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Corpus Testing 10

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Corpus Page 10

Part 10 of 29 of Corpus Testing: every board of these projects, six runs each, one file format a run, as Corpus Testing describes.

10.1 ESP32 Demo Project

ESP32 Demo Project: stages 4 and 6 take 47% to 81% of a run. Simulation, GLB takes 9.4 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.3 s. Simulation, OBJ takes 15 s. Visual, GLB takes 14 s. Visual, OBJ takes 18 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.0 3.6 0.3 ms 3.5 0.2 0.5 0.2 9.4
Simulation, STEP 0.3 1.0 3.6 0.4 ms 3.5 2.7 0.4 0.2 11.9
Simulation, STL 0.3 1.0 3.6 0.3 ms 3.4 0.3 0.5 0.2 9.3
Simulation, OBJ 0.4 1.0 3.6 0.5 ms 3.5 5.9 0.5 0.3 15.2
Visual, GLB 0.3 1.0 3.7 0.4 ms 7.5 0.1 0.9 0.2 13.7
Visual, OBJ 0.3 1.1 3.6 0.6 ms 7.7 3.9 1.0 0.3 17.9
Board Repo: gitRaksha/esp32-4layer-iot-board
Board: ESP32 Demo Project.kicad_pcb
Complexity 305 / 1000 (size 195, features 110)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
curved board outline, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 80, 700, 123
Triangles, simulation 978,974 in 89 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 442 MB
STEP 127 MB 499 MB
STL 49 MB 454 MB
OBJ 100 MB 711 MB
Visual
GLB 21 MB 549 MB
OBJ 63 MB 538 MB

10.2 glasgow

glasgow: stages 4 and 6 take 48% to 80% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 17 s. Visual, GLB takes 17 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.5 3.8 0.3 ms 4.1 0.2 0.6 0.3 10.8
Simulation, STEP 0.3 1.5 4.1 0.4 ms 3.9 3.1 0.5 0.2 13.8
Simulation, STL 0.3 1.6 3.9 0.3 ms 4.0 0.4 0.5 0.2 11.0
Simulation, OBJ 0.4 1.5 4.0 0.4 ms 4.0 6.0 0.6 0.3 16.8
Visual, GLB 0.4 1.5 3.8 0.4 ms 9.5 0.2 1.0 0.3 16.6
Visual, OBJ 0.3 1.4 3.9 0.4 ms 9.1 4.2 1.2 0.2 20.3
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revA
Complexity 296 / 1000 (size 251, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 101, 1,151, 160
Triangles, simulation 1,236,276 in 124 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 43 MB 465 MB
STEP 155 MB 600 MB
STL 62 MB 502 MB
OBJ 127 MB 846 MB
Visual
GLB 28 MB 600 MB
OBJ 86 MB 698 MB

10.3 glasgow

glasgow: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 17 s. Visual, GLB takes 16 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.5 4.3 1 ms 4.1 0.2 0.5 0.3 11.3
Simulation, STEP 0.3 1.5 4.0 0.6 ms 4.1 3.0 0.5 0.3 13.8
Simulation, STL 0.3 1.4 4.0 1 ms 4.0 0.4 0.6 0.2 10.9
Simulation, OBJ 0.3 1.5 4.1 0.7 ms 4.2 6.1 0.5 0.3 17.0
Visual, GLB 0.3 1.3 3.8 0.6 ms 9.5 0.1 1.1 0.2 16.4
Visual, OBJ 0.5 1.6 4.0 1 ms 9.4 4.2 1.0 0.2 21.0
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revB
Complexity 298 / 1000 (size 253, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 106, 1,300, 163
Triangles, simulation 1,302,156 in 156 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 45 MB 502 MB
STEP 166 MB 627 MB
STL 65 MB 497 MB
OBJ 134 MB 917 MB
Visual
GLB 30 MB 663 MB
OBJ 90 MB 683 MB

10.4 glasgow

glasgow: stages 4 and 6 take 48% to 81% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 35 s. Simulation, STL takes 28 s. Simulation, OBJ takes 42 s. Visual, GLB takes 43 s. Visual, OBJ takes 54 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 3.7 10.1 1 ms 10.3 0.5 1.4 0.4 27.2
Simulation, STEP 0.8 3.7 10.2 1 ms 10.4 7.8 1.4 0.3 34.6
Simulation, STL 0.8 3.9 10.2 1 ms 10.0 1.1 1.3 0.4 27.7
Simulation, OBJ 0.9 3.7 9.7 2 ms 10.4 15.2 1.5 0.3 41.7
Visual, GLB 0.8 3.5 10.3 1 ms 24.7 0.3 3.4 0.3 43.2
Visual, OBJ 0.7 3.5 10.3 1 ms 25.0 10.1 3.7 0.3 53.6
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revC0
Complexity 341 / 1000 (size 286, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 187, 4,561, 325
Triangles, simulation 2,954,940 in 238 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 102 MB 902 MB
STEP 446 MB 1.2 GB
STL 148 MB 955 MB
OBJ 312 MB 1.9 GB
Visual
GLB 70 MB 1.4 GB
OBJ 220 MB 1.5 GB

10.5 glasgow

glasgow: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 34 s. Simulation, STL takes 29 s. Simulation, OBJ takes 42 s. Visual, GLB takes 43 s. Visual, OBJ takes 57 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.4 10.0 0.6 ms 11.3 0.6 1.4 0.3 27.8
Simulation, STEP 0.8 3.7 9.8 0.6 ms 10.6 7.4 1.4 0.3 34.0
Simulation, STL 0.8 3.6 10.6 0.7 ms 11.0 1.1 1.3 0.3 28.7
Simulation, OBJ 0.7 3.2 10.4 0.7 ms 11.2 14.8 1.4 0.2 42.0
Visual, GLB 0.8 3.5 9.6 0.6 ms 25.1 0.3 3.3 0.3 43.0
Visual, OBJ 0.8 3.5 11.1 1.0 ms 27.4 9.9 3.6 0.2 56.5
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revC1
Complexity 378 / 1000 (size 288, features 90)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
drill offsets, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 211, 4,790, 386
Triangles, simulation 3,515,526 in 261 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 121 MB 1.1 GB
STEP 513 MB 1.3 GB
STL 176 MB 1.1 GB
OBJ 373 MB 2.3 GB
Visual
GLB 82 MB 1.4 GB
OBJ 257 MB 1.7 GB

10.6 glasgow

glasgow: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 34 s. Simulation, STEP takes 43 s. Simulation, STL takes 32 s. Simulation, OBJ takes 52 s. Visual, GLB takes 47 s. Visual, OBJ takes 59 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 3.4 12.4 0.8 ms 14.1 0.7 1.6 0.3 33.5
Simulation, STEP 1.1 3.5 12.3 0.7 ms 14.7 9.3 1.5 0.3 42.5
Simulation, STL 1.0 3.1 11.9 0.7 ms 13.8 1.0 1.4 0.2 32.5
Simulation, OBJ 0.9 3.4 11.8 0.6 ms 13.7 20.5 1.5 0.3 52.1
Visual, GLB 1.0 3.2 12.1 0.7 ms 27.2 0.3 3.2 0.3 47.5
Visual, OBJ 0.9 3.3 11.7 1 ms 26.2 12.8 3.4 0.2 58.6
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revC2
Complexity 380 / 1000 (size 290, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 237, 4,737, 411
Triangles, simulation 3,784,492 in 241 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 128 MB 1.1 GB
STEP 524 MB 1.4 GB
STL 189 MB 1.2 GB
OBJ 397 MB 2.5 GB
Visual
GLB 81 MB 1.6 GB
OBJ 258 MB 1.7 GB

10.7 glasgow

glasgow: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 40 s. Simulation, STEP takes 51 s. Simulation, STL takes 42 s. Simulation, OBJ takes 61 s. Visual, GLB takes 56 s. Visual, OBJ takes 69 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.1 3.9 14.1 1 ms 18.4 0.6 1.7 0.3 40.2
Simulation, STEP 1.2 3.7 14.5 0.6 ms 19.3 10.6 1.8 0.3 51.4
Simulation, STL 1.1 3.8 14.0 0.6 ms 19.2 1.4 1.7 0.3 41.6
Simulation, OBJ 1.2 3.8 13.6 1 ms 18.8 21.5 1.7 0.3 60.9
Visual, GLB 1.1 3.8 14.2 0.7 ms 31.8 0.4 4.2 0.3 55.6
Visual, OBJ 1.1 3.7 13.6 1 ms 31.0 14.4 4.5 0.3 68.6
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revC3
Complexity 389 / 1000 (size 289, features 100)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 238, 4,662, 409
Triangles, simulation 3,938,690 in 265 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 132 MB 1.2 GB
STEP 597 MB 1.5 GB
STL 197 MB 1.2 GB
OBJ 415 MB 2.6 GB
Visual
GLB 89 MB 1.5 GB
OBJ 283 MB 1.9 GB

10.8 glasgow

glasgow: stages 4 and 6 take 49% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.4 9.9 42.7 2 ms 43.3 1.9 6.5 0.5 107.3
Simulation, STEP 2.3 9.3 41.7 2 ms 43.6 27.3 6.5 0.4 131.1
Simulation, STL 2.7 9.5 41.2 2 ms 42.7 4.8 7.1 0.5 108.7
Simulation, OBJ 2.4 8.8 41.8 2 ms 42.4 69.9 6.6 0.6 172.4
Visual, GLB 2.6 9.0 41.9 2 ms 113.6 1.0 14.7 0.4 183.2
Visual, OBJ 2.2 8.5 40.3 3 ms 116.3 34.4 14.3 0.3 216.2
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revD0
Complexity 449 / 1000 (size 324, features 125)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 711, 7,621, 1,429
Triangles, simulation 11,344,886 in 599 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 378 MB 2.8 GB
STEP 1.6 GB 3.9 GB
STL 567 MB 2.7 GB
OBJ 1.2 GB 7.1 GB
Visual
GLB 223 MB 3.6 GB
OBJ 735 MB 4.7 GB

10.9 glasgow

glasgow: stages 4 and 6 take 50% to 85% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 8.7 37.8 2 ms 43.6 1.8 6.2 0.4 100.6
Simulation, STEP 2.2 9.2 38.1 3 ms 43.4 26.4 5.9 0.5 125.8
Simulation, STL 2.1 8.9 39.1 2 ms 44.4 5.0 6.3 0.5 106.2
Simulation, OBJ 2.1 9.1 38.0 2 ms 43.6 63.3 6.0 0.4 162.5
Visual, GLB 2.1 8.6 37.1 3 ms 110.4 1.0 14.2 0.4 173.9
Visual, OBJ 2.1 8.9 37.9 2 ms 108.6 32.3 13.2 0.3 203.3
Board Repo: GlasgowEmbedded/glasgow
Board: glasgow.kicad_pcb
Folder hardware / boards / glasgow / revD1
Complexity 465 / 1000 (size 325, features 140)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, stack-up,
dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 6
File format KiCad 10 (20260206)
Parts, tracks, vias 746, 7,211, 1,532
Triangles, simulation 12,015,490 in 614 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 400 MB 2.7 GB
STEP 1.6 GB 4.0 GB
STL 601 MB 2.8 GB
OBJ 1.3 GB 7.5 GB
Visual
GLB 235 MB 3.8 GB
OBJ 776 MB 4.8 GB

10.10 test-jig

test-jig: stages 4 and 6 take 59% to 84% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 34 s. Visual, GLB takes 33 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.1 12.2 2 ms 7.4 0.4 1.0 0.3 23.8
Simulation, STEP 0.5 2.1 12.4 2 ms 7.6 5.2 0.9 0.3 29.0
Simulation, STL 0.5 2.2 12.0 0.9 ms 7.4 0.7 0.9 0.3 24.0
Simulation, OBJ 0.4 2.0 12.3 1 ms 7.4 10.0 1.0 0.3 33.5
Visual, GLB 0.4 2.2 12.0 1 ms 16.2 0.2 2.0 0.3 33.5
Visual, OBJ 0.4 2.2 12.1 0.9 ms 16.0 7.3 2.1 0.2 40.4
Board Repo: GlasgowEmbedded/glasgow
Board: test-jig.kicad_pcb
Folder hardware / boards / test-jig
Complexity 270 / 1000 (size 190, features 80)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 117, 1,257, 123
Triangles, simulation 1,980,538 in 106 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 69 MB 722 MB
STEP 372 MB 855 MB
STL 99 MB 792 MB
OBJ 210 MB 1.4 GB
Visual
GLB 47 MB 936 MB
OBJ 143 MB 1.0 GB

10.11 gmm

gmm: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 48 s. Simulation, STEP takes 60 s. Simulation, STL takes 53 s. Simulation, OBJ takes 78 s. Visual, GLB takes 72 s. Visual, OBJ takes 87 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.2 5.8 14.9 0.7 ms 21.9 1.1 2.6 0.4 47.7
Simulation, STEP 1.1 5.4 15.5 0.9 ms 22.2 12.6 3.1 0.4 60.2
Simulation, STL 1.1 6.3 16.2 0.8 ms 23.6 2.9 3.0 0.4 53.4
Simulation, OBJ 1.1 5.8 15.2 0.8 ms 23.2 30.0 2.7 0.4 78.4
Visual, GLB 1.2 5.6 15.9 0.9 ms 42.9 0.5 5.9 0.4 72.4
Visual, OBJ 1.1 5.7 15.6 1 ms 41.4 16.8 6.4 0.4 87.4
Board Repo: GMM-7550/gmm7550-hardware
Board: gmm.kicad_pcb
Folder gmm7550.kicad
Complexity 430 / 1000 (size 300, features 130)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
curved board outline, stack-up,
dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 240, 3,535, 855
Triangles, simulation 5,758,096 in 293 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 190 MB 1.4 GB
STEP 627 MB 2.1 GB
STL 288 MB 1.4 GB
OBJ 610 MB 3.6 GB
Visual
GLB 105 MB 1.9 GB
OBJ 344 MB 2.3 GB

10.12 hat-gmm7550

hat-gmm7550: stages 4 and 6 take 46% to 80% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 13 s. Simulation, OBJ takes 21 s. Visual, GLB takes 18 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.5 4.7 0.8 ms 4.9 0.3 0.7 0.2 12.8
Simulation, STEP 0.5 1.6 4.6 1 ms 5.1 3.9 0.7 0.2 16.6
Simulation, STL 0.6 1.6 4.5 0.8 ms 5.1 0.5 0.7 0.2 13.1
Simulation, OBJ 0.6 1.6 4.6 0.7 ms 4.9 8.1 0.7 0.3 20.7
Visual, GLB 0.6 1.5 4.6 0.8 ms 9.4 0.1 1.0 0.2 17.6
Visual, OBJ 0.6 1.5 4.7 0.7 ms 9.1 4.8 1.3 0.2 22.1
Board Repo: GMM-7550/gmm7550-hardware
Board: hat-gmm7550.kicad_pcb
Folder hat-gmm7550.kicad
Complexity 303 / 1000 (size 198, features 105)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 68, 891, 174
Triangles, simulation 1,643,322 in 158 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 55 MB 621 MB
STEP 207 MB 755 MB
STL 82 MB 592 MB
OBJ 169 MB 1.1 GB
Visual
GLB 32 MB 674 MB
OBJ 97 MB 777 MB

10.13 ram-gmm7550

ram-gmm7550: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.7 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 4.7 s. Visual, GLB takes 4.3 s. Visual, OBJ takes 5.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.3 ms 1.5 60 ms 0.2 0.2 3.3
Simulation, STEP 0.2 0.3 1.0 0.3 ms 1.4 1.4 0.2 0.2 4.7
Simulation, STL 0.2 0.3 1.0 0.3 ms 1.4 77 ms 0.2 0.2 3.3
Simulation, OBJ 0.2 0.2 0.9 0.3 ms 1.6 1.5 0.2 0.2 4.7
Visual, GLB 0.2 0.3 0.9 0.2 ms 2.5 41 ms 0.2 0.2 4.3
Visual, OBJ 0.2 0.3 0.9 0.3 ms 2.5 1.2 0.2 0.2 5.5
Board Repo: GMM-7550/gmm7550-hardware
Board: ram-gmm7550.kicad_pcb
Folder ram-gmm7550.kicad
Complexity 228 / 1000 (size 143, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 10, 284, 60
Triangles, simulation 310,704 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 254 MB
STEP 46 MB 284 MB
STL 16 MB 254 MB
OBJ 31 MB 254 MB
Visual
GLB 8.6 MB 288 MB
OBJ 25 MB 287 MB

10.14 ram-gmm7550_R5mm

ram-gmm7550_R5mm: stages 4 and 6 take 48% to 78% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.3 s. Simulation, OBJ takes 4.8 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.3 0.9 0.2 ms 1.4 62 ms 0.2 0.2 3.1
Simulation, STEP 0.2 0.3 0.9 0.2 ms 1.4 1.4 0.2 0.2 4.4
Simulation, STL 0.2 0.3 0.9 0.3 ms 1.5 79 ms 0.2 0.2 3.3
Simulation, OBJ 0.2 0.3 0.9 0.2 ms 1.4 1.6 0.2 0.2 4.8
Visual, GLB 0.2 0.3 0.9 0.2 ms 2.7 43 ms 0.3 0.2 4.6
Visual, OBJ 0.2 0.3 1.0 0.2 ms 2.7 1.3 0.3 0.2 5.9
Board Repo: GMM-7550/gmm7550-hardware
Board: ram-gmm7550_R5mm.kicad_pcb
Folder ram-gmm7550.kicad
Complexity 228 / 1000 (size 143, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 10, 280, 61
Triangles, simulation 313,926 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 258 MB
STEP 46 MB 285 MB
STL 16 MB 254 MB
OBJ 31 MB 267 MB
Visual
GLB 8.7 MB 288 MB
OBJ 26 MB 289 MB

10.15 usb3-gmm7550

usb3-gmm7550: stages 4 and 6 take 49% to 80% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 30 s. Visual, GLB takes 30 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.2 5.6 0.7 ms 9.8 0.4 1.1 0.3 20.1
Simulation, STEP 0.8 2.2 5.8 0.6 ms 8.9 6.3 0.9 0.3 25.1
Simulation, STL 0.8 2.2 5.7 0.7 ms 9.8 0.8 1.0 0.3 20.6
Simulation, OBJ 0.7 2.2 5.5 0.5 ms 9.4 11.5 1.0 0.3 30.5
Visual, GLB 0.7 2.2 5.9 0.5 ms 18.0 0.3 2.4 0.2 29.8
Visual, OBJ 0.8 2.5 5.9 0.6 ms 18.5 8.2 2.4 0.3 38.6
Board Repo: GMM-7550/gmm7550-hardware
Board: usb3-gmm7550.kicad_pcb
Folder usb3-gmm7550.kicad
Complexity 385 / 1000 (size 270, features 115)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 198, 2,003, 432
Triangles, simulation 2,449,588 in 217 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 883 MB
STEP 319 MB 1.1 GB
STL 122 MB 866 MB
OBJ 254 MB 1.6 GB
Visual
GLB 57 MB 1.0 GB
OBJ 179 MB 1.3 GB

