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Corpus Testing 15

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Corpus Page 15

Part 15 of 29 of Corpus Testing: boards 1,513 to 1,620, six runs each, one file format a run, as Corpus Testing describes.

1513. attenuator

attenuator: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 3.5 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.7 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.4 0.2 ms 1.1 54 ms 0.2 0.2 3.5
Simulation, STEP 0.1 0.4 1.5 0.2 ms 1.1 1.2 0.2 0.2 4.7
Simulation, STL 0.2 0.4 1.5 0.2 ms 1.1 81 ms 0.2 0.2 3.7
Simulation, OBJ 0.1 0.4 1.5 0.2 ms 1.1 1.9 0.2 0.2 5.5
Visual, GLB 0.1 0.4 1.4 0.3 ms 2.8 34 ms 0.3 0.2 5.3
Visual, OBJ 0.2 0.4 1.4 0.3 ms 2.7 1.2 0.2 0.2 6.4
Board Repo: loxodes/vna
Board: attenuator.kicad_pcb
Folder breakouts / attenuator
Complexity 204 / 1000 (size 169, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 36, 232, 41
Triangles, simulation 357,776 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 247 MB
STEP 47 MB 264 MB
STL 18 MB 236 MB
OBJ 37 MB 290 MB
Visual
GLB 7.9 MB 248 MB
OBJ 23 MB 240 MB

1514. balun

balun: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.8 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.6 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 94 ms 0.1 0.6 0.1 ms 0.6 24 ms 77 ms 0.3 1.8
Simulation, STEP 98 ms 0.1 0.6 0.1 ms 0.7 0.9 84 ms 0.2 2.8
Simulation, STL 87 ms 0.1 0.6 0.1 ms 0.7 35 ms 80 ms 0.2 1.8
Simulation, OBJ 0.1 0.1 0.7 0.1 ms 0.6 0.8 78 ms 0.2 2.6
Visual, GLB 83 ms 90 ms 0.6 0.2 ms 1.3 14 ms 0.1 0.2 2.4
Visual, OBJ 88 ms 93 ms 0.6 0.1 ms 1.3 0.4 0.1 0.2 2.8
Board Repo: loxodes/vna
Board: balun.kicad_pcb
Folder breakouts / balun
Complexity 121 / 1000 (size 81, features 40)
KESE features rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 7, 12, 0
Triangles, simulation 133,858 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.7 MB 196 MB
STEP 24 MB 201 MB
STL 6.7 MB 199 MB
OBJ 13 MB 188 MB
Visual
GLB 2.8 MB 157 MB
OBJ 7.7 MB 158 MB

1515. bias_controller

bias_controller: stages 4 and 6 take 58% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 16 s. Visual, GLB takes 17 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.2 4.2 0.5 ms 4.8 0.2 0.4 0.3 11.4
Simulation, STEP 0.4 1.2 4.4 0.4 ms 4.6 4.0 0.4 0.2 15.3
Simulation, STL 0.5 1.2 4.5 0.4 ms 4.9 0.5 0.4 0.3 12.2
Simulation, OBJ 0.5 1.2 4.3 0.4 ms 5.1 4.4 0.3 0.3 16.1
Visual, GLB 0.5 1.1 4.3 0.5 ms 9.7 0.1 1.0 0.2 17.1
Visual, OBJ 0.5 1.1 4.1 0.4 ms 9.6 3.8 1.4 0.2 20.8
Board Repo: loxodes/vna
Board: bias_controller.kicad_pcb
Folder breakouts / bias_controller / bias_controller
Complexity 134 / 1000 (size 114, features 20)
KESE features slotted holes, rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20231212)
Parts, tracks, vias 201, 0, 0
Triangles, simulation 939,990 in 182 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 544 MB
STEP 180 MB 637 MB
STL 47 MB 519 MB
OBJ 96 MB 642 MB
Visual
GLB 27 MB 603 MB
OBJ 81 MB 636 MB

1516. boosterpack

boosterpack: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 7.8 s. Simulation, STEP takes 9.7 s. Simulation, STL takes 7.8 s. Simulation, OBJ takes 12 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.8 0.3 ms 2.5 0.1 0.4 0.2 7.8
Simulation, STEP 0.2 0.6 3.7 0.3 ms 2.5 2.2 0.4 0.2 9.7
Simulation, STL 0.2 0.6 3.8 0.3 ms 2.4 0.2 0.4 0.3 7.8
Simulation, OBJ 0.2 0.6 3.8 0.2 ms 2.5 4.1 0.4 0.2 11.7
Visual, GLB 0.2 0.6 3.8 0.5 ms 5.1 66 ms 0.5 0.2 10.4
Visual, OBJ 0.2 0.6 3.8 0.3 ms 5.0 2.2 0.6 0.2 12.6
Board Repo: loxodes/vna
Board: boosterpack.kicad_pcb
Folder breakouts / boosterpack
Complexity 177 / 1000 (size 142, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 24, 227, 7
Triangles, simulation 696,784 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 365 MB
STEP 117 MB 387 MB
STL 35 MB 336 MB
OBJ 71 MB 503 MB
Visual
GLB 14 MB 386 MB
OBJ 41 MB 384 MB

1517. clk_lo_buffer

clk_lo_buffer: stages 4 and 6 take 51% to 77% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 4.0 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 4.4 s. Visual, OBJ takes 4.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.1 0.2 ms 1.0 30 ms 0.1 0.2 2.9
Simulation, STEP 0.1 0.4 1.1 0.2 ms 0.9 1.1 0.1 0.2 4.0
Simulation, STL 0.1 0.3 1.1 0.2 ms 0.9 58 ms 88 ms 0.2 2.8
Simulation, OBJ 0.1 0.3 1.0 0.2 ms 1.0 1.1 84 ms 0.2 3.9
Visual, GLB 0.1 0.3 1.1 0.3 ms 2.3 36 ms 0.3 0.2 4.4
Visual, OBJ 0.1 0.3 1.1 0.1 ms 2.0 0.9 0.2 0.2 4.8
Board Repo: loxodes/vna
Board: clk_lo_buffer.kicad_pcb
Folder breakouts / clk_lo_buffer
Complexity 214 / 1000 (size 159, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 44, 318, 48
Triangles, simulation 214,972 in 36 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.9 MB 239 MB
STEP 31 MB 258 MB
STL 11 MB 233 MB
OBJ 22 MB 237 MB
Visual
GLB 6.6 MB 224 MB
OBJ 19 MB 225 MB

1518. coupler_test

coupler_test: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 6.2 s. Simulation, STEP takes 7.6 s. Simulation, STL takes 6.2 s. Simulation, OBJ takes 8.9 s. Visual, GLB takes 6.8 s. Visual, OBJ takes 8.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 2.8 0.2 ms 2.2 84 ms 0.3 0.2 6.2
Simulation, STEP 0.1 0.4 2.6 0.3 ms 2.3 1.6 0.3 0.2 7.6
Simulation, STL 0.1 0.5 2.8 0.4 ms 2.2 0.1 0.3 0.2 6.2
Simulation, OBJ 0.1 0.5 2.6 0.4 ms 2.2 3.0 0.3 0.2 8.9
Visual, GLB 0.1 0.5 2.7 0.3 ms 3.1 30 ms 0.2 0.2 6.8
Visual, OBJ 0.1 0.4 2.8 0.6 ms 3.2 1.1 0.2 0.2 8.1
Board Repo: loxodes/vna
Board: coupler_test.kicad_pcb
Folder breakouts / coupler_test
Complexity 120 / 1000 (size 90, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 4, 10, 0
Triangles, simulation 592,560 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 354 MB
STEP 60 MB 389 MB
STL 30 MB 345 MB
OBJ 58 MB 409 MB
Visual
GLB 7.2 MB 296 MB
OBJ 21 MB 290 MB

1519. cpw_test

cpw_test: stages 4 and 6 take 43% to 63% of a run. Simulation, GLB takes 0.8 s. Simulation, STEP takes 1.0 s. Simulation, STL takes 0.8 s. Simulation, OBJ takes 1.0 s. Visual, GLB takes 1.0 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 62 ms 46 ms 0.2 0.1 ms 0.3 8 ms 29 ms 0.2 0.8
Simulation, STEP 67 ms 55 ms 0.2 0.1 ms 0.3 0.2 32 ms 0.2 1.0
Simulation, STL 71 ms 54 ms 0.2 0.1 ms 0.3 13 ms 29 ms 0.2 0.8
Simulation, OBJ 71 ms 54 ms 0.2 0.1 ms 0.3 0.2 32 ms 0.2 1.0
Visual, GLB 71 ms 60 ms 0.2 0.1 ms 0.5 5 ms 43 ms 0.2 1.0
Visual, OBJ 74 ms 50 ms 0.2 0.2 ms 0.5 97 ms 41 ms 0.2 1.1
Board Repo: loxodes/vna
Board: cpw_test.kicad_pcb
Folder breakouts / cpw_test
Complexity 78 / 1000 (size 68, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 2, 3, 0
Triangles, simulation 40,844 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.3 MB 65 MB
STEP 4.1 MB 69 MB
STL 2.0 MB 66 MB
OBJ 3.7 MB 74 MB
Visual
GLB 731 kB 95 MB
OBJ 2.0 MB 94 MB

1520. crystal_filter

crystal_filter: stages 4 and 6 take 46% to 77% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 96 ms 0.4 0.1 ms 0.5 17 ms 51 ms 0.2 1.4
Simulation, STEP 81 ms 0.1 0.5 0.2 ms 0.5 0.7 53 ms 0.2 2.1
Simulation, STL 0.1 96 ms 0.4 0.1 ms 0.5 23 ms 57 ms 0.2 1.5
Simulation, OBJ 80 ms 0.1 0.4 0.1 ms 0.5 0.6 63 ms 0.2 2.0
Visual, GLB 84 ms 0.1 0.4 0.1 ms 1.1 11 ms 77 ms 0.2 2.0
Visual, OBJ 86 ms 0.1 0.5 0.1 ms 1.0 0.3 67 ms 0.2 2.3
Board Repo: loxodes/vna
Board: crystal_filter.kicad_pcb
Folder breakouts / crystal_filter
Complexity 146 / 1000 (size 111, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 9, 31, 12
Triangles, simulation 99,888 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.6 MB 178 MB
STEP 15 MB 185 MB
STL 5.0 MB 179 MB
OBJ 9.8 MB 181 MB
Visual
GLB 2.2 MB 157 MB
OBJ 6.1 MB 158 MB

1521. demod_breakout

demod_breakout: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 5.8 s. Simulation, STEP takes 7.6 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 9.1 s. Visual, GLB takes 8.8 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.6 0.4 ms 1.8 97 ms 0.3 0.2 5.8
Simulation, STEP 0.2 0.7 2.6 0.3 ms 1.9 1.7 0.3 0.2 7.6
Simulation, STL 0.2 0.6 2.7 0.3 ms 1.9 0.2 0.3 0.2 6.0
Simulation, OBJ 0.2 0.6 2.5 0.3 ms 1.9 3.3 0.3 0.2 9.1
Visual, GLB 0.2 0.7 2.6 0.3 ms 4.5 60 ms 0.5 0.2 8.8
Visual, OBJ 0.2 0.6 2.7 0.3 ms 4.4 2.1 0.5 0.2 10.8
Board Repo: loxodes/vna
Board: demod_breakout.kicad_pcb
Folder breakouts / demod_breakout
Complexity 220 / 1000 (size 185, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 67, 417, 72
Triangles, simulation 649,436 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 330 MB
STEP 85 MB 374 MB
STL 32 MB 340 MB
OBJ 67 MB 482 MB
Visual
GLB 14 MB 371 MB
OBJ 41 MB 371 MB

1522. filter_bank

filter_bank: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 5.1 s. Simulation, STL takes 4.0 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 5.7 s. Visual, OBJ takes 7.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.5 0.2 ms 1.2 69 ms 0.2 0.2 3.7
Simulation, STEP 0.2 0.4 1.7 0.3 ms 1.2 1.2 0.2 0.2 5.1
Simulation, STL 0.1 0.4 1.5 0.3 ms 1.3 0.1 0.2 0.2 4.0
Simulation, OBJ 0.2 0.4 1.5 0.2 ms 1.2 1.9 0.2 0.2 5.5
Visual, GLB 0.2 0.4 1.5 0.3 ms 3.0 36 ms 0.4 0.3 5.7
Visual, OBJ 0.1 0.4 1.5 0.2 ms 3.2 1.3 0.3 0.2 7.0
Board Repo: loxodes/vna
Board: filter_bank.kicad_pcb
Folder breakouts / filter_breakout
Complexity 210 / 1000 (size 175, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 36, 361, 53
Triangles, simulation 321,342 in 56 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 237 MB
STEP 40 MB 260 MB
STL 16 MB 253 MB
OBJ 33 MB 269 MB
Visual
GLB 7.3 MB 235 MB
OBJ 21 MB 237 MB

1523. trl_thru

trl_thru: stages 4 and 6 take 48% to 74% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 3.1 s. Visual, OBJ takes 3.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 0.3 0.8 0.2 ms 0.9 39 ms 0.1 0.2 2.4
Simulation, STEP 96 ms 0.3 0.7 0.1 ms 0.8 0.9 0.1 0.2 3.2
Simulation, STL 92 ms 0.3 0.8 0.1 ms 0.9 70 ms 0.1 0.3 2.5
Simulation, OBJ 98 ms 0.3 0.8 0.1 ms 0.9 1.1 0.1 0.2 3.4
Visual, GLB 0.1 0.3 0.9 0.1 ms 1.5 19 ms 0.1 0.2 3.1
Visual, OBJ 93 ms 0.3 0.8 0.1 ms 1.6 0.6 0.1 0.2 3.6
Board Repo: loxodes/vna
Board: trl_thru.kicad_pcb
Folder breakouts / hmc576_breakout
Complexity 185 / 1000 (size 140, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 10, 55, 27
Triangles, simulation 254,354 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.6 MB 236 MB
STEP 27 MB 244 MB
STL 13 MB 254 MB
OBJ 25 MB 229 MB
Visual
GLB 4.1 MB 184 MB
OBJ 12 MB 184 MB

1524. hyperram_3p3v

hyperram_3p3v: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 3.2 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.6 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 84 ms 0.3 1.3 0.2 ms 1.1 51 ms 0.2 0.2 3.2
Simulation, STEP 92 ms 0.3 1.3 0.2 ms 1.0 1.0 0.2 0.2 4.1
Simulation, STL 0.1 0.3 1.3 0.2 ms 1.1 81 ms 0.2 0.2 3.2
Simulation, OBJ 0.1 0.3 1.2 0.2 ms 1.0 1.5 0.2 0.2 4.6
Visual, GLB 91 ms 0.3 1.3 0.2 ms 1.9 24 ms 0.2 0.2 4.0
Visual, OBJ 96 ms 0.3 1.2 0.5 ms 1.8 0.6 0.1 0.2 4.3
Board Repo: loxodes/vna
Board: hyperram_3p3v.kicad_pcb
Folder breakouts / hyperram / hyperram_3p3v
Complexity 184 / 1000 (size 139, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 129, 16
Triangles, simulation 371,994 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 245 MB
STEP 48 MB 263 MB
STL 19 MB 246 MB
OBJ 37 MB 289 MB
Visual
GLB 5.4 MB 225 MB
OBJ 16 MB 224 MB

1525. launchpad_synthcontrol

launchpad_synthcontrol: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 5.4 s. Simulation, STEP takes 6.9 s. Simulation, STL takes 5.6 s. Simulation, OBJ takes 8.2 s. Visual, GLB takes 7.5 s. Visual, OBJ takes 8.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 2.5 0.4 ms 1.8 77 ms 0.2 0.2 5.4
Simulation, STEP 0.1 0.5 2.4 0.6 ms 1.8 1.7 0.2 0.3 6.9
Simulation, STL 0.1 0.4 2.5 0.4 ms 1.8 0.2 0.3 0.3 5.6
Simulation, OBJ 0.1 0.5 2.6 0.4 ms 1.9 2.7 0.3 0.2 8.2
Visual, GLB 0.1 0.4 2.5 0.4 ms 3.7 60 ms 0.5 0.2 7.5
Visual, OBJ 0.1 0.4 2.6 0.4 ms 3.7 1.5 0.4 0.2 8.9
Board Repo: loxodes/vna
Board: launchpad_synthcontrol.kicad_pcb
Folder breakouts / launchpad_synthcontrol
Complexity 147 / 1000 (size 132, features 15)
KESE features through vias
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 2, 308, 84
Triangles, simulation 603,278 in 50 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 306 MB
STEP 92 MB 354 MB
STL 30 MB 309 MB
OBJ 61 MB 435 MB
Visual
GLB 12 MB 342 MB
OBJ 35 MB 345 MB

1526. maam_011109

maam_011109: stages 4 and 6 take 46% to 78% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 3.9 s. Simulation, STL takes 3.0 s. Simulation, OBJ takes 4.4 s. Visual, GLB takes 3.8 s. Visual, OBJ takes 4.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.0 0.1 ms 1.0 45 ms 0.2 0.2 2.9
Simulation, STEP 0.1 0.3 1.1 0.1 ms 1.0 1.1 0.1 0.2 3.9
Simulation, STL 0.1 0.3 1.2 0.1 ms 1.0 68 ms 0.2 0.2 3.0
Simulation, OBJ 0.1 0.3 1.1 0.1 ms 1.0 1.6 0.2 0.2 4.4
Visual, GLB 0.1 0.3 1.1 0.1 ms 1.9 26 ms 0.2 0.3 3.8
Visual, OBJ 97 ms 0.3 1.0 0.2 ms 1.7 0.6 0.1 0.2 4.0
Board Repo: loxodes/vna
Board: maam_011109.kicad_pcb
Folder breakouts / maam_011109 / maam_011109
Complexity 188 / 1000 (size 143, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 51, 47
Triangles, simulation 316,726 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 247 MB
STEP 31 MB 265 MB
STL 16 MB 268 MB
OBJ 31 MB 271 MB
Visual
GLB 4.4 MB 210 MB
OBJ 12 MB 214 MB

