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Corpus Testing 24

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Corpus Page 24

Part 24 of 29 of Corpus Testing: every board of these projects, six runs each, one file format a run, as Corpus Testing describes.

24.1 uaefi

uaefi: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 48 s. Simulation, STL takes 39 s. Simulation, OBJ takes 62 s. Visual, GLB takes 60 s. Visual, OBJ takes 76 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.5 15.4 1 ms 15.1 0.7 2.2 0.3 39.3
Simulation, STEP 0.9 4.5 15.2 1 ms 14.7 9.7 2.2 0.3 47.6
Simulation, STL 0.9 4.4 14.8 1 ms 14.5 1.6 2.2 0.3 38.8
Simulation, OBJ 1.0 4.5 14.8 1 ms 15.4 23.6 2.1 0.3 61.6
Visual, GLB 0.9 4.4 15.4 1 ms 34.3 0.4 4.5 0.3 60.2
Visual, OBJ 1.0 4.7 14.7 1 ms 35.7 14.8 4.5 0.3 75.7
Board Repo: rusefi/uaefi
Board: uaefi.kicad_pcb
Complexity 314 / 1000 (size 219, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 156, 1,765, 376
Triangles, simulation 4,219,476 in 254 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 143 MB 1.3 GB
STEP 595 MB 1.6 GB
STL 211 MB 1.3 GB
OBJ 447 MB 2.7 GB
Visual
GLB 93 MB 1.5 GB
OBJ 292 MB 2.0 GB

24.2 sd2snes_ecp5

sd2snes_ecp5: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 69 s. Simulation, STL takes 59 s. Simulation, OBJ takes 91 s. Visual, GLB takes 90 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 7.3 24.4 1.0 ms 20.9 1.0 2.7 0.4 57.7
Simulation, STEP 1.1 7.0 23.7 1 ms 20.6 13.5 2.7 0.4 69.0
Simulation, STL 1.0 6.9 23.9 0.9 ms 21.5 2.3 2.9 0.3 58.9
Simulation, OBJ 0.9 7.0 24.6 0.9 ms 21.1 34.0 2.7 0.3 90.7
Visual, GLB 1.0 7.2 24.2 1 ms 50.2 0.5 6.7 0.3 90.2
Visual, OBJ 1.0 7.3 24.4 0.9 ms 48.4 20.0 6.7 0.3 108.1
Board Repo: samlittlewood/sd2snes_ecp5
Board: sd2snes_ecp5.kicad_pcb
Complexity 390 / 1000 (size 300, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 174, 3,190, 1,021
Triangles, simulation 5,798,382 in 429 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 199 MB 1.7 GB
STEP 824 MB 2.2 GB
STL 290 MB 1.7 GB
OBJ 633 MB 3.8 GB
Visual
GLB 122 MB 2.0 GB
OBJ 396 MB 2.6 GB

24.3 tv070hat

tv070hat: stages 4 and 6 take 46% to 83% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.8 s. Simulation, OBJ takes 16 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.2 3.2 0.4 ms 4.3 0.2 0.7 0.2 10.2
Simulation, STEP 0.3 1.1 3.1 0.4 ms 4.3 2.9 0.7 0.2 12.6
Simulation, STL 0.3 1.1 3.0 0.4 ms 4.1 0.3 0.7 0.2 9.8
Simulation, OBJ 0.3 1.1 3.2 1 ms 4.4 6.5 0.7 0.2 16.4
Visual, GLB 0.3 1.1 3.1 0.3 ms 10.3 0.1 1.1 0.2 16.3
Visual, OBJ 0.3 1.1 3.1 0.4 ms 10.2 4.2 1.2 0.2 20.5
Board Repo: ScandentLLC/tv070wxm-hat
Board: tv070hat.kicad_pcb
Complexity 286 / 1000 (size 196, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 45, 1,061, 182
Triangles, simulation 1,240,344 in 99 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 42 MB 496 MB
STEP 157 MB 624 MB
STL 62 MB 515 MB
OBJ 127 MB 835 MB
Visual
GLB 28 MB 684 MB
OBJ 87 MB 682 MB

24.4 CM5RevEng

CM5RevEng: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.9 17.0 43.9 1 ms 56.0 2.6 7.9 0.5 130.7
Simulation, STEP 3.3 17.3 45.1 2 ms 56.3 25.9 8.0 0.5 156.4
Simulation, STL 3.0 17.7 45.0 2 ms 56.0 5.6 7.3 0.5 135.1
Simulation, OBJ 2.9 17.0 45.1 2 ms 56.9 75.6 7.1 0.6 205.0
Visual, GLB 3.1 17.8 47.4 3 ms 113.8 1.0 10.6 0.4 194.0
Visual, OBJ 3.0 17.6 44.7 2 ms 108.8 29.3 10.2 0.5 214.1
Board Repo: schlae/cm5-reveng
Board: CM5RevEng.kicad_pcb
Complexity 537 / 1000 (size 347, features 190)
KESE features through vias,
blind and buried vias, microvias,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 10
File format KiCad 9 (20241229)
Parts, tracks, vias 417, 8,115, 2,902
Triangles, simulation 13,000,160 in 456 parts
Verifier Simulation, GLB: Verifier FAIL
Simulation, STEP: Verifier FAIL
Simulation, STL: Verifier FAIL
Simulation, OBJ: Verifier FAIL
Bad design Bad design according to KESE: copper of two nets on top of each other in the file, a short KiCad's DRC reports; a GND via and a CM5_1V8 via 0.056 mm apart at (128.38, 64.01) mm. KESE models what the file says, so the Verifier rightly finds the two nets' solids overlapping
File
type
File
size
Peak memory
used
Simulation
GLB 444 MB 2.9 GB
STEP 1.6 GB 4.0 GB
STL 650 MB 2.8 GB
OBJ 1.4 GB 8.2 GB
Visual
GLB 198 MB 3.5 GB
OBJ 655 MB 4.3 GB

24.5 rpi-rm0

rpi-rm0: stages 4 and 6 take 44% to 70% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 14 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 1.4 3.7 0.8 ms 2.9 0.2 0.5 0.2 10.6
Simulation, STEP 1.7 1.3 3.6 0.7 ms 2.9 2.3 0.5 0.2 12.4
Simulation, STL 1.6 1.2 3.5 0.6 ms 2.9 0.3 0.5 0.3 10.3
Simulation, OBJ 1.7 1.4 3.6 0.5 ms 2.9 4.5 0.5 0.3 14.8
Visual, GLB 1.8 1.3 3.6 0.5 ms 6.0 69 ms 0.6 0.3 13.7
Visual, OBJ 1.7 1.3 3.6 0.8 ms 6.0 2.2 0.6 0.2 15.5
Board Repo: schlae/cm5-reveng
Board: rpi-rm0.kicad_pcb
Folder rpi-rm0
Complexity 413 / 1000 (size 258, features 155)
KESE features through vias,
blind and buried vias, microvias,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 40, 465, 451
Triangles, simulation 897,508 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 476 MB
STEP 93 MB 538 MB
STL 45 MB 488 MB
OBJ 90 MB 680 MB
Visual
GLB 16 MB 458 MB
OBJ 48 MB 493 MB

24.6 GreengateDS3

GreengateDS3: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 39 s. Simulation, STL takes 30 s. Simulation, OBJ takes 46 s. Visual, GLB takes 42 s. Visual, OBJ takes 53 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.4 13.6 1 ms 11.6 0.6 1.5 0.3 31.1
Simulation, STEP 0.9 2.6 13.7 1 ms 11.2 8.3 1.5 0.4 38.6
Simulation, STL 0.8 2.5 12.9 1 ms 10.9 1.0 1.5 0.3 29.9
Simulation, OBJ 0.9 2.4 12.5 1 ms 11.0 17.4 1.5 0.4 46.1
Visual, GLB 0.8 2.4 12.6 1 ms 22.8 0.3 2.4 0.2 41.6
Visual, OBJ 1.0 2.7 12.9 1 ms 23.5 10.6 2.4 0.3 53.3
Board Repo: schlae/goodgreat-ds3
Board: GreengateDS3.kicad_pcb
Complexity 305 / 1000 (size 195, features 110)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 70, 2,657, 168
Triangles, simulation 2,921,532 in 175 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 98 MB 1.0 GB
STEP 405 MB 1.2 GB
STL 146 MB 1.1 GB
OBJ 304 MB 1.9 GB
Visual
GLB 62 MB 1.3 GB
OBJ 193 MB 1.4 GB

24.7 isavideo

isavideo: stages 4 and 6 take 60% to 84% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 32 s. Visual, GLB takes 35 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.8 10.4 0.4 ms 8.6 0.3 0.9 0.2 23.8
Simulation, STEP 0.5 2.6 10.1 0.7 ms 9.7 5.6 0.9 0.2 29.7
Simulation, STL 0.5 2.7 10.6 0.9 ms 9.1 0.8 0.9 0.3 24.9
Simulation, OBJ 0.4 2.7 10.2 0.6 ms 9.3 8.3 1.0 0.3 32.2
Visual, GLB 0.5 2.6 9.7 0.4 ms 19.3 0.3 2.0 0.2 34.5
Visual, OBJ 0.5 2.8 9.9 0.6 ms 18.8 7.1 2.9 0.3 42.2
Board Repo: schlae/graphics-gremlin
Board: isavideo.kicad_pcb
Complexity 329 / 1000 (size 249, features 80)
KESE features through vias, slotted holes,
custom pads, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 93, 2,062, 258
Triangles, simulation 1,773,268 in 218 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 63 MB 756 MB
STEP 331 MB 909 MB
STL 89 MB 778 MB
OBJ 191 MB 1.3 GB
Visual
GLB 54 MB 1.2 GB
OBJ 164 MB 1.2 GB

24.8 SnarkBarker

SnarkBarker: stages 4 and 6 take 61% to 86% of a run. Simulation, GLB takes 65 s. Simulation, STEP takes 80 s. Simulation, STL takes 66 s. Simulation, OBJ takes 89 s. Visual, GLB takes 83 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.0 31.9 2 ms 23.4 0.9 2.9 0.4 65.2
Simulation, STEP 0.5 4.9 32.8 1 ms 24.2 14.7 3.0 0.3 80.4
Simulation, STL 0.6 5.1 32.7 0.9 ms 22.9 1.7 2.6 0.3 65.9
Simulation, OBJ 0.7 5.1 31.1 2 ms 23.0 25.6 2.8 0.4 88.7
Visual, GLB 0.6 4.8 29.4 1 ms 42.2 0.5 5.0 0.3 82.8
Visual, OBJ 0.7 4.9 31.7 1 ms 41.7 15.0 5.6 0.3 100.0
Board Repo: schlae/snark-barker
Board: SnarkBarker.kicad_pcb
Complexity 244 / 1000 (size 209, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 192, 3,341, 189
Triangles, simulation 5,547,974 in 227 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 191 MB 1.7 GB
STEP 992 MB 2.0 GB
STL 277 MB 1.7 GB
OBJ 596 MB 3.6 GB
Visual
GLB 106 MB 1.7 GB
OBJ 334 MB 2.2 GB

24.9 BM28B0.6-24DSBreakout

BM28B0.6-24DSBreakout: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 2.7 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.6 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 0.1 0.7 0.2 ms 0.7 24 ms 97 ms 0.2 1.9
Simulation, STEP 83 ms 0.1 0.7 0.2 ms 0.6 0.8 0.1 0.2 2.7
Simulation, STL 80 ms 0.1 0.7 0.2 ms 0.7 37 ms 0.1 0.2 1.9
Simulation, OBJ 90 ms 0.1 0.7 0.2 ms 0.6 0.7 96 ms 0.2 2.6
Visual, GLB 91 ms 0.1 0.6 0.2 ms 1.5 16 ms 95 ms 0.2 2.6
Visual, OBJ 87 ms 0.1 0.7 0.2 ms 1.4 0.6 90 ms 0.2 3.2
Board Repo: scottbez1/smartknob
Board: BM28B0.6-24DSBreakout.kicad_pcb
Folder electronics / BM28B0.6-24DSBreakout
Complexity 105 / 1000 (size 105, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 84, 0
Triangles, simulation 143,778 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.8 MB 184 MB
STEP 19 MB 199 MB
STL 7.2 MB 191 MB
OBJ 14 MB 198 MB
Visual
GLB 3.2 MB 165 MB
OBJ 8.9 MB 163 MB

24.10 LevelShifterBreakout

LevelShifterBreakout: stages 4 and 6 take 45% to 75% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 76 ms 0.1 0.4 0.1 ms 0.5 20 ms 65 ms 0.2 1.4
Simulation, STEP 75 ms 0.1 0.4 0.1 ms 0.5 0.7 61 ms 0.2 2.0
Simulation, STL 69 ms 0.1 0.4 0.2 ms 0.5 26 ms 61 ms 0.2 1.4
Simulation, OBJ 66 ms 0.1 0.4 0.2 ms 0.5 0.5 73 ms 0.2 1.9
Visual, GLB 78 ms 98 ms 0.4 0.2 ms 1.2 15 ms 0.1 0.2 2.1
Visual, OBJ 79 ms 0.1 0.4 0.1 ms 1.2 0.4 0.1 0.2 2.5
Board Repo: scottbez1/smartknob
Board: LevelShifterBreakout.kicad_pcb
Folder electronics / LevelShifterBreakout
Complexity 156 / 1000 (size 111, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 5, 63, 11
Triangles, simulation 137,936 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.7 MB 194 MB
STEP 18 MB 199 MB
STL 6.9 MB 192 MB
OBJ 13 MB 195 MB
Visual
GLB 3.5 MB 160 MB
OBJ 10 MB 167 MB

24.11 view_base

view_base: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 9.9 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 3.6 0.5 ms 4.1 0.1 0.5 0.2 9.9
Simulation, STEP 0.3 1.0 3.2 0.4 ms 4.0 3.1 0.5 0.3 12.5
Simulation, STL 0.4 0.9 3.2 0.4 ms 3.9 0.2 0.5 0.2 9.4
Simulation, OBJ 0.3 1.0 3.3 0.3 ms 3.9 5.0 0.5 0.2 14.3
Visual, GLB 0.3 0.9 3.2 0.4 ms 8.4 0.1 0.9 0.2 14.1
Visual, OBJ 0.3 1.0 3.3 0.4 ms 8.3 4.1 1.1 0.3 18.4
Board Repo: scottbez1/smartknob
Board: view_base.kicad_pcb
Folder electronics / view_base
Complexity 317 / 1000 (size 182, features 135)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 76, 834, 174
Triangles, simulation 919,322 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 471 MB
STEP 159 MB 526 MB
STL 46 MB 461 MB
OBJ 93 MB 644 MB
Visual
GLB 28 MB 584 MB
OBJ 84 MB 633 MB

24.12 view_screen

view_screen: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.1 s. Simulation, OBJ takes 2.8 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.1 ms 0.9 32 ms 91 ms 0.3 2.3
Simulation, STEP 0.1 0.2 0.7 0.2 ms 0.9 1.0 85 ms 0.2 3.1
Simulation, STL 0.1 0.2 0.7 0.2 ms 0.8 46 ms 98 ms 0.2 2.1
Simulation, OBJ 0.1 0.2 0.7 0.1 ms 0.8 0.8 81 ms 0.2 2.8
Visual, GLB 0.1 0.2 0.7 0.2 ms 1.7 24 ms 0.2 0.2 3.1
Visual, OBJ 0.1 0.2 0.7 0.1 ms 1.7 0.7 0.2 0.2 3.8
Board Repo: scottbez1/smartknob
Board: view_screen.kicad_pcb
Folder electronics / view_screen
Complexity 212 / 1000 (size 122, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 11, 58, 20
Triangles, simulation 161,874 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.7 MB 203 MB
STEP 31 MB 221 MB
STL 8.1 MB 204 MB
OBJ 16 MB 204 MB
Visual
GLB 5.0 MB 200 MB
OBJ 14 MB 200 MB

24.13 chainlinkBase

chainlinkBase: stages 4 and 6 take 59% to 86% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 25 s. Simulation, STL takes 22 s. Simulation, OBJ takes 30 s. Visual, GLB takes 31 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.0 11.0 0.4 ms 6.8 0.3 0.8 0.3 21.5
Simulation, STEP 0.3 2.1 10.6 0.5 ms 6.7 4.7 0.7 0.2 25.5
Simulation, STL 0.4 2.2 11.1 0.4 ms 6.8 0.6 0.8 0.3 22.3
Simulation, OBJ 0.4 2.1 11.1 0.4 ms 6.7 9.1 0.8 0.2 30.4
Visual, GLB 0.3 2.1 11.0 0.4 ms 15.7 0.2 1.7 0.2 31.2
Visual, OBJ 0.3 2.2 10.8 0.4 ms 16.1 6.4 1.8 0.3 38.0
Board Repo: scottbez1/splitflap
Board: chainlinkBase.kicad_pcb
Folder electronics / chainlinkBase
Complexity 236 / 1000 (size 191, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 119, 932, 259
Triangles, simulation 1,978,438 in 112 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 68 MB 699 MB
STEP 332 MB 849 MB
STL 99 MB 791 MB
OBJ 211 MB 1.3 GB
Visual
GLB 46 MB 855 MB
OBJ 138 MB 1.0 GB