10.16 V501

V501: stages 4 and 6 take 46% to 82% of a run. Simulation, GLB takes 7.1 s. Simulation, STEP takes 9.1 s. Simulation, STL takes 7.2 s. Simulation, OBJ takes 12 s. Visual, GLB takes 9.0 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.9 0.5 ms 2.4 0.1 0.4 0.3 7.1
Simulation, STEP 0.2 0.7 2.8 0.6 ms 2.6 2.2 0.4 0.2 9.1
Simulation, STL 0.2 0.7 2.9 0.4 ms 2.5 0.2 0.4 0.3 7.2
Simulation, OBJ 0.2 0.8 3.0 0.5 ms 2.5 4.8 0.4 0.2 11.8
Visual, GLB 0.2 0.7 2.8 0.4 ms 4.6 61 ms 0.4 0.2 9.0
Visual, OBJ 0.2 0.7 2.9 0.5 ms 4.5 1.9 0.4 0.3 10.9
Board Repo: gmofishsauce/yarc
Board: V501.kicad_pcb
Folder pcb / V501
Complexity 201 / 1000 (size 151, features 50)
KESE features filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 10, 267, 0
Triangles, simulation 833,216 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 330 MB
STEP 86 MB 406 MB
STL 42 MB 329 MB
OBJ 83 MB 597 MB
Visual
GLB 12 MB 410 MB
OBJ 35 MB 413 MB

10.17 V502

V502: stages 4 and 6 take 47% to 82% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 26 s. Simulation, STL takes 22 s. Simulation, OBJ takes 36 s. Visual, GLB takes 28 s. Visual, OBJ takes 32 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.2 8.1 0.9 ms 8.1 0.5 1.2 0.3 20.8
Simulation, STEP 0.4 2.4 7.6 0.8 ms 8.2 5.8 1.1 0.3 25.7
Simulation, STL 0.4 2.6 8.4 0.7 ms 8.5 0.9 1.3 0.3 22.4
Simulation, OBJ 0.5 2.7 8.2 0.8 ms 8.7 14.1 1.2 0.3 35.6
Visual, GLB 0.4 2.7 8.3 0.9 ms 15.1 0.2 1.5 0.2 28.4
Visual, OBJ 0.4 2.4 7.9 0.6 ms 14.1 6.0 1.5 0.3 32.4
Board Repo: gmofishsauce/yarc
Board: V502.kicad_pcb
Folder pcb / V502
Complexity 254 / 1000 (size 189, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 36, 858, 127
Triangles, simulation 2,989,296 in 111 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 101 MB 816 MB
STEP 316 MB 1.1 GB
STL 149 MB 821 MB
OBJ 313 MB 1.9 GB
Visual
GLB 45 MB 1.0 GB
OBJ 140 MB 992 MB

10.18 V503

V503: stages 4 and 6 take 48% to 82% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 20 s. Simulation, OBJ takes 32 s. Visual, GLB takes 25 s. Visual, OBJ takes 30 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.1 7.4 0.6 ms 8.1 0.4 1.2 0.3 19.8
Simulation, STEP 0.4 2.0 7.7 0.7 ms 7.9 5.6 1.2 0.3 25.1
Simulation, STL 0.4 2.2 7.4 0.7 ms 8.1 0.9 1.2 0.3 20.5
Simulation, OBJ 0.4 2.2 7.3 0.6 ms 8.1 12.9 1.2 0.3 32.5
Visual, GLB 0.4 2.3 7.7 0.9 ms 13.1 0.2 1.6 0.2 25.4
Visual, OBJ 0.4 2.1 7.6 0.7 ms 13.1 5.1 1.6 0.3 30.2
Board Repo: gmofishsauce/yarc
Board: V503.kicad_pcb
Folder pcb / V503
Complexity 248 / 1000 (size 183, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 32, 672, 75
Triangles, simulation 2,602,026 in 110 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 87 MB 714 MB
STEP 272 MB 963 MB
STL 130 MB 732 MB
OBJ 271 MB 1.7 GB
Visual
GLB 35 MB 800 MB
OBJ 109 MB 858 MB

10.19 MegaDrive

MegaDrive: stages 4 and 6 take 54% to 88% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 3 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 4 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.0 9.5 45.1 1 ms 55.2 1.5 7.3 0.4 121.1
Simulation, STEP 2.6 9.5 44.0 2 ms 56.7 30.8 8.1 0.5 152.2
Simulation, STL 3.0 10.4 43.4 2 ms 55.0 3.0 7.2 0.4 122.4
Simulation, OBJ 2.2 9.4 42.4 1 ms 55.0 63.2 7.5 0.5 180.3
Visual, GLB 2.6 9.1 41.5 1 ms 139.6 1.1 11.3 0.4 205.5
Visual, OBJ 1.9 8.0 38.0 1 ms 124.6 36.6 11.4 0.4 220.9
Board Repo: goodtofufriday/Mega-Drive-model-1-schematic
Board: MegaDrive.kicad_pcb
Complexity 354 / 1000 (size 279, features 75)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 7 (20221018)
Parts, tracks, vias 266, 10,876, 785
Triangles, simulation 7,577,304 in 344 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 257 MB 2.5 GB
STEP 1.3 GB 3.0 GB
STL 379 MB 2.5 GB
OBJ 806 MB 4.8 GB
Visual
GLB 193 MB 3.0 GB
OBJ 622 MB 4.0 GB

10.20 flash_cartridge

flash_cartridge: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 3.0 s. Simulation, OBJ takes 4.0 s. Visual, GLB takes 4.8 s. Visual, OBJ takes 6.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 0.9 0.2 ms 1.1 46 ms 0.2 0.2 2.8
Simulation, STEP 0.1 0.3 1.0 0.2 ms 1.1 1.2 0.2 0.2 4.2
Simulation, STL 0.1 0.3 1.1 0.2 ms 1.1 68 ms 0.2 0.2 3.0
Simulation, OBJ 0.1 0.3 0.9 0.2 ms 1.2 1.2 0.2 0.2 4.0
Visual, GLB 0.1 0.3 1.0 0.2 ms 2.9 44 ms 0.3 0.2 4.8
Visual, OBJ 0.1 0.3 0.9 0.2 ms 3.1 1.2 0.3 0.2 6.2
Board Repo: google/myelin-acorn-electron-hardware
Board: flash_cartridge.kicad_pcb
Folder 32kb_flash_cartridge / pcb-mini
Complexity 221 / 1000 (size 176, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 6, 266, 46
Triangles, simulation 251,966 in 41 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.1 MB 243 MB
STEP 45 MB 264 MB
STL 13 MB 233 MB
OBJ 26 MB 234 MB
Visual
GLB 8.7 MB 259 MB
OBJ 25 MB 259 MB

10.21 flash_cartridge

flash_cartridge: stages 4 and 6 take 47% to 79% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 5.2 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.2 s. Visual, GLB takes 5.2 s. Visual, OBJ takes 6.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.0 0.2 ms 1.5 64 ms 0.3 0.2 3.4
Simulation, STEP 0.1 0.3 1.2 0.3 ms 1.5 1.7 0.2 0.2 5.2
Simulation, STL 0.1 0.3 1.0 0.2 ms 1.4 0.1 0.2 0.2 3.4
Simulation, OBJ 0.2 0.3 0.9 0.2 ms 1.5 1.8 0.2 0.3 5.2
Visual, GLB 0.1 0.3 1.0 0.3 ms 3.1 55 ms 0.3 0.2 5.2
Visual, OBJ 0.1 0.3 1.0 0.2 ms 3.0 1.8 0.3 0.2 6.9
Board Repo: google/myelin-acorn-electron-hardware
Board: flash_cartridge.kicad_pcb
Folder 32kb_flash_cartridge / pcb-standard
Complexity 212 / 1000 (size 177, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 6, 288, 48
Triangles, simulation 277,490 in 41 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.7 MB 254 MB
STEP 51 MB 281 MB
STL 14 MB 255 MB
OBJ 28 MB 254 MB
Visual
GLB 9.7 MB 294 MB
OBJ 29 MB 293 MB

10.22 a3000_ram_buffer

a3000_ram_buffer: stages 4 and 6 take 60% to 86% of a run. Simulation, GLB takes 26 s. Simulation, STEP takes 31 s. Simulation, STL takes 25 s. Simulation, OBJ takes 36 s. Visual, GLB takes 35 s. Visual, OBJ takes 44 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.0 10.3 1 ms 11.6 0.3 1.1 0.3 26.0
Simulation, STEP 0.4 2.0 9.7 0.8 ms 11.5 6.2 1.0 0.2 31.0
Simulation, STL 0.4 1.9 9.4 0.8 ms 11.3 0.5 1.0 0.3 24.8
Simulation, OBJ 0.4 1.8 9.6 0.9 ms 11.9 10.9 1.0 0.3 35.8
Visual, GLB 0.4 2.0 10.2 1 ms 19.7 0.2 2.0 0.3 34.8
Visual, OBJ 0.6 2.4 10.8 1 ms 19.6 8.4 2.2 0.3 44.3
Board Repo: google/myelin-acorn-electron-hardware
Board: a3000_ram_buffer.kicad_pcb
Folder a3000_ram_buffer / pcb
Complexity 214 / 1000 (size 169, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 38, 882, 28
Triangles, simulation 1,704,328 in 168 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 58 MB 654 MB
STEP 296 MB 815 MB
STL 85 MB 648 MB
OBJ 176 MB 1.1 GB
Visual
GLB 45 MB 881 MB
OBJ 136 MB 962 MB

10.23 arc_keyboard_to_a3000

arc_keyboard_to_a3000: stages 4 and 6 take 46% to 79% of a run. Simulation, GLB takes 1.8 s. Simulation, STEP takes 2.6 s. Simulation, STL takes 1.8 s. Simulation, OBJ takes 2.5 s. Visual, GLB takes 2.4 s. Visual, OBJ takes 2.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 84 ms 0.1 0.6 0.1 ms 0.6 23 ms 85 ms 0.2 1.8
Simulation, STEP 88 ms 0.1 0.6 0.1 ms 0.7 0.9 82 ms 0.3 2.6
Simulation, STL 85 ms 0.1 0.6 0.1 ms 0.6 34 ms 82 ms 0.2 1.8
Simulation, OBJ 89 ms 0.1 0.5 0.2 ms 0.6 0.8 86 ms 0.2 2.5
Visual, GLB 84 ms 0.1 0.6 0.2 ms 1.3 18 ms 97 ms 0.2 2.4
Visual, OBJ 0.1 0.1 0.5 0.1 ms 1.2 0.5 98 ms 0.2 2.8
Board Repo: google/myelin-acorn-electron-hardware
Board: arc_keyboard_to_a3000.kicad_pcb
Folder arc_keyboard_to_a3000 / pcb
Complexity 104 / 1000 (size 84, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 28, 0
Triangles, simulation 129,382 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 4.3 MB 189 MB
STEP 20 MB 198 MB
STL 6.5 MB 191 MB
OBJ 12 MB 186 MB
Visual
GLB 3.1 MB 154 MB
OBJ 8.7 MB 153 MB

10.24 arc_mouse_breakout

arc_mouse_breakout: stages 4 and 6 take 46% to 78% of a run. Simulation, GLB takes 1.9 s. Simulation, STEP takes 2.7 s. Simulation, STL takes 2.0 s. Simulation, OBJ takes 2.7 s. Visual, GLB takes 2.8 s. Visual, OBJ takes 3.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 0.2 0.6 0.2 ms 0.7 27 ms 97 ms 0.2 1.9
Simulation, STEP 87 ms 0.1 0.6 0.2 ms 0.6 0.9 0.1 0.2 2.7
Simulation, STL 80 ms 0.1 0.7 0.3 ms 0.7 44 ms 0.1 0.2 2.0
Simulation, OBJ 90 ms 0.2 0.7 0.2 ms 0.7 0.7 0.1 0.2 2.7
Visual, GLB 85 ms 0.2 0.6 0.3 ms 1.6 17 ms 0.1 0.2 2.8
Visual, OBJ 86 ms 0.1 0.6 0.1 ms 1.6 0.5 0.1 0.2 3.3
Board Repo: google/myelin-acorn-electron-hardware
Board: arc_mouse_breakout.kicad_pcb
Folder arc_mouse_breakout / pcb
Complexity 128 / 1000 (size 93, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 2, 43, 2
Triangles, simulation 181,218 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 6.1 MB 206 MB
STEP 28 MB 213 MB
STL 9.1 MB 206 MB
OBJ 18 MB 214 MB
Visual
GLB 4.4 MB 192 MB
OBJ 12 MB 188 MB

10.25 archimedes_bus_scope

archimedes_bus_scope: stages 4 and 6 take 53% to 79% of a run. Simulation, GLB takes 7.1 s. Simulation, STEP takes 8.8 s. Simulation, STL takes 7.1 s. Simulation, OBJ takes 9.8 s. Visual, GLB takes 7.8 s. Visual, OBJ takes 9.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 3.1 0.2 ms 2.3 92 ms 0.3 0.2 7.1
Simulation, STEP 0.2 0.9 3.0 0.1 ms 2.2 2.1 0.3 0.2 8.8
Simulation, STL 0.2 0.9 3.0 0.2 ms 2.5 0.1 0.3 0.2 7.1
Simulation, OBJ 0.2 0.8 3.0 0.2 ms 2.3 3.0 0.3 0.3 9.8
Visual, GLB 0.3 0.8 3.0 0.2 ms 3.1 49 ms 0.3 0.2 7.8
Visual, OBJ 0.2 0.8 3.1 0.1 ms 3.3 1.9 0.3 0.2 9.8
Board Repo: google/myelin-acorn-electron-hardware
Board: archimedes_bus_scope.kicad_pcb
Folder archimedes_bus_scope / pcb
Complexity 243 / 1000 (size 198, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 6, 141, 41
Triangles, simulation 571,910 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 346 MB
STEP 96 MB 421 MB
STL 29 MB 345 MB
OBJ 58 MB 391 MB
Visual
GLB 12 MB 375 MB
OBJ 34 MB 372 MB

10.26 atsamd11_pro_micro

atsamd11_pro_micro: stages 4 and 6 take 50% to 82% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 4.1 s. Simulation, STL takes 2.8 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 4.2 s. Visual, OBJ takes 5.3 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.0 0.2 ms 1.0 46 ms 0.2 0.2 2.8
Simulation, STEP 0.1 0.2 1.0 0.2 ms 1.1 1.3 0.1 0.3 4.1
Simulation, STL 0.1 0.2 1.0 3 ms 1.0 65 ms 0.1 0.2 2.8
Simulation, OBJ 95 ms 0.2 1.0 0.2 ms 1.0 1.1 0.1 0.2 3.7
Visual, GLB 0.1 0.2 1.0 0.9 ms 2.4 34 ms 0.2 0.2 4.2
Visual, OBJ 0.1 0.2 1.0 0.2 ms 2.4 1.0 0.3 0.2 5.3
Board Repo: google/myelin-acorn-electron-hardware
Board: atsamd11_pro_micro.kicad_pcb
Folder atsamd11_pro_micro / pcb
Complexity 176 / 1000 (size 131, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 10, 169, 15
Triangles, simulation 286,208 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 9.7 MB 234 MB
STEP 45 MB 265 MB
STL 14 MB 232 MB
OBJ 28 MB 248 MB
Visual
GLB 7.9 MB 247 MB
OBJ 23 MB 248 MB

10.27 atsamd21_usb

atsamd21_usb: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 4.0 s. Simulation, STEP takes 5.4 s. Simulation, STL takes 4.2 s. Simulation, OBJ takes 5.8 s. Visual, GLB takes 6.4 s. Visual, OBJ takes 8.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.6 0.4 ms 1.4 64 ms 0.3 0.3 4.0
Simulation, STEP 0.1 0.3 1.6 0.3 ms 1.4 1.5 0.2 0.2 5.4
Simulation, STL 0.2 0.3 1.6 0.2 ms 1.4 0.1 0.3 0.2 4.2
Simulation, OBJ 0.2 0.4 1.6 0.3 ms 1.3 1.9 0.3 0.3 5.8
Visual, GLB 0.2 0.4 1.7 0.3 ms 3.5 51 ms 0.4 0.2 6.4
Visual, OBJ 0.2 0.3 1.6 1 ms 3.7 1.7 0.4 0.2 8.1
Board Repo: google/myelin-acorn-electron-hardware
Board: atsamd21_usb.kicad_pcb
Folder atsamd21_usb_host / pcb
Complexity 233 / 1000 (size 188, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 20, 362, 15
Triangles, simulation 395,358 in 45 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 271 MB
STEP 64 MB 300 MB
STL 20 MB 263 MB
OBJ 40 MB 308 MB
Visual
GLB 11 MB 315 MB
OBJ 32 MB 320 MB

10.28 bbc_128kb_sram

bbc_128kb_sram: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 3.3 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 4.3 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.3 0.3 ms 1.1 51 ms 0.2 0.2 3.3
Simulation, STEP 0.1 0.3 1.1 0.2 ms 1.1 1.2 0.2 0.2 4.2
Simulation, STL 0.1 0.3 1.0 0.2 ms 1.0 82 ms 0.1 0.2 2.9
Simulation, OBJ 0.1 0.3 1.1 0.2 ms 1.1 1.3 0.2 0.2 4.3
Visual, GLB 0.1 0.3 1.2 0.2 ms 2.5 32 ms 0.3 0.2 4.6
Visual, OBJ 0.1 0.3 1.0 0.2 ms 2.8 1.1 0.3 0.2 5.7
Board Repo: google/myelin-acorn-electron-hardware
Board: bbc_128kb_sram.kicad_pcb
Folder bbc_128kb_sram / pcb
Complexity 169 / 1000 (size 134, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 9, 225, 20
Triangles, simulation 326,668 in 52 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 268 MB
STEP 51 MB 281 MB
STL 16 MB 255 MB
OBJ 33 MB 269 MB
Visual
GLB 8.6 MB 284 MB
OBJ 25 MB 284 MB

10.29 bbc_power

bbc_power: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 2.6 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.5 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 3.7 s. Visual, OBJ takes 4.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.2 ms 0.9 43 ms 0.1 0.2 2.6
Simulation, STEP 0.1 0.2 1.0 0.2 ms 0.8 1.1 0.1 0.2 3.6
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.9 61 ms 0.1 0.2 2.5
Simulation, OBJ 0.1 0.2 1.0 0.2 ms 0.9 1.2 0.2 0.2 3.8
Visual, GLB 0.1 0.2 1.0 0.3 ms 1.9 32 ms 0.2 0.3 3.7
Visual, OBJ 0.1 0.2 1.0 0.1 ms 2.0 0.9 0.2 0.3 4.6
Board Repo: google/myelin-acorn-electron-hardware
Board: bbc_power.kicad_pcb
Folder bbc_power_distribution / pcb
Complexity 143 / 1000 (size 108, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 11, 43, 2
Triangles, simulation 249,304 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 8.3 MB 233 MB
STEP 39 MB 237 MB
STL 12 MB 222 MB
OBJ 25 MB 227 MB
Visual
GLB 6.0 MB 234 MB
OBJ 17 MB 234 MB

