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Corpus Testing 20

github-actions[bot] edited this page Nov 10, 2026 · 1 revision

Corpus Page 20

Part 20 of 29 of Corpus Testing: every board of these projects, six runs each, one file format a run, as Corpus Testing describes.

20.1 headstage-rhs2116

headstage-rhs2116: stages 4 and 6 take 44% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 26 s. Visual, GLB takes 27 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.8 4.9 0.6 ms 7.0 0.3 1.0 0.3 15.8
Simulation, STEP 0.6 1.8 4.9 0.6 ms 6.8 5.1 1.0 0.2 20.4
Simulation, STL 0.6 1.8 4.8 0.6 ms 6.8 0.6 1.0 0.3 15.7
Simulation, OBJ 0.7 1.8 4.8 1.0 ms 6.7 11.0 1.0 0.3 26.2
Visual, GLB 0.6 1.7 4.9 0.7 ms 17.6 0.2 1.9 0.2 27.2
Visual, OBJ 0.6 1.8 4.8 0.6 ms 18.6 8.0 2.0 0.2 36.0
Board Repo: open-ephys/onix-headstage-rhs2116
Board: headstage-rhs2116.kicad_pcb
Folder pcb
Complexity 425 / 1000 (size 280, features 145)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 131, 1,462, 313
Triangles, simulation 2,183,078 in 178 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 74 MB 841 MB
STEP 318 MB 952 MB
STL 109 MB 824 MB
OBJ 231 MB 1.5 GB
Visual
GLB 49 MB 919 MB
OBJ 154 MB 1.1 GB

20.2 test-board

test-board: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.5 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 4.8 0.7 ms 3.4 0.2 0.5 0.2 10.2
Simulation, STEP 0.3 0.8 4.3 0.5 ms 3.0 2.5 0.4 0.2 11.6
Simulation, STL 0.3 0.7 4.4 0.3 ms 3.1 0.2 0.5 0.2 9.5
Simulation, OBJ 0.3 0.8 4.4 0.6 ms 3.2 4.6 0.5 0.2 14.1
Visual, GLB 0.3 0.7 4.4 0.4 ms 6.5 0.1 0.7 0.2 12.9
Visual, OBJ 0.3 0.8 4.4 0.3 ms 6.8 3.6 0.8 0.2 16.8
Board Repo: open-ephys/onix-headstage-rhs2116
Board: test-board.kicad_pcb
Folder test-board
Complexity 229 / 1000 (size 144, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 26, 219, 13
Triangles, simulation 820,550 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 402 MB
STEP 144 MB 492 MB
STL 41 MB 393 MB
OBJ 83 MB 590 MB
Visual
GLB 21 MB 558 MB
OBJ 61 MB 540 MB

20.3 PCIexpress_x16_full

PCIexpress_x16_full: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 5.7 s. Simulation, STEP takes 7.3 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 8.4 s. Visual, GLB takes 9.7 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.2 0.4 ms 2.0 0.1 0.3 0.2 5.7
Simulation, STEP 0.2 0.6 2.0 0.5 ms 2.0 1.8 0.3 0.2 7.3
Simulation, STL 0.2 0.6 2.2 0.5 ms 1.9 0.2 0.4 0.2 5.7
Simulation, OBJ 0.2 0.6 2.0 0.7 ms 1.9 3.1 0.4 0.2 8.4
Visual, GLB 0.2 0.7 2.3 0.5 ms 5.6 76 ms 0.6 0.3 9.7
Visual, OBJ 0.2 0.7 2.2 0.5 ms 5.8 2.1 0.7 0.3 11.9
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x16_full.kicad_pcb
Folder PCIexpress_x16_full
Complexity 239 / 1000 (size 184, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 65, 323, 102
Triangles, simulation 613,568 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 375 MB
STEP 102 MB 394 MB
STL 31 MB 373 MB
OBJ 64 MB 452 MB
Visual
GLB 15 MB 388 MB
OBJ 45 MB 389 MB

20.4 PCIexpress_x16_half

PCIexpress_x16_half: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 6.1 s. Simulation, STEP takes 7.8 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 9.3 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.3 0.4 ms 2.1 0.1 0.4 0.2 6.1
Simulation, STEP 0.3 0.7 2.3 0.7 ms 2.0 1.9 0.4 0.2 7.8
Simulation, STL 0.3 0.6 2.3 0.5 ms 2.0 0.2 0.4 0.3 6.0
Simulation, OBJ 0.3 0.7 2.4 0.4 ms 2.1 3.3 0.4 0.2 9.3
Visual, GLB 0.2 0.7 2.3 0.5 ms 5.0 73 ms 0.6 0.2 9.2
Visual, OBJ 0.3 0.7 2.3 0.4 ms 5.4 2.6 0.6 0.3 12.2
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x16_half.kicad_pcb
Folder PCIexpress_x16_half
Complexity 239 / 1000 (size 184, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 65, 323, 102
Triangles, simulation 607,864 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 364 MB
STEP 102 MB 386 MB
STL 30 MB 360 MB
OBJ 63 MB 448 MB
Visual
GLB 15 MB 380 MB
OBJ 45 MB 398 MB

20.5 PCIexpress_x16_low

PCIexpress_x16_low: stages 4 and 6 take 46% to 81% of a run. Simulation, GLB takes 6.5 s. Simulation, STEP takes 8.0 s. Simulation, STL takes 6.4 s. Simulation, OBJ takes 10 s. Visual, GLB takes 11 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.5 0.5 ms 2.2 0.1 0.4 0.3 6.5
Simulation, STEP 0.3 0.7 2.3 0.4 ms 2.1 2.0 0.4 0.3 8.0
Simulation, STL 0.3 0.8 2.5 0.5 ms 2.2 0.2 0.4 0.2 6.4
Simulation, OBJ 0.3 0.8 2.4 0.5 ms 2.1 3.6 0.4 0.3 10.0
Visual, GLB 0.3 0.8 2.5 0.5 ms 6.1 82 ms 0.7 0.2 10.6
Visual, OBJ 0.3 0.7 2.3 0.4 ms 5.3 2.4 0.7 0.3 12.0
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x16_low.kicad_pcb
Folder PCIexpress_x16_low
Complexity 239 / 1000 (size 184, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 65, 323, 102
Triangles, simulation 608,008 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 379 MB
STEP 101 MB 386 MB
STL 30 MB 376 MB
OBJ 63 MB 447 MB
Visual
GLB 15 MB 379 MB
OBJ 45 MB 400 MB

20.6 PCIexpress_x1_full

PCIexpress_x1_full: stages 4 and 6 take 40% to 72% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.2 0.2 ms 0.6 17 ms 54 ms 0.2 1.3
Simulation, STEP 99 ms 98 ms 0.3 0.1 ms 0.5 0.8 53 ms 0.2 2.0
Simulation, STL 0.1 0.1 0.2 0.1 ms 0.5 35 ms 63 ms 0.2 1.3
Simulation, OBJ 98 ms 0.1 0.2 0.1 ms 0.5 0.4 56 ms 0.2 1.7
Visual, GLB 0.1 0.1 0.2 0.1 ms 1.2 12 ms 57 ms 0.2 1.9
Visual, OBJ 98 ms 0.1 0.2 0.2 ms 1.1 0.3 55 ms 0.2 2.1
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x1_full.kicad_pcb
Folder PCIexpress_x1_full
Complexity 175 / 1000 (size 120, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 5, 23, 12
Triangles, simulation 83,072 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.8 MB 182 MB
STEP 12 MB 181 MB
STL 4.2 MB 179 MB
OBJ 8.1 MB 180 MB
Visual
GLB 1.9 MB 154 MB
OBJ 5.4 MB 154 MB

20.7 PCIexpress_x1_half

PCIexpress_x1_half: stages 4 and 6 take 35% to 74% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 97 ms 0.1 0.2 0.2 ms 0.5 15 ms 60 ms 0.2 1.2
Simulation, STEP 0.1 0.1 0.2 0.2 ms 0.5 0.8 73 ms 0.3 2.1
Simulation, STL 0.1 0.1 0.3 0.1 ms 0.6 23 ms 53 ms 0.2 1.4
Simulation, OBJ 94 ms 0.1 0.2 0.1 ms 0.6 0.4 69 ms 0.3 1.7
Visual, GLB 0.1 0.1 0.2 0.3 ms 1.4 15 ms 74 ms 0.2 2.1
Visual, OBJ 95 ms 96 ms 0.2 0.3 ms 1.3 0.3 72 ms 0.3 2.3
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x1_half.kicad_pcb
Folder PCIexpress_x1_half
Complexity 175 / 1000 (size 120, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 5, 23, 12
Triangles, simulation 79,200 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.7 MB 175 MB
STEP 12 MB 176 MB
STL 4.0 MB 176 MB
OBJ 7.8 MB 177 MB
Visual
GLB 1.8 MB 154 MB
OBJ 5.1 MB 153 MB

20.8 PCIexpress_x1_low

PCIexpress_x1_low: stages 4 and 6 take 37% to 74% of a run. Simulation, GLB takes 1.0 s. Simulation, STEP takes 1.7 s. Simulation, STL takes 1.1 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.6 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 82 ms 78 ms 0.2 0.1 ms 0.4 14 ms 43 ms 0.2 1.0
Simulation, STEP 88 ms 92 ms 0.2 0.1 ms 0.5 0.7 41 ms 0.2 1.7
Simulation, STL 86 ms 85 ms 0.2 0.1 ms 0.5 23 ms 47 ms 0.2 1.1
Simulation, OBJ 95 ms 87 ms 0.2 0.1 ms 0.5 0.4 48 ms 0.2 1.5
Visual, GLB 0.1 87 ms 0.2 0.1 ms 1.0 9 ms 47 ms 0.2 1.6
Visual, OBJ 82 ms 81 ms 0.2 0.1 ms 0.9 0.3 58 ms 0.2 1.8
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x1_low.kicad_pcb
Folder PCIexpress_x1_low
Complexity 175 / 1000 (size 120, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 5, 23, 12
Triangles, simulation 79,200 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.7 MB 182 MB
STEP 12 MB 179 MB
STL 4.0 MB 174 MB
OBJ 7.7 MB 182 MB
Visual
GLB 1.8 MB 154 MB
OBJ 5.1 MB 154 MB

20.9 PCIexpress_x4_full

PCIexpress_x4_full: stages 4 and 6 take 43% to 79% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.7 s. Visual, GLB takes 2.9 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.3 ms 0.7 25 ms 0.1 0.2 1.7
Simulation, STEP 0.1 0.2 0.5 0.2 ms 0.6 0.9 0.1 0.2 2.6
Simulation, STL 0.1 0.2 0.5 0.2 ms 0.7 49 ms 81 ms 0.2 1.8
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.7 0.9 90 ms 0.2 2.7
Visual, GLB 0.1 0.2 0.5 0.1 ms 1.8 21 ms 0.1 0.2 2.9
Visual, OBJ 0.1 0.2 0.5 0.2 ms 1.7 0.6 0.1 0.2 3.4
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x4_full.kicad_pcb
Folder PCIexpress_x4_full
Complexity 204 / 1000 (size 149, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 17, 83, 30
Triangles, simulation 187,908 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.3 MB 218 MB
STEP 29 MB 220 MB
STL 9.4 MB 218 MB
OBJ 19 MB 215 MB
Visual
GLB 4.5 MB 183 MB
OBJ 13 MB 182 MB

20.10 PCIexpress_x4_half

PCIexpress_x4_half: stages 4 and 6 take 44% to 81% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 2.8 s. Simulation, STL takes 2.1 s. Simulation, OBJ takes 2.8 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.2 ms 0.8 32 ms 89 ms 0.2 1.9
Simulation, STEP 0.1 0.2 0.5 0.3 ms 0.7 0.9 0.1 0.2 2.8
Simulation, STL 0.1 0.2 0.6 0.2 ms 0.8 49 ms 93 ms 0.2 2.1
Simulation, OBJ 0.1 0.2 0.5 0.2 ms 0.8 0.8 0.1 0.3 2.8
Visual, GLB 97 ms 0.2 0.5 0.2 ms 1.9 18 ms 0.1 0.2 3.0
Visual, OBJ 0.1 0.2 0.5 0.2 ms 1.8 0.6 0.1 0.2 3.5
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x4_half.kicad_pcb
Folder PCIexpress_x4_half
Complexity 204 / 1000 (size 149, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 17, 83, 30
Triangles, simulation 182,182 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.1 MB 215 MB
STEP 29 MB 220 MB
STL 9.1 MB 211 MB
OBJ 18 MB 215 MB
Visual
GLB 4.4 MB 171 MB
OBJ 13 MB 178 MB

20.11 PCIexpress_x4_low

PCIexpress_x4_low: stages 4 and 6 take 44% to 78% of a run. Simulation, GLB takes 2.1 s. Simulation, STEP takes 2.9 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.2 ms 0.8 33 ms 0.1 0.2 2.1
Simulation, STEP 0.1 0.2 0.6 0.2 ms 0.7 1.0 97 ms 0.2 2.9
Simulation, STL 0.1 0.2 0.6 0.1 ms 0.7 49 ms 91 ms 0.2 1.9
Simulation, OBJ 0.1 0.2 0.6 0.2 ms 0.7 1.0 0.1 0.2 2.9
Visual, GLB 0.1 0.2 0.6 0.3 ms 1.9 27 ms 0.1 0.2 3.1
Visual, OBJ 0.1 0.2 0.5 0.3 ms 1.9 0.7 0.1 0.2 3.7
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x4_low.kicad_pcb
Folder PCIexpress_x4_low
Complexity 204 / 1000 (size 149, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 17, 83, 30
Triangles, simulation 182,178 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.1 MB 206 MB
STEP 29 MB 217 MB
STL 9.1 MB 214 MB
OBJ 18 MB 213 MB
Visual
GLB 4.4 MB 175 MB
OBJ 13 MB 179 MB

20.12 PCIexpress_x8_full

PCIexpress_x8_full: stages 4 and 6 take 43% to 78% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.6 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.0 s. Visual, GLB takes 5.2 s. Visual, OBJ takes 6.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.1 0.3 ms 1.2 58 ms 0.2 0.2 3.3
Simulation, STEP 0.2 0.4 1.1 0.2 ms 1.2 1.4 0.2 0.2 4.6
Simulation, STL 0.2 0.4 1.1 0.2 ms 1.1 88 ms 0.2 0.3 3.4
Simulation, OBJ 0.2 0.4 1.1 0.3 ms 1.1 1.9 0.2 0.3 5.0
Visual, GLB 0.2 0.4 1.1 0.3 ms 3.0 39 ms 0.2 0.3 5.2
Visual, OBJ 0.2 0.4 1.1 0.2 ms 2.9 1.3 0.2 0.2 6.2
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x8_full.kicad_pcb
Folder PCIexpress_x8_full
Complexity 221 / 1000 (size 166, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 33, 163, 54
Triangles, simulation 326,948 in 83 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 275 MB
STEP 52 MB 282 MB
STL 16 MB 278 MB
OBJ 34 MB 281 MB
Visual
GLB 8.0 MB 239 MB
OBJ 24 MB 245 MB

20.13 PCIexpress_x8_half

PCIexpress_x8_half: stages 4 and 6 take 45% to 81% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 4.8 s. Visual, GLB takes 5.5 s. Visual, OBJ takes 6.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.1 0.3 ms 1.2 64 ms 0.2 0.3 3.3
Simulation, STEP 0.1 0.4 1.1 0.2 ms 1.2 1.3 0.2 0.2 4.4
Simulation, STL 0.2 0.4 1.1 0.2 ms 1.3 86 ms 0.2 0.2 3.4
Simulation, OBJ 0.2 0.4 1.1 0.3 ms 1.1 1.6 0.2 0.3 4.8
Visual, GLB 0.1 0.3 1.0 0.4 ms 3.4 37 ms 0.3 0.3 5.5
Visual, OBJ 0.2 0.4 1.0 0.2 ms 3.2 1.1 0.2 0.2 6.4
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x8_half.kicad_pcb
Folder PCIexpress_x8_half
Complexity 221 / 1000 (size 166, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 33, 163, 54
Triangles, simulation 323,256 in 83 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 264 MB
STEP 52 MB 273 MB
STL 16 MB 279 MB
OBJ 33 MB 265 MB
Visual
GLB 8.1 MB 242 MB
OBJ 24 MB 242 MB