24.14 chainlinkBuddyBreadboard

chainlinkBuddyBreadboard: stages 4 and 6 take 45% to 76% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.1 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 87 ms 0.1 0.5 0.1 ms 0.5 18 ms 59 ms 0.2 1.5
Simulation, STEP 87 ms 0.1 0.5 0.2 ms 0.6 0.8 72 ms 0.2 2.4
Simulation, STL 91 ms 0.1 0.5 0.2 ms 0.6 26 ms 64 ms 0.2 1.6
Simulation, OBJ 84 ms 0.1 0.5 0.2 ms 0.6 0.5 62 ms 0.2 2.1
Visual, GLB 87 ms 0.1 0.5 0.1 ms 1.3 17 ms 0.1 0.2 2.3
Visual, OBJ 0.1 0.1 0.6 0.2 ms 1.3 0.4 0.1 0.2 2.8
Board Repo: scottbez1/splitflap
Board: chainlinkBuddyBreadboard.kicad_pcb
Folder electronics / chainlinkBuddyBreadboard
Complexity 129 / 1000 (size 84, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 13, 5
Triangles, simulation 109,334 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.8 MB 187 MB
STEP 17 MB 187 MB
STL 5.5 MB 187 MB
OBJ 11 MB 180 MB
Visual
GLB 3.0 MB 152 MB
OBJ 8.4 MB 152 MB

24.15 chainlinkBuddyTDisplay

chainlinkBuddyTDisplay: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 6.0 s. Simulation, STEP takes 7.6 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 9.1 s. Visual, GLB takes 8.2 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.7 0.3 ms 1.9 94 ms 0.3 0.3 6.0
Simulation, STEP 0.2 0.5 2.7 0.3 ms 1.9 1.8 0.3 0.2 7.6
Simulation, STL 0.2 0.6 2.8 0.2 ms 1.8 0.2 0.3 0.2 6.0
Simulation, OBJ 0.2 0.6 2.7 0.3 ms 1.9 3.3 0.3 0.2 9.1
Visual, GLB 0.2 0.5 2.7 0.3 ms 3.9 65 ms 0.6 0.2 8.2
Visual, OBJ 0.2 0.5 2.6 0.3 ms 3.8 2.1 0.5 0.2 10.0
Board Repo: scottbez1/splitflap
Board: chainlinkBuddyTDisplay.kicad_pcb
Folder electronics / chainlinkBuddyTDisplay
Complexity 159 / 1000 (size 109, features 50)
KESE features slotted holes, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 64, 0
Triangles, simulation 587,596 in 33 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 301 MB
STEP 83 MB 358 MB
STL 29 MB 290 MB
OBJ 59 MB 432 MB
Visual
GLB 13 MB 368 MB
OBJ 39 MB 382 MB

24.16 chainlinkDriver

chainlinkDriver: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 9.0 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 14 s. Visual, GLB takes 15 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 3.8 0.6 ms 3.3 0.1 0.5 0.2 9.0
Simulation, STEP 0.2 0.8 4.0 0.4 ms 3.4 3.0 0.4 0.2 12.2
Simulation, STL 0.2 0.9 3.8 0.6 ms 3.3 0.2 0.4 0.3 9.2
Simulation, OBJ 0.3 0.8 3.9 0.4 ms 3.5 5.0 0.4 0.2 14.1
Visual, GLB 0.3 0.9 3.9 0.4 ms 8.3 0.2 1.1 0.2 14.8
Visual, OBJ 0.2 0.7 3.7 0.4 ms 8.2 4.1 0.9 0.2 18.1
Board Repo: scottbez1/splitflap
Board: chainlinkDriver.kicad_pcb
Folder electronics / chainlinkDriver
Complexity 219 / 1000 (size 174, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 58, 687, 111
Triangles, simulation 979,006 in 95 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 423 MB
STEP 154 MB 512 MB
STL 49 MB 428 MB
OBJ 98 MB 663 MB
Visual
GLB 26 MB 633 MB
OBJ 79 MB 633 MB

24.17 chainlinkDriverTester

chainlinkDriverTester: stages 4 and 6 take 57% to 87% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 18 s. Visual, GLB takes 20 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.0 6.1 0.7 ms 4.8 0.2 0.6 0.3 13.2
Simulation, STEP 0.2 1.0 6.0 0.7 ms 5.0 3.5 0.5 0.2 16.4
Simulation, STL 0.2 0.9 6.0 0.8 ms 4.6 0.4 0.5 0.2 12.9
Simulation, OBJ 0.2 0.9 5.9 0.5 ms 4.7 6.0 0.5 0.2 18.5
Visual, GLB 0.2 1.0 6.2 0.7 ms 11.2 0.1 1.1 0.2 20.1
Visual, OBJ 0.2 1.0 5.8 1 ms 12.5 4.2 1.6 0.2 25.7
Board Repo: scottbez1/splitflap
Board: chainlinkDriverTester.kicad_pcb
Folder electronics / chainlinkDriverTester
Complexity 236 / 1000 (size 171, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 59, 536, 97
Triangles, simulation 1,553,564 in 107 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 651 MB
STEP 214 MB 719 MB
STL 78 MB 604 MB
OBJ 158 MB 1.0 GB
Visual
GLB 33 MB 697 MB
OBJ 101 MB 790 MB

24.18 sensor

sensor: stages 4 and 6 take 33% to 65% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 1.8 s. Simulation, STL takes 0.9 s. Simulation, OBJ takes 1.1 s. Visual, GLB takes 1.1 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 73 ms 61 ms 0.2 0.1 ms 0.6 12 ms 44 ms 0.2 1.2
Simulation, STEP 89 ms 74 ms 0.2 0.1 ms 0.3 0.7 33 ms 0.3 1.8
Simulation, STL 71 ms 61 ms 0.2 0.1 ms 0.3 13 ms 29 ms 0.2 0.9
Simulation, OBJ 71 ms 63 ms 0.2 0.1 ms 0.3 0.2 32 ms 0.2 1.1
Visual, GLB 71 ms 61 ms 0.2 0.1 ms 0.5 6 ms 48 ms 0.2 1.1
Visual, OBJ 59 ms 55 ms 0.2 0.1 ms 0.4 0.1 39 ms 0.1 1.1
Board Repo: scottbez1/splitflap
Board: sensor.kicad_pcb
Folder electronics / sensor
Complexity 60 / 1000 (size 60, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 6, 0
Triangles, simulation 51,798 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.8 MB 69 MB
STEP 8.2 MB 170 MB
STL 2.6 MB 69 MB
OBJ 5.0 MB 80 MB
Visual
GLB 1.2 MB 92 MB
OBJ 3.2 MB 105 MB

24.19 sensor_smd

sensor_smd: stages 4 and 6 take 38% to 67% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.6 s. Visual, GLB takes 1.5 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 99 ms 87 ms 0.2 0.1 ms 0.6 12 ms 47 ms 0.3 1.3
Simulation, STEP 99 ms 0.1 0.3 0.1 ms 0.6 0.8 40 ms 0.2 2.1
Simulation, STL 94 ms 83 ms 0.2 0.1 ms 0.6 16 ms 35 ms 0.2 1.3
Simulation, OBJ 0.1 83 ms 0.2 0.1 ms 0.5 0.4 39 ms 0.3 1.6
Visual, GLB 95 ms 85 ms 0.2 0.1 ms 0.8 16 ms 93 ms 0.2 1.5
Visual, OBJ 96 ms 85 ms 0.2 0.1 ms 0.8 0.3 76 ms 0.3 1.8
Board Repo: scottbez1/splitflap
Board: sensor_smd.kicad_pcb
Folder electronics / sensor_smd
Complexity 177 / 1000 (size 92, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 10th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 5, 24, 2
Triangles, simulation 60,768 in 17 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.1 MB 73 MB
STEP 11 MB 186 MB
STL 3.0 MB 73 MB
OBJ 5.8 MB 87 MB
Visual
GLB 1.8 MB 108 MB
OBJ 5.0 MB 107 MB

24.20 mppt

mppt: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 20 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.8 6.5 0.7 ms 4.7 0.2 0.6 0.2 14.6
Simulation, STEP 0.5 1.8 6.7 0.6 ms 4.9 4.0 0.6 0.3 18.8
Simulation, STL 0.5 1.9 6.6 0.8 ms 4.8 0.4 0.6 0.3 14.9
Simulation, OBJ 0.5 1.9 6.8 0.7 ms 4.9 8.2 0.5 0.2 23.0
Visual, GLB 0.5 1.8 6.5 0.8 ms 10.2 0.1 1.2 0.2 20.5
Visual, OBJ 0.5 1.8 6.6 0.6 ms 10.9 4.7 1.6 0.3 26.3
Board Repo: seandepagnier/mppt
Board: mppt.kicad_pcb
Folder schematics
Complexity 275 / 1000 (size 205, features 70)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 152, 949, 117
Triangles, simulation 1,286,936 in 115 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 580 MB
STEP 208 MB 641 MB
STL 64 MB 565 MB
OBJ 135 MB 891 MB
Visual
GLB 27 MB 656 MB
OBJ 82 MB 675 MB

24.21 reCamera B101 v1.0

reCamera B101 v1.0: stages 4 and 6 take 44% to 80% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.4 s. Simulation, STL takes 6.5 s. Simulation, OBJ takes 10 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 2.1 0.3 ms 2.7 0.1 0.4 0.2 6.8
Simulation, STEP 0.3 1.0 2.0 0.4 ms 2.5 2.0 0.4 0.2 8.4
Simulation, STL 0.3 0.9 1.9 0.4 ms 2.5 0.2 0.4 0.3 6.5
Simulation, OBJ 0.3 0.8 2.1 0.2 ms 2.6 4.0 0.3 0.2 10.4
Visual, GLB 0.3 0.8 2.1 0.3 ms 5.9 79 ms 0.6 0.2 10.0
Visual, OBJ 0.3 0.8 1.9 0.4 ms 6.1 3.0 0.8 0.2 13.1
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera B101 v1.0.kicad_pcb
Folder hardware / recamera-2002 / base / b101-default / PCB / V1.0
Complexity 295 / 1000 (size 185, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 46, 408, 133
Triangles, simulation 794,838 in 86 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 393 MB
STEP 123 MB 455 MB
STL 40 MB 418 MB
OBJ 80 MB 550 MB
Visual
GLB 19 MB 461 MB
OBJ 57 MB 454 MB

24.22 reCamera B101 v1.1

reCamera B101 v1.1: stages 4 and 6 take 43% to 77% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.3 s. Simulation, STL takes 6.4 s. Simulation, OBJ takes 10 s. Visual, GLB takes 9.5 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 2.3 0.7 ms 2.5 0.1 0.4 0.2 6.8
Simulation, STEP 0.3 1.0 1.9 0.4 ms 2.4 2.0 0.4 0.2 8.3
Simulation, STL 0.3 1.0 1.8 0.4 ms 2.5 0.2 0.4 0.2 6.4
Simulation, OBJ 0.3 1.0 1.9 0.3 ms 2.6 4.0 0.4 0.2 10.3
Visual, GLB 0.3 1.0 1.9 0.4 ms 5.4 82 ms 0.6 0.2 9.5
Visual, OBJ 0.3 1.0 1.9 0.4 ms 5.1 2.9 0.6 0.2 12.1
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera B101 v1.1.kicad_pcb
Folder hardware / recamera-2002 / base / b101-default / PCB / V1.1
Complexity 304 / 1000 (size 189, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 45, 566, 157
Triangles, simulation 778,752 in 84 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 366 MB
STEP 112 MB 456 MB
STL 39 MB 376 MB
OBJ 78 MB 588 MB
Visual
GLB 19 MB 483 MB
OBJ 57 MB 492 MB

24.23 reCamera B101 v1.2

reCamera B101 v1.2: stages 4 and 6 take 42% to 76% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.7 s. Simulation, STL takes 7.3 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 2.2 0.3 ms 2.8 0.2 0.5 0.3 7.4
Simulation, STEP 0.3 1.2 2.2 0.4 ms 2.9 2.4 0.5 0.2 9.7
Simulation, STL 0.3 1.2 2.1 0.3 ms 2.8 0.3 0.5 0.3 7.3
Simulation, OBJ 0.3 1.2 2.2 0.3 ms 3.0 4.9 0.5 0.3 12.4
Visual, GLB 0.3 1.2 2.2 0.4 ms 6.4 93 ms 0.8 0.2 11.3
Visual, OBJ 0.4 1.2 2.1 0.4 ms 6.2 3.3 0.8 0.3 14.3
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera B101 v1.2.kicad_pcb
Folder hardware / recamera-2002 / base / b101-default / PCB / V1.2
Complexity 305 / 1000 (size 190, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 48, 581, 162
Triangles, simulation 798,866 in 84 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 382 MB
STEP 114 MB 463 MB
STL 40 MB 396 MB
OBJ 80 MB 574 MB
Visual
GLB 19 MB 455 MB
OBJ 58 MB 506 MB

24.24 reCamera B101_B2_v0.1

reCamera B101_B2_v0.1: stages 4 and 6 take 44% to 81% of a run. Simulation, GLB takes 5.7 s. Simulation, STEP takes 7.5 s. Simulation, STL takes 5.9 s. Simulation, OBJ takes 9.1 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.8 0.2 ms 2.3 98 ms 0.4 0.2 5.7
Simulation, STEP 0.2 0.6 1.7 0.2 ms 2.3 1.9 0.4 0.2 7.5
Simulation, STL 0.2 0.6 1.8 0.3 ms 2.3 0.2 0.4 0.2 5.9
Simulation, OBJ 0.3 0.6 1.8 0.4 ms 2.3 3.6 0.4 0.2 9.1
Visual, GLB 0.2 0.7 1.9 0.4 ms 6.2 86 ms 0.6 0.2 10.0
Visual, OBJ 0.3 0.6 1.7 0.2 ms 5.8 2.7 0.8 0.2 12.1
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera B101_B2_v0.1.kicad_pcb
Folder hardware / recamera-2002 / base / b201-vertical-usb-c / PCB
Complexity 296 / 1000 (size 186, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 45, 511, 114
Triangles, simulation 706,564 in 86 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 394 MB
STEP 105 MB 428 MB
STL 35 MB 381 MB
OBJ 71 MB 512 MB
Visual
GLB 18 MB 456 MB
OBJ 53 MB 452 MB

24.25 reCamera 2002 POE Board

reCamera 2002 POE Board: stages 4 and 6 take 44% to 77% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.5 s. Simulation, OBJ takes 15 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 1.6 3.1 0.7 ms 3.6 0.2 0.6 0.2 10.0
Simulation, STEP 0.7 1.6 3.0 0.7 ms 3.5 2.5 0.5 0.3 12.1
Simulation, STL 0.7 1.5 2.9 0.6 ms 3.3 0.3 0.5 0.2 9.5
Simulation, OBJ 0.8 1.6 3.0 0.6 ms 3.4 4.7 0.6 0.3 14.5
Visual, GLB 0.7 1.6 3.1 0.7 ms 8.5 0.1 0.9 0.2 15.1
Visual, OBJ 0.8 1.5 3.0 0.6 ms 8.4 3.6 1.2 0.3 18.8
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera 2002 POE Board.kicad_pcb
Folder hardware / recamera-2002 / base / b301-poe / PCB
Complexity 311 / 1000 (size 196, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 63, 555, 260
Triangles, simulation 1,005,002 in 99 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 518 MB
STEP 128 MB 559 MB
STL 50 MB 528 MB
OBJ 101 MB 742 MB
Visual
GLB 23 MB 537 MB
OBJ 71 MB 562 MB

24.26 reCamera B101_B4_Gyro v0.1

reCamera B101_B4_Gyro v0.1: stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 6.4 s. Simulation, STEP takes 8.8 s. Simulation, STL takes 7.0 s. Simulation, OBJ takes 10 s. Visual, GLB takes 11 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.1 0.3 ms 2.6 0.1 0.5 0.2 6.4
Simulation, STEP 0.3 0.7 2.2 0.3 ms 2.7 2.2 0.5 0.2 8.8
Simulation, STL 0.3 0.7 2.2 0.3 ms 2.8 0.2 0.4 0.2 7.0
Simulation, OBJ 0.3 0.6 2.2 0.3 ms 2.7 3.8 0.5 0.2 10.4
Visual, GLB 0.3 0.7 2.3 0.3 ms 6.6 0.1 0.9 0.2 11.1
Visual, OBJ 0.3 0.7 2.5 0.3 ms 7.4 2.7 1.1 0.3 14.8
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera B101_B4_Gyro v0.1.kicad_pcb
Folder hardware / recamera-2002 / base / b401-can / PCB / B4_v0.1
Complexity 296 / 1000 (size 186, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 51, 520, 95
Triangles, simulation 714,652 in 87 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 355 MB
STEP 119 MB 440 MB
STL 36 MB 351 MB
OBJ 72 MB 538 MB
Visual
GLB 18 MB 440 MB
OBJ 53 MB 480 MB

24.27 reCamera Gimbal

reCamera Gimbal: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.9 s. Simulation, OBJ takes 15 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.0 4.1 0.6 ms 3.9 0.2 0.5 0.3 10.5
Simulation, STEP 0.5 1.0 3.9 0.3 ms 3.8 2.7 0.5 0.3 12.6
Simulation, STL 0.5 1.0 3.7 0.8 ms 3.7 0.3 0.4 0.2 9.9
Simulation, OBJ 0.5 1.0 3.7 0.5 ms 3.9 4.9 0.4 0.3 14.6
Visual, GLB 0.6 1.0 3.7 0.3 ms 8.9 0.1 1.3 0.2 15.8
Visual, OBJ 0.5 1.0 3.7 0.5 ms 9.1 3.9 1.4 0.2 19.8
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera Gimbal.kicad_pcb
Folder hardware / recamera-2002 / base / b401-can / PCB / B4_v0.2
Complexity 289 / 1000 (size 184, features 105)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 108, 515, 237
Triangles, simulation 970,442 in 115 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 506 MB
STEP 176 MB 539 MB
STL 49 MB 502 MB
OBJ 100 MB 686 MB
Visual
GLB 26 MB 606 MB
OBJ 79 MB 642 MB

