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Corpus Testing 11

github-actions[bot] edited this page Nov 11, 2026 · 20 revisions

Corpus Page 11

Part 11 of 29 of Corpus Testing: boards 1,081 to 1,188, six runs each, one file format a run, as Corpus Testing describes.

1081. pcf8583_daughterboard

pcf8583_daughterboard: stages 4 and 6 take 52% to 78% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 3.2 s. Visual, OBJ takes 4.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.1 ms 0.7 32 ms 0.1 0.2 2.2
Simulation, STEP 93 ms 0.2 0.9 0.1 ms 0.8 1.0 0.1 0.2 3.3
Simulation, STL 92 ms 0.2 1.0 0.1 ms 0.8 50 ms 0.1 0.2 2.4
Simulation, OBJ 0.1 0.2 0.9 0.1 ms 0.8 0.9 0.1 0.2 3.2
Visual, GLB 0.1 0.2 0.9 0.1 ms 1.6 21 ms 0.2 0.2 3.2
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.7 0.8 0.2 0.2 4.1
Board Repo: google/myelin-acorn-electron-hardware
Board: pcf8583_daughterboard.kicad_pcb
Folder pcf8583_daughterboard / pcb
Complexity 171 / 1000 (size 116, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 14, 65, 2
Triangles, simulation 214,068 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.4 MB 215 MB
STEP 37 MB 237 MB
STL 11 MB 212 MB
OBJ 21 MB 213 MB
Visual
GLB 5.7 MB 212 MB
OBJ 16 MB 216 MB

1082. post_box_usb

post_box_usb: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 23 s. Simulation, STL takes 19 s. Simulation, OBJ takes 28 s. Visual, GLB takes 28 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 6.9 0.8 ms 7.9 0.3 1.0 0.3 18.5
Simulation, STEP 0.4 1.7 7.0 0.5 ms 7.6 5.4 1.0 0.2 23.4
Simulation, STL 0.4 1.8 7.3 0.6 ms 7.2 0.7 0.9 0.2 18.6
Simulation, OBJ 0.4 1.7 6.9 0.6 ms 7.6 10.0 1.0 0.3 28.0
Visual, GLB 0.4 1.8 6.8 0.7 ms 16.3 0.3 1.9 0.3 27.7
Visual, OBJ 0.5 1.7 6.8 0.8 ms 16.3 6.6 2.1 0.3 34.3
Board Repo: google/myelin-acorn-electron-hardware
Board: post_box_usb.kicad_pcb
Folder post_box_usb / pcb
Complexity 293 / 1000 (size 238, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 66, 1,109, 99
Triangles, simulation 2,050,030 in 121 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 673 MB
STEP 262 MB 871 MB
STL 103 MB 671 MB
OBJ 213 MB 1.4 GB
Visual
GLB 46 MB 956 MB
OBJ 141 MB 1.0 GB

1083. rom_socket_level_shifter

rom_socket_level_shifter: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 5.9 s. Simulation, STL takes 4.7 s. Simulation, OBJ takes 6.5 s. Visual, GLB takes 7.3 s. Visual, OBJ takes 8.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.8 0.3 ms 1.6 79 ms 0.3 0.2 4.5
Simulation, STEP 0.1 0.4 1.9 0.5 ms 1.6 1.5 0.3 0.2 5.9
Simulation, STL 0.1 0.4 1.8 0.3 ms 1.7 0.1 0.3 0.2 4.7
Simulation, OBJ 0.1 0.4 1.9 0.3 ms 1.6 2.1 0.3 0.2 6.5
Visual, GLB 0.2 0.4 1.9 0.3 ms 4.0 64 ms 0.5 0.2 7.3
Visual, OBJ 0.2 0.4 1.7 0.3 ms 3.8 1.6 0.4 0.3 8.4
Board Repo: google/myelin-acorn-electron-hardware
Board: rom_socket_level_shifter.kicad_pcb
Folder rom_socket_level_shifter / pcb
Complexity 194 / 1000 (size 149, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 463, 34
Triangles, simulation 479,746 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 277 MB
STEP 76 MB 341 MB
STL 24 MB 278 MB
OBJ 48 MB 361 MB
Visual
GLB 13 MB 357 MB
OBJ 38 MB 350 MB

1084. bbc_1mhz_serial_sd

bbc_1mhz_serial_sd: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.0 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.8 0.3 ms 2.7 0.1 0.4 0.2 8.0
Simulation, STEP 0.2 0.6 3.8 0.6 ms 2.7 2.3 0.4 0.2 10.1
Simulation, STL 0.2 0.6 3.6 0.3 ms 2.6 0.3 0.4 0.2 8.0
Simulation, OBJ 0.2 0.6 3.8 0.3 ms 2.5 4.4 0.4 0.3 12.1
Visual, GLB 0.2 0.6 3.6 0.6 ms 5.7 77 ms 0.6 0.2 11.1
Visual, OBJ 0.2 0.6 3.7 0.4 ms 5.7 3.0 0.8 0.2 14.2
Board Repo: google/myelin-acorn-electron-hardware
Board: bbc_1mhz_serial_sd.kicad_pcb
Folder serial_sd_adapter / bbc_1mhz_bus_pcb
Complexity 189 / 1000 (size 144, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 361, 19
Triangles, simulation 754,086 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 362 MB
STEP 138 MB 422 MB
STL 38 MB 359 MB
OBJ 77 MB 545 MB
Visual
GLB 18 MB 435 MB
OBJ 54 MB 464 MB

1085. standalone_programmer

standalone_programmer: stages 4 and 6 take 56% to 81% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.0 s. Simulation, STL takes 6.7 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 9.1 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.4 0.3 ms 2.1 91 ms 0.3 0.2 6.8
Simulation, STEP 0.1 0.6 3.1 0.3 ms 1.9 1.8 0.3 0.2 8.0
Simulation, STL 0.1 0.6 3.3 0.3 ms 1.9 0.2 0.4 0.3 6.7
Simulation, OBJ 0.1 0.6 3.4 0.4 ms 2.0 2.8 0.4 0.2 9.5
Visual, GLB 0.1 0.6 3.1 0.5 ms 4.2 65 ms 0.6 0.2 9.1
Visual, OBJ 0.2 0.6 3.3 0.3 ms 4.6 2.0 0.7 0.3 11.6
Board Repo: google/myelin-acorn-electron-hardware
Board: standalone_programmer.kicad_pcb
Folder standalone_cartridge_programmer / pcb
Complexity 198 / 1000 (size 143, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 11, 366, 18
Triangles, simulation 681,416 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 348 MB
STEP 120 MB 390 MB
STL 34 MB 326 MB
OBJ 70 MB 492 MB
Visual
GLB 15 MB 406 MB
OBJ 45 MB 405 MB

1086. xc9500xl_44_breakout

xc9500xl_44_breakout: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 8.5 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 3.5 0.6 ms 3.1 0.1 0.5 0.3 8.5
Simulation, STEP 0.3 0.8 3.7 0.5 ms 3.0 2.6 0.5 0.3 11.1
Simulation, STL 0.2 0.7 3.5 0.4 ms 3.0 0.2 0.4 0.2 8.2
Simulation, OBJ 0.2 0.8 3.4 0.6 ms 3.0 4.0 0.4 0.2 12.1
Visual, GLB 0.2 0.8 3.6 0.3 ms 6.3 90 ms 0.5 0.2 11.6
Visual, OBJ 0.2 0.8 3.6 0.8 ms 6.4 3.2 0.5 0.3 14.9
Board Repo: google/myelin-acorn-electron-hardware
Board: xc9500xl_44_breakout.kicad_pcb
Folder xc9500xl_44_breakout / pcb
Complexity 188 / 1000 (size 143, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 13, 269, 40
Triangles, simulation 750,304 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 405 MB
STEP 123 MB 460 MB
STL 38 MB 405 MB
OBJ 76 MB 535 MB
Visual
GLB 18 MB 442 MB
OBJ 55 MB 488 MB

1087. dvk-mx8m-bsb

dvk-mx8m-bsb: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 10.8 41.0 2 ms 42.3 2.3 5.6 0.4 104.8
Simulation, STEP 2.3 11.1 41.1 2 ms 42.6 22.1 5.1 0.4 124.8
Simulation, STL 2.3 10.6 41.3 2 ms 44.8 4.6 5.5 0.5 109.5
Simulation, OBJ 2.4 11.4 42.4 1 ms 43.8 65.0 6.4 0.5 171.8
Visual, GLB 2.4 12.3 43.2 3 ms 101.0 1.1 14.2 0.4 174.6
Visual, OBJ 2.4 11.2 41.9 2 ms 95.1 31.7 12.3 0.3 194.8
Board Repo: gralco/dvk-mx8m-bsb
Board: dvk-mx8m-bsb.kicad_pcb
Complexity 407 / 1000 (size 317, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 651, 17,587, 1,474
Triangles, simulation 11,609,834 in 629 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 403 MB 2.7 GB
STEP 1.6 GB 3.7 GB
STL 581 MB 2.9 GB
OBJ 1.3 GB 7.4 GB
Visual
GLB 236 MB 3.6 GB
OBJ 764 MB 4.9 GB

1088. librem5_mainboard

librem5_mainboard: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 5 min. Simulation, STEP takes 6 min. Simulation, STL takes 5 min. Simulation, OBJ takes 9 min. Visual, GLB takes 7 min. Visual, OBJ takes 7 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 7.2 47.6 135.3 4 ms 110.4 6.2 15.7 1.1 323.3
Simulation, STEP 7.2 46.3 131.7 2 ms 107.4 45.7 15.4 0.9 354.5
Simulation, STL 7.2 45.3 132.6 3 ms 114.8 11.0 17.0 1.1 329.0
Simulation, OBJ 7.8 49.2 144.4 2 ms 122.4 177.1 23.0 1.5 525.4
Visual, GLB 6.7 45.1 131.6 2 ms 205.7 1.8 18.3 0.8 409.9
Visual, OBJ 6.8 44.6 129.8 2 ms 197.8 48.6 16.3 0.8 444.6
Board Repo: gralco/l5-schematic
Board: librem5_mainboard.kicad_pcb
Folder CAD / KiCad / librem5_mainboard
Complexity 600 / 1000 (size 370, features 230)
KESE features through vias,
blind and buried vias, microvias,
slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026 to 11th November 2026
Copper layers 10
File format KiCad 10 (20260206)
Parts, tracks, vias 1,164, 19,488, 5,044
Triangles, simulation 21,846,464 in 866 parts
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with no memory cap and no time limit (swap added to a 16 GB machine), and passed
File
type
File
size
Peak memory
used
Simulation
GLB 751 MB 4.8 GB
STEP 2.5 GB 6.1 GB
STL 1.1 GB 4.7 GB
OBJ 2.5 GB 14 GB
Visual
GLB 283 MB 5.3 GB
OBJ 948 MB 6.3 GB

1089. librem5_usb-c_board

librem5_usb-c_board: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 18 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 22 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.2 5.7 0.5 ms 5.8 0.2 0.7 0.2 15.6
Simulation, STEP 0.8 2.1 5.6 0.5 ms 5.8 2.8 0.7 0.2 17.9
Simulation, STL 0.7 2.0 5.5 0.3 ms 5.9 0.5 0.7 0.2 15.5
Simulation, OBJ 0.8 2.2 5.8 0.7 ms 5.7 8.2 0.7 0.3 23.6
Visual, GLB 0.8 2.0 5.8 0.7 ms 11.8 0.1 0.9 0.2 21.6
Visual, OBJ 0.8 2.2 5.6 0.4 ms 11.6 4.5 0.9 0.3 25.8
Board Repo: gralco/l5-schematic
Board: librem5_usb-c_board.kicad_pcb
Folder CAD / KiCad / librem5_usb-c_board
Complexity 397 / 1000 (size 212, features 185)
KESE features through vias,
blind and buried vias, microvias,
slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 52, 1,102, 355
Triangles, simulation 1,417,846 in 76 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 49 MB 563 MB
STEP 149 MB 640 MB
STL 71 MB 564 MB
OBJ 147 MB 978 MB
Visual
GLB 25 MB 594 MB
OBJ 77 MB 639 MB

1090. librem5_usb-c_fpc

librem5_usb-c_fpc: stages 4 and 6 take 42% to 74% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.1 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.4 1.2 0.2 ms 1.0 59 ms 0.2 0.2 3.4
Simulation, STEP 0.4 0.3 1.1 0.2 ms 1.1 1.1 0.2 0.2 4.4
Simulation, STL 0.4 0.3 1.1 0.2 ms 1.1 80 ms 0.2 0.2 3.5
Simulation, OBJ 0.4 0.4 1.1 0.2 ms 1.1 1.8 0.2 0.2 5.1
Visual, GLB 0.4 0.4 1.1 0.2 ms 2.3 32 ms 0.2 0.2 4.6
Visual, OBJ 0.4 0.4 1.2 0.3 ms 2.3 1.1 0.2 0.2 5.7
Board Repo: gralco/l5-schematic
Board: librem5_usb-c_fpc.kicad_pcb
Folder CAD / KiCad / librem5_usb-c_fpc
Complexity 203 / 1000 (size 148, features 55)
KESE features through vias, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 2, 240, 96
Triangles, simulation 367,218 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 271 MB
STEP 39 MB 289 MB
STL 18 MB 266 MB
OBJ 37 MB 278 MB
Visual
GLB 7.5 MB 254 MB
OBJ 22 MB 247 MB

1091. librem5_mainboard

librem5_mainboard: stages 4 and 6 take 23% to 38% of a run. Simulation, GLB takes 36 min. Simulation, STEP takes 36 min. Simulation, STL takes 34 min. Visual, GLB takes 42 min. Visual, OBJ takes 39 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 9.7 1587.7 154.9 4 ms 359.8 9.5 26.9 1.4 2149.9
Simulation, STEP 8.2 1539.0 150.1 3 ms 348.4 85.7 26.2 1.2 2158.9
Simulation, STL 7.9 1507.8 146.9 4 ms 343.3 20.2 27.7 1.4 2055.2
Simulation, OBJ exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Visual, GLB 8.3 1522.9 150.6 3 ms 798.7 3.5 32.1 0.9 2517.0
Visual, OBJ 7.5 1345.4 130.5 6 ms 698.2 96.7 30.9 1.0 2310.2
Board Repo: gralco/l5-schematic
Board: librem5_mainboard.kicad_pcb
Folder CAD / PADS / librem5_mainboard / librem5_mainboard_kicad_conversion
Complexity 536 / 1000 (size 371, features 165)
KESE features through vias, padstacks,
slotted holes, drill offsets,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026 to 10th November 2026
Copper layers 10
File format KiCad 10 (20260206)
Parts, tracks, vias 1,161, 23,746, 5,044
Triangles, simulation 42,957,272 in 866 parts
Verifier Simulation, GLB: Verifier FAIL
Simulation, STEP: Verifier FAIL
Simulation, STL: Verifier FAIL
Simulation, OBJ: exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Bad design Bad design according to KESE: copper of two nets on top of each other in the file, a short KiCad's DRC reports; GND and 4G_POWER_KEY vias about 0.01 mm apart in 238 places, the first at (149.77, 116.06) mm (left so by the conversion from PADS). KESE models what the file says, so the Verifier rightly finds the two nets' solids overlapping
Run again Visual, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 1.4 GB 9.2 GB
STEP 4.5 GB 11 GB
STL 2.1 GB 9.2 GB
OBJ – 11 GB
Visual
GLB 655 MB 11 GB
OBJ 2.2 GB 14 GB

1092. amalthea

amalthea: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 5.7 s. Simulation, STEP takes 7.1 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 8.4 s. Visual, GLB takes 7.7 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.3 ms 2.1 0.1 0.2 0.2 5.7
Simulation, STEP 0.2 0.5 2.3 0.3 ms 2.0 1.7 0.3 0.2 7.1
Simulation, STL 0.2 0.5 2.3 0.3 ms 2.0 0.2 0.3 0.3 5.7
Simulation, OBJ 0.2 0.5 2.3 0.2 ms 2.1 2.9 0.3 0.2 8.4
Visual, GLB 0.2 0.5 2.3 0.3 ms 4.1 54 ms 0.5 0.2 7.7
Visual, OBJ 0.2 0.5 2.3 0.3 ms 4.1 1.6 0.6 0.2 9.5
Board Repo: greatscottgadgets/amalthea-hardware
Board: amalthea.kicad_pcb
Complexity 334 / 1000 (size 219, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 41, 440, 63
Triangles, simulation 747,338 in 69 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 350 MB
STEP 103 MB 410 MB
STL 37 MB 342 MB
OBJ 76 MB 532 MB
Visual
GLB 14 MB 388 MB
OBJ 41 MB 388 MB

