Skip to content

Corpus Testing 16

github-actions[bot] edited this page Nov 11, 2026 · 3 revisions

Corpus Page 16

Part 16 of 30 of Corpus Testing: boards 1,621 to 1,728, six runs each, one file format a run, as Corpus Testing describes.

1621. AVIONICS_BOARD

AVIONICS_BOARD: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 40 s. Simulation, STL takes 33 s. Simulation, OBJ takes 48 s. Visual, GLB takes 47 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.4 12.4 2 ms 13.4 0.5 1.6 0.3 32.5
Simulation, STEP 0.7 3.3 12.9 2 ms 12.7 8.6 1.6 0.3 40.0
Simulation, STL 0.8 3.0 12.4 2 ms 13.4 1.2 1.7 0.3 32.8
Simulation, OBJ 0.8 3.4 12.4 2 ms 13.1 15.9 1.7 0.3 47.6
Visual, GLB 0.9 3.3 12.0 2 ms 26.4 0.3 3.3 0.3 46.6
Visual, OBJ 0.9 3.1 12.8 2 ms 26.9 10.1 3.3 0.3 57.4
Board Repo: matthiasgeorgimhof/hardware_csat
Board: AVIONICS_BOARD.kicad_pcb
Folder avionics_board
Complexity 367 / 1000 (size 262, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 182, 2,001, 367
Triangles, simulation 3,369,990 in 275 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 113 MB 1.1 GB
STEP 435 MB 1.4 GB
STL 169 MB 1.1 GB
OBJ 355 MB 2.2 GB
Visual
GLB 69 MB 1.3 GB
OBJ 217 MB 1.4 GB

1622. comm_board

comm_board: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 33 s. Simulation, STL takes 27 s. Simulation, OBJ takes 41 s. Visual, GLB takes 37 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.6 9.9 1 ms 11.1 0.5 1.1 0.3 26.3
Simulation, STEP 0.8 2.4 9.6 0.9 ms 11.8 7.2 1.2 0.3 33.3
Simulation, STL 0.9 2.4 9.7 1 ms 11.5 0.8 1.5 0.4 27.2
Simulation, OBJ 1.0 2.6 10.1 1 ms 11.8 14.0 1.2 0.4 41.0
Visual, GLB 0.8 2.7 9.9 1 ms 21.0 0.2 2.1 0.3 37.1
Visual, OBJ 0.8 2.4 9.6 1 ms 20.1 8.8 2.2 0.3 44.1
Board Repo: matthiasgeorgimhof/hardware_csat
Board: comm_board.kicad_pcb
Folder comm_board
Complexity 365 / 1000 (size 260, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 178, 1,254, 204
Triangles, simulation 2,325,158 in 222 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 811 MB
STEP 326 MB 973 MB
STL 116 MB 822 MB
OBJ 243 MB 1.5 GB
Visual
GLB 51 MB 1.1 GB
OBJ 158 MB 1.1 GB

1623. EPS

EPS: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 59 s. Simulation, STL takes 48 s. Simulation, OBJ takes 74 s. Visual, GLB takes 67 s. Visual, OBJ takes 80 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.0 20.0 1 ms 18.4 0.7 2.6 0.3 47.1
Simulation, STEP 1.1 3.9 19.9 1 ms 18.7 12.2 2.6 0.4 58.7
Simulation, STL 1.0 3.8 19.9 0.9 ms 18.6 1.7 2.6 0.3 47.9
Simulation, OBJ 1.1 3.9 20.2 1.0 ms 18.7 26.9 2.7 0.3 73.7
Visual, GLB 1.0 3.9 20.5 2 ms 36.2 0.5 4.2 0.3 66.6
Visual, OBJ 1.2 4.0 20.2 1.0 ms 35.8 14.3 3.9 0.4 79.7
Board Repo: matthiasgeorgimhof/hardware_csat
Board: EPS.kicad_pcb
Folder eps_board
Complexity 372 / 1000 (size 267, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 242, 2,354, 416
Triangles, simulation 4,561,054 in 261 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 153 MB 1.4 GB
STEP 630 MB 1.6 GB
STL 228 MB 1.3 GB
OBJ 484 MB 2.9 GB
Visual
GLB 82 MB 1.5 GB
OBJ 259 MB 1.7 GB

1624. sci_board

sci_board: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 46 s. Simulation, STL takes 37 s. Simulation, OBJ takes 60 s. Visual, GLB takes 67 s. Visual, OBJ takes 77 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.2 14.0 2 ms 15.5 0.5 1.7 0.3 37.3
Simulation, STEP 1.0 4.2 13.8 0.7 ms 15.2 9.3 1.8 0.3 45.6
Simulation, STL 1.1 4.2 13.8 0.9 ms 15.2 1.1 1.6 0.3 37.2
Simulation, OBJ 1.1 4.1 14.4 1 ms 14.9 22.8 2.8 0.3 60.4
Visual, GLB 1.4 5.8 18.9 2 ms 36.3 0.4 3.5 0.4 66.8
Visual, OBJ 1.1 4.6 14.9 0.8 ms 37.7 13.5 5.3 0.3 77.4
Board Repo: matthiasgeorgimhof/hardware_csat
Board: sci_board.kicad_pcb
Folder sci_board.inactive
Complexity 397 / 1000 (size 267, features 130)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 210, 2,498, 466
Triangles, simulation 3,299,186 in 282 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 111 MB 1.1 GB
STEP 450 MB 1.4 GB
STL 165 MB 1.1 GB
OBJ 348 MB 2.2 GB
Visual
GLB 75 MB 1.5 GB
OBJ 237 MB 1.6 GB

1625. sci_board_wo_switches

sci_board_wo_switches: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 33 s. Simulation, STL takes 27 s. Simulation, OBJ takes 40 s. Visual, GLB takes 38 s. Visual, OBJ takes 49 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.7 10.0 0.6 ms 11.0 0.4 1.3 0.2 26.5
Simulation, STEP 0.8 2.9 10.3 1 ms 10.5 6.7 1.3 0.2 32.7
Simulation, STL 0.8 2.8 10.4 0.6 ms 10.8 0.9 1.4 0.2 27.3
Simulation, OBJ 0.8 2.8 10.1 0.7 ms 10.6 14.4 1.3 0.3 40.1
Visual, GLB 0.7 3.0 10.5 0.7 ms 21.2 0.3 2.4 0.3 38.3
Visual, OBJ 0.8 3.0 10.2 1 ms 22.0 9.6 2.7 0.2 48.5
Board Repo: matthiasgeorgimhof/hardware_csat
Board: sci_board_wo_switches.kicad_pcb
Folder sci_board_wo_switches
Complexity 391 / 1000 (size 261, features 130)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 181, 1,838, 364
Triangles, simulation 2,773,664 in 240 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 93 MB 918 MB
STEP 370 MB 1.1 GB
STL 139 MB 927 MB
OBJ 291 MB 1.8 GB
Visual
GLB 62 MB 1.1 GB
OBJ 194 MB 1.3 GB

1626. bodge

bodge: stages 4 and 6 take 42% to 76% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.8 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 4.2 s. Visual, GLB takes 4.4 s. Visual, OBJ takes 5.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.8 0.3 ms 1.1 50 ms 0.2 0.2 2.8
Simulation, STEP 0.1 0.3 0.7 0.2 ms 1.1 1.2 0.2 0.2 3.8
Simulation, STL 0.1 0.3 0.7 0.2 ms 1.1 85 ms 0.2 0.2 2.8
Simulation, OBJ 0.1 0.3 0.7 0.2 ms 1.1 1.6 0.2 0.2 4.2
Visual, GLB 0.2 0.3 0.7 0.2 ms 2.6 34 ms 0.2 0.3 4.4
Visual, OBJ 0.1 0.3 0.7 0.2 ms 2.5 1.1 0.3 0.2 5.3
Board Repo: matthiasgeorgimhof/hardware_csat
Board: bodge.kicad_pcb
Folder sci_extra / bodge
Complexity 234 / 1000 (size 159, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 9, 315, 48
Triangles, simulation 273,140 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.6 MB 239 MB
STEP 38 MB 247 MB
STL 14 MB 236 MB
OBJ 27 MB 235 MB
Visual
GLB 6.4 MB 246 MB
OBJ 19 MB 242 MB

1627. bodge_oshkosh

bodge_oshkosh: stages 4 and 6 take 42% to 78% of a run. Simulation, GLB takes 2.6 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 4.0 s. Visual, GLB takes 3.9 s. Visual, OBJ takes 4.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.7 0.2 ms 1.1 53 ms 0.2 0.2 2.6
Simulation, STEP 0.1 0.3 0.6 0.2 ms 1.0 1.2 0.2 0.2 3.6
Simulation, STL 0.1 0.3 0.7 0.2 ms 1.0 75 ms 0.2 0.2 2.6
Simulation, OBJ 0.1 0.3 0.7 0.2 ms 1.0 1.5 0.2 0.2 4.0
Visual, GLB 0.1 0.3 0.6 0.2 ms 2.4 30 ms 0.2 0.2 3.9
Visual, OBJ 0.1 0.3 0.7 0.2 ms 2.4 1.0 0.2 0.2 4.9
Board Repo: matthiasgeorgimhof/hardware_csat
Board: bodge_oshkosh.kicad_pcb
Folder sci_extra / bodge_oshkosh
Complexity 234 / 1000 (size 159, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 9, 316, 48
Triangles, simulation 273,466 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.6 MB 241 MB
STEP 38 MB 247 MB
STL 14 MB 247 MB
OBJ 27 MB 239 MB
Visual
GLB 6.4 MB 221 MB
OBJ 19 MB 243 MB

1628. antenna_switch

antenna_switch: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 21 s. Simulation, STL takes 18 s. Simulation, OBJ takes 27 s. Visual, GLB takes 26 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 2.0 7.3 0.2 ms 7.5 0.3 0.6 0.2 18.2
Simulation, STEP 0.2 2.1 7.5 0.2 ms 7.6 3.0 0.6 0.2 21.1
Simulation, STL 0.2 2.0 7.3 0.2 ms 7.4 0.7 0.6 0.2 18.4
Simulation, OBJ 0.2 2.1 7.3 0.1 ms 7.4 9.1 0.6 0.2 27.0
Visual, GLB 0.2 2.0 7.4 0.4 ms 15.2 0.1 1.1 0.2 26.4
Visual, OBJ 0.2 1.9 7.1 0.3 ms 15.8 4.6 1.2 0.2 31.2
Board Repo: matthuszagh/fmcw
Board: antenna_switch.kicad_pcb
Folder hardware / antenna-switch
Complexity 238 / 1000 (size 193, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20190905)
Parts, tracks, vias 32, 143, 525
Triangles, simulation 1,784,972 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 786 MB
STEP 138 MB 845 MB
STL 89 MB 750 MB
OBJ 185 MB 1.2 GB
Visual
GLB 29 MB 719 MB
OBJ 91 MB 777 MB

1629. fmcw

fmcw: stages 4 and 6 take 61% to 86% of a run. Simulation, GLB takes 87 s. Simulation, STEP takes 2 min. Simulation, STL takes 88 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 8.1 42.8 1 ms 30.0 1.1 3.2 0.3 86.9
Simulation, STEP 1.3 7.1 42.3 1 ms 30.3 17.1 3.5 0.3 101.9
Simulation, STL 1.3 7.6 43.2 1 ms 30.1 2.3 3.3 0.4 88.2
Simulation, OBJ 1.3 7.5 43.3 1 ms 29.1 33.9 3.4 0.3 118.9
Visual, GLB 1.3 7.3 41.5 2 ms 61.8 0.7 7.2 0.3 120.2
Visual, OBJ 1.4 7.2 41.7 1 ms 62.7 21.5 7.4 0.3 142.3
Board Repo: matthuszagh/fmcw
Board: fmcw.kicad_pcb
Folder hardware / boards / rev1
Complexity 387 / 1000 (size 307, features 80)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 406, 3,575, 947
Triangles, simulation 6,589,000 in 448 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 229 MB 1.9 GB
STEP 1.0 GB 2.5 GB
STL 329 MB 1.9 GB
OBJ 729 MB 4.3 GB
Visual
GLB 143 MB 2.3 GB
OBJ 461 MB 3.0 GB

1630. fmcw

fmcw: stages 4 and 6 take 62% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 8.9 34.7 1.0 ms 56.5 1.1 3.6 0.4 106.8
Simulation, STEP 1.6 9.7 36.3 1 ms 58.7 18.6 3.7 0.4 129.1
Simulation, STL 1.7 9.2 34.7 1.0 ms 58.1 2.6 3.7 0.4 110.4
Simulation, OBJ 1.4 9.3 35.5 1 ms 58.4 43.8 3.6 0.4 152.3
Visual, GLB 1.5 9.0 34.5 1 ms 72.3 0.7 6.9 0.3 125.3
Visual, OBJ 1.6 9.4 35.9 1 ms 80.2 28.7 7.7 0.4 163.9
Board Repo: matthuszagh/fmcw
Board: fmcw.kicad_pcb
Folder hardware / boards / rev2a
Complexity 400 / 1000 (size 310, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 436, 3,927, 835
Triangles, simulation 6,594,472 in 280 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 228 MB 1.7 GB
STEP 1.0 GB 2.4 GB
STL 330 MB 1.7 GB
OBJ 726 MB 4.3 GB
Visual
GLB 138 MB 2.3 GB
OBJ 447 MB 2.8 GB

1631. fmcw

fmcw: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 90 s. Simulation, STEP takes 2 min. Simulation, STL takes 91 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 11.3 36.8 2 ms 33.9 1.6 4.4 0.4 89.9
Simulation, STEP 1.4 11.8 36.6 1 ms 33.5 18.4 4.5 0.4 106.7
Simulation, STL 1.3 11.3 36.4 2 ms 33.6 3.6 4.7 0.4 91.4
Simulation, OBJ 1.3 10.9 36.2 1 ms 33.4 44.1 4.5 0.4 130.9
Visual, GLB 1.3 10.8 35.2 1 ms 87.6 0.8 9.3 0.4 145.4
Visual, OBJ 1.6 11.1 35.5 1 ms 84.8 26.5 9.4 0.3 169.4
Board Repo: matthuszagh/fmcw
Board: fmcw.kicad_pcb
Folder hardware / boards / rev2b
Complexity 406 / 1000 (size 316, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 436, 4,693, 1,437
Triangles, simulation 7,841,176 in 279 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 269 MB 2.8 GB
STEP 1.1 GB 2.9 GB
STL 392 MB 2.6 GB
OBJ 860 MB 5.0 GB
Visual
GLB 170 MB 2.7 GB
OBJ 554 MB 3.5 GB

1632. fmcw_nightly

fmcw_nightly: stages 4 and 6 take 48% to 73% of a run. Simulation, GLB takes 54 s. Simulation, STEP takes 64 s. Simulation, STL takes 55 s. Simulation, OBJ takes 77 s. Visual, GLB takes 73 s. Visual, OBJ takes 85 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 13.7 20.6 1 ms 16.3 0.7 1.6 0.3 54.5
Simulation, STEP 1.3 14.0 21.1 1 ms 16.0 10.0 1.5 0.3 64.1
Simulation, STL 1.2 13.6 20.8 1 ms 16.2 1.3 1.6 0.3 55.0
Simulation, OBJ 1.2 13.5 20.7 1 ms 16.5 23.2 1.5 0.3 76.8
Visual, GLB 1.1 14.2 21.3 2 ms 32.2 0.4 3.5 0.3 73.0
Visual, OBJ 1.4 13.8 20.9 1 ms 32.4 13.1 3.2 0.3 85.1
Board Repo: matthuszagh/fmcw
Board: fmcw_nightly.kicad_pcb
Folder hardware / boards / rev2b
Complexity 435 / 1000 (size 295, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20200119)
Parts, tracks, vias 437, 1,170, 439
Triangles, simulation 3,680,954 in 245 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 126 MB 1.3 GB
STEP 586 MB 1.5 GB
STL 184 MB 1.2 GB
OBJ 395 MB 2.4 GB
Visual
GLB 74 MB 1.3 GB
OBJ 235 MB 1.6 GB

1633. caps

caps: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 23 s. Visual, GLB takes 15 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 2.0 4.9 0.5 ms 6.9 0.3 0.6 0.3 15.1
Simulation, STEP 0.2 1.9 5.0 0.6 ms 7.5 2.7 0.5 0.3 18.1
Simulation, STL 0.2 1.8 4.8 0.4 ms 6.6 0.4 0.5 0.3 14.7
Simulation, OBJ 0.2 1.8 5.0 0.2 ms 6.8 8.6 0.6 0.2 23.2
Visual, GLB 0.2 1.8 5.2 0.2 ms 6.9 99 ms 0.7 0.2 15.1
Visual, OBJ 0.2 1.8 5.0 0.3 ms 6.2 3.5 0.8 0.2 17.9
Board Repo: matthuszagh/fmcw
Board: caps.kicad_pcb
Folder hardware / prototypes / caps
Complexity 225 / 1000 (size 180, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 11, 10, 492
Triangles, simulation 1,512,272 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 646 MB
STEP 113 MB 753 MB
STL 76 MB 682 MB
OBJ 154 MB 992 MB
Visual
GLB 21 MB 615 MB
OBJ 65 MB 663 MB