10.30 bga_in_two_layers

bga_in_two_layers: stages 4 and 6 take 58% to 86% of a run. Simulation, GLB takes 9.8 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.6 s. Simulation, OBJ takes 14 s. Visual, GLB takes 15 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 4.3 0.3 ms 3.8 0.1 0.5 0.2 9.8
Simulation, STEP 0.2 0.6 4.5 0.5 ms 3.9 2.9 0.5 0.2 12.8
Simulation, STL 0.2 0.6 4.1 0.6 ms 3.7 0.3 0.5 0.2 9.6
Simulation, OBJ 0.2 0.6 4.4 0.4 ms 3.7 4.4 0.5 0.2 14.0
Visual, GLB 0.2 0.6 4.3 0.4 ms 8.7 0.1 0.9 0.3 15.1
Visual, OBJ 0.2 0.6 4.1 0.6 ms 9.0 3.4 1.1 0.3 18.7
Board Repo: google/myelin-acorn-electron-hardware
Board: bga_in_two_layers.kicad_pcb
Folder bga_in_two_layers / pcb
Complexity 255 / 1000 (size 220, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 24, 1,108, 43
Triangles, simulation 982,312 in 116 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 419 MB
STEP 160 MB 524 MB
STL 49 MB 423 MB
OBJ 98 MB 667 MB
Visual
GLB 23 MB 588 MB
OBJ 71 MB 618 MB

10.31 cherry_mx

cherry_mx: stages 4 and 6 take 44% to 65% of a run. Simulation, GLB takes 0.9 s. Simulation, STEP takes 1.3 s. Simulation, STL takes 0.9 s. Simulation, OBJ takes 1.1 s. Visual, GLB takes 1.0 s. Visual, OBJ takes 1.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 68 ms 52 ms 0.2 0.1 ms 0.3 8 ms 31 ms 0.2 0.9
Simulation, STEP 74 ms 58 ms 0.2 0.1 ms 0.4 0.3 34 ms 0.2 1.3
Simulation, STL 69 ms 53 ms 0.2 0.1 ms 0.3 11 ms 36 ms 0.2 0.9
Simulation, OBJ 67 ms 47 ms 0.2 0.1 ms 0.4 0.2 33 ms 0.2 1.1
Visual, GLB 74 ms 57 ms 0.2 0.1 ms 0.5 5 ms 44 ms 0.2 1.0
Visual, OBJ 70 ms 52 ms 0.2 0.1 ms 0.5 0.1 37 ms 0.2 1.1
Board Repo: google/myelin-acorn-electron-hardware
Board: cherry_mx.kicad_pcb
Folder cherry_mx_keyswitch_tester / pcb
Complexity 87 / 1000 (size 87, features 0)
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 4, 24, 0
Triangles, simulation 47,042 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 1.6 MB 66 MB
STEP 5.6 MB 71 MB
STL 2.4 MB 66 MB
OBJ 4.4 MB 77 MB
Visual
GLB 1000 kB 99 MB
OBJ 2.7 MB 90 MB

10.32 cpu_socket_expansion

cpu_socket_expansion: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 14 s. Simulation, STL takes 11 s. Simulation, OBJ takes 17 s. Visual, GLB takes 17 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 5.0 0.8 ms 4.3 0.2 0.6 0.2 11.4
Simulation, STEP 0.2 0.8 4.9 0.8 ms 4.2 3.1 0.7 0.2 14.1
Simulation, STL 0.2 0.9 5.0 0.6 ms 4.0 0.4 0.6 0.3 11.4
Simulation, OBJ 0.2 0.9 5.0 0.6 ms 4.4 5.4 0.6 0.3 16.9
Visual, GLB 0.2 0.8 5.1 0.7 ms 9.5 0.2 1.1 0.3 17.2
Visual, OBJ 0.2 0.8 4.9 0.8 ms 9.1 4.0 1.2 0.2 20.3
Board Repo: google/myelin-acorn-electron-hardware
Board: cpu_socket_expansion.kicad_pcb
Folder cpu_socket_expansion / pcb
Complexity 207 / 1000 (size 162, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 26, 734, 27
Triangles, simulation 1,090,992 in 101 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 446 MB
STEP 178 MB 557 MB
STL 55 MB 455 MB
OBJ 110 MB 756 MB
Visual
GLB 28 MB 630 MB
OBJ 84 MB 677 MB

10.33 cpu_socket_minispartan_daughterboard

Stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 9.7 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.8 4.7 1 ms 3.2 0.2 0.5 0.2 9.7
Simulation, STEP 0.2 0.8 4.7 0.7 ms 3.3 2.5 0.4 0.3 12.1
Simulation, STL 0.2 0.7 4.8 0.6 ms 3.3 0.3 0.5 0.2 10.1
Simulation, OBJ 0.2 0.7 4.6 0.7 ms 3.4 4.4 0.4 0.2 13.9
Visual, GLB 0.2 0.8 4.7 0.7 ms 6.9 0.1 0.8 0.2 13.8
Visual, OBJ 0.2 0.7 4.8 0.7 ms 6.4 2.8 0.8 0.3 15.8
Board Repo: google/myelin-acorn-electron-hardware
Board: cpu_socket_minispartan_daughterboard.kicad_pcb
Folder cpu_socket_minispartan_daughterboard / pcb
Complexity 163 / 1000 (size 128, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 5, 272, 1
Triangles, simulation 1,079,078 in 85 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 445 MB
STEP 149 MB 540 MB
STL 54 MB 432 MB
OBJ 108 MB 739 MB
Visual
GLB 21 MB 574 MB
OBJ 64 MB 598 MB

10.34 econet_standalone

econet_standalone: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 6.9 s. Simulation, STEP takes 8.9 s. Simulation, STL takes 6.9 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 9.9 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 2.7 0.4 ms 2.5 98 ms 0.4 0.3 6.9
Simulation, STEP 0.2 0.7 2.6 0.6 ms 2.5 2.3 0.4 0.3 8.9
Simulation, STL 0.2 0.7 2.6 0.5 ms 2.6 0.2 0.4 0.2 6.9
Simulation, OBJ 0.2 0.6 2.5 0.4 ms 2.4 3.1 0.4 0.2 9.5
Visual, GLB 0.2 0.6 2.6 0.3 ms 5.5 0.1 0.7 0.2 9.9
Visual, OBJ 0.2 0.7 2.4 0.4 ms 5.1 3.0 0.8 0.2 12.4
Board Repo: google/myelin-acorn-electron-hardware
Board: econet_standalone.kicad_pcb
Folder econet_from_scratch / pcb
Complexity 249 / 1000 (size 204, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 42, 614, 22
Triangles, simulation 583,200 in 75 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 20 MB 322 MB
STEP 104 MB 406 MB
STL 29 MB 321 MB
OBJ 59 MB 433 MB
Visual
GLB 18 MB 442 MB
OBJ 52 MB 475 MB

10.35 econet_hub

econet_hub: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 5.9 s. Simulation, STEP takes 7.8 s. Simulation, STL takes 5.8 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 8.3 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.7 0.3 ms 1.9 90 ms 0.3 0.2 5.9
Simulation, STEP 0.2 0.5 2.6 0.3 ms 1.9 2.0 0.4 0.2 7.8
Simulation, STL 0.2 0.5 2.6 0.4 ms 1.9 0.2 0.3 0.2 5.8
Simulation, OBJ 0.2 0.5 2.7 0.3 ms 2.0 3.5 0.4 0.2 9.5
Visual, GLB 0.2 0.6 2.6 0.3 ms 4.4 72 ms 0.4 0.2 8.3
Visual, OBJ 0.2 0.5 2.7 0.3 ms 4.2 2.5 0.4 0.2 10.6
Board Repo: google/myelin-acorn-electron-hardware
Board: econet_hub.kicad_pcb
Folder econet_hub / pcb
Complexity 177 / 1000 (size 142, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 19, 216, 23
Triangles, simulation 639,792 in 24 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 353 MB
STEP 104 MB 382 MB
STL 32 MB 349 MB
OBJ 64 MB 462 MB
Visual
GLB 16 MB 451 MB
OBJ 47 MB 448 MB

10.36 elk_pi_tube_direct

elk_pi_tube_direct: stages 4 and 6 take 51% to 84% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 9.9 s. Simulation, STL takes 7.5 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 3.6 0.4 ms 2.5 0.1 0.4 0.2 7.7
Simulation, STEP 0.2 0.7 3.6 0.3 ms 2.3 2.4 0.4 0.2 9.9
Simulation, STL 0.2 0.7 3.4 0.4 ms 2.4 0.2 0.4 0.3 7.5
Simulation, OBJ 0.2 0.7 3.7 0.3 ms 2.4 4.2 0.4 0.2 11.8
Visual, GLB 0.2 0.7 3.6 0.3 ms 5.3 95 ms 0.4 0.2 10.6
Visual, OBJ 0.2 0.7 3.4 0.4 ms 5.1 2.4 0.5 0.3 12.6
Board Repo: google/myelin-acorn-electron-hardware
Board: elk_pi_tube_direct.kicad_pcb
Folder elk_pi_tube_direct / pcb
Complexity 185 / 1000 (size 140, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 10, 289, 29
Triangles, simulation 731,816 in 57 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 344 MB
STEP 140 MB 398 MB
STL 37 MB 338 MB
OBJ 75 MB 519 MB
Visual
GLB 14 MB 373 MB
OBJ 43 MB 367 MB

10.37 acorn-electron-expansion

acorn-electron-expansion: stages 4 and 6 take 59% to 88% of a run. Simulation, GLB takes 21 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 30 s. Visual, GLB takes 27 s. Visual, OBJ takes 31 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.2 10.0 0.9 ms 7.8 0.3 0.8 0.3 20.7
Simulation, STEP 0.3 1.1 9.6 1 ms 7.8 5.0 1.0 0.3 25.0
Simulation, STL 0.2 1.4 10.0 1.0 ms 8.1 0.6 0.8 0.2 21.5
Simulation, OBJ 0.3 1.3 9.7 2 ms 8.0 9.8 0.9 0.3 30.1
Visual, GLB 0.3 1.3 10.0 1 ms 13.7 0.1 1.3 0.3 27.0
Visual, OBJ 0.3 1.2 10.0 0.9 ms 13.6 4.6 1.3 0.2 31.1
Board Repo: google/myelin-acorn-electron-hardware
Board: acorn-electron-expansion.kicad_pcb
Folder expansion_minispartan_breakout / pcb
Complexity 204 / 1000 (size 159, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 21, 682, 34
Triangles, simulation 1,840,834 in 125 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 717 MB
STEP 357 MB 793 MB
STL 92 MB 697 MB
OBJ 195 MB 1.3 GB
Visual
GLB 34 MB 687 MB
OBJ 101 MB 739 MB

10.38 fx2_tube_cartridge_adapter

fx2_tube_cartridge_adapter: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 16 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.0 5.2 0.4 ms 4.3 0.2 0.7 0.3 11.9
Simulation, STEP 0.3 0.9 5.5 0.5 ms 4.4 3.8 0.7 0.3 15.8
Simulation, STL 0.3 1.0 5.4 0.4 ms 4.5 0.3 0.6 0.2 12.3
Simulation, OBJ 0.3 1.0 5.3 0.6 ms 4.4 6.7 0.6 0.2 18.4
Visual, GLB 0.2 1.0 5.2 0.5 ms 9.7 0.1 1.1 0.2 17.6
Visual, OBJ 0.2 1.0 5.2 0.5 ms 10.2 4.9 1.4 0.2 23.1
Board Repo: google/myelin-acorn-electron-hardware
Board: fx2_tube_cartridge_adapter.kicad_pcb
Folder fx2_tube_cartridge_adapter / pcb
Complexity 220 / 1000 (size 165, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 24, 825, 55
Triangles, simulation 1,279,324 in 73 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 577 MB
STEP 206 MB 638 MB
STL 64 MB 599 MB
OBJ 130 MB 856 MB
Visual
GLB 33 MB 688 MB
OBJ 100 MB 715 MB

10.39 master_updateable_megarom

master_updateable_megarom: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 6.4 s. Simulation, STEP takes 8.1 s. Simulation, STL takes 6.2 s. Simulation, OBJ takes 9.6 s. Visual, GLB takes 9.5 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.6 0.7 ms 2.4 0.1 0.4 0.2 6.4
Simulation, STEP 0.2 0.5 2.3 0.3 ms 2.3 2.2 0.4 0.2 8.1
Simulation, STL 0.2 0.6 2.4 0.3 ms 2.3 0.2 0.4 0.2 6.2
Simulation, OBJ 0.2 0.5 2.3 0.3 ms 2.4 3.6 0.4 0.2 9.6
Visual, GLB 0.2 0.5 2.4 0.3 ms 5.5 86 ms 0.7 0.2 9.5
Visual, OBJ 0.2 0.5 2.3 0.4 ms 5.6 2.8 0.8 0.2 12.4
Board Repo: google/myelin-acorn-electron-hardware
Board: master_updateable_megarom.kicad_pcb
Folder master_updateable_megarom / pcb
Complexity 243 / 1000 (size 198, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 648, 78
Triangles, simulation 647,566 in 71 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 22 MB 378 MB
STEP 105 MB 429 MB
STL 32 MB 372 MB
OBJ 65 MB 463 MB
Visual
GLB 18 MB 500 MB
OBJ 55 MB 471 MB

10.40 minus_one

minus_one: stages 4 and 6 take 60% to 88% of a run. Simulation, GLB takes 28 s. Simulation, STEP takes 33 s. Simulation, STL takes 28 s. Simulation, OBJ takes 39 s. Visual, GLB takes 34 s. Visual, OBJ takes 41 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.6 12.2 0.6 ms 11.8 0.4 1.0 0.2 27.5
Simulation, STEP 0.3 1.5 11.4 0.9 ms 12.0 6.3 1.0 0.2 32.7
Simulation, STL 0.3 1.5 11.8 1 ms 12.1 0.6 1.0 0.2 27.6
Simulation, OBJ 0.3 1.5 11.6 1 ms 11.7 12.3 1.1 0.2 38.8
Visual, GLB 0.4 1.6 12.4 0.9 ms 17.3 0.2 1.6 0.3 33.7
Visual, OBJ 0.3 1.7 12.1 0.7 ms 17.3 7.2 1.8 0.2 40.7
Board Repo: google/myelin-acorn-electron-hardware
Board: minus_one.kicad_pcb
Folder minus_one / pcb
Complexity 223 / 1000 (size 168, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 15, 1,332, 97
Triangles, simulation 2,310,048 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 670 MB
STEP 445 MB 935 MB
STL 116 MB 680 MB
OBJ 245 MB 1.6 GB
Visual
GLB 44 MB 844 MB
OBJ 136 MB 974 MB

10.41 pcf8583_daughterboard

pcf8583_daughterboard: stages 4 and 6 take 52% to 78% of a run. Simulation, GLB takes 2.2 s. Simulation, STEP takes 3.3 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.2 s. Visual, GLB takes 3.2 s. Visual, OBJ takes 4.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.1 ms 0.7 32 ms 0.1 0.2 2.2
Simulation, STEP 93 ms 0.2 0.9 0.1 ms 0.8 1.0 0.1 0.2 3.3
Simulation, STL 92 ms 0.2 1.0 0.1 ms 0.8 50 ms 0.1 0.2 2.4
Simulation, OBJ 0.1 0.2 0.9 0.1 ms 0.8 0.9 0.1 0.2 3.2
Visual, GLB 0.1 0.2 0.9 0.1 ms 1.6 21 ms 0.2 0.2 3.2
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.7 0.8 0.2 0.2 4.1
Board Repo: google/myelin-acorn-electron-hardware
Board: pcf8583_daughterboard.kicad_pcb
Folder pcf8583_daughterboard / pcb
Complexity 171 / 1000 (size 116, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 14, 65, 2
Triangles, simulation 214,068 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.4 MB 215 MB
STEP 37 MB 237 MB
STL 11 MB 212 MB
OBJ 21 MB 213 MB
Visual
GLB 5.7 MB 212 MB
OBJ 16 MB 216 MB

10.42 post_box_usb

post_box_usb: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 19 s. Simulation, STEP takes 23 s. Simulation, STL takes 19 s. Simulation, OBJ takes 28 s. Visual, GLB takes 28 s. Visual, OBJ takes 34 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.6 6.9 0.8 ms 7.9 0.3 1.0 0.3 18.5
Simulation, STEP 0.4 1.7 7.0 0.5 ms 7.6 5.4 1.0 0.2 23.4
Simulation, STL 0.4 1.8 7.3 0.6 ms 7.2 0.7 0.9 0.2 18.6
Simulation, OBJ 0.4 1.7 6.9 0.6 ms 7.6 10.0 1.0 0.3 28.0
Visual, GLB 0.4 1.8 6.8 0.7 ms 16.3 0.3 1.9 0.3 27.7
Visual, OBJ 0.5 1.7 6.8 0.8 ms 16.3 6.6 2.1 0.3 34.3
Board Repo: google/myelin-acorn-electron-hardware
Board: post_box_usb.kicad_pcb
Folder post_box_usb / pcb
Complexity 293 / 1000 (size 238, features 55)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 66, 1,109, 99
Triangles, simulation 2,050,030 in 121 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 673 MB
STEP 262 MB 871 MB
STL 103 MB 671 MB
OBJ 213 MB 1.4 GB
Visual
GLB 46 MB 956 MB
OBJ 141 MB 1.0 GB

10.43 rom_socket_level_shifter

rom_socket_level_shifter: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 4.5 s. Simulation, STEP takes 5.9 s. Simulation, STL takes 4.7 s. Simulation, OBJ takes 6.5 s. Visual, GLB takes 7.3 s. Visual, OBJ takes 8.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.8 0.3 ms 1.6 79 ms 0.3 0.2 4.5
Simulation, STEP 0.1 0.4 1.9 0.5 ms 1.6 1.5 0.3 0.2 5.9
Simulation, STL 0.1 0.4 1.8 0.3 ms 1.7 0.1 0.3 0.2 4.7
Simulation, OBJ 0.1 0.4 1.9 0.3 ms 1.6 2.1 0.3 0.2 6.5
Visual, GLB 0.2 0.4 1.9 0.3 ms 4.0 64 ms 0.5 0.2 7.3
Visual, OBJ 0.2 0.4 1.7 0.3 ms 3.8 1.6 0.4 0.3 8.4
Board Repo: google/myelin-acorn-electron-hardware
Board: rom_socket_level_shifter.kicad_pcb
Folder rom_socket_level_shifter / pcb
Complexity 194 / 1000 (size 149, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 463, 34
Triangles, simulation 479,746 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 277 MB
STEP 76 MB 341 MB
STL 24 MB 278 MB
OBJ 48 MB 361 MB
Visual
GLB 13 MB 357 MB
OBJ 38 MB 350 MB

