBJ takes 85 s. Visual, GLB takes 87 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 6.7 18.4 0.9 ms 20.6 1.1 3.0 0.3 51.9
Simulation, STEP 1.6 6.6 17.8 0.9 ms 20.0 11.7 2.8 0.3 60.9
Simulation, STL 1.6 6.3 17.5 1 ms 20.7 2.1 3.0 0.3 51.6
Simulation, OBJ 1.6 6.0 17.8 1 ms 20.3 36.2 2.9 0.4 85.3
Visual, GLB 1.5 6.1 17.7 2 ms 57.4 0.4 3.9 0.3 87.4
Visual, OBJ 1.5 6.0 17.9 0.9 ms 60.8 16.6 3.7 0.3 106.7
Board Repo: waterloo-rocketry/canhw
Board: CanardBoard.kicad_pcb
Folder CanardBoard
Complexity 417 / 1000 (size 282, features 135)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 253, 2,085, 863
Triangles, simulation 6,007,234 in 258 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 200 MB 1.4 GB
STEP 567 MB 1.9 GB
STL 300 MB 1.4 GB
OBJ 645 MB 3.8 GB
Visual
GLB 95 MB 1.9 GB
OBJ 309 MB 2.1 GB

2988. DAQ CAN support

DAQ CAN support: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 5.1 s. Simulation, OBJ takes 7.3 s. Visual, GLB takes 6.4 s. Visual, OBJ takes 8.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.1 0.3 ms 2.0 81 ms 0.3 0.2 5.3
Simulation, STEP 0.2 0.4 2.1 0.2 ms 2.0 1.7 0.3 0.2 6.8
Simulation, STL 0.2 0.3 2.1 0.3 ms 1.9 0.1 0.3 0.2 5.1
Simulation, OBJ 0.2 0.4 1.9 0.4 ms 1.9 2.4 0.3 0.2 7.3
Visual, GLB 0.2 0.3 1.8 0.3 ms 3.4 59 ms 0.4 0.2 6.4
Visual, OBJ 0.2 0.3 1.9 0.3 ms 3.6 1.5 0.4 0.2 8.1
Board Repo: waterloo-rocketry/canhw
Board: DAQ CAN support.kicad_pcb
Folder DAQ CAN support
Complexity 219 / 1000 (size 149, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 33, 247, 20
Triangles, simulation 506,750 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 305 MB
STEP 82 MB 367 MB
STL 25 MB 305 MB
OBJ 51 MB 396 MB
Visual
GLB 12 MB 388 MB
OBJ 37 MB 353 MB

2989. gps_2

gps_2: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 6.1 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 9.6 s. Visual, GLB takes 9.3 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.2 0.3 ms 2.3 91 ms 0.3 0.3 6.1
Simulation, STEP 0.2 0.6 2.2 0.4 ms 2.3 2.0 0.3 0.2 7.9
Simulation, STL 0.2 0.6 2.2 0.4 ms 2.3 0.1 0.4 0.2 6.0
Simulation, OBJ 0.2 0.7 2.2 0.3 ms 2.4 3.4 0.3 0.3 9.6
Visual, GLB 0.3 0.6 2.2 0.4 ms 5.3 76 ms 0.6 0.3 9.3
Visual, OBJ 0.2 0.6 2.2 0.4 ms 5.2 2.7 0.6 0.2 11.8
Board Repo: waterloo-rocketry/canhw
Board: gps_2.kicad_pcb
Folder gps
Complexity 254 / 1000 (size 164, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 37, 264, 151
Triangles, simulation 566,746 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 354 MB
STEP 93 MB 410 MB
STL 28 MB 337 MB
OBJ 58 MB 429 MB
Visual
GLB 16 MB 415 MB
OBJ 49 MB 429 MB

2990. injector_sensor_hub

injector_sensor_hub: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 6.0 s. Simulation, STEP takes 8.2 s. Simulation, STL takes 6.6 s. Simulation, OBJ takes 9.4 s. Visual, GLB takes 9.7 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.5 2.2 0.3 ms 2.3 0.1 0.4 0.2 6.0
Simulation, STEP 0.3 0.6 2.3 0.3 ms 2.2 2.2 0.4 0.2 8.2
Simulation, STL 0.3 0.7 2.3 0.3 ms 2.4 0.3 0.4 0.3 6.6
Simulation, OBJ 0.3 0.6 2.2 0.3 ms 2.4 3.3 0.4 0.3 9.4
Visual, GLB 0.3 0.6 2.5 0.4 ms 5.5 75 ms 0.5 0.3 9.7
Visual, OBJ 0.3 0.5 2.6 0.5 ms 5.0 2.8 0.7 0.2 12.3
Board Repo: waterloo-rocketry/canhw
Board: injector_sensor_hub.kicad_pcb
Folder injector_sensor_hub
Complexity 215 / 1000 (size 160, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 48, 278, 68
Triangles, simulation 650,724 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 337 MB
STEP 113 MB 401 MB
STL 33 MB 330 MB
OBJ 66 MB 472 MB
Visual
GLB 17 MB 425 MB
OBJ 51 MB 468 MB

2991. telemetry_transmitter

telemetry_transmitter: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 9.5 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 0.8 4.4 0.5 ms 2.9 0.2 0.4 0.3 9.5
Simulation, STEP 0.3 0.7 4.3 0.5 ms 3.1 2.8 0.4 0.3 11.9
Simulation, STL 0.4 0.7 4.5 0.6 ms 2.9 0.2 0.4 0.2 9.3
Simulation, OBJ 0.3 0.7 4.2 0.6 ms 3.0 4.9 0.5 0.3 13.9
Visual, GLB 0.3 0.7 4.5 0.7 ms 7.2 0.1 0.7 0.3 13.8
Visual, OBJ 0.3 0.7 4.5 0.5 ms 6.9 3.2 0.7 0.3 16.6
Board Repo: waterloo-rocketry/canhw
Board: telemetry_transmitter.kicad_pcb
Folder live_telemetry / ARCHIVE / old_telemetry_transmitter
Complexity 232 / 1000 (size 162, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline
Tested 10th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 46, 305, 88
Triangles, simulation 758,176 in 67 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 369 MB
STEP 139 MB 431 MB
STL 38 MB 381 MB
OBJ 78 MB 542 MB
Visual
GLB 18 MB 438 MB
OBJ 54 MB 450 MB