20.14 PCIexpress_x8_low

PCIexpress_x8_low: stages 4 and 6 take 46% to 77% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 4.3 s. Visual, OBJ takes 4.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.9 0.2 ms 0.9 45 ms 0.2 0.2 2.7
Simulation, STEP 0.1 0.3 0.8 0.3 ms 0.9 1.1 0.2 0.2 3.6
Simulation, STL 0.1 0.3 0.9 0.2 ms 0.9 75 ms 0.1 0.2 2.6
Simulation, OBJ 0.2 0.3 0.9 0.3 ms 0.9 1.3 0.1 0.2 3.9
Visual, GLB 0.1 0.3 0.8 0.3 ms 2.5 42 ms 0.3 0.2 4.3
Visual, OBJ 0.1 0.3 0.8 0.3 ms 2.4 0.9 0.2 0.2 4.8
Board Repo: open-ephys/PCIexpress-KiCad
Board: PCIexpress_x8_low.kicad_pcb
Folder PCIexpress_x8_low
Complexity 221 / 1000 (size 166, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 33, 163, 54
Triangles, simulation 321,284 in 83 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 262 MB
STEP 51 MB 275 MB
STL 16 MB 273 MB
OBJ 33 MB 275 MB
Visual
GLB 7.9 MB 236 MB
OBJ 23 MB 239 MB

20.15 panel-back

panel-back: stages 4 and 6 take 42% to 71% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 97 ms 0.3 0.1 ms 0.6 15 ms 42 ms 0.2 1.3
Simulation, STEP 98 ms 89 ms 0.3 0.1 ms 0.6 0.8 41 ms 0.2 2.2
Simulation, STL 0.1 88 ms 0.3 0.1 ms 0.6 29 ms 46 ms 0.2 1.4
Simulation, OBJ 0.1 0.1 0.3 0.1 ms 0.7 0.5 46 ms 0.2 2.0
Visual, GLB 0.1 97 ms 0.3 0.1 ms 1.1 14 ms 0.1 0.3 2.0
Visual, OBJ 0.1 0.1 0.3 0.1 ms 1.1 0.3 89 ms 0.2 2.3
Board Repo: open-ephys/stimjim
Board: panel-back.kicad_pcb
Folder PCB / panels
Complexity 101 / 1000 (size 36, features 65)
KESE features filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 5, 0, 0
Triangles, simulation 118,094 in 12 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.2 MB 190 MB
STEP 23 MB 204 MB
STL 5.9 MB 190 MB
OBJ 12 MB 188 MB
Visual
GLB 2.7 MB 155 MB
OBJ 7.5 MB 156 MB

20.16 panel-front

panel-front: stages 4 and 6 take 39% to 73% of a run. Simulation, GLB takes 1.1 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.6 s. Visual, OBJ takes 1.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 86 ms 0.2 0.1 ms 0.5 14 ms 29 ms 0.2 1.1
Simulation, STEP 96 ms 87 ms 0.2 0.1 ms 0.5 0.7 29 ms 0.2 1.8
Simulation, STL 95 ms 83 ms 0.2 0.1 ms 0.5 22 ms 30 ms 0.2 1.2
Simulation, OBJ 0.1 86 ms 0.2 0.1 ms 0.5 0.4 30 ms 0.2 1.5
Visual, GLB 93 ms 84 ms 0.2 0.1 ms 1.0 11 ms 81 ms 0.2 1.6
Visual, OBJ 94 ms 84 ms 0.2 0.1 ms 1.0 0.3 77 ms 0.2 1.9
Board Repo: open-ephys/stimjim
Board: panel-front.kicad_pcb
Folder PCB / panels
Complexity 129 / 1000 (size 34, features 95)
KESE features arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 4, 0, 0
Triangles, simulation 98,478 in 12 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.4 MB 185 MB
STEP 18 MB 194 MB
STL 4.9 MB 181 MB
OBJ 9.6 MB 185 MB
Visual
GLB 2.7 MB 153 MB
OBJ 7.4 MB 151 MB

20.17 stimjim

stimjim: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 34 s. Simulation, STEP takes 42 s. Simulation, STL takes 33 s. Simulation, OBJ takes 51 s. Visual, GLB takes 48 s. Visual, OBJ takes 60 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 2.9 12.8 0.6 ms 15.0 0.5 1.6 0.3 34.2
Simulation, STEP 1.1 2.9 11.9 0.5 ms 14.6 9.3 1.6 0.3 41.7
Simulation, STL 1.0 2.9 12.2 0.6 ms 14.2 1.1 1.5 0.3 33.3
Simulation, OBJ 1.1 3.2 12.7 0.5 ms 14.7 17.6 1.7 0.3 51.3
Visual, GLB 1.1 3.0 12.7 0.5 ms 27.6 0.4 3.2 0.3 48.3
Visual, OBJ 1.0 3.1 12.5 0.5 ms 28.0 11.9 3.7 0.2 60.4
Board Repo: open-ephys/stimjim
Board: stimjim.kicad_pcb
Folder PCB
Complexity 359 / 1000 (size 259, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 193, 1,526, 371
Triangles, simulation 3,557,586 in 188 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 121 MB 1.1 GB
STEP 564 MB 1.5 GB
STL 178 MB 1.2 GB
OBJ 381 MB 2.4 GB
Visual
GLB 83 MB 1.7 GB
OBJ 265 MB 1.7 GB

20.18 osw

osw: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 19 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.3 5.9 0.5 ms 5.1 0.2 0.6 0.2 13.6
Simulation, STEP 0.4 1.2 5.5 0.5 ms 4.4 3.7 0.5 0.2 16.1
Simulation, STL 0.4 1.3 5.7 0.5 ms 4.8 0.3 0.5 0.3 13.4
Simulation, OBJ 0.3 1.3 5.7 0.6 ms 4.5 7.4 0.6 0.3 20.1
Visual, GLB 0.4 1.2 5.7 0.4 ms 10.5 0.1 1.2 0.2 19.4
Visual, OBJ 0.4 1.1 5.8 0.5 ms 10.6 5.6 1.4 0.2 25.2
Board Repo: Open-Smartwatch/kicad-project
Board: osw.kicad_pcb
Complexity 261 / 1000 (size 196, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 67, 707, 193
Triangles, simulation 1,331,232 in 92 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 525 MB
STEP 193 MB 670 MB
STL 67 MB 528 MB
OBJ 138 MB 910 MB
Visual
GLB 32 MB 668 MB
OBJ 96 MB 764 MB

20.19 osw-light

osw-light: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 4.7 0.5 ms 3.8 0.2 0.5 0.3 10.8
Simulation, STEP 0.3 1.0 4.5 0.4 ms 3.9 3.1 0.5 0.2 13.6
Simulation, STL 0.5 0.9 4.5 0.3 ms 3.7 0.3 0.5 0.3 10.6
Simulation, OBJ 0.3 0.9 4.5 0.4 ms 4.1 5.8 0.6 0.3 16.5
Visual, GLB 0.3 0.9 4.3 0.4 ms 9.0 0.1 1.3 0.2 16.3
Visual, OBJ 0.3 0.9 4.3 0.4 ms 9.1 3.8 1.2 0.2 19.9
Board Repo: Open-Smartwatch/open-smartwatch-light
Board: osw-light.kicad_pcb
Complexity 253 / 1000 (size 188, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 51, 524, 126
Triangles, simulation 972,290 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 436 MB
STEP 149 MB 516 MB
STL 49 MB 458 MB
OBJ 99 MB 684 MB
Visual
GLB 24 MB 517 MB
OBJ 71 MB 572 MB

20.20 6ct-expander

6ct-expander: stages 4 and 6 take 56% to 80% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.3 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 5.7 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.4 0.2 ms 1.7 53 ms 0.2 0.2 4.1
Simulation, STEP 0.2 0.3 1.3 0.2 ms 1.7 1.5 0.2 0.2 5.3
Simulation, STL 0.2 0.3 1.3 0.2 ms 1.6 89 ms 0.2 0.2 4.0
Simulation, OBJ 0.2 0.3 1.4 0.2 ms 1.8 1.7 0.2 0.2 5.7
Visual, GLB 0.2 0.3 1.5 0.2 ms 2.8 42 ms 0.3 0.2 5.3
Visual, OBJ 0.2 0.3 1.4 0.2 ms 2.7 1.4 0.2 0.2 6.3
Board Repo: openenergymonitor/emon32
Board: 6ct-expander.kicad_pcb
Folder pcb / 6ct-expander
Complexity 223 / 1000 (size 153, features 70)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 56, 141, 45
Triangles, simulation 358,758 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 280 MB
STEP 59 MB 321 MB
STL 18 MB 277 MB
OBJ 36 MB 308 MB
Visual
GLB 10 MB 313 MB
OBJ 29 MB 317 MB

20.21 emonPi3

emonPi3: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 33 s. Simulation, STL takes 28 s. Simulation, OBJ takes 38 s. Visual, GLB takes 39 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.2 10.4 0.7 ms 10.3 0.3 1.1 0.3 25.5
Simulation, STEP 0.9 2.1 10.6 0.7 ms 10.3 7.7 1.2 0.3 33.1
Simulation, STL 1.2 2.1 10.6 1.0 ms 11.3 0.8 1.2 0.3 27.6
Simulation, OBJ 0.9 2.4 10.5 0.8 ms 10.6 12.0 1.0 0.4 37.7
Visual, GLB 1.0 2.1 9.6 0.8 ms 22.1 0.3 3.2 0.3 38.6
Visual, OBJ 0.9 2.0 9.8 0.7 ms 19.8 9.2 2.6 0.3 44.6
Board Repo: openenergymonitor/emon32
Board: emonPi3.kicad_pcb
Folder pcb / emonpi3
Complexity 405 / 1000 (size 250, features 155)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
knockout text, TrueType text,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 151, 933, 260
Triangles, simulation 2,361,186 in 148 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 897 MB
STEP 407 MB 1.2 GB
STL 118 MB 934 MB
OBJ 246 MB 1.6 GB
Visual
GLB 59 MB 1.2 GB
OBJ 181 MB 1.3 GB

20.22 OpenHW DevKit

OpenHW DevKit: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 48 s. Simulation, STL takes 39 s. Simulation, OBJ takes 55 s. Visual, GLB takes 59 s. Visual, OBJ takes 70 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 3.5 15.8 0.7 ms 16.1 0.6 1.9 0.3 39.4
Simulation, STEP 1.2 3.4 15.1 0.7 ms 15.1 10.5 1.8 0.3 47.5
Simulation, STL 1.2 3.5 15.2 0.7 ms 16.0 1.1 2.1 0.3 39.4
Simulation, OBJ 1.3 3.5 15.6 0.9 ms 15.1 17.5 1.9 0.3 55.2
Visual, GLB 1.1 3.5 15.8 0.6 ms 33.0 0.4 5.0 0.3 59.0
Visual, OBJ 1.1 3.5 15.3 0.5 ms 32.6 12.3 4.9 0.2 69.9
Board Repo: openhwgroup/core-v-mcu-devkit
Board: OpenHW DevKit.kicad_pcb
Folder kicad
Complexity 411 / 1000 (size 271, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 158, 1,714, 286
Triangles, simulation 3,646,834 in 231 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 126 MB 1.2 GB
STEP 648 MB 1.5 GB
STL 182 MB 1.2 GB
OBJ 392 MB 2.4 GB
Visual
GLB 88 MB 1.5 GB
OBJ 278 MB 1.9 GB

20.23 MacArthur-HAT

MacArthur-HAT: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 23 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 1.9 5.2 0.6 ms 6.0 0.2 0.6 0.2 15.2
Simulation, STEP 1.0 2.1 5.6 0.6 ms 5.8 4.2 0.7 0.2 19.7
Simulation, STL 1.0 1.9 5.4 0.6 ms 5.9 0.5 0.6 0.2 15.5
Simulation, OBJ 1.1 1.9 5.5 0.7 ms 5.9 8.3 0.7 0.2 23.6
Visual, GLB 1.0 2.1 5.6 0.5 ms 12.3 0.2 1.2 0.3 22.7
Visual, OBJ 1.0 2.0 5.7 0.8 ms 12.9 6.4 1.5 0.3 29.6
Board Repo: OpenMarine/MacArthur-HAT
Board: MacArthur-HAT.kicad_pcb
Folder KiCad
Complexity 312 / 1000 (size 207, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 102, 1,085, 240
Triangles, simulation 1,613,902 in 109 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 54 MB 598 MB
STEP 226 MB 782 MB
STL 81 MB 629 MB
OBJ 167 MB 1.1 GB
Visual
GLB 40 MB 803 MB
OBJ 120 MB 881 MB

20.24 blade12

blade12: stages 4 and 6 take 46% to 77% of a run. Simulation, GLB takes 8.3 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 3.1 0.2 ms 3.0 0.1 0.5 0.2 8.3
Simulation, STEP 0.4 1.1 3.1 0.2 ms 3.0 2.8 0.5 0.2 11.1
Simulation, STL 0.3 1.1 3.1 0.2 ms 2.7 0.3 0.5 0.3 8.2
Simulation, OBJ 0.4 1.0 3.0 0.3 ms 2.8 4.7 0.5 0.3 12.6
Visual, GLB 0.4 1.1 3.2 0.3 ms 6.5 99 ms 1.0 0.2 12.6
Visual, OBJ 0.4 1.1 3.1 0.3 ms 6.9 3.6 1.1 0.3 16.4
Board Repo: opulo-inc/lumenpnp
Board: blade12.kicad_pcb
Folder src / PCB / blade12
Complexity 285 / 1000 (size 170, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 38, 391, 206
Triangles, simulation 724,098 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 421 MB
STEP 129 MB 473 MB
STL 36 MB 403 MB
OBJ 74 MB 562 MB
Visual
GLB 20 MB 503 MB
OBJ 61 MB 503 MB

20.25 blade13

blade13: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 8.8 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.6 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.1 3.5 0.3 ms 2.9 0.1 0.5 0.3 8.8
Simulation, STEP 0.4 1.2 3.6 0.2 ms 2.9 2.7 0.7 0.2 11.7
Simulation, STL 0.4 1.2 3.7 0.2 ms 3.1 0.3 0.5 0.3 9.6
Simulation, OBJ 0.4 1.3 3.6 0.2 ms 3.1 4.9 0.5 0.3 13.9
Visual, GLB 0.4 1.2 3.7 0.2 ms 7.1 0.1 1.0 0.3 13.8
Visual, OBJ 0.4 1.2 3.8 0.3 ms 7.1 3.7 1.2 0.3 17.6
Board Repo: opulo-inc/lumenpnp
Board: blade13.kicad_pcb
Folder src / PCB / blade13
Complexity 287 / 1000 (size 172, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 42, 373, 237
Triangles, simulation 789,616 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 431 MB
STEP 140 MB 503 MB
STL 39 MB 408 MB
OBJ 81 MB 571 MB
Visual
GLB 22 MB 495 MB
OBJ 66 MB 549 MB

20.26 cal-fid

cal-fid: reading, start-up and exit take 46% to 66% of a run. Simulation, GLB takes 0.4 s. Simulation, STEP takes 0.5 s. Simulation, STL takes 0.3 s. Simulation, OBJ takes 0.4 s. Visual, GLB takes 0.4 s. Visual, OBJ takes 0.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 5 ms 19 ms 25 ms 0.1 ms 71 ms 2 ms 10 ms 0.2 0.4
Simulation, STEP 6 ms 22 ms 21 ms 0.1 ms 84 ms 0.1 10 ms 0.2 0.5
Simulation, STL 5 ms 15 ms 24 ms 0.1 ms 68 ms 3 ms 10 ms 0.2 0.3
Simulation, OBJ 7 ms 15 ms 27 ms 0.1 ms 77 ms 42 ms 11 ms 0.2 0.4
Visual, GLB 5 ms 16 ms 26 ms 0.1 ms 0.1 3 ms 43 ms 0.2 0.4
Visual, OBJ 6 ms 16 ms 22 ms 0.1 ms 0.1 22 ms 36 ms 0.2 0.5
Board Repo: opulo-inc/lumenpnp
Board: cal-fid.kicad_pcb
Folder src / PCB / cal-fid
Complexity 52 / 1000 (size 17, features 35)
KESE features filled zones, TrueType text
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 5,528 in 8 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 199 kB 39 MB
STEP 1.1 MB 40 MB
STL 277 kB 39 MB
OBJ 517 kB 41 MB
Visual
GLB 103 kB 54 MB
OBJ 247 kB 54 MB

20.27 datum

datum: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 4.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 0.9 0.1 ms 0.8 31 ms 0.1 0.2 2.5
Simulation, STEP 0.2 0.2 0.9 0.2 ms 0.9 1.0 0.1 0.2 3.5
Simulation, STL 0.2 0.2 1.1 0.1 ms 0.9 46 ms 0.1 0.2 2.7
Simulation, OBJ 0.2 0.2 0.9 0.2 ms 0.9 1.2 0.1 0.2 3.7
Visual, GLB 0.2 0.2 0.9 0.1 ms 1.9 26 ms 0.1 0.2 3.6
Visual, OBJ 0.2 0.2 0.9 0.1 ms 1.9 0.6 0.1 0.2 4.1
Board Repo: opulo-inc/lumenpnp
Board: datum.kicad_pcb
Folder src / PCB / datum
Complexity 83 / 1000 (size 63, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 4, 5, 0
Triangles, simulation 196,880 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.9 MB 212 MB
STEP 32 MB 229 MB
STL 9.8 MB 210 MB
OBJ 20 MB 215 MB
Visual
GLB 4.1 MB 188 MB
OBJ 12 MB 184 MB