1634. caps_nightly

caps_nightly: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 20 s. Simulation, STL takes 17 s. Simulation, OBJ takes 25 s. Visual, GLB takes 17 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 2.0 5.7 0.5 ms 7.9 0.2 0.6 0.2 16.8
Simulation, STEP 0.2 1.9 6.2 0.3 ms 7.8 2.7 0.6 0.2 19.6
Simulation, STL 0.2 1.9 5.8 0.3 ms 7.7 0.5 0.6 0.2 16.8
Simulation, OBJ 0.2 1.9 5.9 0.5 ms 7.9 8.3 0.6 0.3 25.0
Visual, GLB 0.2 2.0 5.9 0.4 ms 8.0 0.1 1.0 0.2 17.4
Visual, OBJ 0.2 2.0 5.9 0.3 ms 7.6 3.7 1.0 0.3 20.7
Board Repo: matthuszagh/fmcw
Board: caps_nightly.kicad_pcb
Folder hardware / prototypes / caps
Complexity 264 / 1000 (size 184, features 80)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20200119)
Parts, tracks, vias 11, 11, 636
Triangles, simulation 1,737,368 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 55 MB 783 MB
STEP 118 MB 861 MB
STL 87 MB 770 MB
OBJ 176 MB 1.1 GB
Visual
GLB 25 MB 706 MB
OBJ 77 MB 738 MB

1635. coupler

coupler: stages 4 and 6 take 50% to 76% of a run. Simulation, GLB takes 5.9 s. Simulation, STEP takes 7.3 s. Simulation, STL takes 6.1 s. Simulation, OBJ takes 9.2 s. Visual, GLB takes 5.7 s. Visual, OBJ takes 7.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.7 1.8 0.1 ms 2.7 0.1 0.3 0.2 5.9
Simulation, STEP 0.1 0.8 1.8 0.1 ms 2.7 1.3 0.3 0.2 7.3
Simulation, STL 0.1 0.8 1.7 0.1 ms 2.8 0.1 0.3 0.2 6.1
Simulation, OBJ 0.1 0.7 1.8 0.1 ms 2.8 3.3 0.3 0.2 9.2
Visual, GLB 0.1 0.7 1.8 0.2 ms 2.6 42 ms 0.3 0.2 5.7
Visual, OBJ 0.1 0.7 1.9 0.3 ms 2.8 1.6 0.3 0.2 7.6
Board Repo: matthuszagh/fmcw
Board: coupler.kicad_pcb
Folder hardware / prototypes / coupler
Complexity 199 / 1000 (size 164, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 5, 72, 278
Triangles, simulation 647,556 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 396 MB
STEP 38 MB 446 MB
STL 32 MB 404 MB
OBJ 65 MB 435 MB
Visual
GLB 10 MB 377 MB
OBJ 31 MB 373 MB

1636. coupler_nightly

coupler_nightly: stages 4 and 6 take 52% to 77% of a run. Simulation, GLB takes 5.5 s. Simulation, STEP takes 6.7 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 7.8 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 6.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.6 1.7 0.2 ms 2.5 81 ms 0.3 0.2 5.5
Simulation, STEP 0.1 0.7 1.7 0.1 ms 2.6 1.1 0.2 0.2 6.7
Simulation, STL 0.1 0.7 1.7 0.1 ms 2.5 0.1 0.3 0.2 5.7
Simulation, OBJ 0.1 0.7 1.6 0.1 ms 2.5 2.5 0.2 0.2 7.8
Visual, GLB 0.1 0.6 1.6 0.1 ms 2.8 42 ms 0.3 0.2 5.8
Visual, OBJ 0.1 0.7 1.7 0.2 ms 2.6 1.2 0.3 0.2 6.8
Board Repo: matthuszagh/fmcw
Board: coupler_nightly.kicad_pcb
Folder hardware / prototypes / coupler
Complexity 237 / 1000 (size 167, features 70)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20200119)
Parts, tracks, vias 5, 137, 305
Triangles, simulation 659,588 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 412 MB
STEP 30 MB 458 MB
STL 33 MB 407 MB
OBJ 65 MB 434 MB
Visual
GLB 11 MB 357 MB
OBJ 32 MB 382 MB

1637. microstrip_width

microstrip_width: stages 4 and 6 take 54% to 78% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.5 s. Simulation, OBJ takes 14 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 1.2 2.8 0.3 ms 4.4 0.2 0.4 0.2 9.3
Simulation, STEP 0.1 1.2 2.9 0.1 ms 4.6 1.7 0.4 0.2 11.0
Simulation, STL 0.1 1.2 2.8 0.1 ms 4.6 0.2 0.4 0.3 9.5
Simulation, OBJ 0.1 1.2 2.8 0.1 ms 4.6 4.4 0.4 0.3 13.8
Visual, GLB 0.1 1.1 2.8 0.1 ms 4.4 63 ms 0.5 0.2 9.2
Visual, OBJ 0.1 1.1 2.6 0.2 ms 4.1 2.0 0.6 0.2 10.8
Board Repo: matthuszagh/fmcw
Board: microstrip_width.kicad_pcb
Folder hardware / prototypes / microstrip_width
Complexity 207 / 1000 (size 172, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 3, 421
Triangles, simulation 947,684 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 519 MB
STEP 49 MB 571 MB
STL 47 MB 510 MB
OBJ 95 MB 675 MB
Visual
GLB 15 MB 428 MB
OBJ 45 MB 424 MB

1638. microstrip_width_nightly

microstrip_width_nightly: stages 4 and 6 take 54% to 79% of a run. Simulation, GLB takes 6.6 s. Simulation, STEP takes 7.7 s. Simulation, STL takes 6.6 s. Simulation, OBJ takes 8.8 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 93 ms 0.7 2.0 0.4 ms 3.3 94 ms 0.3 0.2 6.6
Simulation, STEP 0.1 0.7 2.0 0.3 ms 3.0 1.3 0.3 0.2 7.7
Simulation, STL 96 ms 0.7 2.1 0.3 ms 3.1 0.2 0.2 0.2 6.6
Simulation, OBJ 95 ms 0.7 2.0 0.2 ms 2.8 2.8 0.3 0.2 8.8
Visual, GLB 98 ms 0.7 2.1 0.3 ms 2.9 40 ms 0.4 0.2 6.3
Visual, OBJ 92 ms 0.7 2.0 0.3 ms 2.9 1.5 0.4 0.2 7.8
Board Repo: matthuszagh/fmcw
Board: microstrip_width_nightly.kicad_pcb
Folder hardware / prototypes / microstrip_width
Complexity 238 / 1000 (size 168, features 70)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20200119)
Parts, tracks, vias 6, 3, 335
Triangles, simulation 749,524 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 446 MB
STEP 30 MB 478 MB
STL 37 MB 448 MB
OBJ 74 MB 482 MB
Visual
GLB 12 MB 372 MB
OBJ 35 MB 401 MB

1639. basic-ecp5-pcb

basic-ecp5-pcb: stages 4 and 6 take 57% to 86% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 32 s. Simulation, STL takes 27 s. Simulation, OBJ takes 40 s. Visual, GLB takes 35 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.5 12.8 2 ms 8.7 0.4 1.0 0.3 26.2
Simulation, STEP 0.4 2.6 12.9 1 ms 8.8 5.9 1.1 0.2 32.0
Simulation, STL 0.4 2.7 12.9 2 ms 8.8 0.8 1.1 0.3 27.0
Simulation, OBJ 0.4 2.7 13.5 2 ms 9.1 12.7 1.1 0.3 39.7
Visual, GLB 0.4 2.6 13.5 1 ms 16.7 0.2 1.6 0.2 35.2
Visual, OBJ 0.4 2.7 13.4 1 ms 17.0 6.3 1.8 0.3 42.0
Board Repo: mattvenn/basic-ecp5-pcb
Board: basic-ecp5-pcb.kicad_pcb
Folder hardware
Complexity 305 / 1000 (size 250, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 62, 1,148, 130
Triangles, simulation 2,343,666 in 255 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 81 MB 707 MB
STEP 348 MB 928 MB
STL 117 MB 708 MB
OBJ 248 MB 1.6 GB
Visual
GLB 42 MB 927 MB
OBJ 126 MB 925 MB

1640. ai-camera

ai-camera: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 21 s. Simulation, STL takes 17 s. Simulation, OBJ takes 27 s. Visual, GLB takes 29 s. Visual, OBJ takes 36 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.1 6.4 0.7 ms 6.4 0.3 0.9 0.3 17.0
Simulation, STEP 0.6 2.1 5.8 0.8 ms 6.5 4.6 0.9 0.3 20.8
Simulation, STL 0.6 2.1 6.1 0.7 ms 6.4 0.6 0.8 0.2 16.9
Simulation, OBJ 0.5 2.0 6.1 1 ms 6.7 10.2 0.9 0.2 26.7
Visual, GLB 0.6 2.1 6.2 0.9 ms 17.5 0.2 1.9 0.3 28.9
Visual, OBJ 0.5 2.2 6.3 0.9 ms 17.4 7.6 2.1 0.2 36.2
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera.kicad_pcb
Folder ai-camera-rev0
Complexity 339 / 1000 (size 214, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 130, 1,351, 340
Triangles, simulation 2,141,088 in 108 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 876 MB
STEP 293 MB 965 MB
STL 107 MB 812 MB
OBJ 223 MB 1.4 GB
Visual
GLB 51 MB 1.1 GB
OBJ 158 MB 1.2 GB

1641. ai-camera

ai-camera: stages 4 and 6 take 46% to 83% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 20 s. Simulation, OBJ takes 32 s. Visual, GLB takes 32 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.3 7.5 0.6 ms 7.6 0.4 1.0 0.2 19.6
Simulation, STEP 0.6 2.3 7.4 0.6 ms 7.7 6.1 1.1 0.3 25.4
Simulation, STL 0.7 2.4 7.5 0.4 ms 7.6 0.6 1.0 0.3 20.0
Simulation, OBJ 0.7 2.2 7.4 0.7 ms 7.4 12.9 1.0 0.3 31.9
Visual, GLB 0.6 2.2 7.2 0.6 ms 19.1 0.3 2.0 0.2 31.7
Visual, OBJ 0.7 2.2 7.2 0.4 ms 19.2 9.6 2.2 0.3 41.3
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera.kicad_pcb
Folder ai-camera-rev1
Complexity 339 / 1000 (size 214, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 151, 1,227, 305
Triangles, simulation 2,114,240 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 818 MB
STEP 308 MB 943 MB
STL 106 MB 851 MB
OBJ 221 MB 1.4 GB
Visual
GLB 52 MB 958 MB
OBJ 160 MB 1.1 GB

1642. ai-camera-rev2

ai-camera-rev2: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 28 s. Visual, GLB takes 29 s. Visual, OBJ takes 37 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.0 6.6 1 ms 7.0 0.3 1.0 0.2 17.8
Simulation, STEP 0.6 2.2 6.2 0.3 ms 7.0 5.2 0.9 0.2 22.3
Simulation, STL 0.6 2.0 6.5 1.0 ms 6.8 0.5 0.9 0.2 17.4
Simulation, OBJ 0.6 1.9 6.5 0.5 ms 6.8 11.4 1.0 0.2 28.4
Visual, GLB 0.6 2.0 6.3 0.6 ms 17.2 0.2 2.2 0.2 28.6
Visual, OBJ 0.6 2.0 6.5 0.3 ms 17.0 8.2 2.4 0.2 36.9
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera-rev2.kicad_pcb
Folder ai-camera-rev2
Complexity 314 / 1000 (size 214, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 153, 1,208, 330
Triangles, simulation 2,131,926 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 874 MB
STEP 309 MB 989 MB
STL 107 MB 793 MB
OBJ 222 MB 1.4 GB
Visual
GLB 52 MB 1.0 GB
OBJ 159 MB 1.1 GB

1643. ai-camera-rev3.1

ai-camera-rev3.1: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 24 s. Simulation, STL takes 19 s. Simulation, OBJ takes 31 s. Visual, GLB takes 32 s. Visual, OBJ takes 42 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.2 7.5 0.6 ms 7.4 0.3 1.1 0.3 19.4
Simulation, STEP 0.6 2.2 7.2 0.4 ms 7.4 5.3 0.9 0.3 23.9
Simulation, STL 0.6 2.2 7.0 0.7 ms 7.5 0.7 1.0 0.3 19.3
Simulation, OBJ 0.7 2.1 7.5 0.4 ms 7.5 12.2 1.0 0.3 31.3
Visual, GLB 0.6 2.3 7.6 0.7 ms 18.6 0.3 2.2 0.2 31.7
Visual, OBJ 0.6 2.4 7.8 0.4 ms 18.9 9.4 2.5 0.2 41.7
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera-rev3.1.kicad_pcb
Folder ai-camera-rev3.1
Complexity 314 / 1000 (size 214, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 153, 1,223, 330
Triangles, simulation 2,082,322 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 809 MB
STEP 291 MB 929 MB
STL 104 MB 822 MB
OBJ 217 MB 1.4 GB
Visual
GLB 51 MB 933 MB
OBJ 156 MB 1.1 GB

1644. ai-camera-rev3.2

ai-camera-rev3.2: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 28 s. Visual, GLB takes 27 s. Visual, OBJ takes 35 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.1 6.5 0.4 ms 6.8 0.3 0.9 0.2 17.5
Simulation, STEP 0.6 2.0 6.3 0.3 ms 6.8 4.8 0.9 0.2 21.6
Simulation, STL 0.6 2.0 6.3 0.3 ms 6.9 0.5 0.9 0.3 17.5
Simulation, OBJ 0.6 2.1 6.6 0.7 ms 6.9 10.6 0.9 0.3 28.2
Visual, GLB 0.6 2.1 6.3 0.6 ms 16.2 0.2 1.5 0.2 27.2
Visual, OBJ 0.6 2.0 6.4 0.5 ms 16.1 7.8 1.5 0.2 34.6
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera-rev3.2.kicad_pcb
Folder ai-camera-rev3.2
Complexity 315 / 1000 (size 215, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 153, 1,274, 330
Triangles, simulation 2,092,308 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 827 MB
STEP 294 MB 949 MB
STL 105 MB 874 MB
OBJ 218 MB 1.4 GB
Visual
GLB 51 MB 919 MB
OBJ 157 MB 1.1 GB

1645. ai-camera-rev3

ai-camera-rev3: stages 4 and 6 take 47% to 84% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 22 s. Simulation, STL takes 17 s. Simulation, OBJ takes 29 s. Visual, GLB takes 27 s. Visual, OBJ takes 35 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.0 6.1 0.7 ms 7.0 0.3 0.9 0.3 17.2
Simulation, STEP 0.6 2.0 6.2 2 ms 6.8 4.9 0.9 0.2 21.6
Simulation, STL 0.6 2.1 6.2 0.6 ms 6.7 0.5 0.9 0.3 17.3
Simulation, OBJ 0.5 2.1 6.8 0.7 ms 6.7 11.8 0.8 0.2 29.1
Visual, GLB 0.6 2.0 6.5 0.7 ms 16.5 0.2 1.5 0.2 27.5
Visual, OBJ 0.6 2.1 6.3 0.3 ms 15.9 7.9 1.6 0.2 34.5
Board Repo: maxlab-io/tokay-lite-pcb
Board: ai-camera-rev3.kicad_pcb
Folder ai-camera-rev3
Complexity 314 / 1000 (size 214, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 153, 1,215, 330
Triangles, simulation 2,090,940 in 113 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 807 MB
STEP 293 MB 903 MB
STL 105 MB 790 MB
OBJ 218 MB 1.4 GB
Visual
GLB 51 MB 1.1 GB
OBJ 156 MB 1.1 GB

1646. CM4_NAS

CM4_NAS: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 23 s. Visual, GLB takes 23 s. Visual, OBJ takes 28 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.4 6.0 1 ms 6.3 0.3 0.9 0.3 15.8
Simulation, STEP 0.5 1.5 5.8 1.0 ms 6.5 4.5 0.9 0.2 20.0
Simulation, STL 0.5 1.5 5.8 0.9 ms 6.3 0.5 0.9 0.2 15.8
Simulation, OBJ 0.5 1.6 5.8 0.9 ms 6.3 8.0 0.9 0.2 23.3
Visual, GLB 0.5 1.5 6.0 0.9 ms 12.9 0.2 1.5 0.2 22.8
Visual, OBJ 0.5 1.6 5.9 1 ms 12.9 4.9 1.6 0.2 27.5
Board Repo: mebs/CM4-NAS
Board: CM4_NAS.kicad_pcb
Complexity 297 / 1000 (size 197, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201002)
Parts, tracks, vias 32, 1,776, 141
Triangles, simulation 1,943,028 in 179 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 66 MB 675 MB
STEP 306 MB 880 MB
STL 97 MB 675 MB
OBJ 202 MB 1.3 GB
Visual
GLB 41 MB 866 MB
OBJ 125 MB 934 MB

1647. ecp5-dev-board

ecp5-dev-board: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 39 s. Simulation, STL takes 31 s. Simulation, OBJ takes 46 s. Visual, GLB takes 45 s. Visual, OBJ takes 55 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.3 13.7 1 ms 12.2 0.5 1.3 0.3 32.1
Simulation, STEP 0.5 3.2 13.8 0.9 ms 11.8 7.9 1.3 0.2 38.7
Simulation, STL 0.5 3.0 13.3 1 ms 11.9 0.8 1.2 0.3 31.0
Simulation, OBJ 0.5 2.8 13.9 1 ms 12.1 14.8 1.3 0.3 45.7
Visual, GLB 0.5 3.0 13.5 1 ms 24.5 0.3 3.0 0.3 45.0
Visual, OBJ 0.5 3.0 14.3 1 ms 25.0 8.6 2.9 0.3 54.6
Board Repo: medhyal/ecp5-dev-board
Board: ecp5-dev-board.kicad_pcb
Folder v0.1
Complexity 331 / 1000 (size 276, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 107, 3,371, 336
Triangles, simulation 2,965,762 in 283 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 102 MB 1.0 GB
STEP 457 MB 1.2 GB
STL 148 MB 1.1 GB
OBJ 314 MB 1.9 GB
Visual
GLB 60 MB 1.1 GB
OBJ 188 MB 1.3 GB