1527. maam_011109_bias

maam_011109_bias: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 4.6 s. Simulation, STEP takes 5.7 s. Simulation, STL takes 4.4 s. Simulation, OBJ takes 6.3 s. Visual, GLB takes 6.8 s. Visual, OBJ takes 7.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 1.7 0.3 ms 1.4 61 ms 0.2 0.3 4.6
Simulation, STEP 0.2 0.7 1.8 0.2 ms 1.3 1.3 0.2 0.2 5.7
Simulation, STL 0.2 0.7 1.7 0.3 ms 1.3 0.1 0.2 0.2 4.4
Simulation, OBJ 0.2 0.7 1.8 0.4 ms 1.3 1.9 0.2 0.3 6.3
Visual, GLB 0.2 0.7 1.8 0.2 ms 3.5 47 ms 0.4 0.2 6.8
Visual, OBJ 0.2 0.7 1.8 0.3 ms 3.3 1.2 0.3 0.3 7.8
Board Repo: loxodes/vna
Board: maam_011109_bias.kicad_pcb
Folder breakouts / maam_011109_bias
Complexity 202 / 1000 (size 157, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 48, 287, 36
Triangles, simulation 368,514 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 279 MB
STEP 63 MB 305 MB
STL 18 MB 288 MB
OBJ 38 MB 315 MB
Visual
GLB 9.6 MB 274 MB
OBJ 28 MB 281 MB

1528. mixer_breakout

mixer_breakout: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 3.0 s. Simulation, OBJ takes 4.5 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.2 0.2 ms 1.0 52 ms 0.2 0.2 3.1
Simulation, STEP 0.1 0.3 1.2 0.1 ms 1.0 1.1 0.1 0.2 4.1
Simulation, STL 0.1 0.3 1.2 0.1 ms 1.0 68 ms 0.1 0.2 3.0
Simulation, OBJ 0.1 0.3 1.3 0.2 ms 1.0 1.5 0.1 0.2 4.5
Visual, GLB 0.1 0.3 1.2 0.2 ms 2.0 23 ms 0.1 0.3 4.0
Visual, OBJ 0.1 0.3 1.2 0.2 ms 2.0 0.8 0.2 0.2 4.7
Board Repo: loxodes/vna
Board: mixer_breakout.kicad_pcb
Folder breakouts / mixer_breakout
Complexity 170 / 1000 (size 135, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 11, 88, 2
Triangles, simulation 306,878 in 24 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 244 MB
STEP 35 MB 267 MB
STL 15 MB 242 MB
OBJ 31 MB 253 MB
Visual
GLB 5.3 MB 211 MB
OBJ 15 MB 214 MB

1529. pe42520_breakout

pe42520_breakout: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 5.6 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 5.6 s. Simulation, OBJ takes 8.8 s. Visual, GLB takes 7.9 s. Visual, OBJ takes 9.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 2.1 0.2 ms 2.2 0.1 0.3 0.2 5.6
Simulation, STEP 0.1 0.5 2.1 0.2 ms 2.3 1.4 0.3 0.2 6.8
Simulation, STL 0.1 0.5 2.1 0.2 ms 2.2 0.1 0.3 0.2 5.6
Simulation, OBJ 0.1 0.6 2.2 0.2 ms 2.3 3.0 0.3 0.2 8.8
Visual, GLB 0.1 0.5 1.9 0.2 ms 4.8 43 ms 0.3 0.2 7.9
Visual, OBJ 0.1 0.6 2.3 0.2 ms 4.6 1.3 0.4 0.2 9.4
Board Repo: loxodes/vna
Board: pe42520_breakout.kicad_pcb
Folder breakouts / pe42540_breakout
Complexity 210 / 1000 (size 190, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 19, 83, 0
Triangles, simulation 614,274 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 21 MB 344 MB
STEP 46 MB 413 MB
STL 31 MB 348 MB
OBJ 61 MB 450 MB
Visual
GLB 9.2 MB 314 MB
OBJ 27 MB 315 MB

1530. pe42543_breakout

pe42543_breakout: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 5.6 s. Simulation, STL takes 4.3 s. Simulation, OBJ takes 6.2 s. Visual, GLB takes 4.9 s. Visual, OBJ takes 5.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 1.6 0.2 ms 1.7 59 ms 0.2 0.2 4.3
Simulation, STEP 0.2 0.6 1.6 0.2 ms 1.6 1.2 0.2 0.2 5.6
Simulation, STL 0.2 0.5 1.6 0.2 ms 1.6 0.1 0.2 0.2 4.3
Simulation, OBJ 0.1 0.5 1.7 0.2 ms 1.5 2.0 0.2 0.2 6.2
Visual, GLB 0.1 0.4 1.6 0.3 ms 2.4 29 ms 0.2 0.2 4.9
Visual, OBJ 0.1 0.5 1.7 0.2 ms 2.4 0.8 0.2 0.2 5.8
Board Repo: loxodes/vna
Board: pe42543_breakout.kicad_pcb
Folder breakouts / pe42543_breakout
Complexity 197 / 1000 (size 152, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 21, 106, 23
Triangles, simulation 427,902 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 279 MB
STEP 45 MB 315 MB
STL 21 MB 276 MB
OBJ 43 MB 345 MB
Visual
GLB 6.0 MB 240 MB
OBJ 18 MB 238 MB

1531. powerdet_breakout

powerdet_breakout: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 2.1 s. Simulation, STEP takes 2.9 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 2.9 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.2 ms 0.7 29 ms 91 ms 0.2 2.1
Simulation, STEP 0.1 0.2 0.7 0.2 ms 0.7 0.9 93 ms 0.2 2.9
Simulation, STL 0.1 0.2 0.8 0.3 ms 0.7 49 ms 0.1 0.2 2.2
Simulation, OBJ 0.1 0.2 0.7 0.2 ms 0.7 0.9 83 ms 0.2 2.9
Visual, GLB 0.1 0.2 0.7 0.2 ms 1.6 20 ms 0.1 0.2 2.9
Visual, OBJ 0.1 0.2 0.8 0.2 ms 1.7 0.5 0.2 0.2 3.7
Board Repo: loxodes/vna
Board: powerdet_breakout.kicad_pcb
Folder breakouts / powerdet_breakout
Complexity 193 / 1000 (size 158, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 26, 157, 25
Triangles, simulation 202,000 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.2 MB 210 MB
STEP 26 MB 223 MB
STL 10 MB 208 MB
OBJ 20 MB 209 MB
Visual
GLB 4.7 MB 186 MB
OBJ 13 MB 187 MB

1532. refclk_breakout

refclk_breakout: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 2.0 s. Simulation, STEP takes 2.8 s. Simulation, STL takes 2.1 s. Simulation, OBJ takes 2.9 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 94 ms 0.2 0.6 0.2 ms 0.7 28 ms 99 ms 0.2 2.0
Simulation, STEP 87 ms 0.2 0.7 0.1 ms 0.7 0.8 0.1 0.2 2.8
Simulation, STL 90 ms 0.2 0.7 0.5 ms 0.7 37 ms 0.1 0.2 2.1
Simulation, OBJ 92 ms 0.2 0.6 0.1 ms 0.8 0.9 0.1 0.2 2.9
Visual, GLB 87 ms 0.2 0.7 0.2 ms 1.4 16 ms 0.2 0.2 2.7
Visual, OBJ 89 ms 0.2 0.6 0.2 ms 1.3 0.5 0.1 0.2 3.0
Board Repo: loxodes/vna
Board: refclk_breakout.kicad_pcb
Folder breakouts / refclk_breakout
Complexity 176 / 1000 (size 141, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 13, 92, 10
Triangles, simulation 184,948 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.3 MB 194 MB
STEP 26 MB 208 MB
STL 9.2 MB 196 MB
OBJ 18 MB 195 MB
Visual
GLB 3.5 MB 163 MB
OBJ 9.9 MB 162 MB

1533. trl_thru

trl_thru: stages 4 and 6 take 52% to 76% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.6 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.8 0.1 ms 1.2 47 ms 0.1 0.3 2.7
Simulation, STEP 95 ms 0.2 0.7 0.1 ms 1.1 1.0 0.1 0.3 3.5
Simulation, STL 0.1 0.2 0.9 0.1 ms 1.1 59 ms 0.1 0.2 2.7
Simulation, OBJ 97 ms 0.2 0.8 0.1 ms 1.1 1.0 0.1 0.2 3.6
Visual, GLB 99 ms 0.2 0.7 0.1 ms 1.4 15 ms 97 ms 0.2 2.8
Visual, OBJ 0.1 0.2 0.7 0.1 ms 1.4 0.3 64 ms 0.3 3.1
Board Repo: loxodes/vna
Board: trl_thru.kicad_pcb
Folder breakouts / res_splitter
Complexity 147 / 1000 (size 102, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 4, 13, 3
Triangles, simulation 174,854 in 17 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.9 MB 209 MB
STEP 15 MB 227 MB
STL 8.7 MB 206 MB
OBJ 17 MB 208 MB
Visual
GLB 1.8 MB 166 MB
OBJ 5.1 MB 169 MB

1534. sequencing_ltc2937

sequencing_ltc2937: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 21 s. Simulation, STL takes 17 s. Simulation, OBJ takes 27 s. Visual, GLB takes 26 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.5 7.3 0.4 ms 6.2 0.3 0.8 0.3 17.8
Simulation, STEP 0.4 2.4 7.4 0.4 ms 6.0 4.0 0.6 0.3 21.2
Simulation, STL 0.4 2.5 7.0 0.9 ms 5.9 0.6 0.7 0.3 17.3
Simulation, OBJ 0.4 2.4 7.3 0.3 ms 5.9 10.1 0.8 0.3 27.2
Visual, GLB 0.4 2.2 7.2 0.6 ms 14.1 0.2 1.4 0.3 25.9
Visual, OBJ 0.5 2.4 7.4 0.5 ms 14.8 6.7 1.7 0.3 33.8
Board Repo: loxodes/vna
Board: sequencing_ltc2937.kicad_pcb
Folder breakouts / sequencing_ltc2937
Complexity 308 / 1000 (size 263, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 127, 1,208, 292
Triangles, simulation 1,853,264 in 101 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 678 MB
STEP 232 MB 793 MB
STL 93 MB 692 MB
OBJ 195 MB 1.3 GB
Visual
GLB 40 MB 792 MB
OBJ 122 MB 909 MB

1535. sot89_amp_test

sot89_amp_test: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 5.0 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 5.1 s. Simulation, OBJ takes 7.6 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 8.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.4 0.2 ms 2.2 78 ms 0.2 0.2 5.0
Simulation, STEP 0.2 0.7 1.6 0.1 ms 2.3 1.2 0.2 0.2 6.3
Simulation, STL 0.2 0.7 1.4 0.2 ms 2.3 0.2 0.2 0.2 5.1
Simulation, OBJ 0.1 0.6 1.5 0.1 ms 2.3 2.7 0.2 0.2 7.6
Visual, GLB 0.1 0.6 1.5 0.1 ms 3.5 42 ms 0.3 0.2 6.3
Visual, OBJ 0.2 0.8 1.5 0.2 ms 3.5 1.5 0.3 0.2 8.0
Board Repo: loxodes/vna
Board: sot89_amp_test.kicad_pcb
Folder breakouts / sot89_amp_test
Complexity 180 / 1000 (size 135, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 20, 38, 9
Triangles, simulation 549,398 in 25 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 353 MB
STEP 27 MB 399 MB
STL 27 MB 352 MB
OBJ 54 MB 404 MB
Visual
GLB 9.9 MB 350 MB
OBJ 29 MB 354 MB

1536. splitter_breakout

splitter_breakout: stages 4 and 6 take 49% to 82% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.0 s. Simulation, STL takes 2.1 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 0.2 0.6 0.2 ms 1.0 35 ms 0.1 0.2 2.2
Simulation, STEP 92 ms 0.2 0.6 0.1 ms 0.9 0.9 0.1 0.2 3.0
Simulation, STL 91 ms 0.1 0.7 0.1 ms 0.8 58 ms 99 ms 0.2 2.1
Simulation, OBJ 86 ms 0.2 0.7 0.1 ms 0.8 1.0 0.1 0.2 3.1
Visual, GLB 79 ms 0.2 0.7 0.1 ms 1.8 16 ms 0.1 0.2 3.0
Visual, OBJ 78 ms 0.2 0.8 0.1 ms 1.7 0.4 0.1 0.2 3.4
Board Repo: loxodes/vna
Board: splitter_breakout.kicad_pcb
Folder breakouts / splitter_breakout
Complexity 115 / 1000 (size 95, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 4, 14, 0
Triangles, simulation 257,954 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.6 MB 230 MB
STEP 23 MB 256 MB
STL 13 MB 244 MB
OBJ 25 MB 246 MB
Visual
GLB 3.6 MB 189 MB
OBJ 10 MB 185 MB

1537. siw

siw: stages 4 and 6 take 50% to 75% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 1.6 s. Visual, OBJ takes 1.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 78 ms 84 ms 0.4 0.1 ms 0.6 18 ms 75 ms 0.2 1.5
Simulation, STEP 73 ms 85 ms 0.5 0.1 ms 0.6 0.7 52 ms 0.2 2.2
Simulation, STL 80 ms 0.1 0.4 0.1 ms 0.6 25 ms 58 ms 0.2 1.5
Simulation, OBJ 75 ms 0.1 0.4 0.1 ms 0.6 0.5 56 ms 0.2 1.9
Visual, GLB 78 ms 89 ms 0.4 0.2 ms 0.8 6 ms 44 ms 0.2 1.6
Visual, OBJ 81 ms 97 ms 0.4 0.1 ms 0.8 0.2 38 ms 0.2 1.7
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / lpf_20ghz
Complexity 108 / 1000 (size 78, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 5, 0
Triangles, simulation 105,776 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 192 MB
STEP 8.5 MB 196 MB
STL 5.3 MB 192 MB
OBJ 9.9 MB 188 MB
Visual
GLB 969 kB 156 MB
OBJ 2.7 MB 153 MB

1538. siw

siw: stages 4 and 6 take 44% to 75% of a run. Simulation, GLB takes 1.6 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 1.9 s. Visual, OBJ takes 2.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 92 ms 0.1 0.4 0.2 ms 0.6 19 ms 56 ms 0.2 1.6
Simulation, STEP 95 ms 95 ms 0.4 0.2 ms 0.6 0.8 71 ms 0.2 2.3
Simulation, STL 85 ms 98 ms 0.4 0.1 ms 0.6 29 ms 66 ms 0.2 1.5
Simulation, OBJ 79 ms 96 ms 0.4 0.2 ms 0.6 0.5 66 ms 0.2 2.0
Visual, GLB 83 ms 0.1 0.4 0.2 ms 1.0 7 ms 61 ms 0.2 1.9
Visual, OBJ 81 ms 98 ms 0.5 0.2 ms 0.9 0.1 60 ms 0.2 2.0
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / lpf_8ghz
Complexity 108 / 1000 (size 78, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 5, 0
Triangles, simulation 104,500 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 183 MB
STEP 8.4 MB 197 MB
STL 5.2 MB 191 MB
OBJ 9.7 MB 191 MB
Visual
GLB 969 kB 156 MB
OBJ 2.7 MB 154 MB

1539. siw

siw: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 3.0 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 3.0 s. Simulation, OBJ takes 4.4 s. Visual, GLB takes 3.5 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 0.3 1.2 0.2 ms 1.0 60 ms 0.2 0.2 3.0
Simulation, STEP 96 ms 0.3 1.2 0.2 ms 1.0 1.1 0.2 0.2 4.1
Simulation, STL 94 ms 0.3 1.3 0.2 ms 0.9 73 ms 0.1 0.2 3.0
Simulation, OBJ 99 ms 0.3 1.2 0.2 ms 1.1 1.5 0.1 0.2 4.4
Visual, GLB 96 ms 0.3 1.3 0.2 ms 1.5 16 ms 90 ms 0.2 3.5
Visual, OBJ 88 ms 0.3 1.2 0.2 ms 1.4 0.5 86 ms 0.2 3.7
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / siw
Complexity 105 / 1000 (size 75, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 4, 0
Triangles, simulation 305,108 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 253 MB
STEP 32 MB 270 MB
STL 15 MB 255 MB
OBJ 30 MB 257 MB
Visual
GLB 3.1 MB 186 MB
OBJ 8.9 MB 186 MB

1540. siw

siw: stages 4 and 6 take 49% to 76% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.4 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 85 ms 0.1 0.5 0.2 ms 0.8 21 ms 75 ms 0.2 1.8
Simulation, STEP 86 ms 0.1 0.4 0.1 ms 0.7 0.7 63 ms 0.3 2.4
Simulation, STL 85 ms 0.1 0.4 0.1 ms 0.9 29 ms 66 ms 0.3 1.8
Simulation, OBJ 90 ms 0.1 0.5 0.1 ms 0.7 0.6 72 ms 0.3 2.4
Visual, GLB 91 ms 0.1 0.5 0.1 ms 1.0 7 ms 44 ms 0.2 2.0
Visual, OBJ 0.1 0.1 0.5 0.2 ms 0.9 0.2 41 ms 0.2 2.0
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_0402_series
Complexity 110 / 1000 (size 80, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 6, 0
Triangles, simulation 106,076 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.6 MB 186 MB
STEP 8.5 MB 197 MB
STL 5.3 MB 181 MB
OBJ 9.9 MB 186 MB
Visual
GLB 985 kB 156 MB
OBJ 2.8 MB 156 MB