24.28 reCamera Basically Board

reCamera Basically Board: stages 4 and 6 take 48% to 77% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 4.0 s. Visual, GLB takes 4.1 s. Visual, OBJ takes 5.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.2 ms 1.0 38 ms 0.1 0.2 2.8
Simulation, STEP 0.2 0.3 0.9 0.2 ms 1.0 1.1 0.1 0.2 3.7
Simulation, STL 0.2 0.3 1.0 0.2 ms 1.0 65 ms 0.1 0.2 2.9
Simulation, OBJ 0.2 0.3 0.9 0.1 ms 1.0 1.3 0.1 0.2 4.0
Visual, GLB 0.2 0.3 1.0 0.2 ms 2.2 38 ms 0.3 0.2 4.1
Visual, OBJ 0.2 0.3 1.0 0.2 ms 2.3 1.3 0.2 0.2 5.4
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera Basically Board.kicad_pcb
Folder hardware / recamera-2002 / products / gimbal / power-board / PCB / reCamera_Gimbal_Power_Supply_v1.0_SCH&PCB_250109
Complexity 207 / 1000 (size 152, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 30, 148, 85
Triangles, simulation 260,730 in 28 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.1 MB 232 MB
STEP 38 MB 259 MB
STL 13 MB 225 MB
OBJ 26 MB 224 MB
Visual
GLB 8.1 MB 237 MB
OBJ 23 MB 242 MB

24.29 reCamera S101 v1.0

reCamera S101 v1.0: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 21 s. Visual, GLB takes 18 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.1 5.7 0.4 ms 4.8 0.2 0.6 0.2 13.3
Simulation, STEP 0.5 1.1 5.3 0.4 ms 4.8 3.0 0.7 0.2 15.6
Simulation, STL 0.6 1.1 5.3 0.4 ms 4.9 0.4 0.6 0.2 13.2
Simulation, OBJ 0.5 1.2 5.5 0.4 ms 5.0 7.8 0.6 0.2 20.8
Visual, GLB 0.6 1.1 5.5 0.4 ms 9.9 0.1 0.8 0.2 18.1
Visual, OBJ 0.5 1.1 5.5 0.4 ms 10.6 4.7 1.2 0.2 23.8
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera S101 v1.0.kicad_pcb
Folder hardware / recamera-2002 / sensors / s101-ov5647 / PCB / V1.0
Complexity 325 / 1000 (size 200, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 82, 532, 301
Triangles, simulation 1,511,908 in 97 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 636 MB
STEP 202 MB 696 MB
STL 76 MB 580 MB
OBJ 154 MB 994 MB
Visual
GLB 30 MB 746 MB
OBJ 92 MB 715 MB

24.30 reCamera S101 v1.1

reCamera S101 v1.1: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 21 s. Simulation, STL takes 19 s. Simulation, OBJ takes 27 s. Visual, GLB takes 25 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 1.8 6.9 0.5 ms 6.4 0.3 0.7 0.3 18.0
Simulation, STEP 1.5 1.7 7.0 0.5 ms 6.4 3.7 0.7 0.3 21.3
Simulation, STL 1.5 1.8 7.2 0.5 ms 6.3 0.6 0.8 0.3 18.5
Simulation, OBJ 1.5 1.7 6.9 0.5 ms 6.3 9.1 0.8 0.3 26.5
Visual, GLB 1.5 1.8 6.8 0.5 ms 13.4 0.2 1.4 0.3 25.3
Visual, OBJ 1.5 1.7 6.9 0.5 ms 13.7 5.9 1.7 0.3 31.7
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera S101 v1.1.kicad_pcb
Folder hardware / recamera-2002 / sensors / s101-ov5647 / PCB / V1.1
Complexity 343 / 1000 (size 203, features 140)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 82, 711, 334
Triangles, simulation 1,668,166 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 56 MB 624 MB
STEP 231 MB 748 MB
STL 83 MB 658 MB
OBJ 170 MB 1.1 GB
Visual
GLB 34 MB 738 MB
OBJ 101 MB 812 MB

24.31 reCamera 2002 S4 GC2053 Sensor Board_V1.0_SCH&PCB_250905

Stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 19 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 5.3 0.4 ms 4.7 0.2 0.5 0.3 12.7
Simulation, STEP 0.3 1.2 5.0 0.4 ms 4.7 2.7 0.5 0.2 14.7
Simulation, STL 0.3 1.2 4.9 0.4 ms 4.8 0.4 0.6 0.3 12.5
Simulation, OBJ 0.3 1.1 5.2 0.4 ms 4.7 6.1 0.5 0.2 18.3
Visual, GLB 0.4 1.1 5.2 0.6 ms 11.3 0.1 0.9 0.2 19.2
Visual, OBJ 0.3 1.2 5.2 0.5 ms 12.1 3.9 1.1 0.2 24.0
Board Repo: Seeed-Studio/OSHW-reCamera-Series
Board: reCamera 2002 S4 GC2053 Sensor Board_V1.0_SCH&PCB_250905.kicad_pcb
Folder hardware / recamera-2002 / sensors / s401-gc2053 / PCB
Complexity 340 / 1000 (size 200, features 140)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 71, 615, 307
Triangles, simulation 1,419,266 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 605 MB
STEP 199 MB 625 MB
STL 71 MB 563 MB
OBJ 144 MB 944 MB
Visual
GLB 27 MB 600 MB
OBJ 82 MB 629 MB

24.32 SFUSat-Radio

SFUSat-Radio: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 50 s. Simulation, STEP takes 59 s. Simulation, STL takes 49 s. Simulation, OBJ takes 69 s. Visual, GLB takes 65 s. Visual, OBJ takes 79 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.8 21.7 1 ms 18.3 0.9 2.4 0.4 49.7
Simulation, STEP 1.2 4.5 22.1 0.7 ms 18.6 9.4 2.5 0.4 58.7
Simulation, STL 1.2 4.5 21.6 1 ms 17.9 1.2 2.3 0.3 49.1
Simulation, OBJ 1.3 4.6 21.3 1 ms 17.7 21.7 2.5 0.3 69.4
Visual, GLB 1.2 4.5 20.8 0.7 ms 33.2 0.3 4.4 0.3 64.8
Visual, OBJ 1.1 4.4 21.0 2 ms 33.9 13.9 4.7 0.3 79.4
Board Repo: sfusatclub/cubesat-radio
Board: SFUSat-Radio.kicad_pcb
Complexity 264 / 1000 (size 229, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 251, 1,996, 649
Triangles, simulation 3,534,654 in 217 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 120 MB 1.1 GB
STEP 431 MB 1.5 GB
STL 177 MB 1.0 GB
OBJ 373 MB 2.3 GB
Visual
GLB 74 MB 1.3 GB
OBJ 231 MB 1.5 GB

24.33 Cheap FOCer 2 60mm

Cheap FOCer 2 60mm: stages 4 and 6 take 58% to 83% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 32 s. Simulation, OBJ takes 45 s. Visual, GLB takes 45 s. Visual, OBJ takes 56 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.4 12.6 0.9 ms 14.6 0.5 1.2 0.3 33.2
Simulation, STEP 0.7 3.2 12.6 1 ms 15.1 7.0 1.2 0.2 40.0
Simulation, STL 0.6 3.2 12.1 0.4 ms 14.1 0.8 1.1 0.3 32.2
Simulation, OBJ 0.7 3.1 12.2 0.8 ms 14.0 13.9 1.2 0.2 45.4
Visual, GLB 0.7 3.3 12.2 1 ms 25.3 0.3 3.2 0.3 45.3
Visual, OBJ 0.7 3.3 12.4 1 ms 24.1 12.0 3.5 0.3 56.3
Board Repo: shamansystems/cheap-focer-2
Board: Cheap FOCer 2 60mm.kicad_pcb
Folder source
Complexity 312 / 1000 (size 257, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 175, 2,158, 727
Triangles, simulation 2,647,782 in 143 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 90 MB 899 MB
STEP 414 MB 1.1 GB
STL 132 MB 856 MB
OBJ 277 MB 1.7 GB
Visual
GLB 70 MB 1.2 GB
OBJ 219 MB 1.5 GB

24.34 portapack_h1

portapack_h1: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 23 s. Simulation, STL takes 20 s. Simulation, OBJ takes 30 s. Visual, GLB takes 29 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.3 6.0 0.9 ms 9.2 0.3 0.8 0.2 19.3
Simulation, STEP 0.4 2.5 6.2 0.9 ms 8.8 4.6 0.8 0.3 23.5
Simulation, STL 0.3 2.4 6.1 0.4 ms 9.3 0.8 0.8 0.3 20.0
Simulation, OBJ 0.3 2.4 6.0 2 ms 9.3 11.2 0.9 0.2 30.4
Visual, GLB 0.4 2.8 6.3 1 ms 17.1 0.2 2.3 0.3 29.4
Visual, OBJ 0.3 2.5 6.2 0.8 ms 16.3 7.7 2.6 0.2 35.8
Board Repo: sharebrained/portapack-hackrf
Board: portapack_h1.kicad_pcb
Folder hardware / portapack_h1
Complexity 286 / 1000 (size 261, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 98, 1,508, 475
Triangles, simulation 2,142,988 in 153 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 73 MB 833 MB
STEP 225 MB 1.0 GB
STL 107 MB 848 MB
OBJ 222 MB 1.4 GB
Visual
GLB 49 MB 1.1 GB
OBJ 152 MB 1.1 GB

24.35 rpi-cm4-carrier-template

rpi-cm4-carrier-template: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 2.0 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.4 ms 0.9 24 ms 85 ms 0.2 1.8
Simulation, STEP 0.1 0.1 0.4 0.7 ms 1.0 1.1 85 ms 0.2 3.0
Simulation, STL 0.1 0.1 0.4 0.5 ms 1.0 41 ms 89 ms 0.3 2.0
Simulation, OBJ 0.1 0.1 0.5 0.5 ms 1.1 0.3 84 ms 0.3 2.4
Visual, GLB 0.1 0.1 0.4 0.9 ms 2.2 20 ms 0.2 0.3 3.3
Visual, OBJ 0.1 0.1 0.4 0.7 ms 2.3 0.4 0.1 0.3 3.8
Board Repo: ShawnHymel/rpi-cm4-carrier-template
Board: rpi-cm4-carrier-template.kicad_pcb
Folder hardware / rpi-cm4-carrier-template
Complexity 69 / 1000 (size 24, features 45)
KESE features curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20201002)
Parts, tracks, vias 1, 0, 0
Triangles, simulation 40,544 in 207 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.6 MB 75 MB
STEP 8.1 MB 180 MB
STL 2.0 MB 75 MB
OBJ 4.5 MB 93 MB
Visual
GLB 2.0 MB 138 MB
OBJ 5.6 MB 143 MB

24.36 tulipcc

tulipcc: stages 4 and 6 take 60% to 82% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 29 s. Simulation, STL takes 23 s. Simulation, OBJ takes 32 s. Visual, GLB takes 29 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.2 8.5 0.8 ms 9.9 0.3 1.0 0.3 22.7
Simulation, STEP 0.7 2.2 8.5 1 ms 10.2 6.5 1.1 0.3 29.3
Simulation, STL 0.6 2.0 8.4 0.7 ms 10.2 0.6 1.0 0.3 23.2
Simulation, OBJ 0.7 2.1 8.6 0.9 ms 10.6 8.6 1.1 0.3 31.8
Visual, GLB 0.5 2.2 8.5 1.0 ms 15.7 0.2 2.0 0.3 29.4
Visual, OBJ 0.6 2.1 8.6 0.7 ms 15.5 7.7 1.9 0.2 36.6
Board Repo: shorepine/tulipcc
Board: tulipcc.kicad_pcb
Folder docs / pcbs / tulip4_board_v4r9
Complexity 303 / 1000 (size 193, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 10th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 96, 919, 474
Triangles, simulation 1,494,292 in 127 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 688 MB
STEP 248 MB 825 MB
STL 75 MB 707 MB
OBJ 153 MB 1.0 GB
Visual
GLB 45 MB 801 MB
OBJ 137 MB 976 MB

24.37 FlightPCB

FlightPCB: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 53 s. Simulation, STL takes 43 s. Simulation, OBJ takes 60 s. Visual, GLB takes 54 s. Visual, OBJ takes 65 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.3 16.9 2 ms 17.4 0.8 2.1 0.4 43.8
Simulation, STEP 0.9 5.3 15.8 1 ms 18.6 9.6 2.0 0.4 52.5
Simulation, STL 0.9 4.9 16.4 1 ms 16.5 1.8 1.9 0.4 42.8
Simulation, OBJ 1.0 5.1 15.8 1 ms 16.2 19.6 1.9 0.3 59.9
Visual, GLB 0.9 4.9 15.3 1 ms 28.9 0.3 3.7 0.3 54.3
Visual, OBJ 0.8 4.8 15.8 1 ms 28.8 10.1 4.1 0.4 64.8
Board Repo: shubhamai/tsar
Board: FlightPCB.kicad_pcb
Folder v1
Complexity 398 / 1000 (size 283, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 188, 3,309, 418
Triangles, simulation 3,693,058 in 258 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 128 MB 1.1 GB
STEP 566 MB 1.3 GB
STL 185 MB 1.0 GB
OBJ 397 MB 2.5 GB
Visual
GLB 70 MB 1.2 GB
OBJ 223 MB 1.6 GB

24.38 FlightPCB

FlightPCB: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 22 s. Simulation, OBJ takes 34 s. Visual, GLB takes 31 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.6 9.1 0.8 ms 7.9 0.3 1.0 0.2 21.7
Simulation, STEP 0.5 2.9 9.1 0.9 ms 8.2 5.1 1.0 0.2 27.0
Simulation, STL 0.6 2.7 9.1 0.9 ms 8.1 0.6 0.9 0.3 22.4
Simulation, OBJ 0.6 2.7 9.5 0.9 ms 8.1 11.5 1.2 0.3 33.8
Visual, GLB 0.5 2.7 9.3 0.9 ms 16.2 0.2 1.6 0.2 30.8
Visual, OBJ 0.6 2.6 9.1 0.9 ms 16.6 6.3 1.9 0.3 37.4
Board Repo: shubhamai/tsar
Board: FlightPCB.kicad_pcb
Folder v2
Complexity 368 / 1000 (size 253, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 132, 1,661, 205
Triangles, simulation 2,181,068 in 169 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 76 MB 732 MB
STEP 333 MB 889 MB
STL 109 MB 737 MB
OBJ 232 MB 1.5 GB
Visual
GLB 40 MB 872 MB
OBJ 123 MB 908 MB

24.39 FlightPCB

FlightPCB: stages 4 and 6 take 51% to 79% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 26 s. Visual, GLB takes 24 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.9 7.1 1 ms 6.7 0.3 0.9 0.2 18.5
Simulation, STEP 0.4 2.9 7.3 0.9 ms 6.9 3.8 0.7 0.2 22.3
Simulation, STL 0.4 2.8 6.7 0.8 ms 6.8 0.5 0.8 0.2 18.2
Simulation, OBJ 0.4 2.9 6.8 0.7 ms 6.6 8.5 0.8 0.2 26.3
Visual, GLB 0.4 3.2 6.7 0.7 ms 12.1 0.1 1.1 0.2 23.9
Visual, OBJ 0.4 2.8 6.7 0.5 ms 12.5 4.5 1.5 0.2 28.8
Board Repo: shubhamai/tsar
Board: FlightPCB.kicad_pcb
Folder v3
Complexity 371 / 1000 (size 246, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 93, 1,322, 184
Triangles, simulation 1,958,972 in 157 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 68 MB 690 MB
STEP 287 MB 780 MB
STL 98 MB 667 MB
OBJ 206 MB 1.4 GB
Visual
GLB 36 MB 739 MB
OBJ 109 MB 831 MB

24.40 rp-micro

rp-micro: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 5.1 s. Simulation, STEP takes 6.9 s. Simulation, STL takes 5.1 s. Simulation, OBJ takes 7.7 s. Visual, GLB takes 7.1 s. Visual, OBJ takes 9.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.7 0.2 ms 2.2 74 ms 0.3 0.2 5.1
Simulation, STEP 0.2 0.4 1.8 0.2 ms 2.1 1.9 0.3 0.2 6.9
Simulation, STL 0.2 0.4 1.8 0.3 ms 2.2 0.1 0.3 0.2 5.1
Simulation, OBJ 0.2 0.4 1.7 0.2 ms 2.1 2.7 0.3 0.2 7.7
Visual, GLB 0.2 0.4 1.7 0.2 ms 4.2 80 ms 0.4 0.2 7.1
Visual, OBJ 0.3 0.4 1.7 0.2 ms 4.2 2.1 0.4 0.2 9.3
Board Repo: siderakb/rp-micro
Board: rp-micro.kicad_pcb
Folder hardware
Complexity 307 / 1000 (size 202, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 40, 437, 64
Triangles, simulation 530,056 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 317 MB
STEP 89 MB 373 MB
STL 27 MB 307 MB
OBJ 53 MB 398 MB
Visual
GLB 14 MB 412 MB
OBJ 42 MB 379 MB

24.41 mainboard

mainboard: stages 4 and 6 take 47% to 83% of a run. Simulation, GLB takes 71 s. Simulation, STEP takes 89 s. Simulation, STL takes 76 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 7.8 28.2 2 ms 27.8 1.3 3.5 0.4 71.0
Simulation, STEP 1.9 7.7 27.8 2 ms 28.2 18.9 4.0 0.4 89.0
Simulation, STL 2.1 8.1 28.7 3 ms 29.9 2.9 3.5 0.4 75.7
Simulation, OBJ 1.9 7.9 28.3 2 ms 29.2 51.4 4.0 0.4 123.2
Visual, GLB 2.0 8.7 30.3 2 ms 63.1 0.7 7.3 0.4 112.5
Visual, OBJ 2.1 8.0 28.4 2 ms 63.2 27.0 7.7 0.4 136.8
Board Repo: sierra-lobo/mainboard-hardware
Board: mainboard.kicad_pcb
Folder revA-proto
Complexity 373 / 1000 (size 293, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026 to 10th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 310, 3,216, 717
Triangles, simulation 7,297,760 in 361 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 253 MB 1.9 GB
STEP 977 MB 2.5 GB
STL 365 MB 1.9 GB
OBJ 802 MB 4.7 GB
Visual
GLB 142 MB 2.3 GB
OBJ 462 MB 3.0 GB