1648. mega65-kbd

mega65-kbd: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 54 s. Simulation, STEP takes 65 s. Simulation, STL takes 53 s. Simulation, OBJ takes 79 s. Visual, GLB takes 84 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.3 22.9 1 ms 20.1 0.9 2.6 0.4 53.6
Simulation, STEP 1.5 5.2 22.1 1 ms 18.7 14.5 2.5 0.4 64.9
Simulation, STL 1.4 5.2 22.5 1 ms 19.3 1.8 2.4 0.4 53.0
Simulation, OBJ 1.5 5.1 22.0 1 ms 19.8 28.0 2.5 0.3 79.3
Visual, GLB 1.4 5.4 22.1 1 ms 48.7 0.6 5.8 0.3 84.3
Visual, OBJ 1.4 5.1 21.1 1.0 ms 46.4 20.9 7.3 0.3 102.5
Board Repo: MEGA65/mega65-kbd-pcb
Board: mega65-kbd.kicad_pcb
Complexity 237 / 1000 (size 192, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 105, 1,364, 210
Triangles, simulation 4,669,240 in 287 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 157 MB 1.7 GB
STEP 680 MB 1.9 GB
STL 233 MB 1.7 GB
OBJ 493 MB 3.0 GB
Visual
GLB 112 MB 2.0 GB
OBJ 357 MB 2.3 GB

1649. expansion_connector_board

expansion_connector_board: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 16 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.8 0.4 ms 3.8 0.2 0.6 0.3 10.8
Simulation, STEP 0.3 0.9 4.8 0.6 ms 3.6 2.8 0.6 0.2 13.2
Simulation, STL 0.3 0.9 4.6 0.3 ms 3.6 0.3 0.6 0.3 10.5
Simulation, OBJ 0.3 0.8 4.6 0.6 ms 4.0 5.8 0.6 0.2 16.4
Visual, GLB 0.3 0.9 4.7 0.5 ms 8.7 0.1 0.9 0.2 15.7
Visual, OBJ 0.3 0.9 4.7 0.4 ms 8.7 4.0 1.0 0.2 19.8
Board Repo: MEGA65/mega65-r3-expansion-board
Board: expansion_connector_board.kicad_pcb
Folder expansion_connector_board
Complexity 284 / 1000 (size 159, features 125)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 18, 683, 47
Triangles, simulation 1,114,064 in 92 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 38 MB 511 MB
STEP 167 MB 568 MB
STL 56 MB 494 MB
OBJ 112 MB 768 MB
Visual
GLB 26 MB 622 MB
OBJ 77 MB 605 MB

1650. external_drive_board

external_drive_board: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 18 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 5.7 0.3 ms 4.2 0.2 0.6 0.2 12.2
Simulation, STEP 0.3 0.9 5.4 0.4 ms 4.2 3.2 0.6 0.2 14.7
Simulation, STL 0.2 0.9 5.5 0.3 ms 4.2 0.4 0.6 0.2 12.1
Simulation, OBJ 0.3 0.9 5.6 0.4 ms 4.4 5.9 0.6 0.2 17.8
Visual, GLB 0.2 1.0 5.8 0.3 ms 9.6 0.1 1.1 0.2 18.0
Visual, OBJ 0.2 1.0 5.7 0.4 ms 8.9 3.9 1.2 0.2 21.1
Board Repo: MEGA65/mega65-r3-expansion-board
Board: external_drive_board.kicad_pcb
Folder external_drive_board
Complexity 208 / 1000 (size 163, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 30, 578, 60
Triangles, simulation 1,447,024 in 69 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 49 MB 612 MB
STEP 221 MB 666 MB
STL 72 MB 678 MB
OBJ 148 MB 971 MB
Visual
GLB 33 MB 712 MB
OBJ 98 MB 773 MB

1651. jtag_base_board

jtag_base_board: stages 4 and 6 take 53% to 86% of a run. Simulation, GLB takes 9.0 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 14 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 4.4 0.5 ms 2.8 0.1 0.5 0.3 9.0
Simulation, STEP 0.2 0.7 4.3 0.8 ms 2.9 2.6 0.5 0.2 11.3
Simulation, STL 0.2 0.6 4.3 0.6 ms 3.1 0.2 0.5 0.2 9.2
Simulation, OBJ 0.2 0.7 4.4 0.6 ms 3.1 5.0 0.5 0.2 14.1
Visual, GLB 0.2 0.6 4.5 0.7 ms 6.4 91 ms 0.6 0.3 12.7
Visual, OBJ 0.2 0.6 4.3 0.5 ms 6.5 3.1 0.6 0.2 15.5
Board Repo: MEGA65/mega65-r3-expansion-board
Board: jtag_base_board.kicad_pcb
Folder jtag_base_board
Complexity 197 / 1000 (size 132, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 10, 229, 2
Triangles, simulation 936,044 in 72 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 406 MB
STEP 139 MB 505 MB
STL 47 MB 416 MB
OBJ 95 MB 668 MB
Visual
GLB 20 MB 530 MB
OBJ 59 MB 567 MB

1652. mega65-r3-expansion-board.kicad

Stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 38 s. Simulation, STEP takes 48 s. Simulation, STL takes 40 s. Simulation, OBJ takes 62 s. Visual, GLB takes 58 s. Visual, OBJ takes 69 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 4.5 14.8 0.9 ms 15.1 0.7 2.0 0.3 38.3
Simulation, STEP 0.9 4.4 15.4 0.7 ms 14.7 9.8 2.2 0.3 47.6
Simulation, STL 0.9 4.5 15.3 0.8 ms 14.6 1.9 2.0 0.3 39.6
Simulation, OBJ 1.0 4.4 14.7 0.8 ms 14.7 24.5 2.2 0.4 61.9
Visual, GLB 0.8 4.7 14.9 0.9 ms 32.6 0.4 4.3 0.3 58.0
Visual, OBJ 0.9 4.7 15.7 1.0 ms 30.5 12.3 4.6 0.3 68.9
Board Repo: MEGA65/mega65-r3-expansion-board
Board: mega65-r3-expansion-board.kicad.kicad_pcb
Complexity 304 / 1000 (size 219, features 85)
KESE features through vias, slotted holes,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 102, 2,880, 310
Triangles, simulation 5,028,540 in 186 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 169 MB 1.3 GB
STEP 591 MB 1.7 GB
STL 251 MB 1.3 GB
OBJ 538 MB 3.2 GB
Visual
GLB 85 MB 1.6 GB
OBJ 272 MB 1.9 GB

1653. pmod_connector_board

pmod_connector_board: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.6 s. Simulation, OBJ takes 5.2 s. Visual, GLB takes 5.1 s. Visual, OBJ takes 6.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.5 0.2 ms 1.0 53 ms 0.2 0.2 3.4
Simulation, STEP 0.1 0.3 1.5 0.2 ms 1.1 1.3 0.2 0.3 4.7
Simulation, STL 0.1 0.3 1.6 0.2 ms 1.0 77 ms 0.2 0.2 3.6
Simulation, OBJ 0.1 0.3 1.5 0.3 ms 1.0 1.8 0.2 0.2 5.2
Visual, GLB 0.1 0.3 1.5 0.3 ms 2.6 36 ms 0.3 0.2 5.1
Visual, OBJ 0.1 0.3 1.5 0.4 ms 2.5 1.3 0.3 0.2 6.2
Board Repo: MEGA65/mega65-r3-expansion-board
Board: pmod_connector_board.kicad_pcb
Folder pmod_connector_board
Complexity 170 / 1000 (size 125, features 45)
KESE features through vias, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 4, 212, 16
Triangles, simulation 310,928 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 227 MB
STEP 47 MB 258 MB
STL 16 MB 240 MB
OBJ 32 MB 259 MB
Visual
GLB 7.5 MB 242 MB
OBJ 23 MB 245 MB

1654. IIsi-to-ztex

IIsi-to-ztex: stages 4 and 6 take 56% to 86% of a run. Simulation, GLB takes 35 s. Simulation, STEP takes 42 s. Simulation, STL takes 35 s. Simulation, OBJ takes 50 s. Visual, GLB takes 50 s. Visual, OBJ takes 59 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.7 15.5 0.8 ms 13.3 0.6 2.1 0.3 35.1
Simulation, STEP 0.6 2.6 15.2 1 ms 12.8 8.7 2.2 0.3 42.4
Simulation, STL 0.6 2.7 14.9 1 ms 13.3 1.0 2.2 0.3 34.9
Simulation, OBJ 0.7 2.6 14.7 1 ms 13.0 16.0 2.2 0.3 49.5
Visual, GLB 0.7 2.6 15.3 0.9 ms 27.4 0.3 3.0 0.3 49.6
Visual, OBJ 0.6 2.8 15.7 1 ms 26.7 9.2 3.3 0.3 58.6
Board Repo: MelkhiorVintageComputing/IIsiFPGA
Board: IIsi-to-ztex.kicad_pcb
Folder IIsi-to-ztex
Complexity 256 / 1000 (size 211, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 63, 2,837, 112
Triangles, simulation 3,427,216 in 267 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 114 MB 1.0 GB
STEP 444 MB 1.3 GB
STL 171 MB 1.0 GB
OBJ 359 MB 2.2 GB
Visual
GLB 65 MB 1.3 GB
OBJ 204 MB 1.4 GB

1655. IIsiA7_Mini

IIsiA7_Mini: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 56 s. Simulation, STEP takes 70 s. Simulation, STL takes 57 s. Simulation, OBJ takes 89 s. Visual, GLB takes 86 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.7 21.1 1 ms 24.1 1.1 3.4 0.4 56.1
Simulation, STEP 1.4 4.9 20.7 1 ms 24.3 15.2 3.5 0.4 70.4
Simulation, STL 1.2 5.1 20.6 1 ms 23.3 2.5 3.7 0.4 57.0
Simulation, OBJ 1.3 4.7 20.5 1 ms 24.5 33.6 3.6 0.3 88.6
Visual, GLB 1.4 4.9 20.2 1 ms 51.7 0.6 6.5 0.3 85.6
Visual, OBJ 1.4 4.8 20.4 1 ms 51.3 18.6 6.3 0.3 103.1
Board Repo: MelkhiorVintageComputing/IIsiFPGA
Board: IIsiA7_Mini.kicad_pcb
Folder IIsiA7_Mini
Complexity 410 / 1000 (size 310, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 218, 5,573, 523
Triangles, simulation 6,574,296 in 382 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 219 MB 1.7 GB
STEP 881 MB 2.3 GB
STL 329 MB 1.7 GB
OBJ 695 MB 4.2 GB
Visual
GLB 132 MB 2.1 GB
OBJ 419 MB 2.7 GB

1656. nubus-to-ztex

nubus-to-ztex: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 51 s. Simulation, STEP takes 63 s. Simulation, STL takes 52 s. Simulation, OBJ takes 74 s. Visual, GLB takes 70 s. Visual, OBJ takes 85 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.8 25.8 0.8 ms 16.3 0.7 2.5 0.3 51.5
Simulation, STEP 1.2 4.8 25.5 0.9 ms 16.3 12.7 2.6 0.3 63.4
Simulation, STL 1.2 4.9 25.5 0.7 ms 15.9 1.7 2.4 0.3 52.0
Simulation, OBJ 1.1 4.6 24.9 0.7 ms 16.2 24.6 2.5 0.3 74.3
Visual, GLB 1.2 4.8 25.7 1 ms 33.8 0.3 3.9 0.3 70.1
Visual, OBJ 1.2 4.7 24.9 0.7 ms 35.8 13.9 4.2 0.3 85.0
Board Repo: MelkhiorVintageComputing/NuBusFPGA
Board: nubus-to-ztex.kicad_pcb
Folder nubus-to-ztex
Complexity 290 / 1000 (size 225, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 101, 5,227, 164
Triangles, simulation 4,022,564 in 220 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 138 MB 1.3 GB
STEP 640 MB 1.5 GB
STL 201 MB 1.3 GB
OBJ 430 MB 2.7 GB
Visual
GLB 80 MB 1.4 GB
OBJ 251 MB 1.7 GB

1657. PicoBerry_V1.0

PicoBerry_V1.0: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.1 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.4 0.5 ms 3.0 0.2 0.4 0.2 9.3
Simulation, STEP 0.3 0.9 4.5 0.4 ms 3.0 2.6 0.4 0.2 11.9
Simulation, STL 0.2 0.8 4.2 0.4 ms 3.0 0.2 0.4 0.2 9.1
Simulation, OBJ 0.3 0.9 4.4 0.6 ms 3.1 4.3 0.4 0.2 13.6
Visual, GLB 0.3 0.9 4.5 0.4 ms 7.1 91 ms 0.8 0.2 13.9
Visual, OBJ 0.4 1.0 4.6 0.4 ms 6.8 3.0 0.8 0.2 16.8
Board Repo: mfolejewski/PicoBerry
Board: PicoBerry_V1.0.kicad_pcb
Folder source files / KiCad
Complexity 285 / 1000 (size 160, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 21, 637, 52
Triangles, simulation 823,516 in 98 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 398 MB
STEP 164 MB 495 MB
STL 41 MB 406 MB
OBJ 84 MB 592 MB
Visual
GLB 20 MB 494 MB
OBJ 60 MB 533 MB

1658. CM5IO

CM5IO: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 46 s. Simulation, STL takes 39 s. Simulation, OBJ takes 59 s. Visual, GLB takes 58 s. Visual, OBJ takes 72 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 4.1 16.0 1 ms 15.1 0.6 2.0 0.3 38.9
Simulation, STEP 0.9 4.1 15.5 1 ms 14.5 8.9 2.1 0.3 46.3
Simulation, STL 0.8 4.1 15.4 0.6 ms 14.8 1.1 2.1 0.3 38.6
Simulation, OBJ 0.9 4.0 16.0 0.6 ms 14.8 20.8 2.1 0.3 58.8
Visual, GLB 0.9 4.5 16.4 0.7 ms 31.5 0.5 4.3 0.3 58.2
Visual, OBJ 0.8 4.1 15.7 1 ms 32.2 14.7 4.1 0.2 71.8
Board Repo: mibs510/openxtcm5-head-unit
Board: CM5IO.kicad_pcb
Folder pcb / lib / RPI-CM5-IO
Complexity 347 / 1000 (size 222, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 64, 4,090, 703
Triangles, simulation 3,764,542 in 226 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 126 MB 1.2 GB
STEP 497 MB 1.6 GB
STL 188 MB 1.2 GB
OBJ 397 MB 2.5 GB
Visual
GLB 86 MB 1.5 GB
OBJ 274 MB 1.8 GB

1659. 2070-S-100-bus-analyzer

2070-S-100-bus-analyzer: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 82 s. Simulation, STEP takes 99 s. Simulation, STL takes 82 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.4 7.5 36.6 2 ms 28.9 1.5 4.9 0.4 82.1
Simulation, STEP 2.3 7.1 36.2 2 ms 28.2 20.1 4.5 0.4 98.7
Simulation, STL 2.2 7.0 36.1 2 ms 29.2 2.8 4.7 0.4 82.5
Simulation, OBJ 2.2 7.0 36.8 1 ms 28.4 43.9 4.7 0.3 123.3
Visual, GLB 2.3 7.3 36.9 1 ms 62.1 0.7 7.9 0.4 117.6
Visual, OBJ 2.2 7.6 37.0 1 ms 60.0 25.5 8.4 0.3 141.2
Board Repo: MichaelPetry/2070-S-100-bus-analyzer
Board: 2070-S-100-bus-analyzer.kicad_pcb
Complexity 366 / 1000 (size 216, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 90, 1,959, 520
Triangles, simulation 7,342,844 in 412 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 244 MB 2.1 GB
STEP 1.0 GB 2.8 GB
STL 367 MB 2.0 GB
OBJ 780 MB 4.7 GB
Visual
GLB 151 MB 2.4 GB
OBJ 479 MB 3.1 GB

1660. EDA-02327-V2-0_pcb

EDA-02327-V2-0_pcb: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 35 s. Simulation, STL takes 28 s. Simulation, OBJ takes 43 s. Visual, GLB takes 42 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 3.1 8.9 1 ms 11.2 0.5 1.5 0.3 26.8
Simulation, STEP 1.2 3.3 8.7 1 ms 11.3 8.8 1.5 0.3 35.1
Simulation, STL 1.3 3.3 9.0 0.9 ms 11.7 0.9 1.4 0.3 27.9
Simulation, OBJ 1.3 3.1 8.9 1 ms 10.8 17.1 1.4 0.3 42.9
Visual, GLB 1.4 3.1 8.5 1 ms 25.1 0.4 3.5 0.3 42.3
Visual, OBJ 1.2 3.2 8.7 0.9 ms 25.5 11.9 3.4 0.2 54.2
Board Repo: michalgaska/fmc-tester-v2
Board: EDA-02327-V2-0_pcb.kicad_pcb
Complexity 377 / 1000 (size 272, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 169, 4,424, 556
Triangles, simulation 3,191,776 in 347 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 108 MB 945 MB
STEP 425 MB 1.4 GB
STL 160 MB 958 MB
OBJ 348 MB 2.1 GB
Visual
GLB 74 MB 1.3 GB
OBJ 246 MB 1.7 GB