2992. LTT

LTT: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 30 s. Simulation, STL takes 27 s. Simulation, OBJ takes 40 s. Visual, GLB takes 37 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.5 9.0 0.4 ms 10.6 0.5 1.2 0.3 25.7
Simulation, STEP 0.7 3.4 8.7 0.3 ms 10.8 5.4 1.1 0.4 30.5
Simulation, STL 0.7 3.8 9.3 1.0 ms 11.1 1.0 1.2 0.4 27.4
Simulation, OBJ 0.6 3.3 8.6 0.5 ms 10.6 15.4 1.2 0.4 40.1
Visual, GLB 0.7 3.4 9.4 0.4 ms 21.0 0.3 2.2 0.3 37.3
Visual, OBJ 0.6 3.2 8.6 0.9 ms 20.9 8.5 2.2 0.3 44.2
Board Repo: waterloo-rocketry/canhw
Board: LTT.kicad_pcb
Folder live_telemetry / LTT
Complexity 353 / 1000 (size 253, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 10th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 100, 545, 705
Triangles, simulation 2,420,870 in 95 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 946 MB
STEP 221 MB 1.2 GB
STL 121 MB 1.1 GB
OBJ 252 MB 1.6 GB
Visual
GLB 47 MB 889 MB
OBJ 145 MB 1.0 GB

2993. power-splitter

power-splitter: stages 4 and 6 take 53% to 78% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 3.8 s. Visual, OBJ takes 4.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.2 0.1 ms 0.9 32 ms 89 ms 0.2 2.9
Simulation, STEP 0.1 0.3 1.2 0.1 ms 0.9 0.9 90 ms 0.2 3.7
Simulation, STL 0.1 0.3 1.2 0.1 ms 0.8 46 ms 86 ms 0.2 2.8
Simulation, OBJ 0.1 0.3 1.1 0.1 ms 0.9 1.1 94 ms 0.2 3.9
Visual, GLB 0.1 0.3 1.2 0.2 ms 1.7 23 ms 0.2 0.2 3.8
Visual, OBJ 0.1 0.3 1.1 0.2 ms 1.8 0.7 0.1 0.2 4.4
Board Repo: waterloo-rocketry/canhw
Board: power-splitter.kicad_pcb
Folder live_telemetry / power-splitter
Complexity 234 / 1000 (size 139, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 7, 9, 140
Triangles, simulation 198,584 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.8 MB 223 MB
STEP 15 MB 238 MB
STL 9.9 MB 226 MB
OBJ 20 MB 223 MB
Visual
GLB 4.7 MB 201 MB
OBJ 14 MB 205 MB

2994. novatel_gps_breakout

novatel_gps_breakout: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.5 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.0 s. Visual, GLB takes 4.8 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 1.3 0.2 ms 1.1 54 ms 0.2 0.2 3.3
Simulation, STEP 0.1 0.2 1.3 0.2 ms 1.2 1.2 0.2 0.2 4.5
Simulation, STL 0.2 0.3 1.3 0.3 ms 1.1 80 ms 0.2 0.3 3.4
Simulation, OBJ 0.2 0.3 1.3 0.2 ms 1.1 1.7 0.2 0.2 5.0
Visual, GLB 0.2 0.2 1.3 0.2 ms 2.6 35 ms 0.3 0.3 4.8
Visual, OBJ 0.2 0.3 1.4 0.2 ms 2.7 1.2 0.2 0.2 6.1
Board Repo: waterloo-rocketry/canhw
Board: novatel_gps_breakout.kicad_pcb
Folder novatel_gps_breakout
Complexity 188 / 1000 (size 118, features 70)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones
Tested 10th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 7, 119, 2
Triangles, simulation 317,818 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 239 MB
STEP 48 MB 268 MB
STL 16 MB 251 MB
OBJ 31 MB 260 MB
Visual
GLB 7.0 MB 238 MB
OBJ 20 MB 235 MB

2995. picdev

picdev: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.0 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 4.3 0.3 ms 3.1 0.1 0.4 0.2 8.9
Simulation, STEP 0.2 0.6 4.0 0.4 ms 3.2 2.4 0.4 0.2 11.0
Simulation, STL 0.2 0.6 4.2 0.3 ms 3.1 0.2 0.4 0.2 9.0
Simulation, OBJ 0.2 0.6 4.1 0.4 ms 3.1 4.2 0.4 0.3 12.8
Visual, GLB 0.2 0.6 4.1 0.5 ms 6.8 88 ms 0.9 0.2 12.9
Visual, OBJ 0.2 0.6 4.0 0.4 ms 6.8 2.8 0.8 0.2 15.3
Board Repo: waterloo-rocketry/canhw
Board: picdev.kicad_pcb
Folder picdev / picdev
Complexity 185 / 1000 (size 150, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 45, 239, 12
Triangles, simulation 994,038 in 72 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 449 MB
STEP 182 MB 505 MB
STL 50 MB 446 MB
OBJ 102 MB 704 MB
Visual
GLB 22 MB 548 MB
OBJ 64 MB 558 MB

2996. processor

processor: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 14 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 3.0 0.4 ms 3.6 0.2 0.5 0.2 8.9
Simulation, STEP 0.3 0.9 2.9 0.4 ms 3.6 3.0 0.4 0.2 11.5
Simulation, STL 0.3 0.9 3.1 0.3 ms 3.7 0.5 0.5 0.2 9.3
Simulation, OBJ 0.4 0.9 3.0 0.4 ms 3.6 5.2 0.5 0.3 13.9
Visual, GLB 0.4 1.0 3.0 0.7 ms 8.9 0.1 1.2 0.2 14.8
Visual, OBJ 0.4 1.0 3.4 0.4 ms 8.8 3.9 1.4 0.2 19.0
Board Repo: waterloo-rocketry/canhw
Board: processor.kicad_pcb
Folder processor
Complexity 352 / 1000 (size 237, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 63, 1,009, 121
Triangles, simulation 1,275,614 in 130 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 489 MB
STEP 183 MB 593 MB
STL 64 MB 521 MB
OBJ 131 MB 902 MB
Visual
GLB 31 MB 680 MB
OBJ 94 MB 722 MB