1093. cydonia

cydonia: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 9.8 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.6 0.4 ms 3.1 0.2 0.4 0.3 9.8
Simulation, STEP 0.3 1.0 4.5 0.5 ms 3.0 2.5 0.4 0.3 12.0
Simulation, STL 0.3 0.9 4.5 0.5 ms 3.0 0.3 0.4 0.2 9.7
Simulation, OBJ 0.3 0.9 4.7 0.7 ms 3.0 4.5 0.4 0.2 14.0
Visual, GLB 0.3 1.0 4.7 0.6 ms 7.0 96 ms 0.7 0.3 13.9
Visual, OBJ 0.3 1.0 4.6 1 ms 6.8 2.7 0.8 0.3 16.4
Board Repo: greatscottgadgets/cydonia
Board: cydonia.kicad_pcb
Complexity 299 / 1000 (size 234, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 107, 574, 74
Triangles, simulation 920,804 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 452 MB
STEP 124 MB 484 MB
STL 46 MB 454 MB
OBJ 96 MB 679 MB
Visual
GLB 19 MB 473 MB
OBJ 57 MB 499 MB

1094. cynthion

cynthion: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 56 s. Simulation, STEP takes 68 s. Simulation, STL takes 57 s. Simulation, OBJ takes 90 s. Visual, GLB takes 80 s. Visual, OBJ takes 98 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.1 21.7 2 ms 23.1 1.2 2.9 0.3 55.6
Simulation, STEP 1.5 5.1 21.4 0.9 ms 23.0 13.7 2.9 0.3 67.9
Simulation, STL 1.4 5.2 21.8 1 ms 23.5 2.2 3.0 0.3 57.4
Simulation, OBJ 1.4 5.3 21.7 1 ms 23.3 35.3 3.1 0.4 90.5
Visual, GLB 1.4 5.3 21.3 1.0 ms 45.3 0.5 5.5 0.3 79.7
Visual, OBJ 1.5 5.2 21.9 1.0 ms 46.2 18.2 5.0 0.3 98.3
Board Repo: greatscottgadgets/cynthion-hardware
Board: cynthion.kicad_pcb
Complexity 454 / 1000 (size 304, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 294, 3,622, 651
Triangles, simulation 6,192,160 in 391 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 212 MB 1.5 GB
STEP 929 MB 2.1 GB
STL 310 MB 1.7 GB
OBJ 676 MB 4.0 GB
Visual
GLB 112 MB 1.9 GB
OBJ 364 MB 2.5 GB

1095. gig-e

gig-e: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 26 s. Simulation, OBJ takes 40 s. Visual, GLB takes 38 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.9 11.2 0.6 ms 8.7 0.4 1.3 0.2 25.3
Simulation, STEP 0.6 2.9 11.5 0.9 ms 8.5 5.9 1.2 0.3 30.9
Simulation, STL 0.6 3.0 11.4 0.9 ms 8.7 1.0 1.3 0.3 26.3
Simulation, OBJ 0.6 3.0 11.5 1 ms 8.7 14.2 1.3 0.3 39.6
Visual, GLB 0.6 2.9 11.2 0.6 ms 20.2 0.3 2.7 0.2 38.1
Visual, OBJ 0.6 2.8 11.2 1 ms 19.4 9.1 2.9 0.2 46.3
Board Repo: greatscottgadgets/daisho
Board: gig-e.kicad_pcb
Folder hw / de2-115-frontend / gig-e
Complexity 307 / 1000 (size 272, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 181, 2,692, 396
Triangles, simulation 2,547,136 in 199 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 90 MB 882 MB
STEP 353 MB 1.1 GB
STL 127 MB 911 MB
OBJ 273 MB 1.7 GB
Visual
GLB 61 MB 1.1 GB
OBJ 188 MB 1.3 GB

1096. hdmi

hdmi: stages 4 and 6 take 45% to 83% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 54 s. Simulation, STL takes 46 s. Simulation, OBJ takes 77 s. Visual, GLB takes 72 s. Visual, OBJ takes 87 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.9 15.8 1.0 ms 18.6 0.9 2.6 0.3 44.2
Simulation, STEP 0.9 5.0 14.8 1.0 ms 19.3 11.5 2.5 0.3 54.4
Simulation, STL 1.0 5.3 15.1 3 ms 20.2 1.8 2.5 0.4 46.2
Simulation, OBJ 1.0 4.9 15.1 2 ms 19.9 33.3 2.8 0.4 77.4
Visual, GLB 1.0 5.0 16.8 1 ms 43.3 0.6 5.0 0.4 71.9
Visual, OBJ 1.0 5.4 15.0 1 ms 42.8 17.9 4.4 0.3 86.8
Board Repo: greatscottgadgets/daisho
Board: hdmi.kicad_pcb
Folder hw / de2-115-frontend / hdmi
Complexity 354 / 1000 (size 299, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 6
File format KiCad 3 (3)
Parts, tracks, vias 221, 2,755, 605
Triangles, simulation 4,787,176 in 387 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 164 MB 1.4 GB
STEP 555 MB 1.7 GB
STL 239 MB 1.3 GB
OBJ 513 MB 3.0 GB
Visual
GLB 92 MB 1.7 GB
OBJ 296 MB 1.9 GB

1097. rs232

rs232: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.3 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.0 0.5 ms 3.0 0.1 0.4 0.2 7.7
Simulation, STEP 0.2 0.8 3.0 0.5 ms 3.2 2.5 0.4 0.2 10.4
Simulation, STL 0.2 0.8 3.0 0.4 ms 3.4 0.2 0.4 0.2 8.3
Simulation, OBJ 0.2 0.9 3.1 0.5 ms 3.3 4.0 0.4 0.2 12.1
Visual, GLB 0.2 0.8 3.0 0.7 ms 7.1 0.1 0.9 0.2 12.3
Visual, OBJ 0.2 0.8 3.0 0.7 ms 6.9 3.5 1.0 0.2 15.7
Board Repo: greatscottgadgets/daisho
Board: rs232.kicad_pcb
Folder hw / de2-115-frontend / rs232
Complexity 222 / 1000 (size 177, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 3 (3)
Parts, tracks, vias 41, 1,007, 149
Triangles, simulation 780,252 in 111 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 447 MB
STEP 129 MB 483 MB
STL 39 MB 423 MB
OBJ 79 MB 563 MB
Visual
GLB 23 MB 577 MB
OBJ 71 MB 596 MB

1098. gige_fe

gige_fe: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 33 s. Visual, GLB takes 31 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.3 8.8 0.9 ms 7.1 0.4 1.0 0.3 20.3
Simulation, STEP 0.5 2.4 9.0 0.9 ms 7.0 4.8 0.9 0.3 24.9
Simulation, STL 0.5 2.5 8.9 0.8 ms 7.3 0.9 0.9 0.2 21.3
Simulation, OBJ 0.5 2.6 9.0 1 ms 7.5 12.5 1.0 0.3 33.4
Visual, GLB 0.4 2.4 9.2 0.9 ms 16.9 0.2 1.8 0.2 31.2
Visual, OBJ 0.5 2.7 9.0 2 ms 17.1 8.3 2.3 0.3 40.1
Board Repo: greatscottgadgets/daisho
Board: gige_fe.kicad_pcb
Folder hw / frontend / daisho_gige_fe
Complexity 306 / 1000 (size 261, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 138, 1,686, 264
Triangles, simulation 2,142,834 in 260 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 75 MB 801 MB
STEP 291 MB 856 MB
STL 107 MB 840 MB
OBJ 228 MB 1.4 GB
Visual
GLB 46 MB 890 MB
OBJ 140 MB 1.0 GB

1099. rs232_fe

rs232_fe: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 41 s. Visual, GLB takes 39 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.6 11.4 2 ms 8.5 0.4 1.3 0.3 25.1
Simulation, STEP 0.6 2.8 11.1 1.0 ms 8.6 6.3 1.3 0.3 31.0
Simulation, STL 0.6 2.9 11.8 1 ms 9.3 0.8 1.4 0.3 26.9
Simulation, OBJ 0.6 3.0 12.2 1 ms 9.4 14.2 1.4 0.3 41.0
Visual, GLB 0.6 2.9 11.6 1 ms 21.6 0.2 2.1 0.3 39.3
Visual, OBJ 0.5 2.8 11.1 1.0 ms 21.0 8.3 2.0 0.2 46.0
Board Repo: greatscottgadgets/daisho
Board: rs232_fe.kicad_pcb
Folder hw / frontend / daisho_rs232_fe / rs232_fe
Complexity 275 / 1000 (size 220, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 165, 2,512, 181
Triangles, simulation 2,309,022 in 309 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 871 MB
STEP 345 MB 921 MB
STL 115 MB 817 MB
OBJ 250 MB 1.6 GB
Visual
GLB 52 MB 1.0 GB
OBJ 161 MB 1.1 GB

1100. hdmi

hdmi: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 48 s. Simulation, STEP takes 58 s. Simulation, STL takes 49 s. Simulation, OBJ takes 77 s. Visual, GLB takes 65 s. Visual, OBJ takes 81 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.1 19.0 1 ms 19.0 1.1 2.2 0.4 47.7
Simulation, STEP 1.0 5.3 19.0 0.8 ms 19.9 10.1 2.6 0.3 58.0
Simulation, STL 1.0 5.0 19.3 2 ms 19.3 1.6 2.6 0.4 49.1
Simulation, OBJ 0.9 5.5 19.4 1 ms 19.1 28.8 2.5 0.4 76.5
Visual, GLB 1.0 5.4 19.3 1 ms 34.7 0.4 4.3 0.4 65.4
Visual, OBJ 0.9 5.2 19.2 2 ms 35.4 15.0 5.3 0.3 81.3
Board Repo: greatscottgadgets/daisho
Board: hdmi.kicad_pcb
Folder hw / frontend / hdmi
Complexity 346 / 1000 (size 301, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 224, 3,608, 525
Triangles, simulation 4,443,754 in 345 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 155 MB 1.3 GB
STEP 527 MB 1.6 GB
STL 222 MB 1.3 GB
OBJ 480 MB 2.9 GB
Visual
GLB 83 MB 1.6 GB
OBJ 264 MB 1.8 GB

1101. prod_fe

prod_fe: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.9 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.0 0.3 ms 1.0 45 ms 0.2 0.2 2.8
Simulation, STEP 0.1 0.3 1.0 0.4 ms 1.0 1.1 0.2 0.3 3.9
Simulation, STL 0.1 0.3 1.0 0.4 ms 1.0 71 ms 0.2 0.2 2.9
Simulation, OBJ 0.1 0.3 1.0 0.4 ms 1.0 1.0 0.2 0.2 3.8
Visual, GLB 0.1 0.3 1.0 0.4 ms 3.5 34 ms 0.2 0.2 5.3
Visual, OBJ 0.1 0.3 1.0 0.6 ms 3.4 0.8 0.2 0.2 6.1
Board Repo: greatscottgadgets/daisho
Board: prod_fe.kicad_pcb
Folder hw / frontend / prod_fe_template
Complexity 171 / 1000 (size 146, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 5, 208, 28
Triangles, simulation 204,920 in 174 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 224 MB
STEP 28 MB 232 MB
STL 10 MB 216 MB
OBJ 21 MB 224 MB
Visual
GLB 5.3 MB 199 MB
OBJ 15 MB 204 MB

1102. usb

usb: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 70 s. Simulation, STL takes 63 s. Simulation, OBJ takes 95 s. Visual, GLB takes 82 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 7.2 24.1 3 ms 21.4 1.1 2.7 0.3 57.7
Simulation, STEP 0.9 7.3 24.9 1 ms 22.0 12.2 2.6 0.3 70.1
Simulation, STL 0.9 8.5 24.5 2 ms 23.0 2.4 2.9 0.4 62.6
Simulation, OBJ 0.9 7.7 24.7 1 ms 22.3 36.5 2.6 0.4 95.2
Visual, GLB 0.9 7.3 24.5 2 ms 43.3 0.5 5.0 0.3 81.8
Visual, OBJ 1.0 7.7 24.7 1 ms 45.8 21.6 5.0 0.3 106.1
Board Repo: greatscottgadgets/daisho
Board: usb.kicad_pcb
Folder hw / frontend / usb
Complexity 333 / 1000 (size 308, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 249, 5,119, 831
Triangles, simulation 5,867,216 in 325 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 202 MB 1.5 GB
STEP 706 MB 2.0 GB
STL 293 MB 1.6 GB
OBJ 640 MB 3.8 GB
Visual
GLB 110 MB 1.8 GB
OBJ 360 MB 2.4 GB

1103. main_board

main_board: stages 4 and 6 take 46% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 12.1 44.8 2 ms 41.1 2.4 5.7 0.5 108.3
Simulation, STEP 1.6 12.1 44.2 2 ms 41.4 23.8 6.2 0.5 129.9
Simulation, STL 1.8 12.4 44.6 3 ms 41.5 5.2 6.4 0.5 112.4
Simulation, OBJ 1.7 12.4 44.5 2 ms 41.2 80.1 6.3 0.5 186.7
Visual, GLB 1.8 12.4 44.9 3 ms 79.1 0.9 9.9 0.4 149.3
Visual, OBJ 1.9 12.8 46.2 3 ms 86.3 33.2 10.6 0.4 191.3
Board Repo: greatscottgadgets/daisho
Board: main_board.kicad_pcb
Folder hw / main_board
Complexity 375 / 1000 (size 330, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 8
File format KiCad 4 (4)
Parts, tracks, vias 383, 8,842, 1,485
Triangles, simulation 12,543,244 in 692 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 428 MB 2.4 GB
STEP 1.3 GB 3.6 GB
STL 627 MB 2.4 GB
OBJ 1.4 GB 7.9 GB
Visual
GLB 192 MB 3.2 GB
OBJ 649 MB 4.2 GB

1104. azalea

azalea: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 23 s. Simulation, OBJ takes 33 s. Visual, GLB takes 32 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.5 9.1 0.9 ms 8.3 0.4 1.1 0.3 22.1
Simulation, STEP 0.4 2.4 9.2 1 ms 8.2 5.2 1.2 0.3 26.8
Simulation, STL 0.5 2.5 9.1 2 ms 8.3 0.7 1.2 0.3 22.6
Simulation, OBJ 0.4 2.6 9.1 1 ms 8.2 11.8 1.1 0.2 33.4
Visual, GLB 0.5 2.4 8.9 1 ms 17.8 0.3 2.1 0.3 32.2
Visual, OBJ 0.4 2.6 9.3 1 ms 18.0 6.4 1.9 0.3 39.0
Board Repo: greatscottgadgets/greatfet-hardware
Board: azalea.kicad_pcb
Folder azalea
Complexity 300 / 1000 (size 245, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 84, 1,412, 176
Triangles, simulation 2,293,082 in 149 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 702 MB
STEP 329 MB 832 MB
STL 115 MB 717 MB
OBJ 244 MB 1.5 GB
Visual
GLB 48 MB 870 MB
OBJ 149 MB 1.1 GB

1105. begonia

begonia: stages 4 and 6 take 57% to 83% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 9.6 s. Simulation, STL takes 8.1 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.6 4.0 0.4 ms 2.5 0.1 0.4 0.2 8.0
Simulation, STEP 0.2 0.7 3.8 0.7 ms 2.4 2.0 0.4 0.2 9.6
Simulation, STL 0.1 0.7 3.8 0.7 ms 2.6 0.2 0.4 0.2 8.1
Simulation, OBJ 0.1 0.6 4.0 0.6 ms 2.6 3.6 0.4 0.2 11.5
Visual, GLB 0.2 0.7 4.0 0.9 ms 5.0 53 ms 0.6 0.3 10.7
Visual, OBJ 0.2 0.6 3.9 0.6 ms 4.8 1.6 0.6 0.2 12.0
Board Repo: greatscottgadgets/greatfet-hardware
Board: begonia.kicad_pcb
Folder begonia
Complexity 162 / 1000 (size 117, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 68, 3
Triangles, simulation 705,624 in 117 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 327 MB
STEP 106 MB 411 MB
STL 35 MB 326 MB
OBJ 71 MB 506 MB
Visual
GLB 12 MB 363 MB
OBJ 34 MB 368 MB