1661. moteus_c1

moteus_c1: stages 4 and 6 take 47% to 80% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 20 s. Simulation, STL takes 16 s. Simulation, OBJ takes 26 s. Visual, GLB takes 24 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.1 5.7 0.6 ms 6.2 0.3 0.8 0.2 15.8
Simulation, STEP 0.5 2.2 5.7 0.6 ms 6.1 4.3 0.8 0.3 19.9
Simulation, STL 0.5 2.2 5.7 0.6 ms 6.2 0.5 0.8 0.3 16.2
Simulation, OBJ 0.5 2.1 5.9 0.5 ms 6.3 10.0 0.8 0.3 25.9
Visual, GLB 0.7 2.1 5.7 0.8 ms 13.5 0.2 1.5 0.3 23.9
Visual, OBJ 0.5 2.2 5.9 0.9 ms 13.3 6.1 1.5 0.3 29.9
Board Repo: mjbots/moteus
Board: moteus_c1.kicad_pcb
Folder hw / c1
Complexity 340 / 1000 (size 250, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 120, 1,099, 290
Triangles, simulation 1,697,714 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 613 MB
STEP 200 MB 687 MB
STL 85 MB 589 MB
OBJ 175 MB 1.2 GB
Visual
GLB 35 MB 738 MB
OBJ 107 MB 831 MB

1662. moteus_c1

moteus_c1: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 20 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.6 4.4 0.7 ms 4.8 0.3 0.6 0.2 12.3
Simulation, STEP 0.4 1.5 4.3 0.6 ms 4.9 3.0 0.6 0.2 14.9
Simulation, STL 0.4 1.7 4.3 0.5 ms 4.6 0.5 0.6 0.2 12.3
Simulation, OBJ 0.4 1.5 4.6 0.8 ms 5.0 7.0 0.6 0.2 19.4
Visual, GLB 0.4 1.6 4.7 0.9 ms 11.3 0.1 1.1 0.2 19.5
Visual, OBJ 0.4 1.5 4.4 0.7 ms 11.3 4.2 1.1 0.2 23.1
Board Repo: mjbots/moteus
Board: moteus_c1.kicad_pcb
Folder hw / c1 / r1.0
Complexity 340 / 1000 (size 250, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 130, 1,083, 286
Triangles, simulation 1,709,492 in 121 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 599 MB
STEP 205 MB 681 MB
STL 85 MB 566 MB
OBJ 176 MB 1.1 GB
Visual
GLB 36 MB 732 MB
OBJ 109 MB 866 MB

1663. moteus_c1

moteus_c1: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 20 s. Simulation, OBJ takes 28 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.3 6.7 0.6 ms 7.0 0.3 0.8 0.3 18.0
Simulation, STEP 0.6 2.5 6.3 0.6 ms 7.3 4.5 0.9 0.3 22.4
Simulation, STL 0.6 2.6 7.5 0.6 ms 7.4 0.7 1.1 0.3 20.2
Simulation, OBJ 0.6 2.5 6.5 0.6 ms 6.6 10.3 0.9 0.4 27.7
Visual, GLB 0.5 2.2 6.0 0.9 ms 14.9 0.2 1.7 0.3 25.9
Visual, OBJ 0.6 2.4 6.3 0.6 ms 14.7 6.5 1.8 0.3 32.7
Board Repo: mjbots/moteus
Board: moteus_c1.kicad_pcb
Folder hw / c1 / r1.1
Complexity 339 / 1000 (size 249, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 120, 1,088, 289
Triangles, simulation 1,693,562 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 597 MB
STEP 199 MB 664 MB
STL 85 MB 609 MB
OBJ 174 MB 1.2 GB
Visual
GLB 35 MB 767 MB
OBJ 107 MB 819 MB

1664. mjuart

mjuart: stages 4 and 6 take 42% to 76% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.8 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 4.1 s. Visual, OBJ takes 5.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.7 0.2 ms 0.9 41 ms 0.1 0.3 2.5
Simulation, STEP 0.2 0.3 0.8 0.3 ms 1.0 1.1 0.1 0.3 3.8
Simulation, STL 0.2 0.3 0.7 0.2 ms 0.9 91 ms 0.2 0.2 2.6
Simulation, OBJ 0.2 0.3 0.7 0.2 ms 1.0 1.5 0.1 0.2 3.9
Visual, GLB 0.2 0.3 0.7 0.2 ms 2.4 39 ms 0.2 0.2 4.1
Visual, OBJ 0.1 0.3 0.7 0.4 ms 2.6 1.1 0.2 0.3 5.3
Board Repo: mjbots/moteus
Board: mjuart.kicad_pcb
Folder hw / mjuart
Complexity 245 / 1000 (size 155, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 16, 150, 37
Triangles, simulation 222,280 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.7 MB 220 MB
STEP 28 MB 232 MB
STL 11 MB 219 MB
OBJ 22 MB 226 MB
Visual
GLB 5.4 MB 209 MB
OBJ 15 MB 212 MB

1665. moteus_x1

moteus_x1: stages 4 and 6 take 46% to 89% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 52 s. Simulation, STL takes 45 s. Simulation, OBJ takes 75 s. Visual, GLB takes 90 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.8 16.4 0.6 ms 18.2 0.8 2.2 0.3 44.5
Simulation, STEP 0.8 5.8 16.6 0.8 ms 17.7 8.7 2.2 0.3 52.1
Simulation, STL 0.8 6.0 15.8 1 ms 17.9 1.6 2.2 0.3 44.6
Simulation, OBJ 0.8 5.9 16.0 1.0 ms 18.0 31.1 2.3 0.3 74.6
Visual, GLB 0.9 6.0 16.6 0.7 ms 62.8 0.4 2.8 0.3 89.6
Visual, OBJ 0.9 5.9 16.4 0.7 ms 62.4 13.0 2.8 0.2 101.5
Board Repo: mjbots/moteus
Board: moteus_x1.kicad_pcb
Folder hw / x1
Complexity 408 / 1000 (size 278, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 183, 1,473, 1,087
Triangles, simulation 5,602,952 in 146 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 183 MB 1.2 GB
STEP 471 MB 1.6 GB
STL 280 MB 1.2 GB
OBJ 588 MB 3.5 GB
Visual
GLB 86 MB 1.6 GB
OBJ 275 MB 1.9 GB

1666. amiga-gfxcard-before-pour

amiga-gfxcard-before-pour: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 23 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.5 6.8 0.7 ms 5.3 0.3 0.8 0.2 15.2
Simulation, STEP 0.3 1.5 6.5 1 ms 5.1 4.1 0.8 0.3 18.6
Simulation, STL 0.3 1.5 6.8 0.9 ms 5.6 0.4 0.8 0.3 15.6
Simulation, OBJ 0.3 1.4 7.1 1 ms 5.4 8.3 0.8 0.3 23.5
Visual, GLB 0.4 1.5 6.9 1 ms 12.0 0.2 1.4 0.3 22.6
Visual, OBJ 0.3 1.5 6.8 0.8 ms 12.4 5.9 1.5 0.3 28.7
Board Repo: mntmn/amiga2000-gfxcard
Board: amiga-gfxcard-before-pour.kicad_pcb
Folder kicad
Complexity 245 / 1000 (size 230, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 21, 1,740, 290
Triangles, simulation 1,270,194 in 237 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 525 MB
STEP 204 MB 645 MB
STL 64 MB 522 MB
OBJ 132 MB 881 MB
Visual
GLB 33 MB 684 MB
OBJ 101 MB 768 MB

1667. amiga-gfxcard

amiga-gfxcard: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 9.3 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 4.3 0.8 ms 2.9 0.2 0.5 0.3 9.3
Simulation, STEP 0.2 0.8 4.3 0.7 ms 2.9 2.4 0.5 0.3 11.3
Simulation, STL 0.2 0.8 4.2 0.8 ms 2.9 0.2 0.5 0.2 9.2
Simulation, OBJ 0.2 0.9 4.3 0.7 ms 2.9 4.2 0.5 0.2 13.2
Visual, GLB 0.2 0.9 4.0 0.7 ms 7.1 0.1 0.9 0.3 13.5
Visual, OBJ 0.2 0.8 4.2 0.7 ms 7.5 3.1 0.9 0.2 16.9
Board Repo: mntmn/amiga2000-gfxcard
Board: amiga-gfxcard.kicad_pcb
Folder kicad
Complexity 206 / 1000 (size 171, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 32, 871, 112
Triangles, simulation 842,260 in 159 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 401 MB
STEP 147 MB 472 MB
STL 42 MB 423 MB
OBJ 87 MB 621 MB
Visual
GLB 21 MB 538 MB
OBJ 65 MB 524 MB

1668. videoslot

videoslot: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.0 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.6 0.5 ms 2.8 0.1 0.4 0.3 8.0
Simulation, STEP 0.2 0.6 3.6 0.4 ms 2.8 2.3 0.4 0.2 10.1
Simulation, STL 0.2 0.6 3.6 0.4 ms 2.7 0.2 0.4 0.3 8.0
Simulation, OBJ 0.2 0.6 3.6 0.4 ms 2.9 4.0 0.4 0.2 12.0
Visual, GLB 0.2 0.6 3.7 0.5 ms 6.0 81 ms 0.6 0.2 11.6
Visual, OBJ 0.2 0.7 3.6 0.8 ms 6.0 2.8 0.6 0.3 14.2
Board Repo: mntmn/amiga2000-gfxcard
Board: videoslot.kicad_pcb
Folder videoslot
Complexity 184 / 1000 (size 149, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20160815)
Parts, tracks, vias 13, 425, 49
Triangles, simulation 689,736 in 107 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 343 MB
STEP 121 MB 403 MB
STL 34 MB 339 MB
OBJ 70 MB 495 MB
Visual
GLB 16 MB 419 MB
OBJ 49 MB 420 MB

1669. adapter

adapter: stages 4 and 6 take 47% to 70% of a run. Simulation, GLB takes 3.2 s. Simulation, STEP takes 4.5 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 4.2 s. Visual, GLB takes 4.1 s. Visual, OBJ takes 5.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 0.3 0.8 0.4 ms 1.2 38 ms 0.2 0.2 3.2
Simulation, STEP 0.5 0.3 0.9 0.2 ms 1.2 1.3 0.1 0.2 4.5
Simulation, STL 0.5 0.3 0.8 0.3 ms 1.2 66 ms 0.1 0.3 3.3
Simulation, OBJ 0.5 0.3 0.8 0.2 ms 1.2 1.1 0.1 0.2 4.2
Visual, GLB 0.5 0.3 0.8 0.2 ms 2.1 29 ms 0.2 0.2 4.1
Visual, OBJ 0.5 0.3 0.8 0.3 ms 2.2 0.9 0.2 0.2 5.1
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 34p-adapter-a
Complexity 214 / 1000 (size 139, features 75)
KESE features through vias, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 6, 255, 74
Triangles, simulation 197,086 in 71 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.9 MB 231 MB
STEP 32 MB 256 MB
STL 9.9 MB 232 MB
OBJ 20 MB 232 MB
Visual
GLB 5.8 MB 226 MB
OBJ 17 MB 227 MB

1670. adapter

adapter: stages 4 and 6 take 41% to 78% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.5 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 0.1 0.4 0.1 ms 0.9 24 ms 82 ms 0.2 1.8
Simulation, STEP 0.1 0.1 0.4 0.1 ms 0.7 1.0 76 ms 0.2 2.5
Simulation, STL 94 ms 0.2 0.5 0.2 ms 0.8 41 ms 77 ms 0.2 1.9
Simulation, OBJ 84 ms 0.1 0.4 0.2 ms 0.8 0.5 89 ms 0.2 2.2
Visual, GLB 81 ms 0.1 0.4 0.3 ms 1.5 17 ms 0.1 0.2 2.4
Visual, OBJ 85 ms 0.1 0.4 0.3 ms 1.5 0.4 0.1 0.2 2.8
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 34p-adapter-b
Complexity 189 / 1000 (size 124, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 2, 216, 40
Triangles, simulation 123,848 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.3 MB 199 MB
STEP 21 MB 207 MB
STL 6.2 MB 201 MB
OBJ 12 MB 199 MB
Visual
GLB 3.5 MB 173 MB
OBJ 10 MB 171 MB

1671. adapter

adapter: stages 4 and 6 take 46% to 76% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.4 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.5 0.2 ms 1.1 33 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.5 0.3 ms 1.1 1.2 0.1 0.2 3.4
Simulation, STL 0.1 0.2 0.5 0.2 ms 1.1 49 ms 0.1 0.2 2.3
Simulation, OBJ 0.1 0.2 0.5 0.2 ms 1.0 0.8 0.1 0.2 3.1
Visual, GLB 0.1 0.2 0.5 0.2 ms 1.9 24 ms 0.2 0.2 3.1
Visual, OBJ 0.1 0.2 0.5 0.2 ms 1.9 0.7 0.1 0.2 3.8
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 35p-adapter-a
Complexity 190 / 1000 (size 125, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 2, 195, 53
Triangles, simulation 155,366 in 50 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.4 MB 210 MB
STEP 27 MB 223 MB
STL 7.8 MB 211 MB
OBJ 15 MB 210 MB
Visual
GLB 4.5 MB 199 MB
OBJ 13 MB 199 MB

1672. adapter

adapter: stages 4 and 6 take 44% to 76% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.7 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.1 0.4 0.1 ms 0.9 29 ms 0.1 0.2 1.9
Simulation, STEP 0.1 0.2 0.4 0.2 ms 0.9 1.0 0.1 0.2 3.0
Simulation, STL 0.1 0.2 0.4 0.3 ms 0.9 53 ms 0.1 0.2 1.9
Simulation, OBJ 0.1 0.2 0.4 0.1 ms 0.9 0.8 86 ms 0.2 2.7
Visual, GLB 0.1 0.2 0.4 0.2 ms 1.7 22 ms 0.1 0.2 2.7
Visual, OBJ 0.1 0.2 0.4 0.2 ms 1.6 0.6 0.1 0.2 3.3
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 39p-adapter-b
Complexity 191 / 1000 (size 126, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 2, 264, 42
Triangles, simulation 141,810 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.9 MB 216 MB
STEP 24 MB 216 MB
STL 7.1 MB 218 MB
OBJ 14 MB 217 MB
Visual
GLB 3.9 MB 188 MB
OBJ 11 MB 186 MB

1673. adapter

adapter: stages 4 and 6 take 43% to 78% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 2.9 s. Simulation, STL takes 1.9 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.4 0.2 ms 0.9 25 ms 0.1 0.2 1.9
Simulation, STEP 0.1 0.2 0.4 0.2 ms 0.8 1.0 0.1 0.2 2.9
Simulation, STL 95 ms 0.2 0.4 0.2 ms 0.9 39 ms 99 ms 0.2 1.9
Simulation, OBJ 98 ms 0.2 0.3 0.2 ms 0.9 0.7 0.1 0.2 2.6
Visual, GLB 0.1 0.2 0.3 0.2 ms 1.8 21 ms 0.1 0.2 2.7
Visual, OBJ 0.1 0.2 0.4 0.2 ms 1.7 0.6 0.1 0.2 3.3
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 39p-adapter-c
Complexity 204 / 1000 (size 129, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 3, 259, 42
Triangles, simulation 145,288 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.1 MB 211 MB
STEP 24 MB 218 MB
STL 7.3 MB 206 MB
OBJ 14 MB 205 MB
Visual
GLB 4.0 MB 187 MB
OBJ 12 MB 190 MB

1674. adapter

adapter: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.4 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 4.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.7 0.2 ms 1.0 37 ms 0.1 0.2 2.3
Simulation, STEP 0.1 0.2 0.7 0.3 ms 1.0 1.1 0.1 0.2 3.4
Simulation, STL 0.1 0.2 0.7 0.2 ms 1.0 50 ms 0.1 0.2 2.3
Simulation, OBJ 0.1 0.2 0.7 0.2 ms 1.0 0.9 0.1 0.2 3.2
Visual, GLB 0.1 0.2 0.7 0.2 ms 2.1 28 ms 0.2 0.2 3.6
Visual, OBJ 0.1 0.2 0.8 0.2 ms 2.2 0.8 0.2 0.2 4.4
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 40p-adapter-ab
Complexity 211 / 1000 (size 146, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 8, 401, 69
Triangles, simulation 232,152 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.2 MB 239 MB
STEP 41 MB 259 MB
STL 12 MB 239 MB
OBJ 23 MB 239 MB
Visual
GLB 6.9 MB 246 MB
OBJ 20 MB 244 MB

1675. adapter

adapter: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 3.7 s. Visual, OBJ takes 4.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.2 ms 1.1 33 ms 0.2 0.2 2.7
Simulation, STEP 0.1 0.2 0.7 0.2 ms 1.1 1.2 0.1 0.2 3.7
Simulation, STL 0.1 0.2 0.7 0.3 ms 1.2 66 ms 0.2 0.2 2.6
Simulation, OBJ 0.1 0.2 0.7 0.2 ms 1.1 1.0 0.1 0.2 3.5
Visual, GLB 0.1 0.2 0.7 0.2 ms 2.2 26 ms 0.2 0.2 3.7
Visual, OBJ 0.1 0.2 0.7 0.3 ms 2.0 0.9 0.2 0.2 4.2
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 50p-adapter-b
Complexity 211 / 1000 (size 136, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 5, 311, 44
Triangles, simulation 190,560 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.6 MB 214 MB
STEP 31 MB 233 MB
STL 9.5 MB 217 MB
OBJ 19 MB 216 MB
Visual
GLB 5.5 MB 215 MB
OBJ 16 MB 212 MB