10.44 bbc_1mhz_serial_sd

bbc_1mhz_serial_sd: stages 4 and 6 take 52% to 85% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.0 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.8 0.3 ms 2.7 0.1 0.4 0.2 8.0
Simulation, STEP 0.2 0.6 3.8 0.6 ms 2.7 2.3 0.4 0.2 10.1
Simulation, STL 0.2 0.6 3.6 0.3 ms 2.6 0.3 0.4 0.2 8.0
Simulation, OBJ 0.2 0.6 3.8 0.3 ms 2.5 4.4 0.4 0.3 12.1
Visual, GLB 0.2 0.6 3.6 0.6 ms 5.7 77 ms 0.6 0.2 11.1
Visual, OBJ 0.2 0.6 3.7 0.4 ms 5.7 3.0 0.8 0.2 14.2
Board Repo: google/myelin-acorn-electron-hardware
Board: bbc_1mhz_serial_sd.kicad_pcb
Folder serial_sd_adapter / bbc_1mhz_bus_pcb
Complexity 189 / 1000 (size 144, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 361, 19
Triangles, simulation 754,086 in 55 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 362 MB
STEP 138 MB 422 MB
STL 38 MB 359 MB
OBJ 77 MB 545 MB
Visual
GLB 18 MB 435 MB
OBJ 54 MB 464 MB

10.45 standalone_programmer

standalone_programmer: stages 4 and 6 take 56% to 81% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.0 s. Simulation, STL takes 6.7 s. Simulation, OBJ takes 9.5 s. Visual, GLB takes 9.1 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 3.4 0.3 ms 2.1 91 ms 0.3 0.2 6.8
Simulation, STEP 0.1 0.6 3.1 0.3 ms 1.9 1.8 0.3 0.2 8.0
Simulation, STL 0.1 0.6 3.3 0.3 ms 1.9 0.2 0.4 0.3 6.7
Simulation, OBJ 0.1 0.6 3.4 0.4 ms 2.0 2.8 0.4 0.2 9.5
Visual, GLB 0.1 0.6 3.1 0.5 ms 4.2 65 ms 0.6 0.2 9.1
Visual, OBJ 0.2 0.6 3.3 0.3 ms 4.6 2.0 0.7 0.3 11.6
Board Repo: google/myelin-acorn-electron-hardware
Board: standalone_programmer.kicad_pcb
Folder standalone_cartridge_programmer / pcb
Complexity 198 / 1000 (size 143, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 11, 366, 18
Triangles, simulation 681,416 in 58 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 24 MB 348 MB
STEP 120 MB 390 MB
STL 34 MB 326 MB
OBJ 70 MB 492 MB
Visual
GLB 15 MB 406 MB
OBJ 45 MB 405 MB

10.46 xc9500xl_44_breakout

xc9500xl_44_breakout: stages 4 and 6 take 54% to 85% of a run. Simulation, GLB takes 8.5 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.2 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 3.5 0.6 ms 3.1 0.1 0.5 0.3 8.5
Simulation, STEP 0.3 0.8 3.7 0.5 ms 3.0 2.6 0.5 0.3 11.1
Simulation, STL 0.2 0.7 3.5 0.4 ms 3.0 0.2 0.4 0.2 8.2
Simulation, OBJ 0.2 0.8 3.4 0.6 ms 3.0 4.0 0.4 0.2 12.1
Visual, GLB 0.2 0.8 3.6 0.3 ms 6.3 90 ms 0.5 0.2 11.6
Visual, OBJ 0.2 0.8 3.6 0.8 ms 6.4 3.2 0.5 0.3 14.9
Board Repo: google/myelin-acorn-electron-hardware
Board: xc9500xl_44_breakout.kicad_pcb
Folder xc9500xl_44_breakout / pcb
Complexity 188 / 1000 (size 143, features 45)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 13, 269, 40
Triangles, simulation 750,304 in 53 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 405 MB
STEP 123 MB 460 MB
STL 38 MB 405 MB
OBJ 76 MB 535 MB
Visual
GLB 18 MB 442 MB
OBJ 55 MB 488 MB

10.47 dvk-mx8m-bsb

dvk-mx8m-bsb: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 3 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 2.2 10.8 41.0 2 ms 42.3 2.3 5.6 0.4 104.8
Simulation, STEP 2.3 11.1 41.1 2 ms 42.6 22.1 5.1 0.4 124.8
Simulation, STL 2.3 10.6 41.3 2 ms 44.8 4.6 5.5 0.5 109.5
Simulation, OBJ 2.4 11.4 42.4 1 ms 43.8 65.0 6.4 0.5 171.8
Visual, GLB 2.4 12.3 43.2 3 ms 101.0 1.1 14.2 0.4 174.6
Visual, OBJ 2.4 11.2 41.9 2 ms 95.1 31.7 12.3 0.3 194.8
Board Repo: gralco/dvk-mx8m-bsb
Board: dvk-mx8m-bsb.kicad_pcb
Complexity 407 / 1000 (size 317, features 90)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 5 (20171130)
Parts, tracks, vias 651, 17,587, 1,474
Triangles, simulation 11,609,834 in 629 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 403 MB 2.7 GB
STEP 1.6 GB 3.7 GB
STL 581 MB 2.9 GB
OBJ 1.3 GB 7.4 GB
Visual
GLB 236 MB 3.6 GB
OBJ 764 MB 4.9 GB

10.48 librem5_mainboard

librem5_mainboard: stages 4 and 6 take 67% to 82% of a run. Simulation, GLB takes 5 min. Simulation, STEP takes 6 min. Simulation, STL takes 5 min. Visual, GLB takes 7 min. Visual, OBJ takes 7 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 7.2 47.6 135.3 4 ms 110.4 6.2 15.7 1.1 323.3
Simulation, STEP 7.2 46.3 131.7 2 ms 107.4 45.7 15.4 0.9 354.5
Simulation, STL 7.2 45.3 132.6 3 ms 114.8 11.0 17.0 1.1 329.0
Simulation, OBJ exceeded 11 GB on a 15 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Visual, GLB 6.7 45.1 131.6 2 ms 205.7 1.8 18.3 0.8 409.9
Visual, OBJ 6.8 44.6 129.8 2 ms 197.8 48.6 16.3 0.8 444.6
Board Repo: gralco/l5-schematic
Board: librem5_mainboard.kicad_pcb
Folder CAD / KiCad / librem5_mainboard
Complexity 600 / 1000 (size 370, features 230)
KESE features through vias,
blind and buried vias, microvias,
slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 10
File format KiCad 10 (20260206)
Parts, tracks, vias 1,164, 19,488, 5,044
Triangles, simulation 21,846,464 in 866 parts
Verifier Simulation, OBJ: exceeded 11 GB on a 15 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
File
type
File
size
Peak memory
used
Simulation
GLB 751 MB 4.8 GB
STEP 2.5 GB 6.1 GB
STL 1.1 GB 4.7 GB
OBJ – 11 GB
Visual
GLB 283 MB 5.3 GB
OBJ 948 MB 6.3 GB

10.49 librem5_usb-c_board

librem5_usb-c_board: stages 4 and 6 take 49% to 81% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 18 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 22 s. Visual, OBJ takes 26 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.8 2.2 5.7 0.5 ms 5.8 0.2 0.7 0.2 15.6
Simulation, STEP 0.8 2.1 5.6 0.5 ms 5.8 2.8 0.7 0.2 17.9
Simulation, STL 0.7 2.0 5.5 0.3 ms 5.9 0.5 0.7 0.2 15.5
Simulation, OBJ 0.8 2.2 5.8 0.7 ms 5.7 8.2 0.7 0.3 23.6
Visual, GLB 0.8 2.0 5.8 0.7 ms 11.8 0.1 0.9 0.2 21.6
Visual, OBJ 0.8 2.2 5.6 0.4 ms 11.6 4.5 0.9 0.3 25.8
Board Repo: gralco/l5-schematic
Board: librem5_usb-c_board.kicad_pcb
Folder CAD / KiCad / librem5_usb-c_board
Complexity 397 / 1000 (size 212, features 185)
KESE features through vias,
blind and buried vias, microvias,
slotted holes, custom pads,
rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 52, 1,102, 355
Triangles, simulation 1,417,846 in 76 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 49 MB 563 MB
STEP 149 MB 640 MB
STL 71 MB 564 MB
OBJ 147 MB 978 MB
Visual
GLB 25 MB 594 MB
OBJ 77 MB 639 MB

10.50 librem5_usb-c_fpc

librem5_usb-c_fpc: stages 4 and 6 take 42% to 74% of a run. Simulation, GLB takes 3.4 s. Simulation, STEP takes 4.4 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.1 s. Visual, GLB takes 4.6 s. Visual, OBJ takes 5.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 0.4 1.2 0.2 ms 1.0 59 ms 0.2 0.2 3.4
Simulation, STEP 0.4 0.3 1.1 0.2 ms 1.1 1.1 0.2 0.2 4.4
Simulation, STL 0.4 0.3 1.1 0.2 ms 1.1 80 ms 0.2 0.2 3.5
Simulation, OBJ 0.4 0.4 1.1 0.2 ms 1.1 1.8 0.2 0.2 5.1
Visual, GLB 0.4 0.4 1.1 0.2 ms 2.3 32 ms 0.2 0.2 4.6
Visual, OBJ 0.4 0.4 1.2 0.3 ms 2.3 1.1 0.2 0.2 5.7
Board Repo: gralco/l5-schematic
Board: librem5_usb-c_fpc.kicad_pcb
Folder CAD / KiCad / librem5_usb-c_fpc
Complexity 203 / 1000 (size 148, features 55)
KESE features through vias, filled zones,
copper drawings,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 2, 240, 96
Triangles, simulation 367,218 in 38 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 13 MB 271 MB
STEP 39 MB 289 MB
STL 18 MB 266 MB
OBJ 37 MB 278 MB
Visual
GLB 7.5 MB 254 MB
OBJ 22 MB 247 MB

10.51 librem5_mainboard

librem5_mainboard: stages 4 and 6 take 23% to 38% of a run. Simulation, GLB takes 36 min. Simulation, STEP takes 36 min. Simulation, STL takes 34 min. Visual, GLB takes 42 min. Visual, OBJ takes 39 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 9.7 1587.7 154.9 4 ms 359.8 9.5 26.9 1.4 2149.9
Simulation, STEP 8.2 1539.0 150.1 3 ms 348.4 85.7 26.2 1.2 2158.9
Simulation, STL 7.9 1507.8 146.9 4 ms 343.3 20.2 27.7 1.4 2055.2
Simulation, OBJ exceeded 11 GB on a 15 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Visual, GLB 8.3 1522.9 150.6 3 ms 798.7 3.5 32.1 0.9 2517.0
Visual, OBJ 7.5 1345.4 130.5 6 ms 698.2 96.7 30.9 1.0 2310.2
Board Repo: gralco/l5-schematic
Board: librem5_mainboard.kicad_pcb
Folder CAD / PADS / librem5_mainboard / librem5_mainboard_kicad_conversion
Complexity 536 / 1000 (size 371, features 165)
KESE features through vias, padstacks,
slotted holes, drill offsets,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026 to 10th November 2026
Copper layers 10
File format KiCad 10 (20260206)
Parts, tracks, vias 1,161, 23,746, 5,044
Triangles, simulation 42,957,272 in 866 parts
Verifier Simulation, GLB: Verifier FAIL
Simulation, STEP: Verifier FAIL
Simulation, STL: Verifier FAIL
Simulation, OBJ: exceeded 11 GB on a 15 GB machine (stopped there, not a KESE failure); it will be run again on a machine with more memory
Bad design Bad design according to KESE: copper of two nets on top of each other in the file, a short KiCad's DRC reports; GND and 4G_POWER_KEY vias about 0.01 mm apart in 238 places, the first at (149.77, 116.06) mm (left so by the conversion from PADS). KESE models what the file says, so the Verifier rightly finds the two nets' solids overlapping
Run again Visual, OBJ: failed in the corpus run, run again with the memory cap raised from 11 GB to 14.5 GB, and passed
File
type
File
size
Peak memory
used
Simulation
GLB 1.4 GB 9.2 GB
STEP 4.5 GB 11 GB
STL 2.1 GB 9.2 GB
OBJ – 11 GB
Visual
GLB 655 MB 11 GB
OBJ 2.2 GB 14 GB

10.52 amalthea

amalthea: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 5.7 s. Simulation, STEP takes 7.1 s. Simulation, STL takes 5.7 s. Simulation, OBJ takes 8.4 s. Visual, GLB takes 7.7 s. Visual, OBJ takes 9.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.5 2.4 0.3 ms 2.1 0.1 0.2 0.2 5.7
Simulation, STEP 0.2 0.5 2.3 0.3 ms 2.0 1.7 0.3 0.2 7.1
Simulation, STL 0.2 0.5 2.3 0.3 ms 2.0 0.2 0.3 0.3 5.7
Simulation, OBJ 0.2 0.5 2.3 0.2 ms 2.1 2.9 0.3 0.2 8.4
Visual, GLB 0.2 0.5 2.3 0.3 ms 4.1 54 ms 0.5 0.2 7.7
Visual, OBJ 0.2 0.5 2.3 0.3 ms 4.1 1.6 0.6 0.2 9.5
Board Repo: greatscottgadgets/amalthea-hardware
Board: amalthea.kicad_pcb
Complexity 334 / 1000 (size 219, features 115)
KESE features through vias, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 41, 440, 63
Triangles, simulation 747,338 in 69 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 26 MB 350 MB
STEP 103 MB 410 MB
STL 37 MB 342 MB
OBJ 76 MB 532 MB
Visual
GLB 14 MB 388 MB
OBJ 41 MB 388 MB

10.53 cydonia

cydonia: stages 4 and 6 take 55% to 83% of a run. Simulation, GLB takes 9.8 s. Simulation, STEP takes 12 s. Simulation, STL takes 9.7 s. Simulation, OBJ takes 14 s. Visual, GLB takes 14 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.9 4.6 0.4 ms 3.1 0.2 0.4 0.3 9.8
Simulation, STEP 0.3 1.0 4.5 0.5 ms 3.0 2.5 0.4 0.3 12.0
Simulation, STL 0.3 0.9 4.5 0.5 ms 3.0 0.3 0.4 0.2 9.7
Simulation, OBJ 0.3 0.9 4.7 0.7 ms 3.0 4.5 0.4 0.2 14.0
Visual, GLB 0.3 1.0 4.7 0.6 ms 7.0 96 ms 0.7 0.3 13.9
Visual, OBJ 0.3 1.0 4.6 1 ms 6.8 2.7 0.8 0.3 16.4
Board Repo: greatscottgadgets/cydonia
Board: cydonia.kicad_pcb
Complexity 299 / 1000 (size 234, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 107, 574, 74
Triangles, simulation 920,804 in 93 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 33 MB 452 MB
STEP 124 MB 484 MB
STL 46 MB 454 MB
OBJ 96 MB 679 MB
Visual
GLB 19 MB 473 MB
OBJ 57 MB 499 MB

10.54 cynthion

cynthion: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 56 s. Simulation, STEP takes 68 s. Simulation, STL takes 57 s. Simulation, OBJ takes 90 s. Visual, GLB takes 80 s. Visual, OBJ takes 98 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.4 5.1 21.7 2 ms 23.1 1.2 2.9 0.3 55.6
Simulation, STEP 1.5 5.1 21.4 0.9 ms 23.0 13.7 2.9 0.3 67.9
Simulation, STL 1.4 5.2 21.8 1 ms 23.5 2.2 3.0 0.3 57.4
Simulation, OBJ 1.4 5.3 21.7 1 ms 23.3 35.3 3.1 0.4 90.5
Visual, GLB 1.4 5.3 21.3 1.0 ms 45.3 0.5 5.5 0.3 79.7
Visual, OBJ 1.5 5.2 21.9 1.0 ms 46.2 18.2 5.0 0.3 98.3
Board Repo: greatscottgadgets/cynthion-hardware
Board: cynthion.kicad_pcb
Complexity 454 / 1000 (size 304, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
arc tracks, filled zones,
copper drawings, copper text,
curved board outline, stack-up,
dielectric εr and tanδ,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 7 (20221018)
Parts, tracks, vias 294, 3,622, 651
Triangles, simulation 6,192,160 in 391 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 212 MB 1.5 GB
STEP 929 MB 2.1 GB
STL 310 MB 1.7 GB
OBJ 676 MB 4.0 GB
Visual
GLB 112 MB 1.9 GB
OBJ 364 MB 2.5 GB

10.55 gig-e

gig-e: stages 4 and 6 take 51% to 82% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 26 s. Simulation, OBJ takes 40 s. Visual, GLB takes 38 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 2.9 11.2 0.6 ms 8.7 0.4 1.3 0.2 25.3
Simulation, STEP 0.6 2.9 11.5 0.9 ms 8.5 5.9 1.2 0.3 30.9
Simulation, STL 0.6 3.0 11.4 0.9 ms 8.7 1.0 1.3 0.3 26.3
Simulation, OBJ 0.6 3.0 11.5 1 ms 8.7 14.2 1.3 0.3 39.6
Visual, GLB 0.6 2.9 11.2 0.6 ms 20.2 0.3 2.7 0.2 38.1
Visual, OBJ 0.6 2.8 11.2 1 ms 19.4 9.1 2.9 0.2 46.3
Board Repo: greatscottgadgets/daisho
Board: gig-e.kicad_pcb
Folder hw / de2-115-frontend / gig-e
Complexity 307 / 1000 (size 272, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 181, 2,692, 396
Triangles, simulation 2,547,136 in 199 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 90 MB 882 MB
STEP 353 MB 1.1 GB
STL 127 MB 911 MB
OBJ 273 MB 1.7 GB
Visual
GLB 61 MB 1.1 GB
OBJ 188 MB 1.3 GB

10.56 hdmi

hdmi: stages 4 and 6 take 45% to 83% of a run. Simulation, GLB takes 44 s. Simulation, STEP takes 54 s. Simulation, STL takes 46 s. Simulation, OBJ takes 77 s. Visual, GLB takes 72 s. Visual, OBJ takes 87 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 4.9 15.8 1.0 ms 18.6 0.9 2.6 0.3 44.2
Simulation, STEP 0.9 5.0 14.8 1.0 ms 19.3 11.5 2.5 0.3 54.4
Simulation, STL 1.0 5.3 15.1 3 ms 20.2 1.8 2.5 0.4 46.2
Simulation, OBJ 1.0 4.9 15.1 2 ms 19.9 33.3 2.8 0.4 77.4
Visual, GLB 1.0 5.0 16.8 1 ms 43.3 0.6 5.0 0.4 71.9
Visual, OBJ 1.0 5.4 15.0 1 ms 42.8 17.9 4.4 0.3 86.8
Board Repo: greatscottgadgets/daisho
Board: hdmi.kicad_pcb
Folder hw / de2-115-frontend / hdmi
Complexity 354 / 1000 (size 299, features 55)
KESE features through vias, slotted holes,
filled zones, copper text
Tested 9th November 2026
Copper layers 6
File format KiCad 3 (3)
Parts, tracks, vias 221, 2,755, 605
Triangles, simulation 4,787,176 in 387 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 164 MB 1.4 GB
STEP 555 MB 1.7 GB
STL 239 MB 1.3 GB
OBJ 513 MB 3.0 GB
Visual
GLB 92 MB 1.7 GB
OBJ 296 MB 1.9 GB