1106. crocus

crocus: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 14 s. Simulation, OBJ takes 23 s. Visual, GLB takes 18 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.3 6.0 0.5 ms 4.4 0.3 0.7 0.3 13.2
Simulation, STEP 0.4 1.5 6.3 0.5 ms 4.7 3.4 0.7 0.3 17.1
Simulation, STL 0.3 1.4 6.4 0.5 ms 4.6 0.4 0.8 0.2 14.2
Simulation, OBJ 0.3 1.4 6.3 0.5 ms 5.1 8.5 0.7 0.3 22.7
Visual, GLB 0.3 1.4 6.4 0.6 ms 8.3 90 ms 0.9 0.2 17.6
Visual, OBJ 0.3 1.3 6.3 0.8 ms 8.0 3.6 1.0 0.2 20.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: crocus.kicad_pcb
Folder crocus
Complexity 220 / 1000 (size 175, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 49, 298, 46
Triangles, simulation 1,310,436 in 132 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 471 MB
STEP 169 MB 546 MB
STL 66 MB 486 MB
OBJ 135 MB 870 MB
Visual
GLB 21 MB 577 MB
OBJ 62 MB 529 MB

1107. daffodil

daffodil: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 13 s. Simulation, OBJ takes 18 s. Visual, GLB takes 15 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 6.1 0.5 ms 3.9 0.2 0.4 0.2 12.0
Simulation, STEP 0.2 0.9 6.1 0.7 ms 4.2 3.1 0.4 0.2 15.1
Simulation, STL 0.2 1.0 6.3 0.5 ms 4.0 0.4 0.5 0.2 12.6
Simulation, OBJ 0.2 0.9 6.1 0.5 ms 4.0 5.7 0.5 0.2 17.6
Visual, GLB 0.2 1.0 6.4 0.5 ms 6.0 77 ms 0.7 0.2 14.5
Visual, OBJ 0.2 1.0 6.5 0.5 ms 6.3 2.6 0.7 0.3 17.5
Board Repo: greatscottgadgets/greatfet-hardware
Board: daffodil.kicad_pcb
Folder daffodil
Complexity 137 / 1000 (size 97, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 30, 0
Triangles, simulation 1,112,878 in 154 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 443 MB
STEP 172 MB 558 MB
STL 56 MB 430 MB
OBJ 113 MB 786 MB
Visual
GLB 18 MB 491 MB
OBJ 53 MB 513 MB

1108. edelweiss

edelweiss: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.5 s. Simulation, STL takes 6.8 s. Simulation, OBJ takes 11 s. Visual, GLB takes 7.7 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 3.1 0.1 ms 2.5 98 ms 0.3 0.2 6.8
Simulation, STEP 0.1 0.5 3.2 0.2 ms 2.1 2.0 0.3 0.2 8.5
Simulation, STL 0.2 0.5 3.2 0.3 ms 2.3 0.2 0.3 0.3 6.8
Simulation, OBJ 0.1 0.5 3.2 0.1 ms 2.5 3.9 0.3 0.3 10.8
Visual, GLB 0.2 0.6 3.3 0.3 ms 3.0 43 ms 0.3 0.2 7.7
Visual, OBJ 0.2 0.5 2.9 0.4 ms 3.0 1.4 0.4 0.2 8.5
Board Repo: greatscottgadgets/greatfet-hardware
Board: edelweiss.kicad_pcb
Folder edelweiss
Complexity 96 / 1000 (size 56, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 7, 0, 0
Triangles, simulation 829,404 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 371 MB
STEP 99 MB 443 MB
STL 41 MB 376 MB
OBJ 83 MB 591 MB
Visual
GLB 10 MB 362 MB
OBJ 30 MB 360 MB

1109. foxglove

foxglove: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 5.8 0.6 ms 3.3 0.2 0.5 0.3 11.1
Simulation, STEP 0.3 0.8 5.5 0.9 ms 3.4 2.7 0.5 0.3 13.5
Simulation, STL 0.2 0.7 5.5 0.7 ms 3.3 0.3 0.5 0.3 10.7
Simulation, OBJ 0.2 0.8 5.9 1.0 ms 3.3 5.4 0.5 0.2 16.5
Visual, GLB 0.2 0.8 5.4 0.6 ms 5.9 77 ms 0.7 0.2 13.3
Visual, OBJ 0.3 0.8 5.4 1 ms 6.3 2.5 0.8 0.3 16.4
Board Repo: greatscottgadgets/greatfet-hardware
Board: foxglove.kicad_pcb
Folder foxglove
Complexity 242 / 1000 (size 187, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 19, 318, 24
Triangles, simulation 855,148 in 137 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 375 MB
STEP 133 MB 464 MB
STL 43 MB 361 MB
OBJ 87 MB 632 MB
Visual
GLB 15 MB 433 MB
OBJ 44 MB 427 MB

1110. gladiolus

gladiolus: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 36 s. Visual, GLB takes 32 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 11.3 0.6 ms 8.2 0.4 1.1 0.3 24.3
Simulation, STEP 0.5 2.5 11.6 0.7 ms 8.1 5.4 1.2 0.3 29.5
Simulation, STL 0.4 2.4 11.1 0.7 ms 8.1 0.8 1.2 0.2 24.2
Simulation, OBJ 0.4 2.3 11.5 0.5 ms 8.4 12.0 1.1 0.3 36.0
Visual, GLB 0.4 2.5 11.4 0.8 ms 15.8 0.2 1.8 0.2 32.3
Visual, OBJ 0.4 2.4 11.4 0.8 ms 16.8 7.4 1.5 0.2 40.2
Board Repo: greatscottgadgets/greatfet-hardware
Board: gladiolus.kicad_pcb
Folder gladiolus
Complexity 299 / 1000 (size 244, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 138, 962, 106
Triangles, simulation 2,062,476 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 782 MB
STEP 326 MB 859 MB
STL 103 MB 661 MB
OBJ 217 MB 1.3 GB
Visual
GLB 40 MB 856 MB
OBJ 122 MB 938 MB

1111. jasmine

jasmine: stages 4 and 6 take 58% to 83% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 25 s. Visual, GLB takes 21 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.1 8.2 0.7 ms 5.3 0.2 0.5 0.3 16.9
Simulation, STEP 0.3 1.7 7.4 0.6 ms 5.0 3.8 0.6 0.3 19.0
Simulation, STL 0.3 1.6 7.6 1 ms 5.1 0.4 0.7 0.3 16.0
Simulation, OBJ 0.3 2.0 8.5 1 ms 5.8 7.1 0.6 0.3 24.7
Visual, GLB 0.4 1.7 7.4 0.8 ms 10.3 0.1 1.0 0.3 21.3
Visual, OBJ 0.3 1.9 8.8 0.5 ms 11.0 5.5 0.9 0.3 28.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: jasmine.kicad_pcb
Folder jasmine
Complexity 218 / 1000 (size 163, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 69, 349, 37
Triangles, simulation 1,031,328 in 156 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 408 MB
STEP 163 MB 510 MB
STL 52 MB 428 MB
OBJ 106 MB 754 MB
Visual
GLB 20 MB 504 MB
OBJ 59 MB 484 MB

1112. lily

lily: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 4.6 0.5 ms 3.5 0.2 0.6 0.2 10.2
Simulation, STEP 0.2 1.0 4.5 0.4 ms 3.4 2.5 0.5 0.2 12.4
Simulation, STL 0.3 1.0 4.3 0.4 ms 3.4 0.3 0.5 0.2 10.0
Simulation, OBJ 0.2 1.1 4.7 1 ms 3.5 5.2 0.6 0.3 15.5
Visual, GLB 0.2 0.9 4.6 0.6 ms 6.4 64 ms 0.6 0.3 13.1
Visual, OBJ 0.2 1.0 4.6 1 ms 6.2 2.1 0.7 0.2 15.1
Board Repo: greatscottgadgets/greatfet-hardware
Board: lily.kicad_pcb
Folder lily
Complexity 212 / 1000 (size 157, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 31, 139, 17
Triangles, simulation 1,061,168 in 122 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 383 MB
STEP 134 MB 472 MB
STL 53 MB 394 MB
OBJ 107 MB 747 MB
Visual
GLB 15 MB 436 MB
OBJ 44 MB 428 MB

1113. luckybamboo

luckybamboo: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 32 s. Simulation, STL takes 27 s. Simulation, OBJ takes 39 s. Visual, GLB takes 33 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 11.9 0.8 ms 9.6 0.5 1.2 0.2 26.5
Simulation, STEP 0.5 2.5 12.3 1 ms 9.6 5.7 1.2 0.3 32.1
Simulation, STL 0.5 2.7 11.9 0.8 ms 9.5 0.7 1.1 0.2 26.7
Simulation, OBJ 0.5 2.5 11.4 0.8 ms 9.4 13.9 1.1 0.2 39.0
Visual, GLB 0.5 2.5 11.9 0.8 ms 16.1 0.2 1.5 0.2 32.9
Visual, OBJ 0.5 2.5 11.8 2 ms 16.1 7.0 1.8 0.2 39.9
Board Repo: greatscottgadgets/greatfet-hardware
Board: luckybamboo.kicad_pcb
Folder luckybamboo
Complexity 336 / 1000 (size 281, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 153, 1,754, 197
Triangles, simulation 2,657,326 in 183 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 92 MB 827 MB
STEP 351 MB 979 MB
STL 133 MB 884 MB
OBJ 283 MB 1.8 GB
Visual
GLB 48 MB 901 MB
OBJ 147 MB 1.0 GB

1114. narcissus

narcissus: stages 4 and 6 take 60% to 88% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 37 s. Simulation, STL takes 30 s. Simulation, OBJ takes 44 s. Visual, GLB takes 36 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.0 15.7 0.6 ms 10.1 0.3 1.6 0.3 30.4
Simulation, STEP 0.5 1.9 15.6 0.8 ms 10.1 6.8 1.7 0.3 36.9
Simulation, STL 0.4 2.0 15.5 0.6 ms 9.7 0.8 1.6 0.2 30.2
Simulation, OBJ 0.4 2.0 15.8 0.6 ms 10.3 13.4 1.6 0.3 43.8
Visual, GLB 0.4 1.7 13.4 0.8 ms 18.6 0.3 1.7 0.3 36.4
Visual, OBJ 0.4 1.9 15.5 0.5 ms 16.5 7.1 1.4 0.4 43.1
Board Repo: greatscottgadgets/greatfet-hardware
Board: narcissus.kicad_pcb
Folder narcissus
Complexity 280 / 1000 (size 225, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 51, 1,212, 68
Triangles, simulation 2,432,446 in 193 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 728 MB
STEP 424 MB 977 MB
STL 122 MB 752 MB
OBJ 257 MB 1.6 GB
Visual
GLB 44 MB 977 MB
OBJ 135 MB 1.0 GB

1115. neighbor-template

neighbor-template: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.1 s. Simulation, OBJ takes 13 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 5.0 0.2 ms 4.1 0.2 0.5 0.3 11.1
Simulation, STEP 0.2 0.8 4.7 0.2 ms 3.3 2.9 0.5 0.3 12.6
Simulation, STL 0.2 0.8 4.3 0.1 ms 3.0 0.2 0.4 0.2 9.1
Simulation, OBJ 0.2 0.6 4.0 0.2 ms 2.8 4.8 0.5 0.3 13.3
Visual, GLB 0.2 0.8 4.5 0.4 ms 3.7 48 ms 0.4 0.3 10.0
Visual, OBJ 0.2 0.7 4.1 0.2 ms 3.8 2.0 0.5 0.3 11.6
Board Repo: greatscottgadgets/greatfet-hardware
Board: neighbor-template.kicad_pcb
Folder neighbor-template
Complexity 96 / 1000 (size 56, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 7, 0, 0
Triangles, simulation 829,656 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 353 MB
STEP 99 MB 441 MB
STL 41 MB 380 MB
OBJ 83 MB 589 MB
Visual
GLB 10 MB 360 MB
OBJ 30 MB 365 MB

1116. quince

quince: stages 4 and 6 take 56% to 86% of a run. Simulation, GLB takes 9.9 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 5.0 0.7 ms 3.1 0.1 0.4 0.2 9.9
Simulation, STEP 0.2 0.8 5.6 0.7 ms 3.1 2.7 0.4 0.3 13.1
Simulation, STL 0.2 0.7 5.5 0.4 ms 3.2 0.2 0.4 0.2 10.5
Simulation, OBJ 0.2 0.7 5.2 0.4 ms 3.2 5.0 0.4 0.2 14.9
Visual, GLB 0.2 0.7 5.2 0.3 ms 5.6 77 ms 0.5 0.3 12.7
Visual, OBJ 0.2 0.8 5.4 0.5 ms 5.8 2.7 0.6 0.3 15.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: quince.kicad_pcb
Folder quince
Complexity 184 / 1000 (size 129, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 26, 76, 10
Triangles, simulation 859,922 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 390 MB
STEP 134 MB 456 MB
STL 43 MB 421 MB
OBJ 88 MB 627 MB
Visual
GLB 15 MB 439 MB
OBJ 46 MB 424 MB

1117. hackrf-one

hackrf-one: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 70 s. Simulation, STEP takes 81 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 91 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 6.9 30.9 2 ms 26.5 1.0 2.8 0.4 70.2
Simulation, STEP 1.5 6.6 30.1 2 ms 26.6 13.1 2.7 0.3 81.0
Simulation, STL 1.5 6.8 30.3 2 ms 26.4 1.7 2.7 0.4 69.8
Simulation, OBJ 1.4 6.8 30.5 1 ms 27.3 31.8 3.0 0.4 101.2
Visual, GLB 1.5 6.7 31.2 1 ms 45.6 0.5 5.2 0.4 91.0
Visual, OBJ 1.6 7.4 33.9 3 ms 47.6 17.3 4.9 0.4 113.1
Board Repo: greatscottgadgets/hackrf
Board: hackrf-one.kicad_pcb
Folder hardware / hackrf-one
Complexity 396 / 1000 (size 291, features 105)
KESE features through vias, filled zones,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 346, 3,817, 498
Triangles, simulation 4,917,978 in 392 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 173 MB 1.5 GB
STEP 687 MB 1.8 GB
STL 246 MB 1.5 GB
OBJ 541 MB 3.3 GB
Visual
GLB 95 MB 1.6 GB
OBJ 304 MB 2.1 GB

1118. LNA915

LNA915: stages 4 and 6 take 50% to 77% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.3 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.2 ms 0.8 37 ms 84 ms 0.2 2.3
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.7 1.0 98 ms 0.2 3.1
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.8 50 ms 0.1 0.3 2.6
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.9 1.0 0.1 0.2 3.3
Visual, GLB 0.1 0.2 0.9 0.2 ms 1.7 19 ms 0.1 0.3 3.3
Visual, OBJ 0.1 0.2 0.9 0.2 ms 1.7 0.5 0.1 0.2 3.7
Board Repo: greatscottgadgets/hackrf
Board: LNA915.kicad_pcb
Folder hardware / LNA915
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 124, 8
Triangles, simulation 207,672 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 205 MB
STEP 26 MB 221 MB
STL 10 MB 211 MB
OBJ 22 MB 214 MB
Visual
GLB 3.8 MB 167 MB
OBJ 11 MB 165 MB

1119. marzipan

marzipan: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 71 s. Simulation, STL takes 60 s. Simulation, OBJ takes 84 s. Visual, GLB takes 78 s. Visual, OBJ takes 92 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 5.3 27.0 2 ms 21.2 0.8 2.5 0.3 58.1
Simulation, STEP 1.0 5.3 27.6 2 ms 22.1 11.8 2.5 0.3 70.6
Simulation, STL 1.0 5.5 27.4 2 ms 21.5 1.5 2.8 0.3 59.9
Simulation, OBJ 1.0 5.4 26.9 2 ms 21.2 27.1 2.5 0.3 84.4
Visual, GLB 0.9 5.6 27.1 2 ms 39.5 0.4 4.0 0.3 78.0
Visual, OBJ 1.0 5.5 26.3 2 ms 39.5 14.9 4.3 0.3 91.8
Board Repo: greatscottgadgets/hackrf
Board: marzipan.kicad_pcb
Folder hardware / marzipan
Complexity 336 / 1000 (size 291, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 340, 3,928, 500
Triangles, simulation 4,858,612 in 391 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 170 MB 1.4 GB
STEP 669 MB 1.8 GB
STL 243 MB 1.4 GB
OBJ 539 MB 3.2 GB
Visual
GLB 95 MB 1.6 GB
OBJ 303 MB 2.1 GB