1676. adapter

adapter: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 6.2 s. Simulation, STEP takes 7.9 s. Simulation, STL takes 6.3 s. Simulation, OBJ takes 9.2 s. Visual, GLB takes 8.0 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.1 0.4 ms 2.6 92 ms 0.4 0.2 6.2
Simulation, STEP 0.2 0.5 2.1 0.3 ms 2.4 2.1 0.3 0.2 7.9
Simulation, STL 0.2 0.5 2.2 0.3 ms 2.7 0.2 0.4 0.2 6.3
Simulation, OBJ 0.2 0.5 2.2 0.4 ms 2.6 3.1 0.4 0.2 9.2
Visual, GLB 0.2 0.5 2.2 0.4 ms 4.3 78 ms 0.4 0.3 8.0
Visual, OBJ 0.2 0.5 2.1 0.4 ms 4.4 2.6 0.4 0.2 10.4
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / 50p-adapter-c
Complexity 244 / 1000 (size 169, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 26, 982, 90
Triangles, simulation 554,128 in 87 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 328 MB
STEP 100 MB 395 MB
STL 28 MB 332 MB
OBJ 56 MB 424 MB
Visual
GLB 16 MB 405 MB
OBJ 46 MB 464 MB

1677. pcb

pcb: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 64 s. Simulation, STEP takes 81 s. Simulation, STL takes 68 s. Simulation, OBJ takes 2 min. Visual, GLB takes 99 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 6.0 22.6 1 ms 29.9 1.2 3.0 0.3 64.5
Simulation, STEP 1.6 6.1 22.9 1 ms 30.2 16.5 3.1 0.4 80.8
Simulation, STL 1.5 6.2 23.0 2 ms 31.0 2.4 3.1 0.5 67.6
Simulation, OBJ 1.5 5.9 23.9 2 ms 31.8 35.8 3.3 0.4 102.7
Visual, GLB 1.7 6.3 23.4 1 ms 58.4 0.7 8.1 0.4 98.9
Visual, OBJ 1.6 6.1 22.8 1 ms 57.5 20.0 8.1 0.3 116.5
Board Repo: Modos-Labs/Glider
Board: pcb.kicad_pcb
Folder pcb / mainboard
Complexity 464 / 1000 (size 309, features 155)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline,
knockout text, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 375, 8,883, 900
Triangles, simulation 5,797,268 in 472 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 199 MB 1.7 GB
STEP 870 MB 2.2 GB
STL 290 MB 1.7 GB
OBJ 626 MB 3.7 GB
Visual
GLB 127 MB 2.1 GB
OBJ 413 MB 2.6 GB

1678. adapter

adapter: stages 4 and 6 take 54% to 79% of a run. Simulation, GLB takes 5.9 s. Simulation, STEP takes 8.0 s. Simulation, STL takes 5.9 s. Simulation, OBJ takes 8.3 s. Visual, GLB takes 8.7 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.6 0.4 ms 2.9 90 ms 0.3 0.2 5.9
Simulation, STEP 0.2 0.6 1.7 0.4 ms 2.8 2.3 0.3 0.2 8.0
Simulation, STL 0.2 0.5 1.7 0.4 ms 2.9 0.2 0.3 0.2 5.9
Simulation, OBJ 0.2 0.6 1.6 0.5 ms 2.9 2.6 0.3 0.2 8.3
Visual, GLB 0.2 0.6 1.7 0.4 ms 5.1 77 ms 0.7 0.2 8.7
Visual, OBJ 0.2 0.6 1.6 0.5 ms 5.3 2.2 0.8 0.2 10.9
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / mega_adapter
Complexity 261 / 1000 (size 171, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, knockout text,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 16, 1,300, 195
Triangles, simulation 655,760 in 108 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 400 MB
STEP 117 MB 446 MB
STL 33 MB 403 MB
OBJ 66 MB 477 MB
Visual
GLB 19 MB 428 MB
OBJ 57 MB 514 MB

1679. adapter

adapter: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.8 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 4.3 s. Visual, GLB takes 4.5 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.8 0.4 ms 1.3 44 ms 0.2 0.2 3.1
Simulation, STEP 0.1 0.3 1.0 0.3 ms 1.5 1.5 0.2 0.2 4.8
Simulation, STL 0.1 0.3 0.9 0.2 ms 1.4 0.1 0.2 0.2 3.3
Simulation, OBJ 0.1 0.3 0.8 0.2 ms 1.3 1.4 0.2 0.2 4.3
Visual, GLB 0.1 0.3 0.8 0.4 ms 2.7 40 ms 0.2 0.2 4.5
Visual, OBJ 0.1 0.3 0.9 0.2 ms 2.7 1.6 0.2 0.3 6.1
Board Repo: Modos-Labs/Glider
Board: adapter.kicad_pcb
Folder pcb / u133_adapter
Complexity 229 / 1000 (size 144, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 7, 340, 86
Triangles, simulation 229,622 in 70 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.0 MB 234 MB
STEP 35 MB 260 MB
STL 11 MB 233 MB
OBJ 23 MB 234 MB
Visual
GLB 6.6 MB 243 MB
OBJ 20 MB 240 MB

1680. pcb

pcb: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 38 s. Simulation, STL takes 31 s. Simulation, OBJ takes 48 s. Visual, GLB takes 46 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.6 11.4 1 ms 12.9 0.6 1.4 0.3 31.2
Simulation, STEP 0.8 3.5 11.2 1 ms 12.1 8.4 1.3 0.3 37.6
Simulation, STL 0.8 3.5 11.9 1 ms 12.5 0.9 1.5 0.3 31.4
Simulation, OBJ 0.7 3.5 11.5 1 ms 12.0 18.7 1.5 0.3 48.2
Visual, GLB 0.8 3.7 11.5 1 ms 26.2 0.4 2.8 0.3 45.7
Visual, OBJ 0.8 3.5 11.6 1 ms 25.7 12.5 2.9 0.3 57.2
Board Repo: Modos-Labs/Lancer
Board: pcb.kicad_pcb
Folder pcb / epdc_poc_board
Complexity 390 / 1000 (size 285, features 105)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210824)
Parts, tracks, vias 152, 2,972, 478
Triangles, simulation 2,984,120 in 302 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 103 MB 941 MB
STEP 437 MB 1.2 GB
STL 149 MB 929 MB
OBJ 315 MB 2.0 GB
Visual
GLB 71 MB 1.2 GB
OBJ 225 MB 1.5 GB

1681. pcb

pcb: stages 4 and 6 take 60% to 84% of a run. Simulation, GLB takes 52 s. Simulation, STEP takes 64 s. Simulation, STL takes 52 s. Simulation, OBJ takes 69 s. Visual, GLB takes 68 s. Visual, OBJ takes 83 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.3 4.5 20.5 2 ms 22.0 0.6 2.5 0.3 51.6
Simulation, STEP 1.2 4.6 20.0 2 ms 21.8 13.5 2.5 0.3 63.8
Simulation, STL 1.3 4.7 20.4 2 ms 22.2 1.2 2.2 0.3 52.3
Simulation, OBJ 1.2 4.4 20.2 2 ms 21.5 19.1 2.3 0.3 69.0
Visual, GLB 1.3 4.5 20.1 2 ms 37.3 0.4 4.5 0.3 68.4
Visual, OBJ 1.3 4.7 20.7 2 ms 36.6 15.1 4.5 0.3 83.2
Board Repo: Modos-Labs/Lancer
Board: pcb.kicad_pcb
Folder pcb / mainboard
Complexity 385 / 1000 (size 270, features 115)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20210824)
Parts, tracks, vias 252, 3,168, 656
Triangles, simulation 3,434,270 in 443 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 119 MB 1.3 GB
STEP 679 MB 1.7 GB
STL 172 MB 1.3 GB
OBJ 368 MB 2.3 GB
Visual
GLB 90 MB 1.7 GB
OBJ 282 MB 1.9 GB

1682. pcb

pcb: stages 4 and 6 take 42% to 76% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 81 ms 77 ms 0.4 0.1 ms 0.5 19 ms 72 ms 0.2 1.4
Simulation, STEP 93 ms 86 ms 0.4 0.1 ms 0.5 0.8 73 ms 0.2 2.2
Simulation, STL 85 ms 86 ms 0.4 0.1 ms 0.6 28 ms 73 ms 0.2 1.4
Simulation, OBJ 84 ms 79 ms 0.4 0.2 ms 0.5 0.5 69 ms 0.2 1.9
Visual, GLB 98 ms 82 ms 0.4 0.1 ms 1.1 16 ms 88 ms 0.2 2.0
Visual, OBJ 0.1 81 ms 0.5 0.1 ms 1.1 0.3 65 ms 0.2 2.3
Board Repo: Modos-Labs/Lancer
Board: pcb.kicad_pcb
Folder pcb / usb_adapter_board
Complexity 148 / 1000 (size 93, features 55)
KESE features filled zones, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20210824)
Parts, tracks, vias 3, 40, 0
Triangles, simulation 109,756 in 17 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.6 MB 186 MB
STEP 16 MB 191 MB
STL 5.5 MB 188 MB
OBJ 10 MB 180 MB
Visual
GLB 2.1 MB 153 MB
OBJ 5.7 MB 152 MB

1683. Project NuXT

Project NuXT: stages 4 and 6 take 50% to 87% of a run. Simulation, GLB takes 3 min. Simulation, STEP takes 4 min. Simulation, STL takes 3 min. Simulation, OBJ takes 5 min. Visual, GLB takes 5 min. Visual, OBJ takes 6 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.7 17.5 73.2 2 ms 66.5 3.3 12.6 0.6 177.4
Simulation, STEP 3.5 15.6 71.9 1 ms 71.8 43.7 11.9 0.6 219.0
Simulation, STL 3.3 16.2 70.0 4 ms 66.4 6.8 11.9 0.6 175.1
Simulation, OBJ 3.0 15.5 71.4 4 ms 64.2 106.1 11.9 0.6 272.6
Visual, GLB 3.1 15.9 69.7 3 ms 176.1 1.8 16.1 0.5 283.3
Visual, OBJ 3.3 19.0 73.5 3 ms 174.4 61.4 16.1 0.4 348.1
Board Repo: monotech/NuXT
Board: Project NuXT.kicad_pcb
Complexity 302 / 1000 (size 237, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 221, 6,262, 262
Triangles, simulation 15,376,478 in 341 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 521 MB 3.5 GB
STEP 2.1 GB 4.7 GB
STL 769 MB 3.5 GB
OBJ 1.7 GB 9.6 GB
Visual
GLB 292 MB 4.5 GB
OBJ 941 MB 5.9 GB

1684. 96boards-robomezzi

96boards-robomezzi: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.4 4.9 1.0 ms 4.2 0.2 0.7 0.3 11.9
Simulation, STEP 0.3 1.4 4.9 0.6 ms 4.3 3.3 0.6 0.2 15.0
Simulation, STL 0.3 1.4 4.8 1 ms 4.3 0.4 0.7 0.2 12.1
Simulation, OBJ 0.3 1.4 4.9 0.6 ms 4.3 7.4 0.6 0.2 19.1
Visual, GLB 0.3 1.4 4.9 0.7 ms 10.3 0.1 1.1 0.3 18.5
Visual, OBJ 0.4 1.6 5.1 0.8 ms 9.8 4.4 1.1 0.2 22.6
Board Repo: mwelling/96boards-robomezzi
Board: 96boards-robomezzi.kicad_pcb
Complexity 247 / 1000 (size 202, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 112, 968, 113
Triangles, simulation 1,414,434 in 142 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 532 MB
STEP 195 MB 598 MB
STL 71 MB 490 MB
OBJ 147 MB 982 MB
Visual
GLB 28 MB 712 MB
OBJ 86 MB 693 MB

1685. beagle-wire

beagle-wire: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 23 s. Simulation, STL takes 18 s. Simulation, OBJ takes 29 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.2 6.4 0.9 ms 7.5 0.3 1.1 0.3 18.2
Simulation, STEP 0.5 2.3 6.3 0.8 ms 7.1 5.4 1.1 0.2 22.8
Simulation, STL 0.4 2.3 6.3 0.8 ms 7.3 0.5 1.2 0.3 18.3
Simulation, OBJ 0.4 2.4 6.7 0.9 ms 7.4 10.6 1.0 0.3 28.9
Visual, GLB 0.5 2.2 6.2 0.9 ms 14.8 0.2 1.5 0.2 25.7
Visual, OBJ 0.4 2.3 6.3 0.9 ms 15.3 7.1 1.7 0.2 33.3
Board Repo: mwelling/beagle-wire
Board: beagle-wire.kicad_pcb
Complexity 316 / 1000 (size 261, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 104, 2,019, 289
Triangles, simulation 2,045,158 in 200 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 691 MB
STEP 302 MB 893 MB
STL 102 MB 668 MB
OBJ 216 MB 1.4 GB
Visual
GLB 46 MB 875 MB
OBJ 145 MB 1.0 GB

1686. icebreaker++

icebreaker++: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 32 s. Simulation, STL takes 26 s. Simulation, OBJ takes 38 s. Visual, GLB takes 39 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.5 9.1 1 ms 11.2 0.5 1.3 0.3 25.6
Simulation, STEP 0.7 2.7 9.2 1 ms 10.9 7.1 1.3 0.3 32.1
Simulation, STL 0.7 2.5 9.0 1 ms 11.2 1.1 1.3 0.3 26.1
Simulation, OBJ 0.7 2.6 9.2 1 ms 10.7 13.1 1.3 0.3 37.9
Visual, GLB 0.7 2.7 9.3 1 ms 22.2 0.3 3.1 0.3 38.5
Visual, OBJ 0.6 2.8 9.2 1 ms 21.8 8.6 3.2 0.3 46.4
Board Repo: mwelling/icecrusher
Board: icebreaker++.kicad_pcb
Folder kicad-src
Complexity 369 / 1000 (size 269, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201116)
Parts, tracks, vias 99, 2,201, 284
Triangles, simulation 2,479,698 in 300 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 864 MB
STEP 381 MB 1.1 GB
STL 124 MB 854 MB
OBJ 260 MB 1.7 GB
Visual
GLB 55 MB 1.1 GB
OBJ 172 MB 1.2 GB

1687. lofive

lofive: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 7.5 s. Simulation, STEP takes 8.9 s. Simulation, STL takes 7.3 s. Simulation, OBJ takes 11 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 1.0 3.1 0.3 ms 2.5 0.1 0.4 0.2 7.5
Simulation, STEP 0.2 1.0 3.0 0.3 ms 2.4 1.9 0.3 0.2 8.9
Simulation, STL 0.2 0.9 3.0 0.3 ms 2.4 0.3 0.3 0.2 7.3
Simulation, OBJ 0.2 0.9 3.1 0.3 ms 2.4 3.7 0.3 0.2 10.9
Visual, GLB 0.2 1.0 3.1 0.5 ms 5.6 69 ms 0.5 0.2 10.7
Visual, OBJ 0.2 1.0 3.1 0.3 ms 5.9 2.1 0.7 0.2 13.2
Board Repo: mwelling/lofive
Board: lofive.kicad_pcb
Complexity 264 / 1000 (size 219, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 33, 445, 83
Triangles, simulation 899,502 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 419 MB
STEP 149 MB 452 MB
STL 45 MB 407 MB
OBJ 93 MB 646 MB
Visual
GLB 19 MB 464 MB
OBJ 56 MB 464 MB

1688. pocketbone-kicad

pocketbone-kicad: stages 4 and 6 take 57% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 16 s. Simulation, STL takes 14 s. Simulation, OBJ takes 20 s. Visual, GLB takes 19 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.2 6.5 0.4 ms 4.5 0.2 0.5 0.2 13.4
Simulation, STEP 0.3 1.1 6.3 0.4 ms 4.5 3.6 0.5 0.2 16.5
Simulation, STL 0.3 1.2 6.5 0.8 ms 4.7 0.4 0.6 0.2 13.9
Simulation, OBJ 0.3 1.2 6.6 0.6 ms 4.7 6.2 0.5 0.2 19.6
Visual, GLB 0.3 1.2 6.4 0.4 ms 9.3 0.1 1.3 0.2 18.8
Visual, OBJ 0.3 1.2 6.3 0.4 ms 9.1 3.9 1.1 0.2 22.2
Board Repo: mwelling/pocketbone-kicad
Board: pocketbone-kicad.kicad_pcb
Complexity 292 / 1000 (size 247, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 56, 891, 151
Triangles, simulation 1,477,718 in 88 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 655 MB
STEP 247 MB 754 MB
STL 74 MB 652 MB
OBJ 155 MB 1.0 GB
Visual
GLB 34 MB 687 MB
OBJ 102 MB 791 MB

1689. OpenCAPI-to-PCIe_for_MNV303212A_RevA2

Stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 21 s. Visual, OBJ takes 27 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 4.3 0.5 ms 5.6 0.2 0.7 0.3 12.7
Simulation, STEP 0.4 1.2 4.3 0.4 ms 5.8 4.5 0.8 0.3 17.3
Simulation, STL 0.4 1.3 4.4 0.4 ms 5.8 0.4 0.8 0.3 13.3
Simulation, OBJ 0.4 1.2 4.6 0.4 ms 5.6 7.6 0.8 0.2 20.4
Visual, GLB 0.4 1.2 4.3 0.4 ms 12.9 0.2 1.4 0.3 20.7
Visual, OBJ 0.4 1.2 4.2 0.5 ms 12.5 6.9 1.6 0.3 27.1
Board Repo: mwrnd/opencapi-to-pcie_for_mnv303212a_reva2
Board: OpenCAPI-to-PCIe_for_MNV303212A_RevA2.kicad_pcb
Complexity 284 / 1000 (size 184, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 5, 2,398, 175
Triangles, simulation 1,358,418 in 85 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 650 MB
STEP 212 MB 780 MB
STL 68 MB 645 MB
OBJ 139 MB 897 MB
Visual
GLB 37 MB 720 MB
OBJ 112 MB 828 MB