10.57 rs232

rs232: stages 4 and 6 take 53% to 82% of a run. Simulation, GLB takes 7.7 s. Simulation, STEP takes 10 s. Simulation, STL takes 8.3 s. Simulation, OBJ takes 12 s. Visual, GLB takes 12 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.0 0.5 ms 3.0 0.1 0.4 0.2 7.7
Simulation, STEP 0.2 0.8 3.0 0.5 ms 3.2 2.5 0.4 0.2 10.4
Simulation, STL 0.2 0.8 3.0 0.4 ms 3.4 0.2 0.4 0.2 8.3
Simulation, OBJ 0.2 0.9 3.1 0.5 ms 3.3 4.0 0.4 0.2 12.1
Visual, GLB 0.2 0.8 3.0 0.7 ms 7.1 0.1 0.9 0.2 12.3
Visual, OBJ 0.2 0.8 3.0 0.7 ms 6.9 3.5 1.0 0.2 15.7
Board Repo: greatscottgadgets/daisho
Board: rs232.kicad_pcb
Folder hw / de2-115-frontend / rs232
Complexity 222 / 1000 (size 177, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 3 (3)
Parts, tracks, vias 41, 1,007, 149
Triangles, simulation 780,252 in 111 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 27 MB 447 MB
STEP 129 MB 483 MB
STL 39 MB 423 MB
OBJ 79 MB 563 MB
Visual
GLB 23 MB 577 MB
OBJ 71 MB 596 MB

10.58 gige_fe

gige_fe: stages 4 and 6 take 49% to 84% of a run. Simulation, GLB takes 20 s. Simulation, STEP takes 25 s. Simulation, STL takes 21 s. Simulation, OBJ takes 33 s. Visual, GLB takes 31 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.3 8.8 0.9 ms 7.1 0.4 1.0 0.3 20.3
Simulation, STEP 0.5 2.4 9.0 0.9 ms 7.0 4.8 0.9 0.3 24.9
Simulation, STL 0.5 2.5 8.9 0.8 ms 7.3 0.9 0.9 0.2 21.3
Simulation, OBJ 0.5 2.6 9.0 1 ms 7.5 12.5 1.0 0.3 33.4
Visual, GLB 0.4 2.4 9.2 0.9 ms 16.9 0.2 1.8 0.2 31.2
Visual, OBJ 0.5 2.7 9.0 2 ms 17.1 8.3 2.3 0.3 40.1
Board Repo: greatscottgadgets/daisho
Board: gige_fe.kicad_pcb
Folder hw / frontend / daisho_gige_fe
Complexity 306 / 1000 (size 261, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 138, 1,686, 264
Triangles, simulation 2,142,834 in 260 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 75 MB 801 MB
STEP 291 MB 856 MB
STL 107 MB 840 MB
OBJ 228 MB 1.4 GB
Visual
GLB 46 MB 890 MB
OBJ 140 MB 1.0 GB

10.59 rs232_fe

rs232_fe: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 25 s. Simulation, STEP takes 31 s. Simulation, STL takes 27 s. Simulation, OBJ takes 41 s. Visual, GLB takes 39 s. Visual, OBJ takes 46 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.6 11.4 2 ms 8.5 0.4 1.3 0.3 25.1
Simulation, STEP 0.6 2.8 11.1 1.0 ms 8.6 6.3 1.3 0.3 31.0
Simulation, STL 0.6 2.9 11.8 1 ms 9.3 0.8 1.4 0.3 26.9
Simulation, OBJ 0.6 3.0 12.2 1 ms 9.4 14.2 1.4 0.3 41.0
Visual, GLB 0.6 2.9 11.6 1 ms 21.6 0.2 2.1 0.3 39.3
Visual, OBJ 0.5 2.8 11.1 1.0 ms 21.0 8.3 2.0 0.2 46.0
Board Repo: greatscottgadgets/daisho
Board: rs232_fe.kicad_pcb
Folder hw / frontend / daisho_rs232_fe / rs232_fe
Complexity 275 / 1000 (size 220, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 165, 2,512, 181
Triangles, simulation 2,309,022 in 309 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 82 MB 871 MB
STEP 345 MB 921 MB
STL 115 MB 817 MB
OBJ 250 MB 1.6 GB
Visual
GLB 52 MB 1.0 GB
OBJ 161 MB 1.1 GB

10.60 hdmi

hdmi: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 48 s. Simulation, STEP takes 58 s. Simulation, STL takes 49 s. Simulation, OBJ takes 77 s. Visual, GLB takes 65 s. Visual, OBJ takes 81 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 5.1 19.0 1 ms 19.0 1.1 2.2 0.4 47.7
Simulation, STEP 1.0 5.3 19.0 0.8 ms 19.9 10.1 2.6 0.3 58.0
Simulation, STL 1.0 5.0 19.3 2 ms 19.3 1.6 2.6 0.4 49.1
Simulation, OBJ 0.9 5.5 19.4 1 ms 19.1 28.8 2.5 0.4 76.5
Visual, GLB 1.0 5.4 19.3 1 ms 34.7 0.4 4.3 0.4 65.4
Visual, OBJ 0.9 5.2 19.2 2 ms 35.4 15.0 5.3 0.3 81.3
Board Repo: greatscottgadgets/daisho
Board: hdmi.kicad_pcb
Folder hw / frontend / hdmi
Complexity 346 / 1000 (size 301, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 224, 3,608, 525
Triangles, simulation 4,443,754 in 345 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 155 MB 1.3 GB
STEP 527 MB 1.6 GB
STL 222 MB 1.3 GB
OBJ 480 MB 2.9 GB
Visual
GLB 83 MB 1.6 GB
OBJ 264 MB 1.8 GB

10.61 prod_fe

prod_fe: stages 4 and 6 take 52% to 84% of a run. Simulation, GLB takes 2.8 s. Simulation, STEP takes 3.9 s. Simulation, STL takes 2.9 s. Simulation, OBJ takes 3.8 s. Visual, GLB takes 5.3 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.0 0.3 ms 1.0 45 ms 0.2 0.2 2.8
Simulation, STEP 0.1 0.3 1.0 0.4 ms 1.0 1.1 0.2 0.3 3.9
Simulation, STL 0.1 0.3 1.0 0.4 ms 1.0 71 ms 0.2 0.2 2.9
Simulation, OBJ 0.1 0.3 1.0 0.4 ms 1.0 1.0 0.2 0.2 3.8
Visual, GLB 0.1 0.3 1.0 0.4 ms 3.5 34 ms 0.2 0.2 5.3
Visual, OBJ 0.1 0.3 1.0 0.6 ms 3.4 0.8 0.2 0.2 6.1
Board Repo: greatscottgadgets/daisho
Board: prod_fe.kicad_pcb
Folder hw / frontend / prod_fe_template
Complexity 171 / 1000 (size 146, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 3 (3)
Parts, tracks, vias 5, 208, 28
Triangles, simulation 204,920 in 174 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 224 MB
STEP 28 MB 232 MB
STL 10 MB 216 MB
OBJ 21 MB 224 MB
Visual
GLB 5.3 MB 199 MB
OBJ 15 MB 204 MB

10.62 usb

usb: stages 4 and 6 take 49% to 83% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 70 s. Simulation, STL takes 63 s. Simulation, OBJ takes 95 s. Visual, GLB takes 82 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.9 7.2 24.1 3 ms 21.4 1.1 2.7 0.3 57.7
Simulation, STEP 0.9 7.3 24.9 1 ms 22.0 12.2 2.6 0.3 70.1
Simulation, STL 0.9 8.5 24.5 2 ms 23.0 2.4 2.9 0.4 62.6
Simulation, OBJ 0.9 7.7 24.7 1 ms 22.3 36.5 2.6 0.4 95.2
Visual, GLB 0.9 7.3 24.5 2 ms 43.3 0.5 5.0 0.3 81.8
Visual, OBJ 1.0 7.7 24.7 1 ms 45.8 21.6 5.0 0.3 106.1
Board Repo: greatscottgadgets/daisho
Board: usb.kicad_pcb
Folder hw / frontend / usb
Complexity 333 / 1000 (size 308, features 25)
KESE features through vias, curved board outline
Tested 9th November 2026
Copper layers 6
File format KiCad 4 (4)
Parts, tracks, vias 249, 5,119, 831
Triangles, simulation 5,867,216 in 325 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 202 MB 1.5 GB
STEP 706 MB 2.0 GB
STL 293 MB 1.6 GB
OBJ 640 MB 3.8 GB
Visual
GLB 110 MB 1.8 GB
OBJ 360 MB 2.4 GB

10.63 main_board

main_board: stages 4 and 6 take 46% to 83% of a run. Simulation, GLB takes 2 min. Simulation, STEP takes 2 min. Simulation, STL takes 2 min. Simulation, OBJ takes 3 min. Visual, GLB takes 2 min. Visual, OBJ takes 3 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 12.1 44.8 2 ms 41.1 2.4 5.7 0.5 108.3
Simulation, STEP 1.6 12.1 44.2 2 ms 41.4 23.8 6.2 0.5 129.9
Simulation, STL 1.8 12.4 44.6 3 ms 41.5 5.2 6.4 0.5 112.4
Simulation, OBJ 1.7 12.4 44.5 2 ms 41.2 80.1 6.3 0.5 186.7
Visual, GLB 1.8 12.4 44.9 3 ms 79.1 0.9 9.9 0.4 149.3
Visual, OBJ 1.9 12.8 46.2 3 ms 86.3 33.2 10.6 0.4 191.3
Board Repo: greatscottgadgets/daisho
Board: main_board.kicad_pcb
Folder hw / main_board
Complexity 375 / 1000 (size 330, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 8
File format KiCad 4 (4)
Parts, tracks, vias 383, 8,842, 1,485
Triangles, simulation 12,543,244 in 692 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 428 MB 2.4 GB
STEP 1.3 GB 3.6 GB
STL 627 MB 2.4 GB
OBJ 1.4 GB 7.9 GB
Visual
GLB 192 MB 3.2 GB
OBJ 649 MB 4.2 GB

10.64 azalea

azalea: stages 4 and 6 take 52% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 23 s. Simulation, OBJ takes 33 s. Visual, GLB takes 32 s. Visual, OBJ takes 39 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 2.5 9.1 0.9 ms 8.3 0.4 1.1 0.3 22.1
Simulation, STEP 0.4 2.4 9.2 1 ms 8.2 5.2 1.2 0.3 26.8
Simulation, STL 0.5 2.5 9.1 2 ms 8.3 0.7 1.2 0.3 22.6
Simulation, OBJ 0.4 2.6 9.1 1 ms 8.2 11.8 1.1 0.2 33.4
Visual, GLB 0.5 2.4 8.9 1 ms 17.8 0.3 2.1 0.3 32.2
Visual, OBJ 0.4 2.6 9.3 1 ms 18.0 6.4 1.9 0.3 39.0
Board Repo: greatscottgadgets/greatfet-hardware
Board: azalea.kicad_pcb
Folder azalea
Complexity 300 / 1000 (size 245, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 84, 1,412, 176
Triangles, simulation 2,293,082 in 149 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 80 MB 702 MB
STEP 329 MB 832 MB
STL 115 MB 717 MB
OBJ 244 MB 1.5 GB
Visual
GLB 48 MB 870 MB
OBJ 149 MB 1.1 GB

10.65 begonia

begonia: stages 4 and 6 take 57% to 83% of a run. Simulation, GLB takes 8.0 s. Simulation, STEP takes 9.6 s. Simulation, STL takes 8.1 s. Simulation, OBJ takes 12 s. Visual, GLB takes 11 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.6 4.0 0.4 ms 2.5 0.1 0.4 0.2 8.0
Simulation, STEP 0.2 0.7 3.8 0.7 ms 2.4 2.0 0.4 0.2 9.6
Simulation, STL 0.1 0.7 3.8 0.7 ms 2.6 0.2 0.4 0.2 8.1
Simulation, OBJ 0.1 0.6 4.0 0.6 ms 2.6 3.6 0.4 0.2 11.5
Visual, GLB 0.2 0.7 4.0 0.9 ms 5.0 53 ms 0.6 0.3 10.7
Visual, OBJ 0.2 0.6 3.9 0.6 ms 4.8 1.6 0.6 0.2 12.0
Board Repo: greatscottgadgets/greatfet-hardware
Board: begonia.kicad_pcb
Folder begonia
Complexity 162 / 1000 (size 117, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 13, 68, 3
Triangles, simulation 705,624 in 117 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 23 MB 327 MB
STEP 106 MB 411 MB
STL 35 MB 326 MB
OBJ 71 MB 506 MB
Visual
GLB 12 MB 363 MB
OBJ 34 MB 368 MB

10.66 crocus

crocus: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 14 s. Simulation, OBJ takes 23 s. Visual, GLB takes 18 s. Visual, OBJ takes 21 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.3 6.0 0.5 ms 4.4 0.3 0.7 0.3 13.2
Simulation, STEP 0.4 1.5 6.3 0.5 ms 4.7 3.4 0.7 0.3 17.1
Simulation, STL 0.3 1.4 6.4 0.5 ms 4.6 0.4 0.8 0.2 14.2
Simulation, OBJ 0.3 1.4 6.3 0.5 ms 5.1 8.5 0.7 0.3 22.7
Visual, GLB 0.3 1.4 6.4 0.6 ms 8.3 90 ms 0.9 0.2 17.6
Visual, OBJ 0.3 1.3 6.3 0.8 ms 8.0 3.6 1.0 0.2 20.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: crocus.kicad_pcb
Folder crocus
Complexity 220 / 1000 (size 175, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 49, 298, 46
Triangles, simulation 1,310,436 in 132 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 44 MB 471 MB
STEP 169 MB 546 MB
STL 66 MB 486 MB
OBJ 135 MB 870 MB
Visual
GLB 21 MB 577 MB
OBJ 62 MB 529 MB

10.67 daffodil

daffodil: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 13 s. Simulation, OBJ takes 18 s. Visual, GLB takes 15 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 6.1 0.5 ms 3.9 0.2 0.4 0.2 12.0
Simulation, STEP 0.2 0.9 6.1 0.7 ms 4.2 3.1 0.4 0.2 15.1
Simulation, STL 0.2 1.0 6.3 0.5 ms 4.0 0.4 0.5 0.2 12.6
Simulation, OBJ 0.2 0.9 6.1 0.5 ms 4.0 5.7 0.5 0.2 17.6
Visual, GLB 0.2 1.0 6.4 0.5 ms 6.0 77 ms 0.7 0.2 14.5
Visual, OBJ 0.2 1.0 6.5 0.5 ms 6.3 2.6 0.7 0.3 17.5
Board Repo: greatscottgadgets/greatfet-hardware
Board: daffodil.kicad_pcb
Folder daffodil
Complexity 137 / 1000 (size 97, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 8, 30, 0
Triangles, simulation 1,112,878 in 154 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 37 MB 443 MB
STEP 172 MB 558 MB
STL 56 MB 430 MB
OBJ 113 MB 786 MB
Visual
GLB 18 MB 491 MB
OBJ 53 MB 513 MB

10.68 edelweiss

edelweiss: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 6.8 s. Simulation, STEP takes 8.5 s. Simulation, STL takes 6.8 s. Simulation, OBJ takes 11 s. Visual, GLB takes 7.7 s. Visual, OBJ takes 8.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.5 3.1 0.1 ms 2.5 98 ms 0.3 0.2 6.8
Simulation, STEP 0.1 0.5 3.2 0.2 ms 2.1 2.0 0.3 0.2 8.5
Simulation, STL 0.2 0.5 3.2 0.3 ms 2.3 0.2 0.3 0.3 6.8
Simulation, OBJ 0.1 0.5 3.2 0.1 ms 2.5 3.9 0.3 0.3 10.8
Visual, GLB 0.2 0.6 3.3 0.3 ms 3.0 43 ms 0.3 0.2 7.7
Visual, OBJ 0.2 0.5 2.9 0.4 ms 3.0 1.4 0.4 0.2 8.5
Board Repo: greatscottgadgets/greatfet-hardware
Board: edelweiss.kicad_pcb
Folder edelweiss
Complexity 96 / 1000 (size 56, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 7, 0, 0
Triangles, simulation 829,404 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 371 MB
STEP 99 MB 443 MB
STL 41 MB 376 MB
OBJ 83 MB 591 MB
Visual
GLB 10 MB 362 MB
OBJ 30 MB 360 MB

10.69 foxglove

foxglove: stages 4 and 6 take 56% to 85% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 11 s. Simulation, OBJ takes 16 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.7 5.8 0.6 ms 3.3 0.2 0.5 0.3 11.1
Simulation, STEP 0.3 0.8 5.5 0.9 ms 3.4 2.7 0.5 0.3 13.5
Simulation, STL 0.2 0.7 5.5 0.7 ms 3.3 0.3 0.5 0.3 10.7
Simulation, OBJ 0.2 0.8 5.9 1.0 ms 3.3 5.4 0.5 0.2 16.5
Visual, GLB 0.2 0.8 5.4 0.6 ms 5.9 77 ms 0.7 0.2 13.3
Visual, OBJ 0.3 0.8 5.4 1 ms 6.3 2.5 0.8 0.3 16.4
Board Repo: greatscottgadgets/greatfet-hardware
Board: foxglove.kicad_pcb
Folder foxglove
Complexity 242 / 1000 (size 187, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 19, 318, 24
Triangles, simulation 855,148 in 137 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 29 MB 375 MB
STEP 133 MB 464 MB
STL 43 MB 361 MB
OBJ 87 MB 632 MB
Visual
GLB 15 MB 433 MB
OBJ 44 MB 427 MB

10.70 gladiolus

gladiolus: stages 4 and 6 take 55% to 84% of a run. Simulation, GLB takes 24 s. Simulation, STEP takes 29 s. Simulation, STL takes 24 s. Simulation, OBJ takes 36 s. Visual, GLB takes 32 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 11.3 0.6 ms 8.2 0.4 1.1 0.3 24.3
Simulation, STEP 0.5 2.5 11.6 0.7 ms 8.1 5.4 1.2 0.3 29.5
Simulation, STL 0.4 2.4 11.1 0.7 ms 8.1 0.8 1.2 0.2 24.2
Simulation, OBJ 0.4 2.3 11.5 0.5 ms 8.4 12.0 1.1 0.3 36.0
Visual, GLB 0.4 2.5 11.4 0.8 ms 15.8 0.2 1.8 0.2 32.3
Visual, OBJ 0.4 2.4 11.4 0.8 ms 16.8 7.4 1.5 0.2 40.2
Board Repo: greatscottgadgets/greatfet-hardware
Board: gladiolus.kicad_pcb
Folder gladiolus
Complexity 299 / 1000 (size 244, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 138, 962, 106
Triangles, simulation 2,062,476 in 114 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 71 MB 782 MB
STEP 326 MB 859 MB
STL 103 MB 661 MB
OBJ 217 MB 1.3 GB
Visual
GLB 40 MB 856 MB
OBJ 122 MB 938 MB