20.28 ftp

ftp: stages 4 and 6 take 60% to 80% of a run. Simulation, GLB takes 7.3 s. Simulation, STEP takes 10 s. Simulation, STL takes 7.9 s. Simulation, OBJ takes 9.9 s. Visual, GLB takes 9.3 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.5 2.3 0.2 ms 3.5 81 ms 0.3 0.3 7.3
Simulation, STEP 0.3 0.4 2.4 0.2 ms 3.7 2.8 0.3 0.2 10.1
Simulation, STL 0.3 0.5 2.3 0.3 ms 4.0 0.2 0.3 0.3 7.9
Simulation, OBJ 0.3 0.4 2.4 0.2 ms 3.7 2.6 0.3 0.2 9.9
Visual, GLB 0.3 0.4 2.3 0.2 ms 5.2 78 ms 0.8 0.3 9.3
Visual, OBJ 0.3 0.4 2.5 0.2 ms 4.7 2.3 0.6 0.2 11.1
Board Repo: opulo-inc/lumenpnp
Board: ftp.kicad_pcb
Folder src / PCB / ftp
Complexity 202 / 1000 (size 142, features 60)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 81, 115, 0
Triangles, simulation 499,656 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 378 MB
STEP 109 MB 409 MB
STL 25 MB 384 MB
OBJ 51 MB 400 MB
Visual
GLB 15 MB 461 MB
OBJ 44 MB 459 MB

20.29 ftp0402

ftp0402: stages 4 and 6 take 59% to 82% of a run. Simulation, GLB takes 6.5 s. Simulation, STEP takes 8.7 s. Simulation, STL takes 6.7 s. Simulation, OBJ takes 9.2 s. Visual, GLB takes 7.4 s. Visual, OBJ takes 9.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 2.1 0.2 ms 3.2 69 ms 0.3 0.2 6.5
Simulation, STEP 0.3 0.4 2.1 0.2 ms 3.2 2.2 0.2 0.2 8.7
Simulation, STL 0.3 0.4 2.1 0.2 ms 3.2 0.1 0.3 0.2 6.7
Simulation, OBJ 0.3 0.4 2.3 0.3 ms 3.2 2.6 0.3 0.2 9.2
Visual, GLB 0.3 0.4 2.0 0.2 ms 4.0 64 ms 0.4 0.2 7.4
Visual, OBJ 0.3 0.4 2.1 0.3 ms 3.9 1.8 0.5 0.2 9.3
Board Repo: opulo-inc/lumenpnp
Board: ftp0402.kicad_pcb
Folder src / PCB / ftp / ftp0402
Complexity 199 / 1000 (size 139, features 60)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 81, 91, 0
Triangles, simulation 441,218 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 339 MB
STEP 89 MB 387 MB
STL 22 MB 335 MB
OBJ 45 MB 362 MB
Visual
GLB 13 MB 417 MB
OBJ 37 MB 335 MB

20.30 mobo

mobo: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 61 s. Simulation, STEP takes 74 s. Simulation, STL takes 62 s. Simulation, OBJ takes 93 s. Visual, GLB takes 93 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.9 7.5 27.5 2 ms 20.4 1.0 2.9 0.4 61.4
Simulation, STEP 1.9 7.5 27.2 1 ms 19.8 14.6 2.9 0.3 74.1
Simulation, STL 1.8 7.6 27.5 1 ms 19.8 1.8 3.0 0.4 62.0
Simulation, OBJ 1.8 7.5 27.9 2 ms 20.2 32.6 2.8 0.3 93.1
Visual, GLB 1.9 7.7 27.8 2 ms 48.6 0.5 5.9 0.3 92.7
Visual, OBJ 1.8 7.8 28.7 2 ms 48.5 20.6 6.3 0.3 114.1
Board Repo: opulo-inc/lumenpnp
Board: mobo.kicad_pcb
Folder src / PCB / mobo
Complexity 454 / 1000 (size 294, features 160)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 296, 2,176, 1,010
Triangles, simulation 5,290,772 in 276 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 177 MB 1.8 GB
STEP 676 MB 2.2 GB
STL 265 MB 1.7 GB
OBJ 563 MB 3.4 GB
Visual
GLB 114 MB 1.8 GB
OBJ 363 MB 2.4 GB

20.31 pi-interface

pi-interface: stages 4 and 6 take 44% to 76% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 2.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 34 ms 0.1 0.3 0.1 ms 0.5 16 ms 68 ms 0.2 1.3
Simulation, STEP 37 ms 83 ms 0.3 0.2 ms 0.5 0.7 52 ms 0.2 2.0
Simulation, STL 33 ms 81 ms 0.3 0.1 ms 0.6 25 ms 53 ms 0.2 1.2
Simulation, OBJ 37 ms 90 ms 0.3 0.2 ms 0.5 0.5 57 ms 0.2 1.7
Visual, GLB 35 ms 78 ms 0.3 0.1 ms 1.0 17 ms 66 ms 0.2 1.7
Visual, OBJ 34 ms 85 ms 0.3 0.2 ms 1.0 0.3 71 ms 0.2 2.0
Board Repo: opulo-inc/lumenpnp
Board: pi-interface.kicad_pcb
Folder src / PCB / pi-interface
Complexity 157 / 1000 (size 102, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 3, 49, 7
Triangles, simulation 85,092 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.9 MB 156 MB
STEP 12 MB 157 MB
STL 4.3 MB 158 MB
OBJ 8.0 MB 159 MB
Visual
GLB 2.0 MB 130 MB
OBJ 5.6 MB 128 MB

20.32 ringLight

ringLight: stages 4 and 6 take 52% to 78% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 0.7 0.2 ms 0.9 26 ms 88 ms 0.2 2.3
Simulation, STEP 0.1 0.2 0.7 0.2 ms 1.0 0.9 88 ms 0.2 3.2
Simulation, STL 0.1 0.2 0.6 0.1 ms 1.0 36 ms 91 ms 0.2 2.3
Simulation, OBJ 0.1 0.2 0.6 0.1 ms 1.0 0.7 90 ms 0.2 2.9
Visual, GLB 0.2 0.2 0.6 0.1 ms 1.6 20 ms 0.1 0.2 2.8
Visual, OBJ 0.1 0.2 0.6 0.1 ms 1.6 0.6 0.1 0.2 3.4
Board Repo: opulo-inc/lumenpnp
Board: ringLight.kicad_pcb
Folder src / PCB / ringLight
Complexity 222 / 1000 (size 137, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 21, 142, 17
Triangles, simulation 179,692 in 25 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.4 MB 219 MB
STEP 36 MB 237 MB
STL 9.0 MB 219 MB
OBJ 18 MB 219 MB
Visual
GLB 5.4 MB 218 MB
OBJ 15 MB 215 MB

20.33 x-cable-chain-support

x-cable-chain-support: stages 4 and 6 take 41% to 67% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 1.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 0.1 0.3 0.1 ms 0.6 25 ms 40 ms 0.3 1.4
Simulation, STEP 89 ms 0.1 0.2 0.1 ms 0.6 0.8 39 ms 0.2 2.1
Simulation, STL 86 ms 0.1 0.2 0.1 ms 0.6 29 ms 41 ms 0.2 1.3
Simulation, OBJ 95 ms 91 ms 0.3 0.1 ms 0.6 0.7 40 ms 0.2 1.9
Visual, GLB 88 ms 98 ms 0.2 0.1 ms 0.9 16 ms 0.1 0.2 1.7
Visual, OBJ 88 ms 93 ms 0.2 0.1 ms 0.9 0.3 96 ms 0.2 1.9
Board Repo: opulo-inc/lumenpnp
Board: x-cable-chain-support.kicad_pcb
Folder src / PCB / x-cable-chain-support
Complexity 92 / 1000 (size 17, features 75)
KESE features filled zones, curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 110,860 in 9 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.3 MB 179 MB
STEP 25 MB 195 MB
STL 5.5 MB 179 MB
OBJ 12 MB 169 MB
Visual
GLB 2.3 MB 134 MB
OBJ 6.2 MB 135 MB

20.34 xy-limit

xy-limit: stages 4 and 6 take 43% to 71% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 2.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 78 ms 0.3 0.1 ms 0.6 28 ms 60 ms 0.2 1.3
Simulation, STEP 0.1 92 ms 0.3 0.1 ms 0.7 0.9 49 ms 0.2 2.3
Simulation, STL 0.1 83 ms 0.3 0.1 ms 0.7 35 ms 61 ms 0.2 1.5
Simulation, OBJ 0.1 0.1 0.3 0.1 ms 0.7 0.6 61 ms 0.2 2.1
Visual, GLB 0.1 0.1 0.3 0.1 ms 1.0 15 ms 90 ms 0.2 1.8
Visual, OBJ 0.1 0.1 0.3 0.2 ms 1.0 0.3 0.1 0.2 2.2
Board Repo: opulo-inc/lumenpnp
Board: xy-limit.kicad_pcb
Folder src / PCB / xy-limit
Complexity 173 / 1000 (size 103, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
TrueType text
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 3, 42, 11
Triangles, simulation 129,766 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.8 MB 194 MB
STEP 25 MB 212 MB
STL 6.5 MB 192 MB
OBJ 14 MB 192 MB
Visual
GLB 2.5 MB 154 MB
OBJ 6.8 MB 155 MB

20.35 z-limit

z-limit: stages 4 and 6 take 39% to 75% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 84 ms 0.3 0.1 ms 0.6 26 ms 60 ms 0.2 1.4
Simulation, STEP 0.2 0.1 0.4 0.1 ms 0.6 0.9 56 ms 0.2 2.4
Simulation, STL 0.1 0.1 0.4 0.1 ms 0.6 37 ms 81 ms 0.2 1.5
Simulation, OBJ 0.2 0.1 0.4 0.3 ms 0.6 0.6 54 ms 0.2 2.1
Visual, GLB 0.1 0.1 0.4 0.1 ms 1.3 15 ms 0.1 0.2 2.3
Visual, OBJ 0.2 0.1 0.4 0.1 ms 1.3 0.4 97 ms 0.2 2.7
Board Repo: opulo-inc/lumenpnp
Board: z-limit.kicad_pcb
Folder src / PCB / z-limit
Complexity 171 / 1000 (size 101, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
TrueType text
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 3, 30, 13
Triangles, simulation 107,692 in 17 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.8 MB 190 MB
STEP 18 MB 196 MB
STL 5.4 MB 185 MB
OBJ 11 MB 189 MB
Visual
GLB 3.0 MB 156 MB
OBJ 8.3 MB 158 MB

20.36 OrangeCrab

OrangeCrab: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 44 s. Simulation, STL takes 37 s. Simulation, OBJ takes 56 s. Visual, GLB takes 50 s. Visual, OBJ takes 59 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.7 13.9 0.5 ms 14.8 0.6 1.7 0.3 35.7
Simulation, STEP 0.8 3.9 14.3 0.6 ms 14.6 8.9 1.6 0.3 44.3
Simulation, STL 0.8 3.5 14.5 1 ms 14.7 1.5 1.7 0.3 37.0
Simulation, OBJ 0.8 3.8 14.4 1 ms 14.6 20.4 1.7 0.3 55.9
Visual, GLB 0.8 4.0 13.9 2 ms 26.9 0.4 3.6 0.2 49.8
Visual, OBJ 0.9 3.8 13.5 1 ms 26.3 10.4 3.6 0.3 58.7
Board Repo: orangecrab-fpga/orangecrab-hardware
Board: OrangeCrab.kicad_pcb
Folder hardware / orangecrab_r0.1
Complexity 403 / 1000 (size 303, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 141, 6,919, 449
Triangles, simulation 4,238,478 in 192 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 146 MB 1.2 GB
STEP 609 MB 1.5 GB
STL 212 MB 1.3 GB
OBJ 453 MB 2.7 GB
Visual
GLB 73 MB 1.3 GB
OBJ 233 MB 1.6 GB

20.37 OrangeCrab

OrangeCrab: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 40 s. Simulation, STEP takes 51 s. Simulation, STL takes 43 s. Simulation, OBJ takes 67 s. Visual, GLB takes 55 s. Visual, OBJ takes 68 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.8 15.4 0.6 ms 17.5 0.7 1.8 0.3 40.3
Simulation, STEP 0.9 3.7 15.5 0.9 ms 18.4 9.9 2.0 0.3 50.8
Simulation, STL 1.0 3.7 15.8 0.9 ms 18.3 1.7 2.0 0.3 42.9
Simulation, OBJ 0.9 3.8 15.9 0.6 ms 18.5 25.5 2.2 0.3 67.1
Visual, GLB 1.0 4.0 14.9 0.6 ms 30.6 0.4 3.8 0.3 55.0
Visual, OBJ 1.0 3.8 15.3 0.7 ms 30.6 12.8 3.9 0.2 67.7
Board Repo: orangecrab-fpga/orangecrab-hardware
Board: OrangeCrab.kicad_pcb
Folder hardware / orangecrab_r0.2.1
Complexity 404 / 1000 (size 304, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 142, 7,280, 441
Triangles, simulation 4,397,740 in 188 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 151 MB 1.1 GB
STEP 636 MB 1.5 GB
STL 220 MB 1.2 GB
OBJ 470 MB 2.8 GB
Visual
GLB 77 MB 1.5 GB
OBJ 245 MB 1.7 GB

20.38 OrangeCrab

OrangeCrab: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 41 s. Simulation, STEP takes 51 s. Simulation, STL takes 42 s. Simulation, OBJ takes 69 s. Visual, GLB takes 60 s. Visual, OBJ takes 74 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.1 15.5 1.0 ms 16.7 0.9 1.9 0.3 40.5
Simulation, STEP 1.1 4.2 16.0 1 ms 17.0 10.4 2.0 0.3 51.1
Simulation, STL 1.1 4.3 16.0 0.7 ms 16.7 1.8 2.0 0.3 42.4
Simulation, OBJ 1.1 4.4 16.0 0.6 ms 17.1 28.1 2.2 0.3 69.1
Visual, GLB 1.1 4.4 16.4 1 ms 32.9 0.4 4.4 0.3 59.9
Visual, OBJ 1.1 4.4 16.3 0.6 ms 33.4 14.1 4.5 0.3 74.1
Board Repo: orangecrab-fpga/orangecrab-hardware
Board: OrangeCrab.kicad_pcb
Folder hardware / orangecrab_r0.2
Complexity 405 / 1000 (size 305, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 144, 7,537, 459
Triangles, simulation 4,445,274 in 185 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 153 MB 1.3 GB
STEP 651 MB 1.6 GB
STL 222 MB 1.4 GB
OBJ 475 MB 2.9 GB
Visual
GLB 79 MB 1.5 GB
OBJ 252 MB 1.6 GB

20.39 mezzanine-breakout-board

mezzanine-breakout-board: stages 4 and 6 take 44% to 75% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 2.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 0.1 0.3 0.2 ms 0.5 14 ms 44 ms 0.2 1.3
Simulation, STEP 77 ms 0.1 0.3 0.1 ms 0.5 0.7 46 ms 0.2 2.0
Simulation, STL 77 ms 0.1 0.3 0.1 ms 0.5 21 ms 47 ms 0.2 1.3
Simulation, OBJ 85 ms 0.1 0.3 0.1 ms 0.5 0.4 51 ms 0.2 1.7
Visual, GLB 76 ms 99 ms 0.3 0.1 ms 1.0 11 ms 70 ms 0.2 1.7
Visual, OBJ 79 ms 0.1 0.3 0.1 ms 0.9 0.4 58 ms 0.2 2.0
Board Repo: oresat/oresat-adcs-hardware
Board: mezzanine-breakout-board.kicad_pcb
Folder mezzanine-breakout-board
Complexity 197 / 1000 (size 92, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 2, 31, 5
Triangles, simulation 88,076 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.0 MB 178 MB
STEP 12 MB 186 MB
STL 4.4 MB 176 MB
OBJ 8.5 MB 178 MB
Visual
GLB 2.1 MB 152 MB
OBJ 5.8 MB 152 MB

20.40 mezzanine-flex-board

mezzanine-flex-board: stages 4 and 6 take 38% to 69% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 79 ms 0.2 0.3 0.1 ms 0.5 21 ms 42 ms 0.2 1.3
Simulation, STEP 78 ms 0.2 0.3 0.1 ms 0.4 0.7 47 ms 0.2 2.0
Simulation, STL 80 ms 0.2 0.3 0.1 ms 0.5 45 ms 48 ms 0.2 1.3
Simulation, OBJ 74 ms 0.2 0.3 0.1 ms 0.4 0.5 52 ms 0.2 1.7
Visual, GLB 78 ms 0.2 0.3 0.2 ms 0.9 12 ms 86 ms 0.2 1.8
Visual, OBJ 79 ms 0.2 0.4 0.2 ms 0.9 0.3 89 ms 0.2 2.1
Board Repo: oresat/oresat-adcs-hardware
Board: mezzanine-flex-board.kicad_pcb
Folder mezzanine-flex-board
Complexity 204 / 1000 (size 109, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 2, 16, 40
Triangles, simulation 118,972 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.2 MB 199 MB
STEP 22 MB 208 MB
STL 6.0 MB 195 MB
OBJ 12 MB 199 MB
Visual
GLB 2.6 MB 162 MB
OBJ 7.4 MB 164 MB