1690. AnalogComputer

AnalogComputer: stages 4 and 6 take 50% to 85% of a run. Simulation, GLB takes 53 s. Simulation, STEP takes 62 s. Simulation, STL takes 52 s. Simulation, OBJ takes 77 s. Visual, GLB takes 67 s. Visual, OBJ takes 81 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 5.2 20.7 0.9 ms 21.3 0.9 3.4 0.4 53.0
Simulation, STEP 1.1 4.7 19.1 1 ms 20.5 12.8 3.0 0.3 61.5
Simulation, STL 1.1 5.0 18.5 0.8 ms 21.5 2.2 3.1 0.3 51.9
Simulation, OBJ 1.1 4.9 18.5 0.9 ms 19.8 29.1 3.1 0.4 76.8
Visual, GLB 1.0 4.5 17.8 0.8 ms 39.2 0.3 4.0 0.3 67.2
Visual, OBJ 1.0 4.7 17.5 0.9 ms 39.0 13.2 4.8 0.3 80.5
Board Repo: mwwhited/embeddedbakery
Board: AnalogComputer.kicad_pcb
Folder circuits / AnalogCalculator / AnalogComputer
Complexity 285 / 1000 (size 210, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 113, 2,006, 31
Triangles, simulation 4,617,684 in 226 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 159 MB 1.2 GB
STEP 681 MB 1.6 GB
STL 231 MB 1.2 GB
OBJ 495 MB 3.0 GB
Visual
GLB 73 MB 1.7 GB
OBJ 228 MB 1.5 GB

1691. Diode Function

Diode Function: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.4 s. Simulation, OBJ takes 12 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.7 1.0 ms 2.7 0.1 0.4 0.2 8.0
Simulation, STEP 0.2 0.7 3.9 0.4 ms 3.0 2.2 0.4 0.2 10.5
Simulation, STL 0.2 0.7 3.9 0.5 ms 2.8 0.2 0.4 0.2 8.4
Simulation, OBJ 0.2 0.6 3.9 0.4 ms 2.8 4.1 0.3 0.2 12.3
Visual, GLB 0.3 0.6 3.9 0.5 ms 4.5 69 ms 0.5 0.2 10.0
Visual, OBJ 0.2 0.7 3.8 0.8 ms 4.7 2.4 0.5 0.2 12.5
Board Repo: mwwhited/embeddedbakery
Board: Diode Function.kicad_pcb
Folder circuits / AnalogCalculator / Diode Function / Diode Function
Complexity 173 / 1000 (size 158, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 69, 320, 7
Triangles, simulation 845,732 in 56 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 392 MB
STEP 109 MB 462 MB
STL 42 MB 375 MB
OBJ 84 MB 592 MB
Visual
GLB 16 MB 464 MB
OBJ 48 MB 497 MB

1692. OperationalAmplifierExamples

OperationalAmplifierExamples: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 7.2 s. Simulation, STEP takes 9.5 s. Simulation, STL takes 7.3 s. Simulation, OBJ takes 11 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 3.2 0.6 ms 2.6 0.1 0.4 0.2 7.2
Simulation, STEP 0.2 0.5 3.1 0.5 ms 2.9 2.1 0.4 0.3 9.5
Simulation, STL 0.2 0.5 3.2 0.5 ms 2.6 0.2 0.4 0.2 7.3
Simulation, OBJ 0.2 0.4 3.2 0.5 ms 2.8 4.1 0.4 0.3 11.3
Visual, GLB 0.2 0.5 3.4 1 ms 5.4 72 ms 0.5 0.3 10.5
Visual, OBJ 0.2 0.7 3.2 0.4 ms 5.6 2.2 0.8 0.2 13.0
Board Repo: mwwhited/embeddedbakery
Board: OperationalAmplifierExamples.kicad_pcb
Folder circuits / AnalogCalculator / OperationalAmplifierExamples / OperationalAmplifierExamples
Complexity 175 / 1000 (size 145, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 48, 195, 0
Triangles, simulation 846,610 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 409 MB
STEP 117 MB 469 MB
STL 42 MB 392 MB
OBJ 84 MB 589 MB
Visual
GLB 17 MB 498 MB
OBJ 50 MB 466 MB

1693. Connectors

Connectors: stages 4 and 6 take 48% to 76% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.2 ms 0.7 32 ms 0.1 0.2 2.2
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.7 1.0 0.1 0.2 3.1
Simulation, STL 0.1 0.2 0.7 0.1 ms 0.8 46 ms 0.1 0.3 2.2
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.7 1.0 0.1 0.2 3.1
Visual, GLB 0.1 0.2 0.8 0.3 ms 1.6 21 ms 0.2 0.3 3.1
Visual, OBJ 89 ms 0.2 0.8 0.2 ms 1.5 0.5 0.1 0.2 3.3
Board Repo: mwwhited/embeddedbakery
Board: Connectors.kicad_pcb
Folder circuits / AnalogCalculator / SimpleOpAmp / Connectors / Connectors
Complexity 120 / 1000 (size 105, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 1, 122, 4
Triangles, simulation 231,562 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.7 MB 216 MB
STEP 28 MB 229 MB
STL 12 MB 221 MB
OBJ 22 MB 213 MB
Visual
GLB 4.3 MB 203 MB
OBJ 12 MB 200 MB

1694. Simple OpAmp

Simple OpAmp: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 45 s. Simulation, STL takes 37 s. Simulation, OBJ takes 54 s. Visual, GLB takes 45 s. Visual, OBJ takes 55 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 3.2 15.7 1 ms 14.2 0.5 1.3 0.3 35.8
Simulation, STEP 0.6 3.2 15.7 1 ms 14.7 9.0 1.4 0.3 44.9
Simulation, STL 0.7 3.2 15.7 1 ms 14.9 1.1 1.5 0.3 37.3
Simulation, OBJ 0.6 3.2 16.1 1 ms 14.6 18.1 1.5 0.3 54.3
Visual, GLB 0.7 3.2 15.6 1 ms 22.3 0.3 2.6 0.3 45.0
Visual, OBJ 0.7 3.2 16.2 1 ms 22.2 9.6 2.8 0.3 54.9
Board Repo: mwwhited/embeddedbakery
Board: Simple OpAmp.kicad_pcb
Folder circuits / AnalogCalculator / SimpleOpAmp / Simple OpAmp
Complexity 83 / 1000 (size 73, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 174, 0, 0
Triangles, simulation 3,102,728 in 334 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 98 MB 895 MB
STEP 366 MB 1.2 GB
STL 155 MB 904 MB
OBJ 330 MB 2.0 GB
Visual
GLB 57 MB 1.1 GB
OBJ 178 MB 1.3 GB

1695. Regulator7913-1

Regulator7913-1: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 4.9 s. Simulation, STEP takes 6.6 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 7.2 s. Visual, GLB takes 6.1 s. Visual, OBJ takes 7.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.9 0.4 ms 1.8 76 ms 0.3 0.2 4.9
Simulation, STEP 0.2 0.4 2.1 0.3 ms 1.8 1.6 0.3 0.3 6.6
Simulation, STL 0.2 0.4 2.0 0.3 ms 1.8 0.1 0.2 0.2 4.9
Simulation, OBJ 0.2 0.4 2.0 0.3 ms 1.8 2.3 0.3 0.3 7.2
Visual, GLB 0.1 0.4 1.9 0.4 ms 3.0 45 ms 0.4 0.2 6.1
Visual, OBJ 0.2 0.3 2.0 0.4 ms 3.0 1.2 0.4 0.2 7.5
Board Repo: mwwhited/embeddedbakery
Board: Regulator7913-1.kicad_pcb
Folder circuits / ComdynaGP6 / Regulator7913-1
Complexity 160 / 1000 (size 145, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 34, 242, 1
Triangles, simulation 497,452 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 275 MB
STEP 64 MB 337 MB
STL 25 MB 282 MB
OBJ 49 MB 376 MB
Visual
GLB 9.0 MB 311 MB
OBJ 27 MB 316 MB

1696. Digital Logic Board

Digital Logic Board: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 4.9 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 5.2 s. Simulation, OBJ takes 7.4 s. Visual, GLB takes 6.8 s. Visual, OBJ takes 8.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.7 2.0 0.4 ms 1.5 65 ms 0.3 0.2 4.9
Simulation, STEP 0.1 0.7 1.8 0.5 ms 1.5 1.6 0.3 0.2 6.3
Simulation, STL 0.1 0.8 1.9 0.4 ms 1.7 0.2 0.3 0.3 5.2
Simulation, OBJ 0.1 0.7 2.0 0.3 ms 1.5 2.4 0.3 0.3 7.4
Visual, GLB 0.2 0.7 2.0 0.4 ms 3.2 44 ms 0.4 0.2 6.8
Visual, OBJ 0.1 0.7 1.9 0.3 ms 3.2 1.3 0.4 0.2 8.0
Board Repo: mwwhited/embeddedbakery
Board: Digital Logic Board.kicad_pcb
Folder circuits / Digital Tools / Digital Logic Board
Complexity 176 / 1000 (size 131, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 10, 194, 8
Triangles, simulation 509,302 in 44 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 284 MB
STEP 82 MB 349 MB
STL 25 MB 296 MB
OBJ 51 MB 384 MB
Visual
GLB 9.7 MB 328 MB
OBJ 29 MB 332 MB

1697. Examples

Examples: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 5.1 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 5.2 s. Simulation, OBJ takes 7.8 s. Visual, GLB takes 6.2 s. Visual, OBJ takes 7.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.1 0.5 ms 1.8 69 ms 0.2 0.2 5.1
Simulation, STEP 0.2 0.4 2.3 0.3 ms 1.9 1.6 0.2 0.2 6.8
Simulation, STL 0.2 0.4 2.2 0.4 ms 1.8 0.1 0.2 0.3 5.2
Simulation, OBJ 0.2 0.5 2.4 0.2 ms 1.9 2.4 0.2 0.2 7.8
Visual, GLB 0.2 0.4 2.1 0.3 ms 2.8 41 ms 0.3 0.2 6.2
Visual, OBJ 0.2 0.4 2.2 0.3 ms 2.8 1.7 0.3 0.2 7.9
Board Repo: mwwhited/embeddedbakery
Board: Examples.kicad_pcb
Folder circuits / DiodeLogicBoards / Examples
Complexity 57 / 1000 (size 57, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 41, 0, 0
Triangles, simulation 446,392 in 31 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 264 MB
STEP 48 MB 314 MB
STL 22 MB 262 MB
OBJ 45 MB 340 MB
Visual
GLB 8.6 MB 303 MB
OBJ 25 MB 301 MB

1698. PROM

PROM: stages 4 and 6 take 59% to 85% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 29 s. Visual, GLB takes 23 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 8.4 1 ms 8.7 0.3 0.7 0.2 20.5
Simulation, STEP 0.4 1.9 8.7 0.9 ms 8.4 4.7 0.7 0.2 25.1
Simulation, STL 0.4 1.8 8.5 0.8 ms 8.5 0.7 0.7 0.2 20.7
Simulation, OBJ 0.4 1.7 8.3 1 ms 8.9 8.7 0.7 0.2 29.0
Visual, GLB 0.4 1.7 8.5 1 ms 11.2 0.2 1.0 0.2 23.2
Visual, OBJ 0.5 1.7 8.4 1.0 ms 11.2 5.0 1.6 0.2 28.7
Board Repo: mwwhited/embeddedbakery
Board: PROM.kicad_pcb
Folder circuits / DiodeLogicBoards / PROM
Complexity 71 / 1000 (size 71, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 145, 0, 0
Triangles, simulation 2,224,624 in 179 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 720 MB
STEP 243 MB 920 MB
STL 111 MB 713 MB
OBJ 232 MB 1.5 GB
Visual
GLB 41 MB 1.1 GB
OBJ 123 MB 1.1 GB

1699. h4n2rs485

h4n2rs485: stages 4 and 6 take 50% to 78% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 3.0 s. Simulation, OBJ takes 4.4 s. Visual, GLB takes 3.5 s. Visual, OBJ takes 4.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 98 ms 0.3 1.2 0.3 ms 0.9 41 ms 0.1 0.2 2.9
Simulation, STEP 0.1 0.3 1.3 0.2 ms 0.9 1.1 0.2 0.2 4.1
Simulation, STL 97 ms 0.3 1.2 0.3 ms 1.0 61 ms 0.1 0.2 3.0
Simulation, OBJ 0.1 0.3 1.2 0.2 ms 1.0 1.4 0.2 0.2 4.4
Visual, GLB 97 ms 0.3 1.3 0.2 ms 1.5 19 ms 0.2 0.2 3.5
Visual, OBJ 0.1 0.3 1.2 0.2 ms 1.6 0.7 0.2 0.2 4.3
Board Repo: mwwhited/embeddedbakery
Board: h4n2rs485.kicad_pcb
Folder circuits / h4n2rs485
Complexity 58 / 1000 (size 48, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 17, 0, 0
Triangles, simulation 277,192 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.4 MB 226 MB
STEP 41 MB 250 MB
STL 14 MB 228 MB
OBJ 28 MB 245 MB
Visual
GLB 4.4 MB 206 MB
OBJ 13 MB 199 MB

1700. Analog Controller

Analog Controller: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 6.5 s. Simulation, STEP takes 8.5 s. Simulation, STL takes 6.8 s. Simulation, OBJ takes 9.6 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.9 0.4 ms 2.2 0.1 0.3 0.2 6.5
Simulation, STEP 0.2 0.6 3.1 0.4 ms 2.3 1.8 0.3 0.2 8.5
Simulation, STL 0.2 0.6 3.0 0.8 ms 2.3 0.2 0.4 0.2 6.8
Simulation, OBJ 0.2 0.6 3.0 0.2 ms 2.3 3.1 0.3 0.2 9.6
Visual, GLB 0.2 0.6 3.2 0.3 ms 4.4 51 ms 0.5 0.2 9.2
Visual, OBJ 0.2 0.6 3.0 0.4 ms 4.3 1.7 0.7 0.2 10.7
Board Repo: mwwhited/embeddedbakery
Board: Analog Controller.kicad_pcb
Folder circuits / HelperBoards / Controller / Analog Controller
Complexity 179 / 1000 (size 154, features 25)
KESE features through vias, rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 42, 313, 13
Triangles, simulation 784,554 in 68 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 374 MB
STEP 108 MB 452 MB
STL 39 MB 369 MB
OBJ 78 MB 560 MB
Visual
GLB 15 MB 452 MB
OBJ 46 MB 452 MB

1701. Analog Converter Backplane

Analog Converter Backplane: stages 4 and 6 take 53% to 80% of a run. Simulation, GLB takes 3.0 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.1 s. Visual, GLB takes 3.7 s. Visual, OBJ takes 4.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 85 ms 0.2 1.2 0.4 ms 1.1 55 ms 0.2 0.2 3.0
Simulation, STEP 95 ms 0.2 1.2 0.4 ms 1.2 1.2 0.2 0.2 4.2
Simulation, STL 0.1 0.2 1.3 0.3 ms 1.2 91 ms 0.1 0.2 3.2
Simulation, OBJ 94 ms 0.2 1.2 0.3 ms 1.0 1.3 0.2 0.2 4.1
Visual, GLB 0.1 0.2 1.2 0.6 ms 1.7 25 ms 0.2 0.2 3.7
Visual, OBJ 0.1 0.2 1.1 0.3 ms 1.7 0.7 0.2 0.3 4.2
Board Repo: mwwhited/embeddedbakery
Board: Analog Converter Backplane.kicad_pcb
Folder circuits / HelperBoards / Controller / Analog Converter Backplane / Analog Converter Backplane
Complexity 138 / 1000 (size 123, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 8, 144, 3
Triangles, simulation 276,700 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.9 MB 220 MB
STEP 34 MB 253 MB
STL 14 MB 221 MB
OBJ 27 MB 235 MB
Visual
GLB 5.0 MB 226 MB
OBJ 15 MB 226 MB

1702. Analog Converter

Analog Converter: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 5.2 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 6.0 s. Visual, GLB takes 5.4 s. Visual, OBJ takes 6.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.7 0.2 ms 1.5 64 ms 0.2 0.2 4.0
Simulation, STEP 0.1 0.3 1.6 0.2 ms 1.4 1.4 0.2 0.2 5.2
Simulation, STL 0.1 0.3 1.6 0.2 ms 1.4 88 ms 0.2 0.2 3.9
Simulation, OBJ 0.1 0.3 1.6 0.3 ms 1.3 2.2 0.3 0.2 6.0
Visual, GLB 0.1 0.3 1.6 0.2 ms 2.9 35 ms 0.2 0.2 5.4
Visual, OBJ 0.1 0.3 1.6 0.2 ms 3.0 1.2 0.2 0.2 6.6
Board Repo: mwwhited/embeddedbakery
Board: Analog Converter.kicad_pcb
Folder circuits / HelperBoards / Controller / Analog Converter / Analog Converter
Complexity 161 / 1000 (size 131, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 17, 161, 0
Triangles, simulation 402,410 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 257 MB
STEP 59 MB 304 MB
STL 20 MB 264 MB
OBJ 40 MB 310 MB
Visual
GLB 7.9 MB 278 MB
OBJ 23 MB 280 MB