10.71 jasmine

jasmine: stages 4 and 6 take 58% to 83% of a run. Simulation, GLB takes 17 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 25 s. Visual, GLB takes 21 s. Visual, OBJ takes 29 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.1 8.2 0.7 ms 5.3 0.2 0.5 0.3 16.9
Simulation, STEP 0.3 1.7 7.4 0.6 ms 5.0 3.8 0.6 0.3 19.0
Simulation, STL 0.3 1.6 7.6 1 ms 5.1 0.4 0.7 0.3 16.0
Simulation, OBJ 0.3 2.0 8.5 1 ms 5.8 7.1 0.6 0.3 24.7
Visual, GLB 0.4 1.7 7.4 0.8 ms 10.3 0.1 1.0 0.3 21.3
Visual, OBJ 0.3 1.9 8.8 0.5 ms 11.0 5.5 0.9 0.3 28.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: jasmine.kicad_pcb
Folder jasmine
Complexity 218 / 1000 (size 163, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 69, 349, 37
Triangles, simulation 1,031,328 in 156 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 408 MB
STEP 163 MB 510 MB
STL 52 MB 428 MB
OBJ 106 MB 754 MB
Visual
GLB 20 MB 504 MB
OBJ 59 MB 484 MB

10.72 lily

lily: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 4.6 0.5 ms 3.5 0.2 0.6 0.2 10.2
Simulation, STEP 0.2 1.0 4.5 0.4 ms 3.4 2.5 0.5 0.2 12.4
Simulation, STL 0.3 1.0 4.3 0.4 ms 3.4 0.3 0.5 0.2 10.0
Simulation, OBJ 0.2 1.1 4.7 1 ms 3.5 5.2 0.6 0.3 15.5
Visual, GLB 0.2 0.9 4.6 0.6 ms 6.4 64 ms 0.6 0.3 13.1
Visual, OBJ 0.2 1.0 4.6 1 ms 6.2 2.1 0.7 0.2 15.1
Board Repo: greatscottgadgets/greatfet-hardware
Board: lily.kicad_pcb
Folder lily
Complexity 212 / 1000 (size 157, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 31, 139, 17
Triangles, simulation 1,061,168 in 122 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 383 MB
STEP 134 MB 472 MB
STL 53 MB 394 MB
OBJ 107 MB 747 MB
Visual
GLB 15 MB 436 MB
OBJ 44 MB 428 MB

10.73 luckybamboo

luckybamboo: stages 4 and 6 take 53% to 85% of a run. Simulation, GLB takes 27 s. Simulation, STEP takes 32 s. Simulation, STL takes 27 s. Simulation, OBJ takes 39 s. Visual, GLB takes 33 s. Visual, OBJ takes 40 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 2.5 11.9 0.8 ms 9.6 0.5 1.2 0.2 26.5
Simulation, STEP 0.5 2.5 12.3 1 ms 9.6 5.7 1.2 0.3 32.1
Simulation, STL 0.5 2.7 11.9 0.8 ms 9.5 0.7 1.1 0.2 26.7
Simulation, OBJ 0.5 2.5 11.4 0.8 ms 9.4 13.9 1.1 0.2 39.0
Visual, GLB 0.5 2.5 11.9 0.8 ms 16.1 0.2 1.5 0.2 32.9
Visual, OBJ 0.5 2.5 11.8 2 ms 16.1 7.0 1.8 0.2 39.9
Board Repo: greatscottgadgets/greatfet-hardware
Board: luckybamboo.kicad_pcb
Folder luckybamboo
Complexity 336 / 1000 (size 281, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 153, 1,754, 197
Triangles, simulation 2,657,326 in 183 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 92 MB 827 MB
STEP 351 MB 979 MB
STL 133 MB 884 MB
OBJ 283 MB 1.8 GB
Visual
GLB 48 MB 901 MB
OBJ 147 MB 1.0 GB

10.74 narcissus

narcissus: stages 4 and 6 take 60% to 88% of a run. Simulation, GLB takes 30 s. Simulation, STEP takes 37 s. Simulation, STL takes 30 s. Simulation, OBJ takes 44 s. Visual, GLB takes 36 s. Visual, OBJ takes 43 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 2.0 15.7 0.6 ms 10.1 0.3 1.6 0.3 30.4
Simulation, STEP 0.5 1.9 15.6 0.8 ms 10.1 6.8 1.7 0.3 36.9
Simulation, STL 0.4 2.0 15.5 0.6 ms 9.7 0.8 1.6 0.2 30.2
Simulation, OBJ 0.4 2.0 15.8 0.6 ms 10.3 13.4 1.6 0.3 43.8
Visual, GLB 0.4 1.7 13.4 0.8 ms 18.6 0.3 1.7 0.3 36.4
Visual, OBJ 0.4 1.9 15.5 0.5 ms 16.5 7.1 1.4 0.4 43.1
Board Repo: greatscottgadgets/greatfet-hardware
Board: narcissus.kicad_pcb
Folder narcissus
Complexity 280 / 1000 (size 225, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 51, 1,212, 68
Triangles, simulation 2,432,446 in 193 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 83 MB 728 MB
STEP 424 MB 977 MB
STL 122 MB 752 MB
OBJ 257 MB 1.6 GB
Visual
GLB 44 MB 977 MB
OBJ 135 MB 1.0 GB

10.75 neighbor-template

neighbor-template: stages 4 and 6 take 52% to 82% of a run. Simulation, GLB takes 11 s. Simulation, STEP takes 13 s. Simulation, STL takes 9.1 s. Simulation, OBJ takes 13 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 5.0 0.2 ms 4.1 0.2 0.5 0.3 11.1
Simulation, STEP 0.2 0.8 4.7 0.2 ms 3.3 2.9 0.5 0.3 12.6
Simulation, STL 0.2 0.8 4.3 0.1 ms 3.0 0.2 0.4 0.2 9.1
Simulation, OBJ 0.2 0.6 4.0 0.2 ms 2.8 4.8 0.5 0.3 13.3
Visual, GLB 0.2 0.8 4.5 0.4 ms 3.7 48 ms 0.4 0.3 10.0
Visual, OBJ 0.2 0.7 4.1 0.2 ms 3.8 2.0 0.5 0.3 11.6
Board Repo: greatscottgadgets/greatfet-hardware
Board: neighbor-template.kicad_pcb
Folder neighbor-template
Complexity 96 / 1000 (size 56, features 40)
KESE features filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 7, 0, 0
Triangles, simulation 829,656 in 16 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 28 MB 353 MB
STEP 99 MB 441 MB
STL 41 MB 380 MB
OBJ 83 MB 589 MB
Visual
GLB 10 MB 360 MB
OBJ 30 MB 365 MB

10.76 quince

quince: stages 4 and 6 take 56% to 86% of a run. Simulation, GLB takes 9.9 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 13 s. Visual, OBJ takes 16 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 5.0 0.7 ms 3.1 0.1 0.4 0.2 9.9
Simulation, STEP 0.2 0.8 5.6 0.7 ms 3.1 2.7 0.4 0.3 13.1
Simulation, STL 0.2 0.7 5.5 0.4 ms 3.2 0.2 0.4 0.2 10.5
Simulation, OBJ 0.2 0.7 5.2 0.4 ms 3.2 5.0 0.4 0.2 14.9
Visual, GLB 0.2 0.7 5.2 0.3 ms 5.6 77 ms 0.5 0.3 12.7
Visual, OBJ 0.2 0.8 5.4 0.5 ms 5.8 2.7 0.6 0.3 15.7
Board Repo: greatscottgadgets/greatfet-hardware
Board: quince.kicad_pcb
Folder quince
Complexity 184 / 1000 (size 129, features 55)
KESE features through vias, filled zones,
copper text, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 4 (4)
Parts, tracks, vias 26, 76, 10
Triangles, simulation 859,922 in 26 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 390 MB
STEP 134 MB 456 MB
STL 43 MB 421 MB
OBJ 88 MB 627 MB
Visual
GLB 15 MB 439 MB
OBJ 46 MB 424 MB

10.77 hackrf-one

hackrf-one: stages 4 and 6 take 57% to 84% of a run. Simulation, GLB takes 70 s. Simulation, STEP takes 81 s. Simulation, STL takes 70 s. Simulation, OBJ takes 2 min. Visual, GLB takes 91 s. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.6 6.9 30.9 2 ms 26.5 1.0 2.8 0.4 70.2
Simulation, STEP 1.5 6.6 30.1 2 ms 26.6 13.1 2.7 0.3 81.0
Simulation, STL 1.5 6.8 30.3 2 ms 26.4 1.7 2.7 0.4 69.8
Simulation, OBJ 1.4 6.8 30.5 1 ms 27.3 31.8 3.0 0.4 101.2
Visual, GLB 1.5 6.7 31.2 1 ms 45.6 0.5 5.2 0.4 91.0
Visual, OBJ 1.6 7.4 33.9 3 ms 47.6 17.3 4.9 0.4 113.1
Board Repo: greatscottgadgets/hackrf
Board: hackrf-one.kicad_pcb
Folder hardware / hackrf-one
Complexity 396 / 1000 (size 291, features 105)
KESE features through vias, filled zones,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 346, 3,817, 498
Triangles, simulation 4,917,978 in 392 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 173 MB 1.5 GB
STEP 687 MB 1.8 GB
STL 246 MB 1.5 GB
OBJ 541 MB 3.3 GB
Visual
GLB 95 MB 1.6 GB
OBJ 304 MB 2.1 GB

10.78 LNA915

LNA915: stages 4 and 6 take 50% to 77% of a run. Simulation, GLB takes 2.3 s. Simulation, STEP takes 3.1 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.3 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 0.9 0.2 ms 0.8 37 ms 84 ms 0.2 2.3
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.7 1.0 98 ms 0.2 3.1
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.8 50 ms 0.1 0.3 2.6
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.9 1.0 0.1 0.2 3.3
Visual, GLB 0.1 0.2 0.9 0.2 ms 1.7 19 ms 0.1 0.3 3.3
Visual, OBJ 0.1 0.2 0.9 0.2 ms 1.7 0.5 0.1 0.2 3.7
Board Repo: greatscottgadgets/hackrf
Board: LNA915.kicad_pcb
Folder hardware / LNA915
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 124, 8
Triangles, simulation 207,672 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 205 MB
STEP 26 MB 221 MB
STL 10 MB 211 MB
OBJ 22 MB 214 MB
Visual
GLB 3.8 MB 167 MB
OBJ 11 MB 165 MB

10.79 marzipan

marzipan: stages 4 and 6 take 57% to 85% of a run. Simulation, GLB takes 58 s. Simulation, STEP takes 71 s. Simulation, STL takes 60 s. Simulation, OBJ takes 84 s. Visual, GLB takes 78 s. Visual, OBJ takes 92 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.0 5.3 27.0 2 ms 21.2 0.8 2.5 0.3 58.1
Simulation, STEP 1.0 5.3 27.6 2 ms 22.1 11.8 2.5 0.3 70.6
Simulation, STL 1.0 5.5 27.4 2 ms 21.5 1.5 2.8 0.3 59.9
Simulation, OBJ 1.0 5.4 26.9 2 ms 21.2 27.1 2.5 0.3 84.4
Visual, GLB 0.9 5.6 27.1 2 ms 39.5 0.4 4.0 0.3 78.0
Visual, OBJ 1.0 5.5 26.3 2 ms 39.5 14.9 4.3 0.3 91.8
Board Repo: greatscottgadgets/hackrf
Board: marzipan.kicad_pcb
Folder hardware / marzipan
Complexity 336 / 1000 (size 291, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 340, 3,928, 500
Triangles, simulation 4,858,612 in 391 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 170 MB 1.4 GB
STEP 669 MB 1.8 GB
STL 243 MB 1.4 GB
OBJ 539 MB 3.2 GB
Visual
GLB 95 MB 1.6 GB
OBJ 303 MB 2.1 GB

10.80 neapolitan

neapolitan: stages 4 and 6 take 58% to 85% of a run. Simulation, GLB takes 36 s. Simulation, STEP takes 41 s. Simulation, STL takes 37 s. Simulation, OBJ takes 51 s. Visual, GLB takes 48 s. Visual, OBJ takes 56 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 3.3 17.2 1 ms 12.1 0.5 1.4 0.3 35.6
Simulation, STEP 0.6 3.1 17.1 0.6 ms 12.0 6.9 1.5 0.3 41.4
Simulation, STL 0.6 3.4 17.7 0.8 ms 11.8 1.1 1.6 0.3 36.6
Simulation, OBJ 0.6 3.4 17.3 0.5 ms 12.0 15.9 1.5 0.3 51.0
Visual, GLB 0.7 3.2 16.7 1 ms 24.2 0.3 2.7 0.3 48.2
Visual, OBJ 0.5 3.0 16.9 0.6 ms 23.2 8.7 3.0 0.2 55.5
Board Repo: greatscottgadgets/hackrf
Board: neapolitan.kicad_pcb
Folder hardware / neapolitan
Complexity 318 / 1000 (size 273, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 241, 1,961, 272
Triangles, simulation 3,033,820 in 180 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 106 MB 1.0 GB
STEP 411 MB 1.2 GB
STL 152 MB 948 MB
OBJ 334 MB 2.1 GB
Visual
GLB 58 MB 1.2 GB
OBJ 181 MB 1.3 GB

10.81 operacake

operacake: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 33 s. Simulation, STEP takes 40 s. Simulation, STL takes 33 s. Simulation, OBJ takes 49 s. Visual, GLB takes 42 s. Visual, OBJ takes 50 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 3.5 14.1 0.7 ms 12.3 0.6 1.6 0.3 33.0
Simulation, STEP 0.5 3.5 14.1 1 ms 12.3 7.2 1.7 0.3 39.6
Simulation, STL 0.6 3.5 13.9 0.6 ms 12.4 0.9 1.7 0.3 33.4
Simulation, OBJ 0.6 3.5 13.8 0.8 ms 12.3 16.9 1.6 0.3 49.1
Visual, GLB 0.5 3.3 14.1 0.7 ms 21.2 0.2 2.7 0.2 42.3
Visual, OBJ 0.6 3.5 13.5 0.8 ms 22.0 7.7 2.7 0.3 50.2
Board Repo: greatscottgadgets/hackrf
Board: operacake.kicad_pcb
Folder hardware / operacake
Complexity 252 / 1000 (size 207, features 45)
KESE features through vias, filled zones,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 122, 1,091, 182
Triangles, simulation 3,263,706 in 217 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 110 MB 1.0 GB
STEP 391 MB 1.2 GB
STL 163 MB 993 MB
OBJ 354 MB 2.2 GB
Visual
GLB 50 MB 975 MB
OBJ 157 MB 1.2 GB

10.82 praline

praline: stages 4 and 6 take 54% to 86% of a run. Simulation, GLB takes 94 s. Simulation, STEP takes 2 min. Simulation, STL takes 95 s. Simulation, OBJ takes 2 min. Visual, GLB takes 2 min. Visual, OBJ takes 2 min

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 1.8 8.1 40.9 2 ms 36.9 1.6 4.0 0.4 93.7
Simulation, STEP 2.0 8.1 41.4 2 ms 37.3 19.2 3.8 0.4 112.2
Simulation, STL 1.9 7.5 40.9 1 ms 36.8 3.7 4.0 0.4 95.2
Simulation, OBJ 1.9 8.2 40.0 2 ms 36.7 51.0 4.2 0.4 142.5
Visual, GLB 1.8 7.7 40.2 2 ms 67.6 0.7 6.8 0.4 125.2
Visual, OBJ 1.9 7.7 40.2 2 ms 67.1 21.7 7.1 0.4 146.2
Board Repo: greatscottgadgets/hackrf-pro
Board: praline.kicad_pcb
Complexity 466 / 1000 (size 316, features 150)
KESE features through vias, slotted holes,
custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
copper text, curved board outline,
stack-up, dielectric εr and tanδ,
copper finish,
mask and silkscreen colours
Tested 9th November 2026
Copper layers 6
File format KiCad 9 (20241229)
Parts, tracks, vias 511, 4,690, 953
Triangles, simulation 9,435,120 in 508 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 319 MB 2.2 GB
STEP 1.2 GB 3.3 GB
STL 472 MB 2.2 GB
OBJ 1.0 GB 6.1 GB
Visual
GLB 149 MB 2.6 GB
OBJ 491 MB 3.3 GB

10.83 swg_test

swg_test: stages 4 and 6 take 45% to 72% of a run. Simulation, GLB takes 4.2 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.5 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 5.9 s. Visual, OBJ takes 7.4 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 1.1 0.2 ms 1.8 85 ms 0.2 0.2 4.2
Simulation, STEP 0.2 0.5 1.3 0.2 ms 1.9 1.4 0.2 0.3 5.8
Simulation, STL 0.2 0.6 1.2 0.2 ms 1.8 0.2 0.2 0.2 4.5
Simulation, OBJ 0.2 0.6 1.2 0.2 ms 1.9 2.6 0.2 0.2 6.9
Visual, GLB 0.2 0.6 1.3 0.2 ms 3.0 66 ms 0.5 0.2 5.9
Visual, OBJ 0.3 0.6 1.2 0.2 ms 3.0 1.7 0.4 0.3 7.4
Board Repo: greatscottgadgets/lab-notes
Board: swg_test.kicad_pcb
Folder rf-testing / 2023-05-16-swg-test-board / swg_test_kicad
Complexity 266 / 1000 (size 166, features 100)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
stack-up, dielectric εr and tanδ,
copper finish
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 23, 17, 129
Triangles, simulation 425,002 in 29 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 14 MB 313 MB
STEP 46 MB 357 MB
STL 21 MB 315 MB
OBJ 42 MB 342 MB
Visual
GLB 9.3 MB 297 MB
OBJ 27 MB 294 MB

10.84 LNA1109

LNA1109: stages 4 and 6 take 49% to 78% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.2 s. Simulation, STL takes 2.4 s. Simulation, OBJ takes 3.3 s. Visual, GLB takes 3.2 s. Visual, OBJ takes 3.7 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.2 1.0 0.3 ms 0.9 44 ms 0.1 0.3 2.7
Simulation, STEP 0.1 0.2 0.8 0.2 ms 0.8 0.9 0.1 0.2 3.2
Simulation, STL 0.1 0.2 0.9 0.8 ms 0.8 66 ms 0.1 0.3 2.4
Simulation, OBJ 0.1 0.2 0.8 0.2 ms 0.8 1.1 98 ms 0.2 3.3
Visual, GLB 0.1 0.2 0.9 0.2 ms 1.7 22 ms 0.1 0.2 3.2
Visual, OBJ 0.1 0.2 0.8 0.2 ms 1.6 0.5 0.1 0.2 3.7
Board Repo: greatscottgadgets/LNA1109
Board: LNA1109.kicad_pcb
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 129, 8
Triangles, simulation 207,670 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.5 MB 211 MB
STEP 26 MB 224 MB
STL 10 MB 218 MB
OBJ 22 MB 212 MB
Visual
GLB 3.9 MB 167 MB
OBJ 11 MB 167 MB

