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Corpus Testing 18

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Corpus Page 18

Part 18 of 30 of Corpus Testing: boards 1,837 to 1,944, six runs each, one file format a run, as Corpus Testing describes.

1837. ESP32-EVB_Rev_D

ESP32-EVB_Rev_D: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 32 s. Simulation, STL takes 28 s. Simulation, OBJ takes 38 s. Visual, GLB takes 44 s. Visual, OBJ takes 52 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.4 12.4 1 ms 9.6 0.4 1.3 0.3 26.9
Simulation, STEP 0.5 2.2 12.1 1.0 ms 9.5 6.3 1.3 0.3 32.2
Simulation, STL 0.7 2.4 12.6 0.8 ms 10.0 0.9 1.4 0.3 28.1
Simulation, OBJ 0.6 2.4 12.3 1.0 ms 9.7 11.1 1.4 0.3 37.8
Visual, GLB 0.6 2.4 12.5 1 ms 23.9 0.3 3.6 0.3 43.5
Visual, OBJ 0.7 2.4 12.2 1 ms 23.7 9.4 3.6 0.3 52.3
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_D.kicad_pcb
Folder HARDWARE / REV-D
Complexity 301 / 1000 (size 246, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 146, 2,818, 315
Triangles, simulation 2,219,460 in 143 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 775 MB
STEP 428 MB 1.0 GB
STL 111 MB 801 MB
OBJ 239 MB 1.5 GB
Visual
GLB 62 MB 1.1 GB
OBJ 190 MB 1.3 GB

1838. ESP32-EVB_Rev_F

ESP32-EVB_Rev_F: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 36 s. Simulation, STL takes 29 s. Simulation, OBJ takes 44 s. Visual, GLB takes 43 s. Visual, OBJ takes 55 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.8 12.9 1.0 ms 11.1 0.4 1.5 0.3 29.8
Simulation, STEP 0.8 2.8 13.3 1 ms 10.8 6.9 1.4 0.3 36.3
Simulation, STL 0.7 2.8 12.9 1 ms 10.3 0.7 1.4 0.3 29.1
Simulation, OBJ 0.8 2.6 13.1 0.7 ms 10.7 14.9 1.4 0.2 43.6
Visual, GLB 0.8 2.6 12.8 0.8 ms 24.0 0.4 2.5 0.3 43.3
Visual, OBJ 0.7 2.7 12.6 0.7 ms 24.8 10.9 2.5 0.3 54.6
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_F.kicad_pcb
Folder HARDWARE / REV-F
Complexity 301 / 1000 (size 246, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 148, 2,880, 303
Triangles, simulation 2,246,438 in 143 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 931 MB
STEP 438 MB 1.0 GB
STL 112 MB 916 MB
OBJ 242 MB 1.5 GB
Visual
GLB 63 MB 1.1 GB
OBJ 193 MB 1.4 GB

1839. ESP32-EVB_Rev_H

ESP32-EVB_Rev_H: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 31 s. Simulation, STL takes 26 s. Simulation, OBJ takes 38 s. Visual, GLB takes 37 s. Visual, OBJ takes 47 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.3 11.1 0.7 ms 9.7 0.3 1.2 0.3 25.6
Simulation, STEP 0.6 2.3 11.1 0.7 ms 9.6 6.2 1.2 0.3 31.2
Simulation, STL 0.6 2.4 11.3 0.7 ms 9.7 0.6 1.1 0.3 26.0
Simulation, OBJ 0.7 2.4 11.5 1 ms 9.8 12.0 1.1 0.3 37.7
Visual, GLB 0.6 2.3 11.0 0.7 ms 21.0 0.3 2.0 0.2 37.5
Visual, OBJ 0.6 2.4 11.1 0.6 ms 20.9 9.5 2.2 0.2 46.9
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_H.kicad_pcb
Folder HARDWARE / REV-H
Complexity 291 / 1000 (size 246, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 146, 2,965, 310
Triangles, simulation 2,248,598 in 140 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 846 MB
STEP 430 MB 1.0 GB
STL 112 MB 936 MB
OBJ 242 MB 1.5 GB
Visual
GLB 64 MB 1.1 GB
OBJ 197 MB 1.3 GB

1840. ESP32-EVB_Rev_I

ESP32-EVB_Rev_I: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 27 s. Simulation, STL takes 22 s. Simulation, OBJ takes 31 s. Visual, GLB takes 35 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.1 9.9 0.8 ms 8.5 0.3 1.0 0.2 22.5
Simulation, STEP 0.5 1.9 9.5 0.8 ms 8.7 5.2 1.0 0.2 27.1
Simulation, STL 0.6 1.9 9.7 0.9 ms 8.3 0.6 1.0 0.2 22.3
Simulation, OBJ 0.5 1.9 9.4 1 ms 8.5 9.2 1.1 0.2 30.9
Visual, GLB 0.6 1.8 9.5 0.8 ms 19.3 0.2 2.8 0.3 34.5
Visual, OBJ 0.5 1.9 9.4 0.9 ms 19.5 7.8 3.1 0.2 42.4
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_I.kicad_pcb
Folder HARDWARE / REV-I
Complexity 301 / 1000 (size 246, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 147, 2,960, 310
Triangles, simulation 2,199,014 in 140 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 858 MB
STEP 417 MB 1.0 GB
STL 110 MB 899 MB
OBJ 236 MB 1.5 GB
Visual
GLB 63 MB 1.1 GB
OBJ 193 MB 1.4 GB

1841. ESP32-EVB_Rev_J

ESP32-EVB_Rev_J: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 32 s. Simulation, STL takes 26 s. Simulation, OBJ takes 36 s. Visual, GLB takes 40 s. Visual, OBJ takes 49 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.6 11.0 0.8 ms 9.1 0.4 1.2 0.3 25.3
Simulation, STEP 0.8 2.3 11.6 1 ms 9.3 6.3 1.2 0.3 31.7
Simulation, STL 0.8 2.5 11.1 1 ms 9.1 0.6 1.3 0.3 25.7
Simulation, OBJ 0.7 2.7 11.3 1.0 ms 9.2 10.5 1.2 0.2 35.8
Visual, GLB 0.7 2.5 11.4 0.9 ms 22.5 0.3 2.6 0.3 40.3
Visual, OBJ 0.7 2.2 11.0 0.9 ms 23.5 8.8 2.7 0.3 49.2
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_J.kicad_pcb
Folder HARDWARE / REV-J
Complexity 303 / 1000 (size 248, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 157, 3,235, 315
Triangles, simulation 2,334,232 in 145 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 886 MB
STEP 445 MB 1.1 GB
STL 117 MB 890 MB
OBJ 251 MB 1.6 GB
Visual
GLB 66 MB 1.2 GB
OBJ 203 MB 1.4 GB

1842. ESP32-EVB_Rev_K

ESP32-EVB_Rev_K: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 26 s. Simulation, OBJ takes 37 s. Visual, GLB takes 38 s. Visual, OBJ takes 47 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.6 11.4 0.8 ms 8.8 0.3 1.1 0.3 25.3
Simulation, STEP 0.7 2.4 11.1 0.6 ms 8.7 5.9 1.1 0.2 30.0
Simulation, STL 0.8 2.5 11.5 0.9 ms 8.9 0.5 1.2 0.2 25.6
Simulation, OBJ 0.8 2.4 11.3 0.7 ms 8.8 12.1 1.2 0.2 36.8
Visual, GLB 0.7 2.5 11.0 0.4 ms 20.7 0.3 2.5 0.2 38.0
Visual, OBJ 0.7 2.4 10.7 0.8 ms 20.6 9.7 2.6 0.2 47.0
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_K.kicad_pcb
Folder HARDWARE / REV-K
Complexity 303 / 1000 (size 248, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 157, 3,236, 315
Triangles, simulation 2,291,902 in 145 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 890 MB
STEP 430 MB 1.1 GB
STL 115 MB 886 MB
OBJ 247 MB 1.6 GB
Visual
GLB 66 MB 1.1 GB
OBJ 203 MB 1.4 GB

1843. ESP32-EVB_Rev_K1

ESP32-EVB_Rev_K1: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 29 s. Simulation, STEP takes 35 s. Simulation, STL takes 29 s. Simulation, OBJ takes 43 s. Visual, GLB takes 45 s. Visual, OBJ takes 56 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.8 13.3 0.9 ms 10.3 0.4 1.3 0.3 29.4
Simulation, STEP 1.0 2.8 13.0 0.8 ms 10.0 6.7 1.3 0.3 35.0
Simulation, STL 0.9 2.9 13.2 0.8 ms 9.9 0.7 1.2 0.3 29.2
Simulation, OBJ 0.9 2.9 13.3 0.9 ms 10.2 13.7 1.3 0.3 42.6
Visual, GLB 0.9 2.9 13.2 1.0 ms 24.8 0.3 2.9 0.3 45.3
Visual, OBJ 0.9 2.9 12.9 0.8 ms 24.1 11.4 3.0 0.3 55.6
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_K1.kicad_pcb
Folder HARDWARE / REV-K1
Complexity 303 / 1000 (size 248, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 157, 3,236, 315
Triangles, simulation 2,292,316 in 145 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 865 MB
STEP 430 MB 1.0 GB
STL 115 MB 852 MB
OBJ 247 MB 1.6 GB
Visual
GLB 66 MB 1.1 GB
OBJ 203 MB 1.4 GB

1844. ESP32-EVB_Rev_K2

ESP32-EVB_Rev_K2: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 26 s. Simulation, OBJ takes 36 s. Visual, GLB takes 41 s. Visual, OBJ takes 53 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.3 11.6 1.0 ms 8.9 0.3 1.1 0.3 25.4
Simulation, STEP 0.7 2.5 11.4 0.9 ms 8.7 6.0 1.1 0.3 30.7
Simulation, STL 0.7 2.5 11.7 1 ms 9.2 0.6 1.2 0.3 26.2
Simulation, OBJ 0.7 2.5 11.1 1.0 ms 9.0 11.1 1.3 0.2 36.0
Visual, GLB 0.8 2.4 11.1 1 ms 22.8 0.3 3.2 0.3 40.9
Visual, OBJ 0.8 2.4 11.7 0.9 ms 24.4 9.9 3.6 0.3 53.0
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_K2.kicad_pcb
Folder HARDWARE / REV-K2
Complexity 293 / 1000 (size 248, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 157, 3,236, 315
Triangles, simulation 2,292,312 in 145 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 972 MB
STEP 430 MB 1.1 GB
STL 115 MB 900 MB
OBJ 247 MB 1.6 GB
Visual
GLB 66 MB 1.1 GB
OBJ 203 MB 1.3 GB

1845. ESP32-EVB_Rev_L

ESP32-EVB_Rev_L: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 25 s. Simulation, OBJ takes 36 s. Visual, GLB takes 39 s. Visual, OBJ takes 49 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.5 10.8 0.7 ms 8.9 0.3 1.1 0.2 24.7
Simulation, STEP 0.8 2.4 10.9 0.7 ms 9.2 5.9 1.0 0.2 30.6
Simulation, STL 1.0 2.3 11.1 0.8 ms 9.0 0.5 1.0 0.2 25.1
Simulation, OBJ 0.9 2.3 10.7 0.6 ms 9.0 11.6 1.2 0.3 36.0
Visual, GLB 0.9 2.3 11.2 0.8 ms 21.8 0.3 2.4 0.2 39.2
Visual, OBJ 0.9 2.5 11.0 0.7 ms 21.9 9.9 3.0 0.3 49.4
Board Repo: OLIMEX/ESP32-EVB
Board: ESP32-EVB_Rev_L.kicad_pcb
Folder HARDWARE / REV-L
Complexity 307 / 1000 (size 247, features 60)
KESE features through vias, slotted holes,
filled zones, knockout text
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 155, 3,066, 307
Triangles, simulation 2,193,876 in 144 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 830 MB
STEP 424 MB 981 MB
STL 110 MB 807 MB
OBJ 237 MB 1.5 GB
Visual
GLB 62 MB 1.1 GB
OBJ 191 MB 1.4 GB

1846. ESP32-GATEWAY_Rev_A

ESP32-GATEWAY_Rev_A: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 24 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 7.6 0.9 ms 5.3 0.3 0.7 0.3 16.2
Simulation, STEP 0.5 1.6 7.7 0.6 ms 5.2 4.0 0.7 0.3 20.0
Simulation, STL 0.5 1.6 7.3 0.5 ms 5.1 0.4 0.7 0.2 15.8
Simulation, OBJ 0.4 1.6 7.3 0.6 ms 5.3 8.0 0.7 0.2 23.7
Visual, GLB 0.4 1.5 7.6 0.6 ms 12.7 0.2 1.7 0.2 24.4
Visual, OBJ 0.5 1.6 7.2 0.5 ms 13.1 6.6 1.8 0.2 30.9
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_A.kicad_pcb
Folder HARDWARE / Hardware revision A
Complexity 288 / 1000 (size 233, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 82, 1,876, 230
Triangles, simulation 1,311,668 in 104 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 47 MB 544 MB
STEP 241 MB 642 MB
STL 66 MB 551 MB
OBJ 139 MB 933 MB
Visual
GLB 38 MB 716 MB
OBJ 114 MB 783 MB

1847. ESP32-GATEWAY_Rev_B

ESP32-GATEWAY_Rev_B: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 17 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 25 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.4 6.7 0.6 ms 4.7 0.2 0.7 0.3 14.4
Simulation, STEP 0.4 1.4 6.5 0.6 ms 4.6 3.4 0.6 0.2 17.1
Simulation, STL 0.4 1.4 6.3 0.6 ms 4.8 0.5 0.6 0.3 14.3
Simulation, OBJ 0.5 1.4 6.3 0.5 ms 4.7 6.6 0.8 0.3 20.6
Visual, GLB 0.7 1.8 7.9 0.6 ms 12.6 0.2 1.6 0.3 25.0
Visual, OBJ 0.4 1.2 6.7 0.6 ms 12.7 5.8 1.9 0.2 28.9
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_B.kicad_pcb
Folder HARDWARE / Hardware revision B
Complexity 288 / 1000 (size 233, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 83, 1,858, 229
Triangles, simulation 1,306,382 in 104 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 547 MB
STEP 240 MB 637 MB
STL 65 MB 535 MB
OBJ 138 MB 942 MB
Visual
GLB 38 MB 685 MB
OBJ 114 MB 796 MB

1848. ESP32-GATEWAY_Rev_C

ESP32-GATEWAY_Rev_C: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 22 s. Visual, GLB takes 24 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.5 7.0 0.5 ms 4.8 0.2 0.6 0.3 14.9
Simulation, STEP 0.5 1.4 6.8 0.5 ms 4.6 3.8 0.6 0.2 17.9
Simulation, STL 0.5 1.5 6.9 0.6 ms 4.8 0.5 0.7 0.2 15.1
Simulation, OBJ 0.5 1.5 7.1 0.6 ms 4.8 7.4 0.6 0.3 22.1
Visual, GLB 0.4 1.6 6.8 0.5 ms 13.1 0.2 1.4 0.3 23.7
Visual, OBJ 0.5 1.6 6.9 0.5 ms 12.6 6.2 1.7 0.3 29.8
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_C.kicad_pcb
Folder HARDWARE / Hardware revision C
Complexity 288 / 1000 (size 233, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 84, 1,868, 232
Triangles, simulation 1,333,358 in 104 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 47 MB 554 MB
STEP 246 MB 670 MB
STL 67 MB 558 MB
OBJ 141 MB 950 MB
Visual
GLB 39 MB 758 MB
OBJ 117 MB 822 MB

1849. ESP32-GATEWAY_Rev_D

ESP32-GATEWAY_Rev_D: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 23 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.9 7.2 0.5 ms 5.1 0.2 0.7 0.3 15.9
Simulation, STEP 0.5 1.9 7.1 0.5 ms 4.8 3.7 0.7 0.2 18.8
Simulation, STL 0.4 1.8 7.0 0.4 ms 4.8 0.4 0.7 0.3 15.4
Simulation, OBJ 0.5 1.9 6.9 0.4 ms 4.8 7.5 0.6 0.3 22.5
Visual, GLB 0.4 2.0 7.2 0.5 ms 11.8 0.2 1.4 0.2 23.2
Visual, OBJ 0.5 1.9 7.3 0.6 ms 12.2 6.4 1.5 0.3 30.0
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_D.kicad_pcb
Folder HARDWARE / Hardware revision D
Complexity 288 / 1000 (size 233, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 82, 1,793, 226
Triangles, simulation 1,276,634 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 541 MB
STEP 236 MB 642 MB
STL 64 MB 544 MB
OBJ 135 MB 888 MB
Visual
GLB 37 MB 697 MB
OBJ 111 MB 803 MB

1850. ESP32-GATEWAY_Rev_E

ESP32-GATEWAY_Rev_E: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 19 s. Visual, GLB takes 19 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.5 5.9 0.5 ms 4.1 0.2 0.6 0.2 12.9
Simulation, STEP 0.4 1.6 5.8 0.5 ms 4.0 3.2 0.5 0.2 15.7
Simulation, STL 0.4 1.6 5.6 0.3 ms 4.0 0.3 0.5 0.2 12.7
Simulation, OBJ 0.4 1.6 5.7 0.3 ms 4.1 6.2 0.6 0.2 18.6
Visual, GLB 0.4 1.6 6.0 0.4 ms 9.9 0.2 1.1 0.2 19.3
Visual, OBJ 0.4 1.5 5.8 0.4 ms 10.3 5.3 1.2 0.2 24.8
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_E.kicad_pcb
Folder HARDWARE / Hardware revision E
Complexity 288 / 1000 (size 233, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 82, 1,795, 226
Triangles, simulation 1,276,018 in 103 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 541 MB
STEP 236 MB 645 MB
STL 64 MB 535 MB
OBJ 134 MB 881 MB
Visual
GLB 37 MB 685 MB
OBJ 111 MB 839 MB