1703. Wave Form Generator Amplifier

Wave Form Generator Amplifier: stages 4 and 6 take 47% to 85% of a run. Simulation, GLB takes 5.8 s. Simulation, STEP takes 7.2 s. Simulation, STL takes 5.6 s. Simulation, OBJ takes 8.9 s. Visual, GLB takes 8.5 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.5 ms 1.9 91 ms 0.3 0.3 5.8
Simulation, STEP 0.2 0.5 2.3 0.4 ms 1.8 1.8 0.3 0.2 7.2
Simulation, STL 0.2 0.4 2.5 0.2 ms 1.8 0.1 0.4 0.2 5.6
Simulation, OBJ 0.3 0.4 2.3 0.2 ms 1.8 3.4 0.3 0.3 8.9
Visual, GLB 0.2 0.4 2.4 0.3 ms 4.7 52 ms 0.4 0.2 8.5
Visual, OBJ 0.2 0.4 2.3 0.4 ms 4.6 1.9 0.4 0.2 10.0
Board Repo: mwwhited/embeddedbakery
Board: Wave Form Generator Amplifier.kicad_pcb
Folder circuits / HelperBoards / Wave Form Generator Amplifier
Complexity 169 / 1000 (size 139, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 22, 223, 0
Triangles, simulation 532,854 in 33 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 330 MB
STEP 86 MB 354 MB
STL 27 MB 344 MB
OBJ 53 MB 393 MB
Visual
GLB 11 MB 355 MB
OBJ 32 MB 354 MB

1704. MyIOShield

MyIOShield: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 4.4 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.5 s. Simulation, OBJ takes 6.6 s. Visual, GLB takes 5.8 s. Visual, OBJ takes 6.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 2.1 0.5 ms 1.3 81 ms 0.2 0.2 4.4
Simulation, STEP 0.1 0.4 2.0 0.4 ms 1.3 1.5 0.3 0.2 5.8
Simulation, STL 0.1 0.4 2.0 0.6 ms 1.3 0.1 0.3 0.2 4.5
Simulation, OBJ 0.1 0.4 2.1 0.4 ms 1.3 2.2 0.2 0.2 6.6
Visual, GLB 0.1 0.3 2.0 0.4 ms 2.7 33 ms 0.4 0.2 5.8
Visual, OBJ 0.1 0.3 2.1 0.4 ms 2.5 1.2 0.4 0.2 6.9
Board Repo: mwwhited/embeddedbakery
Board: MyIOShield.kicad_pcb
Folder circuits / MyIOShield
Complexity 52 / 1000 (size 52, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 24, 0, 0
Triangles, simulation 442,126 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 260 MB
STEP 58 MB 306 MB
STL 22 MB 260 MB
OBJ 45 MB 352 MB
Visual
GLB 7.8 MB 292 MB
OBJ 23 MB 315 MB

1705. 16bit Banked Switches

16bit Banked Switches: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 5.2 s. Simulation, STEP takes 6.2 s. Simulation, STL takes 5.0 s. Simulation, OBJ takes 7.3 s. Visual, GLB takes 6.1 s. Visual, OBJ takes 7.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 2.6 0.3 ms 1.7 76 ms 0.2 0.2 5.2
Simulation, STEP 0.1 0.4 2.3 0.3 ms 1.5 1.4 0.2 0.2 6.2
Simulation, STL 0.1 0.4 2.4 0.5 ms 1.5 95 ms 0.2 0.2 5.0
Simulation, OBJ 0.1 0.4 2.4 0.3 ms 1.6 2.3 0.2 0.2 7.3
Visual, GLB 0.2 0.4 2.4 0.3 ms 2.6 32 ms 0.3 0.2 6.1
Visual, OBJ 0.2 0.4 2.3 0.5 ms 2.5 1.1 0.3 0.2 7.1
Board Repo: mwwhited/embeddedbakery
Board: 16bit Banked Switches.kicad_pcb
Folder circuits / Pmod16bitBanked
Complexity 147 / 1000 (size 137, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 24, 182, 0
Triangles, simulation 448,056 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 266 MB
STEP 70 MB 310 MB
STL 22 MB 287 MB
OBJ 46 MB 362 MB
Visual
GLB 7.7 MB 267 MB
OBJ 23 MB 278 MB

1706. SimpleClock

SimpleClock: stages 4 and 6 take 54% to 79% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 5.7 s. Simulation, STL takes 4.3 s. Simulation, OBJ takes 6.2 s. Visual, GLB takes 5.0 s. Visual, OBJ takes 5.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.8 0.3 ms 1.6 63 ms 0.2 0.2 4.3
Simulation, STEP 0.1 0.3 1.8 0.6 ms 1.6 1.4 0.2 0.2 5.7
Simulation, STL 0.1 0.4 1.7 0.4 ms 1.6 0.1 0.2 0.2 4.3
Simulation, OBJ 0.1 0.3 1.7 0.5 ms 1.6 1.9 0.2 0.3 6.2
Visual, GLB 0.2 0.4 1.8 0.4 ms 2.2 31 ms 0.3 0.2 5.0
Visual, OBJ 0.1 0.3 1.7 0.3 ms 2.2 1.0 0.3 0.2 5.8
Board Repo: mwwhited/embeddedbakery
Board: SimpleClock.kicad_pcb
Folder circuits / SimpleClock / SimpleClock
Complexity 54 / 1000 (size 54, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 31, 0, 0
Triangles, simulation 454,624 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 264 MB
STEP 46 MB 309 MB
STL 23 MB 264 MB
OBJ 45 MB 351 MB
Visual
GLB 8.4 MB 305 MB
OBJ 25 MB 304 MB

1707. LimeSDR_Sony

LimeSDR_Sony: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 43 s. Simulation, STEP takes 51 s. Simulation, STL takes 43 s. Simulation, OBJ takes 64 s. Visual, GLB takes 64 s. Visual, OBJ takes 80 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.3 14.9 2 ms 18.5 0.8 1.9 0.3 42.5
Simulation, STEP 0.8 5.5 14.8 2 ms 18.5 9.5 1.9 0.3 51.4
Simulation, STL 1.0 5.4 14.4 1 ms 18.2 1.9 1.9 0.3 43.1
Simulation, OBJ 0.8 5.2 14.0 1 ms 18.2 24.0 2.0 0.3 64.5
Visual, GLB 0.8 5.3 14.0 0.6 ms 38.0 0.5 5.4 0.3 64.2
Visual, OBJ 0.8 5.4 14.5 2 ms 38.9 14.0 5.6 0.3 79.5
Board Repo: myriadrf/front-end-modules
Board: LimeSDR_Sony.kicad_pcb
Folder LimeSDR_PA_LNA / hardware / v1r3 / KiCAD
Complexity 319 / 1000 (size 274, features 45)
KESE features through vias, slotted holes,
filled zones
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 244, 2,265, 237
Triangles, simulation 4,502,856 in 159 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 155 MB 1.2 GB
STEP 559 MB 1.7 GB
STL 225 MB 1.2 GB
OBJ 487 MB 2.9 GB
Visual
GLB 89 MB 1.5 GB
OBJ 282 MB 1.9 GB

1708. lc-b3-mpa

lc-b3-mpa: stages 4 and 6 take 53% to 81% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 0.2 0.9 0.1 ms 1.1 34 ms 0.1 0.2 2.5
Simulation, STEP 97 ms 0.2 0.8 0.2 ms 1.0 1.1 0.1 0.2 3.5
Simulation, STL 0.1 0.2 0.9 0.1 ms 1.1 57 ms 0.1 0.3 2.7
Simulation, OBJ 96 ms 0.1 0.8 0.1 ms 1.0 1.0 0.1 0.2 3.4
Visual, GLB 0.1 0.2 0.9 0.1 ms 1.7 17 ms 97 ms 0.2 3.1
Visual, OBJ 97 ms 0.2 0.9 0.1 ms 1.6 0.4 81 ms 0.2 3.3
Board Repo: myriadrf/lc-b3-mpa
Board: lc-b3-mpa.kicad_pcb
Folder hardware / 0v1
Complexity 219 / 1000 (size 149, features 70)
KESE features through vias, rounded,
trapezoid or chamfered pads,
drill offsets, arc tracks,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 15, 8, 57
Triangles, simulation 213,914 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.0 MB 210 MB
STEP 22 MB 236 MB
STL 11 MB 214 MB
OBJ 21 MB 232 MB
Visual
GLB 2.8 MB 168 MB
OBJ 7.9 MB 168 MB

1709. lc-b3-mpa

lc-b3-mpa: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 88 ms 0.1 0.8 0.1 ms 1.0 32 ms 0.1 0.2 2.4
Simulation, STEP 96 ms 0.2 0.8 0.1 ms 1.0 0.9 92 ms 0.2 3.3
Simulation, STL 96 ms 0.1 0.8 0.1 ms 0.9 57 ms 0.1 0.2 2.4
Simulation, OBJ 95 ms 0.1 0.8 0.1 ms 1.0 0.8 97 ms 0.3 3.1
Visual, GLB 97 ms 0.2 0.8 0.2 ms 1.5 13 ms 84 ms 0.2 2.8
Visual, OBJ 90 ms 0.1 0.8 0.1 ms 1.6 0.3 88 ms 0.2 3.2
Board Repo: myriadrf/lc-b3-mpa
Board: lc-b3-mpa.kicad_pcb
Folder hardware / 1v0
Complexity 209 / 1000 (size 149, features 60)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 15, 10, 57
Triangles, simulation 217,420 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.1 MB 219 MB
STEP 23 MB 239 MB
STL 11 MB 217 MB
OBJ 21 MB 233 MB
Visual
GLB 2.9 MB 170 MB
OBJ 8.2 MB 168 MB

1710. CSAD10

CSAD10: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 6.1 s. Simulation, STEP takes 8.9 s. Simulation, STL takes 6.6 s. Simulation, OBJ takes 9.2 s. Visual, GLB takes 9.0 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.6 2.0 0.5 ms 2.6 88 ms 0.3 0.2 6.1
Simulation, STEP 0.3 0.6 2.1 0.3 ms 2.9 2.5 0.3 0.2 8.9
Simulation, STL 0.3 0.6 2.1 0.2 ms 3.0 0.2 0.3 0.2 6.6
Simulation, OBJ 0.3 0.6 2.1 0.3 ms 2.7 3.1 0.3 0.2 9.2
Visual, GLB 0.3 0.6 2.3 0.3 ms 4.9 80 ms 0.5 0.2 9.0
Visual, OBJ 0.3 0.6 2.0 0.2 ms 4.5 2.5 0.7 0.2 10.8
Board Repo: myriadrf/lc-clock
Board: CSAD10.kicad_pcb
Folder csad10
Complexity 340 / 1000 (size 225, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 60, 440, 81
Triangles, simulation 595,804 in 67 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 355 MB
STEP 91 MB 415 MB
STL 30 MB 357 MB
OBJ 60 MB 415 MB
Visual
GLB 16 MB 424 MB
OBJ 48 MB 480 MB

1711. CSAD2

CSAD2: stages 4 and 6 take 47% to 76% of a run. Simulation, GLB takes 3.0 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 4.6 s. Visual, GLB takes 3.9 s. Visual, OBJ takes 5.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.2 ms 1.2 42 ms 0.1 0.3 3.0
Simulation, STEP 0.2 0.3 0.8 0.2 ms 1.2 1.2 0.1 0.2 4.1
Simulation, STL 0.2 0.3 0.8 0.2 ms 1.2 74 ms 0.1 0.2 2.9
Simulation, OBJ 0.2 0.3 1.0 0.2 ms 1.2 1.6 0.2 0.2 4.6
Visual, GLB 0.2 0.3 0.9 0.2 ms 2.1 32 ms 0.3 0.2 3.9
Visual, OBJ 0.2 0.3 0.9 0.3 ms 2.2 1.1 0.2 0.2 5.0
Board Repo: myriadrf/lc-clock
Board: CSAD2.kicad_pcb
Folder csad2
Complexity 278 / 1000 (size 163, features 115)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 37, 121, 43
Triangles, simulation 293,046 in 44 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 245 MB
STEP 44 MB 284 MB
STL 15 MB 242 MB
OBJ 29 MB 261 MB
Visual
GLB 7.4 MB 258 MB
OBJ 22 MB 252 MB

1712. B3LPD

B3LPD: stages 4 and 6 take 45% to 74% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.6 0.1 ms 1.1 34 ms 86 ms 0.2 2.4
Simulation, STEP 0.1 0.3 0.6 0.2 ms 1.1 0.8 82 ms 0.2 3.2
Simulation, STL 0.1 0.3 0.6 0.2 ms 1.1 58 ms 89 ms 0.2 2.5
Simulation, OBJ 0.1 0.3 0.6 0.2 ms 1.0 1.2 89 ms 0.2 3.5
Visual, GLB 0.1 0.3 0.6 0.1 ms 1.5 21 ms 0.1 0.2 2.8
Visual, OBJ 0.1 0.3 0.6 0.2 ms 1.5 0.7 0.1 0.2 3.6
Board Repo: myriadrf/lc-filters
Board: B3LPD.kicad_pcb
Folder b3lpd
Complexity 240 / 1000 (size 150, features 90)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 7, 22, 96
Triangles, simulation 214,242 in 20 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.2 MB 233 MB
STEP 13 MB 246 MB
STL 11 MB 233 MB
OBJ 21 MB 233 MB
Visual
GLB 4.3 MB 192 MB
OBJ 12 MB 191 MB

1713. LC_RFE-RevA1

LC_RFE-RevA1: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 42 s. Simulation, STEP takes 51 s. Simulation, STL takes 45 s. Simulation, OBJ takes 66 s. Visual, GLB takes 62 s. Visual, OBJ takes 72 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 5.2 16.9 2 ms 16.4 0.7 1.6 0.3 42.2
Simulation, STEP 0.9 5.0 17.3 2 ms 17.1 8.5 1.8 0.4 51.0
Simulation, STL 1.1 5.4 17.4 2 ms 16.9 2.1 1.8 0.3 44.9
Simulation, OBJ 0.9 5.6 17.4 2 ms 17.5 22.7 1.7 0.4 66.2
Visual, GLB 0.9 5.6 17.1 2 ms 33.6 0.4 3.9 0.3 61.9
Visual, OBJ 0.9 5.2 16.5 1 ms 32.4 12.5 4.0 0.3 71.8
Board Repo: myriadrf/lc-rfe
Board: LC_RFE-RevA1.kicad_pcb
Folder revisions / LC_RFE-RevA1
Complexity 399 / 1000 (size 284, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 228, 1,247, 1,393
Triangles, simulation 4,623,948 in 206 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 154 MB 1.6 GB
STEP 422 MB 1.9 GB
STL 231 MB 1.7 GB
OBJ 482 MB 3.0 GB
Visual
GLB 89 MB 1.6 GB
OBJ 283 MB 1.9 GB

1714. LC_RFE-RevA2

LC_RFE-RevA2: stages 4 and 6 take 56% to 82% of a run. Simulation, GLB takes 73 s. Simulation, STEP takes 79 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 96 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 8.1 27.0 2 ms 31.8 1.2 2.5 0.4 72.6
Simulation, STEP 1.4 8.4 26.6 2 ms 29.6 10.7 2.2 0.3 79.2
Simulation, STL 1.2 8.0 25.8 3 ms 29.5 2.4 2.5 0.4 69.8
Simulation, OBJ 1.1 8.0 25.3 3 ms 30.3 32.2 2.6 0.4 99.9
Visual, GLB 1.3 8.1 26.0 3 ms 52.7 0.6 7.2 0.4 96.4
Visual, OBJ 1.3 7.9 26.1 2 ms 54.4 17.7 7.4 0.3 115.1
Board Repo: myriadrf/lc-rfe
Board: LC_RFE-RevA2.kicad_pcb
Folder revisions / LC_RFE-RevA2
Complexity 406 / 1000 (size 291, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 256, 1,307, 2,201
Triangles, simulation 6,245,326 in 210 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 208 MB 2.0 GB
STEP 521 MB 2.7 GB
STL 312 MB 2.0 GB
OBJ 653 MB 3.9 GB
Visual
GLB 122 MB 2.1 GB
OBJ 391 MB 2.5 GB

1715. LC-RFE-Mini-RevA1

LC-RFE-Mini-RevA1: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 47 s. Simulation, STL takes 38 s. Simulation, OBJ takes 51 s. Visual, GLB takes 52 s. Visual, OBJ takes 58 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 4.2 15.0 0.5 ms 14.4 0.5 1.7 0.3 37.0
Simulation, STEP 1.1 5.3 17.4 1.0 ms 15.0 6.7 1.6 0.4 47.5
Simulation, STL 0.8 4.6 14.8 1 ms 14.9 1.0 1.6 0.3 38.1
Simulation, OBJ 0.7 3.9 14.0 0.7 ms 13.8 17.4 1.3 0.3 51.3
Visual, GLB 0.7 3.7 14.0 1.0 ms 28.9 0.4 4.0 0.2 52.0
Visual, OBJ 0.8 4.0 14.1 0.9 ms 24.3 11.7 2.9 0.3 58.1
Board Repo: myriadrf/lc-rfe-mini
Board: LC-RFE-Mini-RevA1.kicad_pcb
Folder revisions / LC-RFE-Mini-RevA1
Complexity 370 / 1000 (size 255, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 98, 458, 910
Triangles, simulation 3,268,520 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 110 MB 1.3 GB
STEP 319 MB 1.4 GB
STL 163 MB 1.3 GB
OBJ 339 MB 2.1 GB
Visual
GLB 64 MB 1.3 GB
OBJ 199 MB 1.4 GB