2997. PropulsionBoard

PropulsionBoard: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 17 s. Visual, GLB takes 17 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 4.4 0.4 ms 4.0 0.2 0.5 0.3 10.7
Simulation, STEP 0.4 1.0 4.3 0.3 ms 4.3 3.7 0.5 0.2 14.4
Simulation, STL 0.4 1.0 4.4 0.3 ms 4.0 0.4 0.5 0.3 11.0
Simulation, OBJ 0.4 1.0 4.4 0.4 ms 4.1 6.0 0.5 0.3 16.6
Visual, GLB 0.5 1.0 4.4 0.3 ms 9.3 0.1 1.0 0.3 16.7
Visual, OBJ 0.4 1.1 4.5 0.3 ms 9.4 5.0 1.3 0.2 21.8
Board Repo: waterloo-rocketry/canhw
Board: PropulsionBoard.kicad_pcb
Folder PropulsionBoard
Complexity 237 / 1000 (size 182, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 10th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 86, 851, 138
Triangles, simulation 1,003,706 in 76 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 480 MB
STEP 178 MB 591 MB
STL 50 MB 496 MB
OBJ 102 MB 693 MB
Visual
GLB 29 MB 696 MB
OBJ 86 MB 758 MB

2998. remote_arming

remote_arming: stages 4 and 6 take 46% to 81% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.5 s. Simulation, STL takes 7.7 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 2.6 0.4 ms 2.8 0.1 0.4 0.2 7.4
Simulation, STEP 0.3 0.8 2.5 0.4 ms 2.8 2.5 0.4 0.2 9.5
Simulation, STL 0.3 0.8 2.6 0.4 ms 3.0 0.3 0.4 0.2 7.7
Simulation, OBJ 0.3 0.8 2.6 0.4 ms 2.9 4.6 0.5 0.2 11.9
Visual, GLB 0.3 0.9 2.7 0.5 ms 6.8 0.1 0.7 0.2 11.7
Visual, OBJ 0.3 0.8 2.8 0.5 ms 7.2 2.8 0.7 0.2 14.8
Board Repo: waterloo-rocketry/canhw
Board: remote_arming.kicad_pcb
Folder remote_arming
Complexity 300 / 1000 (size 190, features 110)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 65, 441, 140
Triangles, simulation 1,057,408 in 71 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 461 MB
STEP 138 MB 531 MB
STL 53 MB 468 MB
OBJ 107 MB 719 MB
Visual
GLB 23 MB 519 MB
OBJ 69 MB 576 MB

2999. rocket_power_board

rocket_power_board: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 8.2 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.3 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 2.9 0.4 ms 3.3 0.2 0.5 0.2 8.2
Simulation, STEP 0.3 0.8 3.0 0.4 ms 3.3 2.7 0.5 0.2 10.7
Simulation, STL 0.3 0.8 2.9 0.5 ms 3.3 0.2 0.5 0.2 8.3
Simulation, OBJ 0.3 0.9 3.0 0.3 ms 3.3 5.2 0.4 0.2 13.4
Visual, GLB 0.3 0.8 2.9 0.4 ms 6.7 0.1 0.6 0.2 11.7
Visual, OBJ 0.4 0.9 2.9 0.5 ms 6.6 3.6 0.6 0.2 15.2
Board Repo: waterloo-rocketry/canhw
Board: rocket_power_board.kicad_pcb
Folder rocket_power_board
Complexity 294 / 1000 (size 194, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 83, 553, 136
Triangles, simulation 1,134,474 in 71 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 39 MB 472 MB
STEP 167 MB 577 MB
STL 57 MB 487 MB
OBJ 115 MB 805 MB
Visual
GLB 26 MB 616 MB
OBJ 79 MB 637 MB

3000. usbdbg

usbdbg: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 4.6 s. Simulation, OBJ takes 7.0 s. Visual, GLB takes 7.1 s. Visual, OBJ takes 8.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 1.6 0.2 ms 1.8 66 ms 0.3 0.3 4.7
Simulation, STEP 0.2 0.4 1.6 0.3 ms 1.8 1.8 0.2 0.2 6.3
Simulation, STL 0.2 0.4 1.6 0.5 ms 1.9 0.1 0.2 0.2 4.6
Simulation, OBJ 0.2 0.4 1.7 0.4 ms 1.9 2.4 0.2 0.2 7.0
Visual, GLB 0.2 0.4 1.6 0.4 ms 4.2 73 ms 0.4 0.2 7.1
Visual, OBJ 0.2 0.4 1.6 0.2 ms 4.0 1.9 0.5 0.2 8.8
Board Repo: waterloo-rocketry/canhw
Board: usbdbg.kicad_pcb
Folder usbdbg
Complexity 247 / 1000 (size 152, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 31, 252, 42
Triangles, simulation 440,540 in 54 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 281 MB
STEP 74 MB 327 MB
STL 22 MB 282 MB
OBJ 44 MB 322 MB
Visual
GLB 12 MB 340 MB
OBJ 35 MB 340 MB

3001. Driverino-Shield

Driverino-Shield: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 7.8 s. Simulation, STEP takes 9.4 s. Simulation, STL takes 7.1 s. Simulation, OBJ takes 11 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.2 0.4 ms 2.8 0.1 0.4 0.4 7.8
Simulation, STEP 0.2 0.6 3.1 0.4 ms 2.6 2.2 0.4 0.2 9.4
Simulation, STL 0.3 0.5 2.8 0.4 ms 2.6 0.2 0.4 0.2 7.1
Simulation, OBJ 0.3 0.5 3.0 0.4 ms 2.8 3.5 0.4 0.2 10.8
Visual, GLB 0.3 0.6 2.9 0.4 ms 5.5 0.1 0.7 0.2 10.2
Visual, OBJ 0.3 0.6 3.0 0.5 ms 5.7 2.7 0.7 0.2 13.2
Board Repo: weirdgyn/Driverino-Shield
Board: Driverino-Shield.kicad_pcb
Folder PCB
Complexity 241 / 1000 (size 196, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 52, 229, 45
Triangles, simulation 743,350 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 372 MB
STEP 120 MB 455 MB
STL 37 MB 360 MB
OBJ 75 MB 551 MB
Visual
GLB 18 MB 458 MB
OBJ 53 MB 442 MB