20.41 oresat-adcs-card

oresat-adcs-card: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.5 9.8 49.2 2 ms 37.1 1.8 4.9 0.4 105.8
Simulation, STEP 2.8 10.7 49.9 1 ms 34.3 20.7 4.5 0.4 123.3
Simulation, STL 2.4 9.6 51.3 1 ms 34.8 3.8 5.3 0.4 107.6
Simulation, OBJ 2.5 10.2 49.3 2 ms 35.2 52.7 5.2 0.5 155.7
Visual, GLB 2.6 10.2 52.0 2 ms 87.3 0.8 8.6 0.4 162.0
Visual, OBJ 2.6 10.1 50.0 1 ms 85.7 30.5 8.5 0.4 187.9
Board Repo: oresat/oresat-adcs-hardware
Board: oresat-adcs-card.kicad_pcb
Folder oresat-adcs-card
Complexity 334 / 1000 (size 244, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 456, 3,064, 1,130
Triangles, simulation 7,666,848 in 369 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 261 MB 2.0 GB
STEP 1.2 GB 2.8 GB
STL 383 MB 2.1 GB
OBJ 829 MB 5.0 GB
Visual
GLB 166 MB 2.7 GB
OBJ 532 MB 3.4 GB

20.42 oresat-mag-card

oresat-mag-card: stages 4 and 6 take 53% to 81% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 38 s. Simulation, STL takes 31 s. Simulation, OBJ takes 44 s. Visual, GLB takes 44 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.3 11.6 0.6 ms 13.8 0.6 1.4 0.3 32.0
Simulation, STEP 0.9 3.2 11.6 0.6 ms 12.7 7.7 1.5 0.3 37.7
Simulation, STL 1.0 3.2 11.3 0.6 ms 12.5 1.3 1.2 0.3 30.7
Simulation, OBJ 0.9 3.2 11.5 0.6 ms 11.9 15.2 1.3 0.2 44.3
Visual, GLB 0.9 3.1 11.8 0.5 ms 23.4 0.3 3.8 0.3 43.6
Visual, OBJ 1.0 3.6 11.9 0.5 ms 24.5 9.1 3.5 0.3 53.9
Board Repo: oresat/oresat-adcs-hardware
Board: oresat-mag-card.kicad_pcb
Folder oresat-mag-card
Complexity 376 / 1000 (size 261, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 175, 1,177, 651
Triangles, simulation 3,666,392 in 197 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 122 MB 1.1 GB
STEP 484 MB 1.5 GB
STL 183 MB 1.1 GB
OBJ 384 MB 2.4 GB
Visual
GLB 74 MB 1.3 GB
OBJ 233 MB 1.6 GB

20.43 control-stage

control-stage: stages 4 and 6 take 44% to 78% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 25 s. Visual, GLB takes 20 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.3 4.6 0.9 ms 6.3 0.3 0.9 0.2 15.0
Simulation, STEP 0.5 2.6 5.0 0.9 ms 6.3 3.6 0.9 0.3 19.1
Simulation, STL 0.4 2.5 4.6 1 ms 6.3 0.7 1.0 0.2 15.7
Simulation, OBJ 0.5 2.6 4.9 0.7 ms 5.9 9.7 0.8 0.2 24.6
Visual, GLB 0.4 2.6 4.6 0.7 ms 10.9 0.2 1.0 0.2 19.9
Visual, OBJ 0.4 2.3 4.6 0.9 ms 11.0 4.9 1.5 0.2 25.0
Board Repo: oresat/oresat-adcs-hardware
Board: control-stage.kicad_pcb
Folder oresat-rw-board-rev1-MCXN / control-stage
Complexity 349 / 1000 (size 259, features 90)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 93, 830, 485
Triangles, simulation 2,345,640 in 131 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 829 MB
STEP 210 MB 948 MB
STL 117 MB 806 MB
OBJ 249 MB 1.5 GB
Visual
GLB 38 MB 789 MB
OBJ 122 MB 929 MB

20.44 power-stage-rev8

power-stage-rev8: stages 4 and 6 take 48% to 87% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 47 s. Simulation, STL takes 40 s. Simulation, OBJ takes 64 s. Visual, GLB takes 74 s. Visual, OBJ takes 85 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.2 14.3 1 ms 16.3 0.8 2.0 0.3 39.1
Simulation, STEP 1.2 4.3 14.3 0.8 ms 16.6 8.6 2.0 0.3 47.3
Simulation, STL 1.2 4.3 14.3 1 ms 16.5 1.6 2.1 0.3 40.3
Simulation, OBJ 1.2 4.3 14.1 1 ms 16.7 25.0 2.0 0.3 63.6
Visual, GLB 1.1 4.3 14.2 1 ms 50.1 0.3 3.1 0.3 73.6
Visual, OBJ 1.1 4.3 14.6 1 ms 49.9 11.4 3.2 0.3 84.9
Board Repo: oresat/oresat-adcs-hardware
Board: power-stage-rev8.kicad_pcb
Folder oresat-rw-board-rev2-MCXN / power-stage-rev8
Complexity 435 / 1000 (size 285, features 150)
KESE features through vias, padstacks, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 213, 1,035, 686
Triangles, simulation 4,212,664 in 271 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 140 MB 1.1 GB
STEP 463 MB 1.4 GB
STL 211 MB 1.1 GB
OBJ 442 MB 2.7 GB
Visual
GLB 66 MB 1.4 GB
OBJ 206 MB 1.6 GB

20.45 controller_rev5.0_flat

controller_rev5.0_flat: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 51 s. Simulation, STEP takes 61 s. Simulation, STL takes 53 s. Simulation, OBJ takes 78 s. Visual, GLB takes 69 s. Visual, OBJ takes 83 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 7.4 22.2 0.7 ms 16.9 0.8 2.1 0.3 50.7
Simulation, STEP 1.1 7.7 22.0 0.7 ms 17.6 9.6 2.3 0.3 60.5
Simulation, STL 1.1 7.5 22.3 0.7 ms 18.1 1.6 2.1 0.3 52.9
Simulation, OBJ 1.1 7.7 22.5 0.7 ms 18.1 26.4 2.2 0.3 78.3
Visual, GLB 1.1 7.6 21.9 0.7 ms 33.3 0.4 4.7 0.3 69.2
Visual, OBJ 1.2 7.4 21.5 0.7 ms 31.6 16.1 4.9 0.3 83.0
Board Repo: oresat/oresat-adcs-hardware
Board: controller_rev5.0_flat.kicad_pcb
Folder oresat-rw-board-rev5-flat
Complexity 362 / 1000 (size 272, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20211228)
Parts, tracks, vias 149, 2,162, 1,552
Triangles, simulation 4,833,650 in 201 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 157 MB 1.7 GB
STEP 482 MB 2.0 GB
STL 242 MB 1.8 GB
OBJ 507 MB 3.0 GB
Visual
GLB 99 MB 1.7 GB
OBJ 315 MB 2.1 GB

20.46 rev6.0_flat_controlstage

rev6.0_flat_controlstage: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 42 s. Simulation, STEP takes 49 s. Simulation, STL takes 45 s. Simulation, OBJ takes 67 s. Visual, GLB takes 61 s. Visual, OBJ takes 73 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 6.7 14.2 1 ms 17.9 0.7 1.6 0.3 42.1
Simulation, STEP 0.7 6.7 14.1 1 ms 18.2 6.9 1.6 0.3 48.5
Simulation, STL 0.7 6.8 15.0 1 ms 18.6 1.5 1.7 0.3 44.6
Simulation, OBJ 0.8 7.0 14.7 1 ms 18.3 23.9 1.6 0.3 66.7
Visual, GLB 0.8 7.4 15.8 1 ms 33.1 0.4 3.1 0.3 61.0
Visual, OBJ 0.7 7.0 15.2 1 ms 32.9 13.9 2.9 0.3 73.0
Board Repo: oresat/oresat-adcs-hardware
Board: rev6.0_flat_controlstage.kicad_pcb
Folder oresat-rw-board-rev6 / rev6.0_flat_controlstage
Complexity 342 / 1000 (size 267, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 104, 948, 1,776
Triangles, simulation 4,214,950 in 107 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 134 MB 1.4 GB
STEP 292 MB 1.9 GB
STL 211 MB 1.4 GB
OBJ 438 MB 2.7 GB
Visual
GLB 86 MB 1.5 GB
OBJ 274 MB 1.8 GB

20.47 rev6.0_flat_powerstage

rev6.0_flat_powerstage: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 98 s. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 18.4 39.6 3 ms 33.2 1.7 3.5 0.4 98.3
Simulation, STEP 1.5 18.6 38.4 3 ms 33.2 13.8 3.4 0.4 109.4
Simulation, STL 1.5 18.9 40.9 4 ms 34.2 4.5 3.5 0.4 103.8
Simulation, OBJ 1.4 18.7 39.4 1 ms 33.1 54.2 3.5 0.4 150.6
Visual, GLB 1.5 18.5 40.4 4 ms 83.0 1.1 10.6 0.4 155.4
Visual, OBJ 1.5 18.6 39.6 4 ms 81.3 30.7 10.8 0.4 182.9
Board Repo: oresat/oresat-adcs-hardware
Board: rev6.0_flat_powerstage.kicad_pcb
Folder oresat-rw-board-rev6 / rev6.0_flat_powerstage
Complexity 324 / 1000 (size 249, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 201, 931, 4,881
Triangles, simulation 9,968,238 in 126 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 314 MB 2.8 GB
STEP 588 MB 3.5 GB
STL 498 MB 2.8 GB
OBJ 1.0 GB 6.0 GB
Visual
GLB 202 MB 3.3 GB
OBJ 658 MB 4.2 GB

20.48 as5047p_breakout

as5047p_breakout: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 4.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 98 ms 0.2 0.9 0.2 ms 0.8 42 ms 0.2 0.2 2.5
Simulation, STEP 95 ms 0.2 0.9 0.2 ms 0.8 0.9 0.1 0.2 3.3
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.8 63 ms 0.1 0.2 2.5
Simulation, OBJ 0.1 0.2 0.9 0.3 ms 0.8 1.1 0.1 0.3 3.5
Visual, GLB 0.1 0.2 0.9 0.2 ms 2.0 32 ms 0.2 0.2 3.6
Visual, OBJ 0.1 0.2 0.9 0.2 ms 1.9 0.8 0.2 0.2 4.3
Board Repo: oresat/oresat-adcs-hardware
Board: as5047p_breakout.kicad_pcb
Folder oresat-rw-board-rev7 / as5047p_breakout
Complexity 172 / 1000 (size 127, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 6, 51, 60
Triangles, simulation 273,762 in 24 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.3 MB 232 MB
STEP 34 MB 238 MB
STL 14 MB 221 MB
OBJ 27 MB 234 MB
Visual
GLB 5.9 MB 219 MB
OBJ 17 MB 226 MB

20.49 as5047p_breakout_rev2

as5047p_breakout_rev2: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.8 0.3 ms 0.8 36 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.1 0.8 0.2 ms 0.8 1.0 0.1 0.2 3.2
Simulation, STL 0.1 0.1 0.8 0.3 ms 0.9 58 ms 0.1 0.2 2.3
Simulation, OBJ 0.1 0.1 0.8 0.2 ms 0.9 1.1 0.1 0.2 3.4
Visual, GLB 0.1 0.1 0.8 0.2 ms 2.1 19 ms 0.1 0.2 3.6
Visual, OBJ 96 ms 0.1 0.8 0.2 ms 2.0 0.6 0.1 0.2 3.9
Board Repo: oresat/oresat-adcs-hardware
Board: as5047p_breakout_rev2.kicad_pcb
Folder oresat-rw-board-rev7 / as5047p_breakout_rev2
Complexity 144 / 1000 (size 114, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 8, 88, 0
Triangles, simulation 224,936 in 32 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.6 MB 213 MB
STEP 33 MB 233 MB
STL 11 MB 205 MB
OBJ 22 MB 205 MB
Visual
GLB 4.2 MB 196 MB
OBJ 12 MB 198 MB

20.50 control-stage

control-stage: stages 4 and 6 take 43% to 78% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 21 s. Simulation, OBJ takes 35 s. Visual, GLB takes 33 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.9 6.7 0.3 ms 8.0 0.4 1.0 0.3 20.0
Simulation, STEP 0.8 2.8 6.8 0.3 ms 8.0 4.3 1.0 0.3 24.0
Simulation, STL 0.8 2.8 6.7 0.3 ms 8.0 0.9 1.1 0.3 20.6
Simulation, OBJ 0.8 3.0 6.7 0.3 ms 8.2 14.6 1.2 0.2 34.7
Visual, GLB 0.9 3.6 7.0 0.3 ms 18.9 0.2 2.2 0.2 33.2
Visual, OBJ 0.8 3.0 7.2 0.4 ms 18.9 10.1 2.3 0.3 42.7
Board Repo: oresat/oresat-adcs-hardware
Board: control-stage.kicad_pcb
Folder oresat-rw-board-rev7 / control-stage
Complexity 353 / 1000 (size 258, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, TrueType text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 74, 917, 524
Triangles, simulation 2,647,594 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 89 MB 862 MB
STEP 217 MB 964 MB
STL 132 MB 880 MB
OBJ 281 MB 1.7 GB
Visual
GLB 48 MB 890 MB
OBJ 152 MB 1.1 GB

20.51 power-stage

power-stage: stages 4 and 6 take 48% to 86% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 43 s. Simulation, STL takes 39 s. Simulation, OBJ takes 63 s. Visual, GLB takes 71 s. Visual, OBJ takes 85 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.6 14.0 0.8 ms 14.6 0.7 1.6 0.3 36.9
Simulation, STEP 1.0 4.3 13.7 1.0 ms 14.9 7.1 1.6 0.3 42.9
Simulation, STL 1.1 4.4 13.7 0.7 ms 15.6 1.9 1.7 0.4 38.7
Simulation, OBJ 1.0 4.6 14.2 1 ms 16.4 24.9 1.8 0.3 63.3
Visual, GLB 1.0 4.7 14.5 0.9 ms 46.2 0.3 3.7 0.3 70.8
Visual, OBJ 1.3 4.9 14.2 1.0 ms 47.9 12.1 4.0 0.3 84.6
Board Repo: oresat/oresat-adcs-hardware
Board: power-stage.kicad_pcb
Folder oresat-rw-board-rev7 / power-stage
Complexity 326 / 1000 (size 231, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, TrueType text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 137, 1,171, 840
Triangles, simulation 3,991,868 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 130 MB 1.1 GB
STEP 352 MB 1.3 GB
STL 200 MB 1.2 GB
OBJ 432 MB 2.6 GB
Visual
GLB 64 MB 1.3 GB
OBJ 207 MB 1.4 GB

20.52 oresat-rw-card

oresat-rw-card: stages 4 and 6 take 56% to 81% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 57 s. Simulation, STL takes 48 s. Simulation, OBJ takes 67 s. Visual, GLB takes 61 s. Visual, OBJ takes 74 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 4.2 16.8 2 ms 21.1 0.7 1.8 0.3 47.0
Simulation, STEP 2.1 4.3 16.2 2 ms 21.6 10.5 1.8 0.3 56.7
Simulation, STL 2.1 4.3 16.2 2 ms 21.6 1.7 1.9 0.3 48.1
Simulation, OBJ 2.2 4.5 16.2 2 ms 20.9 20.8 1.8 0.3 66.8
Visual, GLB 2.0 4.3 16.0 2 ms 33.6 0.4 4.9 0.3 61.5
Visual, OBJ 2.1 4.0 15.6 2 ms 33.4 13.9 4.9 0.3 74.2
Board Repo: oresat/oresat-adcs-hardware
Board: oresat-rw-card.kicad_pcb
Folder oresat-rw-card
Complexity 342 / 1000 (size 227, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 267, 1,651, 575
Triangles, simulation 4,214,454 in 244 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 146 MB 1.4 GB
STEP 627 MB 1.6 GB
STL 211 MB 1.3 GB
OBJ 457 MB 2.8 GB
Visual
GLB 99 MB 1.6 GB
OBJ 314 MB 2.1 GB