1120. neapolitan

neapolitan: stages 4 and 6 take 58% to 85% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 41 s. Simulation, STL takes 37 s. Simulation, OBJ takes 51 s. Visual, GLB takes 48 s. Visual, OBJ takes 56 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.3 17.2 1 ms 12.1 0.5 1.4 0.3 35.6
Simulation, STEP 0.6 3.1 17.1 0.6 ms 12.0 6.9 1.5 0.3 41.4
Simulation, STL 0.6 3.4 17.7 0.8 ms 11.8 1.1 1.6 0.3 36.6
Simulation, OBJ 0.6 3.4 17.3 0.5 ms 12.0 15.9 1.5 0.3 51.0
Visual, GLB 0.7 3.2 16.7 1 ms 24.2 0.3 2.7 0.3 48.2
Visual, OBJ 0.5 3.0 16.9 0.6 ms 23.2 8.7 3.0 0.2 55.5
Board Repo: greatscottgadgets/hackrf
Board: neapolitan.kicad_pcb
Folder hardware / neapolitan
Complexity 318 / 1000 (size 273, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 241, 1,961, 272
Triangles, simulation 3,033,820 in 180 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 106 MB 1.0 GB
STEP 411 MB 1.2 GB
STL 152 MB 948 MB
OBJ 334 MB 2.1 GB
Visual
GLB 58 MB 1.2 GB
OBJ 181 MB 1.3 GB

1121. operacake

operacake: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 33 s. Simulation, OBJ takes 49 s. Visual, GLB takes 42 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 3.5 14.1 0.7 ms 12.3 0.6 1.6 0.3 33.0
Simulation, STEP 0.5 3.5 14.1 1 ms 12.3 7.2 1.7 0.3 39.6
Simulation, STL 0.6 3.5 13.9 0.6 ms 12.4 0.9 1.7 0.3 33.4
Simulation, OBJ 0.6 3.5 13.8 0.8 ms 12.3 16.9 1.6 0.3 49.1
Visual, GLB 0.5 3.3 14.1 0.7 ms 21.2 0.2 2.7 0.2 42.3
Visual, OBJ 0.6 3.5 13.5 0.8 ms 22.0 7.7 2.7 0.3 50.2
Board Repo: greatscottgadgets/hackrf
Board: operacake.kicad_pcb
Folder hardware / operacake
Complexity 252 / 1000 (size 207, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 122, 1,091, 182
Triangles, simulation 3,263,706 in 217 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 110 MB 1.0 GB
STEP 391 MB 1.2 GB
STL 163 MB 993 MB
OBJ 354 MB 2.2 GB
Visual
GLB 50 MB 975 MB
OBJ 157 MB 1.2 GB

1122. praline

praline: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 94 s. Simulation, STEP takes 2 min. Simulation, STL takes 95 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 8.1 40.9 2 ms 36.9 1.6 4.0 0.4 93.7
Simulation, STEP 2.0 8.1 41.4 2 ms 37.3 19.2 3.8 0.4 112.2
Simulation, STL 1.9 7.5 40.9 1 ms 36.8 3.7 4.0 0.4 95.2
Simulation, OBJ 1.9 8.2 40.0 2 ms 36.7 51.0 4.2 0.4 142.5
Visual, GLB 1.8 7.7 40.2 2 ms 67.6 0.7 6.8 0.4 125.2
Visual, OBJ 1.9 7.7 40.2 2 ms 67.1 21.7 7.1 0.4 146.2
Board Repo: greatscottgadgets/hackrf-pro
Board: praline.kicad_pcb
Complexity 466 / 1000 (size 316, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 511, 4,690, 953
Triangles, simulation 9,435,120 in 508 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 319 MB 2.2 GB
STEP 1.2 GB 3.3 GB
STL 472 MB 2.2 GB
OBJ 1.0 GB 6.1 GB
Visual
GLB 149 MB 2.6 GB
OBJ 491 MB 3.3 GB

1123. swg_test

swg_test: stages 4 and 6 take 45% to 72% of a run. Simulation, GLB takes 4.2 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.5 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 7.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.1 0.2 ms 1.8 85 ms 0.2 0.2 4.2
Simulation, STEP 0.2 0.5 1.3 0.2 ms 1.9 1.4 0.2 0.3 5.8
Simulation, STL 0.2 0.6 1.2 0.2 ms 1.8 0.2 0.2 0.2 4.5
Simulation, OBJ 0.2 0.6 1.2 0.2 ms 1.9 2.6 0.2 0.2 6.9
Visual, GLB 0.2 0.6 1.3 0.2 ms 3.0 66 ms 0.5 0.2 5.9
Visual, OBJ 0.3 0.6 1.2 0.2 ms 3.0 1.7 0.4 0.3 7.4
Board Repo: greatscottgadgets/lab-notes
Board: swg_test.kicad_pcb
Folder rf-testing / 2023-05-16-swg-test-board / swg_test_kicad
Complexity 266 / 1000 (size 166, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 23, 17, 129
Triangles, simulation 425,002 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 313 MB
STEP 46 MB 357 MB
STL 21 MB 315 MB
OBJ 42 MB 342 MB
Visual
GLB 9.3 MB 297 MB
OBJ 27 MB 294 MB

1124. LNA1109

LNA1109: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.3 s. Visual, GLB takes 3.2 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 1.0 0.3 ms 0.9 44 ms 0.1 0.3 2.7
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.8 0.9 0.1 0.2 3.2
Simulation, STL 0.1 0.2 0.9 0.8 ms 0.8 66 ms 0.1 0.3 2.4
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.8 1.1 98 ms 0.2 3.3
Visual, GLB 0.1 0.2 0.9 0.2 ms 1.7 22 ms 0.1 0.2 3.2
Visual, OBJ 0.1 0.2 0.8 0.2 ms 1.6 0.5 0.1 0.2 3.7
Board Repo: greatscottgadgets/LNA1109
Board: LNA1109.kicad_pcb
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 129, 8
Triangles, simulation 207,670 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 211 MB
STEP 26 MB 224 MB
STL 10 MB 218 MB
OBJ 22 MB 212 MB
Visual
GLB 3.9 MB 167 MB
OBJ 11 MB 167 MB

1125. LNA3030

LNA3030: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.2 ms 0.9 36 ms 0.1 0.2 2.7
Simulation, STEP 0.1 0.2 1.1 0.2 ms 0.9 0.9 0.1 0.2 3.5
Simulation, STL 0.2 0.2 1.0 0.2 ms 0.9 49 ms 0.1 0.2 2.6
Simulation, OBJ 0.1 0.2 1.0 0.3 ms 0.8 1.2 0.1 0.2 3.7
Visual, GLB 0.1 0.2 1.0 0.2 ms 1.6 20 ms 0.1 0.2 3.3
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.6 0.6 0.1 0.2 3.9
Board Repo: greatscottgadgets/LNA3030
Board: LNA3030.kicad_pcb
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 125, 9
Triangles, simulation 211,622 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.6 MB 209 MB
STEP 27 MB 224 MB
STL 11 MB 211 MB
OBJ 22 MB 204 MB
Visual
GLB 3.9 MB 168 MB
OBJ 11 MB 171 MB

1126. baluns

baluns: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 18 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.3 6.6 0.4 ms 5.6 0.2 0.7 0.2 15.1
Simulation, STEP 0.6 1.2 6.2 0.2 ms 5.9 3.9 0.6 0.3 18.7
Simulation, STL 0.6 1.3 6.4 0.4 ms 6.2 0.5 0.7 0.3 16.0
Simulation, OBJ 0.6 1.4 6.4 0.3 ms 5.5 8.8 0.7 0.3 23.7
Visual, GLB 0.5 1.2 6.7 0.6 ms 8.1 76 ms 0.7 0.3 17.7
Visual, OBJ 0.6 1.3 6.4 0.3 ms 7.9 2.7 0.8 0.2 19.8
Board Repo: greatscottgadgets/misc
Board: baluns.kicad_pcb
Folder evaluation-boards / baluns
Complexity 232 / 1000 (size 177, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 92, 230, 30
Triangles, simulation 1,559,312 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 54 MB 662 MB
STEP 192 MB 770 MB
STL 78 MB 645 MB
OBJ 162 MB 1.1 GB
Visual
GLB 17 MB 551 MB
OBJ 51 MB 552 MB

1127. BGA622H6820

BGA622H6820: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 4.1 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.3 ms 0.9 39 ms 0.1 0.3 2.7
Simulation, STEP 0.1 0.2 1.0 0.2 ms 0.9 1.0 0.1 0.2 3.6
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.9 53 ms 0.1 0.2 2.7
Simulation, OBJ 0.1 0.2 1.1 0.2 ms 0.9 1.4 0.1 0.2 4.1
Visual, GLB 0.1 0.3 1.0 0.3 ms 1.5 20 ms 0.2 0.2 3.3
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.6 0.6 0.2 0.2 3.9
Board Repo: greatscottgadgets/misc
Board: BGA622H6820.kicad_pcb
Folder evaluation-boards / BGA622H6820
Complexity 163 / 1000 (size 128, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 15, 33, 6
Triangles, simulation 226,944 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.8 MB 212 MB
STEP 30 MB 222 MB
STL 11 MB 214 MB
OBJ 23 MB 212 MB
Visual
GLB 3.5 MB 166 MB
OBJ 9.9 MB 166 MB

1128. CC-test

CC-test: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 4.9 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.3 s. Visual, GLB takes 5.0 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.7 0.3 ms 1.2 58 ms 0.2 0.2 3.7
Simulation, STEP 0.2 0.3 1.6 0.2 ms 1.1 1.4 0.2 0.2 4.9
Simulation, STL 0.1 0.3 1.5 0.2 ms 1.1 68 ms 0.2 0.2 3.5
Simulation, OBJ 0.1 0.3 1.5 0.2 ms 1.1 1.8 0.2 0.3 5.3
Visual, GLB 0.2 0.3 1.6 0.3 ms 2.5 35 ms 0.2 0.2 5.0
Visual, OBJ 0.1 0.3 1.5 0.3 ms 2.5 1.2 0.3 0.2 6.1
Board Repo: greatscottgadgets/misc
Board: CC-test.kicad_pcb
Folder evaluation-boards / CC-test
Complexity 206 / 1000 (size 141, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 23, 186, 20
Triangles, simulation 303,426 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 240 MB
STEP 52 MB 258 MB
STL 15 MB 238 MB
OBJ 31 MB 258 MB
Visual
GLB 6.8 MB 218 MB
OBJ 20 MB 218 MB

1129. DC1722J5005AHF

DC1722J5005AHF: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 3.5 s. Simulation, STEP takes 4.6 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 3.8 s. Visual, OBJ takes 4.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.2 0.3 ms 1.4 50 ms 0.2 0.3 3.5
Simulation, STEP 0.1 0.3 1.3 0.1 ms 1.3 1.2 0.2 0.2 4.6
Simulation, STL 0.1 0.3 1.2 0.2 ms 1.3 79 ms 0.2 0.2 3.4
Simulation, OBJ 0.1 0.3 1.3 0.2 ms 1.5 1.9 0.2 0.2 5.5
Visual, GLB 0.1 0.3 1.2 0.3 ms 1.8 18 ms 0.1 0.2 3.8
Visual, OBJ 0.2 0.4 1.2 0.2 ms 2.0 0.6 0.1 0.2 4.6
Board Repo: greatscottgadgets/misc
Board: DC1722J5005AHF.kicad_pcb
Folder evaluation-boards / DC1722J5005AHF
Complexity 172 / 1000 (size 117, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 9, 16, 6
Triangles, simulation 333,628 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 266 MB
STEP 37 MB 292 MB
STL 17 MB 268 MB
OBJ 33 MB 284 MB
Visual
GLB 3.7 MB 202 MB
OBJ 10 MB 199 MB

1130. filters

filters: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 23 s. Simulation, OBJ takes 33 s. Visual, GLB takes 24 s. Visual, OBJ takes 27 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.0 9.1 0.5 ms 9.2 0.3 0.8 0.4 22.4
Simulation, STEP 0.8 2.0 8.9 0.5 ms 9.2 4.8 0.8 0.3 26.7
Simulation, STL 0.8 1.8 9.1 0.4 ms 9.1 0.7 0.9 0.3 22.7
Simulation, OBJ 0.7 2.0 9.5 0.5 ms 8.9 10.4 0.9 0.3 32.8
Visual, GLB 0.7 2.1 9.0 0.2 ms 10.8 0.1 1.0 0.3 23.9
Visual, OBJ 0.7 2.0 9.0 0.2 ms 10.6 3.2 0.9 0.3 26.7
Board Repo: greatscottgadgets/misc
Board: filters.kicad_pcb
Folder evaluation-boards / filters
Complexity 218 / 1000 (size 163, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 30, 41, 78
Triangles, simulation 2,127,510 in 31 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 911 MB
STEP 237 MB 1.0 GB
STL 106 MB 985 MB
OBJ 223 MB 1.4 GB
Visual
GLB 23 MB 624 MB
OBJ 69 MB 626 MB

1131. leds

leds: stages 4 and 6 take 54% to 80% of a run. Simulation, GLB takes 4.8 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 4.8 s. Simulation, OBJ takes 6.5 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 1.4 0.3 ms 2.2 64 ms 0.2 0.2 4.8
Simulation, STEP 0.3 0.4 1.4 0.2 ms 2.3 2.1 0.2 0.2 6.8
Simulation, STL 0.2 0.3 1.4 0.3 ms 2.3 0.1 0.2 0.2 4.8
Simulation, OBJ 0.2 0.3 1.4 0.4 ms 2.3 1.8 0.2 0.2 6.5
Visual, GLB 0.2 0.3 1.5 0.3 ms 3.5 59 ms 0.4 0.3 6.3
Visual, OBJ 0.2 0.4 1.4 0.2 ms 3.5 1.6 0.5 0.2 7.8
Board Repo: greatscottgadgets/misc
Board: leds.kicad_pcb
Folder evaluation-boards / leds
Complexity 247 / 1000 (size 172, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 128, 372, 54
Triangles, simulation 457,374 in 66 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 331 MB
STEP 79 MB 384 MB
STL 23 MB 331 MB
OBJ 46 MB 370 MB
Visual
GLB 13 MB 427 MB
OBJ 37 MB 421 MB

1132. limiters

limiters: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 24 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.3 6.2 0.5 ms 6.3 0.3 0.7 0.3 15.7
Simulation, STEP 0.6 1.3 5.9 0.4 ms 5.6 3.7 0.6 0.3 18.1
Simulation, STL 0.6 1.3 6.4 0.8 ms 5.8 0.6 0.6 0.3 15.5
Simulation, OBJ 0.5 1.3 6.3 0.4 ms 5.8 9.3 0.6 0.3 24.1
Visual, GLB 0.6 1.3 6.2 0.5 ms 9.7 0.1 0.9 0.3 19.1
Visual, OBJ 0.7 1.4 6.5 0.4 ms 9.5 3.6 0.8 0.3 22.8
Board Repo: greatscottgadgets/misc
Board: limiters.kicad_pcb
Folder evaluation-boards / limiters
Complexity 267 / 1000 (size 192, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 143, 397, 61
Triangles, simulation 1,536,570 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 735 MB
STEP 184 MB 748 MB
STL 77 MB 667 MB
OBJ 157 MB 1.1 GB
Visual
GLB 21 MB 611 MB
OBJ 65 MB 614 MB

1133. passives

passives: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.1 5.4 0.3 ms 5.3 0.2 0.6 0.3 13.4
Simulation, STEP 0.4 1.2 5.2 0.3 ms 5.4 3.8 0.5 0.2 16.7
Simulation, STL 0.5 1.1 5.4 0.2 ms 5.0 0.4 0.6 0.3 13.2
Simulation, OBJ 0.4 1.1 5.2 0.3 ms 5.1 7.4 0.6 0.3 20.0
Visual, GLB 0.4 1.1 5.3 0.3 ms 6.8 68 ms 0.6 0.3 14.5
Visual, OBJ 0.4 1.0 5.1 0.3 ms 7.0 2.6 0.7 0.3 17.1
Board Repo: greatscottgadgets/misc
Board: passives.kicad_pcb
Folder evaluation-boards / passives
Complexity 239 / 1000 (size 164, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 59, 82, 38
Triangles, simulation 1,229,348 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 42 MB 599 MB
STEP 137 MB 661 MB
STL 61 MB 608 MB
OBJ 124 MB 835 MB
Visual
GLB 15 MB 455 MB
OBJ 44 MB 483 MB

1134. pmos-or

pmos-or: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.2 0.3 ms 1.5 70 ms 0.2 0.2 4.7
Simulation, STEP 0.2 0.4 2.2 0.2 ms 1.5 1.6 0.2 0.2 6.3
Simulation, STL 0.2 0.4 2.3 0.3 ms 1.5 92 ms 0.2 0.2 4.9
Simulation, OBJ 0.2 0.4 2.2 0.2 ms 1.5 2.2 0.2 0.2 6.9
Visual, GLB 0.2 0.4 2.3 0.2 ms 3.0 45 ms 0.3 0.2 6.3
Visual, OBJ 0.2 0.4 2.4 0.2 ms 3.0 1.5 0.3 0.2 7.9
Board Repo: greatscottgadgets/misc
Board: pmos-or.kicad_pcb
Folder evaluation-boards / pmos-or
Complexity 234 / 1000 (size 149, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 42, 193, 24
Triangles, simulation 441,360 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 287 MB
STEP 83 MB 331 MB
STL 22 MB 281 MB
OBJ 45 MB 340 MB
Visual
GLB 9.8 MB 309 MB
OBJ 29 MB 305 MB