1541. siw

siw: stages 4 and 6 take 43% to 66% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 1.9 s. Simulation, STL takes 1.2 s. Simulation, OBJ takes 1.5 s. Visual, GLB takes 1.3 s. Visual, OBJ takes 1.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 76 ms 0.2 0.1 ms 0.5 12 ms 44 ms 0.3 1.3
Simulation, STEP 74 ms 77 ms 0.3 0.2 ms 0.5 0.7 40 ms 0.2 1.9
Simulation, STL 78 ms 70 ms 0.2 0.1 ms 0.5 18 ms 44 ms 0.2 1.2
Simulation, OBJ 91 ms 81 ms 0.2 0.1 ms 0.5 0.3 43 ms 0.3 1.5
Visual, GLB 80 ms 83 ms 0.2 0.2 ms 0.6 6 ms 47 ms 0.2 1.3
Visual, OBJ 85 ms 82 ms 0.3 0.1 ms 0.6 0.1 42 ms 0.3 1.5
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_0402_shunt
Complexity 109 / 1000 (size 79, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 7, 0
Triangles, simulation 63,998 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 2.2 MB 73 MB
STEP 5.3 MB 176 MB
STL 3.2 MB 74 MB
OBJ 6.0 MB 99 MB
Visual
GLB 760 kB 100 MB
OBJ 2.1 MB 101 MB

1542. siw

siw: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 3.4 s. Visual, OBJ takes 3.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.3 ms 0.9 53 ms 0.2 0.2 2.7
Simulation, STEP 98 ms 0.2 0.9 0.2 ms 1.0 1.1 0.1 0.2 3.7
Simulation, STL 0.1 0.3 0.9 0.2 ms 1.0 70 ms 0.1 0.2 2.7
Simulation, OBJ 0.1 0.2 0.9 0.1 ms 0.9 1.2 0.1 0.2 3.8
Visual, GLB 0.1 0.3 1.0 0.1 ms 1.7 17 ms 0.1 0.2 3.4
Visual, OBJ 0.1 0.2 0.9 0.1 ms 1.7 0.5 0.1 0.3 3.8
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_admv
Complexity 214 / 1000 (size 169, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 5, 98, 2
Triangles, simulation 276,854 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.5 MB 247 MB
STEP 29 MB 254 MB
STL 14 MB 244 MB
OBJ 27 MB 241 MB
Visual
GLB 4.0 MB 193 MB
OBJ 11 MB 190 MB

1543. siw

siw: stages 4 and 6 take 47% to 75% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.3 s. Simulation, STL takes 1.7 s. Simulation, OBJ takes 2.3 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 84 ms 0.1 0.5 0.1 ms 0.8 22 ms 76 ms 0.2 1.8
Simulation, STEP 84 ms 0.1 0.4 0.1 ms 0.6 0.7 65 ms 0.2 2.3
Simulation, STL 75 ms 0.1 0.4 0.1 ms 0.8 35 ms 68 ms 0.2 1.7
Simulation, OBJ 86 ms 0.1 0.4 0.1 ms 0.8 0.6 68 ms 0.2 2.3
Visual, GLB 81 ms 0.1 0.4 0.1 ms 1.0 10 ms 62 ms 0.2 2.0
Visual, OBJ 80 ms 0.1 0.4 0.1 ms 1.0 0.2 54 ms 0.2 2.1
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_att_hmc
Complexity 114 / 1000 (size 84, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 3, 8, 0
Triangles, simulation 139,976 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.7 MB 194 MB
STEP 11 MB 203 MB
STL 7.0 MB 194 MB
OBJ 13 MB 194 MB
Visual
GLB 1.6 MB 157 MB
OBJ 4.5 MB 157 MB

1544. siw

siw: stages 4 and 6 take 45% to 75% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.1 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.8 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 87 ms 0.1 0.4 0.1 ms 0.6 18 ms 59 ms 0.2 1.5
Simulation, STEP 78 ms 97 ms 0.4 0.2 ms 0.6 0.7 55 ms 0.2 2.1
Simulation, STL 80 ms 95 ms 0.4 0.1 ms 0.6 27 ms 57 ms 0.2 1.4
Simulation, OBJ 74 ms 86 ms 0.4 0.1 ms 0.6 0.4 60 ms 0.2 1.8
Visual, GLB 79 ms 94 ms 0.4 0.1 ms 0.9 6 ms 46 ms 0.2 1.8
Visual, OBJ 78 ms 92 ms 0.4 0.1 ms 0.8 0.2 57 ms 0.2 1.8
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_line_10p5mm
Complexity 107 / 1000 (size 77, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 6, 0
Triangles, simulation 104,984 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 193 MB
STEP 8.3 MB 195 MB
STL 5.3 MB 194 MB
OBJ 9.8 MB 193 MB
Visual
GLB 956 kB 155 MB
OBJ 2.7 MB 154 MB

1545. siw

siw: stages 4 and 6 take 46% to 72% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 1.8 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 82 ms 93 ms 0.4 0.1 ms 0.6 17 ms 56 ms 0.2 1.4
Simulation, STEP 75 ms 82 ms 0.4 0.1 ms 0.6 0.8 55 ms 0.2 2.2
Simulation, STL 76 ms 93 ms 0.5 0.2 ms 0.6 24 ms 57 ms 0.2 1.5
Simulation, OBJ 71 ms 88 ms 0.4 0.2 ms 0.6 0.5 67 ms 0.2 1.8
Visual, GLB 78 ms 88 ms 0.4 0.2 ms 0.8 7 ms 54 ms 0.2 1.7
Visual, OBJ 75 ms 86 ms 0.4 0.1 ms 0.8 0.1 42 ms 0.2 1.8
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_line_20mm
Complexity 105 / 1000 (size 75, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 5, 0
Triangles, simulation 104,820 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 183 MB
STEP 8.3 MB 194 MB
STL 5.2 MB 185 MB
OBJ 9.8 MB 184 MB
Visual
GLB 943 kB 157 MB
OBJ 2.6 MB 157 MB

1546. siw

siw: stages 4 and 6 take 44% to 72% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.0 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 82 ms 97 ms 0.4 0.1 ms 0.6 19 ms 68 ms 0.2 1.5
Simulation, STEP 0.1 98 ms 0.4 0.1 ms 0.6 0.8 63 ms 0.3 2.4
Simulation, STL 98 ms 0.1 0.5 0.2 ms 0.7 40 ms 76 ms 0.3 1.8
Simulation, OBJ 0.1 0.1 0.4 0.2 ms 0.7 0.6 72 ms 0.3 2.2
Visual, GLB 0.1 0.1 0.5 0.2 ms 1.0 9 ms 58 ms 0.2 2.0
Visual, OBJ 85 ms 0.1 0.5 0.1 ms 1.0 0.2 41 ms 0.2 2.1
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_line_2mm
Complexity 105 / 1000 (size 75, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 5, 0
Triangles, simulation 104,412 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 183 MB
STEP 8.2 MB 195 MB
STL 5.2 MB 184 MB
OBJ 9.7 MB 188 MB
Visual
GLB 932 kB 155 MB
OBJ 2.6 MB 157 MB

1547. siw

siw: stages 4 and 6 take 51% to 66% of a run. Simulation, GLB takes 1.0 s. Simulation, STEP takes 1.3 s. Simulation, STL takes 1.1 s. Simulation, OBJ takes 1.2 s. Visual, GLB takes 1.0 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 63 ms 46 ms 0.2 0.1 ms 0.4 9 ms 37 ms 0.2 1.0
Simulation, STEP 74 ms 61 ms 0.2 0.1 ms 0.4 0.3 37 ms 0.2 1.3
Simulation, STL 70 ms 57 ms 0.2 0.1 ms 0.4 14 ms 36 ms 0.2 1.1
Simulation, OBJ 66 ms 54 ms 0.2 0.1 ms 0.4 0.2 33 ms 0.2 1.2
Visual, GLB 65 ms 52 ms 0.2 0.1 ms 0.4 4 ms 29 ms 0.2 1.0
Visual, OBJ 77 ms 49 ms 0.2 0.1 ms 0.5 84 ms 37 ms 0.2 1.1
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_reflect
Complexity 97 / 1000 (size 67, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 1, 4, 0
Triangles, simulation 53,820 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.8 MB 70 MB
STEP 4.3 MB 74 MB
STL 2.7 MB 71 MB
OBJ 5.0 MB 82 MB
Visual
GLB 514 kB 89 MB
OBJ 1.4 MB 90 MB

1548. siw

siw: stages 4 and 6 take 45% to 74% of a run. Simulation, GLB takes 1.3 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.4 s. Simulation, OBJ takes 1.9 s. Visual, GLB takes 1.7 s. Visual, OBJ takes 1.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 88 ms 0.4 0.2 ms 0.5 15 ms 55 ms 0.2 1.3
Simulation, STEP 80 ms 97 ms 0.4 0.1 ms 0.6 0.8 60 ms 0.2 2.2
Simulation, STL 76 ms 88 ms 0.4 0.1 ms 0.5 28 ms 60 ms 0.2 1.4
Simulation, OBJ 81 ms 92 ms 0.4 0.2 ms 0.6 0.5 60 ms 0.2 1.9
Visual, GLB 92 ms 0.1 0.4 0.1 ms 0.9 6 ms 37 ms 0.2 1.7
Visual, OBJ 77 ms 93 ms 0.4 0.1 ms 0.8 98 ms 45 ms 0.2 1.8
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_thru
Complexity 102 / 1000 (size 72, features 30)
KESE features rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 4, 0
Triangles, simulation 103,060 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.4 MB 188 MB
STEP 8.0 MB 191 MB
STL 5.2 MB 190 MB
OBJ 9.6 MB 192 MB
Visual
GLB 927 kB 154 MB
OBJ 2.6 MB 155 MB

1549. siw

siw: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 3.5 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.0 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 1.3 0.2 ms 1.2 61 ms 0.2 0.3 3.5
Simulation, STEP 0.1 0.3 1.2 0.1 ms 1.2 1.2 0.2 0.2 4.4
Simulation, STL 0.1 0.4 1.2 0.2 ms 1.3 62 ms 0.2 0.3 3.5
Simulation, OBJ 0.2 0.3 1.1 0.1 ms 1.4 1.5 0.2 0.2 5.0
Visual, GLB 0.1 0.3 1.1 0.2 ms 2.1 21 ms 0.1 0.3 4.0
Visual, OBJ 0.1 0.3 1.1 0.5 ms 2.0 0.6 0.1 0.3 4.5
Board Repo: loxodes/vna
Board: siw.kicad_pcb
Folder breakouts / sw_edge_fr408_oshpark / trl_vatt
Complexity 177 / 1000 (size 132, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 7, 95, 3
Triangles, simulation 234,680 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.0 MB 214 MB
STEP 25 MB 235 MB
STL 12 MB 215 MB
OBJ 23 MB 214 MB
Visual
GLB 3.3 MB 172 MB
OBJ 9.3 MB 171 MB

1550. switch_breakout

switch_breakout: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.8 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 4.2 s. Visual, GLB takes 4.3 s. Visual, OBJ takes 4.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 95 ms 0.2 1.0 0.1 ms 1.1 42 ms 0.1 0.2 2.8
Simulation, STEP 89 ms 0.2 1.1 0.2 ms 1.2 0.9 0.2 0.2 3.8
Simulation, STL 90 ms 0.2 1.0 0.1 ms 1.0 70 ms 0.1 0.2 2.7
Simulation, OBJ 86 ms 0.2 1.0 0.1 ms 1.1 1.4 0.2 0.2 4.2
Visual, GLB 0.1 0.2 1.0 0.1 ms 2.5 29 ms 0.2 0.2 4.3
Visual, OBJ 0.1 0.2 1.0 0.1 ms 2.4 0.7 0.2 0.2 4.8
Board Repo: loxodes/vna
Board: switch_breakout.kicad_pcb
Folder breakouts / switch_breakout
Complexity 163 / 1000 (size 128, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 10, 54, 4
Triangles, simulation 371,498 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 279 MB
STEP 35 MB 311 MB
STL 19 MB 279 MB
OBJ 36 MB 280 MB
Visual
GLB 6.2 MB 262 MB
OBJ 18 MB 256 MB

1551. synth

synth: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 6.7 s. Simulation, STL takes 5.3 s. Simulation, OBJ takes 8.2 s. Visual, GLB takes 8.1 s. Visual, OBJ takes 10 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.3 0.3 ms 1.8 98 ms 0.2 0.2 5.3
Simulation, STEP 0.2 0.6 2.3 0.3 ms 1.8 1.6 0.2 0.2 6.7
Simulation, STL 0.2 0.6 2.2 0.3 ms 1.7 0.1 0.2 0.2 5.3
Simulation, OBJ 0.2 0.6 2.4 0.3 ms 1.8 2.8 0.2 0.2 8.2
Visual, GLB 0.2 0.6 2.3 0.3 ms 4.2 57 ms 0.5 0.2 8.1
Visual, OBJ 0.2 0.6 2.4 0.2 ms 4.5 1.8 0.6 0.2 10.3
Board Repo: loxodes/vna
Board: synth.kicad_pcb
Folder breakouts / synth
Complexity 261 / 1000 (size 226, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 79, 391, 73
Triangles, simulation 656,202 in 59 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 339 MB
STEP 88 MB 377 MB
STL 33 MB 352 MB
OBJ 68 MB 467 MB
Visual
GLB 14 MB 389 MB
OBJ 42 MB 389 MB

1552. cpw_test

cpw_test: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 4.8 s. Simulation, STL takes 3.8 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 5.1 s. Visual, OBJ takes 5.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 90 ms 0.3 1.6 0.2 ms 1.4 58 ms 0.2 0.2 3.7
Simulation, STEP 90 ms 0.3 1.5 0.5 ms 1.3 1.2 0.2 0.2 4.8
Simulation, STL 92 ms 0.3 1.5 0.2 ms 1.4 0.1 0.2 0.2 3.8
Simulation, OBJ 90 ms 0.3 1.5 0.3 ms 1.3 1.9 0.2 0.2 5.5
Visual, GLB 89 ms 0.3 1.6 0.2 ms 2.7 24 ms 0.2 0.2 5.1
Visual, OBJ 89 ms 0.3 1.5 0.3 ms 2.7 0.7 0.2 0.2 5.7
Board Repo: loxodes/vna
Board: cpw_test.kicad_pcb
Folder breakouts / ufl_test
Complexity 133 / 1000 (size 98, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 2, 6, 6
Triangles, simulation 453,202 in 13 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 322 MB
STEP 41 MB 362 MB
STL 23 MB 318 MB
OBJ 45 MB 356 MB
Visual
GLB 6.0 MB 257 MB
OBJ 17 MB 256 MB

1553. usb_pd

usb_pd: stages 4 and 6 take 46% to 76% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.7 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 4.1 s. Visual, OBJ takes 5.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.2 ms 0.8 37 ms 0.1 0.2 2.5
Simulation, STEP 0.2 0.3 0.8 0.2 ms 1.0 1.1 0.1 0.2 3.7
Simulation, STL 0.2 0.3 0.9 0.3 ms 0.9 70 ms 0.1 0.2 2.7
Simulation, OBJ 0.2 0.3 0.9 0.4 ms 0.9 1.4 0.1 0.2 3.9
Visual, GLB 0.2 0.3 1.0 0.2 ms 2.2 31 ms 0.2 0.2 4.1
Visual, OBJ 0.1 0.3 0.9 0.2 ms 2.3 0.9 0.3 0.2 5.0
Board Repo: loxodes/vna
Board: usb_pd.kicad_pcb
Folder breakouts / usb_pd / usb_pd
Complexity 263 / 1000 (size 163, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210606)
Parts, tracks, vias 29, 149, 43
Triangles, simulation 294,948 in 34 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.9 MB 232 MB
STEP 39 MB 270 MB
STL 15 MB 245 MB
OBJ 29 MB 258 MB
Visual
GLB 7.0 MB 240 MB
OBJ 20 MB 237 MB

1554. demod_module

demod_module: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 8.5 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 13 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 3.6 0.6 ms 3.1 0.1 0.3 0.2 8.5
Simulation, STEP 0.2 0.9 3.7 0.8 ms 2.8 2.0 0.3 0.2 10.1
Simulation, STL 0.2 0.9 3.4 0.3 ms 3.0 0.3 0.3 0.2 8.2
Simulation, OBJ 0.2 0.9 3.7 1 ms 3.0 4.2 0.3 0.2 12.6
Visual, GLB 0.2 0.9 3.5 0.6 ms 8.1 0.1 0.8 0.2 13.9
Visual, OBJ 0.2 1.0 3.5 0.5 ms 7.9 3.0 1.1 0.2 16.9
Board Repo: loxodes/vna
Board: demod_module.kicad_pcb
Folder hardware / archive / demod_module
Complexity 279 / 1000 (size 234, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 99, 554, 95
Triangles, simulation 1,061,928 in 84 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 478 MB
STEP 131 MB 540 MB
STL 53 MB 464 MB
OBJ 109 MB 756 MB
Visual
GLB 24 MB 548 MB
OBJ 71 MB 550 MB