20.53 oresat-backplane-1u

oresat-backplane-1u: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 34 s. Simulation, STEP takes 42 s. Simulation, STL takes 35 s. Simulation, OBJ takes 54 s. Visual, GLB takes 51 s. Visual, OBJ takes 59 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.5 14.0 0.4 ms 13.1 0.7 1.8 0.3 34.1
Simulation, STEP 0.8 3.5 14.0 0.5 ms 13.3 8.4 1.7 0.3 41.9
Simulation, STL 0.7 3.4 13.9 0.6 ms 13.4 1.4 1.7 0.3 34.7
Simulation, OBJ 0.8 3.5 14.7 0.5 ms 13.7 19.1 1.9 0.3 54.0
Visual, GLB 0.8 3.5 15.1 0.2 ms 28.1 0.3 2.9 0.3 50.9
Visual, OBJ 0.7 3.6 15.0 0.3 ms 27.9 8.2 3.3 0.3 59.0
Board Repo: oresat/oresat-backplane
Board: oresat-backplane-1u.kicad_pcb
Folder 1U / KiCad / oresat-backplane-1u
Complexity 292 / 1000 (size 197, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 45, 1,025, 224
Triangles, simulation 4,370,926 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 148 MB 1.2 GB
STEP 648 MB 1.5 GB
STL 219 MB 1.2 GB
OBJ 467 MB 2.8 GB
Visual
GLB 69 MB 1.3 GB
OBJ 216 MB 1.6 GB

20.54 oresat0-1u-backplane

oresat0-1u-backplane: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 37 s. Simulation, STL takes 30 s. Simulation, OBJ takes 47 s. Visual, GLB takes 40 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 2.8 12.6 0.3 ms 11.0 0.5 1.3 0.3 29.6
Simulation, STEP 1.1 2.9 12.5 0.3 ms 11.0 8.2 1.3 0.3 37.4
Simulation, STL 1.2 3.0 12.7 0.3 ms 10.8 1.1 1.5 0.3 30.5
Simulation, OBJ 1.2 2.8 12.5 0.3 ms 10.6 17.9 1.5 0.3 46.9
Visual, GLB 1.2 2.8 12.2 0.4 ms 21.2 0.2 1.8 0.3 39.8
Visual, OBJ 1.1 2.9 12.9 0.3 ms 21.6 8.6 2.2 0.3 49.5
Board Repo: oresat/oresat-backplane
Board: oresat0-1u-backplane.kicad_pcb
Folder 1U / KiCad / oresat0-1u-backplane
Complexity 313 / 1000 (size 193, features 120)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 38, 808, 245
Triangles, simulation 3,116,812 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 105 MB 974 MB
STEP 441 MB 1.1 GB
STL 156 MB 934 MB
OBJ 330 MB 2.1 GB
Visual
GLB 51 MB 1.1 GB
OBJ 157 MB 1.2 GB

20.55 oresat-backplane-2u

oresat-backplane-2u: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 88 s. Simulation, STEP takes 2 min. Simulation, STL takes 92 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 8.6 38.0 0.8 ms 32.8 1.7 4.4 0.4 88.0
Simulation, STEP 2.0 9.2 38.7 0.5 ms 32.1 19.7 4.0 0.5 106.2
Simulation, STL 1.9 8.8 39.1 0.4 ms 33.3 4.4 4.4 0.4 92.3
Simulation, OBJ 1.9 9.5 38.7 0.6 ms 32.6 54.2 4.1 0.4 141.4
Visual, GLB 2.0 9.3 39.6 0.6 ms 63.1 0.5 8.1 0.3 122.9
Visual, OBJ 1.9 9.1 40.0 0.4 ms 63.8 20.4 9.6 0.4 145.1
Board Repo: oresat/oresat-backplane
Board: oresat-backplane-2u.kicad_pcb
Folder 2U / generic-2u
Complexity 343 / 1000 (size 213, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 52, 923, 1,103
Triangles, simulation 9,769,928 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 324 MB 2.8 GB
STEP 1.3 GB 3.3 GB
STL 489 MB 2.7 GB
OBJ 1.0 GB 6.2 GB
Visual
GLB 145 MB 2.6 GB
OBJ 464 MB 3.0 GB

20.56 oresat-backplane-2u

oresat-backplane-2u: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 91 s. Simulation, STEP takes 2 min. Simulation, STL takes 94 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.9 9.0 39.3 1.0 ms 34.4 1.6 4.3 0.4 90.9
Simulation, STEP 1.8 8.9 40.7 0.5 ms 34.8 19.2 4.1 0.4 110.0
Simulation, STL 1.8 9.1 40.0 2 ms 35.0 3.6 4.3 0.4 94.2
Simulation, OBJ 1.8 9.2 40.4 0.3 ms 34.3 52.3 4.1 0.4 142.5
Visual, GLB 1.9 8.8 38.8 0.6 ms 60.7 0.6 6.8 0.4 117.9
Visual, OBJ 2.0 8.8 39.0 0.6 ms 61.4 22.6 6.8 0.4 141.0
Board Repo: oresat/oresat-backplane
Board: oresat-backplane-2u.kicad_pcb
Folder 2U / oresat0.5
Complexity 349 / 1000 (size 214, features 135)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 59, 731, 1,153
Triangles, simulation 7,981,954 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 265 MB 2.3 GB
STEP 976 MB 2.8 GB
STL 399 MB 2.3 GB
OBJ 853 MB 5.1 GB
Visual
GLB 128 MB 2.3 GB
OBJ 410 MB 2.7 GB

20.57 oresat-backplane-2u

oresat-backplane-2u: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 68 s. Simulation, STEP takes 81 s. Simulation, STL takes 72 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 6.9 29.0 0.9 ms 26.2 1.1 3.1 0.4 68.3
Simulation, STEP 1.5 6.9 29.8 0.7 ms 25.7 13.1 3.3 0.3 80.5
Simulation, STL 1.6 7.1 30.1 1 ms 27.6 2.1 3.4 0.4 72.1
Simulation, OBJ 1.7 7.2 29.8 0.8 ms 24.9 41.1 3.2 0.3 108.2
Visual, GLB 1.7 7.2 33.6 2 ms 58.6 0.6 6.6 0.4 108.5
Visual, OBJ 1.9 8.2 33.9 2 ms 52.5 18.3 4.8 0.3 119.9
Board Repo: oresat/oresat-backplane
Board: oresat-backplane-2u.kicad_pcb
Folder 2U / oresat1
Complexity 370 / 1000 (size 215, features 155)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 53, 1,119, 1,172
Triangles, simulation 6,573,172 in 56 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 223 MB 2.0 GB
STEP 768 MB 2.4 GB
STL 329 MB 2.0 GB
OBJ 708 MB 4.3 GB
Visual
GLB 107 MB 1.9 GB
OBJ 346 MB 2.2 GB

20.58 esi-backplane-3u

esi-backplane-3u: stages 4 and 6 take 55% to 87% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 10.3 57.0 1 ms 39.2 1.9 6.5 0.4 116.9
Simulation, STEP 1.6 10.4 55.4 0.4 ms 39.7 21.6 6.0 0.4 135.1
Simulation, STL 1.6 9.7 57.8 1 ms 41.0 4.5 7.1 0.5 122.0
Simulation, OBJ 1.7 10.7 57.3 0.5 ms 40.0 59.6 6.7 0.4 176.3
Visual, GLB 1.6 9.8 57.5 0.4 ms 75.3 0.8 8.1 0.4 153.5
Visual, OBJ 1.6 10.6 58.5 0.4 ms 77.2 24.2 8.1 0.4 180.6
Board Repo: oresat/oresat-backplane
Board: esi-backplane-3u.kicad_pcb
Folder 3U / esi-backplane-3u
Complexity 392 / 1000 (size 222, features 170)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 81, 2,165, 1,088
Triangles, simulation 10,799,048 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 369 MB 2.3 GB
STEP 1.4 GB 3.5 GB
STL 540 MB 2.4 GB
OBJ 1.2 GB 6.8 GB
Visual
GLB 169 MB 2.9 GB
OBJ 548 MB 3.5 GB

20.59 oresat-backplane-3u

oresat-backplane-3u: stages 4 and 6 take 56% to 89% of a run. Simulation, GLB takes 4 min. Simulation, STEP takes 4 min. Simulation, STL takes 4 min. Simulation, OBJ takes 5 min. Visual, GLB takes 4 min. Visual, OBJ takes 5 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.6 15.5 106.8 3 ms 70.8 3.0 10.7 0.8 211.3
Simulation, STEP 3.8 14.9 107.1 3 ms 71.3 46.9 11.5 0.7 256.3
Simulation, STL 4.0 15.5 102.9 3 ms 69.9 6.5 11.3 0.6 210.8
Simulation, OBJ 3.7 14.5 98.8 4 ms 65.5 99.3 9.9 0.5 292.1
Visual, GLB 3.0 14.1 95.7 3 ms 136.5 1.3 10.0 0.5 261.2
Visual, OBJ 3.2 14.1 96.4 3 ms 137.2 41.7 10.5 0.5 303.6
Board Repo: oresat/oresat-backplane
Board: oresat-backplane-3u.kicad_pcb
Folder 3U / oresat-backplane-3u
Complexity 358 / 1000 (size 218, features 140)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 189, 2,348, 25
Triangles, simulation 14,995,974 in 526 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 510 MB 3.8 GB
STEP 2.3 GB 4.6 GB
STL 750 MB 3.5 GB
OBJ 1.7 GB 9.6 GB
Visual
GLB 222 MB 3.8 GB
OBJ 721 MB 4.6 GB

20.60 oresat-batteries

oresat-batteries: stages 4 and 6 take 58% to 83% of a run. Simulation, GLB takes 49 s. Simulation, STEP takes 61 s. Simulation, STL takes 51 s. Simulation, OBJ takes 70 s. Visual, GLB takes 69 s. Visual, OBJ takes 83 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.2 17.5 2 ms 23.2 0.9 2.1 0.3 49.5
Simulation, STEP 1.5 4.4 17.8 2 ms 23.6 11.2 2.0 0.3 60.8
Simulation, STL 1.4 4.6 18.0 2 ms 23.7 1.4 2.1 0.3 51.5
Simulation, OBJ 1.3 4.5 17.6 2 ms 23.3 21.1 2.1 0.3 70.1
Visual, GLB 1.5 4.3 17.1 2 ms 39.9 0.4 5.5 0.3 69.0
Visual, OBJ 1.3 4.2 17.9 2 ms 39.5 15.0 5.2 0.3 83.3
Board Repo: oresat/oresat-batteries
Board: oresat-batteries.kicad_pcb
Folder oresat-battery-card
Complexity 410 / 1000 (size 270, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 277, 2,229, 566
Triangles, simulation 4,578,120 in 287 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 157 MB 1.4 GB
STEP 697 MB 1.8 GB
STL 229 MB 1.4 GB
OBJ 494 MB 3.0 GB
Visual
GLB 104 MB 1.7 GB
OBJ 334 MB 2.2 GB

20.61 oresat-c3

oresat-c3: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 96 s. Simulation, STEP takes 2 min. Simulation, STL takes 95 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.4 9.7 38.6 2 ms 39.7 1.3 4.1 0.4 96.2
Simulation, STEP 2.4 10.2 38.8 1 ms 39.4 19.0 3.7 0.4 113.8
Simulation, STL 2.5 9.7 37.8 2 ms 37.8 2.6 3.9 0.4 94.7
Simulation, OBJ 2.5 9.7 37.9 1 ms 36.4 44.2 3.7 0.4 134.8
Visual, GLB 2.5 9.5 36.9 2 ms 66.6 0.7 8.0 0.3 124.6
Visual, OBJ 2.5 9.6 38.4 1 ms 64.8 26.5 8.0 0.3 150.2
Board Repo: oresat/oresat-c3-hardware
Board: oresat-c3.kicad_pcb
Folder oresat-c3-card
Complexity 449 / 1000 (size 304, features 145)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 347, 2,992, 1,380
Triangles, simulation 7,494,014 in 560 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 255 MB 2.1 GB
STEP 1.0 GB 2.9 GB
STL 375 MB 2.1 GB
OBJ 809 MB 4.8 GB
Visual
GLB 164 MB 2.6 GB
OBJ 532 MB 3.4 GB

20.62 amp-PA-GRF5504-with-detect

amp-PA-GRF5504-with-detect: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 8.4 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.4 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 3.4 0.2 ms 2.9 0.1 0.3 0.3 8.4
Simulation, STEP 0.4 1.0 3.6 0.4 ms 3.3 2.1 0.4 0.3 10.9
Simulation, STL 0.3 1.0 3.2 0.4 ms 2.9 0.3 0.4 0.3 8.4
Simulation, OBJ 0.3 1.1 3.3 0.3 ms 2.8 3.8 0.3 0.3 12.0
Visual, GLB 0.3 0.9 3.2 0.6 ms 5.9 67 ms 0.7 0.3 11.3
Visual, OBJ 0.3 1.0 3.5 0.3 ms 5.4 2.0 0.5 0.2 13.0
Board Repo: oresat/oresat-c3-rf
Board: amp-PA-GRF5504-with-detect.kicad_pcb
Folder KiCad
Complexity 308 / 1000 (size 188, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 51, 247, 220
Triangles, simulation 840,424 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 418 MB
STEP 96 MB 486 MB
STL 42 MB 410 MB
OBJ 86 MB 626 MB
Visual
GLB 16 MB 418 MB
OBJ 48 MB 420 MB

20.63 cfc_emulator

cfc_emulator: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 5.6 s. Simulation, STEP takes 7.6 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 8.5 s. Visual, GLB takes 7.8 s. Visual, OBJ takes 9.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.4 ms 1.9 0.1 0.3 0.2 5.6
Simulation, STEP 0.2 0.4 2.4 0.3 ms 2.1 1.9 0.3 0.2 7.6
Simulation, STL 0.2 0.4 2.5 0.3 ms 1.9 0.1 0.3 0.2 5.7
Simulation, OBJ 0.2 0.4 2.4 0.3 ms 2.0 2.9 0.3 0.2 8.5
Visual, GLB 0.3 0.4 2.5 0.3 ms 3.9 52 ms 0.4 0.3 7.8
Visual, OBJ 0.3 0.4 2.3 0.5 ms 3.9 1.8 0.5 0.2 9.4
Board Repo: oresat/oresat-cfc-hardware
Board: cfc_emulator.kicad_pcb
Folder cfc-emulator
Complexity 222 / 1000 (size 142, features 80)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20210424)
Parts, tracks, vias 23, 202, 18
Triangles, simulation 540,340 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 305 MB
STEP 84 MB 368 MB
STL 27 MB 303 MB
OBJ 54 MB 411 MB
Visual
GLB 12 MB 344 MB
OBJ 34 MB 345 MB

20.64 cfc-minibackplane

cfc-minibackplane: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 19 s. Visual, GLB takes 18 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 6.0 0.4 ms 4.5 0.2 0.6 0.2 12.7
Simulation, STEP 0.3 0.9 6.2 0.4 ms 4.3 3.2 0.6 0.3 15.8
Simulation, STL 0.3 0.8 6.2 0.3 ms 4.2 0.4 0.6 0.3 12.8
Simulation, OBJ 0.3 0.9 6.2 0.4 ms 4.1 6.4 0.5 0.2 18.6
Visual, GLB 0.3 0.9 6.0 0.6 ms 9.1 0.1 1.1 0.2 17.7
Visual, OBJ 0.3 0.9 6.3 0.5 ms 9.1 3.7 1.1 0.3 21.7
Board Repo: oresat/oresat-cfc-hardware
Board: cfc-minibackplane.kicad_pcb
Folder cfc-minibackplane
Complexity 232 / 1000 (size 147, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 33, 219, 19
Triangles, simulation 1,343,314 in 65 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 501 MB
STEP 230 MB 619 MB
STL 67 MB 523 MB
OBJ 140 MB 925 MB
Visual
GLB 27 MB 663 MB
OBJ 80 MB 688 MB

20.65 cfc-processor

cfc-processor: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 45 s. Simulation, STEP takes 55 s. Simulation, STL takes 45 s. Simulation, OBJ takes 67 s. Visual, GLB takes 62 s. Visual, OBJ takes 81 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.5 18.5 1 ms 18.3 0.7 1.8 0.3 45.5
Simulation, STEP 1.3 4.5 18.0 2 ms 17.9 11.6 1.9 0.3 55.5
Simulation, STL 1.2 4.7 19.0 2 ms 17.1 1.3 1.8 0.3 45.4
Simulation, OBJ 1.3 4.8 19.3 1 ms 17.3 22.1 1.9 0.3 66.9
Visual, GLB 1.3 4.7 18.2 1 ms 33.3 0.4 3.8 0.3 62.1
Visual, OBJ 1.2 4.8 18.7 2 ms 37.3 14.3 4.2 0.3 80.8
Board Repo: oresat/oresat-cfc-hardware
Board: cfc-processor.kicad_pcb
Folder cfc-processor-card-v2
Complexity 403 / 1000 (size 283, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 163, 2,385, 501
Triangles, simulation 3,912,120 in 430 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 133 MB 1.3 GB
STEP 567 MB 1.6 GB
STL 196 MB 1.3 GB
OBJ 419 MB 2.6 GB
Visual
GLB 84 MB 1.4 GB
OBJ 270 MB 1.8 GB