1851. ESP32-GATEWAY_Rev_F

ESP32-GATEWAY_Rev_F: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 17 s. Simulation, OBJ takes 25 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 7.6 0.4 ms 5.4 0.2 0.7 0.3 16.5
Simulation, STEP 0.5 1.8 7.6 0.4 ms 5.5 4.0 0.7 0.2 20.3
Simulation, STL 0.5 1.8 7.8 0.4 ms 5.3 0.4 0.7 0.2 16.8
Simulation, OBJ 0.5 1.7 7.7 0.5 ms 5.4 8.4 0.7 0.2 24.7
Visual, GLB 0.5 1.8 7.8 0.3 ms 14.2 0.2 1.5 0.3 26.3
Visual, OBJ 0.5 1.8 7.8 0.7 ms 14.0 7.0 1.6 0.3 33.0
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_F.kicad_pcb
Folder HARDWARE / Hardware revision F
Complexity 291 / 1000 (size 236, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20190331)
Parts, tracks, vias 90, 1,929, 320
Triangles, simulation 1,424,536 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 50 MB 608 MB
STEP 242 MB 696 MB
STL 71 MB 603 MB
OBJ 150 MB 1.0 GB
Visual
GLB 42 MB 772 MB
OBJ 126 MB 959 MB

1852. ESP32-GATEWAY_Rev_G

ESP32-GATEWAY_Rev_G: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 21 s. Simulation, STL takes 18 s. Simulation, OBJ takes 25 s. Visual, GLB takes 28 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 8.2 0.5 ms 5.8 0.3 0.8 0.3 17.7
Simulation, STEP 0.6 1.8 8.2 0.6 ms 5.7 4.1 0.7 0.3 21.5
Simulation, STL 0.5 1.9 8.6 0.8 ms 5.8 0.5 0.7 0.3 18.2
Simulation, OBJ 0.5 1.8 8.2 0.3 ms 5.6 8.4 0.7 0.2 25.5
Visual, GLB 0.5 1.9 8.4 0.4 ms 15.2 0.2 1.7 0.3 28.1
Visual, OBJ 0.5 1.9 8.2 0.6 ms 14.1 7.3 1.8 0.3 34.1
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_G.kicad_pcb
Folder HARDWARE / Hardware revision G
Complexity 291 / 1000 (size 236, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 90, 1,944, 322
Triangles, simulation 1,438,022 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 607 MB
STEP 245 MB 713 MB
STL 72 MB 591 MB
OBJ 151 MB 999 MB
Visual
GLB 42 MB 811 MB
OBJ 127 MB 971 MB

1853. ESP32-GATEWAY_Rev_H

ESP32-GATEWAY_Rev_H: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 26 s. Visual, GLB takes 28 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 7.8 0.3 ms 6.0 0.3 0.7 0.2 17.3
Simulation, STEP 0.5 1.8 7.9 0.4 ms 6.0 4.2 0.7 0.3 21.5
Simulation, STL 0.6 1.8 7.9 0.3 ms 5.8 0.4 0.8 0.2 17.4
Simulation, OBJ 0.5 1.9 7.8 0.4 ms 6.1 9.2 0.8 0.3 26.4
Visual, GLB 0.5 1.8 7.6 0.4 ms 15.5 0.2 2.0 0.2 27.8
Visual, OBJ 0.5 1.7 7.6 0.4 ms 15.7 8.6 1.9 0.3 36.3
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_H.kicad_pcb
Folder HARDWARE / Hardware revision H
Complexity 281 / 1000 (size 236, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 97, 1,920, 287
Triangles, simulation 1,463,584 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 604 MB
STEP 256 MB 724 MB
STL 73 MB 651 MB
OBJ 154 MB 1.0 GB
Visual
GLB 43 MB 788 MB
OBJ 130 MB 920 MB

1854. ESP32-GATEWAY_Rev_I

ESP32-GATEWAY_Rev_I: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 23 s. Visual, GLB takes 25 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.6 0.6 ms 5.3 0.2 0.6 0.3 15.1
Simulation, STEP 0.5 1.5 6.8 0.6 ms 5.2 3.9 0.6 0.3 18.8
Simulation, STL 0.4 1.6 6.8 0.7 ms 5.8 0.4 0.7 0.3 16.1
Simulation, OBJ 0.4 1.7 6.7 0.7 ms 5.3 7.7 0.6 0.3 22.7
Visual, GLB 0.4 1.6 6.6 0.7 ms 14.3 0.2 1.9 0.2 25.3
Visual, OBJ 0.5 1.3 6.8 0.9 ms 14.4 5.8 2.0 0.3 31.2
Board Repo: OLIMEX/ESP32-GATEWAY
Board: ESP32-GATEWAY_Rev_I.kicad_pcb
Folder HARDWARE / Hardware revision I
Complexity 281 / 1000 (size 236, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 98, 1,934, 287
Triangles, simulation 1,474,380 in 111 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 608 MB
STEP 259 MB 722 MB
STL 74 MB 620 MB
OBJ 156 MB 1.0 GB
Visual
GLB 43 MB 783 MB
OBJ 131 MB 941 MB

1855. ESP32-H2-DevKit-LiPo_Rev_A

ESP32-H2-DevKit-LiPo_Rev_A: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 17 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.1 4.5 0.4 ms 3.9 0.2 0.5 0.2 10.9
Simulation, STEP 0.4 1.1 4.4 0.4 ms 4.0 3.0 0.5 0.2 13.5
Simulation, STL 0.5 1.1 4.5 0.4 ms 3.9 0.4 0.5 0.3 11.2
Simulation, OBJ 0.5 1.0 4.4 0.4 ms 3.8 5.6 0.5 0.2 16.1
Visual, GLB 0.4 1.1 4.4 0.4 ms 9.6 0.1 1.1 0.2 16.9
Visual, OBJ 0.4 1.1 4.4 0.4 ms 9.4 4.3 1.3 0.2 21.1
Board Repo: OLIMEX/ESP32-H2-DevKit-Lipo
Board: ESP32-H2-DevKit-LiPo_Rev_A.kicad_pcb
Folder HARDWARE / ESP32-H2-DevKit-Lipo-Rev.A
Complexity 282 / 1000 (size 182, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 68, 1,096, 124
Triangles, simulation 1,066,038 in 83 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 38 MB 552 MB
STEP 224 MB 574 MB
STL 53 MB 517 MB
OBJ 113 MB 790 MB
Visual
GLB 32 MB 694 MB
OBJ 95 MB 719 MB

1856. ESP32-P4-DevKit_Rev_B

ESP32-P4-DevKit_Rev_B: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 35 s. Visual, GLB takes 38 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.3 8.9 0.8 ms 8.8 0.4 1.4 0.3 22.9
Simulation, STEP 0.8 2.4 9.0 1 ms 8.8 6.1 1.4 0.2 28.7
Simulation, STL 0.8 2.2 9.0 1 ms 9.2 0.7 1.3 0.3 23.5
Simulation, OBJ 0.8 2.2 9.3 1 ms 9.0 11.6 1.5 0.3 34.7
Visual, GLB 0.9 2.3 9.1 1 ms 22.2 0.3 3.0 0.3 38.0
Visual, OBJ 0.9 2.4 9.2 1.0 ms 20.7 8.4 3.0 0.3 44.7
Board Repo: OLIMEX/ESP32-P4-DevKit
Board: ESP32-P4-DevKit_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-P4-DevKit-Rev.B
Complexity 363 / 1000 (size 268, features 95)
KESE features through vias, slotted holes,
filled zones, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 138, 2,985, 213
Triangles, simulation 2,254,720 in 189 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 789 MB
STEP 407 MB 988 MB
STL 113 MB 773 MB
OBJ 245 MB 1.6 GB
Visual
GLB 57 MB 978 MB
OBJ 175 MB 1.2 GB

1857. ESP32-P4-DevKit_Rev_C

ESP32-P4-DevKit_Rev_C: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 30 s. Visual, GLB takes 33 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.9 7.4 0.9 ms 7.9 0.3 1.0 0.2 19.4
Simulation, STEP 0.7 1.9 7.5 0.8 ms 7.5 5.1 1.0 0.3 24.0
Simulation, STL 0.7 1.9 7.4 0.7 ms 7.9 0.7 1.1 0.3 19.9
Simulation, OBJ 0.7 2.0 7.5 0.8 ms 7.7 10.0 1.3 0.3 29.5
Visual, GLB 0.7 2.0 7.6 1.0 ms 19.2 0.2 2.8 0.3 32.8
Visual, OBJ 0.7 2.0 7.8 1 ms 19.2 6.9 2.8 0.2 39.7
Board Repo: OLIMEX/ESP32-P4-DevKit
Board: ESP32-P4-DevKit_Rev_C.kicad_pcb
Folder HARDWARE / ESP32-P4-DevKit-Rev.C
Complexity 374 / 1000 (size 269, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 138, 3,235, 216
Triangles, simulation 2,286,940 in 189 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 859 MB
STEP 413 MB 978 MB
STL 114 MB 820 MB
OBJ 249 MB 1.6 GB
Visual
GLB 57 MB 1.0 GB
OBJ 177 MB 1.2 GB

1858. ESP32-P4-DevKit_Rev_D

ESP32-P4-DevKit_Rev_D: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 32 s. Simulation, STL takes 27 s. Simulation, OBJ takes 41 s. Visual, GLB takes 42 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 2.7 9.8 0.9 ms 9.9 0.5 1.5 0.3 25.8
Simulation, STEP 1.0 2.7 9.9 0.8 ms 9.9 6.9 1.6 0.3 32.2
Simulation, STL 1.0 2.7 9.9 1 ms 10.4 0.8 1.5 0.3 26.6
Simulation, OBJ 1.0 2.5 9.9 4 ms 11.1 14.8 1.7 0.3 41.2
Visual, GLB 1.0 2.6 10.6 1 ms 24.8 0.3 2.8 0.3 42.4
Visual, OBJ 1.1 3.0 10.8 1 ms 25.4 10.8 2.9 0.3 54.3
Board Repo: OLIMEX/ESP32-P4-DevKit
Board: ESP32-P4-DevKit_Rev_D.kicad_pcb
Folder HARDWARE / ESP32-P4-DevKit-Rev.D
Complexity 375 / 1000 (size 270, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 142, 3,494, 216
Triangles, simulation 2,292,888 in 191 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 831 MB
STEP 414 MB 951 MB
STL 115 MB 779 MB
OBJ 249 MB 1.6 GB
Visual
GLB 58 MB 1.0 GB
OBJ 178 MB 1.3 GB

1859. ESP32-P4-DevKit_Rev_D1

ESP32-P4-DevKit_Rev_D1: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 29 s. Simulation, OBJ takes 36 s. Visual, GLB takes 35 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 2.5 9.8 0.8 ms 9.8 0.4 1.5 0.3 25.3
Simulation, STEP 1.0 2.6 9.3 1 ms 9.2 6.2 1.4 0.3 30.0
Simulation, STL 1.7 3.7 11.0 0.8 ms 9.7 0.8 1.4 0.4 28.7
Simulation, OBJ 0.9 2.5 9.1 0.7 ms 9.2 12.4 1.5 0.3 35.8
Visual, GLB 0.8 2.3 8.6 0.7 ms 20.4 0.2 2.3 0.2 34.8
Visual, OBJ 0.8 2.3 8.6 0.9 ms 20.3 9.2 2.5 0.3 44.0
Board Repo: OLIMEX/ESP32-P4-DevKit
Board: ESP32-P4-DevKit_Rev_D1.kicad_pcb
Folder HARDWARE / ESP32-P4-DevKit-Rev.D1
Complexity 375 / 1000 (size 270, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 142, 3,494, 216
Triangles, simulation 2,292,888 in 191 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 841 MB
STEP 414 MB 992 MB
STL 115 MB 831 MB
OBJ 249 MB 1.6 GB
Visual
GLB 58 MB 1.0 GB
OBJ 178 MB 1.3 GB

1860. ESP32-P4-PC_Rev_B

ESP32-P4-PC_Rev_B: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 35 s. Simulation, STEP takes 44 s. Simulation, STL takes 37 s. Simulation, OBJ takes 54 s. Visual, GLB takes 56 s. Visual, OBJ takes 70 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 3.6 13.1 2 ms 14.8 0.6 1.8 0.3 35.3
Simulation, STEP 1.2 3.7 13.2 0.7 ms 15.0 8.3 1.9 0.3 43.5
Simulation, STL 1.2 3.8 13.4 0.8 ms 14.9 1.5 2.1 0.3 37.2
Simulation, OBJ 1.3 3.7 13.5 1 ms 14.8 18.1 2.0 0.3 53.5
Visual, GLB 1.3 3.6 13.0 0.8 ms 33.4 0.4 4.4 0.2 56.4
Visual, OBJ 1.2 3.7 13.3 0.8 ms 34.4 11.9 5.0 0.3 69.8
Board Repo: OLIMEX/ESP32-P4-PC
Board: ESP32-P4-PC_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-P4-PC-Rev.B
Complexity 408 / 1000 (size 293, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 312, 5,090, 549
Triangles, simulation 4,020,402 in 316 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 142 MB 1.3 GB
STEP 676 MB 1.6 GB
STL 201 MB 1.3 GB
OBJ 440 MB 2.7 GB
Visual
GLB 96 MB 1.5 GB
OBJ 303 MB 2.0 GB

1861. ESP32-P4-PC_Rev_C

ESP32-P4-PC_Rev_C: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 40 s. Simulation, STEP takes 49 s. Simulation, STL takes 40 s. Simulation, OBJ takes 58 s. Visual, GLB takes 61 s. Visual, OBJ takes 76 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 4.3 15.3 2 ms 15.6 0.8 2.2 0.3 39.9
Simulation, STEP 1.3 4.0 14.9 1 ms 16.5 9.4 2.2 0.4 48.8
Simulation, STL 1.5 4.0 14.5 0.7 ms 15.9 1.4 2.1 0.3 39.8
Simulation, OBJ 1.3 4.2 14.8 1.0 ms 15.7 19.0 2.1 0.3 57.6
Visual, GLB 1.3 4.0 15.0 0.9 ms 35.4 0.5 4.6 0.3 61.0
Visual, OBJ 1.5 4.1 15.1 2 ms 36.4 13.7 4.8 0.3 76.0
Board Repo: OLIMEX/ESP32-P4-PC
Board: ESP32-P4-PC_Rev_C.kicad_pcb
Folder HARDWARE / ESP32-P4-PC-Rev.C
Complexity 409 / 1000 (size 294, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 312, 5,436, 553
Triangles, simulation 4,016,618 in 316 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 142 MB 1.3 GB
STEP 671 MB 1.5 GB
STL 201 MB 1.3 GB
OBJ 439 MB 2.7 GB
Visual
GLB 95 MB 1.5 GB
OBJ 302 MB 2.0 GB

1862. ESP32-PoE_Rev_B1

ESP32-PoE_Rev_B1: stages 4 and 6 take 56% to 86% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 23 s. Visual, GLB takes 23 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.4 6.7 0.4 ms 6.5 0.2 0.7 0.2 16.2
Simulation, STEP 0.5 1.4 6.4 0.4 ms 6.2 3.9 0.7 0.2 19.4
Simulation, STL 0.5 1.4 6.4 0.6 ms 6.5 0.4 0.7 0.2 16.0
Simulation, OBJ 0.4 1.4 6.4 0.6 ms 6.3 7.3 0.7 0.2 22.7
Visual, GLB 0.4 1.3 6.3 0.6 ms 13.3 0.2 1.0 0.2 22.8
Visual, OBJ 0.4 1.4 6.6 0.9 ms 13.1 6.5 1.0 0.2 29.2
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_B1.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-B1
Complexity 294 / 1000 (size 239, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 111, 2,429, 176
Triangles, simulation 1,444,926 in 144 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 554 MB
STEP 288 MB 719 MB
STL 72 MB 540 MB
OBJ 154 MB 1.0 GB
Visual
GLB 43 MB 782 MB
OBJ 129 MB 893 MB

1863. ESP32-PoE_Rev_B2

ESP32-PoE_Rev_B2: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 17 s. Simulation, STL takes 14 s. Simulation, OBJ takes 20 s. Visual, GLB takes 21 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.4 5.4 0.6 ms 5.6 0.2 0.7 0.2 13.9
Simulation, STEP 0.4 1.4 5.2 0.4 ms 5.4 3.3 0.6 0.2 16.5
Simulation, STL 0.4 1.5 5.3 0.3 ms 5.5 0.5 0.6 0.2 14.0
Simulation, OBJ 0.4 1.4 5.2 0.3 ms 5.7 5.9 0.7 0.2 19.5
Visual, GLB 0.4 1.5 5.2 0.4 ms 12.4 0.2 1.4 0.2 21.3
Visual, OBJ 0.4 1.5 5.3 0.6 ms 12.0 5.0 1.8 0.2 26.2
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_B2.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-B2
Complexity 294 / 1000 (size 239, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 112, 2,429, 176
Triangles, simulation 1,427,864 in 144 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 545 MB
STEP 286 MB 746 MB
STL 71 MB 531 MB
OBJ 152 MB 996 MB
Visual
GLB 42 MB 811 MB
OBJ 127 MB 902 MB