1555. doubler_switch

doubler_switch: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 19 s. Simulation, OBJ takes 27 s. Visual, GLB takes 26 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.6 8.1 0.4 ms 7.0 0.3 0.7 0.3 18.3
Simulation, STEP 0.4 1.5 8.2 0.5 ms 7.1 3.8 0.7 0.3 21.9
Simulation, STL 0.3 1.5 8.7 0.5 ms 7.5 0.5 0.7 0.3 19.5
Simulation, OBJ 0.3 1.6 8.4 0.5 ms 6.6 9.2 0.6 0.3 27.0
Visual, GLB 0.3 1.4 7.8 0.5 ms 14.1 0.1 1.6 0.3 25.7
Visual, OBJ 0.3 1.5 8.4 1 ms 13.9 5.9 1.7 0.3 32.0
Board Repo: loxodes/vna
Board: doubler_switch.kicad_pcb
Folder hardware / archive / doubler_switch
Complexity 215 / 1000 (size 180, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 50, 457, 42
Triangles, simulation 1,500,280 in 54 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 51 MB 641 MB
STEP 171 MB 725 MB
STL 75 MB 653 MB
OBJ 154 MB 994 MB
Visual
GLB 31 MB 747 MB
OBJ 93 MB 695 MB

1556. frequency_synth

frequency_synth: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 22 s. Simulation, STL takes 19 s. Simulation, OBJ takes 27 s. Visual, GLB takes 31 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.1 8.5 0.7 ms 6.4 0.3 0.8 0.2 18.7
Simulation, STEP 0.4 2.0 8.0 0.7 ms 6.3 4.1 0.7 0.3 21.8
Simulation, STL 0.4 1.9 8.3 0.7 ms 6.6 0.7 0.7 0.3 18.9
Simulation, OBJ 0.4 1.9 8.3 0.9 ms 6.4 8.9 0.8 0.3 26.9
Visual, GLB 0.4 2.3 8.2 0.8 ms 18.5 0.2 1.5 0.3 31.4
Visual, OBJ 0.4 2.2 8.8 0.7 ms 17.6 6.3 2.0 0.2 37.5
Board Repo: loxodes/vna
Board: frequency_synth.kicad_pcb
Folder hardware / archive / frequency_synth
Complexity 297 / 1000 (size 252, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 159, 1,274, 215
Triangles, simulation 1,978,440 in 151 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 670 MB
STEP 252 MB 878 MB
STL 99 MB 712 MB
OBJ 209 MB 1.4 GB
Visual
GLB 42 MB 827 MB
OBJ 128 MB 936 MB

1557. trl_line

trl_line: stages 4 and 6 take 52% to 79% of a run. Simulation, GLB takes 2.9 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.9 s. Visual, GLB takes 3.5 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.1 0.2 ms 1.0 48 ms 0.1 0.2 2.9
Simulation, STEP 91 ms 0.2 1.0 0.2 ms 0.9 1.0 0.1 0.2 3.6
Simulation, STL 95 ms 0.2 1.0 0.2 ms 0.9 54 ms 0.1 0.2 2.7
Simulation, OBJ 0.1 0.2 1.1 0.2 ms 0.9 1.2 0.1 0.3 3.9
Visual, GLB 94 ms 0.2 1.1 0.2 ms 1.7 17 ms 0.1 0.3 3.5
Visual, OBJ 0.1 0.2 1.1 0.2 ms 1.7 0.5 0.1 0.2 3.9
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / cap_0201
Complexity 86 / 1000 (size 66, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 3, 2, 0
Triangles, simulation 227,180 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 223 MB
STEP 22 MB 226 MB
STL 11 MB 231 MB
OBJ 22 MB 234 MB
Visual
GLB 3.2 MB 167 MB
OBJ 9.0 MB 167 MB

1558. trl_line

trl_line: stages 4 and 6 take 53% to 80% of a run. Simulation, GLB takes 2.1 s. Simulation, STEP takes 2.9 s. Simulation, STL takes 2.2 s. Simulation, OBJ takes 3.1 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 86 ms 0.2 0.8 0.1 ms 0.7 30 ms 87 ms 0.2 2.1
Simulation, STEP 77 ms 0.2 0.8 0.2 ms 0.7 0.9 84 ms 0.2 2.9
Simulation, STL 83 ms 0.2 0.8 0.1 ms 0.7 65 ms 95 ms 0.2 2.2
Simulation, OBJ 75 ms 0.2 0.8 0.1 ms 0.8 0.9 0.1 0.2 3.1
Visual, GLB 84 ms 0.2 0.8 0.2 ms 1.4 14 ms 0.1 0.2 2.8
Visual, OBJ 81 ms 0.2 0.8 0.2 ms 1.4 0.4 94 ms 0.2 3.1
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / cap_0402
Complexity 86 / 1000 (size 66, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 3, 2, 0
Triangles, simulation 226,556 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 234 MB
STEP 22 MB 238 MB
STL 11 MB 233 MB
OBJ 22 MB 220 MB
Visual
GLB 3.2 MB 168 MB
OBJ 9.0 MB 167 MB

1559. trl_line

trl_line: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 2.5 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 90 ms 0.2 1.0 0.1 ms 0.8 34 ms 0.1 0.3 2.5
Simulation, STEP 81 ms 0.2 0.9 0.1 ms 0.9 0.9 0.1 0.2 3.3
Simulation, STL 83 ms 0.2 0.9 0.1 ms 0.8 49 ms 0.1 0.2 2.3
Simulation, OBJ 88 ms 0.2 0.9 0.1 ms 0.8 1.2 0.1 0.2 3.5
Visual, GLB 83 ms 0.2 1.0 0.1 ms 1.4 16 ms 0.1 0.2 3.0
Visual, OBJ 82 ms 0.2 1.0 0.2 ms 1.5 0.6 96 ms 0.2 3.7
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / shunt_0402
Complexity 136 / 1000 (size 101, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 5, 12, 2
Triangles, simulation 236,544 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.8 MB 232 MB
STEP 23 MB 239 MB
STL 12 MB 230 MB
OBJ 23 MB 232 MB
Visual
GLB 3.4 MB 171 MB
OBJ 9.6 MB 172 MB

1560. trl_line

trl_line: stages 4 and 6 take 50% to 78% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 3.0 s. Visual, OBJ takes 3.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 81 ms 0.2 1.0 0.1 ms 0.8 31 ms 0.1 0.2 2.4
Simulation, STEP 81 ms 0.2 1.0 0.1 ms 0.8 0.9 0.1 0.2 3.2
Simulation, STL 80 ms 0.2 0.9 0.1 ms 0.8 51 ms 0.1 0.2 2.3
Simulation, OBJ 79 ms 0.2 0.9 0.2 ms 0.8 1.1 0.1 0.2 3.4
Visual, GLB 79 ms 0.2 0.9 0.1 ms 1.4 15 ms 0.1 0.3 3.0
Visual, OBJ 82 ms 0.2 1.0 0.2 ms 1.4 0.4 93 ms 0.2 3.4
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / trl_line
Complexity 77 / 1000 (size 57, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 2, 1, 0
Triangles, simulation 227,780 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 233 MB
STEP 22 MB 229 MB
STL 11 MB 224 MB
OBJ 22 MB 225 MB
Visual
GLB 3.2 MB 169 MB
OBJ 9.1 MB 168 MB

1561. trl_reflect

trl_reflect: stages 4 and 6 take 48% to 76% of a run. Simulation, GLB takes 1.4 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.6 s. Simulation, OBJ takes 2.3 s. Visual, GLB takes 2.1 s. Visual, OBJ takes 2.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 75 ms 0.1 0.5 0.1 ms 0.5 18 ms 56 ms 0.2 1.4
Simulation, STEP 76 ms 0.1 0.5 0.1 ms 0.6 0.7 56 ms 0.2 2.2
Simulation, STL 88 ms 0.1 0.5 0.2 ms 0.6 26 ms 60 ms 0.2 1.6
Simulation, OBJ 75 ms 0.1 0.5 0.1 ms 0.7 0.6 68 ms 0.2 2.3
Visual, GLB 81 ms 0.1 0.5 0.1 ms 1.1 10 ms 68 ms 0.2 2.1
Visual, OBJ 75 ms 0.1 0.5 0.2 ms 1.0 0.2 65 ms 0.2 2.2
Board Repo: loxodes/vna
Board: trl_reflect.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / trl_reflect
Complexity 84 / 1000 (size 64, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 1, 3, 0
Triangles, simulation 116,706 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.9 MB 186 MB
STEP 12 MB 190 MB
STL 5.8 MB 194 MB
OBJ 11 MB 184 MB
Visual
GLB 1.7 MB 159 MB
OBJ 4.8 MB 159 MB

1562. trl_line

trl_line: stages 4 and 6 take 51% to 79% of a run. Simulation, GLB takes 2.4 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.4 s. Visual, GLB takes 2.9 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 81 ms 0.2 0.9 0.2 ms 0.8 32 ms 98 ms 0.2 2.4
Simulation, STEP 77 ms 0.2 0.9 0.2 ms 0.8 0.9 0.1 0.2 3.1
Simulation, STL 78 ms 0.2 0.9 0.1 ms 0.8 47 ms 98 ms 0.2 2.3
Simulation, OBJ 79 ms 0.2 0.9 0.1 ms 0.8 1.1 0.1 0.2 3.4
Visual, GLB 83 ms 0.2 0.9 0.1 ms 1.4 14 ms 0.1 0.2 2.9
Visual, OBJ 77 ms 0.2 0.9 0.2 ms 1.4 0.5 0.1 0.2 3.3
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / trl_thru
Complexity 77 / 1000 (size 57, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 2, 1, 0
Triangles, simulation 226,164 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.4 MB 228 MB
STEP 22 MB 243 MB
STL 11 MB 233 MB
OBJ 22 MB 233 MB
Visual
GLB 3.2 MB 167 MB
OBJ 9.0 MB 168 MB

1563. trl_line

trl_line: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 3.2 s. Simulation, STEP takes 4.3 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.4 s. Visual, GLB takes 3.9 s. Visual, OBJ takes 4.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.2 0.2 ms 1.1 48 ms 0.2 0.3 3.2
Simulation, STEP 0.1 0.3 1.3 0.1 ms 1.2 1.2 0.2 0.2 4.3
Simulation, STL 0.1 0.3 1.3 0.2 ms 1.1 68 ms 0.1 0.3 3.2
Simulation, OBJ 94 ms 0.2 1.2 0.1 ms 1.1 1.4 0.1 0.3 4.4
Visual, GLB 0.1 0.2 1.2 0.2 ms 1.9 22 ms 0.2 0.2 3.9
Visual, OBJ 0.1 0.3 1.3 0.2 ms 2.0 0.6 0.1 0.3 4.6
Board Repo: loxodes/vna
Board: trl_line.kicad_pcb
Folder hardware / archive / oshpark_4layer_trl_cal / trl_ustrip_test
Complexity 83 / 1000 (size 63, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 2, 2, 0
Triangles, simulation 228,296 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 233 MB
STEP 22 MB 238 MB
STL 11 MB 233 MB
OBJ 22 MB 232 MB
Visual
GLB 3.2 MB 167 MB
OBJ 9.2 MB 167 MB

1564. switch_demod

switch_demod: stages 4 and 6 take 56% to 80% of a run. Simulation, GLB takes 6.0 s. Simulation, STEP takes 7.8 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 8.1 s. Visual, GLB takes 8.7 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.0 0.4 ms 1.5 60 ms 0.2 0.2 6.0
Simulation, STEP 0.2 0.8 3.0 0.3 ms 1.5 1.8 0.2 0.2 7.8
Simulation, STL 0.2 0.8 2.9 0.3 ms 1.5 0.1 0.2 0.2 6.0
Simulation, OBJ 0.3 0.8 3.0 0.3 ms 1.5 2.1 0.2 0.2 8.1
Visual, GLB 0.2 0.8 2.9 0.3 ms 4.0 51 ms 0.5 0.2 8.7
Visual, OBJ 0.3 0.8 3.2 0.4 ms 4.1 1.5 0.5 0.2 10.7
Board Repo: loxodes/vna
Board: switch_demod.kicad_pcb
Folder hardware / archive / switch_demod
Complexity 172 / 1000 (size 172, features 0)
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 140, 15, 0
Triangles, simulation 355,876 in 111 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 328 MB
STEP 54 MB 366 MB
STL 18 MB 340 MB
OBJ 39 MB 349 MB
Visual
GLB 11 MB 331 MB
OBJ 31 MB 330 MB

1565. vna_control

vna_control: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 26 s. Simulation, OBJ takes 37 s. Visual, GLB takes 35 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 11.3 0.7 ms 8.8 0.4 1.2 0.3 24.9
Simulation, STEP 0.4 2.4 11.9 0.7 ms 9.0 5.4 1.1 0.3 30.5
Simulation, STL 0.5 2.4 11.0 0.7 ms 9.0 0.9 1.3 0.3 25.5
Simulation, OBJ 0.4 2.4 10.8 1 ms 9.0 13.1 1.2 0.3 37.3
Visual, GLB 0.4 2.3 11.1 0.9 ms 18.4 0.2 2.0 0.3 34.7
Visual, OBJ 0.4 2.5 11.4 0.9 ms 21.0 7.6 2.4 0.3 45.6
Board Repo: loxodes/vna
Board: vna_control.kicad_pcb
Folder hardware / archive / vna_r0 / vna_control
Complexity 300 / 1000 (size 245, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 110, 1,091, 157
Triangles, simulation 2,132,360 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 74 MB 654 MB
STEP 276 MB 778 MB
STL 107 MB 662 MB
OBJ 225 MB 1.4 GB
Visual
GLB 41 MB 922 MB
OBJ 124 MB 944 MB

1566. vna_demod

vna_demod: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 45 s. Simulation, STEP takes 52 s. Simulation, STL takes 45 s. Simulation, OBJ takes 65 s. Visual, GLB takes 81 s. Visual, OBJ takes 93 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 5.6 19.7 2 ms 15.6 0.7 1.9 0.3 44.6
Simulation, STEP 0.9 5.7 19.5 0.8 ms 15.1 8.6 1.6 0.3 51.7
Simulation, STL 0.8 5.8 19.5 2 ms 15.4 1.7 1.7 0.3 45.2
Simulation, OBJ 0.8 5.7 19.7 2 ms 15.2 22.0 1.8 0.3 65.5
Visual, GLB 0.9 6.0 19.6 0.8 ms 49.1 0.5 4.6 0.3 80.9
Visual, OBJ 0.9 5.5 19.3 2 ms 48.8 14.0 4.3 0.3 93.2
Board Repo: loxodes/vna
Board: vna_demod.kicad_pcb
Folder hardware / archive / vna_r0 / vna_demod
Complexity 330 / 1000 (size 285, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 10th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 303, 2,447, 408
Triangles, simulation 4,214,150 in 243 parts
Verifier PASS in all six runs
Run again Simulation, GLB; Simulation, STEP; Simulation, STL; Simulation, OBJ; Visual, GLB; Visual, OBJ: failed in the corpus run, run again with fixes to KESE made after the corpus run, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 146 MB 1.4 GB
STEP 498 MB 1.6 GB
STL 211 MB 1.3 GB
OBJ 451 MB 2.8 GB
Visual
GLB 93 MB 1.5 GB
OBJ 294 MB 2.0 GB

1567. vna_rf

vna_rf: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 30 s. Simulation, STL takes 25 s. Simulation, OBJ takes 37 s. Visual, GLB takes 41 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 3.1 10.1 1.0 ms 9.7 0.4 1.0 0.3 25.1
Simulation, STEP 0.5 3.1 10.1 0.9 ms 9.6 5.3 0.9 0.3 29.7
Simulation, STL 0.5 2.9 10.2 0.8 ms 9.4 0.7 0.9 0.3 24.8
Simulation, OBJ 0.4 3.1 9.8 0.8 ms 9.7 12.3 0.9 0.3 36.6
Visual, GLB 0.4 3.0 10.1 0.8 ms 24.8 0.2 2.2 0.3 41.1
Visual, OBJ 0.5 3.1 10.1 1.0 ms 25.2 8.1 2.3 0.3 49.6
Board Repo: loxodes/vna
Board: vna_rf.kicad_pcb
Folder hardware / archive / vna_r0 / vna_rf
Complexity 292 / 1000 (size 247, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 10th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 130, 1,060, 171
Triangles, simulation 2,515,716 in 103 parts
Verifier PASS in all six runs
Run again Simulation, GLB; Simulation, STEP; Simulation, STL; Simulation, OBJ; Visual, GLB; Visual, OBJ: failed in the corpus run, run again with fixes to KESE made after the corpus run, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 86 MB 968 MB
STEP 276 MB 1.1 GB
STL 126 MB 978 MB
OBJ 264 MB 1.7 GB
Visual
GLB 54 MB 1.0 GB
OBJ 167 MB 1.2 GB

1568. ecp5

ecp5: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 46 s. Simulation, STL takes 37 s. Simulation, OBJ takes 56 s. Visual, GLB takes 55 s. Visual, OBJ takes 67 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.4 12.7 0.5 ms 14.8 0.6 1.7 0.3 35.6
Simulation, STEP 1.1 4.2 13.6 0.6 ms 15.6 9.4 1.9 0.3 46.1
Simulation, STL 1.1 4.3 13.4 0.6 ms 15.1 1.3 1.9 0.3 37.4
Simulation, OBJ 1.1 4.3 13.6 0.6 ms 14.5 20.2 1.9 0.3 55.9
Visual, GLB 1.2 4.2 13.7 1 ms 31.4 0.4 3.8 0.2 54.8
Visual, OBJ 0.8 4.5 13.7 0.7 ms 31.7 11.7 3.9 0.2 66.5
Board Repo: loxodes/vna
Board: ecp5.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / ecp5
Complexity 405 / 1000 (size 290, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 6 (20201220)
Parts, tracks, vias 195, 2,373, 498
Triangles, simulation 4,130,736 in 192 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 138 MB 1.1 GB
STEP 545 MB 1.6 GB
STL 207 MB 1.2 GB
OBJ 439 MB 2.7 GB
Visual
GLB 79 MB 1.3 GB
OBJ 252 MB 1.7 GB