20.66 cfc-sensor-card

cfc-sensor-card: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 31 s. Simulation, STL takes 25 s. Simulation, OBJ takes 37 s. Visual, GLB takes 36 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.7 9.5 1.0 ms 9.4 0.4 1.1 0.2 24.2
Simulation, STEP 0.8 2.5 9.7 0.8 ms 9.4 6.9 1.2 0.3 30.7
Simulation, STL 0.9 2.5 9.7 1.0 ms 9.8 0.9 1.2 0.3 25.2
Simulation, OBJ 0.9 2.7 9.5 1 ms 9.6 13.2 1.1 0.3 37.2
Visual, GLB 0.8 2.6 9.5 0.8 ms 19.7 0.3 2.8 0.2 35.9
Visual, OBJ 0.9 2.5 9.3 1 ms 20.3 8.5 3.0 0.3 44.6
Board Repo: oresat/oresat-cfc-hardware
Board: cfc-sensor-card.kicad_pcb
Folder cfc-sensor-card-v2
Complexity 330 / 1000 (size 215, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 149, 1,151, 404
Triangles, simulation 3,117,614 in 170 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 105 MB 984 MB
STEP 434 MB 1.3 GB
STL 156 MB 1.0 GB
OBJ 331 MB 2.1 GB
Visual
GLB 65 MB 1.3 GB
OBJ 206 MB 1.5 GB

20.67 oresat-diode-test-card

oresat-diode-test-card: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 34 s. Simulation, STL takes 28 s. Simulation, OBJ takes 41 s. Visual, GLB takes 39 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.6 12.1 0.7 ms 10.3 0.5 1.2 0.3 27.7
Simulation, STEP 0.7 2.8 12.6 0.5 ms 10.0 5.9 1.3 0.3 33.5
Simulation, STL 0.7 2.8 12.3 0.4 ms 9.9 0.9 1.2 0.3 28.0
Simulation, OBJ 0.7 2.6 12.4 0.5 ms 10.2 13.5 1.3 0.3 40.8
Visual, GLB 0.7 2.6 12.6 0.6 ms 20.0 0.2 2.4 0.2 38.8
Visual, OBJ 0.6 2.5 12.6 0.6 ms 19.7 7.8 2.6 0.3 46.2
Board Repo: oresat/oresat-diode-test-card
Board: oresat-diode-test-card.kicad_pcb
Folder oresat-diode-test-card
Complexity 301 / 1000 (size 211, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 116, 1,047, 362
Triangles, simulation 2,723,040 in 151 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 94 MB 872 MB
STEP 377 MB 1.1 GB
STL 136 MB 878 MB
OBJ 291 MB 1.8 GB
Visual
GLB 55 MB 1.1 GB
OBJ 173 MB 1.3 GB

20.68 AR9271_eval

AR9271_eval: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 28 s. Visual, GLB takes 26 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.9 8.9 1 ms 7.3 0.3 0.8 0.3 20.1
Simulation, STEP 0.6 2.0 8.7 0.8 ms 7.4 3.9 0.8 0.3 23.7
Simulation, STL 0.6 2.0 8.7 0.9 ms 7.4 0.6 0.7 0.3 20.3
Simulation, OBJ 0.5 2.0 8.6 1 ms 7.2 8.9 0.9 0.4 28.4
Visual, GLB 0.6 1.9 8.6 0.9 ms 12.5 0.2 1.4 0.3 25.5
Visual, OBJ 0.5 2.0 8.7 0.8 ms 12.4 5.4 1.6 0.2 30.9
Board Repo: oresat/oresat-dxwifi-hardware
Board: AR9271_eval.kicad_pcb
Folder AR9271_eval / AR9271_eval / AR9271_eval
Complexity 293 / 1000 (size 248, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 125, 745, 346
Triangles, simulation 1,765,668 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 62 MB 669 MB
STEP 243 MB 841 MB
STL 88 MB 657 MB
OBJ 186 MB 1.2 GB
Visual
GLB 38 MB 797 MB
OBJ 114 MB 910 MB

20.69 Bidirectional_Amp

Bidirectional_Amp: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 25 s. Visual, GLB takes 20 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 6.5 0.5 ms 5.6 0.3 0.6 0.3 15.5
Simulation, STEP 0.6 1.8 6.7 0.6 ms 5.8 3.3 0.6 0.2 19.2
Simulation, STL 0.5 1.9 6.8 0.5 ms 5.9 0.4 0.6 0.3 16.4
Simulation, OBJ 0.6 1.8 6.5 0.4 ms 6.3 8.7 0.6 0.2 24.8
Visual, GLB 0.6 1.9 6.7 0.5 ms 9.5 0.2 1.1 0.2 20.2
Visual, OBJ 0.6 1.9 6.7 0.5 ms 9.8 5.2 1.2 0.2 25.6
Board Repo: oresat/oresat-dxwifi-hardware
Board: Bidirectional_Amp.kicad_pcb
Folder bi-directional-amp-board_V2 / KiCad
Complexity 275 / 1000 (size 205, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 101, 356, 445
Triangles, simulation 1,663,490 in 66 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 756 MB
STEP 178 MB 809 MB
STL 83 MB 722 MB
OBJ 174 MB 1.1 GB
Visual
GLB 32 MB 706 MB
OBJ 98 MB 762 MB

20.70 oresat-live-card

oresat-live-card: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 69 s. Simulation, STEP takes 85 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.9 8.2 30.9 1 ms 23.3 1.0 2.9 0.4 68.8
Simulation, STEP 2.0 8.2 32.1 2 ms 24.2 15.2 2.9 0.3 85.0
Simulation, STL 1.9 8.9 30.9 1 ms 23.1 2.3 2.6 0.3 70.0
Simulation, OBJ 1.9 8.5 31.3 1 ms 24.3 33.5 2.8 0.3 102.7
Visual, GLB 2.0 8.5 31.7 1 ms 61.0 0.7 7.2 0.3 111.4
Visual, OBJ 2.1 8.8 31.0 1 ms 57.8 20.8 6.4 0.3 127.2
Board Repo: oresat/oresat-dxwifi-hardware
Board: oresat-live-card.kicad_pcb
Folder oresat-live-card
Complexity 472 / 1000 (size 302, features 170)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 313, 3,611, 1,249
Triangles, simulation 6,616,224 in 533 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 225 MB 1.8 GB
STEP 911 MB 2.5 GB
STL 331 MB 2.0 GB
OBJ 713 MB 4.2 GB
Visual
GLB 144 MB 2.3 GB
OBJ 470 MB 3.1 GB

20.71 receive_Path

receive_Path: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 7.8 s. Simulation, STL takes 6.7 s. Simulation, OBJ takes 10 s. Visual, GLB takes 8.0 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 2.3 0.3 ms 2.8 0.1 0.3 0.2 6.8
Simulation, STEP 0.2 0.9 2.2 0.4 ms 2.6 1.4 0.3 0.2 7.8
Simulation, STL 0.2 0.8 2.3 0.3 ms 2.7 0.2 0.3 0.2 6.7
Simulation, OBJ 0.2 0.8 2.4 0.3 ms 3.0 3.4 0.3 0.2 10.3
Visual, GLB 0.2 0.8 2.3 0.3 ms 4.1 57 ms 0.4 0.2 8.0
Visual, OBJ 0.2 0.9 2.2 0.3 ms 4.1 1.9 0.5 0.2 10.0
Board Repo: oresat/oresat-dxwifi-hardware
Board: receive_Path.kicad_pcb
Folder rf-receive-test
Complexity 291 / 1000 (size 186, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 34, 120, 317
Triangles, simulation 849,594 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 448 MB
STEP 64 MB 523 MB
STL 42 MB 436 MB
OBJ 86 MB 625 MB
Visual
GLB 15 MB 451 MB
OBJ 47 MB 422 MB

20.72 balun-eval-board

balun-eval-board: stages 4 and 6 take 50% to 74% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 5.4 s. Simulation, STL takes 4.6 s. Simulation, OBJ takes 8.9 s. Visual, GLB takes 7.1 s. Visual, OBJ takes 8.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.6 1.3 0.2 ms 2.0 67 ms 0.2 0.2 4.5
Simulation, STEP 0.1 0.7 1.4 0.2 ms 1.9 1.0 0.2 0.2 5.4
Simulation, STL 0.1 0.6 1.3 0.2 ms 2.1 0.1 0.2 0.2 4.6
Simulation, OBJ 0.2 0.8 2.0 0.2 ms 2.5 2.9 0.3 0.3 8.9
Visual, GLB 0.2 0.9 1.9 0.3 ms 3.3 46 ms 0.3 0.4 7.1
Visual, OBJ 0.2 0.9 1.9 0.3 ms 3.0 1.5 0.3 0.3 8.0
Board Repo: oresat/oresat-end-cards
Board: balun-eval-board.kicad_pcb
Folder dev-boards / BalUn-eval-board
Complexity 266 / 1000 (size 161, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 5, 14, 239
Triangles, simulation 450,516 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 319 MB
STEP 19 MB 355 MB
STL 23 MB 327 MB
OBJ 45 MB 342 MB
Visual
GLB 8.2 MB 285 MB
OBJ 25 MB 291 MB

20.73 esi-minusz-end-card

esi-minusz-end-card: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 34 s. Visual, GLB takes 31 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.4 8.2 0.6 ms 7.9 0.4 1.1 0.3 20.8
Simulation, STEP 0.6 2.4 8.3 0.8 ms 7.9 5.4 1.0 0.3 25.9
Simulation, STL 0.6 2.4 8.2 0.6 ms 7.7 0.7 1.0 0.3 20.9
Simulation, OBJ 0.7 2.5 8.5 1 ms 8.1 13.2 1.1 0.2 34.3
Visual, GLB 0.7 2.5 8.4 1.0 ms 16.6 0.2 2.2 0.3 31.0
Visual, OBJ 0.6 2.6 8.4 0.6 ms 16.9 7.8 2.2 0.3 38.8
Board Repo: oresat/oresat-end-cards
Board: esi-minusz-end-card.kicad_pcb
Folder esi-minusz-end-card
Complexity 385 / 1000 (size 205, features 180)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 67, 674, 490
Triangles, simulation 2,180,030 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 74 MB 907 MB
STEP 258 MB 954 MB
STL 109 MB 882 MB
OBJ 229 MB 1.5 GB
Visual
GLB 44 MB 859 MB
OBJ 137 MB 982 MB

20.74 esi-plusz-end-card

esi-plusz-end-card: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 21 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.7 5.7 0.5 ms 5.7 0.2 0.8 0.3 15.1
Simulation, STEP 0.8 1.6 5.7 0.5 ms 5.4 3.9 0.8 0.3 18.5
Simulation, STL 0.7 1.6 5.6 0.5 ms 5.4 0.5 0.7 0.3 14.8
Simulation, OBJ 0.7 1.6 5.5 0.5 ms 5.5 9.0 0.7 0.2 23.3
Visual, GLB 0.7 1.7 5.7 0.5 ms 11.1 0.1 1.2 0.3 20.7
Visual, OBJ 0.7 1.6 5.6 0.5 ms 11.2 5.5 1.3 0.2 26.2
Board Repo: oresat/oresat-end-cards
Board: esi-plusz-end-card.kicad_pcb
Folder esi-plusz-end-card
Complexity 321 / 1000 (size 196, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 50, 692, 275
Triangles, simulation 1,500,644 in 78 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 50 MB 571 MB
STEP 192 MB 710 MB
STL 75 MB 595 MB
OBJ 155 MB 1.0 GB
Visual
GLB 32 MB 740 MB
OBJ 96 MB 716 MB

20.75 plusz-end-card-with-turnstile

plusz-end-card-with-turnstile: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 17 s. Simulation, STL takes 15 s. Simulation, OBJ takes 22 s. Visual, GLB takes 20 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.8 5.7 0.8 ms 6.1 0.2 0.6 0.2 15.0
Simulation, STEP 0.3 1.7 5.7 0.7 ms 6.1 2.8 0.6 0.2 17.4
Simulation, STL 0.3 1.7 5.7 0.7 ms 6.2 0.5 0.7 0.2 15.3
Simulation, OBJ 0.3 1.7 5.7 1.0 ms 6.2 7.2 0.6 0.2 22.1
Visual, GLB 0.3 1.8 5.5 0.6 ms 11.2 0.1 1.1 0.2 20.2
Visual, OBJ 0.3 1.6 5.9 0.7 ms 11.3 4.3 1.2 0.2 24.8
Board Repo: oresat/oresat-end-cards
Board: plusz-end-card-with-turnstile.kicad_pcb
Folder oresat0-plusz-end-card / card
Complexity 313 / 1000 (size 193, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 27, 280, 513
Triangles, simulation 1,879,500 in 75 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 721 MB
STEP 197 MB 838 MB
STL 94 MB 717 MB
OBJ 197 MB 1.3 GB
Visual
GLB 35 MB 786 MB
OBJ 108 MB 814 MB

20.76 plusz-end-card-with-turnstile-mezzanine

Stages 4 and 6 take 54% to 80% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 16 s. Simulation, STL takes 14 s. Simulation, OBJ takes 20 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.7 5.0 0.5 ms 5.8 0.2 0.4 0.3 13.7
Simulation, STEP 0.3 1.7 4.9 0.4 ms 6.1 2.1 0.4 0.3 15.7
Simulation, STL 0.2 1.7 4.9 0.4 ms 5.9 0.3 0.4 0.2 13.6
Simulation, OBJ 0.2 1.7 4.8 0.4 ms 5.9 6.6 0.4 0.3 19.9
Visual, GLB 0.2 1.7 5.0 0.4 ms 7.3 0.1 0.8 0.2 15.5
Visual, OBJ 0.2 1.7 4.9 0.5 ms 7.4 4.1 0.9 0.2 19.5
Board Repo: oresat/oresat-end-cards
Board: plusz-end-card-with-turnstile-mezzanine.kicad_pcb
Folder oresat0-plusz-end-card / mezzanine
Complexity 260 / 1000 (size 190, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 22, 143, 536
Triangles, simulation 1,165,586 in 37 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 542 MB
STEP 75 MB 629 MB
STL 58 MB 580 MB
OBJ 116 MB 784 MB
Visual
GLB 23 MB 659 MB
OBJ 71 MB 605 MB

20.77 oresat0.5-minusz-end-card

oresat0.5-minusz-end-card: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 17 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 4.4 0.2 ms 4.3 0.2 0.5 0.3 11.7
Simulation, STEP 0.5 1.3 4.5 0.2 ms 4.3 2.4 0.5 0.2 13.8
Simulation, STL 0.6 1.4 4.8 0.2 ms 4.2 0.4 0.5 0.3 12.1
Simulation, OBJ 0.5 1.4 4.6 0.2 ms 4.4 7.3 0.5 0.2 18.9
Visual, GLB 0.6 1.4 4.8 0.4 ms 9.2 0.1 0.7 0.2 17.1
Visual, OBJ 0.6 1.4 4.5 0.3 ms 9.5 4.2 0.6 0.2 21.1
Board Repo: oresat/oresat-end-cards
Board: oresat0.5-minusz-end-card.kicad_pcb
Folder oresat0.5-minusz-end-card
Complexity 335 / 1000 (size 175, features 160)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 10, 137, 350
Triangles, simulation 1,327,426 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 43 MB 577 MB
STEP 125 MB 638 MB
STL 66 MB 561 MB
OBJ 134 MB 925 MB
Visual
GLB 24 MB 604 MB
OBJ 73 MB 604 MB

20.78 oresat0.5-pluz-end-card

oresat0.5-pluz-end-card: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 20 s. Visual, GLB takes 17 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.3 4.8 0.2 ms 4.3 0.2 0.5 0.2 12.2
Simulation, STEP 0.7 1.3 5.1 0.4 ms 4.5 2.6 0.6 0.2 15.0
Simulation, STL 0.7 1.2 4.6 0.4 ms 4.4 0.3 0.5 0.2 12.0
Simulation, OBJ 0.6 1.3 4.7 0.2 ms 4.4 7.7 0.6 0.2 19.6
Visual, GLB 0.6 1.2 4.8 0.2 ms 9.3 0.1 1.0 0.3 17.2
Visual, OBJ 0.7 1.4 4.8 0.5 ms 9.1 3.8 1.0 0.2 20.9
Board Repo: oresat/oresat-end-cards
Board: oresat0.5-pluz-end-card.kicad_pcb
Folder oresat0.5-plusz-end-card
Complexity 319 / 1000 (size 179, features 140)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 14, 190, 328
Triangles, simulation 1,392,812 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 595 MB
STEP 150 MB 626 MB
STL 70 MB 615 MB
OBJ 142 MB 942 MB
Visual
GLB 26 MB 621 MB
OBJ 78 MB 606 MB