1864. ESP32-PoE_Rev_C

ESP32-PoE_Rev_C: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 17 s. Simulation, OBJ takes 25 s. Visual, GLB takes 26 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 6.3 1 ms 6.5 0.2 0.8 0.3 16.2
Simulation, STEP 0.4 1.8 6.5 0.6 ms 6.3 3.9 0.8 0.3 20.0
Simulation, STL 0.4 1.8 6.6 0.9 ms 6.6 0.5 0.8 0.3 17.0
Simulation, OBJ 0.5 1.8 7.1 0.6 ms 6.6 7.4 0.9 0.2 24.5
Visual, GLB 0.4 1.9 6.3 0.6 ms 15.2 0.2 2.1 0.3 26.4
Visual, OBJ 0.5 1.8 6.6 0.7 ms 14.6 6.1 2.1 0.3 31.8
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_C.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-C
Complexity 294 / 1000 (size 239, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 111, 2,500, 173
Triangles, simulation 1,413,496 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 50 MB 524 MB
STEP 284 MB 716 MB
STL 71 MB 563 MB
OBJ 151 MB 979 MB
Visual
GLB 42 MB 787 MB
OBJ 126 MB 928 MB

1865. ESP32-PoE_Rev_C

ESP32-PoE_Rev_C: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 23 s. Simulation, STL takes 20 s. Simulation, OBJ takes 28 s. Visual, GLB takes 30 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.0 7.2 0.6 ms 7.3 0.3 0.7 0.3 18.5
Simulation, STEP 0.6 1.9 7.1 0.7 ms 7.7 4.8 1.0 0.3 23.3
Simulation, STL 0.6 2.2 8.1 0.7 ms 7.9 0.5 0.8 0.3 20.4
Simulation, OBJ 0.5 2.0 7.5 0.9 ms 7.7 9.1 0.9 0.3 28.1
Visual, GLB 0.6 2.1 7.3 0.7 ms 17.3 0.2 2.2 0.3 29.9
Visual, OBJ 0.6 2.0 7.4 0.7 ms 15.9 7.7 2.3 0.3 36.3
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_C.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-C1
Complexity 284 / 1000 (size 239, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 111, 2,500, 173
Triangles, simulation 1,379,052 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 49 MB 574 MB
STEP 274 MB 672 MB
STL 69 MB 578 MB
OBJ 147 MB 981 MB
Visual
GLB 41 MB 783 MB
OBJ 125 MB 908 MB

1866. ESP32-PoE_Rev_D

ESP32-PoE_Rev_D: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 21 s. Simulation, STL takes 18 s. Simulation, OBJ takes 26 s. Visual, GLB takes 28 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.8 7.4 0.5 ms 6.1 0.2 0.9 0.3 17.4
Simulation, STEP 0.6 1.7 7.0 0.5 ms 6.1 4.4 1.0 0.3 21.2
Simulation, STL 0.7 1.7 7.3 0.6 ms 6.2 0.5 0.9 0.3 17.6
Simulation, OBJ 0.6 1.8 7.2 0.7 ms 6.3 9.2 0.9 0.2 26.2
Visual, GLB 0.5 1.7 7.2 0.8 ms 16.5 0.2 1.8 0.3 28.3
Visual, OBJ 0.5 1.7 7.1 0.7 ms 16.0 7.8 2.1 0.3 35.5
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_D.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-D
Complexity 307 / 1000 (size 242, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 117, 2,882, 234
Triangles, simulation 1,515,032 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 54 MB 653 MB
STEP 292 MB 748 MB
STL 76 MB 640 MB
OBJ 161 MB 1.1 GB
Visual
GLB 45 MB 798 MB
OBJ 137 MB 1.0 GB

1867. ESP32-PoE_Rev_E

ESP32-PoE_Rev_E: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 23 s. Visual, GLB takes 26 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 6.6 1 ms 6.1 0.3 0.8 0.3 16.2
Simulation, STEP 0.5 1.6 6.5 0.8 ms 6.0 4.0 0.8 0.3 19.6
Simulation, STL 0.5 1.5 6.6 1 ms 6.0 0.5 0.9 0.3 16.2
Simulation, OBJ 0.4 1.5 6.8 0.9 ms 6.1 7.5 0.8 0.3 23.4
Visual, GLB 0.5 1.6 6.3 0.7 ms 15.5 0.3 2.0 0.3 26.3
Visual, OBJ 0.5 1.6 6.6 0.8 ms 15.1 6.2 2.1 0.3 32.3
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_E.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-E
Complexity 308 / 1000 (size 243, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 118, 2,894, 234
Triangles, simulation 1,515,626 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 54 MB 670 MB
STEP 292 MB 760 MB
STL 76 MB 661 MB
OBJ 162 MB 1.1 GB
Visual
GLB 45 MB 826 MB
OBJ 137 MB 949 MB

1868. ESP32-PoE_Rev_G1

ESP32-PoE_Rev_G1: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 23 s. Visual, GLB takes 25 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.4 0.6 ms 5.5 0.2 0.8 0.2 15.1
Simulation, STEP 0.5 1.5 6.5 0.6 ms 5.7 3.9 0.8 0.2 19.0
Simulation, STL 0.5 1.6 6.3 0.7 ms 5.9 0.6 0.8 0.3 16.1
Simulation, OBJ 0.5 1.5 6.3 0.6 ms 5.6 8.5 0.8 0.2 23.5
Visual, GLB 0.6 1.5 6.6 0.5 ms 14.6 0.2 1.6 0.2 25.3
Visual, OBJ 0.5 1.5 6.5 0.9 ms 14.4 6.9 1.8 0.2 31.8
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_G1.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-G1
Complexity 297 / 1000 (size 242, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 120, 2,717, 212
Triangles, simulation 1,477,504 in 135 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 53 MB 634 MB
STEP 287 MB 744 MB
STL 74 MB 642 MB
OBJ 158 MB 1.0 GB
Visual
GLB 45 MB 783 MB
OBJ 137 MB 982 MB

1869. ESP32-PoE_Rev_I

ESP32-PoE_Rev_I: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 27 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.9 7.1 0.6 ms 7.0 0.3 1.0 0.3 18.2
Simulation, STEP 0.6 1.8 7.0 0.5 ms 7.0 4.8 0.9 0.2 22.3
Simulation, STL 0.6 2.0 7.0 0.6 ms 7.0 0.5 1.0 0.2 18.3
Simulation, OBJ 0.6 1.9 6.8 0.6 ms 6.8 10.0 1.0 0.2 27.5
Visual, GLB 0.6 1.9 7.0 0.6 ms 15.1 0.2 1.3 0.2 26.3
Visual, OBJ 0.6 1.8 6.8 0.7 ms 15.1 7.6 1.3 0.2 33.4
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_I.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-I
Complexity 324 / 1000 (size 259, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 123, 2,830, 219
Triangles, simulation 1,907,268 in 138 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 67 MB 694 MB
STEP 306 MB 846 MB
STL 95 MB 691 MB
OBJ 204 MB 1.3 GB
Visual
GLB 48 MB 859 MB
OBJ 147 MB 1.1 GB

1870. ESP32-PoE_Rev_J

ESP32-PoE_Rev_J: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 27 s. Visual, GLB takes 29 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.0 6.4 0.6 ms 7.0 0.3 1.0 0.3 17.5
Simulation, STEP 0.5 2.1 6.6 0.7 ms 6.9 4.3 0.9 0.2 21.6
Simulation, STL 0.5 1.7 6.5 0.6 ms 6.9 0.6 0.9 0.3 17.5
Simulation, OBJ 0.6 2.1 6.7 0.9 ms 7.0 9.7 0.9 0.3 27.3
Visual, GLB 0.6 1.8 6.7 0.8 ms 17.0 0.2 2.1 0.3 28.7
Visual, OBJ 0.6 2.0 6.5 0.7 ms 17.5 7.1 2.4 0.3 36.4
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_J.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-J
Complexity 323 / 1000 (size 258, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 126, 2,532, 219
Triangles, simulation 2,002,088 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 687 MB
STEP 310 MB 840 MB
STL 100 MB 708 MB
OBJ 214 MB 1.4 GB
Visual
GLB 48 MB 854 MB
OBJ 147 MB 1.1 GB

1871. ESP32-PoE_Rev_K

ESP32-PoE_Rev_K: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 23 s. Simulation, STL takes 19 s. Simulation, OBJ takes 29 s. Visual, GLB takes 30 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.1 7.1 0.8 ms 7.3 0.3 1.0 0.3 18.8
Simulation, STEP 0.7 2.0 6.8 0.9 ms 7.2 4.8 1.0 0.3 22.8
Simulation, STL 0.6 2.0 7.0 0.6 ms 7.3 0.6 0.9 0.2 18.7
Simulation, OBJ 0.5 2.0 7.1 0.7 ms 7.3 10.6 1.0 0.3 28.8
Visual, GLB 0.5 2.2 7.2 0.8 ms 17.4 0.2 2.0 0.2 29.8
Visual, OBJ 0.6 2.0 6.6 0.9 ms 17.6 6.7 2.3 0.3 36.2
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_K.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-K
Complexity 323 / 1000 (size 258, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 128, 2,562, 219
Triangles, simulation 2,011,184 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 782 MB
STEP 312 MB 870 MB
STL 101 MB 734 MB
OBJ 215 MB 1.4 GB
Visual
GLB 49 MB 877 MB
OBJ 148 MB 1.1 GB

1872. ESP32-PoE_Rev_L

ESP32-PoE_Rev_L: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 20 s. Simulation, OBJ takes 31 s. Visual, GLB takes 31 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.3 7.8 0.7 ms 7.9 0.3 1.1 0.3 20.4
Simulation, STEP 0.7 2.2 7.8 0.6 ms 7.8 5.3 1.1 0.3 25.1
Simulation, STL 0.7 2.3 7.6 0.6 ms 7.8 0.6 1.0 0.3 20.3
Simulation, OBJ 0.7 2.2 7.7 0.6 ms 7.8 11.5 1.1 0.3 31.3
Visual, GLB 0.7 2.2 7.7 0.6 ms 17.8 0.2 1.8 0.2 30.6
Visual, OBJ 0.7 2.2 7.7 0.6 ms 18.1 8.5 1.8 0.3 39.3
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_L.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-L
Complexity 323 / 1000 (size 258, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 128, 2,574, 221
Triangles, simulation 2,018,962 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 669 MB
STEP 313 MB 857 MB
STL 101 MB 677 MB
OBJ 216 MB 1.4 GB
Visual
GLB 49 MB 864 MB
OBJ 149 MB 1.1 GB

1873. ESP32-PoE_Rev_L1

ESP32-PoE_Rev_L1: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 30 s. Visual, GLB takes 30 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.1 7.4 0.6 ms 7.4 0.3 1.0 0.2 19.2
Simulation, STEP 0.7 2.1 7.3 0.6 ms 7.3 5.0 1.0 0.3 23.7
Simulation, STL 0.7 2.3 7.6 0.6 ms 7.4 0.6 0.9 0.3 19.8
Simulation, OBJ 0.7 2.0 7.5 0.6 ms 7.3 11.4 1.0 0.3 30.2
Visual, GLB 0.7 2.2 7.6 0.6 ms 17.3 0.3 2.0 0.3 30.4
Visual, OBJ 0.7 2.0 7.2 0.6 ms 16.6 8.2 2.2 0.3 37.2
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_L1.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-L1
Complexity 323 / 1000 (size 258, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 128, 2,574, 221
Triangles, simulation 2,024,004 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 673 MB
STEP 314 MB 826 MB
STL 101 MB 703 MB
OBJ 216 MB 1.4 GB
Visual
GLB 49 MB 860 MB
OBJ 149 MB 1.1 GB

1874. ESP32-PoE_Rev_M

ESP32-PoE_Rev_M: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 28 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.0 6.8 0.6 ms 6.9 0.3 1.0 0.3 18.0
Simulation, STEP 0.7 2.0 6.7 0.8 ms 6.7 4.6 1.0 0.3 22.1
Simulation, STL 0.7 2.1 6.9 0.5 ms 6.9 0.5 0.9 0.2 18.3
Simulation, OBJ 0.8 2.0 6.8 0.6 ms 6.7 10.4 1.0 0.3 28.0
Visual, GLB 0.8 2.1 6.8 0.6 ms 14.8 0.2 1.3 0.2 26.2
Visual, OBJ 0.7 2.0 6.9 0.7 ms 14.8 7.2 1.2 0.2 33.0
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_M.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-M
Complexity 368 / 1000 (size 258, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 127, 2,528, 233
Triangles, simulation 1,971,162 in 133 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 722 MB
STEP 335 MB 887 MB
STL 99 MB 694 MB
OBJ 211 MB 1.4 GB
Visual
GLB 47 MB 874 MB
OBJ 144 MB 1.1 GB

1875. ESP32-PoE_Rev_M1

ESP32-PoE_Rev_M1: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 17 s. Simulation, OBJ takes 24 s. Visual, GLB takes 25 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 1.7 5.7 0.7 ms 6.4 0.3 0.9 0.2 16.0
Simulation, STEP 0.6 1.7 5.5 0.6 ms 6.2 4.1 0.9 0.2 19.3
Simulation, STL 0.7 1.8 5.8 0.8 ms 6.5 0.6 1.0 0.3 16.6
Simulation, OBJ 0.6 1.8 5.7 1 ms 6.5 8.4 0.8 0.2 24.0
Visual, GLB 0.6 1.9 5.7 0.6 ms 14.9 0.2 1.9 0.2 25.4
Visual, OBJ 0.6 1.6 5.6 0.6 ms 14.2 6.0 1.9 0.2 30.1
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_M1.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-M1
Complexity 368 / 1000 (size 258, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 127, 2,528, 233
Triangles, simulation 1,971,162 in 133 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 741 MB
STEP 335 MB 835 MB
STL 99 MB 745 MB
OBJ 211 MB 1.4 GB
Visual
GLB 47 MB 848 MB
OBJ 144 MB 1.1 GB

1876. ESP32-PoE_Rev_M2

ESP32-PoE_Rev_M2: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 21 s. Simulation, OBJ takes 31 s. Visual, GLB takes 31 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.2 7.6 0.6 ms 7.7 0.3 1.0 0.3 20.1
Simulation, STEP 0.8 2.3 7.1 0.6 ms 7.7 5.2 1.0 0.3 24.4
Simulation, STL 0.8 2.4 7.7 0.6 ms 8.0 0.7 1.0 0.3 20.8
Simulation, OBJ 0.9 2.1 7.4 0.9 ms 7.6 11.6 1.1 0.3 31.1
Visual, GLB 0.8 2.3 8.3 0.9 ms 17.3 0.2 1.7 0.3 31.0
Visual, OBJ 0.8 2.2 7.9 0.7 ms 17.6 8.3 2.3 0.2 39.3
Board Repo: OLIMEX/ESP32-POE
Board: ESP32-PoE_Rev_M2.kicad_pcb
Folder HARDWARE / ESP32-PoE-hardware-revision-M2
Complexity 368 / 1000 (size 258, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 128, 2,528, 233
Triangles, simulation 1,972,166 in 133 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 713 MB
STEP 335 MB 843 MB
STL 99 MB 761 MB
OBJ 211 MB 1.4 GB
Visual
GLB 47 MB 835 MB
OBJ 145 MB 1.0 GB

1877. ESP32-PoE-ISO_Rev_B

ESP32-PoE-ISO_Rev_B: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 34 s. Simulation, STL takes 28 s. Simulation, OBJ takes 39 s. Visual, GLB takes 38 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.1 9.7 2 ms 11.2 0.4 1.3 0.4 26.9
Simulation, STEP 0.8 3.0 10.4 1 ms 11.3 6.9 1.5 0.3 34.2
Simulation, STL 0.9 3.8 10.1 1 ms 10.4 1.0 1.5 0.4 28.2
Simulation, OBJ 0.8 3.2 9.1 1 ms 10.4 14.2 1.1 0.3 39.2
Visual, GLB 0.7 2.9 8.6 1 ms 22.2 0.3 2.9 0.2 37.7
Visual, OBJ 0.7 2.6 8.3 1 ms 21.5 9.5 3.0 0.3 46.0
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.B
Complexity 325 / 1000 (size 260, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 118, 2,830, 332
Triangles, simulation 2,271,626 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 817 MB
STEP 312 MB 892 MB
STL 114 MB 805 MB
OBJ 242 MB 1.5 GB
Visual
GLB 51 MB 892 MB
OBJ 157 MB 1.1 GB

1878. ESP32-PoE-ISO_Rev_C

ESP32-PoE-ISO_Rev_C: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 31 s. Visual, GLB takes 31 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.2 6.8 0.5 ms 8.0 0.4 1.0 0.3 19.3
Simulation, STEP 0.6 2.3 7.1 0.9 ms 8.1 5.0 1.0 0.2 24.2
Simulation, STL 0.7 2.4 7.1 0.4 ms 8.2 0.8 1.0 0.3 20.3
Simulation, OBJ 0.6 2.4 7.2 1 ms 7.9 11.7 1.0 0.3 31.1
Visual, GLB 0.6 2.3 7.3 0.6 ms 18.3 0.3 2.3 0.2 31.2
Visual, OBJ 0.5 2.3 6.9 0.6 ms 18.3 7.4 2.5 0.2 38.2
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_C.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.C
Complexity 336 / 1000 (size 261, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20190516)
Parts, tracks, vias 117, 2,943, 326
Triangles, simulation 2,260,980 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 840 MB
STEP 321 MB 905 MB
STL 113 MB 788 MB
OBJ 240 MB 1.5 GB
Visual
GLB 52 MB 920 MB
OBJ 159 MB 1.1 GB