1569. ep2k1P

ep2k1P: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 2.6 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 98 ms 0.2 0.9 0.1 ms 1.1 38 ms 0.1 0.2 2.6
Simulation, STEP 85 ms 0.2 0.8 0.1 ms 1.1 1.0 0.1 0.2 3.5
Simulation, STL 91 ms 0.2 0.9 0.2 ms 1.1 69 ms 0.1 0.2 2.7
Simulation, OBJ 94 ms 0.2 0.9 0.2 ms 1.0 1.1 0.1 0.3 3.8
Visual, GLB 89 ms 0.2 0.9 0.2 ms 1.7 17 ms 91 ms 0.2 3.3
Visual, OBJ 93 ms 0.2 0.9 0.2 ms 1.7 0.4 86 ms 0.2 3.6
Board Repo: loxodes/vna
Board: ep2k1P.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / ep2k1P
Complexity 243 / 1000 (size 133, features 110)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 4, 50, 33
Triangles, simulation 254,758 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.3 MB 238 MB
STEP 20 MB 257 MB
STL 13 MB 238 MB
OBJ 25 MB 238 MB
Visual
GLB 3.0 MB 173 MB
OBJ 8.6 MB 173 MB

1570. fpc07181

fpc07181: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.3 s. Simulation, OBJ takes 3.5 s. Visual, GLB takes 2.7 s. Visual, OBJ takes 3.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 92 ms 0.2 0.8 0.2 ms 1.0 31 ms 0.1 0.2 2.3
Simulation, STEP 91 ms 0.2 0.7 0.1 ms 1.0 0.9 0.1 0.2 3.2
Simulation, STL 90 ms 0.2 0.8 0.1 ms 1.0 45 ms 0.1 0.2 2.3
Simulation, OBJ 90 ms 0.2 0.8 0.1 ms 1.0 1.2 0.1 0.2 3.5
Visual, GLB 91 ms 0.2 0.8 0.2 ms 1.4 13 ms 66 ms 0.2 2.7
Visual, OBJ 92 ms 0.2 0.8 0.1 ms 1.3 0.4 62 ms 0.3 3.0
Board Repo: loxodes/vna
Board: fpc07181.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / fpc07181
Complexity 215 / 1000 (size 120, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 5, 20, 13
Triangles, simulation 192,820 in 17 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.3 MB 213 MB
STEP 16 MB 232 MB
STL 9.6 MB 214 MB
OBJ 19 MB 216 MB
Visual
GLB 2.1 MB 166 MB
OBJ 6.1 MB 165 MB

1571. maam-011132

maam-011132: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 4.9 s. Simulation, STEP takes 6.4 s. Simulation, STL takes 4.8 s. Simulation, OBJ takes 7.6 s. Visual, GLB takes 6.6 s. Visual, OBJ takes 8.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.8 0.2 ms 1.8 84 ms 0.2 0.2 4.9
Simulation, STEP 0.2 0.5 1.8 0.2 ms 1.9 1.6 0.3 0.2 6.4
Simulation, STL 0.2 0.5 1.7 0.3 ms 1.8 0.1 0.3 0.3 4.8
Simulation, OBJ 0.2 0.5 1.7 0.2 ms 1.9 2.8 0.3 0.2 7.6
Visual, GLB 0.2 0.5 1.7 0.3 ms 3.4 49 ms 0.5 0.2 6.6
Visual, OBJ 0.2 0.5 1.8 0.2 ms 3.5 1.7 0.5 0.2 8.3
Board Repo: loxodes/vna
Board: maam-011132.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / maam-011132
Complexity 290 / 1000 (size 185, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210228)
Parts, tracks, vias 66, 379, 89
Triangles, simulation 574,998 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 332 MB
STEP 66 MB 385 MB
STL 29 MB 327 MB
OBJ 60 MB 438 MB
Visual
GLB 11 MB 332 MB
OBJ 35 MB 337 MB

1572. maam_011101

maam_011101: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 2.1 s. Simulation, STEP takes 2.9 s. Simulation, STL takes 2.0 s. Simulation, OBJ takes 3.0 s. Visual, GLB takes 2.9 s. Visual, OBJ takes 3.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.6 0.1 ms 0.9 34 ms 0.1 0.2 2.1
Simulation, STEP 0.1 0.1 0.6 0.2 ms 0.9 0.9 85 ms 0.2 2.9
Simulation, STL 94 ms 0.1 0.6 0.1 ms 0.8 52 ms 90 ms 0.2 2.0
Simulation, OBJ 97 ms 0.2 0.7 0.1 ms 0.9 0.9 0.1 0.2 3.0
Visual, GLB 0.1 0.2 0.6 0.1 ms 1.8 14 ms 83 ms 0.2 2.9
Visual, OBJ 98 ms 0.2 0.6 0.1 ms 1.7 0.3 92 ms 0.2 3.1
Board Repo: loxodes/vna
Board: maam_011101.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / maam_011101
Complexity 222 / 1000 (size 127, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210108)
Parts, tracks, vias 8, 24, 16
Triangles, simulation 159,606 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 5.2 MB 199 MB
STEP 14 MB 214 MB
STL 8.0 MB 201 MB
OBJ 16 MB 198 MB
Visual
GLB 2.1 MB 166 MB
OBJ 5.8 MB 167 MB

1573. mamx_011036

mamx_011036: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 4.9 s. Simulation, STEP takes 6.4 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 7.9 s. Visual, GLB takes 6.0 s. Visual, OBJ takes 7.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.9 0.2 ms 1.8 77 ms 0.3 0.2 4.9
Simulation, STEP 0.2 0.5 1.9 0.2 ms 1.8 1.5 0.3 0.2 6.4
Simulation, STL 0.2 0.5 1.8 0.2 ms 1.8 0.1 0.3 0.2 4.9
Simulation, OBJ 0.2 0.5 1.9 0.2 ms 1.7 3.2 0.3 0.2 7.9
Visual, GLB 0.2 0.5 1.8 0.2 ms 3.0 38 ms 0.3 0.2 6.0
Visual, OBJ 0.2 0.5 1.8 0.3 ms 2.9 1.3 0.2 0.2 7.2
Board Repo: loxodes/vna
Board: mamx_011036.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / mamx_011036
Complexity 266 / 1000 (size 171, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 31, 178, 90
Triangles, simulation 507,438 in 37 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 17 MB 305 MB
STEP 50 MB 345 MB
STL 25 MB 322 MB
OBJ 53 MB 343 MB
Visual
GLB 7.9 MB 284 MB
OBJ 24 MB 286 MB

1574. sumusu_ats2012

sumusu_ats2012: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 1.7 s. Simulation, STEP takes 2.4 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.2 s. Visual, GLB takes 2.3 s. Visual, OBJ takes 2.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 75 ms 0.1 0.5 0.1 ms 0.7 41 ms 71 ms 0.2 1.7
Simulation, STEP 76 ms 0.1 0.5 0.1 ms 0.7 0.7 64 ms 0.2 2.4
Simulation, STL 81 ms 0.1 0.5 0.1 ms 0.8 28 ms 66 ms 0.2 1.8
Simulation, OBJ 75 ms 0.1 0.4 0.1 ms 0.7 0.6 70 ms 0.2 2.2
Visual, GLB 87 ms 0.1 0.5 0.1 ms 1.4 10 ms 56 ms 0.2 2.3
Visual, OBJ 77 ms 0.1 0.5 0.1 ms 1.3 0.2 57 ms 0.2 2.4
Board Repo: loxodes/vna
Board: sumusu_ats2012.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / sumusu_ats2012
Complexity 206 / 1000 (size 111, features 95)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20201220)
Parts, tracks, vias 3, 7, 13
Triangles, simulation 140,684 in 15 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.6 MB 198 MB
STEP 12 MB 210 MB
STL 7.0 MB 197 MB
OBJ 14 MB 197 MB
Visual
GLB 1.6 MB 166 MB
OBJ 4.6 MB 167 MB

1575. xx1000-qt

xx1000-qt: stages 4 and 6 take 49% to 79% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 6.0 s. Simulation, STL takes 4.7 s. Simulation, OBJ takes 6.7 s. Visual, GLB takes 6.6 s. Visual, OBJ takes 7.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 1.7 0.3 ms 1.6 65 ms 0.2 0.2 4.5
Simulation, STEP 0.2 0.5 1.7 0.3 ms 1.7 1.5 0.2 0.2 6.0
Simulation, STL 0.2 0.5 1.8 0.2 ms 1.6 0.2 0.2 0.2 4.7
Simulation, OBJ 0.2 0.4 1.6 0.2 ms 1.6 2.4 0.2 0.2 6.7
Visual, GLB 0.2 0.5 1.8 0.3 ms 3.4 50 ms 0.4 0.2 6.6
Visual, OBJ 0.2 0.5 1.6 0.2 ms 3.2 1.2 0.3 0.2 7.2
Board Repo: loxodes/vna
Board: xx1000-qt.kicad_pcb
Folder hardware / mm_reflectometer / evalboards / xx1000-qt
Complexity 287 / 1000 (size 182, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20210228)
Parts, tracks, vias 58, 346, 84
Triangles, simulation 529,594 in 42 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 324 MB
STEP 59 MB 356 MB
STL 26 MB 324 MB
OBJ 55 MB 405 MB
Visual
GLB 11 MB 322 MB
OBJ 32 MB 326 MB

1576. mm_synth

mm_synth: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 33 s. Simulation, OBJ takes 48 s. Visual, GLB takes 54 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.7 4.1 13.1 1 ms 11.6 0.6 1.2 0.3 32.6
Simulation, STEP 1.5 4.4 13.2 1 ms 11.6 8.3 1.1 0.3 40.4
Simulation, STL 1.3 4.2 13.2 1 ms 11.5 1.2 1.1 0.3 32.9
Simulation, OBJ 1.3 4.2 13.0 1 ms 11.4 16.3 1.1 0.3 47.7
Visual, GLB 1.4 4.4 13.4 1 ms 31.3 0.3 3.4 0.3 54.4
Visual, OBJ 1.1 4.3 13.2 1 ms 30.4 9.6 3.8 0.3 62.7
Board Repo: loxodes/vna
Board: mm_synth.kicad_pcb
Folder hardware / mm_reflectometer / synth / mm_synth
Complexity 297 / 1000 (size 192, features 105)
KESE features slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
drill offsets, copper drawings,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 8
File format KiCad 6 (20211014)
Parts, tracks, vias 679, 0, 0
Triangles, simulation 3,436,034 in 332 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 111 MB 1.3 GB
STEP 488 MB 1.4 GB
STL 172 MB 1.2 GB
OBJ 358 MB 2.2 GB
Visual
GLB 68 MB 1.3 GB
OBJ 211 MB 1.4 GB

1577. synth_pod

synth_pod: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 40 s. Simulation, STEP takes 50 s. Simulation, STL takes 42 s. Simulation, OBJ takes 62 s. Visual, GLB takes 60 s. Visual, OBJ takes 72 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.2 16.6 1 ms 15.9 0.6 1.5 0.3 40.2
Simulation, STEP 1.1 4.3 16.8 1 ms 15.7 10.7 1.4 0.3 50.4
Simulation, STL 1.3 4.4 17.6 1 ms 15.9 1.4 1.5 0.3 42.3
Simulation, OBJ 1.1 4.3 16.8 0.9 ms 15.9 22.3 1.4 0.3 62.1
Visual, GLB 1.0 4.3 16.4 0.9 ms 35.0 0.4 3.0 0.3 60.4
Visual, OBJ 1.0 3.9 15.9 1.0 ms 35.1 12.5 3.2 0.3 72.0
Board Repo: loxodes/vna
Board: synth_pod.kicad_pcb
Folder hardware / mm_reflectometer / synth / synth_pod
Complexity 281 / 1000 (size 186, features 95)
KESE features custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, copper drawings,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 8
File format KiCad 6 (20211014)
Parts, tracks, vias 497, 0, 0
Triangles, simulation 4,161,276 in 367 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 135 MB 1.2 GB
STEP 590 MB 1.8 GB
STL 208 MB 1.3 GB
OBJ 434 MB 2.6 GB
Visual
GLB 82 MB 1.4 GB
OBJ 254 MB 1.7 GB

1578. vna_mm_ref

vna_mm_ref: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 37 s. Visual, GLB takes 34 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.7 11.7 0.5 ms 9.0 0.4 0.9 0.3 25.4
Simulation, STEP 0.5 2.8 12.5 0.4 ms 8.9 5.4 0.9 0.2 31.3
Simulation, STL 0.4 3.0 12.6 0.7 ms 8.9 0.8 0.9 0.2 26.8
Simulation, OBJ 0.4 3.0 12.3 0.4 ms 8.7 11.7 0.9 0.3 37.2
Visual, GLB 0.4 3.0 12.6 0.8 ms 16.1 0.2 1.6 0.2 34.2
Visual, OBJ 0.4 2.8 12.7 0.5 ms 15.7 6.1 2.2 0.2 40.1
Board Repo: loxodes/vna
Board: vna_mm_ref.kicad_pcb
Folder hardware / vna_mm_ref
Complexity 274 / 1000 (size 219, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 221, 1,166, 395
Triangles, simulation 2,863,846 in 134 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 98 MB 912 MB
STEP 372 MB 1.2 GB
STL 143 MB 894 MB
OBJ 303 MB 1.9 GB
Visual
GLB 50 MB 975 MB
OBJ 155 MB 1.1 GB

1579. vna_mm_synth

vna_mm_synth: stages 4 and 6 take 62% to 82% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 61 s. Simulation, STL takes 54 s. Simulation, OBJ takes 70 s. Visual, GLB takes 63 s. Visual, OBJ takes 74 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.5 22.6 1.0 ms 15.7 0.5 1.1 0.3 46.7
Simulation, STEP 1.0 5.6 23.7 1 ms 17.3 11.9 1.0 0.3 60.9
Simulation, STL 1.0 6.0 25.6 1 ms 18.5 1.4 1.1 0.4 54.0
Simulation, OBJ 1.1 6.1 25.7 1 ms 18.0 17.8 1.4 0.3 70.3
Visual, GLB 1.0 6.3 25.8 3 ms 26.0 0.3 3.2 0.3 62.9
Visual, OBJ 1.0 6.1 26.0 2 ms 27.3 9.7 3.4 0.3 73.9
Board Repo: loxodes/vna
Board: vna_mm_synth.kicad_pcb
Folder hardware / vna_mm_synth
Complexity 180 / 1000 (size 170, features 10)
KESE features rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 430, 0, 0
Triangles, simulation 2,684,964 in 356 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 92 MB 1.0 GB
STEP 478 MB 1.3 GB
STL 134 MB 1.1 GB
OBJ 290 MB 1.9 GB
Visual
GLB 54 MB 1.0 GB
OBJ 164 MB 1.2 GB

1580. vna_r1

vna_r1: stages 4 and 6 take 53% to 81% of a run. Simulation, GLB takes 74 s. Simulation, STEP takes 83 s. Simulation, STL takes 71 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 10.6 33.6 1 ms 23.8 1.1 3.0 0.4 73.5
Simulation, STEP 1.0 10.1 31.7 2 ms 23.1 13.7 3.1 0.4 83.1
Simulation, STL 1.1 10.4 32.0 2 ms 22.4 2.3 2.8 0.4 71.5
Simulation, OBJ 1.1 10.2 31.9 2 ms 22.4 34.1 2.9 0.4 102.8
Visual, GLB 1.1 10.1 31.4 2 ms 57.7 0.6 8.4 0.3 109.7
Visual, OBJ 1.1 10.1 31.7 1 ms 58.9 20.1 8.6 0.3 131.0
Board Repo: loxodes/vna
Board: vna_r1.kicad_pcb
Folder hardware / vna_rev1 / vna_r1_controller
Complexity 361 / 1000 (size 306, features 55)
KESE features through vias, slotted holes,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 428, 4,487, 806
Triangles, simulation 5,750,876 in 391 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 202 MB 1.7 GB
STEP 797 MB 2.1 GB
STL 288 MB 1.8 GB
OBJ 624 MB 3.7 GB
Visual
GLB 131 MB 2.1 GB
OBJ 418 MB 2.7 GB

1581. vna_r1_demod

vna_r1_demod: stages 4 and 6 take 57% to 87% of a run. Simulation, GLB takes 39 s. Simulation, STEP takes 44 s. Simulation, STL takes 39 s. Simulation, OBJ takes 58 s. Visual, GLB takes 52 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 3.3 14.5 0.9 ms 18.3 0.6 1.4 0.3 38.9
Simulation, STEP 0.5 3.2 14.2 1.0 ms 17.7 7.3 1.3 0.3 44.5
Simulation, STL 0.5 3.2 14.4 0.9 ms 18.3 1.0 1.3 0.3 39.0
Simulation, OBJ 0.5 3.3 14.3 0.9 ms 19.1 19.4 1.4 0.3 58.3
Visual, GLB 0.6 3.3 14.1 0.9 ms 31.0 0.2 2.1 0.3 51.7
Visual, OBJ 0.5 3.4 16.0 1 ms 31.8 9.0 2.2 0.3 63.2
Board Repo: loxodes/vna
Board: vna_r1_demod.kicad_pcb
Folder hardware / vna_rev1 / vna_r1_demod
Complexity 255 / 1000 (size 200, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 111, 678, 158
Triangles, simulation 3,341,808 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 113 MB 1.1 GB
STEP 344 MB 1.4 GB
STL 167 MB 1.0 GB
OBJ 349 MB 2.1 GB
Visual
GLB 52 MB 1.1 GB
OBJ 161 MB 1.2 GB