24.42 mainboard

mainboard: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 56 s. Simulation, STEP takes 66 s. Simulation, STL takes 52 s. Simulation, OBJ takes 81 s. Visual, GLB takes 77 s. Visual, OBJ takes 94 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 5.5 20.9 3 ms 22.5 1.3 3.2 0.4 55.6
Simulation, STEP 1.6 5.6 20.9 2 ms 21.2 13.4 2.7 0.4 65.7
Simulation, STL 1.6 5.2 19.7 1 ms 21.0 1.7 2.5 0.3 52.1
Simulation, OBJ 1.5 5.3 19.5 2 ms 21.4 30.1 2.5 0.3 80.6
Visual, GLB 1.7 5.5 20.4 2 ms 44.0 0.5 4.6 0.2 76.8
Visual, OBJ 1.5 5.2 20.0 3 ms 44.9 16.7 5.8 0.3 94.4
Board Repo: sierra-lobo/mainboard-hardware
Board: mainboard.kicad_pcb
Folder revB-em
Complexity 419 / 1000 (size 289, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 380, 3,520, 732
Triangles, simulation 6,716,384 in 422 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 231 MB 1.7 GB
STEP 1.0 GB 2.2 GB
STL 336 MB 1.8 GB
OBJ 728 MB 4.4 GB
Visual
GLB 127 MB 2.2 GB
OBJ 414 MB 2.8 GB

24.43 mainboard_before_drastic

mainboard_before_drastic: stages 4 and 6 take 45% to 78% of a run. Simulation, GLB takes 67 s. Simulation, STEP takes 82 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 92 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 11.8 23.5 2 ms 24.6 1.2 3.2 0.3 66.7
Simulation, STEP 2.3 12.2 23.4 1 ms 24.5 16.5 3.0 0.3 82.2
Simulation, STL 2.3 12.6 24.4 2 ms 24.7 2.4 3.3 0.5 70.2
Simulation, OBJ 2.5 12.5 23.9 1 ms 24.4 39.3 3.2 0.5 106.3
Visual, GLB 2.2 12.2 22.5 2 ms 48.7 0.7 5.2 0.3 91.8
Visual, OBJ 2.3 12.4 23.9 1.0 ms 49.6 21.5 5.0 0.3 115.0
Board Repo: sierra-lobo/mainboard-hardware
Board: mainboard_before_drastic.kicad_pcb
Folder revB-em
Complexity 373 / 1000 (size 293, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 6 (20211014)
Parts, tracks, vias 350, 3,043, 664
Triangles, simulation 6,173,362 in 345 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 215 MB 1.6 GB
STEP 962 MB 2.1 GB
STL 309 MB 1.6 GB
OBJ 681 MB 4.1 GB
Visual
GLB 118 MB 2.0 GB
OBJ 381 MB 2.5 GB

24.44 mainboard

mainboard: stages 4 and 6 take 43% to 82% of a run. Simulation, GLB takes 92 s. Simulation, STEP takes 2 min. Simulation, STL takes 92 s. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.9 10.6 32.1 2 ms 37.8 2.2 5.6 0.4 91.6
Simulation, STEP 2.7 10.3 31.8 2 ms 37.3 22.2 5.0 0.4 109.7
Simulation, STL 2.8 9.8 31.8 1 ms 36.7 4.8 5.7 0.4 92.1
Simulation, OBJ 2.7 9.9 31.3 2 ms 36.7 72.7 6.2 0.5 159.9
Visual, GLB 2.9 11.1 31.7 1 ms 80.8 1.0 9.2 0.3 137.0
Visual, OBJ 2.8 10.4 31.3 2 ms 80.3 35.3 9.5 0.4 169.9
Board Repo: sierra-lobo/mainboard-hardware
Board: mainboard.kicad_pcb
Folder revC-fm
Complexity 447 / 1000 (size 307, features 140)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 8
File format KiCad 7 (20221018)
Parts, tracks, vias 639, 4,774, 1,106
Triangles, simulation 10,865,118 in 616 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 366 MB 2.5 GB
STEP 1.4 GB 3.5 GB
STL 543 MB 2.4 GB
OBJ 1.2 GB 6.9 GB
Visual
GLB 201 MB 3.2 GB
OBJ 675 MB 4.1 GB

24.45 Frontend_test

Frontend_test: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 7.4 s. Simulation, STEP takes 9.3 s. Simulation, STL takes 7.7 s. Simulation, OBJ takes 11 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.4 0.3 ms 2.4 92 ms 0.4 0.2 7.4
Simulation, STEP 0.2 0.7 3.3 0.2 ms 2.6 1.9 0.3 0.2 9.3
Simulation, STL 0.2 0.7 3.1 0.3 ms 2.7 0.3 0.4 0.2 7.7
Simulation, OBJ 0.2 0.6 3.3 0.3 ms 2.7 3.1 0.4 0.2 10.6
Visual, GLB 0.2 0.7 3.4 0.2 ms 4.9 86 ms 0.6 0.2 10.2
Visual, OBJ 0.2 0.7 3.4 0.3 ms 5.1 2.1 0.7 0.2 12.4
Board Repo: SingularitySurfer/SingularitySurfer-FPGA-Lock-In-Amplifier
Board: Frontend_test.kicad_pcb
Folder BOARD / Frontend_test
Complexity 213 / 1000 (size 158, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 46, 247, 65
Triangles, simulation 645,840 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 350 MB
STEP 112 MB 429 MB
STL 32 MB 355 MB
OBJ 66 MB 482 MB
Visual
GLB 16 MB 407 MB
OBJ 48 MB 467 MB

24.46 SingularitySurfer_V1

SingularitySurfer_V1: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 41 s. Simulation, STEP takes 48 s. Simulation, STL takes 39 s. Simulation, OBJ takes 56 s. Visual, GLB takes 55 s. Visual, OBJ takes 68 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.5 20.8 1 ms 13.6 0.5 1.5 0.3 41.1
Simulation, STEP 0.9 3.5 20.5 0.7 ms 12.3 9.1 1.5 0.3 48.0
Simulation, STL 0.8 3.5 20.1 0.6 ms 12.0 0.9 1.5 0.3 39.1
Simulation, OBJ 0.9 3.5 20.2 0.7 ms 12.3 17.4 1.5 0.2 56.0
Visual, GLB 0.9 3.5 20.2 0.7 ms 25.8 0.3 3.8 0.3 54.9
Visual, OBJ 0.8 3.4 20.4 0.5 ms 25.5 13.4 4.6 0.3 68.3
Board Repo: SingularitySurfer/SingularitySurfer-FPGA-Lock-In-Amplifier
Board: SingularitySurfer_V1.kicad_pcb
Folder BOARD / SingularitySurfer_V1
Complexity 305 / 1000 (size 240, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 158, 1,227, 415
Triangles, simulation 2,823,450 in 130 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 99 MB 1.1 GB
STEP 503 MB 1.3 GB
STL 141 MB 1.1 GB
OBJ 302 MB 1.9 GB
Visual
GLB 74 MB 1.3 GB
OBJ 229 MB 1.6 GB

24.47 AT386SX

AT386SX: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 9.9 49.4 2 ms 34.2 2.1 6.2 0.4 104.0
Simulation, STEP 1.5 10.2 49.5 2 ms 34.6 24.6 5.9 0.4 126.7
Simulation, STL 1.8 10.7 49.0 2 ms 34.1 4.3 6.2 0.4 106.6
Simulation, OBJ 1.5 9.8 48.0 2 ms 34.7 57.9 6.1 0.5 158.4
Visual, GLB 1.7 10.1 49.0 2 ms 98.7 1.1 13.2 0.4 174.2
Visual, OBJ 1.9 10.2 49.1 2 ms 101.0 35.0 14.0 0.3 211.5
Board Repo: skiselev/mb386sx-rc2016
Board: AT386SX.kicad_pcb
Folder KiCad
Complexity 359 / 1000 (size 274, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 148, 8,868, 700
Triangles, simulation 9,788,128 in 320 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 333 MB 2.7 GB
STEP 1.6 GB 3.5 GB
STL 489 MB 2.7 GB
OBJ 1.0 GB 6.1 GB
Visual
GLB 231 MB 3.5 GB
OBJ 739 MB 4.6 GB

24.48 Omega-Keyboard

Omega-Keyboard: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 32 s. Simulation, STL takes 27 s. Simulation, OBJ takes 37 s. Visual, GLB takes 38 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.1 12.3 0.3 ms 8.9 0.4 1.3 0.3 25.7
Simulation, STEP 0.6 2.1 12.0 0.3 ms 8.8 6.4 1.3 0.3 31.5
Simulation, STL 0.7 2.1 12.3 0.6 ms 9.1 0.9 1.2 0.3 26.7
Simulation, OBJ 0.6 2.0 12.2 0.3 ms 8.9 11.5 1.2 0.3 36.7
Visual, GLB 0.6 2.0 12.2 0.6 ms 20.0 0.3 2.8 0.3 38.2
Visual, OBJ 0.6 2.2 12.3 0.7 ms 19.9 8.0 3.3 0.3 46.5
Board Repo: skiselev/omega
Board: Omega-Keyboard.kicad_pcb
Folder Keyboard / KiCad
Complexity 225 / 1000 (size 180, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 89, 978, 38
Triangles, simulation 2,305,514 in 49 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 838 MB
STEP 370 MB 1.0 GB
STL 115 MB 819 MB
OBJ 243 MB 1.6 GB
Visual
GLB 52 MB 932 MB
OBJ 159 MB 1.1 GB

24.49 Omega-Mainboard

Omega-Mainboard: stages 4 and 6 take 52% to 88% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 4 min. Visual, OBJ takes 5 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 9.8 60.3 2 ms 43.6 2.2 9.1 0.4 127.1
Simulation, STEP 1.7 10.0 59.5 2 ms 44.3 31.2 8.3 0.4 155.3
Simulation, STL 1.6 10.1 60.4 2 ms 46.4 5.5 9.3 0.4 133.7
Simulation, OBJ 1.8 10.8 61.4 2 ms 46.2 79.1 8.8 0.5 208.4
Visual, GLB 1.7 10.1 60.0 2 ms 141.6 1.4 12.9 0.3 228.0
Visual, OBJ 1.7 10.5 61.3 2 ms 146.0 48.1 15.8 0.4 283.7
Board Repo: skiselev/omega
Board: Omega-Mainboard.kicad_pcb
Folder Mainboard / KiCad
Complexity 266 / 1000 (size 221, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 237, 6,484, 208
Triangles, simulation 11,299,908 in 419 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 381 MB 4.0 GB
STEP 1.8 GB 4.2 GB
STL 565 MB 3.6 GB
OBJ 1.2 GB 6.9 GB
Visual
GLB 256 MB 4.3 GB
OBJ 822 MB 4.8 GB

24.50 Tiny_Z80

Tiny_Z80: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 29 s. Simulation, STL takes 22 s. Simulation, OBJ takes 34 s. Visual, GLB takes 41 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 10.1 0.6 ms 8.1 0.3 1.1 0.3 23.0
Simulation, STEP 0.5 2.6 10.8 0.5 ms 8.0 5.3 1.0 0.3 28.6
Simulation, STL 0.4 2.3 9.9 0.8 ms 7.5 0.9 1.2 0.2 22.4
Simulation, OBJ 0.5 2.7 10.7 0.5 ms 7.6 10.9 1.1 0.3 33.7
Visual, GLB 0.7 2.7 10.8 0.5 ms 22.7 0.3 3.3 0.3 40.7
Visual, OBJ 0.5 2.4 10.1 0.5 ms 19.5 7.5 2.7 0.3 43.0
Board Repo: skiselev/tiny_z80
Board: Tiny_Z80.kicad_pcb
Folder KiCad
Complexity 326 / 1000 (size 246, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 77, 1,976, 213
Triangles, simulation 1,992,830 in 158 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 795 MB
STEP 382 MB 861 MB
STL 100 MB 860 MB
OBJ 213 MB 1.4 GB
Visual
GLB 54 MB 890 MB
OBJ 166 MB 1.2 GB

24.51 Z80-SBC

Z80-SBC: stages 4 and 6 take 59% to 86% of a run. Simulation, GLB takes 72 s. Simulation, STEP takes 86 s. Simulation, STL takes 71 s. Simulation, OBJ takes 96 s. Visual, GLB takes 90 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 4.5 32.6 1 ms 29.1 0.9 3.5 0.3 71.8
Simulation, STEP 0.8 4.4 32.1 0.6 ms 29.2 15.8 3.5 0.4 86.3
Simulation, STL 0.8 4.4 31.8 0.9 ms 27.7 2.3 3.3 0.4 70.7
Simulation, OBJ 0.8 4.4 30.2 0.7 ms 26.5 30.2 3.3 0.3 95.8
Visual, GLB 0.8 4.2 30.6 0.7 ms 47.3 0.5 6.5 0.3 90.1
Visual, OBJ 0.9 4.3 30.6 0.7 ms 48.2 17.0 6.4 0.3 107.7
Board Repo: skiselev/zeta_sbc
Board: Z80-SBC.kicad_pcb
Folder KiCad
Complexity 252 / 1000 (size 197, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 3 (3)
Parts, tracks, vias 70, 2,861, 205
Triangles, simulation 4,972,440 in 155 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 171 MB 1.3 GB
STEP 865 MB 1.8 GB
STL 249 MB 1.3 GB
OBJ 539 MB 3.2 GB
Visual
GLB 100 MB 1.7 GB
OBJ 318 MB 2.0 GB

24.52 bitaxeUltra

bitaxeUltra: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 19 s. Visual, GLB takes 16 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.4 4.3 0.3 ms 4.2 0.2 0.6 0.2 11.3
Simulation, STEP 0.4 1.3 4.4 0.3 ms 4.3 3.1 0.5 0.2 14.3
Simulation, STL 0.4 1.3 4.3 0.3 ms 4.3 0.4 0.5 0.2 11.4
Simulation, OBJ 0.4 1.4 4.4 0.3 ms 4.5 7.5 0.5 0.2 18.9
Visual, GLB 0.4 1.4 4.5 0.4 ms 8.9 0.1 0.9 0.2 16.4
Visual, OBJ 0.4 1.5 4.6 0.4 ms 8.5 4.4 1.0 0.2 20.5
Board Repo: skot/bitaxe
Board: bitaxeUltra.kicad_pcb
Complexity 333 / 1000 (size 203, features 130)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 94, 933, 201
Triangles, simulation 1,436,406 in 109 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 532 MB
STEP 183 MB 655 MB
STL 72 MB 553 MB
OBJ 147 MB 984 MB
Visual
GLB 28 MB 624 MB
OBJ 85 MB 680 MB

24.53 a13board

a13board: stages 4 and 6 take 62% to 84% of a run. Simulation, GLB takes 46 s. Simulation, STEP takes 55 s. Simulation, STL takes 48 s. Simulation, OBJ takes 62 s. Visual, GLB takes 63 s. Visual, OBJ takes 73 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 4.8 17.7 0.9 ms 20.0 0.6 2.0 0.3 46.2
Simulation, STEP 0.8 4.7 18.3 0.9 ms 20.4 8.5 2.1 0.3 55.1
Simulation, STL 0.7 4.7 18.0 1.0 ms 21.0 1.0 2.1 0.4 48.0
Simulation, OBJ 0.8 4.7 18.0 0.8 ms 20.5 15.7 2.2 0.3 62.2
Visual, GLB 0.8 4.6 17.2 2 ms 35.3 0.3 4.1 0.3 62.7
Visual, OBJ 0.7 4.5 18.0 1 ms 34.9 11.0 3.8 0.4 73.4
Board Repo: slapin/a13board
Board: a13board.kicad_pcb
Complexity 329 / 1000 (size 294, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 152, 5,791, 357
Triangles, simulation 3,205,058 in 287 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 113 MB 1.1 GB
STEP 518 MB 1.3 GB
STL 160 MB 1.1 GB
OBJ 346 MB 2.2 GB
Visual
GLB 77 MB 1.3 GB
OBJ 242 MB 1.7 GB

24.54 StepperMotorBreakout

StepperMotorBreakout: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.1 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.0 3.9 0.3 ms 3.0 0.2 0.4 0.2 8.9
Simulation, STEP 0.2 1.0 3.8 0.4 ms 3.0 2.4 0.4 0.3 11.1
Simulation, STL 0.2 1.1 3.9 0.3 ms 2.9 0.3 0.4 0.2 9.1
Simulation, OBJ 0.2 1.0 3.9 0.6 ms 2.8 5.4 0.4 0.2 14.0
Visual, GLB 0.2 1.1 3.6 0.4 ms 7.1 95 ms 0.6 0.2 13.0
Visual, OBJ 0.2 1.0 3.9 0.4 ms 7.2 3.3 0.7 0.2 16.6
Board Repo: smoothieware/smoothieboard2
Board: StepperMotorBreakout.kicad_pcb
Folder extension-boards / a5984-stepper-driver
Complexity 224 / 1000 (size 189, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 48, 553, 146
Triangles, simulation 1,027,218 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 36 MB 409 MB
STEP 137 MB 487 MB
STL 51 MB 415 MB
OBJ 106 MB 736 MB
Visual
GLB 22 MB 542 MB
OBJ 67 MB 518 MB