1135. quad-balun-directional-coupler

Stages 4 and 6 take 52% to 79% of a run. Simulation, GLB takes 3.8 s. Simulation, STEP takes 5.0 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 5.8 s. Visual, GLB takes 4.2 s. Visual, OBJ takes 5.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.5 0.3 ms 1.5 55 ms 0.2 0.2 3.8
Simulation, STEP 0.1 0.3 1.4 0.3 ms 1.4 1.2 0.2 0.2 5.0
Simulation, STL 0.2 0.3 1.4 0.4 ms 1.4 81 ms 0.2 0.2 3.9
Simulation, OBJ 0.1 0.4 1.5 0.3 ms 1.5 1.9 0.2 0.3 5.8
Visual, GLB 0.2 0.3 1.4 0.3 ms 1.9 26 ms 0.1 0.2 4.2
Visual, OBJ 0.2 0.3 1.4 0.3 ms 2.2 0.6 0.1 0.2 5.0
Board Repo: greatscottgadgets/misc
Board: quad-balun-directional-coupler.kicad_pcb
Folder evaluation-boards / quad-balun-directional-coupler
Complexity 167 / 1000 (size 132, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 14, 55, 4
Triangles, simulation 337,942 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 250 MB
STEP 37 MB 295 MB
STL 17 MB 252 MB
OBJ 34 MB 288 MB
Visual
GLB 4.0 MB 205 MB
OBJ 11 MB 203 MB

1136. rf-amps

rf-amps: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 14 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.9 0.2 ms 3.2 0.2 0.3 0.2 8.9
Simulation, STEP 0.3 0.7 3.9 0.2 ms 3.3 2.2 0.3 0.2 11.0
Simulation, STL 0.3 0.7 3.9 0.2 ms 3.3 0.2 0.4 0.3 9.2
Simulation, OBJ 0.3 0.7 3.7 0.2 ms 3.4 5.1 0.4 0.3 13.9
Visual, GLB 0.3 0.8 4.1 0.2 ms 5.5 52 ms 0.3 0.2 11.3
Visual, OBJ 0.3 0.8 3.8 0.2 ms 5.6 1.7 0.4 0.2 12.8
Board Repo: greatscottgadgets/misc
Board: rf-amps.kicad_pcb
Folder evaluation-boards / rf-amps
Complexity 231 / 1000 (size 166, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 59, 149, 23
Triangles, simulation 984,660 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 490 MB
STEP 122 MB 526 MB
STL 49 MB 456 MB
OBJ 100 MB 708 MB
Visual
GLB 12 MB 424 MB
OBJ 35 MB 410 MB

1137. rf-switch-dpdt

rf-switch-dpdt: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 8.8 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.9 s. Simulation, OBJ takes 14 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.6 0.5 ms 3.3 0.2 0.5 0.2 8.8
Simulation, STEP 0.3 0.7 3.6 0.4 ms 3.4 2.2 0.4 0.2 11.0
Simulation, STL 0.3 0.7 3.5 0.5 ms 3.4 0.3 0.5 0.2 8.9
Simulation, OBJ 0.3 0.7 3.7 0.4 ms 3.5 5.4 0.5 0.2 14.3
Visual, GLB 0.3 0.7 3.5 0.4 ms 5.8 83 ms 0.5 0.3 11.2
Visual, OBJ 0.3 0.8 3.6 0.6 ms 5.7 2.3 0.6 0.2 13.6
Board Repo: greatscottgadgets/misc
Board: rf-switch-dpdt.kicad_pcb
Folder evaluation-boards / rf-switch-dpdt
Complexity 256 / 1000 (size 156, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 29, 120, 24
Triangles, simulation 1,024,652 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 432 MB
STEP 138 MB 521 MB
STL 51 MB 424 MB
OBJ 102 MB 724 MB
Visual
GLB 16 MB 475 MB
OBJ 47 MB 494 MB

1138. rf-switch-sp3t

rf-switch-sp3t: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 8.6 s. Simulation, STEP takes 10 s. Simulation, STL takes 9.0 s. Simulation, OBJ takes 13 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.5 0.4 ms 3.2 0.1 0.4 0.3 8.6
Simulation, STEP 0.3 0.7 3.5 0.2 ms 3.1 2.2 0.4 0.2 10.4
Simulation, STL 0.3 0.7 3.6 0.2 ms 3.4 0.3 0.4 0.3 9.0
Simulation, OBJ 0.3 0.8 3.6 0.3 ms 3.2 4.9 0.4 0.3 13.5
Visual, GLB 0.3 0.8 3.5 0.3 ms 4.7 79 ms 0.5 0.3 10.1
Visual, OBJ 0.3 0.7 3.6 0.3 ms 5.2 1.8 0.5 0.2 12.2
Board Repo: greatscottgadgets/misc
Board: rf-switch-sp3t.kicad_pcb
Folder evaluation-boards / rf-switch-sp3t
Complexity 241 / 1000 (size 166, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 33, 141, 57
Triangles, simulation 942,708 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 468 MB
STEP 103 MB 532 MB
STL 47 MB 442 MB
OBJ 95 MB 673 MB
Visual
GLB 13 MB 415 MB
OBJ 38 MB 441 MB

1139. rf-switch-sp4t

rf-switch-sp4t: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 20 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.2 0.4 ms 6.7 0.3 0.7 0.2 16.1
Simulation, STEP 0.5 1.5 6.1 0.3 ms 6.3 4.0 0.7 0.2 19.3
Simulation, STL 0.4 1.5 6.1 0.3 ms 6.6 0.6 0.8 0.2 16.1
Simulation, OBJ 0.4 1.3 5.9 0.5 ms 6.8 8.7 0.7 0.3 24.1
Visual, GLB 0.5 1.5 6.3 0.3 ms 10.3 0.1 1.0 0.3 19.9
Visual, OBJ 0.4 1.5 6.1 0.3 ms 9.9 3.4 1.0 0.2 22.5
Board Repo: greatscottgadgets/misc
Board: rf-switch-sp4t.kicad_pcb
Folder evaluation-boards / rf-switch-sp4t
Complexity 287 / 1000 (size 187, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 73, 347, 109
Triangles, simulation 2,124,978 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 865 MB
STEP 238 MB 950 MB
STL 106 MB 881 MB
OBJ 220 MB 1.4 GB
Visual
GLB 28 MB 811 MB
OBJ 85 MB 718 MB

1140. rf-switch-spdt

rf-switch-spdt: stages 4 and 6 take 48% to 85% of a run. Simulation, GLB takes 6.6 s. Simulation, STEP takes 8.1 s. Simulation, STL takes 6.3 s. Simulation, OBJ takes 9.9 s. Visual, GLB takes 9.0 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.5 0.2 ms 2.5 0.1 0.5 0.2 6.6
Simulation, STEP 0.2 0.5 2.5 0.2 ms 2.4 1.8 0.4 0.2 8.1
Simulation, STL 0.2 0.6 2.4 0.1 ms 2.4 0.2 0.3 0.2 6.3
Simulation, OBJ 0.2 0.5 2.4 0.2 ms 2.3 3.7 0.4 0.3 9.9
Visual, GLB 0.2 0.5 2.4 0.2 ms 5.3 42 ms 0.3 0.2 9.0
Visual, OBJ 0.2 0.5 2.4 0.3 ms 5.4 1.5 0.3 0.2 10.5
Board Repo: greatscottgadgets/misc
Board: rf-switch-spdt.kicad_pcb
Folder evaluation-boards / rf-switch-spdt
Complexity 259 / 1000 (size 159, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 28, 85, 48
Triangles, simulation 729,262 in 31 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 391 MB
STEP 79 MB 447 MB
STL 36 MB 393 MB
OBJ 73 MB 523 MB
Visual
GLB 10 MB 354 MB
OBJ 30 MB 352 MB

1141. Si5351A

Si5351A: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 16 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 5.2 0.7 ms 4.3 0.2 0.6 0.2 11.9
Simulation, STEP 0.4 1.1 5.3 0.5 ms 4.2 3.0 0.5 0.3 14.7
Simulation, STL 0.4 1.1 5.4 0.5 ms 4.3 0.4 0.6 0.2 12.4
Simulation, OBJ 0.4 1.2 5.3 0.5 ms 4.3 7.1 0.5 0.2 19.0
Visual, GLB 0.3 1.1 5.4 0.3 ms 7.6 92 ms 0.9 0.2 15.6
Visual, OBJ 0.3 1.1 5.5 0.3 ms 7.2 3.2 1.0 0.2 18.5
Board Repo: greatscottgadgets/misc
Board: Si5351A.kicad_pcb
Folder evaluation-boards / Si5351A
Complexity 273 / 1000 (size 188, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 84, 439, 69
Triangles, simulation 1,313,314 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 43 MB 578 MB
STEP 152 MB 634 MB
STL 66 MB 566 MB
OBJ 133 MB 899 MB
Visual
GLB 20 MB 627 MB
OBJ 61 MB 588 MB

1142. sky13350

sky13350: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 4.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 0.2 1.1 0.3 ms 0.9 42 ms 0.1 0.2 2.7
Simulation, STEP 94 ms 0.2 1.1 0.2 ms 0.9 0.9 0.1 0.2 3.5
Simulation, STL 0.1 0.2 1.1 0.4 ms 0.8 68 ms 0.2 0.2 2.6
Simulation, OBJ 0.1 0.2 1.0 0.2 ms 0.9 1.2 0.1 0.2 3.7
Visual, GLB 99 ms 0.2 1.1 0.4 ms 1.8 20 ms 0.2 0.2 3.6
Visual, OBJ 0.1 0.3 1.1 0.3 ms 1.6 0.5 0.2 0.2 4.0
Board Repo: greatscottgadgets/misc
Board: sky13350.kicad_pcb
Folder evaluation-boards / sky13350
Complexity 164 / 1000 (size 129, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 22, 34, 3
Triangles, simulation 292,626 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 222 MB
STEP 39 MB 241 MB
STL 15 MB 225 MB
OBJ 30 MB 229 MB
Visual
GLB 4.4 MB 203 MB
OBJ 13 MB 197 MB

1143. sky13351

sky13351: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.6 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.3 0.2 ms 1.0 47 ms 0.2 0.2 3.1
Simulation, STEP 0.1 0.3 1.4 0.1 ms 1.0 1.1 0.1 0.2 4.2
Simulation, STL 0.1 0.3 1.3 0.2 ms 1.0 70 ms 0.2 0.2 3.2
Simulation, OBJ 0.1 0.3 1.3 0.2 ms 1.0 1.4 0.2 0.2 4.6
Visual, GLB 0.1 0.3 1.3 0.2 ms 1.8 23 ms 0.2 0.2 4.0
Visual, OBJ 0.1 0.3 1.2 0.2 ms 1.8 0.7 0.2 0.3 4.5
Board Repo: greatscottgadgets/misc
Board: sky13351.kicad_pcb
Folder evaluation-boards / sky13351
Complexity 167 / 1000 (size 132, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 22, 42, 3
Triangles, simulation 294,750 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 233 MB
STEP 40 MB 241 MB
STL 15 MB 228 MB
OBJ 30 MB 231 MB
Visual
GLB 4.5 MB 192 MB
OBJ 13 MB 193 MB

1144. sky13374

sky13374: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 4.6 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.2 s. Simulation, OBJ takes 6.2 s. Visual, GLB takes 5.1 s. Visual, OBJ takes 6.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.9 0.2 ms 1.5 86 ms 0.2 0.3 4.6
Simulation, STEP 0.2 0.4 1.7 0.2 ms 1.4 1.6 0.2 0.3 5.8
Simulation, STL 0.2 0.5 1.7 0.4 ms 1.3 88 ms 0.2 0.3 4.2
Simulation, OBJ 0.1 0.4 1.7 0.2 ms 1.3 2.3 0.2 0.2 6.2
Visual, GLB 0.1 0.3 1.7 0.2 ms 2.3 25 ms 0.3 0.3 5.1
Visual, OBJ 0.1 0.3 1.8 0.4 ms 2.4 0.8 0.2 0.3 6.0
Board Repo: greatscottgadgets/misc
Board: sky13374.kicad_pcb
Folder evaluation-boards / sky13374
Complexity 171 / 1000 (size 136, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 17, 45, 10
Triangles, simulation 299,316 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 225 MB
STEP 40 MB 236 MB
STL 15 MB 226 MB
OBJ 30 MB 234 MB
Visual
GLB 4.6 MB 202 MB
OBJ 13 MB 197 MB

1145. sky13411

sky13411: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 5.5 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 6.0 s. Visual, GLB takes 5.0 s. Visual, OBJ takes 6.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.9 0.2 ms 1.3 84 ms 0.2 0.3 4.3
Simulation, STEP 0.1 0.5 1.9 0.2 ms 1.2 1.3 0.2 0.2 5.5
Simulation, STL 0.1 0.3 1.7 0.4 ms 1.2 88 ms 0.2 0.2 3.9
Simulation, OBJ 0.1 0.4 1.8 0.2 ms 1.2 2.0 0.2 0.2 6.0
Visual, GLB 0.2 0.4 1.7 0.2 ms 2.3 30 ms 0.2 0.3 5.0
Visual, OBJ 0.1 0.4 1.7 0.2 ms 2.4 1.1 0.2 0.2 6.2
Board Repo: greatscottgadgets/misc
Board: sky13411.kicad_pcb
Folder evaluation-boards / sky13411
Complexity 172 / 1000 (size 137, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 26, 53, 3
Triangles, simulation 355,080 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 240 MB
STEP 48 MB 258 MB
STL 18 MB 244 MB
OBJ 36 MB 288 MB
Visual
GLB 5.3 MB 212 MB
OBJ 15 MB 216 MB

1146. sma-jlcpcb

sma-jlcpcb: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 19 s. Simulation, OBJ takes 28 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 7.1 0.5 ms 7.6 0.3 0.8 0.3 18.2
Simulation, STEP 0.4 1.7 7.8 0.5 ms 7.6 3.8 0.8 0.3 22.5
Simulation, STL 0.4 1.8 6.9 0.4 ms 8.0 0.6 0.8 0.2 18.8
Simulation, OBJ 0.5 1.7 7.2 0.3 ms 7.9 9.6 0.7 0.3 27.7
Visual, GLB 0.4 1.6 7.5 0.4 ms 8.4 99 ms 0.9 0.3 19.1
Visual, OBJ 0.4 1.7 7.1 0.3 ms 9.1 3.1 1.0 0.3 22.7
Board Repo: greatscottgadgets/misc
Board: sma-jlcpcb.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 236 / 1000 (size 171, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 20, 10, 104
Triangles, simulation 1,934,558 in 25 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 849 MB
STEP 181 MB 902 MB
STL 97 MB 838 MB
OBJ 199 MB 1.3 GB
Visual
GLB 22 MB 662 MB
OBJ 65 MB 630 MB

1147. trace-width-jlcpcb

trace-width-jlcpcb: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 5.0 0.3 ms 4.5 0.2 0.4 0.2 11.7
Simulation, STEP 0.3 1.1 5.0 0.4 ms 4.7 2.4 0.4 0.2 14.1
Simulation, STL 0.3 1.1 4.9 0.4 ms 4.4 0.3 0.5 0.2 11.7
Simulation, OBJ 0.3 1.1 4.9 0.4 ms 4.4 6.2 0.4 0.2 17.7
Visual, GLB 0.3 1.1 4.9 0.4 ms 4.8 55 ms 0.3 0.2 11.7
Visual, OBJ 0.3 1.1 5.1 0.4 ms 4.8 1.9 0.3 0.2 13.7
Board Repo: greatscottgadgets/misc
Board: trace-width-jlcpcb.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 230 / 1000 (size 165, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 16, 8, 84
Triangles, simulation 1,229,520 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 41 MB 555 MB
STEP 118 MB 668 MB
STL 61 MB 544 MB
OBJ 124 MB 853 MB
Visual
GLB 13 MB 447 MB
OBJ 39 MB 413 MB