1582. vna_r1_synth

vna_r1_synth: stages 4 and 6 take 55% to 85% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 40 s. Visual, GLB takes 41 s. Visual, OBJ takes 49 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.7 10.4 0.8 ms 11.3 0.5 1.1 0.3 26.6
Simulation, STEP 0.5 2.6 10.0 0.7 ms 11.1 5.6 1.1 0.3 31.1
Simulation, STL 0.5 2.6 10.3 0.6 ms 11.0 1.0 1.1 0.3 26.9
Simulation, OBJ 0.4 2.8 10.3 0.8 ms 11.5 13.4 1.1 0.3 39.8
Visual, GLB 0.4 2.6 10.4 0.5 ms 24.7 0.3 2.7 0.3 41.4
Visual, OBJ 0.5 2.9 10.2 0.7 ms 25.3 7.6 2.6 0.3 49.3
Board Repo: loxodes/vna
Board: vna_r1_synth.kicad_pcb
Folder hardware / vna_rev1 / vna_r1_synth
Complexity 292 / 1000 (size 247, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 135, 1,070, 169
Triangles, simulation 2,886,442 in 106 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 98 MB 995 MB
STEP 312 MB 1.2 GB
STL 144 MB 1.0 GB
OBJ 302 MB 1.9 GB
Visual
GLB 55 MB 1.1 GB
OBJ 172 MB 1.3 GB

1583. [DFR1142]Lite Carrier for LattePanda Mu

Stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 54 s. Simulation, STEP takes 68 s. Simulation, STL takes 55 s. Simulation, OBJ takes 80 s. Visual, GLB takes 87 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 6.2 21.8 2 ms 20.8 0.9 2.2 0.3 53.7
Simulation, STEP 1.6 5.8 22.6 2 ms 21.3 13.7 2.3 0.4 67.7
Simulation, STL 1.6 5.7 21.4 2 ms 21.4 2.1 2.2 0.4 54.8
Simulation, OBJ 1.5 6.1 21.9 2 ms 22.0 26.1 2.4 0.4 80.5
Visual, GLB 1.6 6.1 23.0 2 ms 49.0 0.6 6.5 0.3 87.2
Visual, OBJ 1.7 6.5 23.1 2 ms 48.6 17.6 6.7 0.3 104.5
Board Repo: ltbrain/mubook
Board: [DFR1142]Lite Carrier for LattePanda Mu.kicad_pcb
Folder hardware / v.1
Complexity 406 / 1000 (size 286, features 120)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 273, 4,113, 1,035
Triangles, simulation 5,358,896 in 432 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 183 MB 1.5 GB
STEP 764 MB 2.2 GB
STL 268 MB 1.5 GB
OBJ 577 MB 3.5 GB
Visual
GLB 118 MB 2.0 GB
OBJ 384 MB 2.5 GB

1584. Aleste520v4

Aleste520v4: stages 4 and 6 take 57% to 89% of a run. Simulation, GLB takes 5 min. Simulation, STEP takes 6 min. Simulation, STL takes 6 min. Simulation, OBJ takes 7 min. Visual, GLB takes 9 min. Visual, OBJ takes 11 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 3.0 24.7 156.7 2 ms 94.6 3.8 16.9 0.7 300.4
Simulation, STEP 3.2 23.4 156.4 3 ms 93.3 55.9 18.5 0.7 351.3
Simulation, STL 3.3 24.9 158.0 5 ms 111.4 14.0 21.9 0.7 334.3
Simulation, OBJ 2.9 24.5 152.4 6 ms 97.5 137.6 20.2 0.9 436.1
Visual, GLB 3.3 25.7 170.1 4 ms 308.2 2.6 26.6 0.6 536.9
Visual, OBJ 3.7 27.6 164.6 3 ms 311.9 96.7 25.1 0.6 630.2
Board Repo: lucedoriente/Aleste520ex
Board: Aleste520v4.kicad_pcb
Folder board
Complexity 318 / 1000 (size 243, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026 to 10th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 326, 9,389, 4,195
Triangles, simulation 19,250,030 in 466 parts
Verifier PASS in all six runs
Run again Simulation, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 660 MB 5.3 GB
STEP 3.1 GB 6.9 GB
STL 963 MB 5.7 GB
OBJ 2.1 GB 12 GB
Visual
GLB 430 MB 6.7 GB
OBJ 1.4 GB 8.4 GB

1585. Aleste520_Keyboard

Aleste520_Keyboard: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 38 s. Simulation, STL takes 33 s. Simulation, OBJ takes 48 s. Visual, GLB takes 48 s. Visual, OBJ takes 61 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 3.2 13.4 0.6 ms 10.7 0.5 1.3 0.3 30.8
Simulation, STEP 1.4 3.1 13.2 0.7 ms 10.9 8.0 1.2 0.2 38.0
Simulation, STL 1.5 3.2 14.0 0.4 ms 12.2 1.0 1.2 0.3 33.4
Simulation, OBJ 1.4 3.1 13.4 0.5 ms 10.6 18.1 1.2 0.3 48.1
Visual, GLB 1.4 3.0 13.2 0.7 ms 25.9 0.3 3.5 0.3 47.6
Visual, OBJ 1.4 3.1 13.5 0.4 ms 25.9 12.6 4.0 0.3 60.8
Board Repo: lucedoriente/Aleste520ex
Board: Aleste520_Keyboard.kicad_pcb
Folder keyboard
Complexity 268 / 1000 (size 233, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 167, 17,707, 141
Triangles, simulation 3,352,674 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 112 MB 1.4 GB
STEP 438 MB 1.5 GB
STL 168 MB 1.3 GB
OBJ 351 MB 2.2 GB
Visual
GLB 79 MB 1.6 GB
OBJ 246 MB 1.7 GB

1586. DepthABC

DepthABC: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 23 s. Simulation, STEP takes 29 s. Simulation, STL takes 23 s. Simulation, OBJ takes 35 s. Visual, GLB takes 36 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.7 7.5 0.9 ms 10.3 0.4 1.1 0.3 23.0
Simulation, STEP 0.7 2.6 7.5 1 ms 9.9 7.0 1.1 0.3 29.2
Simulation, STL 0.7 2.5 7.7 1.0 ms 10.3 0.9 1.1 0.3 23.4
Simulation, OBJ 0.7 2.5 7.5 1 ms 10.0 12.9 1.2 0.3 35.1
Visual, GLB 0.6 2.7 7.2 1 ms 21.4 0.3 3.2 0.3 35.7
Visual, OBJ 0.7 2.4 7.4 1 ms 20.8 9.5 4.0 0.3 45.0
Board Repo: luxonis/depthai-hardware
Board: DepthABC.kicad_pcb
Folder OSHW_KiCad_Community / Reference Designs (In Progress) / DepthABC
Complexity 315 / 1000 (size 225, features 90)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 83, 5,199, 450
Triangles, simulation 2,455,628 in 177 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 84 MB 856 MB
STEP 332 MB 1.1 GB
STL 123 MB 859 MB
OBJ 257 MB 1.6 GB
Visual
GLB 60 MB 1.1 GB
OBJ 190 MB 1.3 GB

1587. payload_board

payload_board: stages 4 and 6 take 59% to 87% of a run. Simulation, GLB takes 8.3 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.3 s. Simulation, OBJ takes 12 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.5 0.6 ms 3.3 0.1 0.4 0.2 8.3
Simulation, STEP 0.2 0.6 3.6 0.7 ms 3.1 2.9 0.4 0.2 11.1
Simulation, STL 0.2 0.5 3.5 0.8 ms 3.1 0.3 0.4 0.3 8.3
Simulation, OBJ 0.2 0.6 3.5 1 ms 3.3 3.3 0.4 0.2 11.6
Visual, GLB 0.2 0.6 3.5 0.9 ms 8.7 95 ms 0.8 0.3 14.1
Visual, OBJ 0.2 0.6 3.5 0.9 ms 8.6 2.6 0.8 0.2 16.6
Board Repo: M2I-CySat/SDR-Carrier-Board
Board: payload_board.kicad_pcb
Folder schematics / breakoutBoard
Complexity 164 / 1000 (size 129, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 7, 172, 21
Triangles, simulation 714,524 in 392 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 396 MB
STEP 126 MB 477 MB
STL 36 MB 405 MB
OBJ 72 MB 521 MB
Visual
GLB 20 MB 551 MB
OBJ 59 MB 585 MB

1588. Mupi

Mupi: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 16 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 5.5 0.4 ms 3.5 0.2 0.4 0.2 11.0
Simulation, STEP 0.3 1.0 5.5 0.4 ms 3.5 2.9 0.4 0.2 13.8
Simulation, STL 0.3 1.0 5.5 0.4 ms 3.5 0.3 0.4 0.2 11.1
Simulation, OBJ 0.3 0.9 5.7 0.3 ms 3.4 4.9 0.4 0.2 15.7
Visual, GLB 0.2 1.0 5.2 0.6 ms 8.4 0.1 1.1 0.2 16.3
Visual, OBJ 0.3 1.0 5.4 0.4 ms 8.5 3.5 1.1 0.2 19.9
Board Repo: m47812/custom-3d-printer-controller
Board: Mupi.kicad_pcb
Folder 3D_Printer_Handheld
Complexity 227 / 1000 (size 172, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 84, 497, 68
Triangles, simulation 1,166,542 in 73 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 41 MB 562 MB
STEP 213 MB 621 MB
STL 58 MB 563 MB
OBJ 121 MB 801 MB
Visual
GLB 29 MB 608 MB
OBJ 87 MB 665 MB

1589. 3D_Printer_Mainboard_STM32

3D_Printer_Mainboard_STM32: stages 4 and 6 take 59% to 84% of a run. Simulation, GLB takes 40 s. Simulation, STEP takes 48 s. Simulation, STL takes 40 s. Simulation, OBJ takes 56 s. Visual, GLB takes 60 s. Visual, OBJ takes 73 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.7 20.5 0.9 ms 12.2 0.5 1.6 0.3 39.6
Simulation, STEP 0.8 3.7 20.1 0.9 ms 12.4 9.6 1.6 0.3 48.5
Simulation, STL 0.8 3.6 19.9 0.5 ms 12.3 1.1 1.7 0.3 39.7
Simulation, OBJ 0.6 3.8 20.0 2 ms 12.8 16.7 1.6 0.3 55.8
Visual, GLB 0.8 3.8 20.0 0.8 ms 29.9 0.4 4.5 0.3 59.6
Visual, OBJ 0.8 3.7 20.5 0.6 ms 31.1 12.4 4.4 0.3 73.2
Board Repo: m47812/custom-3d-printer-controller
Board: 3D_Printer_Mainboard_STM32.kicad_pcb
Folder 3D_Printer_Mainboard_STM32
Complexity 284 / 1000 (size 239, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 191, 1,355, 233
Triangles, simulation 3,389,266 in 196 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 118 MB 1.2 GB
STEP 621 MB 1.4 GB
STL 169 MB 1.2 GB
OBJ 363 MB 2.3 GB
Visual
GLB 86 MB 1.4 GB
OBJ 267 MB 1.8 GB

1590. 3D_Printer_Stepper_TMC2209

3D_Printer_Stepper_TMC2209: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 4.1 s. Simulation, STEP takes 5.7 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 6.3 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.5 0.2 ms 1.5 66 ms 0.2 0.3 4.1
Simulation, STEP 0.1 0.4 1.6 0.5 ms 1.7 1.5 0.2 0.2 5.7
Simulation, STL 0.2 0.4 1.3 0.2 ms 1.5 0.1 0.2 0.2 3.9
Simulation, OBJ 0.2 0.4 1.5 0.2 ms 1.7 2.2 0.2 0.2 6.3
Visual, GLB 0.1 0.5 1.5 0.2 ms 3.4 50 ms 0.5 0.3 6.3
Visual, OBJ 0.2 0.4 1.5 0.4 ms 3.0 1.5 0.4 0.2 7.2
Board Repo: m47812/custom-3d-printer-controller
Board: 3D_Printer_Stepper_TMC2209.kicad_pcb
Folder 3D_Printer_Motor_Driver
Complexity 257 / 1000 (size 187, features 70)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 21, 227, 44
Triangles, simulation 417,724 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 276 MB
STEP 77 MB 311 MB
STL 21 MB 291 MB
OBJ 42 MB 337 MB
Visual
GLB 11 MB 289 MB
OBJ 31 MB 303 MB

1591. blaustahl

blaustahl: stages 4 and 6 take 54% to 82% of a run. Simulation, GLB takes 5.5 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 6.0 s. Simulation, OBJ takes 8.1 s. Visual, GLB takes 8.2 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.5 0.4 ms 1.9 76 ms 0.2 0.3 5.5
Simulation, STEP 0.2 0.4 2.3 0.4 ms 1.8 1.7 0.2 0.2 6.8
Simulation, STL 0.2 0.4 2.6 2 ms 2.2 0.2 0.2 0.2 6.0
Simulation, OBJ 0.3 0.4 2.5 0.3 ms 1.9 2.4 0.3 0.3 8.1
Visual, GLB 0.2 0.4 2.5 0.3 ms 4.2 54 ms 0.5 0.3 8.2
Visual, OBJ 0.2 0.4 2.4 0.4 ms 4.2 1.7 0.4 0.3 9.5
Board Repo: machdyne/blaustahl
Board: blaustahl.kicad_pcb
Folder pcb / blaustahl_v0
Complexity 296 / 1000 (size 201, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 38, 388, 63
Triangles, simulation 388,128 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 299 MB
STEP 75 MB 335 MB
STL 19 MB 285 MB
OBJ 40 MB 322 MB
Visual
GLB 9.8 MB 299 MB
OBJ 29 MB 306 MB

1592. eis

eis: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 20 s. Simulation, OBJ takes 29 s. Visual, GLB takes 26 s. Visual, OBJ takes 33 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.1 8.7 0.5 ms 7.3 0.3 0.8 0.2 19.8
Simulation, STEP 0.5 2.1 8.1 0.4 ms 7.2 5.3 0.8 0.3 24.1
Simulation, STL 0.5 2.1 8.2 0.5 ms 7.1 0.5 0.8 0.3 19.5
Simulation, OBJ 0.4 2.1 8.3 0.5 ms 7.3 10.0 0.8 0.2 29.3
Visual, GLB 0.5 2.1 8.2 0.4 ms 13.7 0.2 1.2 0.2 26.1
Visual, OBJ 0.5 2.1 8.4 0.5 ms 14.2 5.7 1.7 0.2 32.8
Board Repo: machdyne/eis
Board: eis.kicad_pcb
Folder pcb / eis_v0
Complexity 364 / 1000 (size 269, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 103, 1,474, 220
Triangles, simulation 1,893,902 in 185 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 753 MB
STEP 306 MB 895 MB
STL 95 MB 762 MB
OBJ 200 MB 1.3 GB
Visual
GLB 37 MB 759 MB
OBJ 116 MB 927 MB

1593. ssx

ssx: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 6.4 s. Simulation, STEP takes 8.3 s. Simulation, STL takes 6.1 s. Simulation, OBJ takes 9.6 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.1 0.6 ms 2.7 0.1 0.4 0.2 6.4
Simulation, STEP 0.3 0.6 2.0 0.4 ms 2.6 2.2 0.4 0.2 8.3
Simulation, STL 0.3 0.6 1.9 0.3 ms 2.5 0.2 0.4 0.2 6.1
Simulation, OBJ 0.3 0.5 2.1 0.4 ms 2.6 3.5 0.4 0.2 9.6
Visual, GLB 0.3 0.5 2.0 0.4 ms 5.4 73 ms 0.6 0.3 9.2
Visual, OBJ 0.2 0.6 1.9 0.4 ms 5.4 2.2 0.6 0.2 11.0
Board Repo: machdyne/ferrit
Board: ssx.kicad_pcb
Folder hw / ferrit-1
Complexity 347 / 1000 (size 222, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 43, 546, 60
Triangles, simulation 719,896 in 85 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 349 MB
STEP 97 MB 435 MB
STL 36 MB 350 MB
OBJ 72 MB 533 MB
Visual
GLB 15 MB 378 MB
OBJ 44 MB 405 MB

1594. ssu

ssu: stages 4 and 6 take 49% to 85% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 30 s. Simulation, STL takes 24 s. Simulation, OBJ takes 38 s. Visual, GLB takes 34 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.2 9.8 0.5 ms 9.7 0.6 1.2 0.3 24.4
Simulation, STEP 0.6 1.9 9.4 0.6 ms 9.6 7.0 1.2 0.3 29.9
Simulation, STL 0.6 1.9 9.1 0.5 ms 9.5 1.1 1.4 0.3 23.9
Simulation, OBJ 0.5 1.9 9.2 0.4 ms 9.6 15.6 1.3 0.3 38.3
Visual, GLB 0.5 1.8 9.0 0.8 ms 20.4 0.3 2.2 0.3 34.5
Visual, OBJ 0.5 1.9 9.4 0.6 ms 20.2 7.9 2.5 0.3 42.7
Board Repo: machdyne/ferrit
Board: ssu.kicad_pcb
Folder hw / ferrit-16
Complexity 306 / 1000 (size 191, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 37, 1,219, 50
Triangles, simulation 2,954,306 in 46 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 100 MB 1.1 GB
STEP 396 MB 1.2 GB
STL 148 MB 1.0 GB
OBJ 310 MB 1.9 GB
Visual
GLB 52 MB 989 MB
OBJ 161 MB 1.2 GB