1879. ESP32-PoE-ISO_Rev_D

ESP32-PoE-ISO_Rev_D: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 31 s. Visual, GLB takes 30 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.3 7.5 0.6 ms 7.6 0.4 0.9 0.3 19.9
Simulation, STEP 0.7 2.2 7.1 0.7 ms 7.8 5.0 1.0 0.3 24.0
Simulation, STL 0.6 2.2 7.5 0.5 ms 7.6 0.8 1.0 0.3 19.9
Simulation, OBJ 0.6 2.2 7.2 0.5 ms 7.9 11.7 0.9 0.2 30.8
Visual, GLB 0.6 2.4 7.2 0.5 ms 17.4 0.2 1.8 0.3 29.9
Visual, OBJ 0.6 2.2 7.5 0.5 ms 17.5 8.1 2.0 0.3 38.2
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_D.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.D
Complexity 336 / 1000 (size 261, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20191123)
Parts, tracks, vias 118, 2,957, 326
Triangles, simulation 2,205,456 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 77 MB 799 MB
STEP 311 MB 874 MB
STL 110 MB 787 MB
OBJ 234 MB 1.5 GB
Visual
GLB 51 MB 894 MB
OBJ 156 MB 1.1 GB

1880. ESP32-PoE-ISO_Rev_G1

ESP32-PoE-ISO_Rev_G1: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 36 s. Visual, GLB takes 39 s. Visual, OBJ takes 51 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.6 9.2 0.9 ms 11.0 0.4 1.2 0.3 25.4
Simulation, STEP 0.8 2.7 8.4 0.5 ms 10.0 5.8 1.2 0.3 29.1
Simulation, STL 0.7 2.7 8.3 0.6 ms 9.7 1.0 1.1 0.3 23.8
Simulation, OBJ 0.7 2.7 8.2 1.0 ms 9.6 13.7 1.0 0.3 36.3
Visual, GLB 0.7 2.7 8.4 0.6 ms 23.4 0.3 3.2 0.3 38.9
Visual, OBJ 0.7 2.9 9.2 0.8 ms 23.6 10.6 3.4 0.3 50.7
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_G1.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.G1
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 122, 3,042, 331
Triangles, simulation 2,274,334 in 138 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 818 MB
STEP 318 MB 887 MB
STL 114 MB 742 MB
OBJ 242 MB 1.6 GB
Visual
GLB 52 MB 934 MB
OBJ 160 MB 1.1 GB

1881. ESP32-PoE-ISO_Rev_H

ESP32-PoE-ISO_Rev_H: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 21 s. Simulation, STL takes 17 s. Simulation, OBJ takes 26 s. Visual, GLB takes 28 s. Visual, OBJ takes 35 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.9 6.1 0.4 ms 6.9 0.3 0.8 0.2 16.8
Simulation, STEP 0.5 2.0 6.0 0.3 ms 7.0 4.2 0.9 0.2 20.8
Simulation, STL 0.6 1.9 5.9 0.5 ms 7.4 0.6 0.9 0.2 17.4
Simulation, OBJ 0.5 1.9 5.9 0.6 ms 7.3 9.4 0.9 0.2 26.1
Visual, GLB 0.5 2.0 6.0 0.3 ms 16.5 0.2 2.4 0.2 27.9
Visual, OBJ 0.5 2.0 6.1 0.5 ms 16.8 6.4 2.4 0.2 34.5
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_H.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.H
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 123, 3,089, 329
Triangles, simulation 2,272,098 in 138 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 801 MB
STEP 318 MB 881 MB
STL 114 MB 787 MB
OBJ 242 MB 1.6 GB
Visual
GLB 52 MB 945 MB
OBJ 160 MB 1.1 GB

1882. ESP32-PoE-ISO_Rev_I

ESP32-PoE-ISO_Rev_I: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 32 s. Visual, GLB takes 30 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.3 7.2 0.4 ms 7.9 0.4 1.0 0.3 19.6
Simulation, STEP 0.6 2.3 7.2 0.4 ms 8.0 5.0 1.0 0.2 24.4
Simulation, STL 0.6 2.2 7.3 0.4 ms 8.1 0.6 1.0 0.2 20.1
Simulation, OBJ 0.6 2.3 7.5 0.6 ms 8.0 12.0 1.0 0.3 31.7
Visual, GLB 0.6 2.3 7.2 0.6 ms 18.2 0.3 1.7 0.2 30.4
Visual, OBJ 0.7 2.4 7.4 0.5 ms 17.9 7.9 1.7 0.3 38.3
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_I.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.I
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 123, 3,108, 329
Triangles, simulation 2,285,522 in 138 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 800 MB
STEP 321 MB 908 MB
STL 114 MB 773 MB
OBJ 244 MB 1.5 GB
Visual
GLB 53 MB 925 MB
OBJ 161 MB 1.1 GB

1883. ESP32-PoE-ISO_Rev_J

ESP32-PoE-ISO_Rev_J: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 32 s. Visual, GLB takes 32 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.5 7.7 0.4 ms 8.8 0.4 1.0 0.2 21.3
Simulation, STEP 0.7 2.3 7.8 0.6 ms 8.8 5.3 1.1 0.3 26.3
Simulation, STL 0.7 2.2 7.7 0.6 ms 8.7 0.6 1.0 0.3 21.3
Simulation, OBJ 0.6 2.0 7.6 0.6 ms 8.9 11.9 1.0 0.2 32.3
Visual, GLB 0.6 2.6 7.2 0.4 ms 19.3 0.2 2.1 0.3 32.2
Visual, OBJ 0.7 2.3 7.2 0.5 ms 18.5 7.4 2.3 0.3 38.7
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_J.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.J
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 126, 3,029, 319
Triangles, simulation 2,413,834 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 84 MB 765 MB
STEP 345 MB 965 MB
STL 121 MB 762 MB
OBJ 257 MB 1.6 GB
Visual
GLB 56 MB 1.0 GB
OBJ 171 MB 1.2 GB

1884. ESP32-PoE-ISO_Rev_K

ESP32-PoE-ISO_Rev_K: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 23 s. Simulation, OBJ takes 34 s. Visual, GLB takes 36 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.4 7.7 0.7 ms 9.3 0.4 1.1 0.3 22.0
Simulation, STEP 0.7 2.4 7.5 0.3 ms 9.6 5.6 1.1 0.3 27.3
Simulation, STL 0.8 2.6 8.0 0.4 ms 9.6 0.8 1.1 0.3 23.1
Simulation, OBJ 0.7 2.4 7.7 0.5 ms 9.7 12.1 1.1 0.3 33.9
Visual, GLB 0.7 2.4 7.5 0.4 ms 21.5 0.3 3.2 0.3 35.9
Visual, OBJ 0.8 2.4 7.9 0.9 ms 21.1 8.2 3.2 0.3 43.8
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_K.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.K
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 128, 3,057, 320
Triangles, simulation 2,423,136 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 85 MB 782 MB
STEP 346 MB 978 MB
STL 121 MB 780 MB
OBJ 258 MB 1.6 GB
Visual
GLB 56 MB 982 MB
OBJ 172 MB 1.2 GB

1885. ESP32-PoE-ISO_Rev_L

ESP32-PoE-ISO_Rev_L: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 42 s. Visual, GLB takes 40 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.9 9.0 0.7 ms 10.7 0.4 1.3 0.3 25.3
Simulation, STEP 0.8 2.6 8.9 0.4 ms 10.9 6.6 1.1 0.3 31.3
Simulation, STL 0.8 2.7 8.8 0.7 ms 11.6 1.0 1.3 0.3 26.7
Simulation, OBJ 0.9 2.9 9.3 0.5 ms 11.4 15.8 1.4 0.3 42.0
Visual, GLB 0.9 2.9 8.6 0.5 ms 24.2 0.3 3.1 0.3 40.3
Visual, OBJ 0.9 2.8 8.5 0.4 ms 24.6 10.1 3.2 0.3 50.4
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_L.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.L
Complexity 337 / 1000 (size 262, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 128, 3,103, 321
Triangles, simulation 2,428,460 in 139 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 85 MB 755 MB
STEP 347 MB 987 MB
STL 121 MB 805 MB
OBJ 259 MB 1.7 GB
Visual
GLB 56 MB 994 MB
OBJ 172 MB 1.2 GB

1886. ESP32-PoE-ISO_Rev_M

ESP32-PoE-ISO_Rev_M: stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 38 s. Visual, GLB takes 38 s. Visual, OBJ takes 52 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 2.7 8.1 0.6 ms 9.6 0.4 1.1 0.3 23.2
Simulation, STEP 1.0 2.7 8.1 0.8 ms 9.5 5.8 1.2 0.3 28.6
Simulation, STL 1.0 2.7 8.0 0.6 ms 9.6 0.9 1.2 0.3 23.7
Simulation, OBJ 1.0 2.7 8.2 0.4 ms 9.8 15.0 1.4 0.3 38.5
Visual, GLB 1.1 2.8 8.3 0.6 ms 22.2 0.3 3.1 0.3 38.1
Visual, OBJ 1.1 3.0 8.7 0.9 ms 25.0 10.2 3.1 0.3 51.5
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_M.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.M
Complexity 389 / 1000 (size 264, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 125, 3,737, 325
Triangles, simulation 2,278,208 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 861 MB
STEP 342 MB 907 MB
STL 114 MB 874 MB
OBJ 244 MB 1.5 GB
Visual
GLB 53 MB 959 MB
OBJ 162 MB 1.1 GB

1887. ESP32-PoE-ISO_Rev_M1

ESP32-PoE-ISO_Rev_M1: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 37 s. Visual, GLB takes 36 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 3.0 8.7 0.6 ms 9.7 0.4 1.2 0.3 24.5
Simulation, STEP 1.3 2.5 8.7 0.5 ms 9.8 6.3 1.2 0.4 30.1
Simulation, STL 1.1 2.7 8.8 0.6 ms 9.7 0.7 1.2 0.3 24.6
Simulation, OBJ 1.0 2.7 8.8 0.5 ms 9.3 14.0 1.2 0.3 37.3
Visual, GLB 1.2 2.6 8.5 0.4 ms 21.0 0.2 1.9 0.3 35.7
Visual, OBJ 1.1 2.9 8.4 0.7 ms 20.7 9.4 2.1 0.3 44.9
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_M1.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.M1
Complexity 389 / 1000 (size 264, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 126, 3,737, 325
Triangles, simulation 2,279,540 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 823 MB
STEP 343 MB 902 MB
STL 114 MB 854 MB
OBJ 244 MB 1.6 GB
Visual
GLB 53 MB 953 MB
OBJ 163 MB 1.2 GB

1888. ESP32-PoE-ISO_Rev_N

ESP32-PoE-ISO_Rev_N: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 29 s. Simulation, STL takes 25 s. Simulation, OBJ takes 39 s. Visual, GLB takes 37 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 2.7 9.0 1 ms 9.8 0.4 1.2 0.3 24.5
Simulation, STEP 1.0 2.7 8.4 0.9 ms 9.5 6.0 1.3 0.3 29.0
Simulation, STL 1.0 2.8 8.7 1 ms 10.1 1.0 1.4 0.4 25.4
Simulation, OBJ 1.0 2.9 9.1 0.9 ms 9.7 14.4 1.2 0.3 38.7
Visual, GLB 1.1 2.7 8.4 0.9 ms 22.2 0.3 2.5 0.3 37.4
Visual, OBJ 1.0 2.6 8.3 0.9 ms 22.3 9.4 2.5 0.3 46.4
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_N.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.N
Complexity 389 / 1000 (size 264, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 127, 3,683, 326
Triangles, simulation 2,294,172 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 860 MB
STEP 347 MB 917 MB
STL 115 MB 844 MB
OBJ 246 MB 1.6 GB
Visual
GLB 53 MB 955 MB
OBJ 164 MB 1.1 GB

1889. ESP32-PoE-ISO_Rev_N1

ESP32-PoE-ISO_Rev_N1: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 28 s. Simulation, STL takes 23 s. Simulation, OBJ takes 36 s. Visual, GLB takes 36 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 2.6 8.1 0.8 ms 9.4 0.4 1.1 0.3 22.9
Simulation, STEP 1.0 2.7 8.3 0.7 ms 9.2 5.8 1.2 0.3 28.5
Simulation, STL 1.1 2.7 8.3 0.8 ms 9.2 0.7 1.1 0.3 23.3
Simulation, OBJ 1.0 2.7 8.2 0.9 ms 9.4 13.7 1.1 0.3 36.4
Visual, GLB 1.0 2.6 8.3 0.9 ms 21.1 0.3 2.2 0.3 35.8
Visual, OBJ 1.0 2.6 8.2 0.9 ms 21.1 9.2 2.4 0.3 45.0
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_N1.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.N1
Complexity 389 / 1000 (size 264, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 128, 3,683, 326
Triangles, simulation 2,295,698 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 838 MB
STEP 348 MB 949 MB
STL 115 MB 791 MB
OBJ 246 MB 1.6 GB
Visual
GLB 53 MB 959 MB
OBJ 164 MB 1.2 GB

1890. ESP32-PoE-ISO_Rev_O

ESP32-PoE-ISO_Rev_O: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 33 s. Visual, GLB takes 32 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.2 7.4 1.0 ms 8.2 0.3 1.0 0.2 20.3
Simulation, STEP 0.9 2.3 7.5 0.7 ms 8.3 5.3 1.0 0.2 25.7
Simulation, STL 0.9 2.4 7.7 0.7 ms 8.5 0.7 1.0 0.3 21.4
Simulation, OBJ 0.8 2.5 7.5 0.7 ms 8.8 12.4 1.0 0.3 33.2
Visual, GLB 1.0 2.4 7.4 0.8 ms 19.0 0.3 1.8 0.3 32.1
Visual, OBJ 1.1 2.5 7.9 0.8 ms 18.6 8.8 1.6 0.3 40.7
Board Repo: OLIMEX/ESP32-POE-ISO
Board: ESP32-PoE-ISO_Rev_O.kicad_pcb
Folder HARDWARE / ESP32-PoE-ISO-Rev.O
Complexity 379 / 1000 (size 264, features 115)
KESE features through vias, slotted holes,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 129, 3,704, 322
Triangles, simulation 2,304,726 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 806 MB
STEP 353 MB 940 MB
STL 115 MB 789 MB
OBJ 247 MB 1.6 GB
Visual
GLB 54 MB 990 MB
OBJ 167 MB 1.2 GB

1891. ESP32-PoE2_Rev_B

ESP32-PoE2_Rev_B: stages 4 and 6 take 55% to 82% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 35 s. Visual, GLB takes 33 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.5 8.8 0.8 ms 11.1 0.4 1.0 0.3 25.0
Simulation, STEP 0.8 2.5 9.2 0.8 ms 11.0 5.2 1.0 0.3 30.0
Simulation, STL 0.8 2.4 8.8 1 ms 10.8 0.7 1.1 0.3 24.9
Simulation, OBJ 0.8 2.4 8.4 0.8 ms 10.9 11.4 1.0 0.3 35.3
Visual, GLB 0.7 2.3 8.4 0.7 ms 18.4 0.2 2.4 0.3 32.7
Visual, OBJ 0.7 2.4 9.0 0.9 ms 18.0 7.9 2.8 0.3 41.1
Board Repo: OLIMEX/ESP32-POE2
Board: ESP32-PoE2_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-PoE2_Rev_B
Complexity 380 / 1000 (size 260, features 120)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 142, 2,198, 390
Triangles, simulation 2,336,490 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 780 MB
STEP 346 MB 1.0 GB
STL 117 MB 823 MB
OBJ 250 MB 1.6 GB
Visual
GLB 54 MB 974 MB
OBJ 167 MB 1.2 GB

1892. ESP32-PRO_Rev_B

ESP32-PRO_Rev_B: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 26 s. Visual, GLB takes 29 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.1 7.4 1.0 ms 7.1 0.3 0.8 0.3 18.6
Simulation, STEP 0.5 2.0 7.2 0.9 ms 6.8 4.2 0.8 0.3 21.8
Simulation, STL 0.5 1.7 7.1 0.6 ms 6.9 0.5 0.9 0.3 17.9
Simulation, OBJ 0.5 1.8 7.3 1 ms 6.9 8.4 0.8 0.2 26.0
Visual, GLB 0.5 1.9 7.3 0.7 ms 17.0 0.2 2.0 0.2 29.2
Visual, OBJ 0.5 1.9 7.4 0.9 ms 17.3 6.9 2.2 0.3 36.5
Board Repo: OLIMEX/ESP32-PRO
Board: ESP32-PRO_Rev_B.kicad_pcb
Folder HARDWARE / REV-B
Complexity 308 / 1000 (size 253, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 123, 3,549, 327
Triangles, simulation 1,642,858 in 123 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 676 MB
STEP 310 MB 815 MB
STL 82 MB 676 MB
OBJ 176 MB 1.2 GB
Visual
GLB 50 MB 865 MB
OBJ 151 MB 1.0 GB