3002. FourThirdsEye

FourThirdsEye: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 40 s. Visual, GLB takes 41 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.1 10.9 0.7 ms 9.3 0.4 1.0 0.2 25.8
Simulation, STEP 0.6 3.2 10.9 0.3 ms 9.6 4.9 1.0 0.3 30.6
Simulation, STL 0.7 3.1 11.3 0.8 ms 9.8 0.7 0.9 0.3 26.8
Simulation, OBJ 0.6 2.9 10.8 0.3 ms 9.9 14.9 0.9 0.3 40.3
Visual, GLB 0.6 3.1 10.7 0.4 ms 24.5 0.2 2.1 0.3 41.4
Visual, OBJ 0.7 3.2 10.5 0.4 ms 23.8 8.9 2.6 0.3 49.9
Board Repo: will127534/FourThirdsEye
Board: FourThirdsEye.kicad_pcb
Complexity 341 / 1000 (size 216, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 107, 634, 836
Triangles, simulation 2,604,862 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 85 MB 1.0 GB
STEP 244 MB 1.2 GB
STL 130 MB 961 MB
OBJ 269 MB 1.7 GB
Visual
GLB 54 MB 1.0 GB
OBJ 166 MB 1.2 GB

3003. IMUArray_BreakoutBoard

IMUArray_BreakoutBoard: stages 4 and 6 take 45% to 76% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.8 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 4.1 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.9 0.3 ms 1.0 47 ms 0.1 0.2 2.8
Simulation, STEP 0.2 0.4 0.9 0.2 ms 0.9 1.0 0.1 0.2 3.8
Simulation, STL 0.1 0.4 1.0 0.2 ms 0.9 68 ms 0.2 0.2 2.8
Simulation, OBJ 0.1 0.3 0.9 0.2 ms 1.0 1.5 0.2 0.2 4.1
Visual, GLB 0.1 0.3 1.0 0.2 ms 2.1 29 ms 0.3 0.2 4.0
Visual, OBJ 0.1 0.3 1.0 0.2 ms 2.1 1.0 0.2 0.2 4.9
Board Repo: will127534/IMU_Array
Board: IMUArray_BreakoutBoard.kicad_pcb
Folder IMUArray_BreakoutBoard
Complexity 240 / 1000 (size 145, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 6, 54, 65
Triangles, simulation 316,704 in 48 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 269 MB
STEP 39 MB 278 MB
STL 16 MB 262 MB
OBJ 32 MB 266 MB
Visual
GLB 7.0 MB 235 MB
OBJ 20 MB 234 MB

3004. IMUArray_ProcessingBoard

IMUArray_ProcessingBoard: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 31 s. Visual, GLB takes 24 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.7 7.1 0.4 ms 9.3 0.3 0.8 0.3 21.0
Simulation, STEP 0.5 2.7 6.9 0.5 ms 9.2 3.7 0.8 0.2 24.0
Simulation, STL 0.4 2.7 6.7 0.3 ms 8.3 0.6 0.8 0.3 19.9
Simulation, OBJ 0.4 2.6 6.9 0.3 ms 8.5 11.2 0.7 0.3 30.6
Visual, GLB 0.5 2.6 6.6 0.5 ms 12.5 0.2 1.5 0.2 24.0
Visual, OBJ 0.4 2.5 6.5 0.8 ms 12.8 6.7 1.6 0.2 30.7
Board Repo: will127534/IMU_Array
Board: IMUArray_ProcessingBoard.kicad_pcb
Folder IMUArray_ProcessingBoard / IMUArray_ProcessingBoard
Complexity 338 / 1000 (size 253, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 85, 390, 880
Triangles, simulation 2,049,144 in 124 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 868 MB
STEP 147 MB 988 MB
STL 102 MB 887 MB
OBJ 208 MB 1.4 GB
Visual
GLB 44 MB 827 MB
OBJ 134 MB 942 MB

3005. IMUArray_SensorBoard

IMUArray_SensorBoard: stages 4 and 6 take 49% to 86% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 39 s. Simulation, STL takes 31 s. Simulation, OBJ takes 50 s. Visual, GLB takes 52 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 3.4 10.9 2 ms 13.3 0.9 1.7 0.3 31.7
Simulation, STEP 1.2 3.5 10.6 0.5 ms 13.5 8.0 1.4 0.3 38.5
Simulation, STL 1.0 3.1 10.8 0.5 ms 13.5 1.0 1.5 0.3 31.1
Simulation, OBJ 1.0 3.2 10.6 0.9 ms 14.1 19.4 1.5 0.3 50.2
Visual, GLB 1.0 3.0 11.1 1 ms 34.0 0.2 2.8 0.3 52.4
Visual, OBJ 1.1 3.2 11.4 0.5 ms 35.0 8.4 3.5 0.3 62.8
Board Repo: will127534/IMU_Array
Board: IMUArray_SensorBoard.kicad_pcb
Folder IMUArray_SensorBoard
Complexity 353 / 1000 (size 268, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 6 (20211014)
Parts, tracks, vias 148, 1,177, 558
Triangles, simulation 3,916,240 in 97 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 132 MB 1.1 GB
STEP 509 MB 1.3 GB
STL 196 MB 1.0 GB
OBJ 429 MB 2.6 GB
Visual
GLB 62 MB 1.3 GB
OBJ 200 MB 1.5 GB