24.55 C.H.I.P-DIP

C.H.I.P-DIP: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 6.9 s. Simulation, STEP takes 9.0 s. Simulation, STL takes 6.9 s. Simulation, OBJ takes 10 s. Visual, GLB takes 9.1 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 3.1 0.3 ms 2.4 0.1 0.3 0.2 6.9
Simulation, STEP 0.2 0.5 3.2 0.4 ms 2.4 2.1 0.3 0.3 9.0
Simulation, STL 0.1 0.5 3.1 0.4 ms 2.4 0.2 0.3 0.2 6.9
Simulation, OBJ 0.2 0.5 3.0 0.5 ms 2.3 3.5 0.3 0.2 10.1
Visual, GLB 0.1 0.4 3.1 0.3 ms 4.5 58 ms 0.5 0.2 9.1
Visual, OBJ 0.2 0.5 3.1 0.3 ms 4.4 2.0 0.5 0.2 10.8
Board Repo: smoothieware/smoothieboard2
Board: C.H.I.P-DIP.kicad_pcb
Folder extension-boards / chip-dip-computer-carrier
Complexity 170 / 1000 (size 135, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 19, 160, 9
Triangles, simulation 633,472 in 96 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 341 MB
STEP 108 MB 374 MB
STL 32 MB 322 MB
OBJ 64 MB 460 MB
Visual
GLB 12 MB 358 MB
OBJ 36 MB 350 MB

24.56 Large MOSFET

Large MOSFET: stages 4 and 6 take 44% to 75% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.2 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.5 0.2 ms 0.6 21 ms 58 ms 0.2 1.7
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.5 0.8 61 ms 0.3 2.4
Simulation, STL 90 ms 0.2 0.5 0.1 ms 0.5 29 ms 58 ms 0.2 1.6
Simulation, OBJ 96 ms 0.1 0.6 0.1 ms 0.5 0.6 60 ms 0.2 2.2
Visual, GLB 96 ms 0.1 0.5 0.1 ms 1.1 16 ms 95 ms 0.2 2.2
Visual, OBJ 0.1 0.1 0.6 0.1 ms 1.1 0.5 0.1 0.3 2.8
Board Repo: smoothieware/smoothieboard2
Board: Large MOSFET.kicad_pcb
Folder extension-boards / large-mosfet-kicad
Complexity 120 / 1000 (size 100, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 9, 35, 0
Triangles, simulation 132,178 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 MB 193 MB
STEP 19 MB 194 MB
STL 6.6 MB 191 MB
OBJ 13 MB 188 MB
Visual
GLB 3.3 MB 159 MB
OBJ 9.1 MB 158 MB

24.57 level-shifter

level-shifter: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 5.8 s. Simulation, STEP takes 7.3 s. Simulation, STL takes 5.8 s. Simulation, OBJ takes 8.5 s. Visual, GLB takes 8.9 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.4 0.3 ms 1.9 98 ms 0.4 0.3 5.8
Simulation, STEP 0.2 0.6 2.2 0.4 ms 1.9 1.8 0.3 0.2 7.3
Simulation, STL 0.2 0.5 2.3 0.3 ms 2.0 0.1 0.3 0.3 5.8
Simulation, OBJ 0.2 0.6 2.3 0.2 ms 1.9 2.8 0.3 0.2 8.5
Visual, GLB 0.2 0.6 2.2 0.2 ms 4.9 73 ms 0.6 0.3 8.9
Visual, OBJ 0.2 0.6 2.2 0.3 ms 5.2 2.5 0.6 0.3 11.5
Board Repo: smoothieware/smoothieboard2
Board: level-shifter.kicad_pcb
Folder extension-boards / legacy-level-shifter-high-current
Complexity 204 / 1000 (size 169, features 35)
KESE features through vias, filled zones
Tested 10th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 60, 520, 70
Triangles, simulation 499,498 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 315 MB
STEP 91 MB 341 MB
STL 25 MB 304 MB
OBJ 51 MB 385 MB
Visual
GLB 15 MB 381 MB
OBJ 44 MB 380 MB

24.58 MechEndstop

MechEndstop: stages 4 and 6 take 43% to 74% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.2 ms 0.6 17 ms 48 ms 0.3 1.5
Simulation, STEP 0.1 98 ms 0.4 0.1 ms 0.6 0.8 47 ms 0.2 2.3
Simulation, STL 0.1 0.1 0.3 0.1 ms 0.5 19 ms 53 ms 0.3 1.4
Simulation, OBJ 97 ms 92 ms 0.3 0.1 ms 0.5 0.4 48 ms 0.2 1.7
Visual, GLB 93 ms 90 ms 0.3 0.1 ms 1.1 13 ms 91 ms 0.2 1.9
Visual, OBJ 99 ms 88 ms 0.3 0.1 ms 1.1 0.3 70 ms 0.2 2.2
Board Repo: smoothieware/smoothieboard2
Board: MechEndstop.kicad_pcb
Folder extension-boards / mechanical-endstop
Complexity 115 / 1000 (size 95, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 6, 32, 0
Triangles, simulation 73,228 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.6 MB 171 MB
STEP 13 MB 180 MB
STL 3.7 MB 169 MB
OBJ 7.2 MB 167 MB
Visual
GLB 1.7 MB 153 MB
OBJ 4.6 MB 153 MB

24.59 RPi zero with ethernet

RPi zero with ethernet: stages 4 and 6 take 55% to 86% of a run. Simulation, GLB takes 8.7 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.5 s. Simulation, OBJ takes 13 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 4.4 0.4 ms 2.8 0.1 0.4 0.2 8.7
Simulation, STEP 0.2 0.8 4.4 0.5 ms 2.7 2.4 0.4 0.2 11.0
Simulation, STL 0.2 0.6 4.2 0.5 ms 2.6 0.2 0.4 0.2 8.5
Simulation, OBJ 0.2 0.7 4.1 0.5 ms 2.8 4.2 0.3 0.2 12.6
Visual, GLB 0.2 0.7 4.2 0.5 ms 6.5 72 ms 0.6 0.2 12.5
Visual, OBJ 0.2 0.7 3.7 0.6 ms 6.1 2.8 0.8 0.3 14.6
Board Repo: smoothieware/smoothieboard2
Board: RPi zero with ethernet.kicad_pcb
Folder extension-boards / raspberry-pi-zero-ethernet
Complexity 251 / 1000 (size 206, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 38, 687, 35
Triangles, simulation 859,646 in 74 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 375 MB
STEP 156 MB 448 MB
STL 43 MB 371 MB
OBJ 89 MB 611 MB
Visual
GLB 19 MB 491 MB
OBJ 58 MB 473 MB

24.60 Rpi-zero

Rpi-zero: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 6.2 s. Simulation, STEP takes 7.7 s. Simulation, STL takes 6.1 s. Simulation, OBJ takes 8.8 s. Visual, GLB takes 8.2 s. Visual, OBJ takes 9.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 3.2 0.3 ms 1.9 84 ms 0.3 0.2 6.2
Simulation, STEP 0.1 0.4 3.2 0.3 ms 1.8 1.7 0.3 0.2 7.7
Simulation, STL 0.1 0.4 3.1 0.3 ms 1.8 0.2 0.3 0.2 6.1
Simulation, OBJ 0.1 0.4 3.2 0.2 ms 1.9 2.8 0.3 0.2 8.8
Visual, GLB 0.1 0.4 3.1 0.4 ms 3.8 41 ms 0.5 0.2 8.2
Visual, OBJ 0.1 0.4 3.2 0.3 ms 3.6 1.4 0.4 0.2 9.2
Board Repo: smoothieware/smoothieboard2
Board: Rpi-zero.kicad_pcb
Folder extension-boards / raspberry-pi-zero-interface
Complexity 167 / 1000 (size 142, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 17, 289, 6
Triangles, simulation 512,212 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 299 MB
STEP 84 MB 330 MB
STL 26 MB 307 MB
OBJ 52 MB 390 MB
Visual
GLB 8.8 MB 295 MB
OBJ 26 MB 281 MB

24.61 Small Mosfet

Small Mosfet: stages 4 and 6 take 46% to 75% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 97 ms 0.1 0.5 0.1 ms 0.6 20 ms 61 ms 0.2 1.6
Simulation, STEP 95 ms 0.1 0.5 0.2 ms 0.6 0.8 60 ms 0.2 2.4
Simulation, STL 93 ms 0.1 0.5 0.1 ms 0.6 29 ms 59 ms 0.2 1.6
Simulation, OBJ 0.1 0.1 0.5 0.1 ms 0.6 0.6 65 ms 0.2 2.2
Visual, GLB 0.1 0.1 0.5 0.1 ms 1.2 14 ms 94 ms 0.2 2.3
Visual, OBJ 98 ms 0.1 0.5 0.1 ms 1.3 0.4 92 ms 0.2 2.8
Board Repo: smoothieware/smoothieboard2
Board: Small Mosfet.kicad_pcb
Folder extension-boards / small-mosfet-kicad
Complexity 122 / 1000 (size 102, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 9, 39, 0
Triangles, simulation 117,682 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.1 MB 183 MB
STEP 19 MB 195 MB
STL 5.9 MB 184 MB
OBJ 12 MB 181 MB
Visual
GLB 2.9 MB 157 MB
OBJ 8.0 MB 156 MB

24.62 SPI Hub

SPI Hub: stages 4 and 6 take 46% to 74% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.7 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 99 ms 0.2 0.5 0.1 ms 0.7 23 ms 67 ms 0.2 1.7
Simulation, STEP 0.1 0.2 0.6 0.1 ms 0.7 0.8 67 ms 0.2 2.7
Simulation, STL 91 ms 0.2 0.5 0.2 ms 0.8 56 ms 75 ms 0.2 1.9
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.8 0.7 73 ms 0.2 2.6
Visual, GLB 93 ms 0.2 0.5 0.1 ms 1.4 27 ms 0.2 0.2 2.5
Visual, OBJ 92 ms 0.2 0.5 0.1 ms 1.3 0.6 0.1 0.2 3.1
Board Repo: smoothieware/smoothieboard2
Board: SPI Hub.kicad_pcb
Folder extension-boards / spi-hub
Complexity 155 / 1000 (size 140, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 209, 41
Triangles, simulation 143,264 in 32 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.1 MB 201 MB
STEP 22 MB 216 MB
STL 7.2 MB 201 MB
OBJ 14 MB 200 MB
Visual
GLB 4.1 MB 184 MB
OBJ 12 MB 187 MB

24.63 SPIOpto

SPIOpto: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.0 s. Visual, GLB takes 4.9 s. Visual, OBJ takes 6.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.5 0.3 ms 1.0 47 ms 0.1 0.2 3.4
Simulation, STEP 0.1 0.3 1.5 0.3 ms 1.0 1.1 0.2 0.2 4.4
Simulation, STL 0.1 0.3 1.5 0.3 ms 1.1 87 ms 0.2 0.2 3.5
Simulation, OBJ 0.1 0.3 1.6 0.2 ms 1.1 1.4 0.2 0.2 5.0
Visual, GLB 0.1 0.4 1.5 0.4 ms 2.5 37 ms 0.2 0.2 4.9
Visual, OBJ 0.1 0.3 1.5 0.3 ms 2.5 1.1 0.2 0.2 6.0
Board Repo: smoothieware/smoothieboard2
Board: SPIOpto.kicad_pcb
Folder extension-boards / spi-opto-isolator
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 32, 248, 33
Triangles, simulation 359,254 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 263 MB
STEP 59 MB 281 MB
STL 18 MB 253 MB
OBJ 37 MB 265 MB
Visual
GLB 9.5 MB 263 MB
OBJ 27 MB 280 MB

24.64 SPI PT100

SPI PT100: stages 4 and 6 take 47% to 76% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 88 ms 0.2 0.5 0.1 ms 0.7 30 ms 91 ms 0.2 1.8
Simulation, STEP 89 ms 0.1 0.5 0.2 ms 0.7 0.9 87 ms 0.2 2.5
Simulation, STL 94 ms 0.1 0.6 0.1 ms 0.7 54 ms 94 ms 0.2 1.8
Simulation, OBJ 89 ms 0.1 0.5 0.1 ms 0.7 0.6 93 ms 0.2 2.4
Visual, GLB 89 ms 0.2 0.5 0.2 ms 1.4 21 ms 0.1 0.2 2.4
Visual, OBJ 91 ms 0.1 0.5 0.1 ms 1.4 0.6 0.2 0.2 3.0
Board Repo: smoothieware/smoothieboard2
Board: SPI PT100.kicad_pcb
Folder extension-boards / spi-pt100
Complexity 174 / 1000 (size 139, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20170123)
Parts, tracks, vias 13, 221, 27
Triangles, simulation 161,198 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.5 MB 202 MB
STEP 28 MB 220 MB
STL 8.1 MB 203 MB
OBJ 16 MB 207 MB
Visual
GLB 4.8 MB 198 MB
OBJ 14 MB 200 MB

24.65 Thermocouple

Thermocouple: stages 4 and 6 take 46% to 76% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.3 s. Visual, GLB takes 2.5 s. Visual, OBJ takes 2.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 93 ms 0.1 0.5 0.1 ms 0.7 29 ms 89 ms 0.2 1.7
Simulation, STEP 94 ms 0.1 0.5 0.1 ms 0.7 0.9 68 ms 0.3 2.6
Simulation, STL 93 ms 0.1 0.5 0.3 ms 0.7 31 ms 62 ms 0.3 1.7
Simulation, OBJ 97 ms 0.1 0.5 0.1 ms 0.7 0.6 75 ms 0.2 2.3
Visual, GLB 97 ms 0.1 0.5 0.1 ms 1.4 21 ms 0.1 0.2 2.5
Visual, OBJ 98 ms 0.1 0.5 0.1 ms 1.3 0.5 0.1 0.2 2.9
Board Repo: smoothieware/smoothieboard2
Board: Thermocouple.kicad_pcb
Folder extension-boards / thermocouple-interface
Complexity 156 / 1000 (size 111, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 9, 54, 5
Triangles, simulation 116,554 in 20 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.2 MB 194 MB
STEP 22 MB 206 MB
STL 5.8 MB 186 MB
OBJ 12 MB 196 MB
Visual
GLB 3.1 MB 158 MB
OBJ 8.5 MB 157 MB

24.66 smoothiev2-prime-2660

smoothiev2-prime-2660: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.5 11.9 46.7 1 ms 60.0 1.8 6.4 0.5 129.7
Simulation, STEP 2.4 11.6 46.4 1 ms 62.6 29.9 6.9 0.5 160.4
Simulation, STL 2.7 12.1 46.9 1 ms 60.1 4.6 6.9 0.5 133.8
Simulation, OBJ 2.3 12.0 46.1 2 ms 58.0 61.0 7.0 0.5 186.8
Visual, GLB 2.5 12.0 46.3 1 ms 113.8 1.1 15.0 0.4 191.1
Visual, OBJ 2.4 12.1 45.4 1 ms 116.7 39.1 14.2 0.4 230.3
Board Repo: smoothieware/smoothieboard2
Board: smoothiev2-prime-2660.kicad_pcb
Folder smoothiev2-prime-Proto9and10_Kicad5
Complexity 412 / 1000 (size 312, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 411, 8,248, 1,353
Triangles, simulation 9,777,692 in 411 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 332 MB 2.6 GB
STEP 1.4 GB 3.7 GB
STL 489 MB 2.5 GB
OBJ 1.0 GB 6.0 GB
Visual
GLB 224 MB 3.4 GB
OBJ 723 MB 4.7 GB

24.67 V2 Core

V2 Core: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 83 s. Simulation, STEP takes 2 min. Simulation, STL takes 83 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 7.6 30.5 1 ms 37.2 1.1 4.0 0.4 82.8
Simulation, STEP 2.0 7.9 30.2 1 ms 37.0 19.9 4.0 0.4 101.4
Simulation, STL 2.0 7.5 29.6 1 ms 36.8 2.4 4.5 0.4 83.1
Simulation, OBJ 2.0 7.5 31.8 1 ms 36.0 39.9 4.4 0.4 121.9
Visual, GLB 2.2 7.6 29.7 1 ms 68.5 0.8 7.8 0.4 117.2
Visual, OBJ 2.1 7.7 29.9 1 ms 68.2 28.2 7.5 0.4 143.8
Board Repo: smoothieware/smoothieboard2
Board: V2 Core.kicad_pcb
Folder V2_Core_P1
Complexity 402 / 1000 (size 297, features 105)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline,
TrueType text
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 325, 6,452, 788
Triangles, simulation 6,264,664 in 357 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 216 MB 1.7 GB
STEP 979 MB 2.4 GB
STL 313 MB 1.7 GB
OBJ 670 MB 4.0 GB
Visual
GLB 150 MB 2.4 GB
OBJ 482 MB 3.1 GB

24.68 motordriver

motordriver: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 43 s. Simulation, STEP takes 54 s. Simulation, STL takes 44 s. Simulation, OBJ takes 70 s. Visual, GLB takes 90 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.9 17.1 0.5 ms 15.6 0.7 2.2 0.4 42.7
Simulation, STEP 0.8 5.8 16.9 0.5 ms 16.1 11.7 2.2 0.3 53.8
Simulation, STL 0.9 5.7 17.0 2 ms 16.2 1.7 2.1 0.3 43.8
Simulation, OBJ 0.9 6.2 17.1 1 ms 15.6 27.8 2.2 0.3 70.1
Visual, GLB 0.8 5.6 17.4 2 ms 55.5 1.0 8.9 0.4 89.7
Visual, OBJ 1.5 8.3 23.5 0.5 ms 57.0 22.2 6.4 0.4 119.3
Board Repo: smoothieware/smoothieboard2
Board: motordriver.kicad_pcb
Folder V2_P11_Prime2660 / motordriver
Complexity 300 / 1000 (size 225, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 101, 2,575, 958
Triangles, simulation 4,673,744 in 127 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 156 MB 1.4 GB
STEP 523 MB 1.7 GB
STL 234 MB 1.4 GB
OBJ 490 MB 2.9 GB
Visual
GLB 101 MB 1.6 GB
OBJ 326 MB 2.1 GB