1716. LC-RFE-Mini-RevA2

LC-RFE-Mini-RevA2: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 15 s. Simulation, OBJ takes 22 s. Visual, GLB takes 21 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.1 0.3 ms 6.1 0.3 0.7 0.2 15.3
Simulation, STEP 0.4 1.4 6.3 0.2 ms 5.9 4.0 0.7 0.2 19.1
Simulation, STL 0.4 1.4 6.0 0.3 ms 5.8 0.5 0.7 0.2 15.0
Simulation, OBJ 0.4 1.5 5.9 0.3 ms 5.7 7.6 0.8 0.2 22.2
Visual, GLB 0.4 1.5 6.0 0.3 ms 11.7 0.2 1.2 0.2 21.3
Visual, OBJ 0.4 1.5 6.2 0.3 ms 11.5 4.6 1.6 0.2 26.1
Board Repo: myriadrf/lc-rfe-mini
Board: LC-RFE-Mini-RevA2.kicad_pcb
Folder revisions / LC-RFE-Mini-RevA2
Complexity 355 / 1000 (size 240, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 95, 396, 289
Triangles, simulation 1,923,076 in 108 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 717 MB
STEP 244 MB 821 MB
STL 96 MB 835 MB
OBJ 199 MB 1.3 GB
Visual
GLB 38 MB 764 MB
OBJ 116 MB 866 MB

1717. Lime_RFE

Lime_RFE: stages 4 and 6 take 47% to 88% of a run. Simulation, GLB takes 3 min. Simulation, STEP takes 4 min. Simulation, STL takes 3 min. Simulation, OBJ takes 6 min. Visual, GLB takes 6 min. Visual, OBJ takes 7 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.4 20.3 84.9 4 ms 70.3 4.4 8.9 0.5 192.7
Simulation, STEP 3.4 19.9 83.0 2 ms 71.9 43.5 9.6 0.5 231.8
Simulation, STL 3.5 22.1 91.1 3 ms 74.9 7.9 10.0 0.6 210.0
Simulation, OBJ 4.0 20.9 84.9 3 ms 73.4 142.3 9.9 0.6 336.0
Visual, GLB 3.4 21.2 90.4 3 ms 215.7 1.5 14.3 0.5 346.9
Visual, OBJ 3.5 21.2 87.9 3 ms 221.3 58.0 14.8 0.5 407.3
Board Repo: myriadrf/LimeRFE
Board: Lime_RFE.kicad_pcb
Folder archived / 0v3 / hardware / KiCad
Complexity 325 / 1000 (size 270, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 986, 8,840, 623
Triangles, simulation 18,078,138 in 810 parts
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 668 MB 4.5 GB
STEP 2.6 GB 6.1 GB
STL 904 MB 4.6 GB
OBJ 2.1 GB 12 GB
Visual
GLB 320 MB 4.9 GB
OBJ 1.0 GB 6.7 GB

1718. Lime_RFE_fab

Lime_RFE_fab: stages 4 and 6 take 48% to 87% of a run. Simulation, GLB takes 3 min. Simulation, STEP takes 3 min. Simulation, STL takes 3 min. Simulation, OBJ takes 6 min. Visual, GLB takes 5 min. Visual, OBJ takes 6 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.7 18.2 73.3 3 ms 63.0 3.8 8.2 0.5 169.8
Simulation, STEP 2.6 17.6 73.0 3 ms 62.9 37.6 8.2 0.5 202.5
Simulation, STL 2.9 18.4 74.3 3 ms 64.9 7.8 8.4 0.5 177.3
Simulation, OBJ 4.4 24.9 93.2 3 ms 79.3 143.3 10.8 1.1 357.0
Visual, GLB 2.9 18.7 74.9 3 ms 188.2 1.5 16.8 0.4 303.4
Visual, OBJ 2.7 17.9 72.9 4 ms 201.1 48.2 16.9 0.5 360.2
Board Repo: myriadrf/LimeRFE
Board: Lime_RFE_fab.kicad_pcb
Folder archived / 0v3 / hardware / KiCad
Complexity 325 / 1000 (size 270, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 986, 8,840, 623
Triangles, simulation 18,079,684 in 810 parts
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 668 MB 4.9 GB
STEP 2.6 GB 5.8 GB
STL 904 MB 4.8 GB
OBJ 2.1 GB 12 GB
Visual
GLB 320 MB 4.9 GB
OBJ 1.0 GB 6.4 GB

1719. Lime_RFE

Lime_RFE: stages 4 and 6 take 9% to 10% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 15 s. Simulation, STL takes 15 s. Simulation, OBJ takes 15 s. Visual, GLB takes 15 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 4.4 9.2 1.4 1 ms 37 ms 2 ms 6 ms 0.3 15.3
Simulation, STEP 4.4 9.1 1.5 1 ms 36 ms 41 ms 7 ms 0.3 15.3
Simulation, STL 4.4 9.2 1.4 1 ms 37 ms 2 ms 6 ms 0.3 15.4
Simulation, OBJ 4.3 9.1 1.4 0.7 ms 38 ms 14 ms 6 ms 0.3 15.2
Visual, GLB 4.3 9.2 1.5 1 ms 93 ms 4 ms 12 ms 0.3 15.3
Visual, OBJ 4.6 9.3 1.5 1 ms 0.1 13 ms 15 ms 0.2 15.8
Board Repo: myriadrf/LimeRFE
Board: Lime_RFE.kicad_pcb
Folder archived / 1v0 / hardware / KiCAD
Complexity 339 / 1000 (size 274, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 1,278, 9,448, 585
Triangles, simulation 2,136 in 8 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 63 kB 478 MB
STEP 381 kB 478 MB
STL 107 kB 479 MB
OBJ 216 kB 476 MB
Visual
GLB 75 kB 479 MB
OBJ 194 kB 478 MB

1720. Lime_RFE

Lime_RFE: stages 4 and 6 take 11% to 12% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 15 s. Simulation, STL takes 16 s. Simulation, OBJ takes 15 s. Visual, GLB takes 15 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 4.3 8.9 1.6 1 ms 31 ms 2 ms 5 ms 0.2 15.1
Simulation, STEP 4.1 9.2 1.7 1 ms 31 ms 34 ms 7 ms 0.3 15.3
Simulation, STL 4.6 9.5 1.7 2 ms 31 ms 2 ms 5 ms 0.3 16.1
Simulation, OBJ 4.2 8.8 1.6 2 ms 33 ms 14 ms 5 ms 0.3 15.0
Visual, GLB 4.2 9.4 1.6 2 ms 96 ms 2 ms 14 ms 0.3 15.5
Visual, OBJ 4.0 8.8 1.7 1 ms 95 ms 12 ms 12 ms 0.3 14.9
Board Repo: myriadrf/LimeRFE
Board: Lime_RFE.kicad_pcb
Folder archived / 1v2 / hardware / KiCAD
Complexity 340 / 1000 (size 275, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 1,295, 10,180, 591
Triangles, simulation 2,136 in 8 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 63 kB 542 MB
STEP 381 kB 542 MB
STL 107 kB 542 MB
OBJ 216 kB 542 MB
Visual
GLB 75 kB 542 MB
OBJ 194 kB 542 MB

1721. Lime_RFE

Lime_RFE: stages 4 and 6 take 10% to 12% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 13 s. Simulation, STL takes 12 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.4 8.0 1.4 2 ms 27 ms 1 ms 6 ms 0.2 13.1
Simulation, STEP 3.5 7.7 1.3 2 ms 27 ms 49 ms 6 ms 0.3 12.9
Simulation, STL 3.4 7.4 1.3 1 ms 24 ms 1 ms 5 ms 0.3 12.3
Simulation, OBJ 3.3 7.5 1.4 2 ms 25 ms 8 ms 6 ms 0.3 12.5
Visual, GLB 3.4 7.6 1.2 1 ms 74 ms 2 ms 9 ms 0.3 12.7
Visual, OBJ 3.4 7.7 1.5 1 ms 83 ms 7 ms 9 ms 0.3 12.9
Board Repo: myriadrf/LimeRFE
Board: Lime_RFE.kicad_pcb
Folder hardware / 1v31 / KiCAD
Complexity 341 / 1000 (size 276, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 1,317, 10,728, 612
Triangles, simulation 1,736 in 8 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 kB 545 MB
STEP 240 kB 546 MB
STL 87 kB 544 MB
OBJ 169 kB 548 MB
Visual
GLB 52 kB 545 MB
OBJ 133 kB 545 MB

1722. FrontEnd_5G

FrontEnd_5G: stages 4 and 6 take 67% to 83% of a run. Simulation, GLB takes 7 min. Simulation, STEP takes 9 min. Simulation, STL takes 8 min. Visual, GLB takes 12 min. Visual, OBJ takes 13 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 23.3 57.8 171.2 5 ms 157.3 6.5 25.0 1.2 442.2
Simulation, STEP 25.1 60.0 185.7 4 ms 176.8 67.2 25.0 1.2 541.0
Simulation, STL 26.0 62.1 185.2 5 ms 177.1 17.1 24.2 1.1 492.8
Simulation, OBJ exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Visual, GLB 26.7 64.2 182.8 4 ms 397.2 3.0 28.0 0.9 702.8
Visual, OBJ 24.3 59.7 177.6 5 ms 404.0 88.9 29.9 1.0 785.3
Board Repo: myriadrf/LimeRFE-8001P
Board: FrontEnd_5G.kicad_pcb
Folder hardware / 1v0 / KiCAD
Complexity 376 / 1000 (size 291, features 85)
KESE features through vias,
blind and buried vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026 to 10th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 1,605, 23,739, 1,538
Triangles, simulation 30,808,402 in 1307 parts
Verifier Simulation, OBJ: exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Run again Visual, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 1.0 GB 8.7 GB
STEP 2.9 GB 10 GB
STL 1.5 GB 8.6 GB
OBJ – 11 GB
Visual
GLB 535 MB 8.9 GB
OBJ 1.8 GB 11 GB

1723. FrontEnd_5G

FrontEnd_5G: stages 4 and 6 take 67% to 85% of a run. Simulation, GLB takes 6 min. Simulation, STEP takes 7 min. Simulation, STL takes 6 min. Visual, GLB takes 10 min. Visual, OBJ takes 11 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 5.7 54.4 150.5 4 ms 131.1 6.3 19.7 0.8 368.5
Simulation, STEP 5.9 54.3 149.9 4 ms 124.6 51.7 19.8 0.7 406.8
Simulation, STL 5.9 53.3 150.3 4 ms 128.2 13.6 18.8 0.7 370.8
Simulation, OBJ exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Visual, GLB 5.8 52.2 147.2 4 ms 351.3 2.4 26.8 0.5 586.1
Visual, OBJ 5.6 52.1 143.3 4 ms 352.7 74.3 25.1 0.6 653.5
Board Repo: myriadrf/LimeRFE-8001P
Board: FrontEnd_5G.kicad_pcb
Folder hardware / 1v1 / KiCAD
Complexity 383 / 1000 (size 288, features 95)
KESE features through vias,
blind and buried vias,
slotted holes, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 1,461, 20,552, 1,349
Triangles, simulation 27,133,154 in 1073 parts
Verifier Simulation, OBJ: exceeded 11 GB on a 16 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
File
type
File
size
Peak memory
used
Simulation
GLB 916 MB 7.3 GB
STEP 2.5 GB 8.7 GB
STL 1.4 GB 7.5 GB
OBJ – 11 GB
Visual
GLB 462 MB 7.4 GB
OBJ 1.5 GB 9.7 GB

1724. LimeSDR_Breakout

LimeSDR_Breakout: reading, start-up and exit take 42% to 46% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 1.4 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.4 s. Visual, GLB takes 1.4 s. Visual, OBJ takes 1.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.6 0.1 0.1 ms 23 ms 2 ms 3 ms 0.2 1.4
Simulation, STEP 0.4 0.6 0.1 0.1 ms 25 ms 34 ms 3 ms 0.2 1.4
Simulation, STL 0.4 0.6 0.1 0.1 ms 23 ms 2 ms 4 ms 0.2 1.4
Simulation, OBJ 0.4 0.6 0.2 0.1 ms 25 ms 26 ms 4 ms 0.2 1.4
Visual, GLB 0.4 0.6 0.1 0.1 ms 57 ms 3 ms 21 ms 0.2 1.4
Visual, OBJ 0.4 0.6 0.1 0.1 ms 57 ms 24 ms 13 ms 0.2 1.4
Board Repo: myriadrf/LimeSDR_GPIO_Board
Board: LimeSDR_Breakout.kicad_pcb
Folder hardware / 0402_Variant / CAD2
Complexity 244 / 1000 (size 199, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 90, 2,265, 397
Triangles, simulation 5,712 in 3 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 165 kB 90 MB
STEP 74 kB 92 MB
STL 286 kB 90 MB
OBJ 542 kB 90 MB
Visual
GLB 212 kB 90 MB
OBJ 545 kB 90 MB

1725. LMS6002-Pmod

LMS6002-Pmod: stages 4 and 6 take 59% to 86% of a run. Simulation, GLB takes 8.7 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.8 0.5 ms 3.4 99 ms 0.4 0.2 8.7
Simulation, STEP 0.2 0.7 3.8 0.4 ms 3.6 2.2 0.4 0.2 11.1
Simulation, STL 0.3 0.7 4.1 0.3 ms 3.3 0.2 0.4 0.2 9.2
Simulation, OBJ 0.2 0.7 3.8 0.5 ms 3.6 3.6 0.4 0.2 12.5
Visual, GLB 0.2 0.6 4.3 0.4 ms 7.1 90 ms 0.7 0.2 13.2
Visual, OBJ 0.2 0.6 3.8 0.3 ms 7.1 2.8 0.7 0.2 15.4
Board Repo: myriadrf/LMS6002-Pmod
Board: LMS6002-Pmod.kicad_pcb
Folder board / KiCad
Complexity 270 / 1000 (size 215, features 55)
KESE features through vias, slotted holes,
drill offsets, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 55, 891, 65
Triangles, simulation 724,500 in 95 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 370 MB
STEP 139 MB 450 MB
STL 36 MB 391 MB
OBJ 77 MB 545 MB
Visual
GLB 20 MB 512 MB
OBJ 60 MB 487 MB

1726. LMS8001_Companion

LMS8001_Companion: stages 4 and 6 take 12% to 14% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 1.3 0.4 0.1 ms 11 ms 1 ms 3 ms 0.3 2.8
Simulation, STEP 0.9 1.1 0.3 0.0 ms 10 ms 6 ms 3 ms 0.2 2.6
Simulation, STL 0.9 1.2 0.4 0.1 ms 18 ms 2 ms 3 ms 0.2 2.7
Simulation, OBJ 0.8 1.1 0.3 0.1 ms 11 ms 1 ms 3 ms 0.3 2.6
Visual, GLB 0.9 1.2 0.3 0.1 ms 30 ms 2 ms 13 ms 0.2 2.7
Visual, OBJ 1.0 1.2 0.3 0.0 ms 31 ms 1 ms 12 ms 0.3 2.8
Board Repo: myriadrf/LMS8001-Companion
Board: LMS8001_Companion.kicad_pcb
Folder hardware / 2v1 / KiCAD
Complexity 320 / 1000 (size 265, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 351, 2,038, 174
Triangles, simulation 52 in 3 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 kB 136 MB
STEP 23 kB 136 MB
STL 2.9 kB 136 MB
OBJ 6.2 kB 136 MB
Visual
GLB 5.0 kB 136 MB
OBJ 5.2 kB 136 MB

1727. LMS8001_Companion

LMS8001_Companion: stages 4 and 6 take 12% to 14% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 1.5 0.4 0.0 ms 12 ms 1 ms 3 ms 0.3 3.1
Simulation, STEP 1.1 1.5 0.4 0.1 ms 13 ms 9 ms 3 ms 0.2 3.3
Simulation, STL 1.0 1.6 0.4 0.1 ms 11 ms 1 ms 2 ms 0.3 3.2
Simulation, OBJ 1.1 1.4 0.4 0.1 ms 13 ms 2 ms 3 ms 0.2 3.1
Visual, GLB 1.0 1.4 0.4 0.0 ms 24 ms 1 ms 12 ms 0.2 3.0
Visual, OBJ 1.0 1.4 0.4 0.1 ms 31 ms 2 ms 14 ms 0.2 3.0
Board Repo: myriadrf/LMS8001-Companion
Board: LMS8001_Companion.kicad_pcb
Folder hardware / 3v1 / KiCAD
Complexity 332 / 1000 (size 267, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 351, 2,332, 176
Triangles, simulation 52 in 3 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 kB 139 MB
STEP 23 kB 139 MB
STL 2.9 kB 139 MB
OBJ 6.2 kB 139 MB
Visual
GLB 5.0 kB 139 MB
OBJ 5.2 kB 139 MB

1728. LMS8001_Companion

LMS8001_Companion: stages 4 and 6 take 12% to 16% of a run. Simulation, GLB takes 3.2 s. Simulation, STEP takes 3.4 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 3.3 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 1.5 0.4 0.0 ms 12 ms 1 ms 3 ms 0.2 3.2
Simulation, STEP 1.2 1.5 0.4 0.0 ms 11 ms 8 ms 5 ms 0.3 3.4
Simulation, STL 1.0 1.5 0.5 0.0 ms 12 ms 0.9 ms 3 ms 0.3 3.4
Simulation, OBJ 1.1 1.6 0.4 0.0 ms 11 ms 1 ms 3 ms 0.2 3.3
Visual, GLB 1.1 1.5 0.4 0.0 ms 31 ms 2 ms 13 ms 0.3 3.3
Visual, OBJ 1.1 1.6 0.4 0.0 ms 26 ms 1 ms 11 ms 0.3 3.5
Board Repo: myriadrf/LMS8001-Companion
Board: LMS8001_Companion.kicad_pcb
Folder hardware / 3v2 / KiCAD
Complexity 333 / 1000 (size 268, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 352, 2,467, 192
Triangles, simulation 52 in 3 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 kB 141 MB
STEP 23 kB 141 MB
STL 2.9 kB 141 MB
OBJ 6.2 kB 141 MB
Visual
GLB 5.0 kB 142 MB
OBJ 5.2 kB 142 MB
Previous Next
Corpus Page 15 Corpus Page 17

Clone this wiki locally