3006. CM4ClusterHat

CM4ClusterHat: stages 4 and 6 take 56% to 81% of a run. Simulation, GLB takes 42 s. Simulation, STEP takes 51 s. Simulation, STL takes 42 s. Simulation, OBJ takes 58 s. Visual, GLB takes 59 s. Visual, OBJ takes 72 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.4 13.6 2 ms 19.5 0.7 2.0 0.3 41.5
Simulation, STEP 1.2 4.4 13.4 2 ms 19.6 9.7 1.9 0.3 50.6
Simulation, STL 1.2 4.5 13.2 2 ms 19.1 1.3 1.9 0.3 41.6
Simulation, OBJ 1.1 4.5 13.4 1 ms 19.2 17.6 1.8 0.3 57.8
Visual, GLB 1.2 4.5 12.9 0.9 ms 34.7 0.5 4.6 0.2 58.5
Visual, OBJ 1.2 4.1 13.3 0.9 ms 35.2 12.7 5.0 0.3 71.6
Board Repo: will127534/Miniature-CM4-Cluster
Board: CM4ClusterHat.kicad_pcb
Folder ClusterHat
Complexity 377 / 1000 (size 277, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210925)
Parts, tracks, vias 236, 2,332, 758
Triangles, simulation 3,694,372 in 401 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 125 MB 1.2 GB
STEP 514 MB 1.6 GB
STL 185 MB 1.1 GB
OBJ 393 MB 2.4 GB
Visual
GLB 88 MB 1.4 GB
OBJ 278 MB 1.8 GB

3007. CM4Card

CM4Card: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 4.5 0.8 ms 5.0 0.2 0.8 0.2 12.4
Simulation, STEP 0.5 1.4 4.5 0.8 ms 4.6 3.3 0.6 0.2 15.0
Simulation, STL 0.4 1.2 4.4 0.7 ms 4.5 0.3 0.6 0.2 11.8
Simulation, OBJ 0.5 1.2 4.4 0.8 ms 4.4 5.4 0.6 0.2 16.7
Visual, GLB 0.4 1.1 4.4 0.7 ms 10.5 0.1 1.3 0.2 18.0
Visual, OBJ 0.4 1.2 4.7 0.8 ms 10.7 4.2 1.4 0.3 22.9
Board Repo: will127534/Miniature-CM4-Cluster
Board: CM4Card.kicad_pcb
Folder CM4Card
Complexity 288 / 1000 (size 198, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210925)
Parts, tracks, vias 54, 822, 252
Triangles, simulation 1,208,432 in 246 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 41 MB 516 MB
STEP 190 MB 629 MB
STL 60 MB 504 MB
OBJ 124 MB 831 MB
Visual
GLB 30 MB 643 MB
OBJ 91 MB 733 MB

3008. OneInchEye

OneInchEye: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 25 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 5.8 0.8 ms 5.3 0.3 0.6 0.2 14.5
Simulation, STEP 0.4 1.8 6.1 0.3 ms 5.9 3.5 0.6 0.2 18.4
Simulation, STL 0.4 2.0 5.7 0.7 ms 5.6 0.5 0.7 0.3 14.9
Simulation, OBJ 0.4 1.9 5.9 0.3 ms 5.6 8.3 0.6 0.2 23.0
Visual, GLB 0.4 1.8 6.0 0.7 ms 15.5 0.2 1.3 0.3 25.5
Visual, OBJ 0.4 1.8 6.2 0.5 ms 15.1 4.7 1.5 0.2 30.1
Board Repo: will127534/OneInchEye
Board: OneInchEye.kicad_pcb
Complexity 307 / 1000 (size 207, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 80, 624, 531
Triangles, simulation 1,868,154 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 62 MB 762 MB
STEP 191 MB 835 MB
STL 93 MB 730 MB
OBJ 192 MB 1.2 GB
Visual
GLB 37 MB 750 MB
OBJ 113 MB 840 MB

3009. NixieAtomicClock

NixieAtomicClock: stages 4 and 6 take 58% to 87% of a run. Simulation, GLB takes 70 s. Simulation, STEP takes 82 s. Simulation, STL takes 73 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 7.5 33.8 1 ms 23.8 1.0 2.8 0.4 70.4
Simulation, STEP 1.1 7.5 34.4 0.9 ms 24.0 11.6 2.8 0.3 81.8
Simulation, STL 1.2 7.6 33.8 1 ms 24.5 2.3 2.9 0.4 72.6
Simulation, OBJ 1.2 7.6 33.3 2 ms 25.0 30.8 2.7 0.3 100.8
Visual, GLB 1.1 7.6 33.1 1 ms 69.3 0.5 5.7 0.3 117.5
Visual, OBJ 1.2 8.1 35.4 3 ms 68.5 17.7 6.0 0.3 137.1
Board Repo: will127534/RaspberryPiAtomicNixieClock
Board: NixieAtomicClock.kicad_pcb
Folder PCB
Complexity 397 / 1000 (size 282, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201002)
Parts, tracks, vias 256, 2,400, 2,132
Triangles, simulation 6,889,714 in 363 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 225 MB 2.5 GB
STEP 718 MB 2.6 GB
STL 345 MB 2.3 GB
OBJ 728 MB 4.3 GB
Visual
GLB 135 MB 2.3 GB
OBJ 436 MB 2.8 GB

3010. StarlightEye

StarlightEye: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 28 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 7.0 0.6 ms 5.9 0.2 0.5 0.2 16.1
Simulation, STEP 0.4 1.7 6.7 0.8 ms 5.7 3.4 0.6 0.2 18.7
Simulation, STL 0.4 1.7 6.9 0.6 ms 5.9 0.7 0.6 0.3 16.4
Simulation, OBJ 0.4 1.8 7.0 0.8 ms 6.0 8.5 0.5 0.2 24.5
Visual, GLB 0.4 1.7 6.9 0.8 ms 17.1 0.2 1.6 0.2 28.2
Visual, OBJ 0.4 1.7 6.7 1.0 ms 16.7 5.1 1.3 0.2 32.0
Board Repo: will127534/StarlightEye
Board: StarlightEye.kicad_pcb
Complexity 335 / 1000 (size 210, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 111, 601, 524
Triangles, simulation 2,043,226 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 806 MB
STEP 223 MB 899 MB
STL 102 MB 808 MB
OBJ 211 MB 1.4 GB
Visual
GLB 43 MB 820 MB
OBJ 131 MB 933 MB