24.69 smoothiev2-prime-2660

smoothiev2-prime-2660: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 99 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.3 11.6 37.6 2 ms 41.6 1.3 5.1 0.4 99.9
Simulation, STEP 2.3 11.4 38.6 2 ms 39.1 22.6 4.9 0.4 119.3
Simulation, STL 2.4 11.0 36.8 1 ms 40.3 3.2 5.0 0.4 99.1
Simulation, OBJ 2.5 11.6 37.6 2 ms 38.3 53.2 5.0 0.4 148.7
Visual, GLB 2.2 11.3 38.3 2 ms 85.1 1.0 9.9 0.4 148.2
Visual, OBJ 2.4 10.8 36.6 1 ms 81.5 33.1 10.4 0.4 175.1
Board Repo: smoothieware/smoothieboard2
Board: smoothiev2-prime-2660.kicad_pcb
Folder V2_P11_Prime2660
Complexity 462 / 1000 (size 312, features 150)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, copper text,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 411, 8,241, 1,351
Triangles, simulation 8,598,648 in 411 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 289 MB 2.2 GB
STEP 1.3 GB 3.1 GB
STL 430 MB 2.2 GB
OBJ 919 MB 5.4 GB
Visual
GLB 198 MB 3.2 GB
OBJ 641 MB 4.1 GB

24.70 smoothiev2-prime

smoothiev2-prime: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.9 12.0 46.6 2 ms 53.3 1.8 7.0 0.4 124.0
Simulation, STEP 2.8 12.0 47.2 1 ms 53.5 28.9 6.8 0.4 151.5
Simulation, STL 2.9 11.7 46.2 1 ms 51.3 3.6 7.3 0.4 123.3
Simulation, OBJ 2.9 12.3 48.2 1 ms 52.9 59.1 7.4 0.4 183.3
Visual, GLB 2.8 11.8 49.1 1 ms 99.5 1.3 10.0 0.4 174.8
Visual, OBJ 3.1 12.1 49.1 1 ms 99.2 40.4 10.2 0.3 214.4
Board Repo: smoothieware/smoothieboard2
Board: smoothiev2-prime.kicad_pcb
Folder V2_P11_Prime2660
Complexity 408 / 1000 (size 308, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 437, 9,634, 1,439
Triangles, simulation 10,502,460 in 444 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 356 MB 2.7 GB
STEP 1.5 GB 3.8 GB
STL 525 MB 2.7 GB
OBJ 1.1 GB 6.6 GB
Visual
GLB 244 MB 3.7 GB
OBJ 790 MB 4.9 GB

24.71 smoothiev2-prime

smoothiev2-prime: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.9 13.6 47.5 3 ms 50.3 1.8 7.5 0.5 124.2
Simulation, STEP 3.0 14.5 46.5 2 ms 51.9 27.8 6.5 0.5 150.7
Simulation, STL 2.9 13.3 48.5 3 ms 49.7 4.1 6.8 0.5 125.8
Simulation, OBJ 3.2 13.5 47.5 3 ms 51.3 72.3 7.3 0.5 195.7
Visual, GLB 2.9 13.5 49.5 3 ms 111.5 1.2 15.1 0.4 194.1
Visual, OBJ 3.0 14.1 47.6 3 ms 108.4 42.1 13.9 0.4 229.4
Board Repo: smoothieware/smoothieboard2
Board: smoothiev2-prime.kicad_pcb
Folder V2_P12_Prime2590
Complexity 458 / 1000 (size 308, features 150)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings, copper text,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 437, 9,602, 1,439
Triangles, simulation 9,364,018 in 444 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 314 MB 2.4 GB
STEP 1.4 GB 3.4 GB
STL 468 MB 2.4 GB
OBJ 1.0 GB 5.9 GB
Visual
GLB 216 MB 3.4 GB
OBJ 701 MB 4.3 GB

24.72 main

main: stages 4 and 6 take 56% to 87% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 34 s. Simulation, OBJ takes 49 s. Visual, GLB takes 51 s. Visual, OBJ takes 60 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.2 14.3 0.7 ms 13.2 0.6 1.6 0.3 32.7
Simulation, STEP 0.4 2.1 14.4 0.9 ms 13.0 8.4 1.7 0.3 40.4
Simulation, STL 0.4 2.2 14.5 0.6 ms 13.1 1.7 1.6 0.3 33.7
Simulation, OBJ 0.4 2.3 14.8 0.9 ms 13.0 16.7 1.8 0.3 49.3
Visual, GLB 0.4 2.2 14.0 1.0 ms 30.4 0.3 3.8 0.3 51.3
Visual, OBJ 0.4 2.3 14.1 0.9 ms 29.2 10.4 3.6 0.3 60.3
Board Repo: snippyrow/-816-board
Board: main.kicad_pcb
Folder EXP / GPU_SCH
Complexity 231 / 1000 (size 196, features 35)
KESE features through vias, rounded,
trapezoid or chamfered pads,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 66, 2,767, 253
Triangles, simulation 3,510,342 in 160 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 121 MB 1.2 GB
STEP 600 MB 1.4 GB
STL 176 MB 1.3 GB
OBJ 374 MB 2.2 GB
Visual
GLB 76 MB 1.4 GB
OBJ 240 MB 1.6 GB

24.73 main

main: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.4 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 4.0 0.3 ms 3.3 0.1 0.4 0.2 8.9
Simulation, STEP 0.2 0.6 3.9 0.8 ms 3.6 2.6 0.5 0.2 11.6
Simulation, STL 0.2 0.6 4.1 0.6 ms 3.5 0.3 0.5 0.2 9.4
Simulation, OBJ 0.2 0.7 4.0 0.4 ms 3.6 4.9 0.5 0.2 14.1
Visual, GLB 0.2 0.7 3.7 0.4 ms 7.6 0.1 0.9 0.2 13.3
Visual, OBJ 0.2 0.7 3.8 0.5 ms 7.3 3.0 1.1 0.2 16.2
Board Repo: snippyrow/-816-board
Board: main.kicad_pcb
Folder EXP / RAM_SCH
Complexity 217 / 1000 (size 162, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 17, 890, 43
Triangles, simulation 1,093,718 in 61 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 455 MB
STEP 152 MB 573 MB
STL 55 MB 541 MB
OBJ 109 MB 763 MB
Visual
GLB 23 MB 606 MB
OBJ 70 MB 666 MB

24.74 main

main: stages 4 and 6 take 55% to 86% of a run. Simulation, GLB takes 69 s. Simulation, STEP takes 86 s. Simulation, STL takes 78 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.6 33.1 1 ms 24.1 1.1 3.4 0.4 68.6
Simulation, STEP 0.8 5.6 32.6 1 ms 25.3 17.8 3.7 0.4 86.2
Simulation, STL 1.1 6.4 36.4 1 ms 26.1 2.7 4.4 0.5 77.6
Simulation, OBJ 0.9 6.0 35.6 2 ms 25.7 39.8 3.9 0.4 112.3
Visual, GLB 1.0 5.6 36.3 2 ms 80.8 0.9 11.0 0.4 136.0
Visual, OBJ 1.1 6.0 38.0 2 ms 77.9 26.0 10.2 0.4 159.6
Board Repo: snippyrow/-816-board
Board: main.kicad_pcb
Complexity 321 / 1000 (size 221, features 100)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 137, 7,943, 670
Triangles, simulation 7,106,946 in 256 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 239 MB 2.5 GB
STEP 1.1 GB 2.7 GB
STL 355 MB 2.6 GB
OBJ 749 MB 4.5 GB
Visual
GLB 165 MB 2.6 GB
OBJ 530 MB 3.3 GB

24.75 db9

db9: stages 4 and 6 take 40% to 60% of a run. Simulation, GLB takes 0.9 s. Simulation, STEP takes 1.2 s. Simulation, STL takes 0.9 s. Simulation, OBJ takes 1.2 s. Visual, GLB takes 1.1 s. Visual, OBJ takes 1.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 87 ms 85 ms 0.1 0.1 ms 0.3 9 ms 29 ms 0.2 0.9
Simulation, STEP 86 ms 81 ms 0.1 0.1 ms 0.3 0.3 31 ms 0.2 1.2
Simulation, STL 96 ms 88 ms 0.1 0.1 ms 0.4 10 ms 29 ms 0.2 0.9
Simulation, OBJ 87 ms 81 ms 0.1 0.1 ms 0.4 0.2 33 ms 0.3 1.2
Visual, GLB 87 ms 84 ms 0.1 0.1 ms 0.5 8 ms 47 ms 0.2 1.1
Visual, OBJ 0.1 98 ms 0.1 0.1 ms 0.5 0.2 46 ms 0.2 1.3
Board Repo: softerhardware/Hermes-Lite2
Board: db9.kicad_pcb
Folder hardware / companions / db9
Complexity 138 / 1000 (size 123, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 9, 131, 3
Triangles, simulation 33,536 in 20 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.3 MB 66 MB
STEP 6.8 MB 70 MB
STL 1.7 MB 67 MB
OBJ 3.4 MB 76 MB
Visual
GLB 1.1 MB 95 MB
OBJ 3.1 MB 96 MB

24.76 io_jumper

io_jumper: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 3.5 s. Simulation, STEP takes 4.6 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 4.9 s. Visual, GLB takes 4.5 s. Visual, OBJ takes 5.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.4 0.3 ms 1.2 49 ms 0.2 0.3 3.5
Simulation, STEP 0.2 0.3 1.3 0.3 ms 1.1 1.3 0.2 0.2 4.6
Simulation, STL 0.1 0.3 1.4 0.2 ms 1.2 77 ms 0.2 0.3 3.5
Simulation, OBJ 0.2 0.3 1.3 0.3 ms 1.1 1.6 0.2 0.2 4.9
Visual, GLB 0.1 0.3 1.3 0.3 ms 2.3 33 ms 0.2 0.3 4.5
Visual, OBJ 0.1 0.3 1.2 0.3 ms 2.4 1.1 0.2 0.2 5.6
Board Repo: softerhardware/Hermes-Lite2
Board: io_jumper.kicad_pcb
Folder hardware / companions / io_jumper
Complexity 165 / 1000 (size 130, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 12, 162, 9
Triangles, simulation 273,400 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.4 MB 238 MB
STEP 40 MB 244 MB
STL 14 MB 225 MB
OBJ 27 MB 234 MB
Visual
GLB 6.0 MB 237 MB
OBJ 17 MB 239 MB

24.77 n2adr

n2adr: stages 4 and 6 take 53% to 86% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 22 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.5 6.9 0.6 ms 6.1 0.3 0.7 0.2 15.9
Simulation, STEP 0.3 1.5 7.0 0.6 ms 6.0 3.8 0.7 0.2 19.6
Simulation, STL 0.3 1.5 6.8 0.6 ms 6.0 0.4 0.7 0.2 16.0
Simulation, OBJ 0.4 1.5 6.9 0.5 ms 6.0 8.7 0.8 0.2 24.4
Visual, GLB 0.3 1.5 7.2 1 ms 11.5 0.1 0.8 0.2 21.7
Visual, OBJ 0.3 1.5 6.9 0.6 ms 11.5 5.1 0.9 0.3 26.5
Board Repo: softerhardware/Hermes-Lite2
Board: n2adr.kicad_pcb
Folder hardware / companions / n2adr
Complexity 236 / 1000 (size 191, features 45)
KESE features through vias, drill offsets,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 99, 620, 25
Triangles, simulation 1,611,570 in 98 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 56 MB 539 MB
STEP 276 MB 679 MB
STL 81 MB 523 MB
OBJ 169 MB 1.1 GB
Visual
GLB 34 MB 679 MB
OBJ 101 MB 749 MB

24.78 Header2x20

Header2x20: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 2.1 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 2.1 s. Simulation, OBJ takes 3.0 s. Visual, GLB takes 2.6 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 14 ms 0.1 0.8 0.2 ms 0.9 34 ms 97 ms 0.2 2.1
Simulation, STEP 13 ms 0.1 0.8 0.2 ms 0.8 0.9 0.1 0.2 3.0
Simulation, STL 13 ms 0.1 0.8 0.2 ms 0.8 47 ms 0.1 0.2 2.1
Simulation, OBJ 14 ms 0.1 0.8 0.2 ms 0.8 1.0 99 ms 0.2 3.0
Visual, GLB 14 ms 0.1 0.8 0.2 ms 1.3 13 ms 0.1 0.2 2.6
Visual, OBJ 15 ms 0.1 0.8 0.1 ms 1.3 0.4 0.1 0.2 3.0
Board Repo: softerhardware/Hermes-Lite2
Board: Header2x20.kicad_pcb
Folder hardware / companions / n2adr_jumper
Complexity 85 / 1000 (size 85, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 1, 40, 0
Triangles, simulation 205,332 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.9 MB 181 MB
STEP 34 MB 202 MB
STL 10 MB 181 MB
OBJ 20 MB 186 MB
Visual
GLB 2.8 MB 145 MB
OBJ 8.0 MB 147 MB

24.79 psfeedback

psfeedback: stages 4 and 6 take 42% to 75% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 93 ms 0.1 0.4 0.2 ms 0.6 18 ms 54 ms 0.3 1.5
Simulation, STEP 98 ms 0.1 0.4 0.2 ms 0.6 0.8 58 ms 0.2 2.3
Simulation, STL 97 ms 0.1 0.4 0.1 ms 0.6 28 ms 50 ms 0.2 1.5
Simulation, OBJ 84 ms 0.1 0.4 0.2 ms 0.6 0.4 60 ms 0.2 1.9
Visual, GLB 89 ms 0.1 0.5 0.1 ms 1.0 10 ms 63 ms 0.2 1.9
Visual, OBJ 96 ms 0.1 0.4 0.1 ms 1.1 0.3 54 ms 0.2 2.3
Board Repo: softerhardware/Hermes-Lite2
Board: psfeedback.kicad_pcb
Folder hardware / companions / psfeedback
Complexity 143 / 1000 (size 98, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 27, 4
Triangles, simulation 72,872 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.6 MB 171 MB
STEP 11 MB 175 MB
STL 3.6 MB 169 MB
OBJ 7.0 MB 168 MB
Visual
GLB 1.7 MB 151 MB
OBJ 4.5 MB 153 MB

24.80 smallio

smallio: stages 4 and 6 take 39% to 75% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 2.0 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 85 ms 81 ms 0.2 0.1 ms 0.5 19 ms 59 ms 0.2 1.2
Simulation, STEP 82 ms 85 ms 0.3 0.2 ms 0.5 0.7 72 ms 0.2 2.0
Simulation, STL 81 ms 87 ms 0.2 0.1 ms 0.5 21 ms 53 ms 0.2 1.2
Simulation, OBJ 81 ms 96 ms 0.3 0.1 ms 0.5 0.3 53 ms 0.2 1.5
Visual, GLB 81 ms 89 ms 0.2 0.1 ms 1.2 13 ms 72 ms 0.2 1.9
Visual, OBJ 83 ms 96 ms 0.3 0.2 ms 1.2 0.3 66 ms 0.2 2.2
Board Repo: softerhardware/Hermes-Lite2
Board: smallio.kicad_pcb
Folder hardware / companions / smallio
Complexity 150 / 1000 (size 115, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 83, 9
Triangles, simulation 70,712 in 28 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.5 MB 173 MB
STEP 13 MB 180 MB
STL 3.5 MB 173 MB
OBJ 6.9 MB 177 MB
Visual
GLB 2.2 MB 152 MB
OBJ 6.1 MB 152 MB

24.81 hl2-back-horiz

hl2-back-horiz: stages 4 and 6 take 41% to 72% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.1 ms 0.4 12 ms 37 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.4 0.1 ms 0.4 0.8 38 ms 0.2 2.1
Simulation, STL 0.1 0.1 0.5 0.1 ms 0.4 17 ms 40 ms 0.2 1.4
Simulation, OBJ 0.1 0.1 0.5 0.1 ms 0.4 0.4 36 ms 0.2 1.7
Visual, GLB 0.1 0.1 0.4 0.1 ms 0.9 11 ms 71 ms 0.2 1.8
Visual, OBJ 0.1 0.1 0.4 0.1 ms 0.9 0.3 65 ms 0.2 2.1
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-back-horiz.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-back-horiz
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 67,236 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.5 MB 176 MB
STEP 14 MB 180 MB
STL 3.4 MB 177 MB
OBJ 6.9 MB 175 MB
Visual
GLB 2.0 MB 154 MB
OBJ 5.6 MB 155 MB

24.82 hl2-back-vert

hl2-back-vert: stages 4 and 6 take 40% to 72% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.8 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.5 0.1 ms 0.4 14 ms 45 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.4 0.8 44 ms 0.2 2.3
Simulation, STL 0.1 0.1 0.5 0.1 ms 0.4 19 ms 41 ms 0.2 1.4
Simulation, OBJ 0.1 0.1 0.5 0.1 ms 0.4 0.4 41 ms 0.2 1.8
Visual, GLB 0.1 0.1 0.5 0.1 ms 0.9 12 ms 78 ms 0.2 2.0
Visual, OBJ 0.1 0.1 0.5 0.1 ms 1.0 0.3 86 ms 0.2 2.3
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-back-vert.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-back-vert
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 67,224 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.5 MB 179 MB
STEP 14 MB 184 MB
STL 3.4 MB 180 MB
OBJ 6.9 MB 180 MB
Visual
GLB 2.0 MB 156 MB
OBJ 5.6 MB 154 MB