20.79 oresat1-minusz-end-card

oresat1-minusz-end-card: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 32 s. Visual, GLB takes 29 s. Visual, OBJ takes 35 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.4 8.1 0.3 ms 7.5 0.3 1.0 0.3 20.2
Simulation, STEP 0.7 2.4 7.9 0.6 ms 7.6 4.8 1.0 0.3 24.7
Simulation, STL 0.7 2.4 7.9 0.3 ms 7.5 0.9 1.1 0.3 20.7
Simulation, OBJ 0.7 2.4 8.1 0.3 ms 7.4 12.2 1.0 0.3 32.1
Visual, GLB 0.7 2.5 8.2 0.5 ms 15.8 0.2 1.7 0.3 29.3
Visual, OBJ 0.7 2.4 8.0 0.4 ms 15.2 7.1 1.8 0.3 35.4
Board Repo: oresat/oresat-end-cards
Board: oresat1-minusz-end-card.kicad_pcb
Folder oresat1-minusz-end-card
Complexity 394 / 1000 (size 204, features 190)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
copper text, curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 65, 682, 477
Triangles, simulation 2,062,236 in 87 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 785 MB
STEP 235 MB 933 MB
STL 103 MB 746 MB
OBJ 216 MB 1.4 GB
Visual
GLB 42 MB 843 MB
OBJ 130 MB 973 MB

20.80 oresat1-plusz-end-card

oresat1-plusz-end-card: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 28 s. Simulation, STL takes 23 s. Simulation, OBJ takes 36 s. Visual, GLB takes 31 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 2.4 9.6 0.3 ms 7.7 0.3 0.9 0.3 22.4
Simulation, STEP 1.1 2.5 9.7 0.3 ms 7.8 5.5 0.9 0.2 27.8
Simulation, STL 1.1 2.6 9.6 0.5 ms 7.7 0.8 1.0 0.3 23.1
Simulation, OBJ 1.2 2.6 9.9 0.3 ms 8.1 13.4 1.0 0.3 36.3
Visual, GLB 1.2 2.4 9.6 0.4 ms 15.9 0.2 1.9 0.3 31.5
Visual, OBJ 1.1 2.5 10.0 0.6 ms 16.1 8.0 2.1 0.3 40.2
Board Repo: oresat/oresat-end-cards
Board: oresat1-plusz-end-card.kicad_pcb
Folder oresat1-plusz-end-card
Complexity 375 / 1000 (size 205, features 170)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
curved board outline,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 74, 731, 445
Triangles, simulation 2,233,472 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 76 MB 866 MB
STEP 280 MB 959 MB
STL 112 MB 849 MB
OBJ 236 MB 1.5 GB
Visual
GLB 45 MB 892 MB
OBJ 141 MB 1.1 GB

20.81 esi-minusZ-end-cap

esi-minusZ-end-cap: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 9.9 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.2 0.3 ms 2.9 0.1 0.4 0.2 8.0
Simulation, STEP 0.3 0.8 3.0 0.3 ms 2.9 2.3 0.4 0.2 9.9
Simulation, STL 0.3 0.9 3.0 0.3 ms 3.0 0.3 0.4 0.2 8.2
Simulation, OBJ 0.3 0.8 3.0 0.3 ms 2.9 4.9 0.4 0.2 12.7
Visual, GLB 0.3 0.9 2.9 0.3 ms 5.8 76 ms 0.5 0.2 10.7
Visual, OBJ 0.3 0.8 3.1 0.2 ms 6.1 2.7 0.5 0.2 13.7
Board Repo: oresat/oresat-endcaps
Board: esi-minusZ-end-cap.kicad_pcb
Folder esi-minusz-end-cap
Complexity 289 / 1000 (size 184, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 33, 287, 220
Triangles, simulation 906,706 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 498 MB
STEP 103 MB 509 MB
STL 45 MB 450 MB
OBJ 93 MB 657 MB
Visual
GLB 17 MB 468 MB
OBJ 52 MB 446 MB

20.82 esi-plusz-end-cap

esi-plusz-end-cap: stages 4 and 6 take 47% to 79% of a run. Simulation, GLB takes 7.3 s. Simulation, STEP takes 9.4 s. Simulation, STL takes 7.5 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 0.7 2.7 0.2 ms 2.6 0.1 0.4 0.2 7.3
Simulation, STEP 0.5 0.8 2.5 0.3 ms 2.8 2.3 0.4 0.3 9.4
Simulation, STL 0.4 0.8 2.7 0.3 ms 2.7 0.2 0.4 0.3 7.5
Simulation, OBJ 0.5 0.7 2.7 0.2 ms 2.8 4.3 0.4 0.3 11.6
Visual, GLB 0.5 0.8 2.8 0.4 ms 6.1 79 ms 0.8 0.3 11.3
Visual, OBJ 0.5 0.8 2.9 0.3 ms 6.1 2.6 0.9 0.3 14.2
Board Repo: oresat/oresat-endcaps
Board: esi-plusz-end-cap.kicad_pcb
Folder esi-plusz-end-cap
Complexity 285 / 1000 (size 180, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 34, 273, 146
Triangles, simulation 829,900 in 56 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 439 MB
STEP 105 MB 450 MB
STL 41 MB 443 MB
OBJ 85 MB 611 MB
Visual
GLB 17 MB 480 MB
OBJ 53 MB 447 MB

20.83 oresat0-plusz-end-cap

oresat0-plusz-end-cap: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 6.4 s. Simulation, STEP takes 8.1 s. Simulation, STL takes 6.5 s. Simulation, OBJ takes 9.3 s. Visual, GLB takes 9.1 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.9 0.2 ms 1.9 89 ms 0.3 0.2 6.4
Simulation, STEP 0.3 0.8 2.8 0.2 ms 2.0 1.6 0.3 0.3 8.1
Simulation, STL 0.3 0.7 2.8 0.1 ms 1.9 0.1 0.3 0.2 6.5
Simulation, OBJ 0.3 0.7 2.9 0.2 ms 1.9 3.0 0.3 0.2 9.3
Visual, GLB 0.3 0.7 2.9 0.2 ms 4.5 60 ms 0.4 0.2 9.1
Visual, OBJ 0.3 0.7 2.8 0.2 ms 4.4 2.1 0.5 0.2 11.1
Board Repo: oresat/oresat-endcaps
Board: oresat0-plusz-end-cap.kicad_pcb
Folder oresat0-plusz-end-cap / kicad
Complexity 268 / 1000 (size 163, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 25, 242, 209
Triangles, simulation 598,388 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 339 MB
STEP 87 MB 390 MB
STL 30 MB 359 MB
OBJ 62 MB 462 MB
Visual
GLB 15 MB 385 MB
OBJ 45 MB 388 MB

20.84 oresat0.5-minusz-end-cap

oresat0.5-minusz-end-cap: stages 4 and 6 take 57% to 82% of a run. Simulation, GLB takes 7.1 s. Simulation, STEP takes 8.5 s. Simulation, STL takes 7.1 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 9.9 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.4 0.3 ms 2.1 97 ms 0.3 0.3 7.1
Simulation, STEP 0.2 0.7 3.0 0.4 ms 2.1 1.8 0.3 0.2 8.5
Simulation, STL 0.2 0.8 3.2 0.3 ms 2.1 0.2 0.3 0.3 7.1
Simulation, OBJ 0.2 0.7 3.3 0.6 ms 2.1 2.7 0.3 0.2 9.5
Visual, GLB 0.2 0.7 3.3 0.4 ms 4.8 66 ms 0.5 0.2 9.9
Visual, OBJ 0.2 0.8 3.1 0.4 ms 4.8 2.3 0.7 0.2 12.2
Board Repo: oresat/oresat-endcaps
Board: oresat0.5-minusz-end-cap.kicad_pcb
Folder oresat0.5-minusz-end-cap
Complexity 271 / 1000 (size 166, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 26, 249, 267
Triangles, simulation 651,044 in 51 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 383 MB
STEP 86 MB 414 MB
STL 33 MB 398 MB
OBJ 66 MB 478 MB
Visual
GLB 17 MB 414 MB
OBJ 51 MB 427 MB

20.85 oresat0.5-plusz-end-cap

oresat0.5-plusz-end-cap: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 7.1 s. Simulation, STEP takes 8.6 s. Simulation, STL takes 7.2 s. Simulation, OBJ takes 10 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.4 0.4 ms 2.1 90 ms 0.3 0.2 7.1
Simulation, STEP 0.2 0.6 3.3 0.2 ms 2.1 1.7 0.4 0.2 8.6
Simulation, STL 0.2 0.7 3.4 0.3 ms 2.2 0.2 0.4 0.2 7.2
Simulation, OBJ 0.2 0.7 3.5 0.6 ms 2.1 3.0 0.4 0.3 10.2
Visual, GLB 0.2 0.7 3.4 0.4 ms 5.4 68 ms 0.7 0.2 10.7
Visual, OBJ 0.2 0.6 3.4 0.4 ms 5.3 2.2 0.6 0.3 12.6
Board Repo: oresat/oresat-endcaps
Board: oresat0.5-plusz-end-cap.kicad_pcb
Folder oresat0.5-plusz-end-cap
Complexity 269 / 1000 (size 164, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 27, 254, 215
Triangles, simulation 616,052 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 352 MB
STEP 90 MB 388 MB
STL 31 MB 378 MB
OBJ 63 MB 463 MB
Visual
GLB 16 MB 395 MB
OBJ 49 MB 406 MB

20.86 oresat1-minusZ-end-cap

oresat1-minusZ-end-cap: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 8.3 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.5 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 3.1 0.4 ms 3.0 0.1 0.5 0.2 8.3
Simulation, STEP 0.3 1.1 2.9 0.3 ms 3.0 2.3 0.5 0.3 10.5
Simulation, STL 0.3 0.9 3.1 0.2 ms 3.2 0.3 0.5 0.3 8.5
Simulation, OBJ 0.3 0.8 3.0 0.3 ms 3.3 4.6 0.5 0.2 12.7
Visual, GLB 0.4 1.0 3.4 0.3 ms 6.5 92 ms 0.8 0.2 12.4
Visual, OBJ 0.4 0.9 3.3 0.3 ms 6.4 3.1 0.8 0.3 15.1
Board Repo: oresat/oresat-endcaps
Board: oresat1-minusZ-end-cap.kicad_pcb
Folder oresat1-minusz-end-cap
Complexity 291 / 1000 (size 186, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 41, 260, 228
Triangles, simulation 984,700 in 60 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 500 MB
STEP 113 MB 545 MB
STL 49 MB 494 MB
OBJ 100 MB 681 MB
Visual
GLB 21 MB 524 MB
OBJ 63 MB 543 MB

20.87 oresat1-plusz-end-cap

oresat1-plusz-end-cap: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 15 s. Visual, GLB takes 13 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.1 3.9 0.4 ms 3.5 0.2 0.6 0.3 10.1
Simulation, STEP 0.5 1.0 3.5 0.3 ms 3.4 2.4 0.6 0.2 11.7
Simulation, STL 0.5 1.0 3.7 0.4 ms 3.4 0.3 0.6 0.3 9.7
Simulation, OBJ 0.6 1.0 3.7 0.4 ms 3.5 5.7 0.6 0.2 15.2
Visual, GLB 0.5 1.0 3.5 0.4 ms 7.4 0.1 0.7 0.3 13.5
Visual, OBJ 0.5 1.0 3.7 0.5 ms 7.4 3.6 0.8 0.2 17.2
Board Repo: oresat/oresat-endcaps
Board: oresat1-plusz-end-cap.kicad_pcb
Folder oresat1-plusz-end-cap
Complexity 293 / 1000 (size 188, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 42, 302, 240
Triangles, simulation 1,070,180 in 60 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 520 MB
STEP 124 MB 538 MB
STL 54 MB 518 MB
OBJ 109 MB 735 MB
Visual
GLB 22 MB 549 MB
OBJ 69 MB 542 MB

20.88 backplane-debug

backplane-debug: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 3.5 s. Visual, OBJ takes 4.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.1 ms 0.9 35 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.8 1.0 0.1 0.2 3.2
Simulation, STL 0.1 0.2 0.8 0.1 ms 0.7 39 ms 98 ms 0.2 2.2
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.8 1.0 0.1 0.2 3.2
Visual, GLB 0.1 0.2 0.8 0.2 ms 2.0 26 ms 0.2 0.2 3.5
Visual, OBJ 98 ms 0.2 0.8 0.2 ms 1.9 0.8 0.1 0.2 4.0
Board Repo: oresat/oresat-flatsat
Board: backplane-debug.kicad_pcb
Folder backplane-debug-board
Complexity 206 / 1000 (size 111, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 3, 76, 16
Triangles, simulation 213,296 in 24 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 212 MB
STEP 41 MB 240 MB
STL 11 MB 228 MB
OBJ 21 MB 232 MB
Visual
GLB 5.6 MB 210 MB
OBJ 16 MB 211 MB

20.89 backplane-debug-breakout

backplane-debug-breakout: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 6.3 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 5.0 s. Simulation, OBJ takes 7.1 s. Visual, GLB takes 6.4 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.6 2.4 0.5 ms 2.2 75 ms 0.4 0.3 6.3
Simulation, STEP 0.4 0.5 2.2 0.4 ms 1.6 1.5 0.2 0.3 6.8
Simulation, STL 0.3 0.5 1.8 0.2 ms 1.7 0.1 0.3 0.2 5.0
Simulation, OBJ 0.3 0.4 1.9 0.4 ms 1.7 2.3 0.3 0.2 7.1
Visual, GLB 0.3 0.4 1.7 0.3 ms 3.3 50 ms 0.3 0.2 6.4
Visual, OBJ 0.3 0.4 1.8 0.3 ms 3.3 2.0 0.5 0.2 8.5
Board Repo: oresat/oresat-flatsat
Board: backplane-debug-breakout.kicad_pcb
Folder backplane-debug-breakout
Complexity 240 / 1000 (size 135, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 15, 97, 39
Triangles, simulation 433,812 in 41 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 279 MB
STEP 71 MB 332 MB
STL 22 MB 291 MB
OBJ 44 MB 358 MB
Visual
GLB 11 MB 326 MB
OBJ 32 MB 323 MB

20.90 c3-proxy

c3-proxy: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 21 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 5.2 0.9 ms 5.6 0.3 0.7 0.3 14.1
Simulation, STEP 0.6 1.6 5.3 0.6 ms 5.9 3.9 0.7 0.3 18.2
Simulation, STL 0.5 1.7 5.1 0.7 ms 5.7 0.5 0.8 0.2 14.6
Simulation, OBJ 0.6 1.6 5.5 0.7 ms 5.7 8.3 0.8 0.2 22.6
Visual, GLB 0.5 1.7 5.5 0.8 ms 12.1 0.2 1.3 0.2 21.4
Visual, OBJ 0.6 1.6 5.2 0.5 ms 11.9 5.2 1.6 0.2 26.3
Board Repo: oresat/oresat-flatsat
Board: c3-proxy.kicad_pcb
Folder c3-proxy
Complexity 329 / 1000 (size 199, features 130)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 64, 706, 265
Triangles, simulation 1,736,256 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 665 MB
STEP 243 MB 805 MB
STL 87 MB 672 MB
OBJ 182 MB 1.2 GB
Visual
GLB 38 MB 912 MB
OBJ 115 MB 881 MB

20.91 oresat-c3-surrogate

oresat-c3-surrogate: stages 4 and 6 take 56% to 81% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 18 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.4 5.5 0.7 ms 4.0 0.2 0.6 0.3 12.3
Simulation, STEP 0.3 1.3 5.6 0.7 ms 4.2 3.0 0.6 0.3 15.2
Simulation, STL 0.3 1.3 5.5 0.6 ms 3.8 0.4 0.6 0.3 12.4
Simulation, OBJ 0.3 1.3 5.6 0.7 ms 3.9 5.2 0.5 0.2 17.1
Visual, GLB 0.3 1.3 5.4 0.8 ms 9.0 0.1 1.4 0.3 17.8
Visual, OBJ 0.3 1.3 5.4 0.8 ms 8.8 3.8 1.4 0.3 21.3
Board Repo: oresat/oresat-flatsat
Board: oresat-c3-surrogate.kicad_pcb
Folder c3-surrogate-card
Complexity 272 / 1000 (size 167, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 37, 318, 185
Triangles, simulation 1,085,502 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 462 MB
STEP 152 MB 572 MB
STL 54 MB 492 MB
OBJ 110 MB 742 MB
Visual
GLB 26 MB 628 MB
OBJ 80 MB 636 MB