3011. macpro62_am5

macpro62_am5: stages 4 and 6 take 62% to 87% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 35 s. Simulation, STL takes 28 s. Simulation, OBJ takes 39 s. Visual, GLB takes 42 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.7 10.9 0.1 ms 13.5 0.4 0.7 0.2 28.0
Simulation, STEP 0.5 1.7 11.0 0.1 ms 14.1 7.2 0.7 0.2 35.3
Simulation, STL 0.4 1.9 10.5 0.2 ms 13.4 0.8 0.6 0.2 27.9
Simulation, OBJ 0.5 1.9 10.6 0.1 ms 13.7 11.8 0.7 0.3 39.4
Visual, GLB 0.5 1.7 10.9 0.2 ms 24.7 0.3 3.4 0.3 41.7
Visual, OBJ 0.5 2.0 10.6 0.1 ms 26.1 10.3 4.2 0.2 53.9
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: macpro62_am5.kicad_pcb
Folder kicad / macpro62-am5-v3
Complexity 209 / 1000 (size 154, features 55)
KESE features curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 10
File format KiCad 9 (20241229)
Parts, tracks, vias 26, 0, 0
Triangles, simulation 2,490,472 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 88 MB 1.1 GB
STEP 374 MB 1.4 GB
STL 125 MB 1.1 GB
OBJ 272 MB 1.7 GB
Visual
GLB 77 MB 1.6 GB
OBJ 241 MB 1.6 GB

3012. macpro62_am5

macpro62_am5: stages 4 and 6 take 58% to 87% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 32 s. Simulation, OBJ takes 46 s. Visual, GLB takes 46 s. Visual, OBJ takes 60 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.1 12.6 0.2 ms 15.8 0.4 0.9 0.3 32.8
Simulation, STEP 0.6 2.2 12.8 0.1 ms 14.8 8.4 0.8 0.2 39.8
Simulation, STL 0.6 2.1 12.5 0.1 ms 15.3 0.8 0.8 0.3 32.4
Simulation, OBJ 0.6 2.1 12.1 0.1 ms 14.5 15.3 0.9 0.3 45.9
Visual, GLB 0.6 2.2 13.0 0.1 ms 26.4 0.4 3.2 0.2 46.0
Visual, OBJ 0.6 2.2 13.0 0.2 ms 26.2 13.9 3.3 0.3 59.5
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: macpro62_am5.kicad_pcb
Folder kicad / macpro62-am5
Complexity 209 / 1000 (size 154, features 55)
KESE features curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 10
File format KiCad 9 (20241229)
Parts, tracks, vias 26, 0, 0
Triangles, simulation 2,490,472 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 88 MB 1.1 GB
STEP 374 MB 1.4 GB
STL 125 MB 1.1 GB
OBJ 272 MB 1.8 GB
Visual
GLB 77 MB 1.5 GB
OBJ 241 MB 1.7 GB

3013. backplane

backplane: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 60 s. Simulation, STEP takes 75 s. Simulation, STL takes 62 s. Simulation, OBJ takes 96 s. Visual, GLB takes 80 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 7.0 17.0 2 ms 30.8 0.9 2.8 0.3 60.0
Simulation, STEP 1.3 6.7 16.9 0.9 ms 30.8 15.9 3.1 0.4 75.0
Simulation, STL 1.2 6.8 17.0 0.9 ms 31.6 2.2 3.1 0.3 62.1
Simulation, OBJ 1.3 6.9 17.5 0.8 ms 32.1 35.3 2.9 0.4 96.4
Visual, GLB 1.3 6.9 17.0 1.0 ms 47.4 0.5 6.1 0.3 79.5
Visual, OBJ 1.4 7.2 18.2 2 ms 47.8 20.8 6.3 0.3 102.0
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane.kicad_pcb
Folder kicad / macpro62-backplane-v2
Complexity 370 / 1000 (size 280, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 149, 6,925, 1,336
Triangles, simulation 5,498,640 in 349 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.6 GB
STEP 690 MB 2.3 GB
STL 275 MB 1.5 GB
OBJ 582 MB 3.4 GB
Visual
GLB 108 MB 1.8 GB
OBJ 348 MB 2.3 GB

3014. backplane

backplane: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 74 s. Simulation, STL takes 61 s. Simulation, OBJ takes 99 s. Visual, GLB takes 85 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 6.8 15.5 0.9 ms 28.7 1.2 3.6 0.3 57.6
Simulation, STEP 1.4 7.2 15.8 1 ms 29.1 16.6 3.8 0.4 74.3
Simulation, STL 1.6 7.5 16.7 0.9 ms 28.8 3.0 3.5 0.3 61.4
Simulation, OBJ 1.3 7.0 16.1 0.9 ms 29.4 41.0 3.8 0.4 99.0
Visual, GLB 1.4 7.1 16.2 1 ms 51.9 0.5 7.2 0.4 84.7
Visual, OBJ 1.5 7.1 16.4 2 ms 50.2 18.8 6.8 0.3 101.2
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane.kicad_pcb
Folder kicad / macpro62-backplane-v3
Complexity 427 / 1000 (size 292, features 135)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 152, 8,103, 1,423
Triangles, simulation 7,763,616 in 333 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 258 MB 2.0 GB
STEP 837 MB 2.9 GB
STL 388 MB 2.1 GB
OBJ 834 MB 4.8 GB
Visual
GLB 124 MB 2.1 GB
OBJ 410 MB 2.7 GB

3015. backplane

backplane: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 63 s. Simulation, STEP takes 76 s. Simulation, STL takes 63 s. Simulation, OBJ takes 93 s. Visual, GLB takes 79 s. Visual, OBJ takes 98 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 7.1 17.3 0.9 ms 32.3 1.0 3.1 0.3 62.6
Simulation, STEP 1.3 7.3 17.0 2 ms 30.7 16.5 3.0 0.4 76.2
Simulation, STL 1.4 6.9 16.8 2 ms 32.1 2.4 3.1 0.3 63.0
Simulation, OBJ 1.3 7.0 17.5 0.9 ms 31.1 32.7 3.1 0.4 93.1
Visual, GLB 1.3 7.0 17.1 0.9 ms 47.0 0.5 5.6 0.3 78.8
Visual, OBJ 1.3 6.9 17.0 2 ms 46.4 20.1 5.7 0.3 97.7
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane.kicad_pcb
Folder kicad / macpro62-backplane
Complexity 370 / 1000 (size 280, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 149, 6,925, 1,336
Triangles, simulation 5,498,650 in 349 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 186 MB 1.5 GB
STEP 690 MB 2.3 GB
STL 275 MB 1.6 GB
OBJ 582 MB 3.4 GB
Visual
GLB 108 MB 1.8 GB
OBJ 348 MB 2.2 GB