24.83 hl2-back

hl2-back: stages 4 and 6 take 42% to 74% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.5 0.1 ms 0.5 16 ms 49 ms 0.3 1.6
Simulation, STEP 0.1 0.1 0.5 0.2 ms 0.5 0.9 50 ms 0.2 2.4
Simulation, STL 0.1 0.1 0.5 0.2 ms 0.5 23 ms 58 ms 0.2 1.6
Simulation, OBJ 0.1 0.1 0.4 0.2 ms 0.5 0.3 41 ms 0.2 1.7
Visual, GLB 0.1 0.1 0.4 0.1 ms 1.0 15 ms 87 ms 0.2 2.0
Visual, OBJ 0.1 0.1 0.5 0.1 ms 0.9 0.3 76 ms 0.2 2.2
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-back.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-back
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 66,376 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.5 MB 180 MB
STEP 13 MB 183 MB
STL 3.3 MB 179 MB
OBJ 6.8 MB 179 MB
Visual
GLB 2.0 MB 156 MB
OBJ 5.5 MB 155 MB

24.84 hl2-front-horiz

hl2-front-horiz: stages 4 and 6 take 42% to 74% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.3 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 2.2 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 93 ms 0.2 0.5 0.1 ms 0.4 14 ms 54 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.4 0.7 50 ms 0.2 2.2
Simulation, STL 94 ms 0.1 0.4 0.1 ms 0.4 20 ms 44 ms 0.2 1.3
Simulation, OBJ 76 ms 0.1 0.5 0.1 ms 0.5 0.4 50 ms 0.2 1.7
Visual, GLB 91 ms 0.2 0.5 0.1 ms 1.1 11 ms 82 ms 0.2 2.2
Visual, OBJ 93 ms 0.1 0.4 0.1 ms 1.0 0.3 64 ms 0.2 2.3
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-front-horiz.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-front-horiz
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 73,984 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.7 MB 181 MB
STEP 15 MB 185 MB
STL 3.7 MB 177 MB
OBJ 7.5 MB 180 MB
Visual
GLB 2.2 MB 155 MB
OBJ 6.2 MB 154 MB

24.85 hl2-front-vert

hl2-front-vert: stages 4 and 6 take 42% to 72% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 2.2 s. Visual, OBJ takes 2.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.6 0.1 ms 0.5 15 ms 46 ms 0.2 1.6
Simulation, STEP 0.1 0.2 0.5 0.1 ms 0.5 0.9 58 ms 0.2 2.5
Simulation, STL 98 ms 0.2 0.6 0.2 ms 0.5 22 ms 46 ms 0.2 1.6
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.5 0.4 46 ms 0.3 2.0
Visual, GLB 0.1 0.2 0.6 0.1 ms 1.0 17 ms 99 ms 0.2 2.2
Visual, OBJ 0.1 0.2 0.5 0.1 ms 1.0 0.4 82 ms 0.3 2.5
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-front-vert.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-front-vert
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 73,972 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.7 MB 181 MB
STEP 15 MB 182 MB
STL 3.7 MB 183 MB
OBJ 7.5 MB 180 MB
Visual
GLB 2.2 MB 154 MB
OBJ 6.2 MB 155 MB

24.86 hl2-front

hl2-front: stages 4 and 6 take 41% to 73% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.1 ms 0.5 14 ms 47 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.5 0.1 ms 0.4 0.8 45 ms 0.2 2.1
Simulation, STL 0.1 0.2 0.5 0.2 ms 0.5 18 ms 47 ms 0.2 1.5
Simulation, OBJ 0.1 0.2 0.5 0.1 ms 0.4 0.5 47 ms 0.2 1.9
Visual, GLB 0.1 0.2 0.5 0.1 ms 1.0 11 ms 98 ms 0.2 2.1
Visual, OBJ 0.1 0.2 0.5 0.1 ms 0.9 0.4 81 ms 0.2 2.4
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-front.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-front
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 75,024 in 12 parts
Note no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.8 MB 182 MB
STEP 15 MB 186 MB
STL 3.8 MB 176 MB
OBJ 7.6 MB 180 MB
Visual
GLB 2.3 MB 156 MB
OBJ 6.3 MB 154 MB

24.87 hl2-panel

hl2-panel: stages 4 and 6 take 37% to 67% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.8 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 1.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.5 0.1 ms 0.4 12 ms 43 ms 0.2 1.4
Simulation, STEP 0.1 0.1 0.4 0.1 ms 0.5 1.0 42 ms 0.2 2.4
Simulation, STL 0.1 0.1 0.5 0.2 ms 0.5 15 ms 43 ms 0.2 1.4
Simulation, OBJ 0.1 0.1 0.5 0.1 ms 0.5 0.3 43 ms 0.2 1.8
Visual, GLB 0.1 0.1 0.5 0.1 ms 0.7 10 ms 74 ms 0.3 1.8
Visual, OBJ 0.1 0.2 0.5 0.1 ms 0.6 0.3 66 ms 0.2 1.9
Board Repo: softerhardware/Hermes-Lite2
Board: hl2-panel.kicad_pcb
Folder hardware / enclosure / endcaps / ad5dz / hl2-panel
Complexity 47 / 1000 (size 17, features 30)
KESE features slotted holes, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 0, 0, 0
Triangles, simulation 58,308 in 11 parts
Note panel, no components
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.2 MB 79 MB
STEP 12 MB 188 MB
STL 2.9 MB 79 MB
OBJ 6.0 MB 94 MB
Visual
GLB 1.7 MB 117 MB
OBJ 4.7 MB 102 MB

24.88 endcap

endcap: stages 4 and 6 take 53% to 81% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 6.9 s. Simulation, STL takes 5.3 s. Simulation, OBJ takes 7.4 s. Visual, GLB takes 7.9 s. Visual, OBJ takes 9.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.1 0.3 ms 1.9 75 ms 0.2 0.2 5.3
Simulation, STEP 0.2 0.5 2.1 0.2 ms 1.8 1.8 0.2 0.2 6.9
Simulation, STL 0.2 0.5 2.1 0.4 ms 2.0 0.1 0.3 0.2 5.3
Simulation, OBJ 0.3 0.6 2.0 0.2 ms 1.9 2.2 0.2 0.2 7.4
Visual, GLB 0.2 0.5 2.2 0.2 ms 4.1 62 ms 0.5 0.2 7.9
Visual, OBJ 0.2 0.5 2.0 0.2 ms 3.9 2.0 0.5 0.2 9.3
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kd9s / hl2_55b / hl2_55b_v
Complexity 208 / 1000 (size 153, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 42, 278, 19
Triangles, simulation 404,012 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 298 MB
STEP 71 MB 337 MB
STL 20 MB 290 MB
OBJ 42 MB 341 MB
Visual
GLB 12 MB 336 MB
OBJ 35 MB 344 MB

24.89 endcap

endcap: stages 4 and 6 take 40% to 70% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.6 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 5.1 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 6.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 0.8 0.1 ms 1.4 49 ms 0.2 0.2 3.4
Simulation, STEP 0.2 0.6 0.7 0.1 ms 1.4 1.4 0.1 0.2 4.6
Simulation, STL 0.2 0.6 0.7 0.1 ms 1.4 0.1 0.1 0.2 3.3
Simulation, OBJ 0.2 0.6 0.8 0.1 ms 1.3 1.8 0.1 0.3 5.1
Visual, GLB 0.2 0.6 0.9 0.1 ms 2.3 48 ms 0.4 0.2 4.6
Visual, OBJ 0.2 0.6 0.7 0.1 ms 2.2 1.6 0.5 0.3 6.0
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kd9s / hl2_55f / hl2_55f_v
Complexity 72 / 1000 (size 32, features 40)
KESE features slotted holes, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 0, 0
Triangles, simulation 357,484 in 11 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 340 MB
STEP 44 MB 348 MB
STL 18 MB 340 MB
OBJ 36 MB 338 MB
Visual
GLB 10 MB 310 MB
OBJ 29 MB 313 MB

24.90 endcap

endcap: stages 4 and 6 take 53% to 78% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.4 s. Simulation, OBJ takes 6.1 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 7.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 1.7 0.2 ms 1.7 80 ms 0.2 0.2 4.5
Simulation, STEP 0.2 0.5 1.6 0.2 ms 1.6 1.6 0.2 0.2 5.8
Simulation, STL 0.2 0.4 1.7 0.2 ms 1.6 0.1 0.2 0.2 4.4
Simulation, OBJ 0.2 0.5 1.6 0.2 ms 1.6 1.9 0.2 0.2 6.1
Visual, GLB 0.1 0.5 1.7 0.2 ms 2.9 55 ms 0.4 0.2 5.9
Visual, OBJ 0.2 0.4 1.8 0.2 ms 3.0 1.4 0.5 0.2 7.5
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kf7o / hl2_40b
Complexity 197 / 1000 (size 152, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 42, 267, 19
Triangles, simulation 399,626 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 294 MB
STEP 67 MB 339 MB
STL 20 MB 293 MB
OBJ 42 MB 346 MB
Visual
GLB 12 MB 339 MB
OBJ 34 MB 329 MB

24.91 endcap

endcap: stages 4 and 6 take 37% to 67% of a run. Simulation, GLB takes 1.2 s. Simulation, STEP takes 1.9 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.7 s. Visual, GLB takes 1.6 s. Visual, OBJ takes 1.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 89 ms 0.1 0.2 0.1 ms 0.4 16 ms 34 ms 0.2 1.2
Simulation, STEP 87 ms 0.1 0.2 0.1 ms 0.5 0.8 33 ms 0.2 1.9
Simulation, STL 94 ms 0.1 0.3 0.1 ms 0.5 23 ms 29 ms 0.2 1.2
Simulation, OBJ 90 ms 0.1 0.3 0.1 ms 0.5 0.4 32 ms 0.3 1.7
Visual, GLB 0.1 0.1 0.3 0.2 ms 0.8 12 ms 87 ms 0.2 1.6
Visual, OBJ 0.1 0.1 0.3 0.1 ms 0.8 0.3 95 ms 0.2 1.9
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kf7o / hl2_40f
Complexity 62 / 1000 (size 32, features 30)
KESE features filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 0, 0
Triangles, simulation 86,444 in 11 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.9 MB 187 MB
STEP 12 MB 186 MB
STL 4.3 MB 183 MB
OBJ 8.3 MB 183 MB
Visual
GLB 2.2 MB 153 MB
OBJ 6.1 MB 152 MB

24.92 endcap

endcap: stages 4 and 6 take 55% to 77% of a run. Simulation, GLB takes 6.1 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.2 s. Simulation, OBJ takes 8.1 s. Visual, GLB takes 8.5 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.4 0.2 ms 2.1 78 ms 0.3 0.3 6.1
Simulation, STEP 0.2 0.7 2.5 0.2 ms 2.1 1.9 0.2 0.2 7.9
Simulation, STL 0.2 0.8 2.4 0.9 ms 2.0 0.2 0.3 0.2 6.2
Simulation, OBJ 0.2 0.7 2.5 0.2 ms 2.0 2.4 0.2 0.2 8.1
Visual, GLB 0.2 0.8 2.4 0.3 ms 4.2 71 ms 0.6 0.2 8.5
Visual, OBJ 0.2 0.7 2.3 0.2 ms 4.0 2.1 0.7 0.2 10.3
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kf7o / hl2_55b
Complexity 208 / 1000 (size 153, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 42, 278, 19
Triangles, simulation 545,500 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 343 MB
STEP 87 MB 394 MB
STL 27 MB 346 MB
OBJ 57 MB 420 MB
Visual
GLB 16 MB 444 MB
OBJ 47 MB 449 MB

24.93 endcap

endcap: stages 4 and 6 take 39% to 66% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.3 0.1 ms 0.6 21 ms 52 ms 0.2 1.6
Simulation, STEP 0.1 0.2 0.3 0.1 ms 0.6 0.9 51 ms 0.2 2.4
Simulation, STL 0.1 0.2 0.3 0.1 ms 0.6 35 ms 51 ms 0.2 1.6
Simulation, OBJ 0.1 0.2 0.4 0.1 ms 0.6 0.7 49 ms 0.2 2.2
Visual, GLB 0.1 0.2 0.4 0.2 ms 1.1 18 ms 0.1 0.2 2.1
Visual, OBJ 0.1 0.2 0.3 0.1 ms 1.0 0.5 0.1 0.3 2.6
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kf7o / hl2_55f
Complexity 72 / 1000 (size 32, features 40)
KESE features slotted holes, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 0, 0
Triangles, simulation 118,864 in 11 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.0 MB 203 MB
STEP 17 MB 206 MB
STL 5.9 MB 202 MB
OBJ 11 MB 204 MB
Visual
GLB 3.3 MB 159 MB
OBJ 9.0 MB 159 MB

24.94 endcap

endcap: stages 4 and 6 take 33% to 64% of a run. Simulation, GLB takes 0.9 s. Simulation, STEP takes 1.6 s. Simulation, STL takes 0.9 s. Simulation, OBJ takes 1.1 s. Visual, GLB takes 1.1 s. Visual, OBJ takes 1.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 81 ms 0.2 0.1 ms 0.2 7 ms 27 ms 0.3 0.9
Simulation, STEP 90 ms 95 ms 0.2 0.1 ms 0.3 0.7 27 ms 0.2 1.6
Simulation, STL 81 ms 98 ms 0.2 0.1 ms 0.3 11 ms 25 ms 0.2 0.9
Simulation, OBJ 86 ms 89 ms 0.2 0.1 ms 0.3 0.2 25 ms 0.2 1.1
Visual, GLB 75 ms 85 ms 0.2 0.1 ms 0.5 8 ms 58 ms 0.2 1.1
Visual, OBJ 76 ms 0.1 0.2 0.1 ms 0.5 0.2 60 ms 0.2 1.4
Board Repo: softerhardware/Hermes-Lite2
Board: endcap.kicad_pcb
Folder hardware / enclosure / endcaps / kf7o / hl2_55fb
Complexity 69 / 1000 (size 29, features 40)
KESE features slotted holes, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 0, 0
Triangles, simulation 52,740 in 11 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.7 MB 71 MB
STEP 10 MB 177 MB
STL 2.6 MB 71 MB
OBJ 5.1 MB 83 MB
Visual
GLB 1.4 MB 106 MB
OBJ 3.9 MB 107 MB

24.95 hermeslite

hermeslite: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 99 s. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 11.5 41.0 2 ms 38.1 1.8 4.8 0.5 99.0
Simulation, STEP 1.2 10.6 41.7 2 ms 38.3 20.5 4.8 0.4 117.5
Simulation, STL 1.3 11.2 43.1 2 ms 38.9 4.2 5.0 0.4 104.1
Simulation, OBJ 1.1 10.6 40.1 2 ms 37.6 47.0 4.5 0.5 141.4
Visual, GLB 1.2 10.5 38.6 3 ms 75.0 0.8 8.0 0.4 134.5
Visual, OBJ 1.4 10.4 41.9 1 ms 78.4 23.1 8.0 0.4 163.6
Board Repo: softerhardware/Hermes-Lite2
Board: hermeslite.kicad_pcb
Folder hardware / hl
Complexity 288 / 1000 (size 243, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 456, 4,630, 489
Triangles, simulation 7,524,040 in 307 parts
Verifier PASS in all six runs
Run again Visual, GLB; Visual, OBJ: failed in the corpus run, run again with fixes to KESE made after the corpus run, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 264 MB 1.8 GB
STEP 1.3 GB 2.3 GB
STL 376 MB 1.9 GB
OBJ 822 MB 4.8 GB
Visual
GLB 138 MB 2.2 GB
OBJ 434 MB 2.8 GB

24.96 SparkFun_GNSS_Flex_Module_DAN-F10N_panelized

Stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 91 s. Simulation, STEP takes 2 min. Simulation, STL takes 93 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.5 10.0 42.0 2 ms 31.6 1.4 3.0 0.5 91.1
Simulation, STEP 2.5 10.6 42.4 2 ms 31.3 18.5 3.1 0.4 108.9
Simulation, STL 2.5 9.7 41.9 2 ms 32.7 3.0 3.2 0.4 93.4
Simulation, OBJ 2.4 9.9 40.6 2 ms 33.6 53.7 3.2 0.5 143.9
Visual, GLB 2.6 10.1 40.9 2 ms 63.0 0.8 11.0 0.4 128.8
Visual, OBJ 2.7 11.0 43.6 0.6 ms 63.8 31.0 10.7 0.4 163.2
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_DAN-F10N_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_DAN-F10N / hardware / production
Complexity 337 / 1000 (size 232, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 180, 1,020, 1,644
Triangles, simulation 7,341,262 in 59 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 262 MB 2.8 GB
STEP 981 MB 3.2 GB
STL 367 MB 2.6 GB
OBJ 808 MB 4.9 GB
Visual
GLB 165 MB 2.6 GB
OBJ 520 MB 3.5 GB

24.97 SparkFun_GNSS_Flex_Module_DAN-F10N

Stages 4 and 6 take 51% to 79% of a run. Simulation, GLB takes 5.1 s. Simulation, STEP takes 6.5 s. Simulation, STL takes 5.0 s. Simulation, OBJ takes 7.3 s. Visual, GLB takes 6.7 s. Visual, OBJ takes 8.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.8 0.3 ms 2.0 91 ms 0.3 0.2 5.1
Simulation, STEP 0.2 0.6 1.9 0.4 ms 2.0 1.4 0.2 0.3 6.5
Simulation, STL 0.2 0.5 1.8 0.2 ms 2.0 0.1 0.3 0.2 5.0
Simulation, OBJ 0.2 0.5 1.8 0.3 ms 1.9 2.4 0.2 0.2 7.3
Visual, GLB 0.2 0.5 1.7 0.3 ms 3.7 56 ms 0.5 0.2 6.7
Visual, OBJ 0.2 0.5 1.7 0.3 ms 3.4 1.6 0.5 0.2 8.1
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_DAN-F10N.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_DAN-F10N / hardware
Complexity 270 / 1000 (size 165, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
knockout text, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 15, 85, 137
Triangles, simulation 611,188 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 387 MB
STEP 78 MB 428 MB
STL 31 MB 368 MB
OBJ 63 MB 479 MB
Visual
GLB 14 MB 374 MB
OBJ 41 MB 383 MB