1148. trace-width-sunstone

trace-width-sunstone: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 9.7 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.9 0.5 ms 3.9 0.1 0.4 0.3 9.7
Simulation, STEP 0.3 0.8 3.7 0.2 ms 4.2 2.6 0.4 0.2 12.2
Simulation, STL 0.3 0.8 3.8 0.2 ms 4.2 0.3 0.4 0.2 10.1
Simulation, OBJ 0.3 0.8 3.7 0.2 ms 4.0 5.3 0.4 0.2 14.6
Visual, GLB 0.3 0.8 3.8 0.2 ms 3.7 43 ms 0.4 0.2 9.2
Visual, OBJ 0.3 0.8 3.8 0.2 ms 3.7 1.3 0.4 0.2 10.5
Board Repo: greatscottgadgets/misc
Board: trace-width-sunstone.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 113 / 1000 (size 93, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 12, 6, 0
Triangles, simulation 933,056 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 488 MB
STEP 93 MB 590 MB
STL 47 MB 472 MB
OBJ 94 MB 681 MB
Visual
GLB 7.2 MB 386 MB
OBJ 22 MB 361 MB

1149. trace-width

trace-width: stages 4 and 6 take 60% to 84% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 4.6 0.2 ms 5.4 0.2 0.4 0.3 12.0
Simulation, STEP 0.2 0.9 4.3 0.3 ms 4.7 3.3 0.4 0.2 13.9
Simulation, STL 0.2 0.9 4.6 0.2 ms 5.2 0.3 0.4 0.2 11.8
Simulation, OBJ 0.2 0.8 4.7 0.3 ms 5.7 5.3 0.4 0.2 17.4
Visual, GLB 0.2 0.9 4.7 0.2 ms 5.3 54 ms 0.8 0.2 12.1
Visual, OBJ 0.2 1.0 4.9 0.3 ms 5.2 1.8 1.0 0.3 14.3
Board Repo: greatscottgadgets/misc
Board: trace-width.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 132 / 1000 (size 112, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 26, 13, 0
Triangles, simulation 1,164,700 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 39 MB 511 MB
STEP 99 MB 672 MB
STL 58 MB 485 MB
OBJ 116 MB 812 MB
Visual
GLB 12 MB 477 MB
OBJ 35 MB 505 MB

1150. ununs

ununs: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 16 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 4.6 0.3 ms 3.9 0.2 0.4 0.2 10.5
Simulation, STEP 0.2 0.9 4.6 0.3 ms 3.9 2.9 0.4 0.2 13.0
Simulation, STL 0.2 0.9 4.3 0.4 ms 4.0 0.4 0.4 0.2 10.5
Simulation, OBJ 0.2 0.9 4.6 0.4 ms 4.0 5.8 0.5 0.3 16.3
Visual, GLB 0.2 1.0 4.7 0.4 ms 6.3 82 ms 0.7 0.2 13.2
Visual, OBJ 0.2 0.9 4.4 0.4 ms 6.4 2.5 0.7 0.2 15.3
Board Repo: greatscottgadgets/misc
Board: ununs.kicad_pcb
Folder evaluation-boards / ununs
Complexity 250 / 1000 (size 175, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 77, 196, 43
Triangles, simulation 1,471,406 in 61 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 671 MB
STEP 147 MB 705 MB
STL 74 MB 645 MB
OBJ 148 MB 973 MB
Visual
GLB 20 MB 584 MB
OBJ 62 MB 524 MB

1151. vbus-switch

vbus-switch: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.3 7.2 0.6 ms 4.3 0.2 0.6 0.2 14.2
Simulation, STEP 0.4 1.2 7.0 0.5 ms 4.3 3.9 0.5 0.2 17.6
Simulation, STL 0.4 1.3 7.0 0.6 ms 4.3 0.5 0.5 0.2 14.1
Simulation, OBJ 0.4 1.3 7.5 0.4 ms 4.3 7.0 0.5 0.2 21.2
Visual, GLB 0.4 1.1 7.3 0.4 ms 8.3 0.1 1.0 0.2 18.4
Visual, OBJ 0.4 1.2 7.2 0.6 ms 8.9 3.9 1.2 0.2 23.0
Board Repo: greatscottgadgets/misc
Board: vbus-switch.kicad_pcb
Folder evaluation-boards / vbus-switch
Complexity 282 / 1000 (size 197, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 109, 663, 96
Triangles, simulation 1,340,080 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 557 MB
STEP 220 MB 633 MB
STL 67 MB 532 MB
OBJ 140 MB 930 MB
Visual
GLB 27 MB 658 MB
OBJ 79 MB 631 MB

1152. throwing-star-pro

throwing-star-pro: stages 4 and 6 take 60% to 89% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.2 s. Simulation, STL takes 7.1 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 3.0 0.5 ms 3.2 93 ms 0.5 0.2 7.4
Simulation, STEP 0.1 0.3 3.0 0.4 ms 3.2 1.9 0.5 0.2 9.2
Simulation, STL 0.1 0.3 2.8 0.3 ms 3.0 0.1 0.5 0.2 7.1
Simulation, OBJ 0.1 0.3 2.7 0.3 ms 3.0 2.7 0.5 0.2 9.5
Visual, GLB 0.1 0.2 2.7 0.3 ms 6.3 61 ms 0.5 0.2 10.0
Visual, OBJ 0.1 0.3 2.9 0.3 ms 6.0 1.7 0.5 0.2 11.6
Board Repo: greatscottgadgets/throwing-star-lan-tap
Board: throwing-star-pro.kicad_pcb
Complexity 152 / 1000 (size 117, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 112, 4
Triangles, simulation 653,240 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 342 MB
STEP 153 MB 432 MB
STL 33 MB 345 MB
OBJ 71 MB 509 MB
Visual
GLB 16 MB 436 MB
OBJ 47 MB 436 MB

1153. throwing-star

throwing-star: stages 4 and 6 take 55% to 90% of a run. Simulation, GLB takes 9.6 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 13 s. Visual, GLB takes 15 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 4.1 0.6 ms 3.7 0.1 0.9 0.2 9.6
Simulation, STEP 0.2 0.4 3.7 0.5 ms 3.5 2.3 0.8 0.2 11.3
Simulation, STL 0.2 0.4 3.9 0.3 ms 3.5 0.2 0.9 0.3 9.3
Simulation, OBJ 0.2 0.4 3.7 0.2 ms 3.6 4.3 0.9 0.3 13.3
Visual, GLB 0.2 0.4 3.6 0.3 ms 10.0 87 ms 0.5 0.3 15.1
Visual, OBJ 0.2 0.4 3.7 0.3 ms 9.6 2.6 0.6 0.2 17.4
Board Repo: greatscottgadgets/throwing-star-lan-tap
Board: throwing-star.kicad_pcb
Complexity 171 / 1000 (size 126, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 204, 4
Triangles, simulation 695,490 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 380 MB
STEP 165 MB 460 MB
STL 35 MB 385 MB
OBJ 76 MB 534 MB
Visual
GLB 17 MB 438 MB
OBJ 50 MB 435 MB

1154. toorcamp2018badge

toorcamp2018badge: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.4 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 5.9 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 7.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.8 0.2 ms 1.2 59 ms 0.2 0.2 4.1
Simulation, STEP 0.2 0.4 1.9 0.2 ms 1.2 1.3 0.2 0.2 5.4
Simulation, STL 0.1 0.4 1.8 0.2 ms 1.2 89 ms 0.2 0.2 4.0
Simulation, OBJ 0.2 0.4 1.8 0.1 ms 1.2 1.9 0.2 0.2 5.9
Visual, GLB 0.1 0.4 1.8 0.2 ms 2.9 42 ms 0.3 0.2 5.8
Visual, OBJ 0.1 0.4 1.8 0.2 ms 2.8 1.4 0.3 0.2 7.0
Board Repo: greatscottgadgets/toorcamp2018badge
Board: toorcamp2018badge.kicad_pcb
Folder hardware / badge
Complexity 202 / 1000 (size 147, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 30, 264, 8
Triangles, simulation 380,290 in 32 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 265 MB
STEP 70 MB 288 MB
STL 19 MB 260 MB
OBJ 40 MB 302 MB
Visual
GLB 9.8 MB 279 MB
OBJ 29 MB 273 MB

1155. toorcamp2018jig

toorcamp2018jig: stages 4 and 6 take 59% to 86% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 20 s. Visual, GLB takes 21 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.1 7.2 1 ms 5.1 0.2 0.7 0.2 14.8
Simulation, STEP 0.3 1.2 7.2 1 ms 5.1 3.3 0.7 0.2 18.0
Simulation, STL 0.2 1.2 7.1 1.0 ms 5.0 0.3 0.8 0.2 15.0
Simulation, OBJ 0.2 1.1 7.0 0.9 ms 4.9 5.9 0.9 0.2 20.2
Visual, GLB 0.2 1.2 7.3 0.8 ms 10.6 0.1 1.3 0.2 20.9
Visual, OBJ 0.3 1.1 7.2 0.9 ms 10.5 3.6 1.1 0.2 24.0
Board Repo: greatscottgadgets/toorcamp2018badge
Board: toorcamp2018jig.kicad_pcb
Folder hardware / jig
Complexity 218 / 1000 (size 173, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 75, 705, 26
Triangles, simulation 1,475,914 in 181 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 573 MB
STEP 257 MB 651 MB
STL 74 MB 573 MB
OBJ 156 MB 1.0 GB
Visual
GLB 31 MB 690 MB
OBJ 93 MB 679 MB

1156. sasserides

sasserides: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 9.1 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.0 4.2 0.6 ms 2.9 0.2 0.4 0.2 9.1
Simulation, STEP 0.2 0.9 4.1 0.7 ms 2.6 2.3 0.4 0.2 10.7
Simulation, STL 0.2 0.9 4.5 0.6 ms 2.7 0.3 0.4 0.2 9.3
Simulation, OBJ 0.2 1.0 4.4 0.4 ms 2.9 4.1 0.4 0.2 13.2
Visual, GLB 0.2 0.9 4.4 1 ms 5.7 76 ms 0.6 0.2 12.1
Visual, OBJ 0.2 1.1 4.3 0.4 ms 5.8 2.4 0.8 0.2 14.9
Board Repo: greatscottgadgets/tycho
Board: sasserides.kicad_pcb
Folder sasserides
Complexity 230 / 1000 (size 150, features 80)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 30, 324, 12
Triangles, simulation 970,818 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 453 MB
STEP 170 MB 519 MB
STL 49 MB 438 MB
OBJ 100 MB 696 MB
Visual
GLB 19 MB 483 MB
OBJ 58 MB 479 MB

1157. tycho

tycho: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 34 s. Simulation, STEP takes 43 s. Simulation, STL takes 38 s. Simulation, OBJ takes 53 s. Visual, GLB takes 49 s. Visual, OBJ takes 58 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.9 15.0 0.9 ms 12.6 0.5 1.4 0.3 34.3
Simulation, STEP 0.9 4.1 15.3 1 ms 13.5 7.9 1.5 0.3 43.4
Simulation, STL 0.7 4.1 16.4 0.8 ms 13.4 1.2 1.7 0.3 37.8
Simulation, OBJ 0.7 4.1 16.2 0.6 ms 13.5 16.3 1.6 0.3 52.6
Visual, GLB 0.8 3.8 15.9 1 ms 24.2 0.3 3.6 0.3 48.8
Visual, OBJ 0.7 4.1 15.9 1 ms 24.1 9.5 3.8 0.3 58.4
Board Repo: greatscottgadgets/tycho
Board: tycho.kicad_pcb
Folder tycho
Complexity 399 / 1000 (size 259, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 164, 1,623, 399
Triangles, simulation 3,419,022 in 267 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 118 MB 1.1 GB
STEP 518 MB 1.3 GB
STL 171 MB 1.1 GB
OBJ 369 MB 2.3 GB
Visual
GLB 67 MB 1.2 GB
OBJ 210 MB 1.5 GB

1158. mainboard

mainboard: stages 4 and 6 take 55% to 86% of a run. Simulation, GLB takes 86 s. Simulation, STEP takes 2 min. Simulation, STL takes 89 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.9 7.3 35.6 1 ms 35.2 1.3 4.0 0.4 85.8
Simulation, STEP 2.0 7.6 36.6 3 ms 37.5 17.6 4.2 0.4 105.8
Simulation, STL 2.1 7.8 36.2 2 ms 36.3 2.7 4.0 0.4 89.5
Simulation, OBJ 2.0 7.8 35.9 2 ms 37.3 45.7 4.4 0.4 133.5
Visual, GLB 2.2 7.7 36.3 2 ms 64.1 0.7 5.6 0.4 116.9
Visual, OBJ 2.0 7.9 35.6 2 ms 64.0 22.9 5.5 0.4 138.1
Board Repo: greatscottgadgets/urti-mainboard
Board: mainboard.kicad_pcb
Complexity 465 / 1000 (size 315, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 440, 3,761, 899
Triangles, simulation 7,380,624 in 471 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 251 MB 1.9 GB
STEP 1.0 GB 2.7 GB
STL 369 MB 1.9 GB
OBJ 803 MB 4.7 GB
Visual
GLB 127 MB 2.2 GB
OBJ 411 MB 2.8 GB

1159. yardstickone

yardstickone: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 9.6 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 4.1 0.4 ms 3.5 0.1 0.4 0.3 9.6
Simulation, STEP 0.3 0.8 3.9 0.3 ms 3.5 2.5 0.4 0.2 11.7
Simulation, STL 0.3 0.9 3.9 0.3 ms 3.4 0.3 0.4 0.3 9.4
Simulation, OBJ 0.3 0.9 3.9 0.4 ms 3.4 4.4 0.4 0.2 13.5
Visual, GLB 0.3 0.9 3.9 0.4 ms 7.0 91 ms 0.7 0.3 13.2
Visual, OBJ 0.3 0.8 4.0 0.2 ms 7.0 2.4 0.8 0.3 15.6
Board Repo: greatscottgadgets/yardstick
Board: yardstickone.kicad_pcb
Folder yardstickone
Complexity 317 / 1000 (size 232, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 74, 657, 83
Triangles, simulation 894,982 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 423 MB
STEP 141 MB 497 MB
STL 45 MB 418 MB
OBJ 92 MB 672 MB
Visual
GLB 18 MB 452 MB
OBJ 53 MB 455 MB

1160. arm-watch

arm-watch: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 7.0 s. Simulation, STL takes 5.1 s. Simulation, OBJ takes 8.0 s. Visual, GLB takes 7.3 s. Visual, OBJ takes 8.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.7 0.4 ms 2.2 75 ms 0.3 0.2 5.0
Simulation, STEP 0.2 0.4 1.7 0.3 ms 2.3 1.9 0.3 0.2 7.0
Simulation, STL 0.2 0.4 1.7 0.3 ms 2.1 0.2 0.3 0.2 5.1
Simulation, OBJ 0.2 0.4 1.7 0.3 ms 2.3 2.8 0.3 0.2 8.0
Visual, GLB 0.2 0.4 1.7 0.3 ms 4.4 51 ms 0.3 0.2 7.3
Visual, OBJ 0.2 0.4 1.6 0.3 ms 4.5 1.6 0.3 0.2 8.8
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: arm-watch.kicad_pcb
Folder arm-watch / kicad-src
Complexity 323 / 1000 (size 223, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 17, 496, 51
Triangles, simulation 448,504 in 106 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 303 MB
STEP 72 MB 343 MB
STL 22 MB 306 MB
OBJ 47 MB 374 MB
Visual
GLB 11 MB 338 MB
OBJ 33 MB 339 MB

1161. ecpbreaker

ecpbreaker: stages 4 and 6 take 44% to 81% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 38 s. Simulation, STL takes 30 s. Simulation, OBJ takes 50 s. Visual, GLB takes 46 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 3.9 10.0 1 ms 12.4 0.6 1.9 0.3 30.1
Simulation, STEP 1.1 3.7 10.0 1 ms 12.7 8.5 1.8 0.3 38.1
Simulation, STL 1.0 3.8 9.5 1 ms 12.6 1.2 1.9 0.3 30.4
Simulation, OBJ 1.0 3.9 9.5 1.0 ms 12.6 20.7 2.0 0.3 49.9
Visual, GLB 1.1 3.8 9.7 1 ms 27.1 0.4 3.3 0.3 45.6
Visual, OBJ 0.9 3.7 9.8 1 ms 27.4 11.4 3.5 0.3 57.1
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: ecpbreaker.kicad_pcb
Folder ecpbreaker / kicad-src
Complexity 427 / 1000 (size 287, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 6 (20210126)
Parts, tracks, vias 117, 3,175, 442
Triangles, simulation 3,875,838 in 294 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 129 MB 1.2 GB
STEP 499 MB 1.4 GB
STL 194 MB 1.3 GB
OBJ 409 MB 2.5 GB
Visual
GLB 71 MB 1.3 GB
OBJ 229 MB 1.6 GB