3016. backplane_direct

backplane_direct: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 3.7 s. Visual, OBJ takes 4.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.2 ms 1.1 44 ms 86 ms 0.2 2.7
Simulation, STEP 0.1 0.2 0.9 0.1 ms 1.1 1.2 85 ms 0.2 3.7
Simulation, STL 0.1 0.2 0.9 0.1 ms 1.1 71 ms 93 ms 0.2 2.7
Simulation, OBJ 0.1 0.2 1.0 0.1 ms 1.2 1.2 0.1 0.2 3.9
Visual, GLB 0.1 0.2 0.9 0.1 ms 2.1 32 ms 0.2 0.2 3.7
Visual, OBJ 0.1 0.2 0.9 0.1 ms 2.1 1.0 0.2 0.2 4.7
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane_direct.kicad_pcb
Folder kicad / macpro62-backplane
Complexity 171 / 1000 (size 106, features 65)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 19, 0, 0
Triangles, simulation 280,020 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10.0 MB 255 MB
STEP 42 MB 293 MB
STL 14 MB 257 MB
OBJ 29 MB 258 MB
Visual
GLB 8.1 MB 268 MB
OBJ 24 MB 276 MB

3017. hub_fitcheck

hub_fitcheck: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 4.9 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 5.4 s. Visual, GLB takes 6.0 s. Visual, OBJ takes 7.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.8 0.2 ms 1.2 39 ms 0.2 0.2 4.0
Simulation, STEP 0.1 0.3 1.6 0.2 ms 1.2 1.3 0.2 0.2 4.9
Simulation, STL 0.1 0.3 1.8 0.2 ms 1.2 91 ms 0.2 0.2 4.0
Simulation, OBJ 0.1 0.3 1.7 0.2 ms 1.2 1.6 0.2 0.2 5.4
Visual, GLB 0.1 0.3 1.7 0.2 ms 3.3 39 ms 0.4 0.2 6.0
Visual, OBJ 0.1 0.3 1.8 0.2 ms 3.0 1.3 0.3 0.3 7.2
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: hub_fitcheck.kicad_pcb
Folder kicad / macpro62-backplane / variants / fitcheck_hub_allMCIO_cable_variant
Complexity 126 / 1000 (size 96, features 30)
KESE features slotted holes, rounded,
trapezoid or chamfered pads,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 7, 0, 0
Triangles, simulation 298,708 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 266 MB
STEP 45 MB 296 MB
STL 15 MB 269 MB
OBJ 31 MB 267 MB
Visual
GLB 8.8 MB 285 MB
OBJ 26 MB 291 MB

3018. backplane_fp6

backplane_fp6: stages 4 and 6 take 57% to 83% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.0 s. Simulation, STL takes 4.4 s. Simulation, OBJ takes 6.1 s. Visual, GLB takes 6.2 s. Visual, OBJ takes 7.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.8 0.2 ms 1.9 64 ms 0.2 0.2 4.7
Simulation, STEP 0.2 0.4 1.7 0.2 ms 1.8 1.6 0.2 0.2 6.0
Simulation, STL 0.2 0.3 1.7 0.1 ms 1.6 0.1 0.2 0.2 4.4
Simulation, OBJ 0.2 0.4 1.8 0.1 ms 1.7 1.7 0.2 0.2 6.1
Visual, GLB 0.2 0.3 1.8 0.2 ms 3.4 48 ms 0.3 0.2 6.2
Visual, OBJ 0.2 0.3 1.8 0.2 ms 3.5 1.4 0.4 0.2 7.7
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane_fp6.kicad_pcb
Folder kicad / macpro62-backplane / variants / fp6_floorplan_6L
Complexity 191 / 1000 (size 116, features 75)
KESE features slotted holes, rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 20, 0, 0
Triangles, simulation 418,448 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 307 MB
STEP 61 MB 355 MB
STL 21 MB 306 MB
OBJ 44 MB 357 MB
Visual
GLB 12 MB 363 MB
OBJ 36 MB 411 MB

3019. backplane_hub_fp2

backplane_hub_fp2: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 5.8 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 8.8 s. Visual, GLB takes 7.9 s. Visual, OBJ takes 9.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 2.4 0.1 ms 2.1 76 ms 0.3 0.2 5.8
Simulation, STEP 0.2 0.4 2.6 0.2 ms 2.1 2.0 0.3 0.2 7.9
Simulation, STL 0.2 0.5 2.6 0.2 ms 2.2 0.1 0.2 0.2 6.0
Simulation, OBJ 0.2 0.5 2.5 0.2 ms 2.2 2.8 0.2 0.2 8.8
Visual, GLB 0.2 0.4 2.4 0.2 ms 4.2 54 ms 0.3 0.2 7.9
Visual, OBJ 0.3 0.5 2.4 0.2 ms 3.8 1.9 0.4 0.3 9.7
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: backplane_hub_fp2.kicad_pcb
Folder kicad / macpro62-backplane / variants / hub_fp2_d30_assumed
Complexity 192 / 1000 (size 117, features 75)
KESE features slotted holes, rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 21, 0, 0
Triangles, simulation 429,260 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 315 MB
STEP 62 MB 352 MB
STL 21 MB 311 MB
OBJ 46 MB 358 MB
Visual
GLB 12 MB 418 MB
OBJ 37 MB 413 MB