24.98 SparkFun_GNSS_Flex_Module_LG290P-Tilt_panelized

Stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.5 11.6 50.9 0.7 ms 40.4 1.9 4.8 0.5 113.6
Simulation, STEP 3.4 11.4 51.8 0.9 ms 39.6 28.0 5.0 0.5 139.7
Simulation, STL 3.3 11.8 52.3 1 ms 40.3 4.7 5.6 0.5 118.6
Simulation, OBJ 3.4 12.0 51.4 0.6 ms 38.9 70.6 4.8 0.5 181.5
Visual, GLB 3.3 11.1 50.0 2 ms 99.1 1.4 14.0 0.4 179.3
Visual, OBJ 3.5 12.1 51.8 0.7 ms 100.9 48.1 13.9 0.5 230.9
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG290P-Tilt_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG290P-Tilt / hardware / production
Complexity 369 / 1000 (size 249, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 360, 4,905, 1,815
Triangles, simulation 11,325,460 in 65 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 404 MB 3.5 GB
STEP 1.8 GB 4.3 GB
STL 566 MB 3.4 GB
OBJ 1.3 GB 7.5 GB
Visual
GLB 282 MB 4.2 GB
OBJ 894 MB 5.7 GB

24.99 SparkFun_GNSS_Flex_Module_LG290P-Tilt

Stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 10 s. Simulation, STL takes 7.7 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.7 0.4 ms 3.1 0.1 0.4 0.3 7.7
Simulation, STEP 0.3 0.8 3.0 0.4 ms 3.2 2.4 0.4 0.3 10.4
Simulation, STL 0.3 0.8 2.6 0.3 ms 3.1 0.2 0.5 0.2 7.7
Simulation, OBJ 0.3 0.7 2.7 0.4 ms 3.0 4.5 0.4 0.3 11.9
Visual, GLB 0.3 0.8 2.7 0.5 ms 6.1 93 ms 0.7 0.2 10.9
Visual, OBJ 0.4 0.7 2.9 0.4 ms 6.5 3.0 0.7 0.3 14.5
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG290P-Tilt.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG290P-Tilt / hardware
Complexity 295 / 1000 (size 175, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 10th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 24, 327, 121
Triangles, simulation 754,390 in 65 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 425 MB
STEP 118 MB 456 MB
STL 38 MB 399 MB
OBJ 79 MB 586 MB
Visual
GLB 19 MB 450 MB
OBJ 56 MB 446 MB

24.100 SparkFun_GNSS_Flex_Module_LG290P_panelized

Stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 91 s. Simulation, STEP takes 2 min. Simulation, STL takes 95 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.6 8.9 42.6 0.8 ms 31.3 1.6 3.9 0.5 91.3
Simulation, STEP 2.6 8.8 42.4 3 ms 32.0 20.2 4.0 0.6 110.5
Simulation, STL 2.6 9.2 42.8 0.9 ms 31.6 3.5 4.4 0.5 94.7
Simulation, OBJ 2.8 9.4 43.3 0.9 ms 31.4 50.8 3.8 0.6 142.2
Visual, GLB 2.4 9.1 42.5 1.0 ms 70.4 1.0 11.8 0.4 137.6
Visual, OBJ 2.5 9.2 42.2 3 ms 71.6 31.1 11.8 0.4 168.8
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG290P_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG290P / hardware / production
Complexity 358 / 1000 (size 238, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 225, 3,045, 1,500
Triangles, simulation 8,237,804 in 54 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 294 MB 2.9 GB
STEP 1.2 GB 3.5 GB
STL 412 MB 2.8 GB
OBJ 909 MB 5.5 GB
Visual
GLB 198 MB 3.1 GB
OBJ 627 MB 4.0 GB

24.101 SparkFun_GNSS_Flex_Module_LG290P

Stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 5.0 s. Simulation, OBJ takes 7.4 s. Visual, GLB takes 6.9 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.5 1.9 0.4 ms 1.8 0.1 0.3 0.2 5.0
Simulation, STEP 0.2 0.5 1.9 0.3 ms 1.7 1.5 0.3 0.2 6.3
Simulation, STL 0.2 0.5 1.8 0.3 ms 1.9 0.2 0.3 0.2 5.0
Simulation, OBJ 0.2 0.5 1.9 0.3 ms 1.7 2.7 0.3 0.2 7.4
Visual, GLB 0.2 0.5 1.9 0.3 ms 3.5 61 ms 0.5 0.2 6.9
Visual, OBJ 0.2 0.5 1.8 0.3 ms 3.5 1.9 0.5 0.2 8.5
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG290P.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG290P / hardware
Complexity 285 / 1000 (size 165, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 15, 203, 100
Triangles, simulation 548,654 in 54 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 367 MB
STEP 78 MB 375 MB
STL 27 MB 345 MB
OBJ 57 MB 430 MB
Visual
GLB 13 MB 359 MB
OBJ 39 MB 353 MB

24.102 SparkFun_GNSS_Flex_Module_LG580P_panelized

Stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 46 s. Simulation, STL takes 40 s. Simulation, OBJ takes 58 s. Visual, GLB takes 57 s. Visual, OBJ takes 70 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 4.0 16.1 1 ms 13.0 0.6 1.5 0.3 36.6
Simulation, STEP 1.1 3.6 16.5 0.4 ms 14.0 8.6 1.5 0.3 45.6
Simulation, STL 1.2 3.9 17.8 2 ms 14.3 1.3 1.5 0.3 40.3
Simulation, OBJ 1.2 4.0 17.7 0.4 ms 13.6 19.6 1.5 0.3 57.9
Visual, GLB 1.2 4.0 16.5 1 ms 30.1 0.5 4.6 0.3 57.0
Visual, OBJ 1.1 4.0 17.1 1 ms 28.4 13.7 5.3 0.3 69.8
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG580P_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG580P / hardware / production
Complexity 339 / 1000 (size 219, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 132, 894, 786
Triangles, simulation 3,878,978 in 73 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 137 MB 1.5 GB
STEP 532 MB 1.7 GB
STL 194 MB 1.6 GB
OBJ 421 MB 2.6 GB
Visual
GLB 89 MB 1.5 GB
OBJ 279 MB 1.8 GB

24.103 SparkFun_GNSS_Flex_Module_LG580P

Stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 6.4 s. Simulation, STEP takes 8.6 s. Simulation, STL takes 6.5 s. Simulation, OBJ takes 10 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.5 0.4 ms 2.3 0.1 0.4 0.2 6.4
Simulation, STEP 0.3 0.7 2.5 0.4 ms 2.4 2.1 0.4 0.2 8.6
Simulation, STL 0.3 0.7 2.4 0.4 ms 2.3 0.2 0.4 0.2 6.5
Simulation, OBJ 0.3 0.7 2.3 0.4 ms 2.4 3.7 0.4 0.2 10.1
Visual, GLB 0.3 0.7 2.4 0.4 ms 5.0 73 ms 0.6 0.3 9.2
Visual, OBJ 0.3 0.7 2.4 0.4 ms 5.3 2.6 0.7 0.2 12.2
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_LG580P.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_LG580P / hardware
Complexity 291 / 1000 (size 171, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 10th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 22, 149, 131
Triangles, simulation 643,882 in 73 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 412 MB
STEP 86 MB 429 MB
STL 32 MB 409 MB
OBJ 66 MB 496 MB
Visual
GLB 15 MB 402 MB
OBJ 44 MB 396 MB

24.104 SparkFun_GNSS_Flex_Module_mosaic-G5_P3_Tilt_panelized

Stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 4 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.9 15.8 56.8 1 ms 43.7 2.4 5.2 0.5 128.2
Simulation, STEP 3.8 15.6 57.4 0.9 ms 43.4 32.1 5.4 0.5 158.3
Simulation, STL 3.9 15.7 57.9 1 ms 43.8 4.8 5.4 0.5 132.1
Simulation, OBJ 4.2 16.0 58.5 1.0 ms 44.7 82.4 5.4 0.6 211.9
Visual, GLB 4.2 15.6 58.5 1 ms 103.7 1.4 11.9 0.4 195.6
Visual, OBJ 3.8 15.5 58.6 0.9 ms 103.2 50.2 12.2 0.4 244.0
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-G5_P3_Tilt_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-G5_P3-Tilt / hardware / production
Complexity 448 / 1000 (size 328, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 300, 4,920, 2,475
Triangles, simulation 13,247,162 in 79 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 463 MB 4.4 GB
STEP 2.1 GB 5.1 GB
STL 662 MB 4.1 GB
OBJ 1.5 GB 8.7 GB
Visual
GLB 306 MB 4.7 GB
OBJ 982 MB 6.2 GB

24.105 SparkFun_GNSS_Flex_Module_mosaic-G5_P3_Tilt

Stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 7.9 s. Simulation, STEP takes 9.8 s. Simulation, STL takes 7.8 s. Simulation, OBJ takes 12 s. Visual, GLB takes 10 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.8 2.9 0.4 ms 3.0 0.1 0.4 0.2 7.9
Simulation, STEP 0.3 0.8 2.9 0.5 ms 2.9 2.3 0.4 0.2 9.8
Simulation, STL 0.3 0.8 2.9 0.3 ms 3.0 0.2 0.3 0.2 7.8
Simulation, OBJ 0.3 0.7 2.8 0.4 ms 2.9 4.4 0.4 0.2 11.7
Visual, GLB 0.3 0.7 2.8 0.4 ms 5.7 94 ms 0.6 0.3 10.4
Visual, OBJ 0.3 0.7 2.8 0.4 ms 5.9 3.1 0.7 0.2 13.8
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-G5_P3_Tilt.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-G5_P3-Tilt / hardware
Complexity 348 / 1000 (size 228, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 20, 328, 165
Triangles, simulation 882,344 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 496 MB
STEP 132 MB 515 MB
STL 44 MB 489 MB
OBJ 91 MB 636 MB
Visual
GLB 20 MB 488 MB
OBJ 61 MB 521 MB

24.106 SparkFun_GNSS_Flex_Module_mosaic-X5_IM19_panelized

Stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 85 s. Simulation, STEP takes 2 min. Simulation, STL takes 86 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.6 9.0 38.8 0.6 ms 28.5 1.5 4.0 0.4 84.8
Simulation, STEP 2.6 9.2 39.9 0.7 ms 28.8 19.7 3.9 0.4 104.6
Simulation, STL 2.6 9.1 38.6 0.8 ms 28.7 2.9 3.7 0.4 86.0
Simulation, OBJ 2.7 8.9 38.2 1 ms 28.4 47.4 4.0 0.4 130.1
Visual, GLB 2.9 9.4 38.3 0.6 ms 65.9 1.0 7.0 0.4 124.8
Visual, OBJ 2.7 8.8 38.5 0.6 ms 65.2 30.0 6.6 0.4 152.1
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-X5_IM19_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-X5-Tilt / hardware / production
Complexity 426 / 1000 (size 306, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 210, 3,174, 1,254
Triangles, simulation 7,998,602 in 95 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 282 MB 2.9 GB
STEP 1.3 GB 3.3 GB
STL 400 MB 2.7 GB
OBJ 877 MB 5.3 GB
Visual
GLB 179 MB 3.0 GB
OBJ 575 MB 3.8 GB

24.107 SparkFun_GNSS_Flex_Module_mosaic-X5_IM19

Stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.2 4.4 0.3 ms 4.5 0.2 0.6 0.2 11.6
Simulation, STEP 0.4 1.2 4.4 0.3 ms 4.5 3.1 0.6 0.3 14.6
Simulation, STL 0.4 1.1 4.3 0.4 ms 4.5 0.3 0.6 0.2 11.5
Simulation, OBJ 0.4 1.2 4.3 0.3 ms 4.5 7.1 0.6 0.2 18.3
Visual, GLB 0.5 1.2 4.4 0.3 ms 9.1 0.1 0.8 0.3 16.4
Visual, OBJ 0.5 1.2 4.4 0.3 ms 8.8 4.4 0.9 0.2 20.4
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-X5_IM19.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-X5-Tilt / hardware
Complexity 360 / 1000 (size 240, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 35, 529, 209
Triangles, simulation 1,331,060 in 95 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 47 MB 633 MB
STEP 209 MB 683 MB
STL 67 MB 647 MB
OBJ 140 MB 965 MB
Visual
GLB 30 MB 635 MB
OBJ 90 MB 704 MB

24.108 SparkFun_GNSS_Flex_Module_mosaic-X5_panelized

Stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 79 s. Simulation, STEP takes 96 s. Simulation, STL takes 79 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.3 8.0 36.4 0.5 ms 27.0 1.3 3.4 0.3 78.8
Simulation, STEP 2.4 8.3 36.7 0.5 ms 27.2 18.1 3.3 0.4 96.4
Simulation, STL 2.3 8.1 35.8 1.0 ms 26.4 2.6 3.2 0.4 78.7
Simulation, OBJ 2.3 8.1 36.0 0.5 ms 26.6 46.2 3.5 0.4 123.2
Visual, GLB 2.4 8.3 36.5 0.5 ms 60.6 0.8 7.1 0.4 116.1
Visual, OBJ 2.3 8.3 36.2 0.5 ms 59.8 27.2 6.1 0.3 140.2
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-X5_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-X5 / hardware / production
Complexity 423 / 1000 (size 303, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 168, 3,144, 1,272
Triangles, simulation 7,837,644 in 80 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 276 MB 2.6 GB
STEP 1.2 GB 3.3 GB
STL 392 MB 2.5 GB
OBJ 858 MB 5.2 GB
Visual
GLB 173 MB 2.9 GB
OBJ 558 MB 3.6 GB

24.109 SparkFun_GNSS_Flex_Module_mosaic-X5

Stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 13 s. Simulation, OBJ takes 21 s. Visual, GLB takes 19 s. Visual, OBJ takes 24 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.3 5.4 0.3 ms 5.1 0.2 0.7 0.2 13.4
Simulation, STEP 0.5 1.3 5.4 0.4 ms 4.8 3.5 0.6 0.2 16.4
Simulation, STL 0.5 1.3 5.3 0.6 ms 5.1 0.3 0.7 0.3 13.4
Simulation, OBJ 0.5 1.3 5.3 0.3 ms 5.1 7.8 0.7 0.2 20.8
Visual, GLB 0.5 1.3 5.4 0.3 ms 10.5 0.1 1.0 0.3 19.1
Visual, OBJ 0.5 1.3 5.3 0.3 ms 10.4 5.0 1.3 0.2 24.1
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_mosaic-X5.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_mosaic-X5 / hardware
Complexity 357 / 1000 (size 237, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 28, 524, 212
Triangles, simulation 1,304,334 in 80 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 621 MB
STEP 199 MB 660 MB
STL 65 MB 708 MB
OBJ 137 MB 907 MB
Visual
GLB 29 MB 718 MB
OBJ 88 MB 719 MB

24.110 SparkFun_GNSS_Flex_Module_ZED-X20P_Tilt_panelized

Stages 4 and 6 take 46% to 82% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.7 12.9 41.2 0.7 ms 41.8 2.0 4.6 0.5 106.6
Simulation, STEP 3.8 13.2 41.3 2 ms 42.8 30.3 5.1 0.5 137.1
Simulation, STL 3.6 13.3 44.0 1 ms 46.8 4.7 5.3 0.5 118.1
Simulation, OBJ 3.7 13.3 42.8 0.8 ms 41.9 78.2 5.0 0.5 185.4
Visual, GLB 3.8 13.1 42.7 2 ms 103.8 1.4 14.2 0.5 179.5
Visual, OBJ 4.1 13.8 43.9 2 ms 104.3 49.9 14.1 0.5 230.6
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_ZED-X20P_Tilt_panelized.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_ZED-X20P-Tilt / hardware / production
Complexity 370 / 1000 (size 250, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 345, 5,220, 2,010
Triangles, simulation 11,566,264 in 86 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 410 MB 3.5 GB
STEP 1.8 GB 4.4 GB
STL 578 MB 3.3 GB
OBJ 1.3 GB 7.6 GB
Visual
GLB 284 MB 4.3 GB
OBJ 908 MB 5.7 GB

24.111 SparkFun_GNSS_Flex_Module_ZED-X20P_Tilt

Stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 6.9 s. Simulation, STEP takes 8.4 s. Simulation, STL takes 6.8 s. Simulation, OBJ takes 11 s. Visual, GLB takes 9.8 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 2.4 0.5 ms 2.8 0.1 0.4 0.2 6.9
Simulation, STEP 0.3 0.7 2.3 0.4 ms 2.5 2.0 0.4 0.2 8.4
Simulation, STL 0.3 0.7 2.3 0.4 ms 2.6 0.3 0.4 0.2 6.8
Simulation, OBJ 0.3 0.8 2.3 0.4 ms 2.7 3.9 0.4 0.2 10.5
Visual, GLB 0.3 0.8 2.3 0.5 ms 5.5 79 ms 0.6 0.2 9.8
Visual, OBJ 0.4 0.7 2.3 0.4 ms 5.7 2.8 0.6 0.2 12.7
Board Repo: sparkfun/sparkfun_gnss_flex_system
Board: SparkFun_GNSS_Flex_Module_ZED-X20P_Tilt.kicad_pcb
Folder flex_boards / SparkPNT_GNSS_Flex_Module_ZED-X20P-Tilt / hardware
Complexity 296 / 1000 (size 176, features 120)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, knockout text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 23, 348, 134
Triangles, simulation 770,344 in 86 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 421 MB
STEP 115 MB 478 MB
STL 39 MB 445 MB
OBJ 80 MB 582 MB
Visual
GLB 19 MB 482 MB
OBJ 57 MB 481 MB
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