1595. sxy

sxy: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 5.9 s. Simulation, STL takes 4.4 s. Simulation, OBJ takes 6.5 s. Visual, GLB takes 6.5 s. Visual, OBJ takes 8.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.2 0.4 ms 2.0 72 ms 0.3 0.2 4.3
Simulation, STEP 0.2 0.4 1.2 0.3 ms 2.0 1.7 0.3 0.2 5.9
Simulation, STL 0.2 0.4 1.3 0.3 ms 2.0 0.1 0.3 0.2 4.4
Simulation, OBJ 0.2 0.4 1.3 0.2 ms 1.9 2.3 0.3 0.2 6.5
Visual, GLB 0.2 0.4 1.3 0.2 ms 3.9 53 ms 0.4 0.2 6.5
Visual, OBJ 0.2 0.4 1.2 0.2 ms 3.9 1.5 0.6 0.2 8.0
Board Repo: machdyne/ferrit
Board: sxy.kicad_pcb
Folder hw / ferrit-cy
Complexity 349 / 1000 (size 224, features 125)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 45, 591, 64
Triangles, simulation 564,848 in 87 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 19 MB 329 MB
STEP 84 MB 385 MB
STL 28 MB 321 MB
OBJ 56 MB 415 MB
Visual
GLB 13 MB 415 MB
OBJ 38 MB 352 MB

1596. sxa

sxa: stages 4 and 6 take 52% to 80% of a run. Simulation, GLB takes 7.0 s. Simulation, STEP takes 11 s. Simulation, STL takes 7.6 s. Simulation, OBJ takes 11 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.7 0.2 ms 3.7 0.1 0.4 0.2 7.0
Simulation, STEP 0.3 0.6 1.9 0.2 ms 4.0 3.0 0.5 0.3 10.6
Simulation, STL 0.3 0.8 1.9 0.3 ms 3.7 0.3 0.4 0.3 7.6
Simulation, OBJ 0.2 0.6 1.9 0.2 ms 3.7 3.8 0.4 0.3 11.0
Visual, GLB 0.3 0.6 1.7 0.3 ms 5.7 96 ms 0.6 0.2 9.2
Visual, OBJ 0.2 0.6 1.7 0.3 ms 5.2 2.9 0.7 0.2 11.7
Board Repo: machdyne/ferrit
Board: sxa.kicad_pcb
Folder hw / ferrit-m8
Complexity 281 / 1000 (size 181, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
TrueType text, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 30, 525, 103
Triangles, simulation 658,288 in 32 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 357 MB
STEP 92 MB 429 MB
STL 33 MB 357 MB
OBJ 66 MB 466 MB
Visual
GLB 16 MB 483 MB
OBJ 48 MB 484 MB

1597. kaltstahl

kaltstahl: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 5.3 s. Simulation, STEP takes 7.3 s. Simulation, STL takes 5.4 s. Simulation, OBJ takes 7.9 s. Visual, GLB takes 7.8 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.3 0.4 ms 1.9 71 ms 0.2 0.3 5.3
Simulation, STEP 0.2 0.4 2.6 0.3 ms 1.8 1.8 0.3 0.2 7.3
Simulation, STL 0.2 0.4 2.4 0.3 ms 1.8 0.1 0.3 0.3 5.4
Simulation, OBJ 0.3 0.4 2.5 0.4 ms 1.8 2.5 0.2 0.3 7.9
Visual, GLB 0.2 0.4 2.5 0.3 ms 3.9 67 ms 0.4 0.3 7.8
Visual, OBJ 0.2 0.4 2.4 0.3 ms 4.1 1.8 0.4 0.2 9.5
Board Repo: machdyne/kaltstahl
Board: kaltstahl.kicad_pcb
Folder pcb / kaltstahl_v0
Complexity 296 / 1000 (size 201, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 39, 409, 61
Triangles, simulation 393,460 in 66 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 293 MB
STEP 76 MB 341 MB
STL 20 MB 287 MB
OBJ 40 MB 331 MB
Visual
GLB 9.9 MB 313 MB
OBJ 29 MB 318 MB

1598. pmod_ethernet

pmod_ethernet: stages 4 and 6 take 44% to 79% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.5 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.4 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.0 0.2 ms 1.2 60 ms 0.2 0.3 3.3
Simulation, STEP 0.1 0.3 1.1 0.2 ms 1.2 1.3 0.2 0.2 4.5
Simulation, STL 0.2 0.4 1.1 0.2 ms 1.3 88 ms 0.3 0.2 3.4
Simulation, OBJ 0.2 0.3 1.1 0.2 ms 1.3 2.1 0.2 0.2 5.4
Visual, GLB 0.2 0.3 1.0 0.2 ms 2.6 35 ms 0.2 0.2 4.6
Visual, OBJ 0.2 0.3 1.0 0.3 ms 2.6 1.3 0.2 0.2 5.8
Board Repo: machdyne/katze
Board: pmod_ethernet.kicad_pcb
Folder pcb / katze_v1
Complexity 248 / 1000 (size 163, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 21, 257, 30
Triangles, simulation 385,774 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 261 MB
STEP 48 MB 273 MB
STL 19 MB 255 MB
OBJ 38 MB 278 MB
Visual
GLB 7.7 MB 261 MB
OBJ 23 MB 259 MB

1599. kuchen

kuchen: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 24 s. Simulation, STL takes 18 s. Simulation, OBJ takes 27 s. Visual, GLB takes 26 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.6 5.8 0.7 ms 8.6 0.3 0.9 0.3 17.9
Simulation, STEP 0.5 1.6 5.7 0.7 ms 8.9 5.8 1.0 0.2 23.8
Simulation, STL 0.5 1.6 5.8 1.0 ms 8.7 0.6 0.9 0.4 18.5
Simulation, OBJ 0.4 1.6 5.6 0.9 ms 8.8 9.2 1.0 0.3 26.9
Visual, GLB 0.5 1.7 5.8 0.6 ms 16.4 0.2 1.7 0.2 26.4
Visual, OBJ 0.5 1.7 5.7 0.7 ms 15.5 6.0 2.3 0.3 32.0
Board Repo: machdyne/kuchen
Board: kuchen.kicad_pcb
Folder pcb / kuchen_v0
Complexity 367 / 1000 (size 257, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 94, 1,189, 193
Triangles, simulation 1,833,026 in 266 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 61 MB 703 MB
STEP 267 MB 832 MB
STL 92 MB 698 MB
OBJ 194 MB 1.2 GB
Visual
GLB 41 MB 981 MB
OBJ 130 MB 910 MB

1600. lakritz

lakritz: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 26 s. Simulation, STL takes 22 s. Simulation, OBJ takes 31 s. Visual, GLB takes 27 s. Visual, OBJ takes 35 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.6 7.2 0.8 ms 9.0 0.3 0.8 0.3 19.6
Simulation, STEP 0.5 1.6 7.3 0.9 ms 9.9 6.0 0.9 0.2 26.4
Simulation, STL 0.5 1.6 7.6 1 ms 10.1 0.6 0.9 0.3 21.5
Simulation, OBJ 0.5 1.6 7.3 0.9 ms 9.3 10.8 0.8 0.2 30.6
Visual, GLB 0.5 1.7 7.6 1 ms 15.7 0.3 1.6 0.2 27.5
Visual, OBJ 0.5 1.7 7.4 0.8 ms 16.7 6.8 1.9 0.3 35.3
Board Repo: machdyne/lakritz
Board: lakritz.kicad_pcb
Folder pcb / v0
Complexity 390 / 1000 (size 260, features 130)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 103, 1,372, 209
Triangles, simulation 1,936,052 in 266 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 65 MB 711 MB
STEP 293 MB 891 MB
STL 97 MB 733 MB
OBJ 201 MB 1.3 GB
Visual
GLB 42 MB 904 MB
OBJ 130 MB 944 MB

1601. obst

obst: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 34 s. Simulation, STL takes 28 s. Simulation, OBJ takes 40 s. Visual, GLB takes 37 s. Visual, OBJ takes 45 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.4 10.0 1 ms 12.9 0.3 1.4 0.3 27.9
Simulation, STEP 0.5 2.1 9.4 0.8 ms 12.8 7.2 1.2 0.3 33.6
Simulation, STL 0.6 2.3 9.4 0.7 ms 13.2 0.8 1.3 0.3 27.9
Simulation, OBJ 0.5 2.2 9.6 0.7 ms 12.6 13.2 1.3 0.2 39.6
Visual, GLB 0.6 2.3 9.7 0.8 ms 20.8 0.3 2.6 0.3 36.6
Visual, OBJ 0.6 2.2 9.6 1 ms 21.3 8.4 2.9 0.3 45.3
Board Repo: machdyne/obst
Board: obst.kicad_pcb
Folder pcb / mdr_v0b
Complexity 363 / 1000 (size 268, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 142, 1,666, 308
Triangles, simulation 2,753,452 in 280 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 94 MB 922 MB
STEP 393 MB 1.1 GB
STL 138 MB 923 MB
OBJ 288 MB 1.8 GB
Visual
GLB 58 MB 1.3 GB
OBJ 182 MB 1.2 GB

1602. riegel

riegel: stages 4 and 6 take 58% to 84% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 24 s. Simulation, STL takes 21 s. Simulation, OBJ takes 29 s. Visual, GLB takes 25 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.7 9.0 0.9 ms 7.8 0.3 0.7 0.2 20.0
Simulation, STEP 0.4 1.8 8.5 0.9 ms 7.8 4.2 0.8 0.3 23.8
Simulation, STL 0.3 2.0 9.2 0.9 ms 7.6 0.6 0.8 0.3 20.7
Simulation, OBJ 0.3 2.0 9.0 1.0 ms 7.5 8.8 0.8 0.2 28.7
Visual, GLB 0.4 1.9 8.9 0.8 ms 11.9 0.1 1.3 0.2 24.7
Visual, OBJ 0.5 1.9 9.1 0.8 ms 11.5 4.5 1.1 0.2 28.9
Board Repo: machdyne/riegel
Board: riegel.kicad_pcb
Folder pcb / riegel_v4
Complexity 358 / 1000 (size 263, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 89, 1,297, 157
Triangles, simulation 1,733,082 in 152 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 59 MB 622 MB
STEP 278 MB 791 MB
STL 87 MB 617 MB
OBJ 182 MB 1.2 GB
Visual
GLB 33 MB 682 MB
OBJ 100 MB 790 MB

1603. schoko

schoko: stages 4 and 6 take 60% to 85% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 26 s. Simulation, STL takes 23 s. Simulation, OBJ takes 30 s. Visual, GLB takes 28 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.2 10.3 0.6 ms 7.2 0.3 0.8 0.2 21.5
Simulation, STEP 0.4 2.2 9.8 0.6 ms 6.9 5.3 0.9 0.3 25.8
Simulation, STL 0.5 2.3 11.1 0.6 ms 7.6 0.7 0.9 0.3 23.5
Simulation, OBJ 0.4 2.0 10.5 0.6 ms 7.6 8.8 0.8 0.2 30.3
Visual, GLB 0.4 2.0 10.2 1 ms 13.4 0.2 1.3 0.2 27.9
Visual, OBJ 0.4 2.1 10.3 0.6 ms 14.3 5.0 1.5 0.2 33.8
Board Repo: machdyne/schoko
Board: schoko.kicad_pcb
Folder pcb / schoko_v2
Complexity 357 / 1000 (size 262, features 95)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 108, 1,544, 207
Triangles, simulation 2,133,590 in 269 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 73 MB 774 MB
STEP 349 MB 972 MB
STL 107 MB 728 MB
OBJ 227 MB 1.4 GB
Visual
GLB 41 MB 978 MB
OBJ 127 MB 1.0 GB

1604. Main

Main: stages 4 and 6 take 55% to 81% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 26 s. Simulation, STL takes 21 s. Simulation, OBJ takes 28 s. Visual, GLB takes 35 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 2.8 8.0 1 ms 7.1 0.3 0.6 0.3 20.8
Simulation, STEP 1.6 2.8 8.4 1 ms 7.4 5.3 0.6 0.3 26.3
Simulation, STL 1.6 2.6 8.0 0.9 ms 7.0 0.5 0.6 0.3 20.6
Simulation, OBJ 1.6 2.7 8.2 1 ms 7.2 7.2 0.7 0.3 27.8
Visual, GLB 1.7 2.8 8.1 1.0 ms 20.2 0.2 1.9 0.3 35.1
Visual, OBJ 1.7 2.8 8.3 1 ms 20.6 6.9 2.2 0.3 42.9
Board Repo: makerspet/oomwoo-pcb
Board: Main.kicad_pcb
Folder kicad / main
Complexity 228 / 1000 (size 138, features 90)
KESE features slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
copper drawings, copper text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 385, 0, 0
Triangles, simulation 1,448,360 in 433 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 861 MB
STEP 259 MB 904 MB
STL 72 MB 837 MB
OBJ 157 MB 1.1 GB
Visual
GLB 47 MB 1.1 GB
OBJ 140 MB 1.1 GB

1605. Main_PDB

Main_PDB: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 53 s. Simulation, STL takes 45 s. Simulation, OBJ takes 70 s. Visual, GLB takes 54 s. Visual, OBJ takes 63 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 5.1 16.1 2 ms 18.3 0.9 2.2 0.4 44.1
Simulation, STEP 1.2 5.3 16.2 2 ms 18.1 9.8 2.2 0.3 53.2
Simulation, STL 1.2 4.9 15.6 1 ms 18.5 1.9 2.3 0.3 44.7
Simulation, OBJ 1.2 5.3 17.0 1 ms 18.3 25.4 2.3 0.3 69.8
Visual, GLB 1.0 5.1 15.7 1 ms 29.0 0.2 3.0 0.3 54.4
Visual, OBJ 1.1 5.1 16.0 1 ms 28.0 9.6 3.0 0.3 63.1
Board Repo: malcollm/pdb
Board: Main_PDB.kicad_pcb
Complexity 325 / 1000 (size 215, features 110)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 186, 454, 216
Triangles, simulation 5,174,936 in 122 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 171 MB 1.3 GB
STEP 574 MB 1.5 GB
STL 259 MB 1.3 GB
OBJ 543 MB 3.3 GB
Visual
GLB 67 MB 1.3 GB
OBJ 211 MB 1.6 GB

1606. homebrew_486

homebrew_486: stages 4 and 6 take 48% to 85% of a run. Simulation, GLB takes 93 s. Simulation, STEP takes 2 min. Simulation, STL takes 98 s. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 9.2 35.2 2 ms 38.1 1.8 6.3 0.4 93.2
Simulation, STEP 2.2 9.0 35.0 1 ms 37.8 26.4 6.3 0.4 117.2
Simulation, STL 2.3 9.0 36.1 1 ms 40.0 3.6 6.4 0.4 97.8
Simulation, OBJ 2.3 9.3 36.0 1 ms 39.6 62.9 6.7 0.5 157.3
Visual, GLB 2.3 9.6 36.1 1 ms 90.1 1.0 9.1 0.3 148.5
Visual, OBJ 2.2 9.1 35.3 1 ms 87.3 38.3 9.1 0.3 181.6
Board Repo: maniekx86/m8sbc-486
Board: homebrew_486.kicad_pcb
Folder pcb
Complexity 393 / 1000 (size 288, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, TrueType text,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 122, 10,279, 1,150
Triangles, simulation 10,969,982 in 348 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 372 MB 2.9 GB
STEP 1.5 GB 3.6 GB
STL 549 MB 2.8 GB
OBJ 1.2 GB 6.8 GB
Visual
GLB 238 MB 3.7 GB
OBJ 768 MB 4.8 GB

1607. pcb

pcb: stages 4 and 6 take 41% to 76% of a run. Simulation, GLB takes 31 s. Simulation, STEP takes 37 s. Simulation, STL takes 30 s. Simulation, OBJ takes 52 s. Visual, GLB takes 46 s. Visual, OBJ takes 55 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.8 8.4 1 ms 12.6 0.5 2.0 0.4 31.1
Simulation, STEP 0.9 5.0 7.8 1 ms 12.8 8.2 2.0 0.3 37.0
Simulation, STL 0.9 5.2 8.2 1 ms 12.3 1.1 2.0 0.3 30.0
Simulation, OBJ 0.9 5.3 8.0 1 ms 13.4 22.1 2.3 0.4 52.4
Visual, GLB 1.2 6.0 9.0 1 ms 26.1 0.3 3.1 0.3 46.1
Visual, OBJ 0.9 5.3 8.3 1 ms 26.7 10.1 3.6 0.3 55.2
Board Repo: manyetox/huma-rocket-flight-computer
Board: pcb.kicad_pcb
Folder hardware
Complexity 405 / 1000 (size 270, features 135)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 151, 2,313, 327
Triangles, simulation 3,307,666 in 184 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 111 MB 949 MB
STEP 417 MB 1.3 GB
STL 165 MB 985 MB
OBJ 347 MB 2.1 GB
Visual
GLB 61 MB 1.2 GB
OBJ 194 MB 1.3 GB