1162. esp32s2-breakout

esp32s2-breakout: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 39 s. Simulation, STL takes 32 s. Simulation, OBJ takes 46 s. Visual, GLB takes 49 s. Visual, OBJ takes 61 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.4 12.0 0.5 ms 13.3 0.5 1.4 0.3 30.8
Simulation, STEP 0.8 2.4 11.8 1 ms 13.4 9.1 1.4 0.3 39.1
Simulation, STL 0.9 2.7 12.1 0.6 ms 13.2 1.1 1.4 0.3 31.7
Simulation, OBJ 0.7 2.5 12.2 1.0 ms 13.3 15.3 1.3 0.3 45.6
Visual, GLB 0.8 2.3 12.3 0.4 ms 28.2 0.4 4.2 0.2 48.5
Visual, OBJ 0.8 2.5 12.0 1 ms 29.2 11.9 4.8 0.3 61.4
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: esp32s2-breakout.kicad_pcb
Folder esp32s2-breakout / kicad-src
Complexity 360 / 1000 (size 245, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 64, 1,459, 252
Triangles, simulation 3,009,806 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 101 MB 988 MB
STEP 527 MB 1.2 GB
STL 150 MB 992 MB
OBJ 316 MB 1.9 GB
Visual
GLB 75 MB 1.2 GB
OBJ 235 MB 1.5 GB

1163. esp32s2-co2-monitor

esp32s2-co2-monitor: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 21 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 4.9 0.6 ms 7.1 0.3 0.8 0.3 15.6
Simulation, STEP 0.5 1.7 5.2 0.6 ms 7.4 4.7 0.7 0.2 20.3
Simulation, STL 0.5 1.7 4.5 0.5 ms 7.3 0.5 0.7 0.2 15.4
Simulation, OBJ 0.5 1.6 4.7 0.5 ms 7.1 8.1 0.6 0.3 22.9
Visual, GLB 0.5 1.6 4.7 0.3 ms 11.7 0.2 1.6 0.2 20.5
Visual, OBJ 0.5 1.6 4.8 0.7 ms 12.1 5.2 1.8 0.3 26.3
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: esp32s2-co2-monitor.kicad_pcb
Folder esp32s2-co2-monitor / kicad-src
Complexity 360 / 1000 (size 245, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 67, 1,161, 346
Triangles, simulation 1,868,242 in 94 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 62 MB 710 MB
STEP 253 MB 871 MB
STL 93 MB 703 MB
OBJ 192 MB 1.2 GB
Visual
GLB 41 MB 833 MB
OBJ 124 MB 873 MB

1164. esp32s2-lepton

esp32s2-lepton: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 7.6 s. Simulation, STEP takes 10 s. Simulation, STL takes 7.6 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.1 0.6 ms 3.5 0.1 0.6 0.2 7.6
Simulation, STEP 0.3 0.7 2.3 0.4 ms 3.4 2.9 0.5 0.2 10.3
Simulation, STL 0.3 0.7 2.1 0.4 ms 3.5 0.2 0.6 0.2 7.6
Simulation, OBJ 0.3 0.7 2.2 0.4 ms 3.7 4.3 0.5 0.2 12.0
Visual, GLB 0.3 0.6 2.1 0.6 ms 7.5 0.1 0.9 0.2 11.8
Visual, OBJ 0.3 0.7 2.4 0.3 ms 7.4 3.4 0.8 0.2 15.3
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: esp32s2-lepton.kicad_pcb
Folder esp32s2-lepton / kicad-src
Complexity 377 / 1000 (size 237, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 62, 1,082, 116
Triangles, simulation 888,094 in 97 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 466 MB
STEP 138 MB 512 MB
STL 44 MB 428 MB
OBJ 89 MB 621 MB
Visual
GLB 22 MB 607 MB
OBJ 66 MB 593 MB

1165. gpdi-serdes

gpdi-serdes: stages 4 and 6 take 43% to 82% of a run. Simulation, GLB takes 3.8 s. Simulation, STEP takes 5.1 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 6.0 s. Visual, GLB takes 6.2 s. Visual, OBJ takes 7.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.1 0.4 ms 1.6 72 ms 0.3 0.2 3.8
Simulation, STEP 0.2 0.4 1.1 0.3 ms 1.5 1.5 0.2 0.2 5.1
Simulation, STL 0.2 0.4 1.2 0.4 ms 1.5 0.1 0.2 0.3 3.9
Simulation, OBJ 0.2 0.4 1.1 0.3 ms 1.5 2.3 0.3 0.2 6.0
Visual, GLB 0.2 0.4 1.1 0.3 ms 3.9 49 ms 0.3 0.2 6.2
Visual, OBJ 0.2 0.4 1.1 0.3 ms 3.8 1.6 0.4 0.3 7.7
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: gpdi-serdes.kicad_pcb
Folder gpdi-serdes / kicad-src
Complexity 291 / 1000 (size 166, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 20, 300, 48
Triangles, simulation 418,796 in 84 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 264 MB
STEP 57 MB 316 MB
STL 21 MB 287 MB
OBJ 41 MB 333 MB
Visual
GLB 9.2 MB 307 MB
OBJ 28 MB 325 MB

1166. gpdi

gpdi: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 5.5 s. Simulation, STEP takes 7.7 s. Simulation, STL takes 5.4 s. Simulation, OBJ takes 8.5 s. Visual, GLB takes 8.2 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.7 0.3 ms 2.3 89 ms 0.4 0.2 5.5
Simulation, STEP 0.3 0.6 1.7 0.4 ms 2.4 2.3 0.4 0.2 7.7
Simulation, STL 0.2 0.5 1.6 0.5 ms 2.4 0.2 0.3 0.2 5.4
Simulation, OBJ 0.2 0.5 1.6 0.3 ms 2.4 3.3 0.3 0.2 8.5
Visual, GLB 0.2 0.5 1.8 0.4 ms 4.9 63 ms 0.5 0.2 8.2
Visual, OBJ 0.2 0.5 1.6 0.3 ms 4.9 2.3 0.6 0.2 10.4
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: gpdi.kicad_pcb
Folder gpdi / kicad-src
Complexity 313 / 1000 (size 188, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210126)
Parts, tracks, vias 53, 679, 67
Triangles, simulation 676,432 in 104 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 342 MB
STEP 96 MB 414 MB
STL 34 MB 343 MB
OBJ 67 MB 488 MB
Visual
GLB 15 MB 466 MB
OBJ 45 MB 413 MB

1167. hdmi-si

hdmi-si: stages 4 and 6 take 44% to 79% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.0 s. Simulation, OBJ takes 13 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 2.6 0.2 ms 3.3 0.1 0.5 0.2 8.0
Simulation, STEP 0.3 0.9 2.5 0.2 ms 3.2 2.6 0.5 0.2 10.3
Simulation, STL 0.2 0.9 2.5 0.2 ms 3.3 0.2 0.6 0.2 8.0
Simulation, OBJ 0.2 0.9 2.6 0.2 ms 3.4 5.7 0.5 0.2 13.5
Visual, GLB 0.2 0.9 2.5 0.4 ms 6.0 88 ms 0.8 0.3 10.8
Visual, OBJ 0.2 1.0 2.6 0.3 ms 6.2 3.3 0.7 0.3 14.2
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: hdmi-si.kicad_pcb
Folder hdmi-si / kicad-src
Complexity 278 / 1000 (size 178, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 26, 335, 138
Triangles, simulation 987,308 in 42 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 491 MB
STEP 121 MB 540 MB
STL 49 MB 498 MB
OBJ 98 MB 689 MB
Visual
GLB 19 MB 547 MB
OBJ 59 MB 483 MB

1168. icebreaker++

icebreaker++: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 32 s. Visual, GLB takes 29 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.9 7.5 0.8 ms 8.0 0.4 0.9 0.3 19.5
Simulation, STEP 0.6 1.9 7.6 0.9 ms 8.1 6.1 0.9 0.2 25.6
Simulation, STL 0.6 2.1 7.6 0.9 ms 8.6 0.6 1.0 0.3 20.8
Simulation, OBJ 0.6 1.9 7.5 0.9 ms 8.4 12.5 1.0 0.2 32.2
Visual, GLB 0.6 2.0 7.5 0.9 ms 16.9 0.3 1.9 0.2 29.4
Visual, OBJ 0.6 2.1 7.7 0.9 ms 17.3 8.1 2.4 0.2 38.3
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: icebreaker++.kicad_pcb
Folder icebreaker++ / kicad-src
Complexity 365 / 1000 (size 265, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 92, 1,852, 227
Triangles, simulation 2,188,308 in 276 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 74 MB 760 MB
STEP 341 MB 979 MB
STL 109 MB 770 MB
OBJ 229 MB 1.4 GB
Visual
GLB 49 MB 945 MB
OBJ 150 MB 1.1 GB

1169. jtag-programmer

jtag-programmer: stages 4 and 6 take 44% to 79% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.1 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 8.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.2 0.2 ms 1.8 73 ms 0.2 0.2 4.1
Simulation, STEP 0.2 0.4 1.2 0.2 ms 1.8 1.7 0.3 0.2 5.8
Simulation, STL 0.2 0.4 1.2 0.2 ms 1.7 0.1 0.3 0.2 4.1
Simulation, OBJ 0.2 0.4 1.2 0.2 ms 1.8 2.7 0.3 0.2 6.9
Visual, GLB 0.2 0.4 1.2 0.2 ms 3.4 49 ms 0.3 0.2 5.8
Visual, OBJ 0.2 0.4 1.2 0.2 ms 3.8 1.8 0.5 0.2 8.1
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: jtag-programmer.kicad_pcb
Folder jtag-programmer / kicad-src
Complexity 314 / 1000 (size 214, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 25, 327, 92
Triangles, simulation 546,070 in 54 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 310 MB
STEP 73 MB 372 MB
STL 27 MB 308 MB
OBJ 54 MB 411 MB
Visual
GLB 12 MB 355 MB
OBJ 36 MB 386 MB

1170. led-panel

led-panel: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 6.0 s. Simulation, STL takes 4.3 s. Simulation, OBJ takes 5.9 s. Visual, GLB takes 5.1 s. Visual, OBJ takes 6.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 1.0 0.3 ms 2.1 60 ms 0.2 0.2 4.0
Simulation, STEP 0.2 0.3 0.9 0.2 ms 2.2 1.9 0.3 0.2 6.0
Simulation, STL 0.2 0.3 1.0 0.3 ms 2.2 0.1 0.3 0.3 4.3
Simulation, OBJ 0.2 0.2 1.0 0.2 ms 2.1 1.9 0.2 0.2 5.9
Visual, GLB 0.2 0.3 0.9 0.2 ms 3.2 46 ms 0.3 0.2 5.1
Visual, OBJ 0.2 0.2 0.9 0.2 ms 3.2 1.4 0.3 0.2 6.5
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: led-panel.kicad_pcb
Folder led-panel / kicad-src
Complexity 251 / 1000 (size 161, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20201116)
Parts, tracks, vias 58, 388, 16
Triangles, simulation 337,424 in 61 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 295 MB
STEP 74 MB 324 MB
STL 17 MB 291 MB
OBJ 34 MB 294 MB
Visual
GLB 9.0 MB 314 MB
OBJ 26 MB 316 MB

1171. meiji-led-ring

meiji-led-ring: stages 4 and 6 take 47% to 77% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 8.6 s. Visual, GLB takes 8.4 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 1.7 0.3 ms 1.9 84 ms 0.4 0.2 5.3
Simulation, STEP 0.2 0.7 2.0 0.3 ms 2.3 2.0 0.4 0.2 7.9
Simulation, STL 0.3 0.7 1.8 0.3 ms 2.1 0.2 0.4 0.2 5.7
Simulation, OBJ 0.2 0.6 1.9 0.5 ms 2.1 3.1 0.4 0.2 8.6
Visual, GLB 0.4 0.7 1.9 0.4 ms 4.6 72 ms 0.6 0.3 8.4
Visual, OBJ 0.3 0.7 1.9 0.4 ms 5.0 2.3 0.6 0.2 10.9
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: meiji-led-ring.kicad_pcb
Folder meiji-led-ring / kicad-src
Complexity 287 / 1000 (size 187, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210126)
Parts, tracks, vias 61, 592, 59
Triangles, simulation 709,422 in 75 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 399 MB
STEP 110 MB 424 MB
STL 35 MB 393 MB
OBJ 71 MB 510 MB
Visual
GLB 16 MB 431 MB
OBJ 48 MB 434 MB

1172. memory-lcd-wing

memory-lcd-wing: stages 4 and 6 take 47% to 79% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 4.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.2 ms 1.0 33 ms 0.1 0.2 2.4
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.9 1.1 0.1 0.3 3.5
Simulation, STL 0.1 0.2 0.7 0.3 ms 1.0 52 ms 0.1 0.2 2.4
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.9 1.1 0.1 0.2 3.5
Visual, GLB 0.1 0.2 0.7 0.2 ms 1.8 33 ms 0.2 0.2 3.3
Visual, OBJ 0.1 0.2 0.9 0.2 ms 2.2 0.9 0.2 0.2 4.6
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: memory-lcd-wing.kicad_pcb
Folder memory-lcd-wing / kicad-src
Complexity 196 / 1000 (size 106, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20201116)
Parts, tracks, vias 4, 68, 3
Triangles, simulation 192,292 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.2 MB 206 MB
STEP 28 MB 225 MB
STL 9.6 MB 207 MB
OBJ 19 MB 209 MB
Visual
GLB 4.2 MB 188 MB
OBJ 12 MB 191 MB

1173. pcie_x1

pcie_x1: stages 4 and 6 take 43% to 79% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 4.1 s. Visual, OBJ takes 5.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.6 0.3 ms 0.9 45 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.6 0.3 ms 1.0 1.1 0.2 0.2 3.5
Simulation, STL 0.1 0.2 0.6 0.3 ms 0.9 65 ms 0.1 0.2 2.3
Simulation, OBJ 0.1 0.3 0.7 0.2 ms 1.0 1.4 0.2 0.2 3.8
Visual, GLB 0.1 0.3 0.7 0.3 ms 2.6 30 ms 0.2 0.2 4.1
Visual, OBJ 0.1 0.2 0.7 0.3 ms 2.6 1.0 0.3 0.2 5.1
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: pcie_x1.kicad_pcb
Folder pcie_x1 / kicad-src
Complexity 271 / 1000 (size 156, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 10, 248, 37
Triangles, simulation 286,956 in 84 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.6 MB 253 MB
STEP 41 MB 259 MB
STL 14 MB 249 MB
OBJ 28 MB 243 MB
Visual
GLB 6.5 MB 235 MB
OBJ 19 MB 233 MB

1174. pcie_x4

pcie_x4: stages 4 and 6 take 44% to 81% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 5.0 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 7.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.0 0.3 ms 1.5 0.1 0.2 0.2 3.7
Simulation, STEP 0.2 0.4 1.1 0.3 ms 1.4 1.5 0.2 0.3 5.0
Simulation, STL 0.2 0.4 1.2 0.3 ms 1.5 0.1 0.2 0.3 3.9
Simulation, OBJ 0.2 0.4 1.0 1 ms 1.4 2.1 0.2 0.3 5.5
Visual, GLB 0.2 0.4 1.1 0.5 ms 3.7 43 ms 0.3 0.2 5.9
Visual, OBJ 0.2 0.4 1.0 0.4 ms 3.6 1.4 0.3 0.2 7.1
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: pcie_x4.kicad_pcb
Folder pcie_x4 / kicad-src
Complexity 282 / 1000 (size 167, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 16, 374, 53
Triangles, simulation 370,874 in 94 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 275 MB
STEP 52 MB 296 MB
STL 19 MB 273 MB
OBJ 37 MB 285 MB
Visual
GLB 8.3 MB 282 MB
OBJ 25 MB 282 MB

1175. pmod-gnss

pmod-gnss: stages 4 and 6 take 46% to 77% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 4.0 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 4.5 s. Visual, GLB takes 4.2 s. Visual, OBJ takes 5.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.3 ms 1.1 55 ms 0.2 0.2 2.8
Simulation, STEP 0.2 0.3 0.8 0.2 ms 1.1 1.2 0.2 0.3 4.0
Simulation, STL 0.2 0.3 0.8 0.2 ms 1.0 84 ms 0.2 0.3 2.8
Simulation, OBJ 0.2 0.3 0.9 0.2 ms 1.1 1.6 0.2 0.2 4.5
Visual, GLB 0.2 0.3 0.8 0.2 ms 2.4 36 ms 0.2 0.3 4.2
Visual, OBJ 0.1 0.3 0.9 0.2 ms 2.4 1.0 0.2 0.2 5.2
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: pmod-gnss.kicad_pcb
Folder pmod-gnss / kicad-src
Complexity 261 / 1000 (size 156, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 22, 135, 30
Triangles, simulation 281,488 in 41 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.3 MB 234 MB
STEP 34 MB 250 MB
STL 14 MB 234 MB
OBJ 28 MB 237 MB
Visual
GLB 5.8 MB 218 MB
OBJ 17 MB 222 MB