20.92 c3s-card-adapter

c3s-card-adapter: stages 4 and 6 take 54% to 78% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.4 s. Simulation, STL takes 4.1 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 5.7 s. Visual, OBJ takes 6.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.4 0.2 ms 1.6 65 ms 0.3 0.2 4.1
Simulation, STEP 0.1 0.4 1.5 0.3 ms 1.6 1.4 0.3 0.2 5.4
Simulation, STL 0.1 0.4 1.4 0.3 ms 1.6 69 ms 0.3 0.3 4.1
Simulation, OBJ 0.1 0.4 1.4 0.3 ms 1.6 1.5 0.3 0.2 5.5
Visual, GLB 0.2 0.4 1.5 0.3 ms 3.0 55 ms 0.4 0.2 5.7
Visual, OBJ 0.1 0.4 1.5 0.2 ms 3.0 1.3 0.4 0.2 6.8
Board Repo: oresat/oresat-flatsat
Board: c3s-card-adapter.kicad_pcb
Folder c3s-card-adapter
Complexity 225 / 1000 (size 130, features 95)
KESE features through vias, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 2, 213, 88
Triangles, simulation 289,626 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.6 MB 251 MB
STEP 46 MB 278 MB
STL 14 MB 247 MB
OBJ 29 MB 246 MB
Visual
GLB 8.4 MB 406 MB
OBJ 26 MB 406 MB

20.93 card-debug-board-2

card-debug-board-2: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 5.2 s. Simulation, STEP takes 6.6 s. Simulation, STL takes 5.9 s. Simulation, OBJ takes 7.6 s. Visual, GLB takes 7.4 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.0 0.3 ms 1.8 71 ms 0.3 0.2 5.2
Simulation, STEP 0.2 0.6 2.1 0.3 ms 1.8 1.5 0.2 0.2 6.6
Simulation, STL 0.2 0.5 2.5 0.3 ms 2.0 0.1 0.3 0.2 5.9
Simulation, OBJ 0.2 0.5 2.2 0.2 ms 1.8 2.4 0.3 0.2 7.6
Visual, GLB 0.2 0.5 2.2 0.5 ms 3.7 54 ms 0.5 0.2 7.4
Visual, OBJ 0.2 0.5 1.8 0.3 ms 3.3 1.9 0.5 0.2 8.5
Board Repo: oresat/oresat-flatsat
Board: card-debug-board-2.kicad_pcb
Folder card-debug-board-2
Complexity 234 / 1000 (size 144, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 16, 198, 55
Triangles, simulation 428,828 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 277 MB
STEP 70 MB 335 MB
STL 21 MB 279 MB
OBJ 43 MB 348 MB
Visual
GLB 12 MB 334 MB
OBJ 34 MB 330 MB

20.94 card-debug-board-3

card-debug-board-3: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 22 s. Visual, GLB takes 20 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 4.9 0.7 ms 5.8 0.3 0.7 0.2 14.0
Simulation, STEP 0.5 1.5 5.2 0.5 ms 5.6 4.2 0.7 0.3 18.0
Simulation, STL 0.4 1.5 5.3 0.6 ms 5.9 0.5 0.7 0.3 14.6
Simulation, OBJ 0.5 1.5 5.4 0.6 ms 5.9 7.4 0.8 0.2 21.8
Visual, GLB 0.5 1.5 5.3 0.8 ms 11.1 0.1 1.3 0.2 20.1
Visual, OBJ 0.6 1.6 5.3 0.7 ms 11.2 4.9 1.5 0.3 25.3
Board Repo: oresat/oresat-flatsat
Board: card-debug-board-3.kicad_pcb
Folder card-debug-board-3
Complexity 354 / 1000 (size 239, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 78, 599, 249
Triangles, simulation 1,544,806 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 591 MB
STEP 208 MB 740 MB
STL 77 MB 595 MB
OBJ 160 MB 1.0 GB
Visual
GLB 34 MB 686 MB
OBJ 104 MB 779 MB

20.95 flatsat-breakout-main

flatsat-breakout-main: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.3 4.7 0.5 ms 4.3 0.2 0.7 0.3 11.7
Simulation, STEP 0.3 1.2 4.5 0.4 ms 4.4 2.7 0.7 0.3 14.0
Simulation, STL 0.3 1.3 4.8 0.4 ms 4.6 0.4 0.7 0.3 12.4
Simulation, OBJ 0.3 1.4 5.2 0.5 ms 4.3 7.4 0.7 0.2 19.5
Visual, GLB 0.3 1.2 4.7 0.5 ms 7.2 0.1 1.1 0.2 14.8
Visual, OBJ 0.3 1.4 5.1 0.5 ms 7.1 4.0 1.0 0.3 19.2
Board Repo: oresat/oresat-flatsat
Board: flatsat-breakout-main.kicad_pcb
Folder flatsat-breakout
Complexity 269 / 1000 (size 164, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 5, 380, 162
Triangles, simulation 1,354,072 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 512 MB
STEP 140 MB 607 MB
STL 68 MB 494 MB
OBJ 140 MB 914 MB
Visual
GLB 23 MB 551 MB
OBJ 70 MB 599 MB

20.96 oresat-flatsat-interface

oresat-flatsat-interface: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.0 5.2 0.3 ms 3.4 0.1 0.5 0.2 10.7
Simulation, STEP 0.2 1.0 5.3 0.4 ms 3.6 2.4 0.4 0.2 13.1
Simulation, STL 0.2 1.0 5.1 0.4 ms 3.6 0.3 0.5 0.2 11.0
Simulation, OBJ 0.2 1.0 5.1 0.5 ms 3.5 5.4 0.5 0.2 15.8
Visual, GLB 0.2 1.0 5.0 0.7 ms 6.9 91 ms 0.7 0.2 14.0
Visual, OBJ 0.2 1.0 4.9 0.3 ms 6.8 3.2 0.7 0.2 17.1
Board Repo: oresat/oresat-flatsat
Board: oresat-flatsat-interface.kicad_pcb
Folder flatsat-to-oresat-jumper-card
Complexity 289 / 1000 (size 159, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 11, 267, 291
Triangles, simulation 1,034,332 in 60 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 491 MB
STEP 126 MB 534 MB
STL 52 MB 476 MB
OBJ 105 MB 736 MB
Visual
GLB 21 MB 561 MB
OBJ 64 MB 556 MB

20.97 swd-to-card-debug-3

swd-to-card-debug-3: stages 4 and 6 take 52% to 76% of a run. Simulation, GLB takes 3.6 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.8 s. Simulation, OBJ takes 5.3 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.3 0.3 ms 1.3 50 ms 0.2 0.2 3.6
Simulation, STEP 0.1 0.4 1.3 0.3 ms 1.2 1.3 0.2 0.2 4.7
Simulation, STL 0.2 0.4 1.4 0.3 ms 1.4 0.1 0.2 0.2 3.8
Simulation, OBJ 0.1 0.4 1.4 0.4 ms 1.3 1.6 0.2 0.2 5.3
Visual, GLB 0.1 0.4 1.3 0.3 ms 2.8 43 ms 0.5 0.2 5.3
Visual, OBJ 0.1 0.4 1.4 0.3 ms 2.4 1.2 0.3 0.2 6.1
Board Repo: oresat/oresat-flatsat
Board: swd-to-card-debug-3.kicad_pcb
Folder swd-to-card-debug-3
Complexity 263 / 1000 (size 148, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 14, 184, 103
Triangles, simulation 405,560 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 272 MB
STEP 57 MB 321 MB
STL 20 MB 272 MB
OBJ 41 MB 331 MB
Visual
GLB 11 MB 314 MB
OBJ 32 MB 314 MB

20.98 usb_gps

usb_gps: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 21 s. Simulation, STL takes 18 s. Simulation, OBJ takes 25 s. Visual, GLB takes 23 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 8.2 0.9 ms 6.6 0.3 0.8 0.3 18.4
Simulation, STEP 0.4 1.9 7.1 0.8 ms 6.8 3.5 0.8 0.3 20.9
Simulation, STL 0.4 1.9 7.7 0.7 ms 6.3 0.6 0.8 0.3 17.9
Simulation, OBJ 0.4 1.8 7.5 0.6 ms 6.1 8.0 0.7 0.3 24.7
Visual, GLB 0.5 1.7 7.4 0.6 ms 11.9 0.2 1.4 0.3 23.3
Visual, OBJ 0.4 1.9 8.0 0.8 ms 12.4 4.8 1.6 0.3 29.5
Board Repo: oresat/oresat-gps-hardware
Board: usb_gps.kicad_pcb
Folder GPS-USB_Front_End_Board / kicad_board_design
Complexity 284 / 1000 (size 239, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 91, 888, 119
Triangles, simulation 1,683,098 in 118 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 742 MB
STEP 200 MB 777 MB
STL 84 MB 714 MB
OBJ 176 MB 1.1 GB
Visual
GLB 34 MB 721 MB
OBJ 101 MB 788 MB

20.99 BaseBoard

BaseBoard: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.1 s. Simulation, STL takes 4.6 s. Simulation, OBJ takes 6.6 s. Visual, GLB takes 6.0 s. Visual, OBJ takes 7.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 0.4 2.4 0.3 ms 1.4 81 ms 0.2 0.2 4.7
Simulation, STEP 0.1 0.4 2.3 0.4 ms 1.4 1.5 0.2 0.2 6.1
Simulation, STL 94 ms 0.4 2.3 0.3 ms 1.4 0.1 0.2 0.2 4.6
Simulation, OBJ 94 ms 0.4 2.4 0.3 ms 1.3 2.1 0.2 0.2 6.6
Visual, GLB 99 ms 0.4 2.3 0.4 ms 2.7 33 ms 0.4 0.2 6.0
Visual, OBJ 0.1 0.4 2.3 0.4 ms 2.8 1.0 0.2 0.2 7.1
Board Repo: oresat/oresat-gps-hardware
Board: BaseBoard.kicad_pcb
Folder MicroSemi_FPGA_Dev_Board / kicad_base_board_design / BaseBoard
Complexity 136 / 1000 (size 126, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 189, 0
Triangles, simulation 486,040 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 314 MB
STEP 85 MB 337 MB
STL 24 MB 304 MB
OBJ 49 MB 376 MB
Visual
GLB 8.1 MB 316 MB
OBJ 24 MB 312 MB

20.100 1.5V_switcher_test

1.5V_switcher_test: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.1 4.3 0.4 ms 2.9 0.1 0.4 0.2 9.3
Simulation, STEP 0.2 1.1 3.9 0.6 ms 3.0 2.1 0.5 0.2 11.0
Simulation, STL 0.2 1.2 4.0 0.5 ms 2.9 0.3 0.5 0.3 9.3
Simulation, OBJ 0.2 1.1 3.8 0.5 ms 2.9 4.0 0.4 0.2 12.6
Visual, GLB 0.2 1.1 4.4 0.8 ms 5.4 63 ms 0.5 0.3 11.9
Visual, OBJ 0.2 1.1 4.2 0.7 ms 5.4 2.1 0.7 0.3 13.9
Board Repo: oresat/oresat-gps-hardware
Board: 1.5V_switcher_test.kicad_pcb
Folder MicroSemi_FPGA_Dev_Board / kicad_board_design / A3P250_Dev_Board
Complexity 257 / 1000 (size 212, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 39, 266, 50
Triangles, simulation 851,012 in 105 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 366 MB
STEP 115 MB 435 MB
STL 43 MB 345 MB
OBJ 87 MB 594 MB
Visual
GLB 14 MB 403 MB
OBJ 42 MB 396 MB

20.101 A3P250_Dev_Board

A3P250_Dev_Board: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 23 s. Simulation, STL takes 19 s. Simulation, OBJ takes 29 s. Visual, GLB takes 25 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.2 8.2 0.6 ms 7.0 0.3 1.0 0.3 19.4
Simulation, STEP 0.3 2.1 8.2 0.4 ms 6.8 4.5 1.2 0.2 23.3
Simulation, STL 0.4 2.2 8.1 0.6 ms 6.8 0.7 1.0 0.3 19.4
Simulation, OBJ 0.3 2.3 8.3 0.4 ms 6.9 9.6 1.0 0.2 28.6
Visual, GLB 0.3 2.0 7.3 0.4 ms 13.9 0.1 1.4 0.3 25.2
Visual, OBJ 0.3 2.0 7.2 0.6 ms 13.9 4.3 1.6 0.3 29.8
Board Repo: oresat/oresat-gps-hardware
Board: A3P250_Dev_Board.kicad_pcb
Folder MicroSemi_FPGA_Dev_Board / kicad_board_design / A3P250_Dev_Board
Complexity 282 / 1000 (size 237, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 53, 1,191, 123
Triangles, simulation 1,856,362 in 107 parts
Verifier PASS in all six runs
Run again Simulation, GLB; Simulation, STEP; Simulation, STL; Simulation, OBJ: failed in the corpus run, run again with fixes to KESE made after the corpus run, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 577 MB
STEP 301 MB 698 MB
STL 93 MB 602 MB
OBJ 197 MB 1.3 GB
Visual
GLB 34 MB 685 MB
OBJ 103 MB 758 MB

20.102 switcher

switcher: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.5 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.6 0.1 ms 0.7 21 ms 79 ms 0.2 1.8
Simulation, STEP 97 ms 0.2 0.6 0.1 ms 0.7 0.9 66 ms 0.2 2.6
Simulation, STL 0.1 0.1 0.6 0.1 ms 0.8 27 ms 69 ms 0.2 1.9
Simulation, OBJ 0.1 0.2 0.6 0.1 ms 0.7 0.7 72 ms 0.2 2.5
Visual, GLB 0.1 0.1 0.6 0.1 ms 1.3 15 ms 0.1 0.2 2.5
Visual, OBJ 0.1 0.1 0.6 0.1 ms 1.3 0.5 95 ms 0.2 3.0
Board Repo: oresat/oresat-gps-hardware
Board: switcher.kicad_pcb
Folder MicroSemi_FPGA_Dev_Board / kicad_switcher_board / switcher
Complexity 187 / 1000 (size 142, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 12, 133, 2
Triangles, simulation 112,630 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.0 MB 182 MB
STEP 22 MB 197 MB
STL 5.6 MB 186 MB
OBJ 11 MB 185 MB
Visual
GLB 2.6 MB 156 MB
OBJ 7.2 MB 157 MB

20.103 switcher_close

switcher_close: stages 4 and 6 take 47% to 75% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.3 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 2.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.6 0.1 ms 0.6 20 ms 80 ms 0.2 1.8
Simulation, STEP 93 ms 0.1 0.6 0.1 ms 0.6 0.8 67 ms 0.2 2.4
Simulation, STL 87 ms 0.1 0.6 0.1 ms 0.6 28 ms 66 ms 0.2 1.7
Simulation, OBJ 89 ms 0.1 0.6 0.2 ms 0.6 0.6 71 ms 0.2 2.3
Visual, GLB 91 ms 0.1 0.6 0.1 ms 1.2 19 ms 0.1 0.2 2.4
Visual, OBJ 91 ms 0.1 0.6 0.1 ms 1.2 0.4 87 ms 0.2 2.7
Board Repo: oresat/oresat-gps-hardware
Board: switcher_close.kicad_pcb
Folder MicroSemi_FPGA_Dev_Board / kicad_switcher_board / switcher
Complexity 185 / 1000 (size 140, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 12, 114, 2
Triangles, simulation 116,008 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.1 MB 190 MB
STEP 22 MB 202 MB
STL 5.8 MB 186 MB
OBJ 11 MB 186 MB
Visual
GLB 2.7 MB 157 MB
OBJ 7.4 MB 158 MB

20.104 oresat-gps-card

oresat-gps-card: stages 4 and 6 take 57% to 81% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 70 s. Simulation, STL takes 60 s. Simulation, OBJ takes 83 s. Visual, GLB takes 83 s. Visual, OBJ takes 97 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 6.4 23.0 2 ms 23.7 0.8 1.9 0.3 58.2
Simulation, STEP 1.9 6.7 22.1 2 ms 23.8 12.7 2.3 0.4 69.8
Simulation, STL 1.9 6.5 22.9 2 ms 24.5 1.8 2.1 0.3 60.1
Simulation, OBJ 2.1 6.9 23.1 2 ms 24.0 24.1 2.0 0.4 82.6
Visual, GLB 2.2 6.9 23.7 3 ms 43.2 0.6 6.1 0.3 83.0
Visual, OBJ 1.9 6.6 23.6 2 ms 42.7 15.6 6.4 0.3 97.1
Board Repo: oresat/oresat-gps-hardware
Board: oresat-gps-card.kicad_pcb
Folder oresat-gps-card
Complexity 438 / 1000 (size 293, features 145)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
tracks bare of mask, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 215, 3,296, 767
Triangles, simulation 4,929,222 in 472 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 170 MB 1.5 GB
STEP 723 MB 2.0 GB
STL 247 MB 1.5 GB
OBJ 535 MB 3.2 GB
Visual
GLB 112 MB 1.8 GB
OBJ 357 MB 2.3 GB
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