3020. macpro62-io-board

macpro62-io-board: stages 4 and 6 take 62% to 87% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 23 s. Simulation, STL takes 18 s. Simulation, OBJ takes 25 s. Visual, GLB takes 27 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.2 7.1 0.2 ms 7.5 0.3 0.5 0.3 17.4
Simulation, STEP 0.5 1.1 7.4 0.3 ms 7.8 5.0 0.5 0.2 22.5
Simulation, STL 0.5 1.3 7.5 0.2 ms 7.7 0.6 0.5 0.2 18.2
Simulation, OBJ 0.5 1.2 7.6 0.3 ms 8.1 7.0 0.5 0.2 25.1
Visual, GLB 0.5 1.2 7.5 0.1 ms 16.2 0.2 1.5 0.2 27.3
Visual, OBJ 0.5 1.2 7.4 0.4 ms 15.8 6.0 2.2 0.2 33.4
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: macpro62-io-board.kicad_pcb
Folder kicad / macpro62-io-board
Complexity 237 / 1000 (size 162, features 75)
KESE features slotted holes, rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 143, 0, 0
Triangles, simulation 1,595,010 in 16 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 735 MB
STEP 284 MB 919 MB
STL 80 MB 752 MB
OBJ 180 MB 1.2 GB
Visual
GLB 47 MB 1.1 GB
OBJ 147 MB 1.1 GB

3021. mod_hdmi

mod_hdmi: stages 4 and 6 take 53% to 80% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 56 ms 0.1 0.5 0.1 ms 1.1 30 ms 0.1 0.2 2.2
Simulation, STEP 56 ms 0.2 0.5 0.1 ms 1.2 0.9 0.1 0.2 3.1
Simulation, STL 55 ms 0.1 0.5 0.1 ms 1.1 46 ms 0.1 0.2 2.2
Simulation, OBJ 84 ms 0.1 0.5 0.2 ms 1.1 0.8 0.1 0.2 2.9
Visual, GLB 60 ms 0.1 0.5 2 ms 1.7 21 ms 0.2 0.2 2.8
Visual, OBJ 74 ms 0.2 0.5 0.1 ms 1.8 0.6 0.2 0.2 3.4
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: mod_hdmi.kicad_pcb
Folder kicad / macpro62-io-modules / mod_hdmi
Complexity 196 / 1000 (size 131, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 4, 291, 24
Triangles, simulation 168,642 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.3 MB 211 MB
STEP 36 MB 223 MB
STL 8.4 MB 205 MB
OBJ 18 MB 207 MB
Visual
GLB 5.0 MB 175 MB
OBJ 14 MB 175 MB

3022. mod_usba

mod_usba: stages 4 and 6 take 62% to 81% of a run. Simulation, GLB takes 4.8 s. Simulation, STEP takes 6.5 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 6.1 s. Visual, GLB takes 5.2 s. Visual, OBJ takes 6.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 99 ms 0.3 1.6 0.3 ms 2.2 48 ms 0.3 0.2 4.8
Simulation, STEP 98 ms 0.3 1.6 0.2 ms 2.4 1.5 0.3 0.2 6.5
Simulation, STL 0.1 0.4 1.6 0.2 ms 2.2 69 ms 0.3 0.3 4.9
Simulation, OBJ 94 ms 0.3 1.6 0.2 ms 2.2 1.3 0.3 0.3 6.1
Visual, GLB 0.1 0.4 1.5 0.1 ms 2.8 36 ms 0.3 0.2 5.2
Visual, OBJ 96 ms 0.3 1.5 0.2 ms 2.7 1.0 0.2 0.2 6.0
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: mod_usba.kicad_pcb
Folder kicad / macpro62-io-modules / mod_usba
Complexity 190 / 1000 (size 125, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 4, 198, 19
Triangles, simulation 264,738 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 263 MB
STEP 57 MB 273 MB
STL 13 MB 262 MB
OBJ 29 MB 257 MB
Visual
GLB 7.1 MB 236 MB
OBJ 20 MB 237 MB

3023. mod_usbc

mod_usbc: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 4.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 92 ms 0.2 0.5 0.1 ms 1.4 39 ms 0.2 0.2 2.7
Simulation, STEP 91 ms 0.2 0.6 0.2 ms 1.3 1.1 0.2 0.2 3.7
Simulation, STL 76 ms 0.2 0.5 0.2 ms 1.2 45 ms 0.2 0.2 2.5
Simulation, OBJ 77 ms 0.2 0.6 0.1 ms 1.2 1.0 0.2 0.2 3.4
Visual, GLB 76 ms 0.2 0.5 0.2 ms 2.0 26 ms 0.2 0.2 3.3
Visual, OBJ 73 ms 0.2 0.5 0.1 ms 1.9 0.9 0.2 0.2 4.0
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: mod_usbc.kicad_pcb
Folder kicad / macpro62-io-modules / mod_usbc
Complexity 209 / 1000 (size 134, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 4, 361, 29
Triangles, simulation 184,304 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.9 MB 208 MB
STEP 39 MB 232 MB
STL 9.2 MB 206 MB
OBJ 19 MB 209 MB
Visual
GLB 5.5 MB 192 MB
OBJ 15 MB 188 MB

3024. panel_a25

panel_a25: stages 4 and 6 take 76% to 91% of a run. Simulation, GLB takes 76 s. Simulation, STEP takes 84 s. Simulation, STL takes 76 s. Simulation, OBJ takes 87 s. Visual, GLB takes 50 s. Visual, OBJ takes 59 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.8 18.7 0.6 ms 51.1 0.3 2.5 0.3 76.4
Simulation, STEP 0.7 2.6 18.5 0.4 ms 50.3 8.7 2.5 0.3 83.8
Simulation, STL 0.8 2.7 18.2 0.4 ms 50.9 0.5 2.4 0.3 75.9
Simulation, OBJ 0.8 2.7 19.2 0.3 ms 50.9 10.9 2.7 0.3 87.5
Visual, GLB 0.8 2.8 19.1 0.5 ms 25.2 0.2 1.7 0.3 50.1
Visual, OBJ 0.8 2.9 19.9 0.4 ms 25.4 8.1 2.1 0.3 59.5
Board Repo: winkleplex10-bit/the-mac-pro-project
Board: panel_a25.kicad_pcb
Folder kicad / macpro62-io-modules / panel / panel_a25
Complexity 220 / 1000 (size 165, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 22, 825, 88
Triangles, simulation 1,738,244 in 61 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 68 MB 969 MB
STEP 418 MB 1.0 GB
STL 87 MB 945 MB
OBJ 202 MB 1.4 GB
Visual
GLB 48 MB 1.2 GB
OBJ 142 MB 1.1 GB
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