1893. ESP32-PRO_Rev_B1

ESP32-PRO_Rev_B1: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 22 s. Simulation, STL takes 19 s. Simulation, OBJ takes 26 s. Visual, GLB takes 30 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.0 7.7 0.8 ms 7.2 0.3 0.8 0.3 18.7
Simulation, STEP 0.5 1.9 7.0 0.7 ms 7.0 4.2 0.7 0.3 21.7
Simulation, STL 0.6 2.0 7.3 0.7 ms 7.1 0.5 0.8 0.2 18.5
Simulation, OBJ 0.5 2.0 7.5 0.9 ms 7.2 8.0 0.8 0.3 26.3
Visual, GLB 0.6 1.9 7.4 0.6 ms 16.9 0.3 2.2 0.3 29.5
Visual, OBJ 0.5 2.1 7.3 0.6 ms 16.2 7.1 2.3 0.2 35.7
Board Repo: OLIMEX/ESP32-PRO
Board: ESP32-PRO_Rev_B1.kicad_pcb
Folder HARDWARE / REV-B1
Complexity 308 / 1000 (size 253, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 123, 3,548, 327
Triangles, simulation 1,641,446 in 123 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 699 MB
STEP 307 MB 791 MB
STL 82 MB 701 MB
OBJ 176 MB 1.2 GB
Visual
GLB 50 MB 849 MB
OBJ 151 MB 1.1 GB

1894. ESP32-S2-DevKit-Lipo_Rev_B1

ESP32-S2-DevKit-Lipo_Rev_B1: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 23 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 6.5 0.5 ms 5.1 0.2 0.6 0.2 14.8
Simulation, STEP 0.5 1.5 6.4 0.5 ms 5.1 3.9 0.7 0.2 18.4
Simulation, STL 0.5 1.6 6.5 0.5 ms 5.1 0.4 0.7 0.2 15.0
Simulation, OBJ 0.5 1.7 6.4 0.6 ms 5.1 7.9 0.6 0.3 22.6
Visual, GLB 0.5 1.5 6.4 0.5 ms 12.7 0.2 1.3 0.2 22.8
Visual, OBJ 0.5 1.6 6.5 0.5 ms 13.0 6.5 1.6 0.2 29.8
Board Repo: OLIMEX/ESP32-S2-DevKit-LiPo
Board: ESP32-S2-DevKit-Lipo_Rev_B1.kicad_pcb
Folder HARDWARE / ESP32-S2-DevKit-Lipo-Rev.B1
Complexity 253 / 1000 (size 188, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 76, 1,472, 164
Triangles, simulation 1,273,136 in 91 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 575 MB
STEP 244 MB 643 MB
STL 64 MB 561 MB
OBJ 135 MB 905 MB
Visual
GLB 39 MB 787 MB
OBJ 115 MB 847 MB

1895. ESP32-S2-DevKit-USB_Rev_B

ESP32-S2-DevKit-USB_Rev_B: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 21 s. Visual, OBJ takes 28 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.3 5.6 0.4 ms 4.8 0.2 0.6 0.3 13.2
Simulation, STEP 0.4 1.4 5.6 0.5 ms 4.8 3.4 0.6 0.2 16.4
Simulation, STL 0.4 1.4 5.6 0.5 ms 4.7 0.4 0.6 0.2 13.4
Simulation, OBJ 0.4 1.4 5.6 0.3 ms 4.9 6.9 0.6 0.2 19.9
Visual, GLB 0.4 1.3 5.7 0.7 ms 11.9 0.2 1.2 0.3 21.0
Visual, OBJ 0.4 1.4 6.0 0.4 ms 11.1 6.9 1.6 0.3 27.6
Board Repo: OLIMEX/ESP32-S2-DevKit-LiPo-USB
Board: ESP32-S2-DevKit-USB_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-S2-DevKit-USB-Rev-B
Complexity 250 / 1000 (size 185, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 66, 1,299, 156
Triangles, simulation 1,257,842 in 78 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 605 MB
STEP 241 MB 667 MB
STL 63 MB 589 MB
OBJ 133 MB 868 MB
Visual
GLB 38 MB 772 MB
OBJ 113 MB 840 MB

1896. ESP32-S3-DevKit-LiPo_Rev_B_DIMM

Stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 20 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.4 5.8 0.3 ms 4.2 0.2 0.6 0.3 13.1
Simulation, STEP 0.5 1.5 5.8 0.7 ms 4.1 3.3 0.5 0.2 15.8
Simulation, STL 0.5 1.4 5.8 0.6 ms 4.3 0.3 0.5 0.2 13.1
Simulation, OBJ 0.5 1.4 5.8 0.4 ms 4.3 6.7 0.6 0.3 19.6
Visual, GLB 0.5 1.4 6.0 0.3 ms 10.4 0.2 0.9 0.2 19.6
Visual, OBJ 0.5 1.5 6.1 0.3 ms 10.4 5.6 1.0 0.2 25.3
Board Repo: OLIMEX/ESP32-S3-DevKit-LiPo
Board: ESP32-S3-DevKit-LiPo_Rev_B_DIMM.kicad_pcb
Folder HARDWARE / Dimensions
Complexity 237 / 1000 (size 182, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 54, 1,324, 128
Triangles, simulation 1,184,962 in 82 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 42 MB 562 MB
STEP 233 MB 633 MB
STL 59 MB 542 MB
OBJ 125 MB 851 MB
Visual
GLB 35 MB 769 MB
OBJ 106 MB 801 MB

1897. ESP32-S3-DevKit-LiPo_Rev_B

ESP32-S3-DevKit-LiPo_Rev_B: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 22 s. Visual, OBJ takes 28 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.5 0.3 ms 4.6 0.2 0.6 0.3 14.1
Simulation, STEP 0.5 1.5 6.5 0.3 ms 4.5 3.7 0.7 0.3 17.6
Simulation, STL 0.5 1.6 6.4 0.4 ms 4.6 0.3 0.6 0.3 14.3
Simulation, OBJ 0.5 1.5 6.4 0.4 ms 4.7 7.4 0.6 0.2 21.4
Visual, GLB 0.5 1.6 6.5 0.8 ms 11.4 0.2 1.3 0.2 21.8
Visual, OBJ 0.5 1.6 6.5 0.5 ms 11.4 6.3 1.6 0.3 28.0
Board Repo: OLIMEX/ESP32-S3-DevKit-LiPo
Board: ESP32-S3-DevKit-LiPo_Rev_B.kicad_pcb
Folder HARDWARE / ESP32-S3-DevKit-LiPo_Rev_B
Complexity 227 / 1000 (size 182, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 54, 1,324, 128
Triangles, simulation 1,241,654 in 82 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 551 MB
STEP 244 MB 654 MB
STL 62 MB 609 MB
OBJ 131 MB 859 MB
Visual
GLB 37 MB 710 MB
OBJ 111 MB 852 MB

1898. ESP32-SBC-FabGL_Rev_A

ESP32-SBC-FabGL_Rev_A: stages 4 and 6 take 59% to 84% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 30 s. Visual, GLB takes 31 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 9.4 0.8 ms 7.8 0.4 0.9 0.3 21.0
Simulation, STEP 0.4 1.9 9.0 1.0 ms 7.7 4.7 0.9 0.2 24.8
Simulation, STL 0.5 1.6 9.4 0.8 ms 7.4 0.7 0.9 0.2 20.8
Simulation, OBJ 0.5 1.7 9.6 0.7 ms 8.1 9.0 0.9 0.3 30.1
Visual, GLB 0.5 1.8 9.2 0.7 ms 16.3 0.3 2.1 0.2 30.5
Visual, OBJ 0.5 1.7 9.5 0.8 ms 16.6 6.8 2.0 0.3 37.5
Board Repo: OLIMEX/ESP32-SBC-FabGL
Board: ESP32-SBC-FabGL_Rev_A.kicad_pcb
Folder HARDWARE / Hardware-revision-A
Complexity 249 / 1000 (size 194, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 107, 1,402, 264
Triangles, simulation 1,738,592 in 126 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 61 MB 642 MB
STEP 313 MB 847 MB
STL 87 MB 626 MB
OBJ 184 MB 1.2 GB
Visual
GLB 49 MB 830 MB
OBJ 148 MB 1.0 GB

1899. ESP32-SBC-FabGL_Rev_B

ESP32-SBC-FabGL_Rev_B: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 31 s. Visual, GLB takes 31 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 9.4 0.6 ms 7.4 0.3 0.8 0.2 20.5
Simulation, STEP 0.5 1.7 9.6 0.8 ms 7.8 4.8 0.8 0.2 25.4
Simulation, STL 0.5 1.8 9.5 0.6 ms 7.5 0.5 0.8 0.3 20.8
Simulation, OBJ 0.5 1.9 9.3 0.8 ms 7.7 10.1 0.9 0.3 30.6
Visual, GLB 0.5 1.9 9.6 0.9 ms 15.8 0.2 2.1 0.3 30.5
Visual, OBJ 0.5 1.8 9.5 0.8 ms 15.9 8.0 2.7 0.3 38.6
Board Repo: OLIMEX/ESP32-SBC-FabGL
Board: ESP32-SBC-FabGL_Rev_B.kicad_pcb
Folder HARDWARE / Hardware-revision-B
Complexity 249 / 1000 (size 194, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 107, 1,405, 266
Triangles, simulation 1,795,894 in 123 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 63 MB 659 MB
STEP 328 MB 860 MB
STL 90 MB 672 MB
OBJ 190 MB 1.2 GB
Visual
GLB 51 MB 857 MB
OBJ 156 MB 1.1 GB

1900. Flash-e_Rev_C

Flash-e_Rev_C: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 13 s. Simulation, OBJ takes 19 s. Visual, GLB takes 17 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 4.8 0.6 ms 4.7 0.2 0.6 0.3 12.1
Simulation, STEP 0.4 1.1 4.9 0.3 ms 4.4 3.5 0.7 0.2 15.2
Simulation, STL 0.4 1.1 5.2 0.3 ms 4.6 0.3 0.7 0.3 12.6
Simulation, OBJ 0.3 1.1 5.0 0.3 ms 4.8 7.0 0.7 0.3 19.3
Visual, GLB 0.4 1.1 5.1 0.3 ms 9.1 0.1 1.1 0.3 17.2
Visual, OBJ 0.4 1.1 4.9 0.4 ms 9.2 4.5 1.2 0.3 21.6
Board Repo: OLIMEX/Flash-e
Board: Flash-e_Rev_C.kicad_pcb
Folder HARDWARE / Flash-e-Rev.C
Complexity 288 / 1000 (size 243, features 45)
KESE features through vias, filled zones,
copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 35, 1,162, 85
Triangles, simulation 1,152,680 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 40 MB 496 MB
STEP 203 MB 571 MB
STL 58 MB 487 MB
OBJ 120 MB 823 MB
Visual
GLB 27 MB 561 MB
OBJ 81 MB 631 MB

1901. FOSDEM-MUSIC-BOX_RevA

FOSDEM-MUSIC-BOX_RevA: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 7.0 s. Simulation, STL takes 5.5 s. Simulation, OBJ takes 7.7 s. Visual, GLB takes 7.8 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.1 0.7 ms 1.8 88 ms 0.3 0.2 5.3
Simulation, STEP 0.2 0.5 2.3 0.3 ms 1.7 1.7 0.3 0.2 7.0
Simulation, STL 0.2 0.5 2.1 0.3 ms 1.9 0.1 0.3 0.2 5.5
Simulation, OBJ 0.2 0.6 2.1 0.4 ms 1.8 2.5 0.3 0.2 7.7
Visual, GLB 0.2 0.5 2.2 0.3 ms 4.0 51 ms 0.6 0.2 7.8
Visual, OBJ 0.2 0.6 2.2 0.3 ms 4.0 1.7 0.6 0.3 9.5
Board Repo: OLIMEX/FOSDEM-MUSIC-BOX
Board: FOSDEM-MUSIC-BOX_RevA.kicad_pcb
Folder HARDWARE / FOSDEM-MUSIC-BOX_RevA
Complexity 195 / 1000 (size 130, features 65)
KESE features filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20191123)
Parts, tracks, vias 23, 122, 0
Triangles, simulation 568,428 in 32 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 302 MB
STEP 106 MB 347 MB
STL 28 MB 309 MB
OBJ 58 MB 427 MB
Visual
GLB 14 MB 358 MB
OBJ 40 MB 370 MB

1902. GateMateA1-EVB_Rev_A

GateMateA1-EVB_Rev_A: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 91 s. Simulation, STEP takes 2 min. Simulation, STL takes 92 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.5 9.1 38.8 2 ms 33.4 1.4 5.2 0.4 90.8
Simulation, STEP 2.6 9.3 40.4 1.0 ms 33.3 18.8 5.0 0.4 109.8
Simulation, STL 2.6 9.2 38.7 1.0 ms 33.0 3.0 5.5 0.4 92.3
Simulation, OBJ 2.5 9.1 38.8 0.9 ms 32.5 43.9 5.2 0.4 132.5
Visual, GLB 2.4 8.9 38.6 1 ms 79.8 0.8 9.6 0.3 140.5
Visual, OBJ 2.6 9.4 38.8 0.9 ms 76.6 29.4 8.7 0.4 165.8
Board Repo: OLIMEX/GateMateA1-EVB
Board: GateMateA1-EVB_Rev_A.kicad_pcb
Folder HARDWARE / GateMateA1-EVB-Rev.A
Complexity 427 / 1000 (size 302, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 267, 8,244, 1,191
Triangles, simulation 7,054,476 in 301 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 246 MB 2.0 GB
STEP 1.1 GB 2.5 GB
STL 353 MB 2.0 GB
OBJ 767 MB 4.6 GB
Visual
GLB 167 MB 2.6 GB
OBJ 537 MB 3.5 GB

1903. GateMateA1-EVB_Rev_B

GateMateA1-EVB_Rev_B: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 85 s. Simulation, STEP takes 2 min. Simulation, STL takes 85 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 8.3 36.7 1.0 ms 30.0 1.6 5.6 0.5 84.9
Simulation, STEP 2.5 8.8 37.5 1 ms 29.1 16.8 5.1 0.4 100.2
Simulation, STL 1.9 8.6 35.7 1 ms 29.2 3.4 5.4 0.5 84.7
Simulation, OBJ 1.9 8.4 37.1 3 ms 29.3 39.5 5.1 0.5 121.9
Visual, GLB 2.3 8.1 34.7 0.9 ms 75.6 0.8 9.8 0.4 131.8
Visual, OBJ 2.4 8.7 35.2 1 ms 75.5 27.3 9.5 0.3 159.0
Board Repo: OLIMEX/GateMateA1-EVB
Board: GateMateA1-EVB_Rev_B.kicad_pcb
Folder HARDWARE / GateMateA1-EVB-Rev.B
Complexity 428 / 1000 (size 303, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 268, 9,050, 1,267
Triangles, simulation 7,178,598 in 302 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 250 MB 2.0 GB
STEP 1.2 GB 2.6 GB
STL 359 MB 2.1 GB
OBJ 780 MB 4.7 GB
Visual
GLB 171 MB 2.6 GB
OBJ 549 MB 3.6 GB

1904. GateMateA1-EVB_Rev_C

GateMateA1-EVB_Rev_C: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 94 s. Simulation, STEP takes 2 min. Simulation, STL takes 97 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.6 10.0 40.4 1 ms 33.2 1.5 5.7 0.4 93.8
Simulation, STEP 2.5 9.6 41.7 1.0 ms 33.9 19.2 5.2 0.4 112.5
Simulation, STL 2.5 9.7 41.5 1 ms 33.2 3.6 6.4 0.5 97.4
Simulation, OBJ 2.8 9.7 42.1 1 ms 34.2 51.4 5.8 0.4 146.2
Visual, GLB 2.5 9.7 41.6 2 ms 82.5 0.8 8.7 0.4 146.2
Visual, OBJ 2.6 9.6 40.4 1 ms 83.3 31.3 8.7 0.4 176.3
Board Repo: OLIMEX/GateMateA1-EVB
Board: GateMateA1-EVB_Rev_C.kicad_pcb
Folder HARDWARE / GateMateA1-EVB-Rev.C
Complexity 429 / 1000 (size 304, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 268, 9,108, 1,267
Triangles, simulation 7,169,180 in 302 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 250 MB 2.1 GB
STEP 1.1 GB 2.6 GB
STL 358 MB 2.0 GB
OBJ 779 MB 4.7 GB
Visual
GLB 171 MB 2.6 GB
OBJ 548 MB 3.4 GB

1905. ICE40-ADC_Rev_A

ICE40-ADC_Rev_A: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 5.6 5 ms 4.1 0.2 0.5 0.3 12.2
Simulation, STEP 0.3 1.1 5.4 0.3 ms 4.3 3.3 0.6 0.3 15.2
Simulation, STL 0.3 1.2 5.2 0.3 ms 4.1 0.4 0.6 0.3 12.1
Simulation, OBJ 0.3 1.2 5.6 0.5 ms 4.2 6.1 0.6 0.3 18.1
Visual, GLB 0.3 1.1 5.3 0.6 ms 9.8 0.1 1.2 0.3 18.2
Visual, OBJ 0.3 1.2 5.4 0.4 ms 9.7 5.1 1.3 0.3 23.2
Board Repo: OLIMEX/iCE40-ADC
Board: ICE40-ADC_Rev_A.kicad_pcb
Complexity 216 / 1000 (size 181, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 43, 1,220, 192
Triangles, simulation 1,044,008 in 65 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 433 MB
STEP 187 MB 507 MB
STL 52 MB 440 MB
OBJ 108 MB 743 MB
Visual
GLB 28 MB 595 MB
OBJ 83 MB 640 MB