10.85 LNA3030

LNA3030: stages 4 and 6 take 50% to 79% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.2 ms 0.9 36 ms 0.1 0.2 2.7
Simulation, STEP 0.1 0.2 1.1 0.2 ms 0.9 0.9 0.1 0.2 3.5
Simulation, STL 0.2 0.2 1.0 0.2 ms 0.9 49 ms 0.1 0.2 2.6
Simulation, OBJ 0.1 0.2 1.0 0.3 ms 0.8 1.2 0.1 0.2 3.7
Visual, GLB 0.1 0.2 1.0 0.2 ms 1.6 20 ms 0.1 0.2 3.3
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.6 0.6 0.1 0.2 3.9
Board Repo: greatscottgadgets/LNA3030
Board: LNA3030.kicad_pcb
Complexity 186 / 1000 (size 151, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 25, 125, 9
Triangles, simulation 211,622 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.6 MB 209 MB
STEP 27 MB 224 MB
STL 11 MB 211 MB
OBJ 22 MB 204 MB
Visual
GLB 3.9 MB 168 MB
OBJ 11 MB 171 MB

10.86 baluns

baluns: stages 4 and 6 take 50% to 84% of a run. Simulation, GLB takes 15 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 18 s. Visual, OBJ takes 20 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.3 6.6 0.4 ms 5.6 0.2 0.7 0.2 15.1
Simulation, STEP 0.6 1.2 6.2 0.2 ms 5.9 3.9 0.6 0.3 18.7
Simulation, STL 0.6 1.3 6.4 0.4 ms 6.2 0.5 0.7 0.3 16.0
Simulation, OBJ 0.6 1.4 6.4 0.3 ms 5.5 8.8 0.7 0.3 23.7
Visual, GLB 0.5 1.2 6.7 0.6 ms 8.1 76 ms 0.7 0.3 17.7
Visual, OBJ 0.6 1.3 6.4 0.3 ms 7.9 2.7 0.8 0.2 19.8
Board Repo: greatscottgadgets/misc
Board: baluns.kicad_pcb
Folder evaluation-boards / baluns
Complexity 232 / 1000 (size 177, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 92, 230, 30
Triangles, simulation 1,559,312 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 54 MB 662 MB
STEP 192 MB 770 MB
STL 78 MB 645 MB
OBJ 162 MB 1.1 GB
Visual
GLB 17 MB 551 MB
OBJ 51 MB 552 MB

10.87 BGA622H6820

BGA622H6820: stages 4 and 6 take 49% to 77% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.6 s. Simulation, STL takes 2.7 s. Simulation, OBJ takes 4.1 s. Visual, GLB takes 3.3 s. Visual, OBJ takes 3.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.2 1.0 0.3 ms 0.9 39 ms 0.1 0.3 2.7
Simulation, STEP 0.1 0.2 1.0 0.2 ms 0.9 1.0 0.1 0.2 3.6
Simulation, STL 0.1 0.2 1.0 0.2 ms 0.9 53 ms 0.1 0.2 2.7
Simulation, OBJ 0.1 0.2 1.1 0.2 ms 0.9 1.4 0.1 0.2 4.1
Visual, GLB 0.1 0.3 1.0 0.3 ms 1.5 20 ms 0.2 0.2 3.3
Visual, OBJ 0.1 0.2 1.0 0.2 ms 1.6 0.6 0.2 0.2 3.9
Board Repo: greatscottgadgets/misc
Board: BGA622H6820.kicad_pcb
Folder evaluation-boards / BGA622H6820
Complexity 163 / 1000 (size 128, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 15, 33, 6
Triangles, simulation 226,944 in 22 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 7.8 MB 212 MB
STEP 30 MB 222 MB
STL 11 MB 214 MB
OBJ 23 MB 212 MB
Visual
GLB 3.5 MB 166 MB
OBJ 9.9 MB 166 MB

10.88 CC-test

CC-test: stages 4 and 6 take 50% to 81% of a run. Simulation, GLB takes 3.7 s. Simulation, STEP takes 4.9 s. Simulation, STL takes 3.5 s. Simulation, OBJ takes 5.3 s. Visual, GLB takes 5.0 s. Visual, OBJ takes 6.1 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.7 0.3 ms 1.2 58 ms 0.2 0.2 3.7
Simulation, STEP 0.2 0.3 1.6 0.2 ms 1.1 1.4 0.2 0.2 4.9
Simulation, STL 0.1 0.3 1.5 0.2 ms 1.1 68 ms 0.2 0.2 3.5
Simulation, OBJ 0.1 0.3 1.5 0.2 ms 1.1 1.8 0.2 0.3 5.3
Visual, GLB 0.2 0.3 1.6 0.3 ms 2.5 35 ms 0.2 0.2 5.0
Visual, OBJ 0.1 0.3 1.5 0.3 ms 2.5 1.2 0.3 0.2 6.1
Board Repo: greatscottgadgets/misc
Board: CC-test.kicad_pcb
Folder evaluation-boards / CC-test
Complexity 206 / 1000 (size 141, features 65)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 2
File format KiCad 5 (20171130)
Parts, tracks, vias 23, 186, 20
Triangles, simulation 303,426 in 35 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 240 MB
STEP 52 MB 258 MB
STL 15 MB 238 MB
OBJ 31 MB 258 MB
Visual
GLB 6.8 MB 218 MB
OBJ 20 MB 218 MB

10.89 DC1722J5005AHF

DC1722J5005AHF: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 3.5 s. Simulation, STEP takes 4.6 s. Simulation, STL takes 3.4 s. Simulation, OBJ takes 5.5 s. Visual, GLB takes 3.8 s. Visual, OBJ takes 4.6 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.2 0.3 ms 1.4 50 ms 0.2 0.3 3.5
Simulation, STEP 0.1 0.3 1.3 0.1 ms 1.3 1.2 0.2 0.2 4.6
Simulation, STL 0.1 0.3 1.2 0.2 ms 1.3 79 ms 0.2 0.2 3.4
Simulation, OBJ 0.1 0.3 1.3 0.2 ms 1.5 1.9 0.2 0.2 5.5
Visual, GLB 0.1 0.3 1.2 0.3 ms 1.8 18 ms 0.1 0.2 3.8
Visual, OBJ 0.2 0.4 1.2 0.2 ms 2.0 0.6 0.1 0.2 4.6
Board Repo: greatscottgadgets/misc
Board: DC1722J5005AHF.kicad_pcb
Folder evaluation-boards / DC1722J5005AHF
Complexity 172 / 1000 (size 117, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 9, 16, 6
Triangles, simulation 333,628 in 18 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 266 MB
STEP 37 MB 292 MB
STL 17 MB 268 MB
OBJ 33 MB 284 MB
Visual
GLB 3.7 MB 202 MB
OBJ 10 MB 199 MB

10.90 filters

filters: stages 4 and 6 take 56% to 83% of a run. Simulation, GLB takes 22 s. Simulation, STEP takes 27 s. Simulation, STL takes 23 s. Simulation, OBJ takes 33 s. Visual, GLB takes 24 s. Visual, OBJ takes 27 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.7 2.0 9.1 0.5 ms 9.2 0.3 0.8 0.4 22.4
Simulation, STEP 0.8 2.0 8.9 0.5 ms 9.2 4.8 0.8 0.3 26.7
Simulation, STL 0.8 1.8 9.1 0.4 ms 9.1 0.7 0.9 0.3 22.7
Simulation, OBJ 0.7 2.0 9.5 0.5 ms 8.9 10.4 0.9 0.3 32.8
Visual, GLB 0.7 2.1 9.0 0.2 ms 10.8 0.1 1.0 0.3 23.9
Visual, OBJ 0.7 2.0 9.0 0.2 ms 10.6 3.2 0.9 0.3 26.7
Board Repo: greatscottgadgets/misc
Board: filters.kicad_pcb
Folder evaluation-boards / filters
Complexity 218 / 1000 (size 163, features 55)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 30, 41, 78
Triangles, simulation 2,127,510 in 31 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 70 MB 911 MB
STEP 237 MB 1.0 GB
STL 106 MB 985 MB
OBJ 223 MB 1.4 GB
Visual
GLB 23 MB 624 MB
OBJ 69 MB 626 MB

10.91 leds

leds: stages 4 and 6 take 54% to 80% of a run. Simulation, GLB takes 4.8 s. Simulation, STEP takes 6.8 s. Simulation, STL takes 4.8 s. Simulation, OBJ takes 6.5 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.8 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.4 1.4 0.3 ms 2.2 64 ms 0.2 0.2 4.8
Simulation, STEP 0.3 0.4 1.4 0.2 ms 2.3 2.1 0.2 0.2 6.8
Simulation, STL 0.2 0.3 1.4 0.3 ms 2.3 0.1 0.2 0.2 4.8
Simulation, OBJ 0.2 0.3 1.4 0.4 ms 2.3 1.8 0.2 0.2 6.5
Visual, GLB 0.2 0.3 1.5 0.3 ms 3.5 59 ms 0.4 0.3 6.3
Visual, OBJ 0.2 0.4 1.4 0.2 ms 3.5 1.6 0.5 0.2 7.8
Board Repo: greatscottgadgets/misc
Board: leds.kicad_pcb
Folder evaluation-boards / leds
Complexity 247 / 1000 (size 172, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 8 (20240108)
Parts, tracks, vias 128, 372, 54
Triangles, simulation 457,374 in 66 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 15 MB 331 MB
STEP 79 MB 384 MB
STL 23 MB 331 MB
OBJ 46 MB 370 MB
Visual
GLB 13 MB 427 MB
OBJ 37 MB 421 MB

10.92 limiters

limiters: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 18 s. Simulation, STL takes 15 s. Simulation, OBJ takes 24 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.6 1.3 6.2 0.5 ms 6.3 0.3 0.7 0.3 15.7
Simulation, STEP 0.6 1.3 5.9 0.4 ms 5.6 3.7 0.6 0.3 18.1
Simulation, STL 0.6 1.3 6.4 0.8 ms 5.8 0.6 0.6 0.3 15.5
Simulation, OBJ 0.5 1.3 6.3 0.4 ms 5.8 9.3 0.6 0.3 24.1
Visual, GLB 0.6 1.3 6.2 0.5 ms 9.7 0.1 0.9 0.3 19.1
Visual, OBJ 0.7 1.4 6.5 0.4 ms 9.5 3.6 0.8 0.3 22.8
Board Repo: greatscottgadgets/misc
Board: limiters.kicad_pcb
Folder evaluation-boards / limiters
Complexity 267 / 1000 (size 192, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 143, 397, 61
Triangles, simulation 1,536,570 in 79 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 52 MB 735 MB
STEP 184 MB 748 MB
STL 77 MB 667 MB
OBJ 157 MB 1.1 GB
Visual
GLB 21 MB 611 MB
OBJ 65 MB 614 MB

10.93 passives

passives: stages 4 and 6 take 51% to 83% of a run. Simulation, GLB takes 13 s. Simulation, STEP takes 17 s. Simulation, STL takes 13 s. Simulation, OBJ takes 20 s. Visual, GLB takes 14 s. Visual, OBJ takes 17 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.1 5.4 0.3 ms 5.3 0.2 0.6 0.3 13.4
Simulation, STEP 0.4 1.2 5.2 0.3 ms 5.4 3.8 0.5 0.2 16.7
Simulation, STL 0.5 1.1 5.4 0.2 ms 5.0 0.4 0.6 0.3 13.2
Simulation, OBJ 0.4 1.1 5.2 0.3 ms 5.1 7.4 0.6 0.3 20.0
Visual, GLB 0.4 1.1 5.3 0.3 ms 6.8 68 ms 0.6 0.3 14.5
Visual, OBJ 0.4 1.0 5.1 0.3 ms 7.0 2.6 0.7 0.3 17.1
Board Repo: greatscottgadgets/misc
Board: passives.kicad_pcb
Folder evaluation-boards / passives
Complexity 239 / 1000 (size 164, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 59, 82, 38
Triangles, simulation 1,229,348 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 42 MB 599 MB
STEP 137 MB 661 MB
STL 61 MB 608 MB
OBJ 124 MB 835 MB
Visual
GLB 15 MB 455 MB
OBJ 44 MB 483 MB

10.94 pmos-or

pmos-or: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 4.7 s. Simulation, STEP takes 6.3 s. Simulation, STL takes 4.9 s. Simulation, OBJ takes 6.9 s. Visual, GLB takes 6.3 s. Visual, OBJ takes 7.9 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 2.2 0.3 ms 1.5 70 ms 0.2 0.2 4.7
Simulation, STEP 0.2 0.4 2.2 0.2 ms 1.5 1.6 0.2 0.2 6.3
Simulation, STL 0.2 0.4 2.3 0.3 ms 1.5 92 ms 0.2 0.2 4.9
Simulation, OBJ 0.2 0.4 2.2 0.2 ms 1.5 2.2 0.2 0.2 6.9
Visual, GLB 0.2 0.4 2.3 0.2 ms 3.0 45 ms 0.3 0.2 6.3
Visual, OBJ 0.2 0.4 2.4 0.2 ms 3.0 1.5 0.3 0.2 7.9
Board Repo: greatscottgadgets/misc
Board: pmos-or.kicad_pcb
Folder evaluation-boards / pmos-or
Complexity 234 / 1000 (size 149, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 2
File format KiCad 6 (20211014)
Parts, tracks, vias 42, 193, 24
Triangles, simulation 441,360 in 48 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 16 MB 287 MB
STEP 83 MB 331 MB
STL 22 MB 281 MB
OBJ 45 MB 340 MB
Visual
GLB 9.8 MB 309 MB
OBJ 29 MB 305 MB

10.95 quad-balun-directional-coupler

Stages 4 and 6 take 52% to 79% of a run. Simulation, GLB takes 3.8 s. Simulation, STEP takes 5.0 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 5.8 s. Visual, GLB takes 4.2 s. Visual, OBJ takes 5.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.5 0.3 ms 1.5 55 ms 0.2 0.2 3.8
Simulation, STEP 0.1 0.3 1.4 0.3 ms 1.4 1.2 0.2 0.2 5.0
Simulation, STL 0.2 0.3 1.4 0.4 ms 1.4 81 ms 0.2 0.2 3.9
Simulation, OBJ 0.1 0.4 1.5 0.3 ms 1.5 1.9 0.2 0.3 5.8
Visual, GLB 0.2 0.3 1.4 0.3 ms 1.9 26 ms 0.1 0.2 4.2
Visual, OBJ 0.2 0.3 1.4 0.3 ms 2.2 0.6 0.1 0.2 5.0
Board Repo: greatscottgadgets/misc
Board: quad-balun-directional-coupler.kicad_pcb
Folder evaluation-boards / quad-balun-directional-coupler
Complexity 167 / 1000 (size 132, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 5 (20171130)
Parts, tracks, vias 14, 55, 4
Triangles, simulation 337,942 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 11 MB 250 MB
STEP 37 MB 295 MB
STL 17 MB 252 MB
OBJ 34 MB 288 MB
Visual
GLB 4.0 MB 205 MB
OBJ 11 MB 203 MB

10.96 rf-amps

rf-amps: stages 4 and 6 take 51% to 85% of a run. Simulation, GLB takes 8.9 s. Simulation, STEP takes 11 s. Simulation, STL takes 9.2 s. Simulation, OBJ takes 14 s. Visual, GLB takes 11 s. Visual, OBJ takes 13 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.9 0.2 ms 3.2 0.2 0.3 0.2 8.9
Simulation, STEP 0.3 0.7 3.9 0.2 ms 3.3 2.2 0.3 0.2 11.0
Simulation, STL 0.3 0.7 3.9 0.2 ms 3.3 0.2 0.4 0.3 9.2
Simulation, OBJ 0.3 0.7 3.7 0.2 ms 3.4 5.1 0.4 0.3 13.9
Visual, GLB 0.3 0.8 4.1 0.2 ms 5.5 52 ms 0.3 0.2 11.3
Visual, OBJ 0.3 0.8 3.8 0.2 ms 5.6 1.7 0.4 0.2 12.8
Board Repo: greatscottgadgets/misc
Board: rf-amps.kicad_pcb
Folder evaluation-boards / rf-amps
Complexity 231 / 1000 (size 166, features 65)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, copper text,
curved board outline
Tested 9th November 2026
Copper layers 4
File format KiCad 9 (20241229)
Parts, tracks, vias 59, 149, 23
Triangles, simulation 984,660 in 47 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 34 MB 490 MB
STEP 122 MB 526 MB
STL 49 MB 456 MB
OBJ 100 MB 708 MB
Visual
GLB 12 MB 424 MB
OBJ 35 MB 410 MB

10.97 rf-switch-dpdt

rf-switch-dpdt: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 8.8 s. Simulation, STEP takes 11 s. Simulation, STL takes 8.9 s. Simulation, OBJ takes 14 s. Visual, GLB takes 11 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.6 0.5 ms 3.3 0.2 0.5 0.2 8.8
Simulation, STEP 0.3 0.7 3.6 0.4 ms 3.4 2.2 0.4 0.2 11.0
Simulation, STL 0.3 0.7 3.5 0.5 ms 3.4 0.3 0.5 0.2 8.9
Simulation, OBJ 0.3 0.7 3.7 0.4 ms 3.5 5.4 0.5 0.2 14.3
Visual, GLB 0.3 0.7 3.5 0.4 ms 5.8 83 ms 0.5 0.3 11.2
Visual, OBJ 0.3 0.8 3.6 0.6 ms 5.7 2.3 0.6 0.2 13.6
Board Repo: greatscottgadgets/misc
Board: rf-switch-dpdt.kicad_pcb
Folder evaluation-boards / rf-switch-dpdt
Complexity 256 / 1000 (size 156, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 7 (20221018)
Parts, tracks, vias 29, 120, 24
Triangles, simulation 1,024,652 in 39 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 35 MB 432 MB
STEP 138 MB 521 MB
STL 51 MB 424 MB
OBJ 102 MB 724 MB
Visual
GLB 16 MB 475 MB
OBJ 47 MB 494 MB

10.98 rf-switch-sp3t

rf-switch-sp3t: stages 4 and 6 take 51% to 81% of a run. Simulation, GLB takes 8.6 s. Simulation, STEP takes 10 s. Simulation, STL takes 9.0 s. Simulation, OBJ takes 13 s. Visual, GLB takes 10 s. Visual, OBJ takes 12 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.7 3.5 0.4 ms 3.2 0.1 0.4 0.3 8.6
Simulation, STEP 0.3 0.7 3.5 0.2 ms 3.1 2.2 0.4 0.2 10.4
Simulation, STL 0.3 0.7 3.6 0.2 ms 3.4 0.3 0.4 0.3 9.0
Simulation, OBJ 0.3 0.8 3.6 0.3 ms 3.2 4.9 0.4 0.3 13.5
Visual, GLB 0.3 0.8 3.5 0.3 ms 4.7 79 ms 0.5 0.3 10.1
Visual, OBJ 0.3 0.7 3.6 0.3 ms 5.2 1.8 0.5 0.2 12.2
Board Repo: greatscottgadgets/misc
Board: rf-switch-sp3t.kicad_pcb
Folder evaluation-boards / rf-switch-sp3t
Complexity 241 / 1000 (size 166, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 33, 141, 57
Triangles, simulation 942,708 in 40 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 32 MB 468 MB
STEP 103 MB 532 MB
STL 47 MB 442 MB
OBJ 95 MB 673 MB
Visual
GLB 13 MB 415 MB
OBJ 38 MB 441 MB