1608. dexx_video_adapter

dexx_video_adapter: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 5.5 s. Simulation, STEP takes 7.1 s. Simulation, STL takes 5.5 s. Simulation, OBJ takes 8.6 s. Visual, GLB takes 8.6 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.4 ms 1.8 84 ms 0.4 0.2 5.5
Simulation, STEP 0.2 0.5 2.5 0.4 ms 1.7 1.6 0.4 0.3 7.1
Simulation, STL 0.2 0.6 2.4 0.5 ms 1.7 0.2 0.3 0.2 5.5
Simulation, OBJ 0.2 0.5 2.6 0.3 ms 1.8 2.9 0.3 0.3 8.6
Visual, GLB 0.2 0.5 2.4 0.4 ms 4.5 65 ms 0.6 0.3 8.6
Visual, OBJ 0.2 0.6 2.4 0.3 ms 4.9 1.8 0.6 0.2 10.7
Board Repo: marqs85/ossc_pro_hw
Board: dexx_video_adapter.kicad_pcb
Folder adapters / av_adapter
Complexity 228 / 1000 (size 143, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 10 (20260206)
Parts, tracks, vias 11, 107, 109
Triangles, simulation 538,966 in 36 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 18 MB 317 MB
STEP 64 MB 351 MB
STL 27 MB 331 MB
OBJ 54 MB 397 MB
Visual
GLB 13 MB 366 MB
OBJ 38 MB 358 MB

1609. pcb1p5_hv_syncfix

pcb1p5_hv_syncfix: stages 4 and 6 take 42% to 58% of a run. Simulation, GLB takes 0.8 s. Simulation, STEP takes 1.0 s. Simulation, STL takes 0.8 s. Simulation, OBJ takes 0.8 s. Visual, GLB takes 1.0 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 80 ms 57 ms 0.2 0.1 ms 0.2 7 ms 23 ms 0.2 0.8
Simulation, STEP 74 ms 53 ms 0.2 0.1 ms 0.3 0.2 22 ms 0.2 1.0
Simulation, STL 81 ms 51 ms 0.2 0.1 ms 0.2 8 ms 18 ms 0.2 0.8
Simulation, OBJ 69 ms 42 ms 0.2 0.1 ms 0.2 0.1 20 ms 0.2 0.8
Visual, GLB 91 ms 52 ms 0.2 0.1 ms 0.4 5 ms 39 ms 0.2 1.0
Visual, OBJ 83 ms 54 ms 0.2 0.1 ms 0.4 0.2 37 ms 0.2 1.1
Board Repo: marqs85/ossc_pro_hw
Board: pcb1p5_hv_syncfix.kicad_pcb
Folder adapters / pcb1p5_hv_syncfix
Complexity 170 / 1000 (size 95, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 2, 34, 8
Triangles, simulation 30,502 in 14 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.1 MB 66 MB
STEP 5.1 MB 70 MB
STL 1.5 MB 66 MB
OBJ 2.9 MB 71 MB
Visual
GLB 954 kB 96 MB
OBJ 2.5 MB 98 MB

1610. panel

panel: stages 4 and 6 take 44% to 76% of a run. Simulation, GLB takes 1.5 s. Simulation, STEP takes 2.2 s. Simulation, STL takes 1.5 s. Simulation, OBJ takes 2.0 s. Visual, GLB takes 1.8 s. Visual, OBJ takes 2.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 82 ms 85 ms 0.5 0.2 ms 0.6 16 ms 59 ms 0.2 1.5
Simulation, STEP 80 ms 91 ms 0.5 0.1 ms 0.5 0.8 58 ms 0.2 2.2
Simulation, STL 74 ms 79 ms 0.4 0.1 ms 0.6 23 ms 67 ms 0.2 1.5
Simulation, OBJ 81 ms 93 ms 0.4 0.1 ms 0.5 0.6 57 ms 0.2 2.0
Visual, GLB 79 ms 80 ms 0.5 0.1 ms 0.9 9 ms 62 ms 0.2 1.8
Visual, OBJ 78 ms 81 ms 0.4 0.1 ms 0.9 0.4 65 ms 0.2 2.1
Board Repo: marqs85/ossc_pro_hw
Board: panel.kicad_pcb
Folder buttonpanel
Complexity 87 / 1000 (size 87, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 5, 21, 0
Triangles, simulation 100,836 in 19 parts
Note panel
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 3.5 MB 176 MB
STEP 15 MB 182 MB
STL 5.0 MB 181 MB
OBJ 9.7 MB 178 MB
Visual
GLB 1.7 MB 154 MB
OBJ 4.7 MB 153 MB

1611. extra_av_out

extra_av_out: stages 4 and 6 take 48% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 28 s. Visual, GLB takes 25 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.1 7.3 2 ms 7.0 0.3 0.9 0.3 18.3
Simulation, STEP 0.5 1.9 7.1 0.8 ms 6.6 4.9 0.8 0.3 22.0
Simulation, STL 0.5 2.0 7.1 0.7 ms 6.8 0.6 0.9 0.3 18.2
Simulation, OBJ 0.5 2.0 6.9 2 ms 6.6 10.9 0.9 0.3 28.1
Visual, GLB 0.5 2.0 7.1 0.7 ms 13.7 0.2 1.5 0.3 25.2
Visual, OBJ 0.5 2.0 7.3 0.8 ms 13.8 6.6 1.5 0.3 32.0
Board Repo: marqs85/ossc_pro_hw
Board: extra_av_out.kicad_pcb
Folder expansions / extra_av_out
Complexity 297 / 1000 (size 242, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 10 (20260206)
Parts, tracks, vias 73, 800, 316
Triangles, simulation 1,899,088 in 111 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 723 MB
STEP 215 MB 860 MB
STL 95 MB 712 MB
OBJ 196 MB 1.3 GB
Visual
GLB 38 MB 744 MB
OBJ 114 MB 861 MB

1612. legacy_av_in

legacy_av_in: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 22 s. Visual, GLB takes 21 s. Visual, OBJ takes 25 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.6 5.8 0.6 ms 5.5 0.3 0.7 0.2 14.4
Simulation, STEP 0.3 1.6 6.0 0.8 ms 5.5 3.5 0.7 0.3 17.9
Simulation, STL 0.4 1.7 5.7 0.7 ms 5.6 0.5 0.7 0.2 14.8
Simulation, OBJ 0.5 1.8 5.9 0.7 ms 5.4 7.5 0.7 0.3 22.1
Visual, GLB 0.4 1.6 5.8 0.4 ms 11.7 0.2 1.2 0.2 21.1
Visual, OBJ 0.4 1.6 6.0 3 ms 11.5 4.4 1.4 0.2 25.4
Board Repo: marqs85/ossc_pro_hw
Board: legacy_av_in.kicad_pcb
Folder expansions / legacy_av_in
Complexity 341 / 1000 (size 261, features 80)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 87, 786, 394
Triangles, simulation 1,904,396 in 119 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 838 MB
STEP 192 MB 862 MB
STL 95 MB 820 MB
OBJ 197 MB 1.3 GB
Visual
GLB 38 MB 744 MB
OBJ 114 MB 844 MB

1613. ram_board

ram_board: stages 4 and 6 take 45% to 82% of a run. Simulation, GLB takes 7.5 s. Simulation, STEP takes 9.7 s. Simulation, STL takes 7.5 s. Simulation, OBJ takes 12 s. Visual, GLB takes 10 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 2.6 0.3 ms 2.9 0.1 0.6 0.2 7.5
Simulation, STEP 0.2 0.8 2.6 0.3 ms 3.0 2.3 0.6 0.2 9.7
Simulation, STL 0.2 0.8 2.6 0.3 ms 3.0 0.2 0.5 0.2 7.5
Simulation, OBJ 0.2 0.9 2.6 0.3 ms 2.9 4.9 0.5 0.2 12.2
Visual, GLB 0.3 0.8 2.6 0.3 ms 5.9 71 ms 0.5 0.2 10.4
Visual, OBJ 0.2 0.8 2.6 0.3 ms 5.8 2.5 0.8 0.2 12.9
Board Repo: marqs85/ossc_pro_hw
Board: ram_board.kicad_pcb
Folder expansions / ram_board
Complexity 254 / 1000 (size 169, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 11, 288, 153
Triangles, simulation 938,910 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 31 MB 439 MB
STEP 104 MB 509 MB
STL 47 MB 465 MB
OBJ 94 MB 644 MB
Visual
GLB 17 MB 494 MB
OBJ 52 MB 448 MB

1614. ossc_pro

ossc_pro: stages 4 and 6 take 55% to 76% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 45 s. Simulation, STL takes 38 s. Simulation, OBJ takes 49 s. Visual, GLB takes 40 s. Visual, OBJ takes 47 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.5 7.1 15.2 1 ms 11.4 0.4 0.9 0.3 36.8
Simulation, STEP 1.5 6.8 15.1 1 ms 11.9 8.4 1.0 0.3 45.0
Simulation, STL 1.5 7.0 15.0 1 ms 12.1 0.9 1.0 0.3 37.8
Simulation, OBJ 1.4 6.9 14.9 1 ms 11.7 12.4 0.9 0.3 48.7
Visual, GLB 1.4 6.5 14.7 1 ms 15.7 0.2 1.2 0.3 39.9
Visual, OBJ 1.5 6.8 14.9 1 ms 15.1 6.6 1.7 0.3 47.0
Board Repo: marqs85/ossc_pro_hw
Board: ossc_pro.kicad_pcb
Complexity 154 / 1000 (size 134, features 20)
KESE features slotted holes, rounded,
trapezoid or chamfered pads
Tested 9th November 2026
Copper layers 2
File format KiCad 9 (20241229)
Parts, tracks, vias 492, 0, 0
Triangles, simulation 2,163,518 in 533 parts
Note mostly unrouted
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 74 MB 818 MB
STEP 389 MB 1.1 GB
STL 108 MB 828 MB
OBJ 229 MB 1.5 GB
Visual
GLB 38 MB 1.1 GB
OBJ 114 MB 913 MB

1615. aux_board

aux_board: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 18 s. Simulation, OBJ takes 26 s. Visual, GLB takes 24 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.7 7.4 1 ms 6.5 0.3 0.8 0.2 17.5
Simulation, STEP 0.5 1.8 7.4 0.8 ms 6.7 4.5 0.8 0.2 21.9
Simulation, STL 0.4 1.8 7.2 0.7 ms 6.6 0.6 0.8 0.2 17.7
Simulation, OBJ 0.4 1.8 7.4 1.0 ms 6.7 8.5 0.8 0.2 25.8
Visual, GLB 0.5 1.7 7.2 0.7 ms 12.9 0.2 1.5 0.2 24.2
Visual, OBJ 0.5 1.8 7.6 0.8 ms 12.5 5.4 1.5 0.2 29.4
Board Repo: matthiasgeorgimhof/hardware_csat
Board: aux_board.kicad_pcb
Folder aux_board
Complexity 350 / 1000 (size 245, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 125, 825, 201
Triangles, simulation 2,157,750 in 180 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 693 MB
STEP 266 MB 890 MB
STL 108 MB 709 MB
OBJ 224 MB 1.4 GB
Visual
GLB 43 MB 955 MB
OBJ 130 MB 958 MB

1616. auxio_board

auxio_board: stages 4 and 6 take 54% to 84% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 28 s. Simulation, STL takes 22 s. Simulation, OBJ takes 32 s. Visual, GLB takes 32 s. Visual, OBJ takes 38 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.2 9.5 0.9 ms 8.5 0.3 1.1 0.2 22.4
Simulation, STEP 0.6 2.3 9.1 0.8 ms 8.7 5.6 1.0 0.2 27.6
Simulation, STL 0.5 2.2 9.6 0.9 ms 8.1 0.9 1.0 0.2 22.5
Simulation, OBJ 0.6 2.3 9.2 0.8 ms 8.1 10.7 1.2 0.3 32.2
Visual, GLB 0.6 2.4 9.9 1.0 ms 17.2 0.2 1.8 0.3 32.3
Visual, OBJ 0.5 2.4 9.6 1 ms 16.4 6.5 2.1 0.3 37.8
Board Repo: matthiasgeorgimhof/hardware_csat
Board: auxio_board.kicad_pcb
Folder auxio_board
Complexity 351 / 1000 (size 246, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 128, 942, 204
Triangles, simulation 2,361,290 in 180 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 79 MB 766 MB
STEP 292 MB 986 MB
STL 118 MB 758 MB
OBJ 246 MB 1.6 GB
Visual
GLB 47 MB 995 MB
OBJ 143 MB 1.0 GB

1617. AVIONICS_BOARD

AVIONICS_BOARD: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 32 s. Simulation, STEP takes 40 s. Simulation, STL takes 33 s. Simulation, OBJ takes 48 s. Visual, GLB takes 47 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 3.4 12.4 2 ms 13.4 0.5 1.6 0.3 32.5
Simulation, STEP 0.7 3.3 12.9 2 ms 12.7 8.6 1.6 0.3 40.0
Simulation, STL 0.8 3.0 12.4 2 ms 13.4 1.2 1.7 0.3 32.8
Simulation, OBJ 0.8 3.4 12.4 2 ms 13.1 15.9 1.7 0.3 47.6
Visual, GLB 0.9 3.3 12.0 2 ms 26.4 0.3 3.3 0.3 46.6
Visual, OBJ 0.9 3.1 12.8 2 ms 26.9 10.1 3.3 0.3 57.4
Board Repo: matthiasgeorgimhof/hardware_csat
Board: AVIONICS_BOARD.kicad_pcb
Folder avionics_board
Complexity 367 / 1000 (size 262, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 182, 2,001, 367
Triangles, simulation 3,369,990 in 275 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 113 MB 1.1 GB
STEP 435 MB 1.4 GB
STL 169 MB 1.1 GB
OBJ 355 MB 2.2 GB
Visual
GLB 69 MB 1.3 GB
OBJ 217 MB 1.4 GB

1618. comm_board

comm_board: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 33 s. Simulation, STL takes 27 s. Simulation, OBJ takes 41 s. Visual, GLB takes 37 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 2.6 9.9 1 ms 11.1 0.5 1.1 0.3 26.3
Simulation, STEP 0.8 2.4 9.6 0.9 ms 11.8 7.2 1.2 0.3 33.3
Simulation, STL 0.9 2.4 9.7 1 ms 11.5 0.8 1.5 0.4 27.2
Simulation, OBJ 1.0 2.6 10.1 1 ms 11.8 14.0 1.2 0.4 41.0
Visual, GLB 0.8 2.7 9.9 1 ms 21.0 0.2 2.1 0.3 37.1
Visual, OBJ 0.8 2.4 9.6 1 ms 20.1 8.8 2.2 0.3 44.1
Board Repo: matthiasgeorgimhof/hardware_csat
Board: comm_board.kicad_pcb
Folder comm_board
Complexity 365 / 1000 (size 260, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 178, 1,254, 204
Triangles, simulation 2,325,158 in 222 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 78 MB 811 MB
STEP 326 MB 973 MB
STL 116 MB 822 MB
OBJ 243 MB 1.5 GB
Visual
GLB 51 MB 1.1 GB
OBJ 158 MB 1.1 GB

1619. EPS

EPS: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 47 s. Simulation, STEP takes 59 s. Simulation, STL takes 48 s. Simulation, OBJ takes 74 s. Visual, GLB takes 67 s. Visual, OBJ takes 80 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 4.0 20.0 1 ms 18.4 0.7 2.6 0.3 47.1
Simulation, STEP 1.1 3.9 19.9 1 ms 18.7 12.2 2.6 0.4 58.7
Simulation, STL 1.0 3.8 19.9 0.9 ms 18.6 1.7 2.6 0.3 47.9
Simulation, OBJ 1.1 3.9 20.2 1.0 ms 18.7 26.9 2.7 0.3 73.7
Visual, GLB 1.0 3.9 20.5 2 ms 36.2 0.5 4.2 0.3 66.6
Visual, OBJ 1.2 4.0 20.2 1.0 ms 35.8 14.3 3.9 0.4 79.7
Board Repo: matthiasgeorgimhof/hardware_csat
Board: EPS.kicad_pcb
Folder eps_board
Complexity 372 / 1000 (size 267, features 105)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 242, 2,354, 416
Triangles, simulation 4,561,054 in 261 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 153 MB 1.4 GB
STEP 630 MB 1.6 GB
STL 228 MB 1.3 GB
OBJ 484 MB 2.9 GB
Visual
GLB 82 MB 1.5 GB
OBJ 259 MB 1.7 GB

1620. sci_board

sci_board: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 37 s. Simulation, STEP takes 46 s. Simulation, STL takes 37 s. Simulation, OBJ takes 60 s. Visual, GLB takes 67 s. Visual, OBJ takes 77 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.2 14.0 2 ms 15.5 0.5 1.7 0.3 37.3
Simulation, STEP 1.0 4.2 13.8 0.7 ms 15.2 9.3 1.8 0.3 45.6
Simulation, STL 1.1 4.2 13.8 0.9 ms 15.2 1.1 1.6 0.3 37.2
Simulation, OBJ 1.1 4.1 14.4 1 ms 14.9 22.8 2.8 0.3 60.4
Visual, GLB 1.4 5.8 18.9 2 ms 36.3 0.4 3.5 0.4 66.8
Visual, OBJ 1.1 4.6 14.9 0.8 ms 37.7 13.5 5.3 0.3 77.4
Board Repo: matthiasgeorgimhof/hardware_csat
Board: sci_board.kicad_pcb
Folder sci_board.inactive
Complexity 397 / 1000 (size 267, features 130)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 210, 2,498, 466
Triangles, simulation 3,299,186 in 282 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 111 MB 1.1 GB
STEP 450 MB 1.4 GB
STL 165 MB 1.1 GB
OBJ 348 MB 2.2 GB
Visual
GLB 75 MB 1.5 GB
OBJ 237 MB 1.6 GB
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