1906. ICE40-DAC_Rev_A1

ICE40-DAC_Rev_A1: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.6 0.8 ms 3.5 0.2 0.5 0.3 10.3
Simulation, STEP 0.3 1.0 4.6 0.6 ms 3.4 2.8 0.5 0.3 12.9
Simulation, STL 0.3 0.9 4.5 0.5 ms 3.6 0.3 0.5 0.2 10.4
Simulation, OBJ 0.3 0.9 4.5 0.8 ms 3.5 5.1 0.6 0.2 15.0
Visual, GLB 0.3 0.9 4.4 0.7 ms 9.2 0.1 1.2 0.2 16.4
Visual, OBJ 0.3 0.9 4.4 0.7 ms 9.1 4.0 0.9 0.2 19.7
Board Repo: OLIMEX/iCE40-DAC
Board: ICE40-DAC_Rev_A1.kicad_pcb
Folder Hardware revision A1
Complexity 212 / 1000 (size 177, features 35)
KESE features through vias, filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 39, 1,005, 166
Triangles, simulation 1,063,228 in 72 parts
Verifier PASS in all six runs
Run again Visual, GLB; Visual, OBJ: failed in the corpus run, run again with fixes to KESE made after the corpus run, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 467 MB
STEP 195 MB 518 MB
STL 53 MB 470 MB
OBJ 109 MB 753 MB
Visual
GLB 28 MB 608 MB
OBJ 82 MB 631 MB

1907. ICE40-DAC_Rev_A

ICE40-DAC_Rev_A: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 9.5 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.6 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.2 0.9 ms 3.2 0.2 0.5 0.3 9.5
Simulation, STEP 0.3 0.8 4.0 1 ms 3.0 2.5 0.5 0.2 11.3
Simulation, STL 0.2 0.9 4.2 0.7 ms 3.2 0.4 0.5 0.2 9.6
Simulation, OBJ 0.3 0.8 3.9 0.6 ms 3.2 4.7 0.5 0.3 13.7
Visual, GLB 0.2 0.7 4.1 0.8 ms 7.7 0.1 1.1 0.2 14.1
Visual, OBJ 0.3 0.8 4.0 0.9 ms 7.8 3.4 1.1 0.2 17.7
Board Repo: OLIMEX/iCE40-DAC
Board: ICE40-DAC_Rev_A.kicad_pcb
Complexity 212 / 1000 (size 177, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 39, 1,005, 166
Triangles, simulation 1,030,836 in 72 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 467 MB
STEP 194 MB 529 MB
STL 52 MB 456 MB
OBJ 106 MB 710 MB
Visual
GLB 27 MB 570 MB
OBJ 80 MB 565 MB

1908. ICE40-DIO_Rev_A

ICE40-DIO_Rev_A: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 24 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.5 7.8 0.5 ms 5.9 0.2 0.9 0.3 16.9
Simulation, STEP 0.4 1.4 7.6 0.5 ms 5.2 4.2 0.8 0.3 19.8
Simulation, STL 0.4 1.4 7.5 0.6 ms 5.1 0.4 0.7 0.2 15.7
Simulation, OBJ 0.4 1.4 7.7 0.7 ms 5.3 8.5 0.8 0.3 24.4
Visual, GLB 0.4 1.5 7.7 0.8 ms 12.8 0.2 1.4 0.3 24.2
Visual, OBJ 0.4 1.4 7.5 0.6 ms 12.7 6.5 1.3 0.3 30.2
Board Repo: OLIMEX/iCE40-DIO
Board: ICE40-DIO_Rev_A.kicad_pcb
Complexity 266 / 1000 (size 231, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 41, 1,703, 205
Triangles, simulation 1,473,352 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 580 MB
STEP 258 MB 686 MB
STL 74 MB 587 MB
OBJ 154 MB 984 MB
Visual
GLB 39 MB 726 MB
OBJ 118 MB 880 MB

1909. ICE40-IO_Rev_A

ICE40-IO_Rev_A: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 16 s. Visual, GLB takes 15 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 4.7 0.6 ms 3.5 0.2 0.5 0.3 10.5
Simulation, STEP 0.3 1.0 4.7 0.5 ms 3.5 2.8 0.5 0.2 13.0
Simulation, STL 0.3 1.0 4.6 0.7 ms 3.5 0.2 0.5 0.2 10.3
Simulation, OBJ 0.3 1.0 4.6 0.7 ms 3.4 5.7 0.5 0.3 15.8
Visual, GLB 0.4 1.2 4.9 0.6 ms 7.8 0.1 0.8 0.2 15.4
Visual, OBJ 0.4 1.1 5.1 0.5 ms 7.9 4.3 0.7 0.2 19.6
Board Repo: OLIMEX/iCE40-IO
Board: ICE40-IO_Rev_A.kicad_pcb
Complexity 206 / 1000 (size 171, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 33, 751, 146
Triangles, simulation 1,043,876 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 451 MB
STEP 185 MB 529 MB
STL 52 MB 450 MB
OBJ 107 MB 736 MB
Visual
GLB 27 MB 583 MB
OBJ 80 MB 600 MB

1910. ICE40-1KEVB_Rev_A

ICE40-1KEVB_Rev_A: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 6.2 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.1 s. Simulation, OBJ takes 8.0 s. Visual, GLB takes 8.8 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.8 0.4 ms 1.8 96 ms 0.4 0.3 6.2
Simulation, STEP 0.3 0.7 2.9 0.3 ms 1.7 1.8 0.3 0.2 7.9
Simulation, STL 0.3 0.6 2.9 0.6 ms 1.7 0.1 0.3 0.3 6.1
Simulation, OBJ 0.2 0.6 2.6 0.4 ms 1.8 2.3 0.2 0.3 8.0
Visual, GLB 0.3 0.6 2.9 0.4 ms 4.2 57 ms 0.5 0.2 8.8
Visual, OBJ 0.2 0.7 3.0 2 ms 4.6 1.7 0.6 0.2 10.9
Board Repo: OLIMEX/iCE40HX1K-EVB
Board: ICE40-1KEVB_Rev_A.kicad_pcb
Complexity 102 / 1000 (size 102, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 67, 0, 0
Triangles, simulation 457,628 in 106 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 301 MB
STEP 69 MB 333 MB
STL 23 MB 295 MB
OBJ 48 MB 370 MB
Visual
GLB 11 MB 320 MB
OBJ 31 MB 323 MB

1911. iCE40HX1K-EVB_Rev_B

iCE40HX1K-EVB_Rev_B: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 20 s. Simulation, OBJ takes 32 s. Visual, GLB takes 30 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.3 8.1 1.0 ms 7.6 0.4 1.1 0.2 20.2
Simulation, STEP 0.5 2.2 7.9 0.6 ms 7.9 5.3 1.2 0.3 25.3
Simulation, STL 0.6 2.2 7.6 0.8 ms 7.8 0.7 1.1 0.3 20.3
Simulation, OBJ 0.6 2.4 7.7 0.9 ms 7.3 12.4 1.2 0.3 31.8
Visual, GLB 0.5 2.2 7.5 0.8 ms 17.4 0.2 1.7 0.3 29.9
Visual, OBJ 0.5 2.4 7.9 0.6 ms 17.6 8.7 1.9 0.2 39.3
Board Repo: OLIMEX/iCE40HX1K-EVB
Board: iCE40HX1K-EVB_Rev_B.kicad_pcb
Complexity 281 / 1000 (size 236, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 71, 2,527, 279
Triangles, simulation 1,966,590 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 68 MB 678 MB
STEP 295 MB 808 MB
STL 98 MB 716 MB
OBJ 210 MB 1.3 GB
Visual
GLB 46 MB 886 MB
OBJ 142 MB 1.0 GB

1912. iCE40HX8K-EVB_Rev_B

iCE40HX8K-EVB_Rev_B: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 54 s. Simulation, STEP takes 65 s. Simulation, STL takes 56 s. Simulation, OBJ takes 85 s. Visual, GLB takes 90 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 6.7 20.4 1 ms 21.2 0.9 3.1 0.4 53.7
Simulation, STEP 1.1 6.4 20.6 0.8 ms 21.4 12.5 3.1 0.4 65.5
Simulation, STL 1.1 7.0 20.8 0.8 ms 21.3 1.8 3.2 0.4 55.5
Simulation, OBJ 1.2 6.4 20.4 2 ms 21.3 31.9 3.2 0.3 84.8
Visual, GLB 1.2 6.5 20.9 3 ms 54.2 0.6 6.1 0.3 89.8
Visual, OBJ 1.1 6.6 20.6 2 ms 53.9 22.1 6.1 0.4 110.8
Board Repo: OLIMEX/iCE40HX8K-EVB
Board: iCE40HX8K-EVB_Rev_B.kicad_pcb
Folder HARDWARE / REV-B
Complexity 314 / 1000 (size 269, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20160815)
Parts, tracks, vias 96, 7,178, 863
Triangles, simulation 4,942,670 in 246 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 171 MB 1.5 GB
STEP 730 MB 1.7 GB
STL 247 MB 1.6 GB
OBJ 540 MB 3.2 GB
Visual
GLB 115 MB 1.8 GB
OBJ 371 MB 2.5 GB

1913. iCE40HX8K-EVB_Rev_B1

iCE40HX8K-EVB_Rev_B1: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 51 s. Simulation, STEP takes 62 s. Simulation, STL takes 51 s. Simulation, OBJ takes 79 s. Visual, GLB takes 83 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 6.3 19.0 1 ms 19.8 0.9 3.1 0.4 50.7
Simulation, STEP 1.2 6.4 18.9 1 ms 19.9 12.1 2.9 0.3 61.7
Simulation, STL 1.1 6.2 18.5 0.8 ms 19.7 2.1 3.2 0.3 51.1
Simulation, OBJ 1.1 6.1 18.3 1 ms 19.7 30.7 2.9 0.3 79.1
Visual, GLB 1.1 6.1 18.7 0.8 ms 49.3 0.6 6.6 0.3 82.7
Visual, OBJ 1.2 6.2 19.1 0.7 ms 49.7 20.2 6.3 0.3 103.0
Board Repo: OLIMEX/iCE40HX8K-EVB
Board: iCE40HX8K-EVB_Rev_B1.kicad_pcb
Folder HARDWARE / REV-B1
Complexity 314 / 1000 (size 269, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 96, 7,178, 863
Triangles, simulation 5,101,374 in 247 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 177 MB 1.5 GB
STEP 734 MB 1.8 GB
STL 255 MB 1.5 GB
OBJ 558 MB 3.3 GB
Visual
GLB 117 MB 2.0 GB
OBJ 377 MB 2.6 GB

1914. iMX8MPLUS-SOM_Rev_B

iMX8MPLUS-SOM_Rev_B: stages 4 and 6 take 48% to 85% of a run. Simulation, GLB takes 86 s. Simulation, STEP takes 2 min. Simulation, STL takes 92 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 8.8 31.9 1 ms 34.9 1.9 6.3 0.5 86.4
Simulation, STEP 1.9 8.8 32.3 1 ms 34.7 21.0 5.7 0.4 104.8
Simulation, STL 2.0 9.1 32.8 1 ms 37.6 3.8 6.2 0.4 91.9
Simulation, OBJ 2.1 9.0 32.4 1 ms 36.2 56.3 5.6 0.4 141.9
Visual, GLB 1.9 8.8 31.9 2 ms 80.4 0.9 8.1 0.3 132.4
Visual, OBJ 1.9 8.9 31.8 1 ms 76.6 31.8 8.1 0.4 159.5
Board Repo: OLIMEX/iMX8MP-SOM
Board: iMX8MPLUS-SOM_Rev_B.kicad_pcb
Folder HARDWARE / iMX8MP-SOM-xGB-IND
Complexity 363 / 1000 (size 318, features 45)
KESE features through vias, filled zones,
copper text
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 203, 11,532, 988
Triangles, simulation 8,457,830 in 438 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 294 MB 2.2 GB
STEP 1.2 GB 2.8 GB
STL 423 MB 2.3 GB
OBJ 916 MB 5.4 GB
Visual
GLB 163 MB 2.6 GB
OBJ 535 MB 3.4 GB

1915. iMX8MPLUS-SOM-EVB_Rev_B

iMX8MPLUS-SOM-EVB_Rev_B: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 81 s. Simulation, STEP takes 97 s. Simulation, STL takes 82 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.1 8.3 36.6 1 ms 27.3 1.3 4.8 0.3 80.8
Simulation, STEP 2.1 8.6 36.5 0.9 ms 27.4 17.8 4.2 0.3 96.9
Simulation, STL 2.0 8.4 36.4 0.9 ms 27.7 2.4 4.7 0.3 81.9
Simulation, OBJ 2.2 8.6 35.7 1 ms 27.6 51.1 4.7 0.4 130.4
Visual, GLB 2.2 8.7 37.6 2 ms 81.9 0.8 10.2 0.3 141.6
Visual, OBJ 2.2 8.8 37.1 1 ms 81.0 31.4 9.6 0.4 170.5
Board Repo: OLIMEX/iMX8MP-SOM-EVB
Board: iMX8MPLUS-SOM-EVB_Rev_B.kicad_pcb
Folder HARDWARE / iMX8MP-SOM-EVB-rev.b
Complexity 364 / 1000 (size 299, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 317, 7,518, 1,183
Triangles, simulation 7,608,794 in 443 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 265 MB 2.3 GB
STEP 1.1 GB 2.9 GB
STL 380 MB 2.2 GB
OBJ 824 MB 4.9 GB
Visual
GLB 184 MB 2.8 GB
OBJ 592 MB 3.7 GB

1916. Lime2-SHIELD_RevC

Lime2-SHIELD_RevC: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 9.7 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.0 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 3.4 0.5 ms 3.7 0.2 0.5 0.3 9.7
Simulation, STEP 0.3 1.1 3.2 0.4 ms 3.5 2.7 0.5 0.2 11.7
Simulation, STL 0.3 1.0 3.2 0.6 ms 3.5 0.3 0.5 0.2 9.0
Simulation, OBJ 0.4 1.2 3.1 0.5 ms 3.5 5.3 0.5 0.3 14.3
Visual, GLB 0.4 1.2 3.1 0.5 ms 8.3 0.1 1.1 0.3 14.5
Visual, OBJ 0.4 1.1 3.2 0.4 ms 8.1 4.3 0.9 0.2 18.4
Board Repo: OLIMEX/LIME2-SHIELD
Board: Lime2-SHIELD_RevC.kicad_pcb
Folder HARDWARE / Lime2-SHIELD-Rev.C
Complexity 232 / 1000 (size 187, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 39, 689, 117
Triangles, simulation 1,041,168 in 165 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 482 MB
STEP 165 MB 581 MB
STL 52 MB 474 MB
OBJ 109 MB 779 MB
Visual
GLB 27 MB 639 MB
OBJ 83 MB 627 MB

1917. LoRa_RevA

LoRa_RevA: stages 4 and 6 take 52% to 79% of a run. Simulation, GLB takes 3.9 s. Simulation, STEP takes 5.2 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 5.4 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 6.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.6 0.6 ms 1.3 49 ms 0.2 0.2 3.9
Simulation, STEP 0.2 0.4 1.6 0.5 ms 1.3 1.3 0.2 0.2 5.2
Simulation, STL 0.1 0.5 1.7 0.2 ms 1.2 83 ms 0.2 0.2 3.9
Simulation, OBJ 0.2 0.5 1.7 0.8 ms 1.2 1.6 0.2 0.2 5.4
Visual, GLB 0.2 0.5 1.6 0.5 ms 3.1 39 ms 0.3 0.2 5.8
Visual, OBJ 0.2 0.5 1.5 0.3 ms 3.0 1.0 0.3 0.2 6.7
Board Repo: OLIMEX/LoRa-868-915
Board: LoRa_RevA.kicad_pcb
Folder HARDWARE / LoRa-Rev-A
Complexity 265 / 1000 (size 195, features 70)
KESE features through vias, slotted holes,
custom pads, filled zones,
copper drawings
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 31, 322, 45
Triangles, simulation 350,196 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 260 MB
STEP 63 MB 265 MB
STL 18 MB 264 MB
OBJ 37 MB 283 MB
Visual
GLB 8.5 MB 255 MB
OBJ 25 MB 242 MB

1918. LoRa_RevB

LoRa_RevB: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 5.3 s. Simulation, STL takes 4.1 s. Simulation, OBJ takes 5.7 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 7.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.7 0.2 ms 1.3 66 ms 0.2 0.2 4.0
Simulation, STEP 0.2 0.4 1.7 0.2 ms 1.3 1.3 0.2 0.2 5.3
Simulation, STL 0.2 0.4 1.7 0.3 ms 1.4 0.1 0.2 0.2 4.1
Simulation, OBJ 0.2 0.4 1.6 0.3 ms 1.3 1.8 0.2 0.2 5.7
Visual, GLB 0.2 0.4 1.7 0.3 ms 3.1 44 ms 0.4 0.2 5.9
Visual, OBJ 0.1 0.4 1.8 0.3 ms 3.3 1.3 0.3 0.2 7.4
Board Repo: OLIMEX/LoRa-868-915
Board: LoRa_RevB.kicad_pcb
Folder HARDWARE / LoRa-Rev-B
Complexity 261 / 1000 (size 191, features 70)
KESE features through vias, slotted holes,
custom pads, filled zones,
copper drawings
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 26, 270, 45
Triangles, simulation 371,904 in 41 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 265 MB
STEP 67 MB 275 MB
STL 19 MB 261 MB
OBJ 39 MB 304 MB
Visual
GLB 9.1 MB 249 MB
OBJ 27 MB 266 MB