1176. pmod-quad-7segment

pmod-quad-7segment: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.9 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 6.2 s. Visual, GLB takes 6.1 s. Visual, OBJ takes 7.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.2 0.3 ms 1.7 81 ms 0.3 0.2 4.1
Simulation, STEP 0.2 0.4 1.4 0.4 ms 1.7 1.8 0.3 0.2 5.9
Simulation, STL 0.2 0.4 1.2 0.3 ms 1.6 99 ms 0.3 0.2 4.0
Simulation, OBJ 0.2 0.4 1.3 0.3 ms 1.6 2.3 0.2 0.2 6.2
Visual, GLB 0.2 0.4 1.3 0.3 ms 3.6 50 ms 0.3 0.2 6.1
Visual, OBJ 0.2 0.4 1.2 0.2 ms 3.4 1.7 0.3 0.3 7.3
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: pmod-quad-7segment.kicad_pcb
Folder pmod-quad-7segment / kicad-src
Complexity 244 / 1000 (size 154, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20201116)
Parts, tracks, vias 21, 385, 63
Triangles, simulation 398,938 in 49 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 272 MB
STEP 67 MB 312 MB
STL 20 MB 272 MB
OBJ 40 MB 322 MB
Visual
GLB 11 MB 333 MB
OBJ 33 MB 334 MB

1177. sd-dummy

sd-dummy: stages 4 and 6 take 44% to 75% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.3 ms 0.7 29 ms 90 ms 0.2 1.7
Simulation, STEP 0.1 0.2 0.5 0.1 ms 0.7 0.8 85 ms 0.2 2.5
Simulation, STL 0.1 0.2 0.5 0.1 ms 0.6 39 ms 0.1 0.2 1.7
Simulation, OBJ 99 ms 0.2 0.5 0.2 ms 0.7 0.9 96 ms 0.2 2.6
Visual, GLB 0.1 0.2 0.5 0.1 ms 1.2 16 ms 0.1 0.2 2.3
Visual, OBJ 0.1 0.2 0.5 0.1 ms 1.3 0.5 0.1 0.2 2.9
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: sd-dummy.kicad_pcb
Folder pmod-sd-dummy / kicad-src
Complexity 212 / 1000 (size 122, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 4, 57, 7
Triangles, simulation 165,454 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.6 MB 194 MB
STEP 24 MB 203 MB
STL 8.3 MB 196 MB
OBJ 16 MB 196 MB
Visual
GLB 3.5 MB 165 MB
OBJ 9.9 MB 159 MB

1178. resonance

resonance: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 25 s. Visual, GLB takes 23 s. Visual, OBJ takes 27 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 7.1 0.5 ms 7.2 0.2 0.7 0.3 17.6
Simulation, STEP 0.4 1.4 6.8 0.5 ms 7.8 4.4 0.7 0.2 21.7
Simulation, STL 0.4 1.4 6.9 0.6 ms 6.8 0.4 0.6 0.2 16.7
Simulation, OBJ 0.5 1.4 6.6 0.5 ms 7.1 8.5 0.7 0.2 24.9
Visual, GLB 0.5 1.5 7.1 0.5 ms 11.7 0.1 1.5 0.3 22.7
Visual, OBJ 0.4 1.3 6.8 0.8 ms 11.7 5.0 1.6 0.3 27.1
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: resonance.kicad_pcb
Folder resonance / kicad-src
Complexity 348 / 1000 (size 248, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 64, 858, 149
Triangles, simulation 1,380,012 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 548 MB
STEP 218 MB 674 MB
STL 69 MB 533 MB
OBJ 147 MB 942 MB
Visual
GLB 28 MB 608 MB
OBJ 90 MB 699 MB

1179. rpi-hq-camera

rpi-hq-camera: stages 4 and 6 take 40% to 80% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 5.0 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 5.2 s. Visual, GLB takes 5.4 s. Visual, OBJ takes 6.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 0.8 0.2 ms 1.4 68 ms 0.2 0.3 3.3
Simulation, STEP 0.2 0.3 0.9 0.3 ms 1.4 1.8 0.2 0.2 5.0
Simulation, STL 0.2 0.3 0.9 0.3 ms 1.4 0.1 0.2 0.2 3.3
Simulation, OBJ 0.2 0.3 0.8 0.5 ms 1.3 2.2 0.2 0.2 5.2
Visual, GLB 0.2 0.3 0.8 0.3 ms 3.5 52 ms 0.3 0.3 5.4
Visual, OBJ 0.2 0.3 0.7 0.2 ms 3.4 1.4 0.3 0.3 6.6
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: rpi-hq-camera.kicad_pcb
Folder rpi-hq-camera / kicad-src
Complexity 274 / 1000 (size 159, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 7, 453, 31
Triangles, simulation 341,220 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 279 MB
STEP 57 MB 290 MB
STL 17 MB 262 MB
OBJ 34 MB 286 MB
Visual
GLB 8.1 MB 270 MB
OBJ 24 MB 283 MB

1180. SCD30-3d-model

SCD30-3d-model: stages 4 and 6 take 47% to 77% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.7 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.8 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 98 ms 0.1 0.5 0.1 ms 0.7 24 ms 61 ms 0.2 1.7
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.7 0.9 60 ms 0.2 2.7
Simulation, STL 0.1 0.1 0.5 0.1 ms 0.8 41 ms 63 ms 0.2 1.9
Simulation, OBJ 0.1 0.1 0.5 0.2 ms 0.8 0.9 73 ms 0.2 2.8
Visual, GLB 0.1 0.1 0.5 0.1 ms 1.4 19 ms 0.1 0.2 2.5
Visual, OBJ 0.1 0.1 0.5 0.1 ms 1.4 0.6 0.1 0.3 3.2
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: SCD30-3d-model.kicad_pcb
Folder SCD30-3d-model / kicad-src
Complexity 121 / 1000 (size 66, features 55)
KESE features rounded,
trapezoid or chamfered pads,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 19, 0, 0
Triangles, simulation 138,320 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.7 MB 197 MB
STEP 18 MB 206 MB
STL 6.9 MB 196 MB
OBJ 14 MB 197 MB
Visual
GLB 3.6 MB 173 MB
OBJ 10 MB 171 MB

1181. syzygy-breakout

syzygy-breakout: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 14 s. Simulation, OBJ takes 22 s. Visual, GLB takes 18 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.2 5.3 0.3 ms 5.4 0.3 0.6 0.3 13.3
Simulation, STEP 0.3 1.2 5.3 0.4 ms 5.4 3.8 0.6 0.2 16.9
Simulation, STL 0.3 1.2 5.4 0.5 ms 5.5 0.5 0.6 0.3 13.7
Simulation, OBJ 0.2 1.1 5.5 0.7 ms 5.4 9.1 0.7 0.2 22.3
Visual, GLB 0.4 1.3 5.4 0.3 ms 9.8 0.1 0.9 0.2 18.0
Visual, OBJ 0.3 1.2 5.6 0.3 ms 9.4 4.0 1.1 0.3 21.9
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-breakout.kicad_pcb
Folder syzygy-breakout / kicad-src
Complexity 273 / 1000 (size 158, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 7, 399, 41
Triangles, simulation 1,777,548 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 694 MB
STEP 216 MB 801 MB
STL 89 MB 673 MB
OBJ 181 MB 1.1 GB
Visual
GLB 28 MB 682 MB
OBJ 85 MB 750 MB

1182. syzygy-dual-atto320

syzygy-dual-atto320: stages 4 and 6 take 45% to 81% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 4.6 s. Simulation, OBJ takes 7.5 s. Visual, GLB takes 7.4 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.6 0.2 ms 1.8 98 ms 0.3 0.2 4.7
Simulation, STEP 0.2 0.5 1.7 0.4 ms 1.8 1.6 0.3 0.2 6.3
Simulation, STL 0.2 0.5 1.5 0.3 ms 1.7 0.1 0.3 0.2 4.6
Simulation, OBJ 0.2 0.5 1.5 0.3 ms 1.9 3.0 0.3 0.2 7.5
Visual, GLB 0.2 0.5 1.6 0.2 ms 4.4 60 ms 0.5 0.2 7.4
Visual, OBJ 0.2 0.5 1.5 0.3 ms 4.2 2.1 0.7 0.2 9.5
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-dual-atto320.kicad_pcb
Folder syzygy-dual-atto320 / kicad-src
Complexity 275 / 1000 (size 160, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 8, 323, 73
Triangles, simulation 559,920 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 324 MB
STEP 89 MB 351 MB
STL 28 MB 317 MB
OBJ 56 MB 402 MB
Visual
GLB 13 MB 368 MB
OBJ 40 MB 361 MB

1183. syzygy-epc901

syzygy-epc901: stages 4 and 6 take 46% to 82% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 20 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.7 4.6 0.5 ms 6.7 0.3 0.8 0.2 14.8
Simulation, STEP 0.5 1.6 4.5 0.5 ms 6.3 4.8 0.8 0.2 18.7
Simulation, STL 0.5 1.5 4.4 0.6 ms 6.7 0.5 0.8 0.3 14.7
Simulation, OBJ 0.5 1.6 4.5 0.4 ms 6.2 9.1 0.9 0.2 23.2
Visual, GLB 0.5 1.6 4.3 0.6 ms 11.7 0.2 1.0 0.2 19.6
Visual, OBJ 0.5 1.6 4.5 0.8 ms 11.6 6.1 1.7 0.2 26.3
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-epc901.kicad_pcb
Folder syzygy-epc901 / kicad-src
Complexity 380 / 1000 (size 250, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210126)
Parts, tracks, vias 97, 1,339, 308
Triangles, simulation 1,768,478 in 129 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 645 MB
STEP 233 MB 869 MB
STL 88 MB 656 MB
OBJ 181 MB 1.2 GB
Visual
GLB 39 MB 833 MB
OBJ 121 MB 895 MB

1184. syzygy-flir-boson

syzygy-flir-boson: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 19 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.5 5.5 0.3 ms 5.0 0.2 0.6 0.2 13.4
Simulation, STEP 0.5 1.4 5.1 0.3 ms 5.1 3.3 0.6 0.3 16.3
Simulation, STL 0.3 1.4 5.5 0.7 ms 5.0 0.4 0.6 0.2 13.5
Simulation, OBJ 0.4 1.4 5.5 0.4 ms 5.0 6.2 0.7 0.2 19.4
Visual, GLB 0.4 1.4 5.2 0.3 ms 10.3 0.2 1.3 0.2 19.0
Visual, OBJ 0.3 1.2 5.3 0.4 ms 10.5 4.6 1.3 0.2 23.4
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-flir-boson.kicad_pcb
Folder syzygy-flir-boson / kicad-src
Complexity 312 / 1000 (size 197, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210126)
Parts, tracks, vias 35, 906, 375
Triangles, simulation 1,359,476 in 105 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 599 MB
STEP 179 MB 701 MB
STL 68 MB 606 MB
OBJ 137 MB 919 MB
Visual
GLB 32 MB 758 MB
OBJ 98 MB 812 MB

1185. syzygy-flir-tau2

syzygy-flir-tau2: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.1 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 2.6 0.4 ms 3.1 0.1 0.4 0.2 7.7
Simulation, STEP 0.4 0.8 2.7 0.3 ms 3.1 2.9 0.5 0.2 10.6
Simulation, STL 0.4 0.9 2.8 0.5 ms 3.1 0.2 0.5 0.2 8.1
Simulation, OBJ 0.4 0.9 2.7 0.4 ms 3.2 4.3 0.5 0.2 12.3
Visual, GLB 0.4 0.8 2.8 0.4 ms 7.1 0.1 0.8 0.2 12.2
Visual, OBJ 0.4 0.9 2.6 0.3 ms 7.4 3.3 0.9 0.2 15.6
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-flir-tau2.kicad_pcb
Folder syzygy-flir-tau2 / kicad-src
Complexity 310 / 1000 (size 195, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 32, 1,446, 138
Triangles, simulation 1,050,638 in 82 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 541 MB
STEP 182 MB 589 MB
STL 53 MB 508 MB
OBJ 106 MB 737 MB
Visual
GLB 26 MB 673 MB
OBJ 80 MB 676 MB

1186. syzygy-pmod

syzygy-pmod: stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 7.0 s. Simulation, STL takes 5.6 s. Simulation, OBJ takes 8.4 s. Visual, GLB takes 8.1 s. Visual, OBJ takes 9.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.8 0.3 ms 1.8 90 ms 0.4 0.2 5.0
Simulation, STEP 0.2 0.6 1.8 0.3 ms 2.0 1.8 0.4 0.2 7.0
Simulation, STL 0.2 0.6 2.0 0.3 ms 2.0 0.2 0.4 0.2 5.6
Simulation, OBJ 0.2 0.6 1.9 0.3 ms 2.0 3.0 0.4 0.2 8.4
Visual, GLB 0.2 0.6 1.9 0.3 ms 4.6 61 ms 0.5 0.2 8.1
Visual, OBJ 0.2 0.6 1.9 0.3 ms 4.4 1.8 0.6 0.2 9.8
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-pmod.kicad_pcb
Folder syzygy-pmod / kicad-src
Complexity 281 / 1000 (size 166, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 16, 387, 36
Triangles, simulation 702,838 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 340 MB
STEP 93 MB 381 MB
STL 35 MB 331 MB
OBJ 71 MB 506 MB
Visual
GLB 13 MB 392 MB
OBJ 39 MB 390 MB

1187. syzygy-rgb888-lcd

syzygy-rgb888-lcd: stages 4 and 6 take 44% to 80% of a run. Simulation, GLB takes 3.6 s. Simulation, STEP takes 5.0 s. Simulation, STL takes 3.6 s. Simulation, OBJ takes 5.7 s. Visual, GLB takes 6.1 s. Visual, OBJ takes 7.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.0 0.4 ms 1.5 74 ms 0.3 0.2 3.6
Simulation, STEP 0.2 0.4 1.0 0.2 ms 1.4 1.5 0.3 0.2 5.0
Simulation, STL 0.2 0.4 0.9 0.3 ms 1.4 0.1 0.2 0.3 3.6
Simulation, OBJ 0.2 0.4 0.9 0.3 ms 1.6 2.2 0.2 0.2 5.7
Visual, GLB 0.2 0.4 1.0 0.3 ms 3.9 49 ms 0.3 0.2 6.1
Visual, OBJ 0.2 0.4 1.0 0.3 ms 4.0 1.4 0.4 0.2 7.6
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-rgb888-lcd.kicad_pcb
Folder syzygy-rgb888-lcd / kicad-src
Complexity 282 / 1000 (size 167, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 15, 359, 65
Triangles, simulation 448,792 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 305 MB
STEP 62 MB 317 MB
STL 22 MB 299 MB
OBJ 45 MB 348 MB
Visual
GLB 9.8 MB 317 MB
OBJ 30 MB 321 MB

1188. syzygy-sgmii

syzygy-sgmii: stages 4 and 6 take 46% to 82% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 15 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 3.2 0.5 ms 3.7 0.2 0.6 0.3 9.3
Simulation, STEP 0.3 1.0 3.1 0.5 ms 3.7 3.0 0.6 0.3 12.0
Simulation, STL 0.4 1.0 3.1 0.5 ms 3.8 0.3 0.6 0.3 9.4
Simulation, OBJ 0.4 1.0 3.1 0.4 ms 3.7 5.8 0.6 0.3 15.0
Visual, GLB 0.3 1.0 3.1 0.5 ms 8.0 0.1 0.8 0.2 13.6
Visual, OBJ 0.4 1.1 3.0 0.5 ms 8.2 4.2 0.8 0.3 17.9
Board Repo: gregdavill/advent-calendar-of-circuits-2020
Board: syzygy-sgmii.kicad_pcb
Folder syzygy-sgmii / kicad-src
Complexity 351 / 1000 (size 236, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210126)
Parts, tracks, vias 69, 850, 129
Triangles, simulation 1,034,760 in 118 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 431 MB
STEP 137 MB 533 MB
STL 52 MB 434 MB
OBJ 104 MB 738 MB
Visual
GLB 23 MB 621 MB
OBJ 70 MB 613 MB
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