10.99 rf-switch-sp4t

rf-switch-sp4t: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 16 s. Simulation, STEP takes 19 s. Simulation, STL takes 16 s. Simulation, OBJ takes 24 s. Visual, GLB takes 20 s. Visual, OBJ takes 22 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.5 1.5 6.2 0.4 ms 6.7 0.3 0.7 0.2 16.1
Simulation, STEP 0.5 1.5 6.1 0.3 ms 6.3 4.0 0.7 0.2 19.3
Simulation, STL 0.4 1.5 6.1 0.3 ms 6.6 0.6 0.8 0.2 16.1
Simulation, OBJ 0.4 1.3 5.9 0.5 ms 6.8 8.7 0.7 0.3 24.1
Visual, GLB 0.5 1.5 6.3 0.3 ms 10.3 0.1 1.0 0.3 19.9
Visual, OBJ 0.4 1.5 6.1 0.3 ms 9.9 3.4 1.0 0.2 22.5
Board Repo: greatscottgadgets/misc
Board: rf-switch-sp4t.kicad_pcb
Folder evaluation-boards / rf-switch-sp4t
Complexity 287 / 1000 (size 187, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 73, 347, 109
Triangles, simulation 2,124,978 in 64 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 72 MB 865 MB
STEP 238 MB 950 MB
STL 106 MB 881 MB
OBJ 220 MB 1.4 GB
Visual
GLB 28 MB 811 MB
OBJ 85 MB 718 MB

10.100 rf-switch-spdt

rf-switch-spdt: stages 4 and 6 take 48% to 85% of a run. Simulation, GLB takes 6.6 s. Simulation, STEP takes 8.1 s. Simulation, STL takes 6.3 s. Simulation, OBJ takes 9.9 s. Visual, GLB takes 9.0 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.6 2.5 0.2 ms 2.5 0.1 0.5 0.2 6.6
Simulation, STEP 0.2 0.5 2.5 0.2 ms 2.4 1.8 0.4 0.2 8.1
Simulation, STL 0.2 0.6 2.4 0.1 ms 2.4 0.2 0.3 0.2 6.3
Simulation, OBJ 0.2 0.5 2.4 0.2 ms 2.3 3.7 0.4 0.3 9.9
Visual, GLB 0.2 0.5 2.4 0.2 ms 5.3 42 ms 0.3 0.2 9.0
Visual, OBJ 0.2 0.5 2.4 0.3 ms 5.4 1.5 0.3 0.2 10.5
Board Repo: greatscottgadgets/misc
Board: rf-switch-spdt.kicad_pcb
Folder evaluation-boards / rf-switch-spdt
Complexity 259 / 1000 (size 159, features 100)
KESE features through vias, custom pads, rounded,
trapezoid or chamfered pads,
filled zones, copper drawings,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 8 (20240108)
Parts, tracks, vias 28, 85, 48
Triangles, simulation 729,262 in 31 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 25 MB 391 MB
STEP 79 MB 447 MB
STL 36 MB 393 MB
OBJ 73 MB 523 MB
Visual
GLB 10 MB 354 MB
OBJ 30 MB 352 MB

10.101 Si5351A

Si5351A: stages 4 and 6 take 50% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 15 s. Simulation, STL takes 12 s. Simulation, OBJ takes 19 s. Visual, GLB takes 16 s. Visual, OBJ takes 19 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 5.2 0.7 ms 4.3 0.2 0.6 0.2 11.9
Simulation, STEP 0.4 1.1 5.3 0.5 ms 4.2 3.0 0.5 0.3 14.7
Simulation, STL 0.4 1.1 5.4 0.5 ms 4.3 0.4 0.6 0.2 12.4
Simulation, OBJ 0.4 1.2 5.3 0.5 ms 4.3 7.1 0.5 0.2 19.0
Visual, GLB 0.3 1.1 5.4 0.3 ms 7.6 92 ms 0.9 0.2 15.6
Visual, OBJ 0.3 1.1 5.5 0.3 ms 7.2 3.2 1.0 0.2 18.5
Board Repo: greatscottgadgets/misc
Board: Si5351A.kicad_pcb
Folder evaluation-boards / Si5351A
Complexity 273 / 1000 (size 188, features 85)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, curved board outline,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 84, 439, 69
Triangles, simulation 1,313,314 in 62 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 43 MB 578 MB
STEP 152 MB 634 MB
STL 66 MB 566 MB
OBJ 133 MB 899 MB
Visual
GLB 20 MB 627 MB
OBJ 61 MB 588 MB

10.102 sky13350

sky13350: stages 4 and 6 take 50% to 80% of a run. Simulation, GLB takes 2.7 s. Simulation, STEP takes 3.5 s. Simulation, STL takes 2.6 s. Simulation, OBJ takes 3.7 s. Visual, GLB takes 3.6 s. Visual, OBJ takes 4.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 91 ms 0.2 1.1 0.3 ms 0.9 42 ms 0.1 0.2 2.7
Simulation, STEP 94 ms 0.2 1.1 0.2 ms 0.9 0.9 0.1 0.2 3.5
Simulation, STL 0.1 0.2 1.1 0.4 ms 0.8 68 ms 0.2 0.2 2.6
Simulation, OBJ 0.1 0.2 1.0 0.2 ms 0.9 1.2 0.1 0.2 3.7
Visual, GLB 99 ms 0.2 1.1 0.4 ms 1.8 20 ms 0.2 0.2 3.6
Visual, OBJ 0.1 0.3 1.1 0.3 ms 1.6 0.5 0.2 0.2 4.0
Board Repo: greatscottgadgets/misc
Board: sky13350.kicad_pcb
Folder evaluation-boards / sky13350
Complexity 164 / 1000 (size 129, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 22, 34, 3
Triangles, simulation 292,626 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 222 MB
STEP 39 MB 241 MB
STL 15 MB 225 MB
OBJ 30 MB 229 MB
Visual
GLB 4.4 MB 203 MB
OBJ 13 MB 197 MB

10.103 sky13351

sky13351: stages 4 and 6 take 51% to 78% of a run. Simulation, GLB takes 3.1 s. Simulation, STEP takes 4.2 s. Simulation, STL takes 3.2 s. Simulation, OBJ takes 4.6 s. Visual, GLB takes 4.0 s. Visual, OBJ takes 4.5 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.3 1.3 0.2 ms 1.0 47 ms 0.2 0.2 3.1
Simulation, STEP 0.1 0.3 1.4 0.1 ms 1.0 1.1 0.1 0.2 4.2
Simulation, STL 0.1 0.3 1.3 0.2 ms 1.0 70 ms 0.2 0.2 3.2
Simulation, OBJ 0.1 0.3 1.3 0.2 ms 1.0 1.4 0.2 0.2 4.6
Visual, GLB 0.1 0.3 1.3 0.2 ms 1.8 23 ms 0.2 0.2 4.0
Visual, OBJ 0.1 0.3 1.2 0.2 ms 1.8 0.7 0.2 0.3 4.5
Board Repo: greatscottgadgets/misc
Board: sky13351.kicad_pcb
Folder evaluation-boards / sky13351
Complexity 167 / 1000 (size 132, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 22, 42, 3
Triangles, simulation 294,750 in 27 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 233 MB
STEP 40 MB 241 MB
STL 15 MB 228 MB
OBJ 30 MB 231 MB
Visual
GLB 4.5 MB 192 MB
OBJ 13 MB 193 MB

10.104 sky13374

sky13374: stages 4 and 6 take 48% to 79% of a run. Simulation, GLB takes 4.6 s. Simulation, STEP takes 5.8 s. Simulation, STL takes 4.2 s. Simulation, OBJ takes 6.2 s. Visual, GLB takes 5.1 s. Visual, OBJ takes 6.0 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.4 1.9 0.2 ms 1.5 86 ms 0.2 0.3 4.6
Simulation, STEP 0.2 0.4 1.7 0.2 ms 1.4 1.6 0.2 0.3 5.8
Simulation, STL 0.2 0.5 1.7 0.4 ms 1.3 88 ms 0.2 0.3 4.2
Simulation, OBJ 0.1 0.4 1.7 0.2 ms 1.3 2.3 0.2 0.2 6.2
Visual, GLB 0.1 0.3 1.7 0.2 ms 2.3 25 ms 0.3 0.3 5.1
Visual, OBJ 0.1 0.3 1.8 0.4 ms 2.4 0.8 0.2 0.3 6.0
Board Repo: greatscottgadgets/misc
Board: sky13374.kicad_pcb
Folder evaluation-boards / sky13374
Complexity 171 / 1000 (size 136, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 17, 45, 10
Triangles, simulation 299,316 in 23 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 10 MB 225 MB
STEP 40 MB 236 MB
STL 15 MB 226 MB
OBJ 30 MB 234 MB
Visual
GLB 4.6 MB 202 MB
OBJ 13 MB 197 MB

10.105 sky13411

sky13411: stages 4 and 6 take 51% to 80% of a run. Simulation, GLB takes 4.3 s. Simulation, STEP takes 5.5 s. Simulation, STL takes 3.9 s. Simulation, OBJ takes 6.0 s. Visual, GLB takes 5.0 s. Visual, OBJ takes 6.2 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.1 0.4 1.9 0.2 ms 1.3 84 ms 0.2 0.3 4.3
Simulation, STEP 0.1 0.5 1.9 0.2 ms 1.2 1.3 0.2 0.2 5.5
Simulation, STL 0.1 0.3 1.7 0.4 ms 1.2 88 ms 0.2 0.2 3.9
Simulation, OBJ 0.1 0.4 1.8 0.2 ms 1.2 2.0 0.2 0.2 6.0
Visual, GLB 0.2 0.4 1.7 0.2 ms 2.3 30 ms 0.2 0.3 5.0
Visual, OBJ 0.1 0.4 1.7 0.2 ms 2.4 1.1 0.2 0.2 6.2
Board Repo: greatscottgadgets/misc
Board: sky13411.kicad_pcb
Folder evaluation-boards / sky13411
Complexity 172 / 1000 (size 137, features 35)
KESE features through vias, filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 26, 53, 3
Triangles, simulation 355,080 in 30 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 12 MB 240 MB
STEP 48 MB 258 MB
STL 18 MB 244 MB
OBJ 36 MB 288 MB
Visual
GLB 5.3 MB 212 MB
OBJ 15 MB 216 MB

10.106 sma-jlcpcb

sma-jlcpcb: stages 4 and 6 take 54% to 83% of a run. Simulation, GLB takes 18 s. Simulation, STEP takes 22 s. Simulation, STL takes 19 s. Simulation, OBJ takes 28 s. Visual, GLB takes 19 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.8 7.1 0.5 ms 7.6 0.3 0.8 0.3 18.2
Simulation, STEP 0.4 1.7 7.8 0.5 ms 7.6 3.8 0.8 0.3 22.5
Simulation, STL 0.4 1.8 6.9 0.4 ms 8.0 0.6 0.8 0.2 18.8
Simulation, OBJ 0.5 1.7 7.2 0.3 ms 7.9 9.6 0.7 0.3 27.7
Visual, GLB 0.4 1.6 7.5 0.4 ms 8.4 99 ms 0.9 0.3 19.1
Visual, OBJ 0.4 1.7 7.1 0.3 ms 9.1 3.1 1.0 0.3 22.7
Board Repo: greatscottgadgets/misc
Board: sma-jlcpcb.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 236 / 1000 (size 171, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 20, 10, 104
Triangles, simulation 1,934,558 in 25 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 64 MB 849 MB
STEP 181 MB 902 MB
STL 97 MB 838 MB
OBJ 199 MB 1.3 GB
Visual
GLB 22 MB 662 MB
OBJ 65 MB 630 MB

10.107 trace-width-jlcpcb

trace-width-jlcpcb: stages 4 and 6 take 53% to 83% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 18 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 1.1 5.0 0.3 ms 4.5 0.2 0.4 0.2 11.7
Simulation, STEP 0.3 1.1 5.0 0.4 ms 4.7 2.4 0.4 0.2 14.1
Simulation, STL 0.3 1.1 4.9 0.4 ms 4.4 0.3 0.5 0.2 11.7
Simulation, OBJ 0.3 1.1 4.9 0.4 ms 4.4 6.2 0.4 0.2 17.7
Visual, GLB 0.3 1.1 4.9 0.4 ms 4.8 55 ms 0.3 0.2 11.7
Visual, OBJ 0.3 1.1 5.1 0.4 ms 4.8 1.9 0.3 0.2 13.7
Board Repo: greatscottgadgets/misc
Board: trace-width-jlcpcb.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 230 / 1000 (size 165, features 65)
KESE features through vias, filled zones,
stack-up, dielectric εr and tanδ
Tested 9th November 2026
Copper layers 6
File format KiCad 8 (20240108)
Parts, tracks, vias 16, 8, 84
Triangles, simulation 1,229,520 in 21 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 41 MB 555 MB
STEP 118 MB 668 MB
STL 61 MB 544 MB
OBJ 124 MB 853 MB
Visual
GLB 13 MB 447 MB
OBJ 39 MB 413 MB

10.108 trace-width-sunstone

trace-width-sunstone: stages 4 and 6 take 52% to 81% of a run. Simulation, GLB takes 9.7 s. Simulation, STEP takes 12 s. Simulation, STL takes 10 s. Simulation, OBJ takes 15 s. Visual, GLB takes 9.2 s. Visual, OBJ takes 11 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.3 0.8 3.9 0.5 ms 3.9 0.1 0.4 0.3 9.7
Simulation, STEP 0.3 0.8 3.7 0.2 ms 4.2 2.6 0.4 0.2 12.2
Simulation, STL 0.3 0.8 3.8 0.2 ms 4.2 0.3 0.4 0.2 10.1
Simulation, OBJ 0.3 0.8 3.7 0.2 ms 4.0 5.3 0.4 0.2 14.6
Visual, GLB 0.3 0.8 3.8 0.2 ms 3.7 43 ms 0.4 0.2 9.2
Visual, OBJ 0.3 0.8 3.8 0.2 ms 3.7 1.3 0.4 0.2 10.5
Board Repo: greatscottgadgets/misc
Board: trace-width-sunstone.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 113 / 1000 (size 93, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 4 (4)
Parts, tracks, vias 12, 6, 0
Triangles, simulation 933,056 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 30 MB 488 MB
STEP 93 MB 590 MB
STL 47 MB 472 MB
OBJ 94 MB 681 MB
Visual
GLB 7.2 MB 386 MB
OBJ 22 MB 361 MB

10.109 trace-width

trace-width: stages 4 and 6 take 60% to 84% of a run. Simulation, GLB takes 12 s. Simulation, STEP takes 14 s. Simulation, STL takes 12 s. Simulation, OBJ takes 17 s. Visual, GLB takes 12 s. Visual, OBJ takes 14 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.9 4.6 0.2 ms 5.4 0.2 0.4 0.3 12.0
Simulation, STEP 0.2 0.9 4.3 0.3 ms 4.7 3.3 0.4 0.2 13.9
Simulation, STL 0.2 0.9 4.6 0.2 ms 5.2 0.3 0.4 0.2 11.8
Simulation, OBJ 0.2 0.8 4.7 0.3 ms 5.7 5.3 0.4 0.2 17.4
Visual, GLB 0.2 0.9 4.7 0.2 ms 5.3 54 ms 0.8 0.2 12.1
Visual, OBJ 0.2 1.0 4.9 0.3 ms 5.2 1.8 1.0 0.3 14.3
Board Repo: greatscottgadgets/misc
Board: trace-width.kicad_pcb
Folder evaluation-boards / trace-width
Complexity 132 / 1000 (size 112, features 20)
KESE features filled zones
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 26, 13, 0
Triangles, simulation 1,164,700 in 19 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 39 MB 511 MB
STEP 99 MB 672 MB
STL 58 MB 485 MB
OBJ 116 MB 812 MB
Visual
GLB 12 MB 477 MB
OBJ 35 MB 505 MB

10.110 ununs

ununs: stages 4 and 6 take 53% to 84% of a run. Simulation, GLB takes 10 s. Simulation, STEP takes 13 s. Simulation, STL takes 10 s. Simulation, OBJ takes 16 s. Visual, GLB takes 13 s. Visual, OBJ takes 15 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.2 0.8 4.6 0.3 ms 3.9 0.2 0.4 0.2 10.5
Simulation, STEP 0.2 0.9 4.6 0.3 ms 3.9 2.9 0.4 0.2 13.0
Simulation, STL 0.2 0.9 4.3 0.4 ms 4.0 0.4 0.4 0.2 10.5
Simulation, OBJ 0.2 0.9 4.6 0.4 ms 4.0 5.8 0.5 0.3 16.3
Visual, GLB 0.2 1.0 4.7 0.4 ms 6.3 82 ms 0.7 0.2 13.2
Visual, OBJ 0.2 0.9 4.4 0.4 ms 6.4 2.5 0.7 0.2 15.3
Board Repo: greatscottgadgets/misc
Board: ununs.kicad_pcb
Folder evaluation-boards / ununs
Complexity 250 / 1000 (size 175, features 75)
KESE features through vias, rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 77, 196, 43
Triangles, simulation 1,471,406 in 61 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 48 MB 671 MB
STEP 147 MB 705 MB
STL 74 MB 645 MB
OBJ 148 MB 973 MB
Visual
GLB 20 MB 584 MB
OBJ 62 MB 524 MB

10.111 vbus-switch

vbus-switch: stages 4 and 6 take 56% to 84% of a run. Simulation, GLB takes 14 s. Simulation, STEP takes 18 s. Simulation, STL takes 14 s. Simulation, OBJ takes 21 s. Visual, GLB takes 18 s. Visual, OBJ takes 23 s

Mode and format 1–2 read 3 resolve 4 geometry 5 materials 6 assemble 7 write 8 verify start-up and exit Total
Simulation, GLB 0.4 1.3 7.2 0.6 ms 4.3 0.2 0.6 0.2 14.2
Simulation, STEP 0.4 1.2 7.0 0.5 ms 4.3 3.9 0.5 0.2 17.6
Simulation, STL 0.4 1.3 7.0 0.6 ms 4.3 0.5 0.5 0.2 14.1
Simulation, OBJ 0.4 1.3 7.5 0.4 ms 4.3 7.0 0.5 0.2 21.2
Visual, GLB 0.4 1.1 7.3 0.4 ms 8.3 0.1 1.0 0.2 18.4
Visual, OBJ 0.4 1.2 7.2 0.6 ms 8.9 3.9 1.2 0.2 23.0
Board Repo: greatscottgadgets/misc
Board: vbus-switch.kicad_pcb
Folder evaluation-boards / vbus-switch
Complexity 282 / 1000 (size 197, features 85)
KESE features through vias, slotted holes,
rounded,
trapezoid or chamfered pads,
filled zones, stack-up,
dielectric εr and tanδ
Tested 9th November 2026
Copper layers 4
File format KiCad 6 (20211014)
Parts, tracks, vias 109, 663, 96
Triangles, simulation 1,340,080 in 102 parts
Verifier PASS in all six runs
File
type
File
size
Peak memory
used
Simulation
GLB 46 MB 557 MB
STEP 220 MB 633 MB
STL 67 MB 532 MB
OBJ 140 MB 930 MB
Visual
GLB 27 MB 658 MB
OBJ 79 MB 631 MB
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