1919. MOD-LoRa_RevB

MOD-LoRa_RevB: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.0 s. Simulation, STL takes 3.1 s. Simulation, OBJ takes 4.4 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.2 0.3 ms 1.1 48 ms 0.1 0.2 3.1
Simulation, STEP 0.2 0.3 1.1 0.2 ms 1.0 1.0 0.1 0.2 4.0
Simulation, STL 0.1 0.3 1.2 0.2 ms 1.0 63 ms 0.2 0.3 3.1
Simulation, OBJ 0.1 0.3 1.1 0.1 ms 1.0 1.4 0.2 0.2 4.4
Visual, GLB 0.2 0.3 1.2 0.2 ms 2.5 39 ms 0.2 0.2 4.6
Visual, OBJ 0.2 0.3 1.2 0.2 ms 2.5 1.1 0.2 0.2 5.6
Board Repo: OLIMEX/LoRa-868-915
Board: MOD-LoRa_RevB.kicad_pcb
Folder HARDWARE / MOD-LoRa-Rev-B
Complexity 235 / 1000 (size 190, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 237, 51
Triangles, simulation 251,278 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.3 MB 226 MB
STEP 44 MB 256 MB
STL 13 MB 232 MB
OBJ 26 MB 226 MB
Visual
GLB 7.1 MB 215 MB
OBJ 20 MB 213 MB

1920. STM32WL-DevKit_RevB

STM32WL-DevKit_RevB: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 16 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.7 0.3 ms 4.5 0.2 0.6 0.2 11.5
Simulation, STEP 0.3 0.9 4.8 0.5 ms 4.3 2.7 0.6 0.2 13.9
Simulation, STL 0.4 1.1 4.5 0.4 ms 4.4 0.3 0.6 0.2 11.6
Simulation, OBJ 0.3 1.0 4.6 0.3 ms 4.2 6.2 0.6 0.3 17.2
Visual, GLB 0.4 1.1 4.6 0.5 ms 8.8 0.1 0.9 0.2 16.2
Visual, OBJ 0.4 1.0 4.6 0.4 ms 11.0 4.7 1.3 0.3 23.3
Board Repo: OLIMEX/LoRa-STM32WL-DevKIT
Board: STM32WL-DevKit_RevB.kicad_pcb
Folder HARDWARE / LoRa-STM32WL-DevKIT / LoRa-STM32WL-DevKit-RevB
Complexity 308 / 1000 (size 228, features 80)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 49, 640, 110
Triangles, simulation 1,098,314 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 449 MB
STEP 167 MB 573 MB
STL 55 MB 445 MB
OBJ 112 MB 801 MB
Visual
GLB 26 MB 634 MB
OBJ 77 MB 629 MB

1921. LoRa-STM32WL-DevKit_RevD1

LoRa-STM32WL-DevKit_RevD1: stages 4 and 6 take 55% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 15 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 5.0 0.4 ms 3.9 0.2 0.5 0.2 11.3
Simulation, STEP 0.3 1.0 5.1 0.4 ms 4.0 2.7 0.5 0.2 13.9
Simulation, STL 0.3 1.0 4.8 0.4 ms 3.8 0.2 0.5 0.2 10.9
Simulation, OBJ 0.3 0.9 4.8 0.4 ms 3.8 5.0 0.5 0.2 15.5
Visual, GLB 0.3 1.0 4.7 0.4 ms 8.1 0.1 1.1 0.2 15.6
Visual, OBJ 0.3 1.1 4.7 0.4 ms 8.1 4.1 1.1 0.2 19.7
Board Repo: OLIMEX/LoRa-STM32WL-DevKIT
Board: LoRa-STM32WL-DevKit_RevD1.kicad_pcb
Folder HARDWARE / LoRa-STM32WL-DevKIT / LoRa-STM32WL-DevKit-RevD1
Complexity 271 / 1000 (size 216, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 54, 739, 137
Triangles, simulation 943,760 in 78 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 429 MB
STEP 164 MB 541 MB
STL 47 MB 451 MB
OBJ 97 MB 678 MB
Visual
GLB 27 MB 571 MB
OBJ 80 MB 637 MB

1922. MiniBot_charger_RevA

MiniBot_charger_RevA: stages 4 and 6 take 47% to 78% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.5 0.1 ms 0.7 22 ms 65 ms 0.2 1.7
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.7 0.9 62 ms 0.2 2.5
Simulation, STL 0.1 0.1 0.5 0.1 ms 0.7 32 ms 67 ms 0.2 1.7
Simulation, OBJ 0.1 0.1 0.6 0.1 ms 0.7 0.6 73 ms 0.2 2.4
Visual, GLB 0.1 0.1 0.5 0.1 ms 1.5 19 ms 0.1 0.2 2.5
Visual, OBJ 0.1 0.1 0.5 0.1 ms 1.5 0.6 0.1 0.2 3.2
Board Repo: OLIMEX/Minibot
Board: MiniBot_charger_RevA.kicad_pcb
Folder HARDWARE / charger
Complexity 168 / 1000 (size 123, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 12, 107, 3
Triangles, simulation 117,320 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.3 MB 188 MB
STEP 23 MB 201 MB
STL 5.9 MB 189 MB
OBJ 12 MB 189 MB
Visual
GLB 3.6 MB 158 MB
OBJ 10.0 MB 158 MB

1923. MiniBot_RevA

MiniBot_RevA: stages 4 and 6 take 47% to 79% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 5.4 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 5.9 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 7.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.5 0.2 ms 1.2 56 ms 0.2 0.2 3.7
Simulation, STEP 0.2 0.4 1.5 0.3 ms 1.4 1.5 0.2 0.2 5.4
Simulation, STL 0.2 0.4 1.5 0.2 ms 1.3 82 ms 0.2 0.3 4.0
Simulation, OBJ 0.2 0.4 1.5 0.2 ms 1.3 2.1 0.2 0.3 5.9
Visual, GLB 0.2 0.4 1.4 0.2 ms 3.2 45 ms 0.4 0.2 5.8
Visual, OBJ 0.2 0.4 1.5 0.2 ms 3.2 1.7 0.4 0.2 7.6
Board Repo: OLIMEX/Minibot
Board: MiniBot_RevA.kicad_pcb
Folder HARDWARE
Complexity 202 / 1000 (size 147, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 27, 251, 19
Triangles, simulation 312,404 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 243 MB
STEP 60 MB 262 MB
STL 16 MB 244 MB
OBJ 32 MB 263 MB
Visual
GLB 8.8 MB 244 MB
OBJ 26 MB 256 MB

1924. MIPI-HDMI_Rev_B

MIPI-HDMI_Rev_B: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 7.5 s. Simulation, STEP takes 8.9 s. Simulation, STL takes 7.5 s. Simulation, OBJ takes 11 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 2.9 0.3 ms 2.7 0.1 0.4 0.2 7.5
Simulation, STEP 0.3 0.8 2.9 0.2 ms 2.5 1.9 0.3 0.2 8.9
Simulation, STL 0.3 0.9 2.9 0.3 ms 2.6 0.3 0.4 0.2 7.5
Simulation, OBJ 0.3 0.8 3.2 0.3 ms 2.6 3.8 0.4 0.2 11.3
Visual, GLB 0.3 0.8 3.0 0.3 ms 6.5 0.1 0.8 0.2 11.8
Visual, OBJ 0.3 0.8 3.1 0.2 ms 6.2 2.7 0.6 0.2 14.0
Board Repo: OLIMEX/MIPI-HDMI
Board: MIPI-HDMI_Rev_B.kicad_pcb
Folder HARDWARE / MIPI-HDMI-Rev.B
Complexity 342 / 1000 (size 237, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 55, 1,070, 162
Triangles, simulation 962,002 in 86 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 441 MB
STEP 146 MB 518 MB
STL 48 MB 460 MB
OBJ 100 MB 703 MB
Visual
GLB 23 MB 539 MB
OBJ 71 MB 589 MB

1925. MOD-BME280_RevA

MOD-BME280_RevA: stages 4 and 6 take 41% to 75% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.1 ms 0.5 16 ms 44 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.4 0.1 ms 0.5 0.8 60 ms 0.2 2.2
Simulation, STL 0.1 0.1 0.4 0.1 ms 0.5 22 ms 47 ms 0.2 1.5
Simulation, OBJ 95 ms 0.1 0.5 0.1 ms 0.5 0.5 53 ms 0.2 2.0
Visual, GLB 98 ms 0.1 0.4 0.1 ms 1.1 14 ms 90 ms 0.2 2.1
Visual, OBJ 0.1 0.2 0.4 0.2 ms 1.0 0.4 82 ms 0.2 2.4
Board Repo: OLIMEX/MOD-BME280
Board: MOD-BME280_RevA.kicad_pcb
Folder HARDWARE / MOD-BME280-Rev.A1
Complexity 154 / 1000 (size 119, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 8, 95, 7
Triangles, simulation 76,542 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.9 MB 177 MB
STEP 14 MB 190 MB
STL 3.8 MB 180 MB
OBJ 7.8 MB 182 MB
Visual
GLB 2.5 MB 155 MB
OBJ 6.9 MB 155 MB

1926. MOD-BME280_RevB

MOD-BME280_RevB: stages 4 and 6 take 44% to 73% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.1 ms 0.5 25 ms 65 ms 0.2 1.6
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.6 0.9 48 ms 0.2 2.5
Simulation, STL 0.1 0.1 0.4 0.1 ms 0.5 25 ms 49 ms 0.2 1.6
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.6 0.5 55 ms 0.2 2.1
Visual, GLB 0.1 0.2 0.5 0.1 ms 1.3 16 ms 0.1 0.3 2.5
Visual, OBJ 0.1 0.2 0.5 0.1 ms 1.2 0.4 96 ms 0.3 2.8
Board Repo: OLIMEX/MOD-BME280
Board: MOD-BME280_RevB.kicad_pcb
Folder HARDWARE / MOD-BME280-Rev.B
Complexity 163 / 1000 (size 118, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 93, 7
Triangles, simulation 80,616 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.0 MB 189 MB
STEP 15 MB 188 MB
STL 4.0 MB 189 MB
OBJ 8.2 MB 186 MB
Visual
GLB 2.6 MB 154 MB
OBJ 7.3 MB 155 MB

1927. MOD-ENV_revB

MOD-ENV_revB: stages 4 and 6 take 45% to 73% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.4 0.1 ms 0.6 21 ms 73 ms 0.2 1.6
Simulation, STEP 0.1 0.2 0.4 0.1 ms 0.7 0.8 61 ms 0.2 2.4
Simulation, STL 0.1 0.2 0.4 0.1 ms 0.6 53 ms 61 ms 0.2 1.6
Simulation, OBJ 0.1 0.2 0.4 0.1 ms 0.7 0.6 64 ms 0.2 2.2
Visual, GLB 0.1 0.2 0.4 0.1 ms 1.3 22 ms 0.2 0.2 2.4
Visual, OBJ 0.1 0.2 0.4 0.1 ms 1.2 0.5 0.1 0.2 2.8
Board Repo: OLIMEX/MOD-ENV
Board: MOD-ENV_revB.kicad_pcb
Folder HARDWARE / REV-B
Complexity 188 / 1000 (size 133, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 13, 167, 15
Triangles, simulation 140,154 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.1 MB 200 MB
STEP 26 MB 216 MB
STL 7.0 MB 201 MB
OBJ 14 MB 201 MB
Visual
GLB 4.3 MB 178 MB
OBJ 12 MB 179 MB

1928. MOD-ESP32-C5_Rev_A

MOD-ESP32-C5_Rev_A: stages 4 and 6 take 47% to 79% of a run. Simulation, GLB takes 4.8 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 5.0 s. Simulation, OBJ takes 7.1 s. Visual, GLB takes 7.8 s. Visual, OBJ takes 9.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 1.9 0.3 ms 1.5 73 ms 0.2 0.2 4.8
Simulation, STEP 0.3 0.6 1.9 0.4 ms 1.5 1.5 0.3 0.2 6.3
Simulation, STL 0.3 0.6 2.0 0.3 ms 1.5 0.1 0.3 0.2 5.0
Simulation, OBJ 0.3 0.6 1.8 0.3 ms 1.5 2.5 0.3 0.2 7.1
Visual, GLB 0.3 0.6 2.0 0.7 ms 4.1 65 ms 0.5 0.2 7.8
Visual, OBJ 0.3 0.6 1.9 0.5 ms 4.0 2.1 0.5 0.2 9.6
Board Repo: OLIMEX/MOD-ESP32-C5
Board: MOD-ESP32-C5_Rev_A.kicad_pcb
Folder HARDWARE / MOD-ESP32-C5.Rev.A
Complexity 274 / 1000 (size 169, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 26, 873, 107
Triangles, simulation 437,814 in 54 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 298 MB
STEP 73 MB 323 MB
STL 22 MB 292 MB
OBJ 45 MB 351 MB
Visual
GLB 13 MB 341 MB
OBJ 39 MB 337 MB

1929. MOD-IR-TEMP_RevA

MOD-IR-TEMP_RevA: stages 4 and 6 take 45% to 76% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.6 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 89 ms 0.3 0.1 ms 0.5 16 ms 42 ms 0.2 1.2
Simulation, STEP 85 ms 0.1 0.4 0.1 ms 0.5 0.7 38 ms 0.2 2.0
Simulation, STL 85 ms 89 ms 0.4 0.2 ms 0.5 18 ms 37 ms 0.2 1.3
Simulation, OBJ 0.1 0.1 0.3 0.1 ms 0.4 0.4 41 ms 0.2 1.6
Visual, GLB 95 ms 99 ms 0.4 0.1 ms 1.1 11 ms 71 ms 0.2 2.0
Visual, OBJ 85 ms 95 ms 0.4 0.1 ms 1.1 0.3 73 ms 0.2 2.3
Board Repo: OLIMEX/MOD-IR-TEMP
Board: MOD-IR-TEMP_RevA.kicad_pcb
Folder HARDWARE / REV.A
Complexity 138 / 1000 (size 103, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20160815)
Parts, tracks, vias 6, 42, 4
Triangles, simulation 65,598 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.4 MB 172 MB
STEP 11 MB 176 MB
STL 3.3 MB 171 MB
OBJ 6.6 MB 172 MB
Visual
GLB 1.8 MB 153 MB
OBJ 5.0 MB 151 MB

1930. MOD-LCD2.8RTP_RevB

MOD-LCD2.8RTP_RevB: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 5.6 s. Simulation, STEP takes 7.4 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 8.4 s. Visual, GLB takes 8.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.3 0.2 ms 1.9 75 ms 0.2 0.2 5.6
Simulation, STEP 0.2 0.6 2.4 0.2 ms 1.9 1.9 0.2 0.2 7.4
Simulation, STL 0.2 0.7 2.4 0.2 ms 2.1 0.1 0.2 0.2 6.0
Simulation, OBJ 0.2 0.7 2.3 0.2 ms 1.9 2.7 0.2 0.3 8.4
Visual, GLB 0.2 0.7 2.3 0.3 ms 4.0 64 ms 0.5 0.3 8.2
Visual, OBJ 0.2 0.7 2.5 0.2 ms 4.0 2.3 0.7 0.3 10.6
Board Repo: OLIMEX/MOD-LCD2.8RTP
Board: MOD-LCD2.8RTP_RevB.kicad_pcb
Folder HARDWARE / SCHEMATICS / Hardware-revision-B
Complexity 193 / 1000 (size 158, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 24, 490, 60
Triangles, simulation 384,728 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 300 MB
STEP 72 MB 336 MB
STL 19 MB 290 MB
OBJ 40 MB 327 MB
Visual
GLB 12 MB 341 MB
OBJ 36 MB 337 MB

1931. MOD-LCD2.8RTP_Rev_C

MOD-LCD2.8RTP_Rev_C: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.1 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.2 3.3 0.4 ms 2.4 0.1 0.4 0.2 8.0
Simulation, STEP 0.3 1.2 3.5 0.2 ms 2.4 2.0 0.3 0.2 10.0
Simulation, STL 0.3 1.3 3.3 0.2 ms 2.4 0.2 0.4 0.2 8.1
Simulation, OBJ 0.3 1.3 3.4 0.2 ms 2.4 3.6 0.3 0.2 11.5
Visual, GLB 0.3 1.2 3.5 0.4 ms 5.1 92 ms 0.5 0.2 11.0
Visual, OBJ 0.3 1.3 3.3 0.3 ms 5.1 2.9 0.5 0.2 13.6
Board Repo: OLIMEX/MOD-LCD2.8RTP
Board: MOD-LCD2.8RTP_Rev_C.kicad_pcb
Folder HARDWARE / SCHEMATICS / Hardware-revision-C
Complexity 229 / 1000 (size 174, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 27, 821, 284
Triangles, simulation 677,624 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 401 MB
STEP 98 MB 496 MB
STL 34 MB 412 MB
OBJ 70 MB 485 MB
Visual
GLB 20 MB 493 MB
OBJ 60 MB 540 MB

1932. MOD-LCD2.8RTP_Rev_D

MOD-LCD2.8RTP_Rev_D: stages 4 and 6 take 50% to 76% of a run. Simulation, GLB takes 4.8 s. Simulation, STEP takes 6.6 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 7.2 s. Visual, GLB takes 7.5 s. Visual, OBJ takes 9.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 1.8 0.3 ms 1.6 56 ms 0.2 0.2 4.8
Simulation, STEP 0.4 0.7 1.9 0.4 ms 1.7 1.5 0.2 0.2 6.6
Simulation, STL 0.3 0.7 1.8 0.3 ms 1.7 0.1 0.2 0.2 4.9
Simulation, OBJ 0.4 0.7 1.9 0.3 ms 1.7 2.1 0.2 0.2 7.2
Visual, GLB 0.2 0.8 2.0 0.3 ms 3.7 52 ms 0.5 0.2 7.5
Visual, OBJ 0.3 0.8 1.6 0.3 ms 3.8 1.9 0.6 0.2 9.2
Board Repo: OLIMEX/MOD-LCD2.8RTP
Board: MOD-LCD2.8RTP_Rev_D.kicad_pcb
Folder HARDWARE / SCHEMATICS / Hardware-revision-D
Complexity 262 / 1000 (size 162, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 26, 413, 121
Triangles, simulation 409,860 in 42 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 305 MB
STEP 72 MB 353 MB
STL 20 MB 297 MB
OBJ 42 MB 346 MB
Visual
GLB 12 MB 346 MB
OBJ 36 MB 345 MB

1933. mod-mpu9150

mod-mpu9150: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 3.5 s. Visual, OBJ takes 4.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.2 ms 0.8 32 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.8 0.9 0.1 0.2 3.1
Simulation, STL 0.1 0.2 0.8 0.1 ms 0.8 44 ms 0.1 0.2 2.2
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.7 1.0 0.1 0.2 3.2
Visual, GLB 0.1 0.2 0.8 0.2 ms 1.9 26 ms 0.2 0.2 3.5
Visual, OBJ 0.1 0.2 0.9 0.2 ms 2.0 0.8 0.2 0.2 4.3
Board Repo: OLIMEX/MOD-MPU9150
Board: mod-mpu9150.kicad_pcb
Folder HARDWARE / MOD-MPU9150-Rev.A
Complexity 163 / 1000 (size 128, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 14, 125, 9
Triangles, simulation 199,710 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.2 MB 218 MB
STEP 39 MB 232 MB
STL 10.0 MB 220 MB
OBJ 20 MB 217 MB
Visual
GLB 6.0 MB 214 MB
OBJ 17 MB 212 MB

1934. mod-oled-128x64

mod-oled-128x64: stages 4 and 6 take 45% to 76% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.6 0.1 ms 0.5 25 ms 61 ms 0.2 1.7
Simulation, STEP 0.1 0.2 0.5 0.1 ms 0.5 0.8 50 ms 0.2 2.3
Simulation, STL 0.1 0.1 0.5 0.1 ms 0.5 23 ms 49 ms 0.2 1.5
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.5 0.5 51 ms 0.2 2.1
Visual, GLB 0.1 0.1 0.6 0.1 ms 1.1 15 ms 95 ms 0.2 2.3
Visual, OBJ 0.1 0.2 0.6 0.1 ms 1.2 0.4 81 ms 0.2 2.7
Board Repo: OLIMEX/MOD-OLED-128x64
Board: mod-oled-128x64.kicad_pcb
Folder HARDWARE / MOD-OLED-128x64_Rev.A
Complexity 169 / 1000 (size 134, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 191, 12
Triangles, simulation 97,926 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.6 MB 192 MB
STEP 18 MB 196 MB
STL 4.9 MB 190 MB
OBJ 10 MB 186 MB
Visual
GLB 3.0 MB 161 MB
OBJ 8.2 MB 159 MB

1935. MOD-RTC2_Rev_A

MOD-RTC2_Rev_A: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.6 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 84 ms 0.1 0.7 0.2 ms 0.6 21 ms 67 ms 0.2 1.8
Simulation, STEP 96 ms 0.1 0.6 0.2 ms 0.7 0.8 82 ms 0.2 2.6
Simulation, STL 0.1 0.1 0.6 0.1 ms 0.6 38 ms 73 ms 0.3 1.9
Simulation, OBJ 0.1 0.1 0.6 0.1 ms 0.6 0.6 75 ms 0.2 2.4
Visual, GLB 98 ms 0.1 0.6 0.1 ms 1.4 19 ms 0.1 0.2 2.6
Visual, OBJ 88 ms 0.1 0.6 0.2 ms 1.5 0.4 0.1 0.2 3.1
Board Repo: OLIMEX/MOD-RTC2
Board: MOD-RTC2_Rev_A.kicad_pcb
Folder Hardware / MOD-RTC2-A
Complexity 170 / 1000 (size 125, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171114)
Parts, tracks, vias 9, 123, 14
Triangles, simulation 126,452 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 MB 194 MB
STEP 23 MB 198 MB
STL 6.3 MB 185 MB
OBJ 13 MB 186 MB
Visual
GLB 3.5 MB 159 MB
OBJ 9.7 MB 159 MB

1936. NB-IoT-DevKit_Rev_B

NB-IoT-DevKit_Rev_B: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 26 s. Visual, GLB takes 26 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.9 6.5 1 ms 5.8 0.3 0.8 0.2 16.1
Simulation, STEP 0.6 1.9 6.3 0.7 ms 5.8 4.2 0.8 0.3 19.9
Simulation, STL 0.5 1.9 6.4 0.6 ms 6.1 0.6 0.8 0.2 16.5
Simulation, OBJ 0.6 1.9 6.6 0.9 ms 5.8 9.8 0.8 0.3 25.8
Visual, GLB 0.6 1.9 6.4 0.7 ms 15.2 0.2 1.5 0.2 26.0
Visual, OBJ 0.6 1.9 6.6 1 ms 15.8 6.8 1.7 0.3 33.7
Board Repo: OLIMEX/NB-IoT
Board: NB-IoT-DevKit_Rev_B.kicad_pcb
Folder HARDWARE / NB-IoT-DevKit_Rev_B
Complexity 307 / 1000 (size 217, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20190905)
Parts, tracks, vias 105, 2,707, 203
Triangles, simulation 1,641,942 in 137 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 671 MB
STEP 263 MB 725 MB
STL 82 MB 640 MB
OBJ 174 MB 1.1 GB
Visual
GLB 40 MB 780 MB
OBJ 120 MB 968 MB

1937. NB-IoT-DevKit_Rev_C

NB-IoT-DevKit_Rev_C: stages 4 and 6 take 48% to 84% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 22 s. Visual, GLB takes 23 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.7 5.6 0.6 ms 5.4 0.3 0.7 0.2 14.4
Simulation, STEP 0.5 1.8 5.6 0.7 ms 5.2 3.7 0.8 0.2 17.8
Simulation, STL 0.5 1.7 5.7 1 ms 5.3 0.4 0.8 0.2 14.5
Simulation, OBJ 0.5 1.7 5.5 0.5 ms 5.3 8.6 0.7 0.2 22.5
Visual, GLB 0.5 1.6 5.7 0.6 ms 13.7 0.2 1.2 0.2 23.2
Visual, OBJ 0.5 1.6 5.6 0.6 ms 13.7 5.9 1.4 0.2 29.0
Board Repo: OLIMEX/NB-IoT
Board: NB-IoT-DevKit_Rev_C.kicad_pcb
Folder HARDWARE / NB-IoT-DevKit_Rev_C
Complexity 307 / 1000 (size 217, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 105, 2,707, 203
Triangles, simulation 1,641,972 in 137 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 652 MB
STEP 263 MB 725 MB
STL 82 MB 675 MB
OBJ 174 MB 1.1 GB
Visual
GLB 40 MB 750 MB
OBJ 120 MB 907 MB

1938. NB-IoT-DevKit_Rev_D

NB-IoT-DevKit_Rev_D: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 24 s. Simulation, STL takes 19 s. Simulation, OBJ takes 28 s. Visual, GLB takes 30 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.0 6.7 0.9 ms 7.0 0.3 0.9 0.3 17.9
Simulation, STEP 0.7 2.0 7.8 0.7 ms 7.4 5.1 1.0 0.4 24.4
Simulation, STL 0.7 2.2 7.2 0.8 ms 7.4 0.6 1.1 0.3 19.5
Simulation, OBJ 0.6 2.0 6.8 1 ms 6.9 10.7 1.1 0.3 28.3
Visual, GLB 0.7 2.1 6.8 0.6 ms 18.0 0.2 1.8 0.3 30.0
Visual, OBJ 0.6 2.3 7.0 0.9 ms 17.1 7.1 1.7 0.2 36.1
Board Repo: OLIMEX/NB-IoT
Board: NB-IoT-DevKit_Rev_D.kicad_pcb
Folder HARDWARE / NB-IoT-DevKit_Rev_D
Complexity 307 / 1000 (size 217, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 105, 2,813, 196
Triangles, simulation 1,716,800 in 137 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 60 MB 637 MB
STEP 275 MB 766 MB
STL 86 MB 673 MB
OBJ 182 MB 1.2 GB
Visual
GLB 42 MB 820 MB
OBJ 126 MB 982 MB

1939. Neo6502_Rev_B

Neo6502_Rev_B: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 36 s. Visual, GLB takes 45 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.9 9.8 0.8 ms 8.9 0.3 1.1 0.3 24.1
Simulation, STEP 0.6 2.6 9.6 0.8 ms 8.9 6.2 1.1 0.2 29.3
Simulation, STL 0.7 2.8 9.6 0.8 ms 8.9 0.8 1.1 0.2 24.2
Simulation, OBJ 0.7 2.8 9.3 1.0 ms 10.1 11.9 1.2 0.3 36.3
Visual, GLB 0.7 2.8 11.1 0.9 ms 26.4 0.3 3.0 0.2 44.5
Visual, OBJ 0.8 3.0 10.6 0.8 ms 21.6 10.8 3.1 0.2 50.2
Board Repo: OLIMEX/Neo6502
Board: Neo6502_Rev_B.kicad_pcb
Folder HARDWARE / Neo6502-rev-B
Complexity 303 / 1000 (size 248, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 89, 2,635, 438
Triangles, simulation 2,044,474 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 902 MB
STEP 388 MB 1.1 GB
STL 102 MB 856 MB
OBJ 217 MB 1.4 GB
Visual
GLB 64 MB 1.1 GB
OBJ 196 MB 1.3 GB

1940. Neo6502_Rev_B1

Neo6502_Rev_B1: stages 4 and 6 take 55% to 80% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 20 s. Simulation, OBJ takes 29 s. Visual, GLB takes 33 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.3 8.0 0.7 ms 8.1 0.3 1.0 0.3 20.4
Simulation, STEP 0.6 2.2 8.0 0.9 ms 8.2 5.1 1.0 0.2 25.4
Simulation, STL 0.6 2.2 7.9 0.8 ms 7.8 0.5 0.9 0.2 20.0
Simulation, OBJ 0.6 2.2 7.9 0.8 ms 7.8 8.7 1.1 0.3 28.6
Visual, GLB 0.6 2.2 7.8 1.0 ms 18.4 0.3 3.2 0.3 32.8
Visual, OBJ 0.5 2.2 7.7 1 ms 19.1 7.9 3.0 0.3 40.7
Board Repo: OLIMEX/Neo6502
Board: Neo6502_Rev_B1.kicad_pcb
Folder HARDWARE / Neo6502-rev-B1
Complexity 303 / 1000 (size 248, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 89, 2,635, 438
Triangles, simulation 2,044,474 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 929 MB
STEP 388 MB 1.1 GB
STL 102 MB 896 MB
OBJ 217 MB 1.4 GB
Visual
GLB 64 MB 1.1 GB
OBJ 196 MB 1.4 GB

1941. Neo6502_Rev_A

Neo6502_Rev_A: stages 4 and 6 take 55% to 79% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.5 s. Simulation, OBJ takes 13 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.1 4.4 0.4 ms 2.7 0.1 0.3 0.2 9.3
Simulation, STEP 0.4 1.1 4.6 0.4 ms 2.7 2.4 0.3 0.2 11.8
Simulation, STL 0.4 1.1 4.5 0.4 ms 2.8 0.2 0.3 0.2 9.5
Simulation, OBJ 0.4 1.1 4.4 0.4 ms 2.7 3.6 0.4 0.3 12.9
Visual, GLB 0.4 1.2 4.5 0.6 ms 7.0 0.1 0.9 0.3 14.5
Visual, OBJ 0.4 1.1 4.6 0.4 ms 7.1 3.5 0.9 0.2 17.8
Board Repo: OLIMEX/Neo6502
Board: Neo6502_Rev_A.kicad_pcb
Folder HARDWARE / New6502-Rev-A
Complexity 266 / 1000 (size 221, features 45)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
copper text
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 89, 625, 45
Triangles, simulation 618,484 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 380 MB
STEP 108 MB 452 MB
STL 31 MB 376 MB
OBJ 66 MB 489 MB
Visual
GLB 19 MB 445 MB
OBJ 56 MB 492 MB

1942. Neo6502kbd_Rev_A

Neo6502kbd_Rev_A: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 37 s. Visual, GLB takes 39 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.1 10.7 0.9 ms 9.1 0.4 1.3 0.3 25.8
Simulation, STEP 0.9 3.0 11.2 0.5 ms 8.8 5.6 1.3 0.3 31.0
Simulation, STL 0.9 3.1 11.5 1 ms 9.1 0.8 1.4 0.3 27.1
Simulation, OBJ 0.9 3.1 10.8 0.9 ms 8.6 12.0 1.3 0.2 37.0
Visual, GLB 0.9 3.0 10.8 1 ms 20.8 0.2 2.7 0.2 38.7
Visual, OBJ 0.9 3.1 10.5 1 ms 20.2 8.6 2.9 0.2 46.3
Board Repo: OLIMEX/Neo6502kbd
Board: Neo6502kbd_Rev_A.kicad_pcb
Folder HARDWARE / Neo6502kbd-Rev.A
Complexity 377 / 1000 (size 272, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 134, 3,008, 558
Triangles, simulation 2,878,202 in 179 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 101 MB 1.1 GB
STEP 404 MB 1.3 GB
STL 144 MB 1.1 GB
OBJ 310 MB 2.0 GB
Visual
GLB 66 MB 1.2 GB
OBJ 207 MB 1.5 GB

1943. Neo6502PC-CPU_Rev_B

Neo6502PC-CPU_Rev_B: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 35 s. Simulation, STEP takes 42 s. Simulation, STL takes 36 s. Simulation, OBJ takes 54 s. Visual, GLB takes 56 s. Visual, OBJ takes 67 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.7 13.3 1 ms 13.5 0.5 1.9 0.3 35.3
Simulation, STEP 1.0 4.7 13.5 2 ms 13.0 8.2 1.8 0.3 42.4
Simulation, STL 1.0 4.5 13.3 1 ms 13.5 1.2 2.0 0.3 36.0
Simulation, OBJ 1.3 4.6 13.6 1 ms 13.7 18.1 2.1 0.4 53.8
Visual, GLB 1.1 4.8 13.4 1 ms 31.7 0.4 4.2 0.3 55.9
Visual, OBJ 1.3 4.8 13.2 1 ms 31.5 11.9 4.1 0.3 67.1
Board Repo: OLIMEX/Neo6502pc
Board: Neo6502PC-CPU_Rev_B.kicad_pcb
Folder HARDWARE / Neo6502pc-CPU-rev.B
Complexity 378 / 1000 (size 273, features 105)
KESE features through vias, slotted holes,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 100, 3,940, 752
Triangles, simulation 3,472,416 in 168 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 121 MB 1.3 GB
STEP 496 MB 1.5 GB
STL 174 MB 1.2 GB
OBJ 374 MB 2.3 GB
Visual
GLB 81 MB 1.3 GB
OBJ 254 MB 1.8 GB

1944. Neo6502PC-PWR_Rev_B

Neo6502PC-PWR_Rev_B: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 17 s. Visual, GLB takes 17 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 4.6 0.8 ms 3.7 0.2 0.5 0.3 11.3
Simulation, STEP 0.6 1.6 4.6 0.6 ms 3.8 2.4 0.5 0.2 13.8
Simulation, STL 0.5 1.6 4.4 0.5 ms 3.8 0.2 0.5 0.2 11.2
Simulation, OBJ 0.5 1.6 4.6 0.6 ms 3.7 5.6 0.5 0.2 16.7
Visual, GLB 0.5 1.6 4.6 0.7 ms 9.2 0.1 1.0 0.2 17.2
Visual, OBJ 0.5 1.6 4.6 0.5 ms 8.8 5.1 1.1 0.2 21.9
Board Repo: OLIMEX/Neo6502pc
Board: Neo6502PC-PWR_Rev_B.kicad_pcb
Folder HARDWARE / Neo6502pc-PWR-rev.B
Complexity 299 / 1000 (size 194, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 53, 2,056, 491
Triangles, simulation 1,079,874 in 72 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 38 MB 501 MB
STEP 155 MB 621 MB
STL 54 MB 514 MB
OBJ 112 MB 770 MB
Visual
GLB 33 MB 685 MB
OBJ 100 MB 790 MB
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